JPH10107170A - Resin-molded electronic apparatus and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a resin from flowing to an element mounting face in a resin molding operation by a method wherein gaps between leads in a molding region at a lead frame are filled with the resin in advance so as to be hardened, the gaps between the leads are blocked up, a lid is put on an element and the opening edge of the lid is bonded and fixed to the lead frame. SOLUTION: In a resin-molded electronic component, an element 1 is placed on an electrode part 2a in the center, electrodes on the element 1 are connected to an input lead part 2b, an output lead part 2c and a grounding conductor 2d in the center by means of bonding wires 6, the opening edge 5c of a lid 5 of a one-face opening structure is bonded to faces, on one side, of the conductors 2 so as to cover the element 1, and the lid 5 as well as the front and the rear of the conductors 2 in its peripheral region are molded with a resin. Thereby, it is possible to prevent a molding resin from creeping to an element mounting face on the lid mounting side in a molding operation, and it is possible to prevent the molding resin from being stuck to the element. In addition, when gaps between leads at a lead frame are blocked up by the resin, the element mounting face can be made uniform.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-molded electronic component which needs to be hermetically sealed and a method of manufacturing the same, and more particularly to a component suitable for application to a surface acoustic wave filter (SAW filter) and the like.

[0002]

2. Description of the Related Art As a structure in which a SAW filter is hermetically sealed with a resin mold to constitute one electronic component,
There is one disclosed in Japanese Patent Application Laid-Open No. 2-305013. This resin-molded electronic component is obtained by molding only the electrode forming surface with a lid and molding the resin with the lead extended outside in order to prevent the electrode forming surface of the element from being covered with the molding resin. Things.

[0003]

According to such a conventional structure, since the element is directly molded, there is a possibility that the element is directly subjected to the stress of the molding resin, resulting in deterioration of characteristics and breakage.

An object of the present invention is to provide a resin-molded electronic component which can be produced at a low cost by using a lead frame while sealing the entire device, and a method of manufacturing the same. .

[0005]

When a resin-molded electronic component is formed using a lead frame, a lid is used to prevent the molding resin from adhering to the electrode surface of the element. If the element is mounted on one side of the device and the element is covered with a lid, and the entire lid is molded with resin together with the lead frame, the resin will enter the element mounting surface from the groove of the lead frame, and the element electrodes will be covered with resin. And the characteristics are degraded.

In order to solve such a problem and to realize a structure in which a lid is provided on a lead frame and resin molding is performed,
According to the present invention, a resin is filled in advance in a space between leads (grooves) in a mold region of a lead frame, and the resin is cured to close the space between leads. By fixing, the flow of resin to the element mounting surface during resin molding is prevented.

That is, in the resin-molded electronic component of the present invention, in a resin-molded electronic component in which an element is mounted on a lead frame, a resin is temporarily filled between the leads of the lead frame from behind the element mounting surface of the lead frame. After curing, the device is mounted on the surface of the lead frame, the entire device is covered and sealed with a lid having a single-sided opening structure, and the device mounting surface and the back surface are molded with molding resin. Item 1).

In the method of manufacturing a resin-molded electronic component according to the present invention, a sealing member is provided on an element mounting surface of a lead frame, and a resin is temporarily filled and cured between leads of the lead frame from the back side of the element mounting surface. The element is mounted on the front surface, the entire element is covered with a lid having a single-sided opening structure, adhesively sealed, and the element mounting surface and the back surface are molded with a molding resin. ).

Further, the present invention provides, as the molding resin to be filled between the leads, a thermosetting resin, a photocurable resin, a photocurable and thermosetting resin, or a melting point higher than the molding temperature of the molding resin. A thermoplastic resin is used (claim 3).

[0010]

In the present invention, the element is fixed to the lead frame in a state in which the resin is filled and cured between the leads of the lead frame, the element is covered and adhered, and the lid is molded including the lead frame. Since the space between the leads is closed by the resin, the molding resin is prevented from entering the element mounting surface on the side where the lid is attached during molding, and the molding resin is prevented from adhering to the element. Further, when the resin is filled between the leads, the element mounting surface is covered with the closing member, so that the element mounting surface is uniform when the closing member is removed. Heating is performed to cure the resin for filling between leads, but the gas generated at that time is blocked by the closing member, and the gas can be prevented from adhering to the element mounting surface, so that the connection of the elements is not hindered.

[0011]

1A and 1B show an embodiment of a resin-molded electronic component according to the present invention, wherein FIG. 1A is a plan view showing a molding resin by a two-dot chain line, and FIGS. (A) is a right side view, a front view, and (D) and (E) are EE and FF sectional views of (A), respectively.

In FIG. 1, reference numeral 1 denotes an element constituting a SAW filter, 2a to 2c denote conductors formed from a lead frame, the center conductor 2a is a center ground conductor, and conductors 2b, 2c is an input lead part and an output lead part 2c, respectively. The space 3 between the center ground conductor 2a and the lead portions 2b, 2c on both sides is filled with a lead filling resin 4 and hardened.

The center ground conductor 2a has ground terminals 2d and 2e at opposite corners, and two input / output leads 2b and 2c have two terminals 2f and 2g, respectively. It is formed.

Reference numeral 5 denotes a lid for protecting the element 1, and the lid 5 is a one-side opening side provided integrally with a metal film or a resin molded body in order to obtain a shielding effect on the element 1. The lid 5 has grounding terminals 5a and 5b formed at two diagonally opposite corners for connection to a ground conductor on a substrate (not shown).

The resin-molded electronic component of this embodiment is:
The element 1 is placed on the central electrode 2a, and the electrodes on the element 1 are connected to the input lead 2b, the output lead 2c, and the center ground conductor 2a by bonding wires 6, respectively, so as to cover the element 1. An opening edge 5c of a lid 5 having a single-sided opening structure is adhered to one surface of each of the conductors 2.
Then, the surface and the back surface of the conductor 2 in the region around it are molded with the resin 7. In addition, as the resin 4 that fills and cures between the leads 3, a thermosetting resin, a photocurable resin,
A photo-setting thermosetting resin or a thermoplastic resin having a melting point equal to or higher than the molding temperature of the molding resin (301 manufactured by Techno Alpha Co., Ltd.) is used.

FIG. 2 is a diagram showing a manufacturing process of the resin-molded electronic component of this embodiment. FIG. 2A shows a lead frame 2X, and reference numerals 2a to 2c denote portions serving as a ground conductor, an input lead portion, and an output lead portion shown in FIG. The lead frame 2X is, as shown in FIG.
The belt-like portions a on both sides have feed holes b, and the original portions that eventually become the ground conductors 2a and the input / output lead portions 2b and 2c shown in FIG. 1 are formed by punching. FIG.
(B) shows a region where the molding resin 7 is formed.

As shown in FIG. 2 (B), a masking tape 8 is applied as a closing member to one side of the space 3 between the leads corresponding to the molded portion of the resin 7 in such a lead frame 2X to close the space 3 between the leads. . In this example, the masking tape 8 having a product name of 650S manufactured by Teraoka Seisakusho Co., Ltd. was used. The masking tape 8 uses a polyimide-based resin as a base material and a silicone-based adhesive as a pressure-sensitive adhesive in order to have a property of resisting resin heating.

Next, as shown in FIG. 2C, the resin 4 is filled in between the leads 3 of the lead frame 2X by printing from the side opposite to the surface on which the masking tape 8 is attached, and is cured. In the example, as the resin 4 for filling the space 3 between the leads, an epoxy resin of product name 968-2, which is a thermosetting resin manufactured by Ablestick Japan, was cured at 125 ° C. for 2 hours.

The masking tape 8 prevents the resin 4 from entering the element mounting surface. Further, gas generated when the resin 4 is heated and cured is generated by the lead frame 2X.
Is prevented from adhering to the wire, thereby ensuring wire bonding strength. Also, contamination during handling can be prevented.

Further, the masking tape 8 allows the lead frame 2X and the resin 4 to be on the same surface, so that an airtight structure can be easily formed when the lid 5 is bonded. Masking tape 8
When there is no, it can protrude, lose weight, rise, etc.,
Cannot be airtight.

Next, as shown in FIG. 2D, the masking tape 8 is removed from the lead frame 2X, and
(E) As shown in FIG.
An element 1 made of a SAW filter is placed on an inverted lead frame 2X with a bonding wire 6 with its electrode face up.
And electrically connected to the lead frame 2X.

On the other hand, as shown in FIG. 2 (F), an adhesive 9 is applied by printing to the opening edge of the lid 5 in which a conductive film is formed on a metal or resin molded body, and as shown in FIG. 2 (G). Thus, the lid 5 is put on the lead frame surface on which the element 1 is mounted so as to cover the element 1, and the lid 5 is pressed against the lead frame 2X, cured at 150 ° C. for one hour, and the opening edge 5c of the lid 5 is formed. To the lead frame 2X. In the embodiment, the adhesive 9 is manufactured by Nippon Pernox Co., Ltd., product name Z.
C-106-2 was used.

Then, as shown in FIG.
The front and back surfaces of the lead frame 2X in the surrounding area were molded with the resin 7 at 175 ° C. As the molding resin 7, KE-300- manufactured by Toshiba Chemical Co., Ltd.
The thermosetting epoxy resin of TS1 was used.

Thereafter, the periphery of the mold portion of the lead frame is cut formed to form terminals 2d to 2g.

As described above, the space 3 between the leads of the lead frame 2X is filled with the resin 4 by the masking tape 8,
As shown in FIG. 2 (G), if the mounting surface d of the lid 5 between the leads 3 is made flush with the element mounting surface c other than between the leads and the resin 4, the opening edge 5 c of the lid 5 and the lead 3 Can be completely sealed by the adhesive 9.

FIG. 4 shows another embodiment of the manufacturing method according to the present invention. This embodiment is configured such that the surface opposite to the mounting surface of the element 1 is not covered with the resin 4 so that after molding, Is designed to be able to reduce the overall thickness.

In this embodiment, as shown in FIG. 4B, the lead frame 2X shown in FIG.
Is covered with a masking tape 8, and a photosensitive resin 4 is printed between the leads 3 as shown in FIG. In the present embodiment, as the resin 4, a resin having a thermosetting property and a photosetting property, which is a product name PSR-4000 manufactured by Taiyo Ink Co., Ltd., was used. After the resin 4 was temporarily dried at 75 ° C. for 20 minutes, as shown in FIG. 4D, the space between the leads 3 was exposed (e) in a UV curing furnace, and then etched with a 1% by weight sodium carbonate solution ( (E) is developed as shown in FIG.
As shown in the figure, the resin 4 on the surface opposite to the element mounting surface is removed while leaving only the resin 4 embedded in the space 3 between the leads, and thereafter, heating is performed at 150 ° C. for 30 minutes. The resin 4 inside was cured. Thereafter, the lid 5 was adhered using an epoxy resin (product name: ZC-106-2 manufactured by Pernox Japan Limited) and cured at 150 ° C. for 2 hours. Subsequent steps are as described above.

In the case of the embodiment shown in FIG. 4, the resin 4 may be a resin that can be cured only by photo-curing. However, by using a resin having both photo-curing and thermo-curing properties, the strength of the resin 4 can be reduced. Even if the molding pressure of the resin 7 is increased during molding with the molding resin 7, it is possible to prevent the resin 7 from entering the lid 5.

FIG. 5 shows a state in which the jig 10 is used instead of the masking tape 8 to close the lead 3 of the lead frame 2X, the resin 4 is buried in the lead 3, and then the jig 10 is removed. In addition, the present embodiment can also prevent the resin 4 from entering the element mounting surface. After the masking tape 8 is attached to the lead frame 2X and the space between the leads 3 is filled with the resin 4, the masking tape 8 can be easily peeled off, and the embedding work of the resin 4 can be performed with high productivity.

The present invention can be applied not only to SAW filters but also to other electronic components that require hermetic sealing.

[0031]

According to the first aspect, when an element such as a SAW filter whose element surface cannot be covered with a molding resin is hermetically sealed, the space between the leads of the lead frame is closed by the resin, thereby providing an element mounting surface. And the element accommodating space between the lid and the cover is realized as a hermetically sealed structure. In addition, since a lead frame can be used in this manner, productivity can be improved, and a resin-molded electronic component can be provided at low cost by mass production. In addition, the structure in which the entire element is covered with the lid makes it possible to eliminate stress applied to the element, and to stabilize the characteristics of the element.

According to the second aspect, since the space between the leads of the lead frame is closed on one side by the closing member and the resin is filled between the leads from the other surface, the resin is filled between the leads. The resin in the space between the leads on the mounting surface side can be formed flush with the element mounting surface, and a sealing structure with good airtightness can be realized when the lid is attached. In addition, the gas generated during heating of the resin can be prevented from adhering to the element mounting surface by the closing member, thereby lowering the electrical connection strength of the element and passing between the leads of the molded resin to the element side. Can be prevented from entering.

According to the third aspect, as the resin to be filled between the leads, a thermosetting resin or a thermoplastic resin having a melting point equal to or higher than the molding temperature of the molding resin is used when filling with a closing member. When removing and filling the resin on the surface opposite to the component mounting surface by etching, use light-curing resin or light-curing and heat-curing resin to eliminate bubbles and obtain smoothness. Can be

[Brief description of the drawings]

1A and 1B show an embodiment of a resin-molded electronic component according to the present invention, in which FIG. 1A is a plan view of an electronic component in which a molding resin is indicated by a two-dot chain line, and FIGS. ) Is a right side view, a front view, and (D) and (E) are E of (A), respectively.
It is an E and FF sectional view.

FIGS. 2A to 2H are process diagrams showing an embodiment of a method for manufacturing an electronic component according to the present invention, and FIG. 2G is an enlarged view showing a joint between a lead frame and a lid.

FIG. 3A is a plan view illustrating an example of a lead frame.
(B) is a partial plan view of the lead frame showing a resin-filled portion.

FIGS. 4A to 4E are process diagrams showing another embodiment of the method for manufacturing an electronic component according to the present invention.

FIGS. 5A to 5D are process diagrams showing another example of a method of closing a space between leads in the present invention.

[Explanation of symbols]

1: element, 2a: ground conductor, 2b: input lead, 2
c: output lead portion, 2d to 2g: terminal, 2X: lead frame, 3: between leads, 4: resin, 5: lid, 5a, 5
b: terminal, 5c: opening edge, 6: bonding wire,
7: molding resin, 8: masking tape, 9: adhesive, 1
0: jig

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification symbol FI H03H 9/25 H03H 9/25 A (72) Inventor Shuichiro Yamamoto 1-13-1 Nihombashi, Chuo-ku, Tokyo Inside the corporation

Claims (3)

[Claims] An electronic component mounted with a device on a lead frame and resin-molded, a resin is temporarily filled and cured between the leads of the lead frame from the back side of the device mounting surface of the lead frame, and the device is mounted on the surface of the lead frame. A resin-molded electronic component, wherein the whole of the element is covered with a lid having a single-sided opening structure, and the element is mounted and sealed with a molding resin. 2. A closing member is provided on an element mounting surface of a lead frame, a resin is temporarily filled and cured between leads of the lead frame from the back side of the element mounting surface, the closing member on the element mounting surface is removed, and an element is mounted on the surface. A method of manufacturing a resin-molded electronic component, wherein the entire element is covered and sealed with a lid having a single-sided opening structure, and the element mounting surface and the back surface are molded with a molding resin. 3. The thermosetting resin, the photocurable resin, the photocurable and thermosetting resin, or a melting point higher than the molding temperature of the molding resin as the molding resin to be filled between the leads. A method for manufacturing a resin-molded electronic component, characterized by using a thermoplastic resin.