AU2001272814A1 - Plastic package base, air cavity type package and their manufacturing methods - Google Patents

Plastic package base, air cavity type package and their manufacturing methods

Info

Publication number
AU2001272814A1
AU2001272814A1 AU2001272814A AU7281401A AU2001272814A1 AU 2001272814 A1 AU2001272814 A1 AU 2001272814A1 AU 2001272814 A AU2001272814 A AU 2001272814A AU 7281401 A AU7281401 A AU 7281401A AU 2001272814 A1 AU2001272814 A1 AU 2001272814A1
Authority
AU
Australia
Prior art keywords
air cavity
manufacturing methods
cavity type
package
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001272814A
Inventor
Chan-Ik Park
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020000042755A external-priority patent/KR100335658B1/en
Priority claimed from KR10-2000-0059051A external-priority patent/KR100374683B1/en
Application filed by Individual filed Critical Individual
Publication of AU2001272814A1 publication Critical patent/AU2001272814A1/en
Abandoned legal-status Critical Current

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    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
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    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
AU2001272814A 2000-07-25 2001-07-20 Plastic package base, air cavity type package and their manufacturing methods Abandoned AU2001272814A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR0042755 2000-07-25
KR1020000042755A KR100335658B1 (en) 2000-07-25 2000-07-25 Base of plastic package and method of manufacturing the same
KR10-2000-0059051A KR100374683B1 (en) 2000-10-07 2000-10-07 Air-cavity type package and method of manufacturing the same
KR0059051 2000-10-07
PCT/KR2001/001244 WO2002009180A1 (en) 2000-07-25 2001-07-20 Plastic package base, air cavity type package and their manufacturing methods

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CN1449583A (en) 2003-10-15
US20040011699A1 (en) 2004-01-22
JP2004505450A (en) 2004-02-19
US6983537B2 (en) 2006-01-10
JP3733114B2 (en) 2006-01-11
JP2006041550A (en) 2006-02-09
WO2002009180A1 (en) 2002-01-31

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