WO2015068585A1 - Élément de d'étanchéité, substrat isolé par l'élément d'étanchéité, et son procédé de fabrication - Google Patents

Élément de d'étanchéité, substrat isolé par l'élément d'étanchéité, et son procédé de fabrication Download PDF

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Publication number
WO2015068585A1
WO2015068585A1 PCT/JP2014/078275 JP2014078275W WO2015068585A1 WO 2015068585 A1 WO2015068585 A1 WO 2015068585A1 JP 2014078275 W JP2014078275 W JP 2014078275W WO 2015068585 A1 WO2015068585 A1 WO 2015068585A1
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WIPO (PCT)
Prior art keywords
sealing member
sealing
resin
sealed
substrate
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PCT/JP2014/078275
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English (en)
Japanese (ja)
Inventor
六田　充輝
芳樹 中家
Original Assignee
ダイセル・エボニック株式会社
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Application filed by ダイセル・エボニック株式会社 filed Critical ダイセル・エボニック株式会社
Priority to JP2015546598A priority Critical patent/JPWO2015068585A1/ja
Priority to CN201480061306.6A priority patent/CN105706229A/zh
Priority to KR1020167014619A priority patent/KR20160083892A/ko
Publication of WO2015068585A1 publication Critical patent/WO2015068585A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/164—Material
    • H01L2924/1659—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/166—Material
    • H01L2924/1679—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy

Definitions

  • the present invention relates to a sealing member useful for covering and sealing a substrate on which a component (electronic component or the like) is mounted, a sealing substrate covered and sealed with this sealing member, and a method for manufacturing the same About.
  • precision parts such as printed circuit boards, semiconductor elements, solar cells, etc. are placed in the mold cavity, fluid resin is injected, and precision parts are sealed with resin. To be done.
  • thermosetting resin for example, epoxy resin
  • additives such as a crosslinking agent or curing agent for curing are added to the thermosetting resin, quality control as a thermosetting resin is difficult not only in relation to the pot life, but also cured. For the reaction, usually a long time of several hours or more is required.
  • Patent Document 1 A method of sealing (or protecting) precision parts by injection molding of a thermoplastic resin is also known.
  • Patent Document 1 a printed circuit board on which electronic components are mounted is placed in a mold cavity, and a polyamide resin heated and melted at 160 to 230 ° C. is 2.5 to 25 kg / cm.
  • a method is disclosed in which a printed circuit board on which electronic components are mounted is sealed by being injected into the mold cavity with a pressure of 2 .
  • a polyamide resin is injected into a mold at a melting temperature of 190 ° C. and a pressure of 20 kg / cm 2 to seal a printed circuit board.
  • the electronic component may be damaged because a relatively high temperature and pressure are applied to the electronic component.
  • higher temperature and higher pressure molding conditions are required, and thus the possibility of damage to the electronic component is increased.
  • the resin cannot be completely filled into every corner of precision parts, and if a small void is generated, the electronic circuit may be corroded or short-circuited due to the influence of resin additives or low molecular weight components.
  • the resin be powdered and sealed with powder.
  • the voids are more likely to occur than in the case of injection molding, and damage to the solder due to resin expansion and contraction stress cannot be resolved.
  • the powder is easily scattered and it is difficult to efficiently seal a desired portion.
  • Patent Document 2 Japanese Patent Laid-Open No. 2001-284779 (Patent Document 2), a circuit board provided with electronic components is inserted into a cylindrical film, and both openings of the cylindrical film are closed to pack the circuit board.
  • Patent Document 3 discloses a liquid crystal display panel member in which liquid crystal display panel members made of a plurality of liquid crystal display panel members are wrapped and laminated, and polyamide is also exemplified as a plastic film. ing.
  • Patent Document 4 Japanese Patent Application Laid-Open No. 2008-282906 relates to a method of manufacturing a solar cell module in which a solar cell is sealed with a resin between a substrate and a film, and the substrate, the solar cell, A first sealing resin sheet that covers substantially the entire surface of the substrate is disposed between, and a second sealing resin sheet that covers substantially the entire surface of the substrate is disposed between the film and the solar battery cell.
  • the resin is melted and cooled and sealed, and the sealing resin is a kind of resin selected from the group consisting of ethylene-vinyl acetate copolymer, polyvinyl butyral, and polyurethane. It is.
  • JP 2009-99417 A (Patent Document 5) includes a barrier film for sealing an organic electronic device formed on a substrate, and a hot melt type is provided between the organic electronic device and the barrier film.
  • An organic electronic device sealing panel in which a member is disposed is disclosed, wherein the hot melt member includes a moisture scavenger and a wax, and the hot melt member has a thin film shape with a thickness of 100 ⁇ m or less.
  • Patent Document 6 discloses a hot-melt type member for organic thin-film solar cells (a hot-melt type member having a thin film shape, a plate shape, an indeterminate shape, etc.) containing a moisture scavenger and a wax. It is disclosed.
  • any of these techniques using a film-like sealant is a technique based on the premise that the sealant is in close contact with the part to be sealed or the region to be protected of the electronic device. Therefore, such a method has various problems that occur because the electronic device and the sealant are in close contact as described above, for example, the site to be sealed and the protection due to the expansion / contraction stress of the sealant. It has potential or obvious problems due to adverse effects on the area, unintended voids and incomplete adhesion.
  • Patent Document 7 covers at least a part of a device with a film-like sealant containing a copolymerized polyamide resin, and heat-melts the sealant to cool it. Covering and sealing.
  • This film-like sealant has a high followability to the uneven portion of the device, and can tightly seal over the details of the device while preventing the generation of voids.
  • the technique of Patent Document 7 is also a technique for sealing and protecting the electronic device and the sealing agent in a form in which the electronic device and the sealing agent are in close contact, and is premised on the sealing agent being in close contact.
  • Patent Document 7 also has problems caused by the close contact between the electronic device and the sealing agent, for example, the site to be sealed due to the expansion / contraction stress of the sealing agent. And potential problems or problems caused by unintended voids and incomplete adhesion.
  • JP 2000-133665 A Japanese Patent Laid-Open No. 2001-284779 (Claims) JP-A-11-259021 (Claims, [0022]) JP 2008-282906 A (Claims) JP 2009-99417 A (Claims, [0024]) JP 2009-99805 (Claims) JP 2012-87292 A (Claims)
  • An object of the present invention is to provide a sealing member capable of selectively and effectively sealing and protecting a predetermined portion of a substrate (mounting substrate, device) including a component (a mounting component such as an electronic component), and covering with the sealing member And a sealed mounting substrate (protective substrate) and a manufacturing method thereof.
  • Another object of the present invention is to seal a substrate (mounting substrate, device) provided with a component (mounting component such as an electronic component) with a high adhesion force, and also according to temperature fluctuations under use conditions. It is in providing the sealing member which can protect a part effectively, the mounting board
  • Still another object of the present invention is a sealing member that is excellent in productivity, does not damage the mounted electronic component even if the sealing and protection area is large area, and can prevent corrosion and short circuit of the electronic circuit, It is providing the mounting board
  • Another object of the present invention is to provide a sealing member that does not require work such as excision of the outer edge of the film, even if it has a form such as a film, and is mounted and sealed with this sealing member It is providing a board
  • the present inventors have made the sealing resin follow the shape of the component and the board, and the sealing area of the mounting board is tightly adhered over the whole and sealed.
  • the present invention was completed by further developing the invention according to Patent Document 7, with an idea completely different from the idea of doing. That is, only the peripheral part of the sealing member of a predetermined form such as a film is thermally bonded to the predetermined part of the device (peripheral part of the sealed region), and the inner region of the sealing member is released from the mounting component. Covering the device with the form can not only prevent the generation of voids, but also effectively prevent the thermal expansion / contraction stress from acting on the mounting parts and solder part, and the mounting substrate while sealing tightly with high adhesion force We found that we can protect effectively.
  • the area to be sealed of the device is sealed with a sealing member.
  • the sealing device has a film-like or tray-like form, and at least a peripheral portion of the sealing member includes a thermoplastic resin; the sealing member is separated from a mounting component of the device, and the sealing device The periphery of the stop member is bonded to the device. That is, inside the sealed area of the device, the sealing member is separated from the device (including circuits and mounting components) to form a free space; the peripheral edge of the sealing member is bonded to the substrate of the device And the sealing part which seals a to-be-sealed area in the peripheral part of the to-be-sealed area of a device is formed.
  • At least the peripheral portion of the sealing member includes a thermoadhesive thermoplastic resin (for example, a copolymerized polyamide resin), and may have a film shape or a tray shape. Further, only the peripheral portion of the sealing member may be thermally bonded to the device substrate.
  • a thermoadhesive thermoplastic resin for example, a copolymerized polyamide resin
  • the film-like or tray-like sealing member may have a peripheral portion that can be in line contact or surface contact with the substrate of the device, and includes a copolymerized polyamide resin having at least one of the following characteristics. Also good.
  • Melting point or softening point is about 75 to 160 ° C. (for example, melting point is 90 to 160 ° C.)
  • Crystallinity Crystallinity and melting point of about 90 to 160 ° C.
  • the sealing member may be a multi-component copolymer, for example, a copolymer polyamide resin of a binary copolymer to a quaternary copolymer (for example, binary or ternary copolymer).
  • the copolymerized polyamide resin may have at least one unit described below.
  • A a unit derived from a long chain component having a C 8-16 alkylene group (eg, a C 10-14 alkylene group)
  • B at least selected from C 9-17 lactam and amino C 9-17 alkane carboxylic acid Units derived from one component
  • c Units derived from at least one component selected from laurolactam, aminoundecanoic acid and aminododecanoic acid.
  • the sealing member may have a laminated structure as well as a single layer structure, for example, a sealing layer containing a copolymerized polyamide-based resin, laminated on one surface of the sealing layer, and And a protective layer formed of a heat resistant resin.
  • the heat resistant resin may have, for example, a melting point or softening point of 170 ° C. or higher, and the heat resistant resin may be at least one selected from a polyester resin, a polyamide resin, and a fluororesin. .
  • the thickness (total thickness) of the sealing member may be, for example, about 10 to 1000 ⁇ m.
  • the sealing member of the present invention may be applied to both sides of the device, but is useful for application to one side of the device.
  • the present invention also includes a method of manufacturing a sealed device in which a sealed region of the device is sealed with a sealing member.
  • a sealing member having a film shape or a tray shape and having at least a peripheral portion containing a thermoplastic resin is used.
  • the peripheral portion of the sealing member is adhered to the substrate of the device (peripheral portion of the sealed region), and the sealing member A device is manufactured in which the sealed area of the device is covered and sealed.
  • At least a peripheral portion of the sealing member covers a region to be sealed of the device with a sealing member (a sealing member in the form of a film or a tray) containing a copolymerized polyamide resin, and the sealing member
  • a sealing member a sealing member in the form of a film or a tray
  • the peripheral edge of the substrate may be cooled by being thermally bonded to the substrate of the device.
  • the present invention also includes a sealing member for sealing the sealed area of the device.
  • the sealing member is formed into a film shape or a tray shape, and the peripheral portion includes a thermoplastic resin.
  • the sealing member includes an inner region for forming a free space without adhering to the device; and a peripheral portion (peripheral portion adjacent to the inner region) that can be bonded to the substrate of the device.
  • the sealing member may include a peripheral portion (adhesive portion) that can be thermally bonded (or thermally fused) to the substrate of the device, and at least the peripheral portion may include a copolymerized polyamide resin. .
  • copolymerized polyamide resin refers to not only a copolymer (copolyamide) of a plurality of amide-forming components having different types or carbon numbers, which are amide-forming components that form a homopolyamide. , And is used to include a mixture of a plurality of different types of copolymers (copolyamides) formed from a plurality of amide-forming components.
  • the term “device” means a functional member (electrical or electronic member) that is required to be protected by sealing, and an electronic component such as a functional element or an electric circuit (including a semiconductor circuit) is formed. And a substrate on which components (electronic components such as functional elements) are mounted, for example, a printed wiring board on which electronic components are mounted or mounted.
  • the “device” usually has a flat portion in many cases.
  • Free means that the device is not substantially bonded to the device, and the sealing member of the free space may be in physical contact with the component of the device and, if necessary, the substrate.
  • the sealing member is separated from the device (circuit, component, etc.) inside the sealed region of the device (forms a free space), and the periphery of the sealing member is the base substrate of the sealed region.
  • the device is sealed in a bonded form, and the mounted component and the solder part are not sealed by being molded with a sealing resin. Therefore, the predetermined part of the device can be selectively and effectively sealed and protected.
  • the bonding area of the sealing member to the substrate is small, generation of voids can be suppressed, and stress does not act on the mounting component and the solder part even if the temperature fluctuates under use conditions. Therefore, the corrosion and short circuit of the circuit can be prevented, and the mounted component and the solder portion can be protected from damage.
  • the peripheral portion of the sealing member contains a thermoplastic resin (particularly, a thermoadhesive thermoplastic resin such as a copolymerized polyamide-based resin), the peripheral portion of the sealed region can be sealed with high adhesion. . Furthermore, even if the sealed area (sealing and protection area) is a large area, the mounted electronic component is not damaged, and corrosion and short circuit of the electronic circuit can be prevented. Further, it is not necessary to melt or vacuum-form the entire film or powder resin, and the adhesion area of the sealing member to the substrate can be substantially reduced, so that the productivity of the sealing device can be improved.
  • a thermoplastic resin particularly, a thermoadhesive thermoplastic resin such as a copolymerized polyamide-based resin
  • the device can be effectively protected with high reliability simply and reliably.
  • FIG. 1 is a schematic side view showing an example of the sealing device of the present invention.
  • FIG. 2 is a schematic side view showing another example of the sealing device of the present invention.
  • FIG. 3 is a schematic plan view showing the test substrate used in the examples.
  • the sealing member for sealing the sealed region of the device has at least a peripheral portion containing a thermoplastic resin.
  • the peripheral portion (or outer edge portion) of the sealing member is sealed with the device. Adhere to the substrate in the area. Therefore, even if thermal bonding is used, damage to the device due to heat is small, and not only a sealing member having a low melting point or a low softening point, but a thermoplastic resin having a relatively high melting point or a high softening point can be used. Therefore, the type of thermoplastic resin is not particularly limited, and various thermoplastic resins can be used.
  • olefin resin low density, medium density or high density polyethylene, polyethylene such as linear low density polyethylene, ethylene-propylene, etc.
  • Ethylene copolymer of ethylene and copolymerizable monomer such as copolymer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester copolymer, ethylene-vinyl acetate copolymer
  • Polyethylene resins such as polypropylene; Polypropylene resins such as polypropylene and propylene-ethylene copolymers; Cyclic olefin resins such as ethylene-norbornene copolymers], acrylic resins, styrene resins, polyester resins (ethylene terephthalate) , Alkylene arylate units such as butylene terephthalate Including such copolyester), and polyamide-based resin (a copolymer polyamide resin), etc.
  • These thermoplastic resins can be used alone or in combination
  • a preferred thermoplastic resin is a thermoadhesive thermoplastic resin that can be firmly bonded at a relatively low temperature when the sealing member is thermally bonded to the substrate, for example, an olefin resin, a copolyester containing an alkylene arylate unit, particularly a film. It is a copolymerized polyamide resin from the viewpoints of strength, chemical resistance, film-forming property, adhesion to a substrate (fusibility), and the like. Moreover, the sealing member containing the copolymerized polyamide-based resin can improve adhesion to the device, can impart high impact resistance and wear resistance to the device, and can enhance the protective effect on the device.
  • the copolymerized polyamide-based resin includes a copolymerized polyamide (thermoplastic copolymerized polyamide) and a polyamide elastomer.
  • the thermoplastic copolymer polyamide may be an alicyclic copolymer polyamide, but is usually an aliphatic copolymer polyamide in many cases.
  • the copolymerized polyamide can be formed by combining a diamine component, a dicarboxylic acid component, a lactam component, and an aminocarboxylic acid component. Both the diamine component and the dicarboxylic acid component can form an amide bond of the copolymerized polyamide, and the lactam component and the aminocarboxylic acid component can each independently form an amide bond of the copolymerized polyamide.
  • the copolymerized polyamide can be obtained by copolymerization of a plurality of amide-forming components selected from a pair of components (both components combining a diamine component and a dicarboxylic acid component), a lactam component, and an aminocarboxylic acid component. .
  • the copolymerized polyamide is at least one amide-forming component selected from the pair of components, lactam component, and aminocarboxylic acid component, and is different from the amide-forming component (or the same type and different in carbon number). It can be obtained by copolymerization with an amide-forming component.
  • the lactam component and the aminocarboxylic acid component may be handled as equivalent components as long as they have the same carbon number and branched chain structure.
  • a copolymerized polyamide comprising an amide-forming component, wherein at least one of a diamine component and a dicarboxylic acid component is composed of a plurality of components having different carbon numbers; a first amide-forming component, and a second A copolymerized polyamide with an amide-forming component (at least one component selected from a lactam component and an aminocarboxylic acid component); a second amide-forming component (at least one component selected from a lactam component and an aminocarboxylic acid component)
  • a copolyamide formed, one of a lactam component and an aminocarboxylic acid component It may be a copolyamide of the same carbon number or different lactam component and aminocarboxylic acid component; components are different copolymerized polyamide comprising an amide-forming component, wherein at least one of a diamine component and a dicarboxylic acid component is composed of a plurality of components having different carbon numbers; a first amide-forming component, and
  • diamine component examples include aliphatic diamine or alkylene diamine components (for example, C 4-16 alkylene diamine such as tetramethylene diamine, hexamethylene diamine, trimethyl hexamethylene diamine, octamethylene diamine, and dodecane diamine). These diamine components can be used alone or in combination of two or more.
  • a preferred diamine component contains at least an alkylene diamine (preferably a C 6-14 alkylene diamine, more preferably a C 6-12 alkylene diamine).
  • an alicyclic diamine component (diaminocycloalkane such as diaminocyclohexane (diamino C 5-10 cycloalkane etc.); bis (4-aminocyclohexyl) methane, bis (4-amino-) Bis (aminocycloalkyl) alkanes such as 3-methylcyclohexyl) methane and 2,2-bis (4′-aminocyclohexyl) propane [bis (aminoC 5-8 cycloalkyl) C 1-3 alkane etc.]; hydrogenated Xylylenediamine etc.) and aromatic diamine components (metaxylylenediamine etc.) may be used in combination.
  • the diamine component (for example, an alicyclic diamine component) may have a substituent such as an alkyl group (C 1-4 alkyl group such as a methyl group or an ethyl group).
  • the proportion of the alkylenediamine component is 50 to 100 mol%, preferably 60 to 100 mol% (eg 70 to 97 mol%), more preferably 75 to 100 mol% (eg 80 to 95 mol%).
  • dicarboxylic acid component examples include aliphatic dicarboxylic acid or alkane dicarboxylic acid components (for example, about 4 to 36 carbon atoms such as adipic acid, pimelic acid, azelaic acid, sebacic acid, dodecanedioic acid, dimer acid or hydrogenated product thereof). And dicarboxylic acid or C4-36 alkanedicarboxylic acid). These dicarboxylic acid components can be used alone or in combination of two or more.
  • Preferred dicarboxylic acid components include C 6-36 alkane dicarboxylic acids (eg, C 6-16 alkane dicarboxylic acids, preferably C 8-14 alkane dicarboxylic acids, etc.).
  • an alicyclic dicarboxylic acid component such as C 5-10 cycloalkane-dicarboxylic acid such as cyclohexane-1,4-dicarboxylic acid, cyclohexane-1,3-dicarboxylic acid, etc.
  • aromatic dicarboxylic acid Terephthalic acid, isophthalic acid, etc.
  • diamine component and dicarboxylic acid component an alicyclic ring obtained by using the aliphatic diamine component and / or aliphatic dicarboxylic acid component exemplified above together with the alicyclic diamine component and / or alicyclic dicarboxylic acid component.
  • the group polyamide resin is known as so-called transparent polyamide, and has high transparency.
  • the proportion of the alkanedicarboxylic acid component is 50 to 100 mol%, preferably 60 to 100 mol% (eg 70 to 97 mol%), more preferably 75 to 100 mol% (eg 80 About 95 mol%).
  • the diamine component in the first amide-forming component, can be used in a range of about 0.8 to 1.2 mol, preferably about 0.9 to 1.1 mol, relative to 1 mol of the dicarboxylic acid component.
  • lactam component examples include C such as ⁇ -valerolactam, ⁇ -caprolactam, ⁇ -heptalactam, ⁇ -octalactam, ⁇ -decane lactam, ⁇ -undecanactam, ⁇ -laurolactam (or ⁇ -laurinlactam). such as 4-20 lactam.
  • aminocarboxylic acid component for example, .omega.-aminodecanoic acid, .omega.-aminoundecanoic acid, C 6-20 aminocarboxylic acids such as .omega.-aminododecanoic acid can be exemplified. These lactam components and aminocarboxylic acid components can also be used alone or in combination of two or more.
  • Preferred lactam components include C 6-19 lactam, preferably C 8-17 lactam, more preferably C 10-15 lactam (such as laurolactam).
  • Preferred aminocarboxylic acids are amino C 6-19 alkanecarboxylic acids, preferably amino C 8-17 alkanecarboxylic acids, more preferably amino C 10-15 alkanecarboxylic acids (aminoundecanoic acid, aminododecanoic acid, etc.). Contains.
  • the copolymerized polyamide may be a modified polyamide such as a polyamide having a branched chain structure using a small amount of a polycarboxylic acid component and / or a polyamine component.
  • a first amide-forming component both components combining a diamine component and a dicarboxylic acid component
  • a second amide-forming component at least one amide-forming component selected from a lactam component and an aminocarboxylic acid component
  • the copolymerized polyamide preferably includes a long chain component having a long chain fatty chain (long chain alkylene group or alkenylene group) as a constituent unit (or includes a unit derived from the long chain component).
  • a long chain component includes a long chain fatty chain having about 8 to 36 carbon atoms or a component having an alkylene group (preferably a C 8-16 alkylene group, more preferably a C 10-14 alkylene group).
  • long chain component examples include C 8-18 alkane dicarboxylic acid (preferably C 10-16 alkane dicarboxylic acid, more preferably C 10-14 alkane dicarboxylic acid, etc.), C 9-17 lactam (preferably laurolactam, etc.) And C11-15 lactams) and amino C 9-17 alkanecarboxylic acids (preferably amino C 11-15 alkanecarboxylic acids such as aminoundecanoic acid and aminododecanoic acid). These long chain components can be used alone or in combination of two or more.
  • At least one component selected from a lactam component and / or an aminoalkanecarboxylic acid component such as laurolactam, aminoundecanoic acid and aminododecanoic acid is often used.
  • Copolyamides containing such component-derived units have high water resistance and are excellent in adhesion, wear resistance and impact resistance to electronic devices, and can effectively protect electronic devices.
  • the ratio of the long chain component is 10 to 100 mol% (for example, 25 to 95 mol%), preferably 30 to 90 mol% (for example, 40 to 85 mol%) with respect to the whole monomer component forming the copolymer polyamide. Mol%), more preferably about 50 to 80 mol% (for example, 55 to 75 mol%).
  • the copolyamide may be a multi-component copolymer of the amide-forming component, for example, a binary copolymer to a quaternary copolymer, but is usually a binary copolymer to a quaternary copolymer. In many cases, the polymer is a binary copolymer or a ternary copolymer.
  • the copolymerized polyamide often includes, for example, an amide-forming component selected from polyamide 11, polyamide 12, polyamide 610, polyamide 612, and polyamide 1010 as a constituent unit (or a unit derived from the amide-forming component).
  • the copolymerized polyamide may be a copolymer of a plurality of these amide-forming components, and the one or more amide-forming components and other amide-forming components (at least one selected from polyamide 6 and polyamide 66). It may be a copolymer with an amide-forming component or the like).
  • examples of the copolyamide include copolyamide 6/11, copolyamide 6/12, copolyamide 66/11, copolyamide 66/12, copolyamide 610/11, copolyamide 612/11, copolyamide Polyamide 610/12, copolyamide 612/12, copolyamide 10/10/12, copolyamide 6/11/610, copolyamide 6/11/612, copolyamide 6/12/610, copolyamide 6/12/612, etc. Can be mentioned. These copolyamides can be used alone or in combination of two or more. In these copolyamides, the component separated by a slash “/” indicates an amide-forming component.
  • the sealing member may have at least one unit described below.
  • A a unit derived from a long chain component having a C 8-16 alkylene group
  • b a unit derived from at least one component selected from C 9-17 lactam and amino C 9-17 alkanecarboxylic acid
  • c Units derived from at least one component selected from laurolactam, aminoundecanoic acid and aminododecanoic acid.
  • a polyamide elastomer polyamide block copolymer
  • a polyamide segment for example, polyamide 11
  • a hard segment or hard block
  • Polyamide 12 Polyamide 12, polyamide 610, polyamide 612 and polyamide segment derived from an amide-forming component selected from polyamide 1010) and a soft block (or soft block) polyamide block copolymer, for example, polyamide Polyether block copolymer, polyamide - polyester block copolymer, a polyamide - like polycarbonate block copolymer.
  • a soft block polyamide block copolymer for example, polyamide Polyether block copolymer, polyamide - polyester block copolymer, a polyamide - like polycarbonate block copolymer.
  • a typical polyamide elastomer is a polyamide-polyether block copolymer, for example, a polyether amide [eg, a polyamide block having a diamine end and a polyalkylene glycol block having a dicarboxyl end (or polyoxyalkylene block) Block copolymers, block copolymers of polyamide blocks having dicarboxyl ends and polyalkylene glycol blocks having diamine ends (or polyoxyalkylene blocks)], polyetheresteramides [polyamide blocks having dicarboxyl ends] And a block copolymer of a dialkylene-terminated polyalkylene glycol block (or polyoxyalkylene block) and the like.
  • a polyether amide eg, a polyamide block having a diamine end and a polyalkylene glycol block having a dicarboxyl end (or polyoxyalkylene block)
  • polyether examples include polyalkylene glycol (for example, poly C 2-6 alkylene glycol such as polyethylene glycol, polypropylene glycol, polytetramethylene glycol, preferably poly C 2-4 alkylene glycol). Can be mentioned.
  • the polyamide elastomer may have an ester bond.
  • the number average molecular weight of the soft segment can be selected from the range of, for example, about 100 to 10,000, preferably 300 to 6000 (for example, 300 to 5000), more preferably 500 to 4000 ( For example, it may be about 500 to 3000), particularly about 1000 to 2000.
  • copolyamide resins may be used alone or in combination of two or more.
  • copolymer polyamide resins copolymer polyamides (non-polyamide elastomers or polyamide random copolymers) are preferable from the viewpoint of sealing properties of electronic devices.
  • amide-forming components derived from polyamide 12 are constituent units. Copolyamides included as are preferred.
  • the amino group concentration of the copolymerized polyamide resin is not particularly limited, and may be, for example, about 10 to 300 mmol / kg, preferably about 15 to 280 mmol / kg, and more preferably about 20 to 250 mmol / kg.
  • the amino group concentration of the copolymerized polyamide-based resin is high, the adhesiveness can be improved when another layer (such as a protective layer described later) is laminated on the sealing member, which is advantageous.
  • the carboxyl group concentration of the copolymerized polyamide resin is not particularly limited, and may be, for example, about 10 to 300 mmol / kg, preferably about 15 to 280 mmol / kg, and more preferably about 20 to 250 mmol / kg.
  • the thermal stability is high, which is advantageous in terms of long-term stability (continuous processability).
  • the number average molecular weight of the copolymerized polyamide resin can be selected from the range of, for example, about 5,000 to 200,000, for example, 6000 to 100,000, preferably 7000 to 70000 (for example, 7000 to 15000), and more preferably 8000 to 40,000 (for example, 8000 to 12000), and usually about 8000 to 30000.
  • the molecular weight of the copolymerized polyamide resin can be measured in terms of polymethyl methacrylate by gel permeation chromatography using HFIP (hexafluoroisopropanol) as a solvent.
  • the amide bond content of the copolymerized polyamide-based resin can be selected, for example, from a range of 100 units or less per copolymerized polyamide-based resin, and is 30 to 90 units, preferably 40 to 80 units, from the viewpoint of device sealing performance. More preferably, it may be about 50 to 70 units (for example, 55 to 60 units).
  • the amide bond content can be calculated, for example, by dividing the number average molecular weight by the molecular weight of the repeating unit (1 unit).
  • the copolymerized polyamide resin may be amorphous or may have crystallinity.
  • the degree of crystallinity of the copolymerized polyamide resin is, for example, 20% or less (eg, 1 to 18%), preferably 15% or less (eg, 2 to 13%), more preferably 10% or less (eg, 2 to 2%). 8%).
  • the crystallinity can be measured by a conventional method, for example, a measurement method based on density or heat of fusion, an X-ray diffraction method, an infrared absorption method, or the like.
  • the heat melting property of the amorphous copolymerized polyamide resin can be measured as a softening temperature with a differential scanning calorimeter, and the melting point of the crystalline copolymerized polyamide resin can be measured with a differential scanning calorimeter (DSC).
  • DSC differential scanning calorimeter
  • the melting point or softening point of the copolyamide resin is 75 to 160 ° C. (eg 80 to 150 ° C.), preferably 90 to 140 ° C. (eg 95 to 135 ° C.), Preferably, it may be about 100 to 130 ° C, and is usually about 90 to 160 ° C (eg, 100 to 150 ° C). Since the copolymerized polyamide-based resin has a low melting point or softening point and high adhesiveness, it can be melted at a relatively low temperature and firmly bonded to the device surface (substrate).
  • the melting point of the copolymerized polyamide resin means a temperature corresponding to a single peak when each component is compatible and a single peak is generated in DSC, each component is incompatible, and DSC When a plurality of peaks occur, the temperature corresponding to the peak on the high temperature side among the plurality of peaks is meant.
  • the copolymerized polyamide-based resin may have at least one of the following characteristics.
  • melt flow rate (MFR) of a thermoplastic resin is 1 to 350 g / 10 minutes, preferably 3 to 300 g / 10 minutes, more preferably at a temperature of 160 ° C. and a load of 2.16 kg. It may be about 5 to 250 g / 10 minutes.
  • the thermoplastic resin for example, copolymerized polyamide-based resin
  • the proportion of the homopolyamide is 30 parts by weight or less (for example, 1 to 25 parts by weight), preferably 2 to 20 parts by weight, and more preferably about 3 to 15 parts by weight with respect to 100 parts by weight of the copolymer polyamide resin. There may be.
  • the polyamides may be compatible with each other.
  • the sealing member may contain the other thermoplastic resin, for example, ethylene-vinyl acetate copolymer, if necessary.
  • the ratio of the other resin is, for example, 100 parts by weight or less (eg, about 1 to 80 parts by weight), preferably 2 to 70 parts by weight, more preferably 2 to 50 parts per 100 parts by weight of the copolymer polyamide resin. It may be 30 parts by weight or less (for example, about 3 to 20 parts by weight).
  • Thermoplastic resins are optionally added with various additives such as fillers, stabilizers (heat stabilizers, weathering stabilizers, etc.), colorants, plasticizers, lubricants, flame retardants, An antistatic agent, a heat conductive agent, and the like may be included.
  • additives may be used alone or in combination of two or more. Of these additives, stabilizers, heat conducting agents and the like are widely used.
  • the sealing member of the present invention includes a copolymerized polyamide resin, a mixture of a plurality of copolymerized polyamide resins, or a copolymerized polyamide resin and other components (such as a homopolyamide and an additive). You may form with a mixture (copolymerization polyamide-type resin composition).
  • the sealing member of the present invention is formed into a film shape (or a sheet shape) or a tray shape (or a case shape).
  • the film-like or tray-like sealing member only needs to have a peripheral portion containing the thermoplastic resin (such as a heat-adhesive resin such as a copolyamide-based resin) in order to improve the bondability with the substrate.
  • the periphery may be in line or surface contact with the substrate of the device.
  • the peripheral portion of the sealing member may be formed of the thermoplastic resin
  • the peripheral portion of the sealing member may be formed of the thermoplastic resin.
  • a film may be formed, but usually the entire sealing member including the peripheral portion often contains the thermoplastic resin.
  • the sealing member in such a form includes an inner region for forming a free space without adhering to a device (circuit or mounting component of the substrate); Peripheral edge adjacent to the inner area).
  • the sealing member does not adhere to the device, and stress due to the sealing member can be prevented from acting on the device (such as a mounted component in the free space).
  • the sealing region of the device can be selectively sealed. That is, the peripheral part of the desired sealing region (a specific part or all of the device) of the device can be sealed with high adhesion by the thermoplastic resin of the sealing member.
  • the film-like (or sheet-like) sealing member may be an unstretched film or a stretched film (uniaxial or biaxially stretched film).
  • the stretch ratio of the film may be, for example, about 1.2 to 10 times (preferably 1.5 to 7 times, more preferably 2 to 5 times) in one direction.
  • the film-like sealing member can be produced by using a conventional film forming method, for example, a casting method, an extrusion molding method, a blow molding method, or the like. If necessary, the film may be stretched at a predetermined magnification using a uniaxial or biaxial stretching machine.
  • the thickness of the single-layer film-shaped sealing member can be selected from the range of, for example, about 1 to 1000 ⁇ m, and is usually 5 to 500 ⁇ m (for example, 5 to 300 ⁇ m), preferably 10 to 250 ⁇ m (for example, 25 to 200 ⁇ m), More preferably, it may be about 50 to 200 ⁇ m (for example, 75 to 150 ⁇ m). If the thickness is too small, the mounted component may not be effectively protected in the sealed region, and if the thickness is too large, the adhesion of the sealing member to the substrate may be reduced.
  • the water vapor permeability (40 ° C., 90% RH) of the single-layer film-shaped sealing member is, for example, 100 g / m 2 / day or less, preferably 50 g / m 2 / day or less (for example, 0) in terms of 1 mm thickness. .About 0.01-30 g / m 2 / day).
  • a sealing member containing a copolymerized polyamide has excellent water vapor barrier properties, and the water vapor permeability is, for example, 0.01 to 2 g / m 2 / day, preferably 0.05 to 1.5 g in terms of a thickness of 1 mm. / M 2 / day, more preferably about 0.1 to 1 g / m 2 / day.
  • the water vapor permeability can be measured by a conventional method, for example, the cup method of JIS Z0208.
  • the film-like sealing member may be a single layer film or a laminated film (or laminated sheet).
  • the laminated film is not particularly limited as long as it includes at least a sealing layer formed of the thermoplastic resin (for example, a sealing layer formed of a copolymerized polyamide-based resin).
  • the thermoplastic resin A sealing layer including (a thermoadhesive thermoplastic resin such as a copolymerized polyamide-based resin) and a protection layered on one surface of the sealing layer and formed of a heat-resistant resin (or hydrophobic resin) Layer (heat-resistant resin layer or hydrophobic resin layer).
  • the protective layer may be laminated over the entire surface of the sealing layer, except for the peripheral portion of the sealing layer (the portion corresponding to the peripheral portion of the sealing member) (that is, in the inner region of the sealing layer). )
  • a protective layer may be laminated.
  • the peripheral portion of the sealing member can be bonded to the device with the protective layer facing away from the device, and in the latter laminated form, the peripheral portion of the sealing member is directed toward the device side. It may be glued to the device.
  • a plurality of protective layers may be laminated on one surface of the sealing layer.
  • the protective layer is used to protect the device from external adverse factors such as heat and moisture.
  • the heat-resistant resin layer can prevent the film from being broken due to the adhesion of the peripheral portion, and the hydrophobic resin layer is caused by moisture. Device corrosion can be prevented and device durability can be improved.
  • the heat-resistant resin is not particularly limited as long as it has heat resistance enough to withstand the bonding member's bonding temperature (or heat bonding temperature).
  • ketone resins for example, polyether ketone (PEK), polyether ether ketone (PEEK), etc.
  • polyphenylene sulfide resins for example, polyether ketone (PEK), polyether ether ketone (PEEK), etc.
  • polyphenylene sulfide resins polyether sulfone resins, cellulose derivatives, aromatic epoxy resins, and the like.
  • heat resistant resins may be used alone or in combination of two or more.
  • aromatic polyester resins such as aromatic polyamides
  • polycarbonate resins such as polycarbonate resins
  • polyamide resins such as aromatic polyamides
  • polyphenylene ether resins such as aromatic polyamides
  • polyphenylene sulfide resins such as polyphenylene sulfide resins
  • polyimide resins such as polyimide resins
  • fluorine resins are preferable.
  • typical heat resistant resins include polyester resins (such as aromatic polyesters), polyamide resins, and fluororesins.
  • polyester resins include polyalkylene arylate resins [homopolyesters (eg, poly C 2-4 alkylene arylates such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate), copolyesters (eg, C 2-4 alkylene). And the like)], polyarylate resins, liquid crystal polyesters, and the like.
  • the polyester resin also includes a polyester elastomer.
  • polyester block copolymer a polyester block copolymer composed of an aromatic polyester as a hard segment (or hard block) and a soft segment (or soft block), for example, aromatic polyester-poly
  • aromatic polyester-poly examples include ether block copolymers, aromatic polyester-aliphatic polyester block copolymers, and the like.
  • the aromatic polyester segment (or block) can be composed of the polyalkylene arylate resin (for example, poly C 2-4 alkylene terephthalate such as polybutylene terephthalate), and the soft segment is a polyether exemplified by the polyamide elastomer (for example, , Poly C 2-6 alkylene glycol such as polytetramethylene glycol) and the like.
  • the ratio of the aromatic polyester block (hard segment) is, for example, about 25 to 95% by weight, preferably about 30 to 90% by weight (for example, 50 to 85% by weight) with respect to all segments. Also good.
  • the polyamide resin As the polyamide resin, the homopolyamide (for example, polyamide 11, polyamide 12, polyamide 610, polyamide 612, polyamide 1010, polyamide 1012, etc.), a copolymer different from the copolymer polyamide resin contained in the sealing member is used. Examples thereof include polyamide resins (and polyamide elastomers).
  • the polyamide-based resin is usually a polyamide-based resin other than the copolymerized polyamide.
  • fluororesin examples include homopolymers such as polyvinyl fluoride (PVF), polyvinylidene fluoride (PVDF), polytrifluoroethylene (PTrFE), polychlorotrifluoroethylene, polytetrafluoroethylene (PTFE), and ethylene.
  • -Tetrafluoroethylene copolymer ETFE
  • ethylene-chlorotrifluoroethylene copolymer tetrafluoroethylene-hexafluoropropylene copolymer
  • tetrafluoroethylene-perfluoropropyl vinyl ether copolymer and the like.
  • the heat-resistant resin may be a highly hydrophobic resin such as an olefin resin, a styrene resin, or a fluororesin.
  • the melting point or softening point of the heat resistant resin may be, for example, 160 ° C. or higher (for example, about 165 to 250 ° C.), preferably 170 ° C. or higher (for example, about 175 to 220 ° C.).
  • fusing point or a softening point can be measured by a conventional method, for example, a differential scanning calorimeter (DSC).
  • the heat distortion temperature of the heat-resistant resin can be selected from the range of 160 ° C. or less, for example, under the condition of high load (1.82 MPa) in accordance with ISO 75-1, and is 40 to 155 ° C., preferably 50 to 150 ° C. It may be a degree.
  • the thickness of the protective layer (when a plurality of protective layers are formed, the total thickness of each protective layer) is not particularly limited as long as the peripheral portion of the laminated film can contact the device surface. It may be about 800 ⁇ m (for example, 5 to 700 ⁇ m), preferably about 10 to 600 ⁇ m (for example, 20 to 500 ⁇ m), more preferably about 30 to 400 ⁇ m (for example, 50 to 300 ⁇ m). When the thickness of the protective layer is too small, the protective layer is easily broken and the function as the protective layer is lowered. When a plurality of protective layers are formed, the thickness of each protective layer may be, for example, about 1 to 100 ⁇ m, preferably about 5 to 50 ⁇ m.
  • the laminated film may be, for example, a laminated film in which a protective layer is directly formed on one surface of the sealing layer, and the protective layer is formed on one surface of the sealing layer via an adhesive layer (intermediate layer). It may be a laminated film. Further, if necessary, an intermediate layer (adhesive layer) may be interposed between the plurality of protective layers.
  • the adhesive layer is a conventional adhesive or pressure-sensitive adhesive such as vinyl chloride adhesive, vinyl acetate adhesive, olefin adhesive, acrylic adhesive, polyester adhesive, urethane adhesive, epoxy adhesive. Alternatively, a rubber adhesive may be used.
  • the thickness of the adhesive layer is not particularly limited, and may be, for example, 1 to 50 ⁇ m (for example, 3 to 30 ⁇ m), preferably about 2 to 10 ⁇ m.
  • the thickness (total thickness) of the sealing member including the laminated film may be, for example, about 10 to 1000 ⁇ m, preferably 30 to 800 ⁇ m, and more preferably about 50 to 500 ⁇ m.
  • the laminated film can improve properties such as heat resistance, chemical resistance and water resistance as compared with a single layer film.
  • the heat distortion temperature (maximum use temperature) of the laminated film is, for example, about 160 to 300 ° C., preferably 170 to 280 ° C., and more preferably about 180 to 250 ° C.
  • the heat distortion temperature of the single layer film is 100
  • the heat distortion temperature of the laminated film is, for example, about 120 to 200, preferably about 125 to 180, and more preferably about 130 to 160.
  • the heat deformation temperature means the minimum temperature at which the film is deformed by heat treatment for 15 seconds.
  • the laminated film is chemically resistant to both organic components (for example, aliphatic hydrocarbons, aromatic hydrocarbons, alcohols, ketones, etc.) and inorganic components (for example, inorganic acids such as hydrochloric acid).
  • organic components for example, aliphatic hydrocarbons, aromatic hydrocarbons, alcohols, ketones, etc.
  • inorganic components for example, inorganic acids such as hydrochloric acid.
  • chemical resistance against alcohols such as methanol can be improved.
  • Laminated films can be obtained by conventional methods such as lamination (heat lamination, dry lamination, etc.), co-extrusion using a general-purpose feedblock die or multi-manifold die, coating (including printing such as screen printing). For example, it can be prepared by laminating a sealing layer and a protective layer.
  • the preferred form of the sealing member is a tray.
  • This tray-shaped sealing member usually includes an accommodating portion (accommodating concave portion) that can be accommodated by covering the mounted component in accordance with the height of the mounted component of the device, and an outer peripheral edge portion (a collar portion) extending from the accommodating portion. ).
  • the accommodating portion (accommodating concave portion) has, for example, a curved and swollen shape (a shape such as an inverted U-shaped cross section or a mountain shape), a wall surface and a ceiling wall depending on the component mounting form.
  • the sealing member may have a single storage part (accommodation concave part), adjacent to each other or at a predetermined interval.
  • the peripheral part (ridge part) of a sealing member is surface contactable with the board
  • the peripheral part of the film-like or tray-like sealing member may be adhered to the substrate with an adhesive if necessary, but is preferably adhered by thermal bonding.
  • the peripheral edge portion (ridge portion) of the tray-shaped sealing member may be capable of being thermally bonded or thermally fused to the substrate of the device. It should be noted that at least the peripheral edge of the sealing member only needs to be bonded to the substrate of the device. In a sealing member having a plurality of receiving recesses, the portion between the receiving recesses is also bonded to the device substrate as necessary. It may be.
  • the method for molding the sealing member into a tray shape is not particularly limited, and the tray-shaped sealing member is formed of the single-layer or laminated film-shaped (or sheet-shaped) sealing member by a conventional container molding method such as pressure forming. It can be prepared by molding into a predetermined shape by a molding method such as vacuum molding. Note that the tray-shaped sealing member does not necessarily have a shape along the electronic component mounted on the electronic device.
  • the sealing member may be applied to both sides of the device if necessary, but is usually applied to one side of the device.
  • the sealed region of the device is sealed with the sealing member, but the sealing member is separated from the mounting component of the device, and the peripheral portion of the sealing member is Adhered to the device. That is, on the inner side (inner region) of the sealed region of the device, the sealing member is separated from the device (substrate circuit, mounted component, etc.) to form a free space; the periphery of the sealed region of the device In the portion, the peripheral portion of the sealing member is bonded to the substrate of the device to form a sealing portion. In such a sealing form, even if the sealing member is in physical contact with the mounting component or the like in the free space, the adhesive strength between the sealing member and the mounting component is substantially “0”.
  • the stress by the sealing member does not substantially act on the device in the space. Furthermore, since the peripheral edge of the sealing member is in close contact with the substrate, the free space forms a buffer space filled with a gas such as air, and the mounted parts in the free space are made more effective by the buffering property of the gas. Can protect.
  • the sealing member is formed of a thermoplastic resin having flexibility (particularly, a thermoadhesive thermoplastic resin such as a copolymerized polyamide-based resin)
  • the sealed area of the substrate is formed by a balloon-shaped sealing member. Even if an external force is applied, the balloon-like sealing member and the buffer space can protect the mounted components in the free space.
  • the peripheral part of the sealing member is bonded to the device substrate, the generation of voids can be greatly reduced. Therefore, circuit corrosion and short circuit can be effectively prevented.
  • a thermoadhesive thermoplastic resin such as the above-mentioned copolymerized polyamide resin
  • the peripheral portion of the desired sealing region of the device is bonded to the sealing member with high adhesion. Can be sealed.
  • a predetermined part (sealing region) of the device can be selectively sealed according to the mounting component and the mounting form of the component.
  • FIG. 1 is a schematic side view showing an example of the sealing device of the present invention.
  • the tray-shaped sealing member 11 covers the predetermined sealing area of the electronic device 1 and can be accommodated, and extends outward (sideward direction) from the opening periphery of the accommodating recess, and the electronic device 1 substrate 2 and a peripheral edge portion 13 that can be bonded.
  • region of the electronic device 1 is covered with the tray-shaped sealing member 11 arrange
  • the mounting components 3a to 3c of the electronic device 1 are accommodated in the accommodating recess 12 of the sealing member 11, and the mounting components 3a to 3c including the substrate part 2 in the sealing region are sealed.
  • a free space 15 is formed between the stopper member 11 and the stopper member 11.
  • FIG. 2 is a schematic side view showing another example of the sealing device of the present invention.
  • symbol is attached
  • the sealing member 21 includes a plurality of receiving recesses 22a and 22b having different depths and volumes, and a plurality of receiving recesses depending on the mounting and arrangement form of the plurality of electronic components 3a to 3c in the device 1.
  • a contact portion 24 that extends in a curved or bent direction toward the substrate and that can contact the substrate 2 of the device 1, and a peripheral portion 23 that is formed on the outer peripheral portion and can contact the device 1.
  • a plurality of regions to be sealed are covered with a plurality of receiving recesses 22 a and 22 b, and a portion (contact portion) between the peripheral edge 23 of the sealing member 21 and the plurality of receiving recesses 22 a and 22 b.
  • 24 can be bonded to the substrate 2 of the device 1, and free spaces (or buffer spaces) 25 a and 25 b can be formed by the receiving recesses 22 a and 22 b.
  • the sealing member is bonded to the substrate of the device, and not only the sealing member having one or a plurality of housing recesses, but also a film-like sealing member, if necessary, It may be bonded (or thermally bonded) to the substrate in a spot shape or a linear shape (or a strip shape) even in the inner region of the sealing member as long as it does not adversely affect components and circuits.
  • the sealing device at least the peripheral part of the sealing member is bonded to the substrate of the device, thereby closing the sealing part in a frame shape (frame shape such as a square frame, a polygonal frame, a loop shape). (Closed sealing part) is formed.
  • frame shape such as a square frame, a polygonal frame, a loop shape.
  • the peripheral part of the sealing member can be sealed (or bonded) to the substrate with a predetermined width, and may be sealed (or bonded) in a linear or belt-like form.
  • the predetermined sealing region of the device is covered with the sealing member separated from the mounting component in the sealing region of the device, and the peripheral portion of the sealing member is bonded to the substrate of the device.
  • a device in which the sealed region of the device is covered and sealed with the sealing member can be manufactured.
  • the predetermined sealing region of the device is covered with a sealing member in the form of a film (or sheet) or a tray, and the step of adhering the peripheral portion of the sealing member
  • a sealing member in the form of a film (or sheet) or a tray
  • the sealing member is formed in the region to be sealed.
  • Examples of the device include various organic or inorganic devices such as semiconductor elements, electroluminescence (EL) elements, light emitting diodes, precision components such as solar cells, circuit boards on which circuits (including filter circuits) are formed, Examples include electronic components (particularly precision electronic components or electronic devices) such as printed circuit boards (printed substrates) on which various electronic components or components such as electronic elements (capacitors, filters, etc.) are mounted.
  • organic or inorganic devices such as semiconductor elements, electroluminescence (EL) elements, light emitting diodes, precision components such as solar cells, circuit boards on which circuits (including filter circuits) are formed.
  • Examples include electronic components (particularly precision electronic components or electronic devices) such as printed circuit boards (printed substrates) on which various electronic components or components such as electronic elements (capacitors, filters, etc.) are mounted.
  • the area to be sealed of the device may be covered with a sealing member, and the entire area of one surface of the device or a specific area of the device (electronic component mounting area, wiring area, etc.) may be covered.
  • the peripheral edge of the sealing member is preferably in line or surface contact with the substrate.
  • the unevenness (or undulation) due to the electronic components on the substrate is not so large, for example, a film-shaped sealing member is stacked on the substrate without being previously formed into a tray shape or a case shape, and the periphery of the sealing member By merely fusing the part (outer edge part), the electronic component or solder part in the sealed region does not adhere to the sealing member, and the effect of the present invention can be achieved.
  • the sealing member molded in a tray or case shape is put on the sealing region of the device, and only the outer edge portion of the sealing member is fused. Is preferred.
  • the area to be sealed of the device is usually a part that is easily damaged, for example, an electronic element mounting part or a wiring part.
  • the most important point in the bonding step is that the bonding area (bonding site) between the substrate and the sealing member is small, and the peripheral edge (outer edge) of the sealing member is bonded to the substrate.
  • the method of bonding is not particularly limited, and examples thereof include heating with a laser beam and heating with a heat sealing device such as a heat sealer, and a method of heating and bonding only the bonding site is preferable.
  • the entire sealing member may be heated as necessary, but under the condition that the entire sealing member is melted, the sealing member is non-uniformly fused to the electronic component on the electronic device, It is not preferable because it melts and contacts a solder part or a circuit part of an electronic component, or the thickness of the sealing part can be reduced by melting, or a hole may be opened depending on circumstances. However, as long as such a problem does not occur, the sealing member may be preheated and bonded.
  • the laser When laser is used for fusion, the laser is transmitted through the peripheral edge (or outer edge) of the sealing member as in normal laser welding, and the substrate is heated, and the peripheral edge of the sealing member is heated by the heat.
  • a method of melting and fusing may be employed, but the laser intensity may be adjusted according to the type of device (for example, the color of the substrate, the presence or absence of a circuit inside the substrate, etc.). For example, if there is a display part that can absorb laser light (such as dark colored characters that can absorb laser light) on the substrate, the laser will be strongly absorbed by the display part, generating more heat than necessary. Yes, there is a possibility of fire in extreme cases.
  • thermoplastic resin composition (laser-absorbing thermoplastic resin composition) containing a colorant (pigment or dye such as carbon black) capable of absorbing laser light and a thermoplastic resin at least at the peripheral portion of the sealing member
  • a colorant pigment or dye such as carbon black
  • the whole sealing member may be shape
  • the heating temperature of the peripheral edge (outer edge) of the sealing member is, for example, 75 to 200 ° C., preferably 80 to 180 ° C., more preferably 100 to 100 ° C., depending on the melting point and softening point of the thermoplastic resin of the sealing member. It may be about 175 ° C. (for example, 110 to 150 ° C.).
  • the heating temperature is equal to or higher than the melting point of the thermoplastic resin (for example, the melting point + 5 ° C. or higher, preferably the melting point + 10 ° C. or higher) and the melting point of the heat resistant resin forming the protective layer + 10 ° C. or lower (for example, , Melting point + 5 ° C.
  • the heating temperature may be usually not less than the glass transition temperature of the heat-resistant resin forming the protective layer (preferably not less than the heat distortion temperature). Heating can be performed in air or in an inert gas atmosphere. If necessary, adhesion may be performed under normal pressure, increased pressure, or reduced pressure. Furthermore, if necessary, thermal bonding may be repeated.
  • the peripheral edge (outer edge) of the thermally bonded sealing member may be naturally cooled, cooled stepwise or continuously, or rapidly cooled.
  • Resin A Copolymer polyamide (“Vestamelt X1038P1” manufactured by Evonik, containing C 10-14 alkylene group, melting point 125 ° C.)
  • Resin B Copolyamide (“Vestamelt X1051” manufactured by Evonik, containing C 10-14 alkylene group, melting point 130 ° C.)
  • Resin C Copolyamide (“Vestamelt X1333P1” manufactured by Evonik, containing C 10-14 alkylene group, melting point 105 ° C.)
  • Resin D Copolyamide (“Vestamelt 4680” manufactured by Evonik, containing C 10-14 alkylene group, melting point 105 ° C.)
  • Resin E Copolyamide (“Vestamelt X7079” manufactured by Evonik, containing C 10-14 alkylene group, melting point 130 ° C.)
  • Resin F a melt blend obtained by compounding two types of copolymerized polyamides (a composition containing
  • a flat plate (vertical 100 mm, horizontal 100 mm, thickness 3 mm) formed of polyetheretherketone resin (Evonik's “VESTAKEEP-J ZV7403”) has a predetermined four locations (vertical and horizontal ends, 30 mm inward, respectively)
  • the test was conducted by drilling holes (diameter: 2 mm) in four places where straight lines extending in the vertical and horizontal directions intersect, and inserting a copper wire (diameter: 1 mm, length: 10 mm) and fixing with solder.
  • a substrate was prepared.
  • the solder used was a tin-copper-nickel alloy lead-free solder.
  • test substrate was sealed by the methods of Examples and Comparative Examples, and the presence or absence of cracks in the solder portion was observed with a fiberscope.
  • a comb-shaped electrode portion was formed between the wirings of a printed wiring board (wires attached to a glass epoxy resin substrate with copper foil) to prepare a test substrate.
  • the test substrate thickness: 1.5 mm
  • the test substrate has a pair of counter electrode portions (width: 4.4 mm, length: 29 mm) formed in a straight line with an interval of 20.1 mm.
  • the length (overlap width) W of the adjacent comb teeth that overlap in the direction facing each other is 16.5 mm.
  • the outer periphery of the film-shaped sealing member that seals the test substrate is indicated by a dotted line.
  • test pieces were sealed by the methods of Examples and Comparative Examples and subjected to the following tests.
  • test substrate a test substrate (Examples 1, 2, 5 and Comparative Examples 1-6, 13-15) on which comb-shaped electrodes having a pitch (interval) of 0.4 mm were formed and a pitch of 0 were used.
  • a test substrate on which a 25 mm comb-shaped electrode was formed (other examples and comparative examples) was used.
  • Example 1 Resin A was hot-pressed to prepare a film having a thickness of 100 ⁇ m. Then, the obtained film is cut to a size corresponding to the sealed region of each test substrate, and only the peripheral portion of the film of a predetermined size is fused to the substrate of the test substrate with a heat sealer and sealed with resin. A stopped specimen was prepared.
  • the test substrate is covered with a film-like sealing member cut to a size of 100 mm in length and 100 mm in width, and only the peripheral part (outer edge part having a width of about 3 mm) of the sealing member is covered.
  • a test piece was prepared by heat-sealing the test substrate over the entire circumference and sealing with a sealing member. The film-like sealing member after heat sealing was not in contact with the copper wire, and was separated from the test substrate, the solder portion, and the copper wire without bonding except for the heat sealing portion.
  • the film-shaped sealing member cut into a size of 38 mm in length and 38 mm in width was cut and a pair of counter electrode portions and comb-shaped electrode portions (including at least comb-shaped electrode portions) of the test substrate were used.
  • the region indicated by the dotted line of Fig. 2 is covered, and only the peripheral edge portion (outer edge portion having a width of about 3 mm) of the sealing member is heat-sealed to the substrate portion and the electrode portion of the test substrate, and fusion-sealed to prepare a test piece.
  • the film-shaped sealing member was separated from the comb-shaped electrode portion and the substrate except for the heat seal portion.
  • Comparative Example 1 A test in which each test substrate was inserted into a vertical injection molding machine, the entire test piece was overmolded with resin A and sealed with resin A under the conditions of a cylinder temperature of 200 ° C., an injection pressure of 10 MPa, and a mold temperature of 30 ° C. Pieces were prepared. The thickness of the sealed resin was about 5 mm.
  • Comparative Example 2 A powder obtained by freezing and pulverizing the resin A was spread on each test substrate and heated in an oven at 180 ° C. for 5 minutes to prepare a test piece sealed with the resin A.
  • the thickness of the sealed resin was about 5 mm.
  • Example 6 In Example 1, instead of Resin A, Resin B (Example 2), Resin C (Example 3), Resin D (Example 4), Resin E (Example 5), Resin F (Example 6) A test piece was prepared in the same manner as in Example 1 except that.
  • Comparative Example 4 In Comparative Example 1, a test piece was prepared in the same manner as Comparative Example 1 except that Resin B was used instead of Resin A.
  • Comparative Example 5 In Comparative Example 2, a test piece was prepared in the same manner as Comparative Example 2 except that Resin B was used instead of Resin A.
  • Comparative Example 6 In Comparative Example 3, a test piece was prepared in the same manner as Comparative Example 3 except that Resin B was used instead of Resin A.
  • Comparative Example 7 In Comparative Example 1, a test piece was prepared in the same manner as in Comparative Example 1 except that Resin C was used instead of Resin A and the cylinder temperature was changed to 170 ° C.
  • Comparative Example 8 In Comparative Example 2, a test piece was prepared in the same manner as Comparative Example 2 except that Resin C was used instead of Resin A.
  • Comparative Example 9 In Comparative Example 3, a test piece was prepared in the same manner as in Comparative Example 3 except that Resin C was used instead of Resin A.
  • Comparative Example 10 In Comparative Example 1, a test piece was prepared in the same manner as in Comparative Example 1 except that Resin D was used instead of Resin A and the cylinder temperature was changed to 170 ° C.
  • Comparative Example 11 In Comparative Example 2, a test piece was prepared in the same manner as Comparative Example 2 except that Resin D was used instead of Resin A.
  • Comparative Example 12 In Comparative Example 3, a test piece was prepared in the same manner as Comparative Example 3 except that Resin D was used instead of Resin A.
  • Comparative Example 13 In Comparative Example 1, a test piece was prepared in the same manner as Comparative Example 1 except that Resin E was used instead of Resin A.
  • Comparative Example 14 In Comparative Example 2, a test piece was prepared in the same manner as Comparative Example 2 except that Resin E was used instead of Resin A.
  • Comparative Example 15 In Comparative Example 3, a test piece was prepared in the same manner as Comparative Example 3 except that Resin E was used instead of Resin A.
  • Example 1 In the moisture resistance test, in Example 1 and Example 2, it was 5 ⁇ 10 8 ⁇ at 500 hours.
  • Example 1 In the heat shock test, in Example 1, Example 2, and Comparative Example 1, it was 1.0 ⁇ 10 9 ⁇ at the time of 500 cycles (500 times).
  • Example 3 In the moisture resistance test, in Example 3 and Example 4, it was 5 ⁇ 10 8 ⁇ at 500 hours.
  • Example 3 In the heat shock test, in Example 3, Example 4, and Comparative Example 7, it was 1.0 ⁇ 10 9 ⁇ at the time of 500 cycles (500 times).
  • Example 5 In the voltage application test, in Example 5 and Comparative Examples 13 to 15, a test substrate having a comb electrode pitch of 0.4 mm was used, and in Example 6, a test substrate having a comb electrode pitch of 0.25 mm was used. did.
  • Example 5 In the moisture resistance test, in Example 5 and Example 6, it was 5 ⁇ 10 8 ⁇ at 500 hours.
  • Example 5 In the heat shock test, in Example 5, Example 6, and Comparative Example 13, it was 1.0 ⁇ 10 9 ⁇ at the time of 500 cycles (500 times).
  • all of the embodiments can be sealed with high adhesion, and the sealed area of the substrate can be effectively protected even if only the peripheral edge of the sealing member is bonded to the substrate.
  • the present invention is useful for sealing electronic elements or electronic components such as semiconductor elements, EL elements, solar cells, printed circuit boards mounted with various electronic components or electronic elements, and the like.

Abstract

　Selon la présente invention, une région isolée d'un dispositif (1) est logée par un élément d'étanchéité (11) ayant une forme de pellicule ou de bac, dont au moins une partie bord périphérique (13) comprend une résine thermoplastique (résine à base de polyamide copolymère ou analogue), la partie bord périphérique de l'élément d'étanchéité (11) est thermocollée à un substrat (2) du dispositif (1) dans une forme dans laquelle l'élément d'étanchéité (11) est séparé de constituants montés en surface (3a-3c) du dispositif (1) à l'intérieur de la région isolée, et un dispositif isolé est fabriqué dans lequel la région isolée du dispositif est couverte par l'élément d'étanchéité (11). La résine à base de polyamide copolymère peut comporter des unités dérivées d'un constituant à chaîne longue contenant un groupe alkylène en C8-16 (un lactame en C9-17, un aminoacide carboxylique d'alcane en C9-17, ou analogue). L'élément d'étanchéité isole et protège sélectivement et efficacement une partie prédéterminée du dispositif.
PCT/JP2014/078275 2013-11-07 2014-10-23 Élément de d'étanchéité, substrat isolé par l'élément d'étanchéité, et son procédé de fabrication WO2015068585A1 (fr)

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JP2015546598A JPWO2015068585A1 (ja) 2013-11-07 2014-10-23 封止部材、この封止部材で封止された封止基板及びその製造方法
CN201480061306.6A CN105706229A (zh) 2013-11-07 2014-10-23 密封构件、用该密封构件密封的密封基板及其制造方法
KR1020167014619A KR20160083892A (ko) 2013-11-07 2014-10-23 밀봉 부재, 이 밀봉 부재로 밀봉된 밀봉 기판 및 그의 제조 방법

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JP2020026067A (ja) * 2018-08-10 2020-02-20 ダイセル・エボニック株式会社 複合成形体、及びその製造方法
CN112272890A (zh) * 2018-05-28 2021-01-26 大日本印刷株式会社 电池、热封装置和电池的制造方法
EP3961697A1 (fr) * 2020-08-25 2022-03-02 Siemens Aktiengesellschaft Module semi-conducteur doté d'une cavité

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TW201523814A (zh) 2015-06-16
TWI666741B (zh) 2019-07-21

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