JP5592215B2 - 粉末状封止剤及び封止方法 - Google Patents
粉末状封止剤及び封止方法 Download PDFInfo
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- JP5592215B2 JP5592215B2 JP2010212536A JP2010212536A JP5592215B2 JP 5592215 B2 JP5592215 B2 JP 5592215B2 JP 2010212536 A JP2010212536 A JP 2010212536A JP 2010212536 A JP2010212536 A JP 2010212536A JP 5592215 B2 JP5592215 B2 JP 5592215B2
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- polyamide
- copolyamide
- resin
- powdery
- component
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Classifications
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
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- H10K50/844—Encapsulations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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Description
フラットな基板面での密封性、及びフラットな基板面から直角に立ち上がる側面(高さ:2mm又は20mm)を有する凸部での密封性を、それぞれ以下の基準で評価した。
5:完全に被覆されている
4:ほぼ完全に被覆されているが、一部空気の進入が見られる
3:半分が浮いている
2:一部被塗物と接着しているが、殆どが浮いている
1:塗膜が完全に浮いている。
実施例及び比較例の封止剤で封止されたガラスエポキシ製基板を用いて、碁盤目剥離試験により接着性を評価した。
実施例及び比較例の封止剤で封止されたガラスエポキシ製基板を、23℃の恒温層に100時間浸漬した後、碁盤目剥離試験により耐水性を評価した。
共重合ポリアミド(VESTAMELT X1038p1、エボニック・デグサ社製、C10−14アルキレン基を含有、平均粒子径80μm、粒度0.5〜160μm、融点125℃(DSC)、メルトフローレート15g/10分(温度160℃及び荷重2.16kg))を、金網(開口径200μm)を用い、ガラスエポキシ樹脂製電子基板(200mm×200mm)上に均等に散布した後、温度170℃の雰囲気中で加熱し、透明な樹脂でコーティングされた基板を得た。
共重合ポリアミド(VESTAMELT X1051、エボニック・デグサ社製、C10−14アルキレン基を含有、融点130℃(DSC)、メルトフローレート15g/10分(温度160℃及び荷重2.16kg))を粉砕し、篩いで分級し、平均粒子径80μm、粒度0.5〜160μmの粉末状樹脂粒子を得た。この樹脂粒子を金網(開口径250μm)を用い、ガラスエポキシ樹脂製電子基板(200mm×200mm)上に均等に散布した後、温度180℃の雰囲気中で加熱し、透明な樹脂でコーティングされた基板を得た。
共重合ポリアミド(VESTAMELT X1333p1、エボニック・デグサ社製、C10−14アルキレン基を含有、平均粒子径80μm、粒度0.5〜160μm、融点105℃(DSC)、メルトフローレート15g/10分(温度160℃及び荷重2.16kg))を、金網(開口径200μm)を用い、ガラスエポキシ樹脂製電子基板(200mm×200mm)上に均等に散布した後、温度170℃の雰囲気中で加熱し、透明な樹脂でコーティングされた基板を得た。
共重合ポリアミド(VESTAMELT 4680、エボニック・デグサ社製、C10−14アルキレン基を含有、平均粒子径80μm、粒度0.5〜160μm、融点105℃(DSC)、メルトフローレート35g/10分(温度160℃及び荷重2.16kg))を、金網(開口径200μm)を用い、ガラスエポキシ樹脂製電子基板(200mm×200mm)上に均等に散布した後、温度170℃の雰囲気中で加熱し、透明な樹脂でコーティングされた基板を得た。
共重合ポリアミド(VESTAMELT Z2131、エボニック・デグサ社製、C10−14アルキレン基を含有、平均粒子径80μm、粒度0.5〜160μm、融点90℃(DSC)、メルトフローレート160g/10分(温度160℃及び荷重2.16kg))を、金網(開口径300μm)を用い、ガラスエポキシ樹脂製電子基板(200mm×200mm)上に均等に散布した後、温度130℃の雰囲気中で加熱し、透明な樹脂でコーティングされた基板を得た。
電子部品(高さ20mm)が実装されたガラスエポキシ樹脂製電子基板(200mm×200mm)を170℃で2分間加熱した後、共重合ポリアミド(VESTAMELT X1038p1、エボニック・デグサ社製、C10−14アルキレン基を含有、平均粒子径80μm、粒度0.5〜160μm、融点125℃(DSC)、メルトフローレート15g/10分(温度160℃及び荷重2.16kg))を、金網(開口径200μm)を通じて散布し、過剰の樹脂粒子を取り除き、温度170℃の雰囲気中で2分間加熱し、電子部品も含め、透明な樹脂でコーティングされた実装基板を得た。
ポリアミド12(DAIAMID A1709、エボニック・デグサ社製、平均粒子径80μm、粒度0.5〜160μm、融点178℃(DSC)、メルトフローレート70g/10分(温度190℃及び荷重2.16kg))を、ガラスエポキシ樹脂製電子基板(200mm×200mm)上に均等に散布した後、温度220℃の雰囲気中で加熱し、透明な樹脂でコーティングされた基板を得た。
Claims (13)
- デバイスをモールドして封止するための封止剤であって、平均粒子径が50〜200μmであり、温度160℃及び荷重2.16kgにおけるメルトフローレートが5〜250g/10分である共重合ポリアミド系樹脂を含み、かつ他の樹脂の割合が前記共重合ポリアミド系樹脂100重量部に対して100重量部以下である粉末状封止剤。
- 共重合ポリアミド系樹脂の融点又は軟化点が75〜160℃である請求項1記載の粉末状封止剤。
- 共重合ポリアミド系樹脂が結晶性を有する請求項1又は2記載の粉末状封止剤。
- 共重合ポリアミド系樹脂が結晶性を有するとともに、融点90〜160℃を有する請求項1〜3のいずれかに記載の粉末状封止剤。
- 共重合ポリアミド系樹脂が多元共重合体である請求項1〜4のいずれかに記載の粉末状封止剤。
- 共重合ポリアミド系樹脂が二元共重合体〜四元共重合体である請求項1〜5のいずれかに記載の粉末状封止剤。
- 共重合ポリアミド系樹脂が、C8−16アルキレン基を有する長鎖成分由来の単位を含む請求項1〜6のいずれかに記載の粉末状封止剤。
- 共重合ポリアミド系樹脂が、C9−17ラクタム及びアミノC9−17アルカンカルボン酸から選択された少なくとも一種の成分由来の単位を含む請求項1〜7のいずれかに記載の粉末状封止剤。
- 共重合ポリアミド系樹脂が、ポリアミド11,ポリアミド12、ポリアミド610、ポリアミド612及びポリアミド1010から選択されたアミド形成成分に由来する単位を含む請求項1〜8のいずれかに記載の粉末状封止剤。
- 共重合ポリアミド系樹脂が、コポリアミド6/11、コポリアミド6/12、コポリアミド66/11、コポリアミド66/12、コポリアミド610/11、コポリアミド612/11、コポリアミド610/12、コポリアミド612/12、コポリアミド1010/12、コポリアミド6/11/610、コポリアミド6/11/612、コポリアミド6/12/610、及びコポリアミド6/12/612から選択された少なくとも一種である請求項1〜9のいずれかに記載の粉末状封止剤。
- 共重合ポリアミド系樹脂が、ラウロラクタム、アミノウンデカン酸及びアミノドデカン酸から選択された少なくとも一種の成分に由来する単位を含む請求項1〜10のいずれかに記載の粉末状封止剤。
- デバイスの少なくとも一部に請求項1〜11のいずれかに記載の粉末状封止剤を適用し、粉末状封止剤を加熱溶融して冷却し、共重合ポリアミド系樹脂で被覆又はモールドされたデバイスを製造する方法。
- 請求項1〜11のいずれかに記載の粉末状封止剤が熱融着して形成された共重合ポリアミド系樹脂の被膜で、少なくとも一部が被覆又はモールドされたデバイス。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010212536A JP5592215B2 (ja) | 2010-09-22 | 2010-09-22 | 粉末状封止剤及び封止方法 |
PCT/JP2011/071519 WO2012039437A1 (ja) | 2010-09-22 | 2011-09-21 | 粉末状封止剤及び封止方法 |
CN2011800563063A CN103221455A (zh) | 2010-09-22 | 2011-09-21 | 粉末状密封剂和密封方法 |
KR1020137010071A KR20130108363A (ko) | 2010-09-22 | 2011-09-21 | 분말상 밀봉제 및 밀봉 방법 |
US13/822,498 US20130177704A1 (en) | 2010-09-22 | 2011-09-21 | Powdery sealant and sealing method |
EP11826882.0A EP2620463A4 (en) | 2010-09-22 | 2011-09-21 | POWDER SEALANT AND METHOD OF SEALING |
TW100134104A TW201231499A (en) | 2010-09-22 | 2011-09-22 | Powder-shaped sealing agent and sealing method |
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JP2010212536A JP5592215B2 (ja) | 2010-09-22 | 2010-09-22 | 粉末状封止剤及び封止方法 |
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JP2012067176A JP2012067176A (ja) | 2012-04-05 |
JP5592215B2 true JP5592215B2 (ja) | 2014-09-17 |
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US (1) | US20130177704A1 (ja) |
EP (1) | EP2620463A4 (ja) |
JP (1) | JP5592215B2 (ja) |
KR (1) | KR20130108363A (ja) |
CN (1) | CN103221455A (ja) |
TW (1) | TW201231499A (ja) |
WO (1) | WO2012039437A1 (ja) |
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KR20140127302A (ko) * | 2012-02-09 | 2014-11-03 | 다이셀에보닉 주식회사 | 분말 상태 밀봉제 및 밀봉 방법 |
WO2013137130A1 (ja) * | 2012-03-16 | 2013-09-19 | ダイセル・エボニック株式会社 | ペースト状封止剤及び封止方法 |
CN103709986B (zh) * | 2013-12-18 | 2016-07-06 | 苏州市邦涔高分子科技有限公司 | 一种聚酰胺热熔胶 |
FR3018521B1 (fr) * | 2014-03-17 | 2017-07-07 | Arkema France | Composition de copolyamide a main souple |
EP3470451B1 (en) | 2016-09-29 | 2023-03-08 | Toyobo Co., Ltd. | Crystalline polyester resin and flame-resistant sealing resin composition |
FR3087775B1 (fr) | 2018-10-24 | 2022-12-02 | Arkema France | Poudres de copolyamide a basse temperature de fusion |
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NL7404701A (ja) * | 1973-04-19 | 1974-10-22 | ||
DE2324159A1 (de) * | 1973-05-12 | 1974-11-28 | Plate Bonn Gmbh | Copolyamide enthaltend caprolactam, laurinlactam und adipinsaures hexamethylendiamin |
US4093492A (en) * | 1973-05-12 | 1978-06-06 | Plate Bonn Gesellschaft Mit Beschrankter Haftung | Copolyamides containing caprolactam, lauriclactam and 11-aminoundecanoic acid |
JPS63189458A (ja) * | 1987-02-03 | 1988-08-05 | Dainippon Ink & Chem Inc | 電子部品封止用ポリアリ−レンスルフイド樹脂組成物及び電子部品 |
JP4359793B2 (ja) * | 1998-10-22 | 2009-11-04 | ノードソン株式会社 | 電子部品が実装されたプリント基板を封止する方法 |
JP2001234125A (ja) | 2000-02-24 | 2001-08-28 | Sumitomo Seika Chem Co Ltd | 溶射塗装用粉体塗料 |
JP2002100854A (ja) * | 2000-09-21 | 2002-04-05 | Matsushita Electric Works Ltd | 電子回路ブロック |
JP2004363406A (ja) * | 2003-06-06 | 2004-12-24 | Honda Motor Co Ltd | 樹脂封止電子部品ユニット及びその製造方法 |
US20050000726A1 (en) * | 2003-06-06 | 2005-01-06 | Honda Motor Co., Ltd. | Resin encapsulated electronic component unit and method of manufacturing the same |
JP2005179582A (ja) * | 2003-12-22 | 2005-07-07 | Matsushita Electric Works Ltd | 光半導体封止用樹脂組成物、光半導体封止用予備成形体、光半導体装置 |
DE102004010160A1 (de) * | 2004-02-27 | 2005-09-15 | Degussa Ag | Polymerpulver mit Copolymer, Verwendung in einem formgebenden Verfahren mit fokussiertem Energieeintrag und Formkörper, hergestellt aus diesem Polymerpulver |
JP2006111018A (ja) * | 2005-11-09 | 2006-04-27 | Daicel Polymer Ltd | 樹脂封止方法 |
JP5209229B2 (ja) | 2007-05-09 | 2013-06-12 | 中島硝子工業株式会社 | 太陽電池モジュールの製造方法 |
JP5348869B2 (ja) | 2007-10-17 | 2013-11-20 | 小松精練株式会社 | 有機電子デバイス用ホットメルト型部材、バリアフィルム封止部材、それらを用いた有機電子デバイス封止パネル |
JP5594930B2 (ja) | 2007-10-17 | 2014-09-24 | 小松精練株式会社 | 有機薄膜太陽電池用ホットメルト型部材及び有機薄膜太陽電池素子筐体封止パネル |
-
2010
- 2010-09-22 JP JP2010212536A patent/JP5592215B2/ja not_active Expired - Fee Related
-
2011
- 2011-09-21 CN CN2011800563063A patent/CN103221455A/zh active Pending
- 2011-09-21 WO PCT/JP2011/071519 patent/WO2012039437A1/ja active Application Filing
- 2011-09-21 EP EP11826882.0A patent/EP2620463A4/en not_active Withdrawn
- 2011-09-21 US US13/822,498 patent/US20130177704A1/en not_active Abandoned
- 2011-09-21 KR KR1020137010071A patent/KR20130108363A/ko not_active Application Discontinuation
- 2011-09-22 TW TW100134104A patent/TW201231499A/zh unknown
Also Published As
Publication number | Publication date |
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KR20130108363A (ko) | 2013-10-02 |
EP2620463A1 (en) | 2013-07-31 |
TW201231499A (en) | 2012-08-01 |
CN103221455A (zh) | 2013-07-24 |
WO2012039437A1 (ja) | 2012-03-29 |
US20130177704A1 (en) | 2013-07-11 |
JP2012067176A (ja) | 2012-04-05 |
EP2620463A4 (en) | 2014-05-07 |
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