JP2002324815A - Method for manufacturing electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase a mechanical bonding strength and bonding stability between a connection electrode of an electronic device and a conductive pattern on a mounting board by a simple process without affecting the operation of the electronic component, and to effectively manufacture many electronic devices. SOLUTION: In the electronic device manufacturing method, a plurality of electronic devices 13 are mounted on a batch-process board 111 including a portion to be the mounting boards. A resin film is, then, arranged so as to surround the electronic devices 13 and the boards 111. Cuttings 37 are, then, made in the resin film 15 between portions to be the electronic devices. The resin film 15 is, then, attached to the board 111. The electronic device is completed by cutting the resin film 15 and the set board 111.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic device including a mounting board and electronic components mounted on the mounting board.

[0002]

2. Description of the Related Art A surface acoustic wave device is one in which a comb-shaped electrode is formed on one surface of a piezoelectric substrate. This surface acoustic wave element is widely used as a filter in a mobile communication device such as a mobile phone.

[0003] By the way, electronic components such as semiconductor components are mounted on a mounting substrate, connection electrodes of the electronic component are electrically connected to conductor patterns of the mounting substrate, and connection electrodes of the electronic component are connected to the mounting substrate. Is often used in the form of a package having a structure in which an electrical connection with the conductive pattern is sealed. The same applies when the electronic component is a surface acoustic wave element. In the present application, a device including a mounting board and electronic components mounted on the mounting board is referred to as an electronic device.

In an electronic device, a method of electrically connecting a connection electrode of an electronic component to a conductor pattern of a mounting board is roughly divided into a method of arranging the electronic component such that a surface of the electronic component having the connection electrode faces the mounting board. Face-down bonding, and face-up bonding in which electronic components are arranged such that the surface of the electronic component having connection electrodes faces the opposite side to the mounting substrate. To reduce the size of electronic devices,
Face-down bonding is more advantageous.

In a conventional method of manufacturing an electronic device employing face-down bonding, a connection electrode of an electronic component is electrically connected to a conductor pattern of a mounting substrate, and then an underfill material is provided between the electronic component and the mounting substrate. To seal the electrical connection between the connection electrode of the electronic component and the conductor pattern of the mounting board.

However, when the electronic component is a surface acoustic wave device, there is a problem peculiar to the surface acoustic wave device, so that the above-described general method is not used. The problem peculiar to the surface acoustic wave element is that, in the surface acoustic wave element, a comb-shaped electrode is formed on the surface thereof, and the surface acoustic wave element is sealed so that foreign substances such as moisture and dust do not adhere to the comb-shaped electrode. On the other hand, it is necessary to prevent sealing resin or the like from contacting the surface acoustic wave propagation region on the surface of the surface acoustic wave element so as not to affect the operation of the surface acoustic wave element. That is.

Therefore, conventionally, as a method of manufacturing an electronic device when the electronic component is a surface acoustic wave element,
For example, after the connection electrode of the surface acoustic wave element is electrically connected to the conductor pattern of the mounting board, the surface acoustic wave element is sealed with a structure such as a cap made of ceramic or metal. The method was used. As another method of manufacturing an electronic device when the electronic component is a surface acoustic wave element, after electrically connecting a connection electrode of the surface acoustic wave element and a conductor pattern of a mounting board, the periphery of the surface acoustic wave element is removed. There is a method in which sealing is performed by surrounding with a sidefill material.

[0008]

In a method of manufacturing an electronic device in which an electronic component is a surface acoustic wave element, a method of enclosing a surface acoustic wave element with a structure such as a cap and sealing the electronic device is not an electronic device. There is a problem that it is difficult to reduce the size of the device. Further, in this method, the structure does not contribute to mechanical joining between the connection electrode of the surface acoustic wave element and the conductor pattern of the mounting board. However, there is a problem that it is not possible to improve the mechanical joining strength and joining stability of the above.

In the method of manufacturing an electronic device in the case where the electronic component is a surface acoustic wave element, the method of enclosing the surface acoustic wave element with a sidefill material and sealing the surface acoustic wave element includes:
There is a problem that the sidefill material may enter the surface acoustic wave propagation region on the surface of the surface acoustic wave element.

In addition to the surface acoustic wave element, even when the electronic component is a vibrator or a high-frequency circuit component, if the sealing resin or the like contacts the surface of the electronic component, the operation of the electronic component is affected. There is. Therefore, the above problem is not limited to the case where the electronic component is a surface acoustic wave element, but also applies, for example, to the case where the electronic component is a vibrator or a high-frequency circuit component.

Conventionally, in a method of manufacturing an electronic device in which an electronic component is a surface acoustic wave element, a cap is prepared in advance for each surface acoustic wave element, and one surface acoustic wave element is replaced with one surface acoustic wave element. It had to be surrounded by a cap. Therefore, the conventional method for manufacturing an electronic device has a problem that a large number of electronic devices cannot be efficiently manufactured.

The present invention has been made in view of the above problems, and a first object of the present invention is to provide a method of manufacturing an electronic device including a mounting board and electronic components mounted on the mounting board. In a simple process, it is possible to improve the strength and stability of mechanical bonding between the connection electrode of the electronic component and the conductor pattern of the mounting board without affecting the operation of the electronic component. It is an object of the present invention to provide a method of manufacturing an electronic device which can efficiently manufacture the electronic device.

A second object of the present invention is to provide an electronic device capable of sealing an electronic component by a simple process without affecting the operation of the electronic component, in addition to the first object. It is to provide a manufacturing method of.

[0014]

According to a method of manufacturing an electronic device of the present invention, a mounting substrate having a conductor pattern exposed on one surface and a connection electrode on one surface are provided. A method for manufacturing an electronic device comprising: an electronic component disposed so as to face one surface of a mounting substrate, and a connection electrode electrically connected to a conductor pattern of the mounting substrate and mechanically bonded thereto. The plurality of electronic components and the collective board are arranged such that one surface of each of the plurality of electronic components corresponding to the plurality of electronic devices faces one surface of the collective substrate including portions to be the plurality of mounting substrates. Place,
A step of electrically connecting the connection electrodes of the plurality of electronic components to the conductor pattern of the collective substrate and mechanically joining the plurality of electronic components; and A step of disposing a resin film so as to cover the collective substrate, a step of cutting the resin film between portions to be a plurality of electronic devices, and a step of bonding the resin film to the collective substrate; A step of cutting the resin film and the collective substrate between a plurality of electronic devices to complete the process.

In the method of manufacturing an electronic device according to the present invention, the resin film is disposed so as to be in close contact with the surface of the plurality of electronic components on the side opposite to the collective substrate so as to cover the plurality of electronic components and the collective substrate. Adhered to. Thereafter, the resin film and the collective substrate are cut between the portions to be the plurality of electronic devices, and the plurality of electronic devices are completed. In this electronic device, the resin film reinforces the mechanical connection between the connection electrode of the electronic component and the conductor pattern of the mounting board. Further, in the present invention, before the resin film is bonded to the collective substrate, a cut is made in the resin film between a plurality of electronic devices. This prevents the aggregate substrate from flexing due to shrinkage of the resin film when the resin film is bonded to the aggregate substrate.

In the method of manufacturing an electronic device according to the present invention, the resin film may seal the electronic component. In the method for manufacturing an electronic device according to the present invention, a space may be formed between one surface of the electronic component and one surface of the mounting board.

In the method of manufacturing an electronic device according to the present invention, the step of disposing the resin film includes sucking a gas on the electronic component side from a side of the collective substrate opposite to the electronic component through a hole formed in the collective substrate. Thereby, the resin film is in close contact with the surface of the plurality of electronic components on the side opposite to the collective substrate and one surface of the collective substrate in a peripheral portion of the plurality of electronic components so as to cover the plurality of electronic components and the collective substrate. In addition, a step of changing the shape of the resin film may be included.

[0018]

Embodiments of the present invention will be described below in detail with reference to the drawings. First, a configuration of an electronic device manufactured by a method for manufacturing an electronic device according to an embodiment of the present invention will be described with reference to FIG. The electronic device 10 according to the present embodiment includes a mounting substrate 11 having a conductor pattern 12 exposed on one surface 11a.
And a connection electrode 14 on one surface 13 a, the surface 13 a having the connection electrode 14 is disposed so as to face the one surface 11 a of the mounting board 11, and the connection electrode 14 is An electronic component 13 electrically connected to and mechanically bonded to the electronic component 13, a surface 13 b of the electronic component 13 on a side opposite to the mounting substrate 11, and one surface 11 a of the mounting substrate 11 in a peripheral portion of the electronic component 13. A resin film 15 that covers the electronic component 13 and the mounting board 11 so as to be in close contact with the mounting board 11 and is adhered to the mounting board 11.

The mounting substrate 11 is formed of glass, resin, ceramic, or the like. The electronic component 13 is, for example, a surface acoustic wave element, a vibrator, a high-frequency circuit component, or the like, but may be another electronic component. As described above, the electronic component 13 has the surface 13 a having the connection electrode 14 on the mounting substrate 1.
1 is mounted on the mounting board 11 by face-down bonding arranged so as to face 1. Electronic component 1
A space 16 is formed between one surface 13 a of the mounting substrate 11 and one surface 11 a of the mounting board 11.

The surface 13 b of the electronic component 13 on the side opposite to the mounting board 11 is covered with the resin film 15 without any gap. A part around the electronic component 13 on one surface 11a of the mounting substrate 11 is also covered with the resin film 15 without any gap. In addition, the resin film 15 includes the connection electrode 14 of the electronic component 13 and the conductor pattern 1 of the mounting board 11.
The entire electronic component 13 is sealed, including the portion electrically connected to the electronic component 2.

The resin film 15 is made of, for example, a thermosetting resin such as an epoxy resin. The thickness of the resin film 15 is, for example, 50 to 150 μm.

Next, an outline of a method of manufacturing the electronic device 10 according to the present embodiment will be described. In the method of manufacturing the electronic device 10, an aggregate substrate 111 (not shown in FIG. 1) including portions to be the plurality of mounting substrates 11 is manufactured in advance. The collective board 111 has a conductor pattern 12 corresponding to the plurality of mounting boards 11. The conductor pattern 12 is exposed on one surface of the collective substrate 111.

The method of manufacturing the electronic device 10 according to the present embodiment is such that one surface 13a of each of the plurality of electronic components 13 corresponding to the plurality of electronic devices faces one surface of the collective substrate 111. , A plurality of electronic components 13 and the collective substrate 1
And electrically connecting and mechanically connecting the connection electrodes 14 of the plurality of electronic components 13 to the conductor patterns 12 of the collective substrate 111;
11 and a plurality of electronic components 1
3 and the resin film 15 so as to cover the collective substrate 111.
Disposing the resin film 15 between the parts to be a plurality of electronic devices, bonding the resin film 15 to the collective substrate 111 in the peripheral part of each electronic component 13, The resin film 15 and the collective substrate 111
To complete a plurality of electronic devices.

Next, an example of characteristics of the resin film 15 used in the present embodiment will be conceptually described with reference to FIG. In FIG. 2, white circles and solid lines indicate the correspondence between the temperature of the resin film 15 and the length in an arbitrary direction. In FIG. 2, black circles and broken lines indicate BT for comparison with the characteristics of the resin film 15.
(Bismaleimide triazine) Shows the correspondence between the temperature and the length in an arbitrary direction in a resin whose shape is stable against a temperature change such as a resin. As shown by reference numeral 110, the length of the resin whose shape is stable with respect to the temperature change changes almost linearly with the temperature change.

When the temperature of the resin film 15 is RT (room temperature), the film shape is maintained. As indicated by reference numeral 101, when the temperature of the resin film 15 is increased from the room temperature RT to the glass transition temperature TG, the resin film 15 gradually softens and changes in length almost linearly with the temperature change. Inflate to do. Code 10
As shown by 2, as the temperature of the resin film 15 is raised from the glass transition temperature TG to the curing start temperature HT, the resin film 15 becomes fluid and expands rapidly. As indicated by reference numeral 103, when the temperature of the resin film 15 is equal to or higher than the curing start temperature HT, the resin film 15 starts to cure. When the curing of the resin film 15 is completed, the resin film 15 contracts as indicated by reference numeral 104. At this time, a force in the contracting direction (hereinafter, referred to as a contracting force) is generated in the resin film 15. After the curing of the resin film 15 is completed, as indicated by reference numeral 105, the resin film 15
The shape is stable against temperature changes without softening or fluidity. The curing start temperature HT varies depending on the characteristics of the resin film 15;
The temperature is about 00 ° C., which is around 150 ° C. in the case of the resin film 15 formed using an epoxy resin. Also,
The time required from the start of the curing of the resin film 15 to the end of the curing also varies depending on the characteristics of the resin film 15.

The characteristics of the resin film 15 shown in FIG. 2 are conceptual only. So, for example,
If the amount of temperature change per unit time changes, resin film 1
5 also changes.

In the method of manufacturing the electronic device 10 according to the present embodiment, for example, the resin film 15 is in a state where the temperature of the resin film 15 is increased and the resin film 15 is softened. The shape of the resin film 15 is changed so that the opposite surface 13 b and one surface of the collective substrate 111 in a peripheral portion of the electronic component 13 are uniformly adhered to cover the electronic component 13 and the collective substrate 111. Thereafter, the temperature of the resin film 15 is further increased,
After the resin film 15 has fluidity, the resin film 15 is cured, so that the resin film 15 is adhered to the collective substrate 111 and the shape of the resin film 15 is fixed. When the resin film 15 is cured, a contraction force is generated as described above. The contraction force of the resin film 15 acts so as to press the electronic component 13 against the collective substrate 111. Thereby, the electronic component 13
Mechanical connection between the connection electrode 14 and the conductor pattern 12 of the collective substrate 111 is more reliably reinforced. In addition, the contraction of the resin film 15 causes the resin film 15 to shrink.
Closely adheres to the electronic component 13 and the collective substrate 111.

In the present embodiment, before the resin film 15 is bonded to the collective substrate 111, a cut is made in the resin film 15 between a plurality of electronic devices. Accordingly, it is possible to prevent the collective substrate 111 from bending due to shrinkage of the resin film 15 when the resin film 15 is bonded to the collective substrate 111.

If the resin film 15 has sufficient flexibility even at room temperature, the resin film
5 may be deformed to determine its shape, and then the resin film 15 may be cured by increasing the temperature of the resin film 15.

The resin film 15 is softened at a temperature lower than the glass transition temperature.
After determining the shape of the resin film 5, the resin film 15 may be cured over a relatively long time at a temperature equal to or lower than the glass transition temperature.

When the resin film 15 is formed of a resin that is softened by ultraviolet rays, instead of raising the temperature of the resin film 15 to soften the resin film 15, the resin film 15 is irradiated with ultraviolet rays to be softened. The film 15 may be softened. Alternatively, the resin film 15 may be softened by irradiating the resin film 15 with ultraviolet rays while increasing the temperature of the resin film 15.

When the resin film 15 is formed of a resin which is cured by ultraviolet rays, instead of raising the temperature of the resin film 15 to cure the resin film 15, the resin film 15 is irradiated with ultraviolet rays to cure the resin film. The film 15 may be cured. Alternatively, the resin film 15 may be cured by increasing the temperature of the resin film 15 and irradiating the resin film 15 with ultraviolet rays.

In the present embodiment, the connection electrodes 14 of the electronic component 13 and the mounting board 11 (the collective board 11
Various methods can be used as the method of 1) electrical connection and mechanical joining with the conductor pattern 12.
Hereinafter, several examples of a method of electrical connection and mechanical bonding (hereinafter, simply referred to as a bonding method) between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the mounting board 11 will be described.

First, an example of a conventional bonding method will be described with reference to FIGS. 3 to 5 for comparison with the present embodiment. 3 to 5, the electrical connection and the mechanical connection between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the mounting board 11 are illustrated larger than other portions.

In the example shown in FIG. 3, as the connection electrode 14 of the electronic component 13, a bump 14A made of, for example, gold connected to the conductor pattern 17 of the electronic component 13 is provided. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. In this example, the bump 14A and the connecting portion 12A are metal-bonded, so that the bump 14A and the connecting portion 12A
Are electrically connected and mechanically joined.

In the example shown in FIG. 4, a bump 14B made of, for example, gold connected to the conductor pattern 17 of the electronic component 13 is provided as the connection electrode 14 of the electronic component 13. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. In this example, the bump 14B and the connecting portion 12A
It is electrically connected by the conductive paste 18. After that, an underfill material 19 is filled between the electronic component 13 and the mounting board 11, and mechanical contraction of the bump 14 </ b> B, the conductive paste 18, and the connection portion 12 </ b> A is stabilized by the contraction force of the underfill material 19. Is secured.

In the example shown in FIG. 5, a bump 14A made of, for example, gold connected to the conductor pattern 17 of the electronic component 13 is provided as the connection electrode 14 of the electronic component 13. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. In this example, the bumps 14A and the connection portions 12A are arranged so as to be in contact with each other, whereby the bumps 14A
And the connection portion 12A are electrically connected. A non-conductive or anisotropic conductive bonding paste 20 is injected between the electronic component 13 and the mounting substrate 11 around the bumps 14A and the connection portions 12A. Then, the bumps 14A and the connection portions 12 are formed by the contraction force of the joining paste 20.
A mechanical connection with A is stably ensured.

Next, an example of a joining method according to the present embodiment will be described with reference to FIGS. In addition,
6 to 8, the portions of the electrical connection and the mechanical connection between the connection electrodes 14 of the electronic component 13 and the conductor patterns 12 of the mounting board 11 are drawn larger than other portions.

In the example shown in FIG. 6, as in the example shown in FIG.
A bump 14A made of, for example, gold and connected to the third conductor pattern 17 is provided. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. The bump 14A and the connecting portion 12A are metal-joined, whereby the bump 14A and the connecting portion 12A are electrically connected and mechanically joined. In this example, the resin film 15 of the present embodiment is further provided. Then, the bumps 14A and the connection portions 12 are formed by the contraction force of the resin film 15.
The mechanical connection with A is reinforced.

In the example shown in FIG. 7, as in the example shown in FIG.
A bump 14B made of, for example, gold, which is connected to the third conductor pattern 17 is provided. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. The bump 14B and the connection portion 12A are electrically connected by the conductive paste 18. In this example, the resin film 15 of the present embodiment is further provided. Then, without using the underfill material 19, mechanical contraction of the bump 14 </ b> B, the conductive paste 18, and the connection part 12 </ b> A is stably secured by the contraction force of the resin film 15.

In the example shown in FIG. 8, as in the example shown in FIG.
A bump 14A made of, for example, gold and connected to the third conductor pattern 17 is provided. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. The bump 14A and the connecting portion 12A are arranged so as to be in contact with each other,
The bump 14A and the connection portion 12A are electrically connected. A non-conductive or anisotropic conductive bonding paste 20 is injected between the electronic component 13 and the mounting substrate 11 around the bumps 14A and the connection portions 12A. Then, the bumps 14A are formed by the contraction force of the joining paste 20.
Mechanical connection between the wire and the connecting portion 12A is stably secured.
In this example, the resin film 15 of the present embodiment is further provided. And this resin film 15
, The mechanical joining between the bump 14A and the connecting portion 12A is reinforced.

The joining method in the present embodiment is as follows.
The bonding method is not limited to those shown in FIGS. 6 to 8, and most of the conventional bonding methods in face-down bonding can be used.

Next, an example of the surface acoustic wave element 13A as the electronic component 13 will be described with reference to FIG. The surface acoustic wave element 13A shown in FIG.
Comb-shaped electrode 22 formed on one surface of this piezoelectric substrate 21
And a conductor pattern 23 and a connection electrode 24 formed at an end of the conductor pattern 23. Connection electrode 24
Corresponds to the connection electrode 14 in FIG. The surface acoustic wave element 13A is an element that uses a surface acoustic wave generated by the comb-shaped electrode 22 for a basic operation, and has a function as a bandpass filter in the present embodiment.

In FIG. 9, the connection electrode 24 labeled "IN" is an input terminal, the connection electrode 24 labeled "OUT" is an output terminal, and the connection electrode 24 labeled "GND" This is a ground terminal. Also, in FIG.
An area surrounded by a broken line indicated by reference numeral 25 is an area including the surface acoustic wave propagation area and in which it is necessary to prevent a sealing material or the like from entering inside.

Next, a method for manufacturing the electronic device 10 according to the present embodiment will be described in detail with reference to FIGS. In the method of manufacturing an electronic device according to the present embodiment, as shown in FIG.
An aggregate substrate 111 including a portion to be formed is manufactured in advance. The collective board 111 has a conductor pattern 12 corresponding to the plurality of mounting boards 11. The conductor pattern 12 is exposed on one surface 111a of the collective substrate 111.

In the method of manufacturing electronic device 10 according to the present embodiment, one surface 13a of each of a plurality of electronic components 13 corresponding to the plurality of electronic devices is opposed to one surface 111a of aggregate substrate 111. Then, the plurality of electronic components 13 and the collective substrate 111 are arranged, and the connection electrodes 14 of the plurality of electronic components 13 are electrically connected to the conductor pattern 12 of the collective substrate 111 and mechanically joined. Next, the resin film 15 formed in the same planar shape as the shape of the one surface 111a of the collective substrate 111 is attached to the electronic component 13 and the collective substrate 1.
11 so as to cover it.

A plurality of holes 31 are formed in the collective board 111 at the periphery of the rectangular area where the electronic components 13 are arranged. The holes 31 may be provided, for example, at two positions on opposite sides of the center of the arrangement region of the electronic component 13, or may be provided at four positions of the arrangement region of the electronic component 13.
It may be provided at four locations outside one side, or may be provided at more locations.

Next, as shown in FIG. 11, while the resin film 15 is heated to soften the resin film 15, the
The gas on the electronic component 13 side is sucked from the side opposite to the electronic component 13. The gas referred to here is air, nitrogen gas, inert gas, or the like, although it differs depending on the atmosphere in which the processing is performed. As a result, the resin film 15 uniformly adheres to the surface 13b of the electronic component 13 on the side opposite to the collective substrate 111 and one surface 111a of the collective substrate 111 around the electronic component 13 so that the electronic component 13 and the collective The shape of the resin film 15 is changed so as to cover the substrate 111. At this time, the temperature of the resin film 15 is
Is lower than the curing temperature. Thus, through the holes 31 of the collective substrate 111, the collective substrate 111
The shape of the resin film 15 can be easily determined by sucking the gas on the electronic component 13 side from the side opposite to the electronic component 13 and changing the shape of the resin film 15. Further, by changing the shape of the resin film 15 in a state where the resin film 15 is softened, the shape of the resin film 15 can be more easily determined.
When the resin film 15 has sufficient flexibility even at room temperature, the shape of the resin film 15 may be changed only by the above-mentioned suction without heating the resin film 15.

When the resin film 15 is formed of a resin that is softened by ultraviolet rays, instead of raising the temperature of the resin film 15 to soften the resin film 15, the resin film 15 is irradiated with ultraviolet rays to be softened. The film 15 may be softened. Alternatively, the resin film 15 may be softened by irradiating the resin film 15 with ultraviolet rays while increasing the temperature of the resin film 15.

In the present embodiment, the means for heating the resin film 15 and the means for sucking the gas on the electronic component 13 side from the side of the collective substrate 111 opposite to the electronic component 13 include:
A heating furnace 32 capable of reducing pressure is used. However, other means may be used as the heating means or the gas suction means. The heating furnace 32 has a heater 33 on which the collective substrate 111 is placed. The heater 33 is connected to the collective substrate 11.
1 and the resin film 15 are heated. The heater 33 has a hole 34 communicating with the hole 31 of the collective substrate 111. When the gas in the heating furnace 32 is exhausted and the pressure in the heating furnace 32 is reduced, the holes 34 of the heater 33 and the collective substrate 111 are removed.
Through the hole 31, the gas on the electronic component 13 side is sucked from the side of the collective substrate 111 opposite to the electronic component 13.

Next, as shown in FIG.
3 heats the collective substrate 111 and the resin film 15 to stabilize the shape of the resin film 15 and temporarily adheres the resin film 15 to the collective substrate 111. However, at this point, the resin film 15 is not completely adhered to the collective substrate 111 and the resin film 15
Do not completely cure. When the resin film 15 is formed of a resin that is cured by ultraviolet rays, the resin film 15 is irradiated with ultraviolet rays instead of raising the temperature of the resin film 15 to stabilize the shape of the resin film 15 and The film 15 may be temporarily bonded to the collective substrate 111.

Next, as shown in FIG. 13, a jig 36 is used to make a cut 37 in the resin film 15 between a plurality of electronic devices. The jigs 36 are arranged in a lattice so as to correspond to positions between portions to be a plurality of electronic devices, and a blade portion 36a for making a cut 37 in the resin film 15 and a holding portion 3 for holding the blade portion 36a.
6b.

Next, as shown in FIG. 14, the collective substrate 111 and the resin film 1 are again heated by the heater 33.
5 is heated so that the temperature of the resin film 15 is equal to or higher than the temperature at which the resin film 15 cures. Thus, the resin film 15 is made to have fluidity and then is cured to completely adhere the resin film 15 to the collective substrate 111 and fix the shape of the resin film 15.

When the resin film 15 is formed of a resin that is cured by ultraviolet rays, instead of raising the temperature of the resin film 15 to cure the resin film 15, the resin film 15 is irradiated with ultraviolet rays to cure the resin film. The film 15 may be cured. Alternatively, the resin film 15 may be cured by increasing the temperature of the resin film 15 and irradiating the resin film 15 with ultraviolet rays.

Next, as shown in FIG. 15, the resin film 15 and the collective substrate 111 are cut at the cutting positions 41 between the portions to be the plurality of electronic devices 10, thereby completing the plurality of electronic devices 10. . FIG. 16 is a plan view showing the collective board 111, the electronic component 13, and the resin film 15 before the cutting step shown in FIG. FIG. 15 and FIG.
In 6, the position of the cut 37 is matched with the cutting position 41.

However, the resin film 15 and the collective substrate 111 may be cut at a cutting position 41 closer to the electronic component 13 than the position of the cut 37 between the portions to be the plurality of electronic devices 10. FIG. 17 is an explanatory diagram showing a step subsequent to FIG. 14 in this case. FIG. 18 is a plan view showing the assembly board 111, the electronic component 13, and the resin film 15 before the cutting step shown in FIG. FIG. 19 shows the collective substrate 111 in this case.
An example of the upper conductor pattern 12 and the cutting position 41 is shown. In FIG. 18, reference numeral 42 denotes a plurality of electronic devices 10.
2 shows a conductor pattern arranged between the portions. The conductor pattern 42 connects the conductor patterns 12 in a portion to be a plurality of electronic devices 10 in order to prevent the collective substrate 111 from being charged before the step of cutting the collective substrate 111, and connects these. This is for setting the same potential. The conductor pattern 42 is removed by cutting the collective substrate 111 at the cutting position 41 shown in FIG.

As described above, in the method of manufacturing an electronic device according to the present embodiment, the resin film 15 is in close contact with the surface 13 b of the plurality of electronic components 13 on the side opposite to the collective substrate 111, and the plurality of electronic The electronic components 13 are arranged so as to cover the components 13, and are adhered to the collective substrate 111 at a peripheral portion of each electronic component 13. Thereafter, the resin film 15 and the collective substrate 111 are cut between the portions to be the plurality of electronic devices 10, and the plurality of electronic devices 10 are completed. This electronic device 10
In this case, the resin film 15 reinforces the mechanical connection between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the mounting board 11. In the present embodiment, the space between the electronic component 13 and the mounting board 11 is not filled with the underfill material. Therefore, according to the present embodiment, the connection electrodes 14 of the electronic component 13 and the mounting board 1 are not affected by the simple configuration and the simple steps without affecting the operation of the electronic component 13.
The strength of mechanical joining and the stability of joining with the first conductor pattern 12 can be improved.

In particular, the resin film 15 is
When the resin film 15 is heated, the resin film 15 is hardened after the resin film 15 has fluidity, so that the resin film 15 is bonded to the collective substrate 111. Are the connecting electrodes 14 of the electronic component 13 and the conductive patterns 1
The strength of mechanical joining and the stability of joining can be more reliably improved.

In the present embodiment, the collective substrate 111
A plurality of electronic components 13 are mounted on the
The resin film 15 is disposed so as to cover the collective substrate 111, and the resin film 15 is bonded to the collective substrate 111. Then, finally, the resin film 15 and the collective substrate 111 are cut at a cutting position 41 between the portions to be the plurality of electronic devices 10, thereby completing the plurality of electronic devices 10. Therefore, according to the present embodiment, a large number of electronic devices 1
0 can be manufactured at the same time, so that a large number of electronic devices 10 can be manufactured efficiently.

When a large number of electronic devices 10 are manufactured simultaneously as described above, the resin film 15 is
There is a possibility that the collective substrate 111 bends due to shrinkage of the resin film 15 when the resin film 15 is bonded to the substrate 11. Assembly board 111
If the flexure occurs, the operation of cutting the resin film 15 and the collective substrate 111 is hindered, or the completed electronic device 1
At 0, there is a possibility that a problem such as bending of the mounting board 11 may occur.

On the other hand, in the present embodiment, before the resin film 15 is bonded to the collective substrate 111, a cut 37 is made in the resin film 15 between the portions to be the plurality of electronic devices 10. Thereby, when the resin film 15 is bonded to the collective substrate 111, the resin film 1
Even if 5 shrinks, the notch 37 spreads and the aggregate substrate 1
11 can be prevented from bending, and the above-described problems can be prevented from occurring.

According to the present embodiment, since the electronic component 13 is sealed with the resin film 15, the operation of the electronic component 13 is not affected by the simple configuration and the simple process without affecting the operation of the electronic component 13. 13 can be sealed. Thereby, the resistance of the electronic device 10 to the environment and the like can be secured.

In the present embodiment, the collective substrate 111
The hole 31 is closed by the resin film 15 in the step of bonding the resin film 15 to the collective substrate 111. Therefore, in the present embodiment, even if the hole 31 is not closed, the sealed state can be reliably maintained.

According to the present embodiment, the electronic component 1
Since the space 16 is formed between the one surface 13a of the electronic component 13 and the one surface 11a of the mounting board 11, the operation of the electronic component 13 is caused by the one surface 13a of the electronic component 13 coming into contact with another object. Can be prevented from being affected. This is particularly effective when the electronic component 13 is a surface acoustic wave element, a vibrator, or a high-frequency circuit component.

As described above, according to the present embodiment, the reliability of the electronic device 10 can be improved.
Further, according to the present embodiment, since the electronic component 13 is sealed using the resin film 15, compared to the case where the electronic component 13 is sealed using a structure such as a cap,
The electronic device 10 can be reduced in size, weight, and thickness.
In addition, according to the present embodiment, since the electronic component 13 is sealed using the resin film 15, the above-described effects can be obtained at low cost.

It should be noted that the present invention is not limited to the above embodiment, and various modifications are possible. For example, the collective substrate 111
The hole 31 in is not limited to a hole specially provided for suction, and may be an existing hole such as a through hole.

In the present invention, one electronic device may include a plurality of electronic components.

[0068]

As described above, claims 1 to 4
In the method for manufacturing an electronic device according to any one of the above, the resin film is disposed so as to be in close contact with a surface of the plurality of electronic components opposite to the collective substrate and to cover the plurality of electronic components and the collective substrate. Adhered to. Thereafter, the resin film and the collective substrate are cut between the portions to be the plurality of electronic devices, and the plurality of electronic devices are completed. In this electronic device, the resin film reinforces the mechanical connection between the connection electrode of the electronic component and the conductor pattern of the mounting board. Further, in the present invention, before the resin film is bonded to the collective substrate, a cut is made in the resin film between a plurality of electronic devices. This prevents the aggregate substrate from flexing due to shrinkage of the resin film when the resin film is bonded to the aggregate substrate. Therefore, according to the present invention, the strength of mechanical bonding and the stability of bonding between the connection electrode of the electronic component and the conductor pattern of the mounting board can be improved in a simple process without affecting the operation of the electronic component. This makes it possible to efficiently manufacture a large number of electronic devices.

According to the method for manufacturing an electronic device according to the second aspect, the electronic component is sealed with the resin film, so that the operation of the electronic component can be performed in a simple process without affecting the operation of the electronic component. This has the effect of being able to be sealed.

According to the method of manufacturing an electronic device of the third aspect, a space is formed between one surface of the electronic component and one surface of the mounting board, so that one surface of the electronic component is formed. This has the effect that the operation of the electronic component can be prevented from being affected by contact with another object.

According to a fourth aspect of the present invention, the step of arranging the resin film includes the step of arranging the resin film through a hole formed in the collective board from the side opposite to the electronic component on the collective board. By sucking the gas, the resin film is brought into close contact with the surface of the plurality of electronic components on the side opposite to the collective substrate and on one surface of the collective substrate in a peripheral portion of the plurality of electronic components, and the plurality of electronic components and the collective Since it includes the step of changing the shape of the resin film so as to cover the substrate,
There is an effect that the shape of the resin film can be easily determined.

[Brief description of the drawings]

FIG. 1 is a sectional view of an electronic device manufactured by a method for manufacturing an electronic device according to an embodiment of the present invention.

FIG. 2 is an explanatory view conceptually showing an example of characteristics of a resin film used in an embodiment of the present invention.

FIG. 3 is a cross-sectional view showing an example of a conventional joining method for comparison with an embodiment of the present invention.

FIG. 4 is a cross-sectional view showing another example of a conventional joining method for comparison with one embodiment of the present invention.

FIG. 5 is a cross-sectional view showing still another example of the conventional joining method for comparison with one embodiment of the present invention.

FIG. 6 is a cross-sectional view illustrating an example of a bonding method according to an embodiment of the present invention.

FIG. 7 is a cross-sectional view showing another example of the bonding method according to the embodiment of the present invention.

FIG. 8 is a sectional view showing still another example of the joining method according to the embodiment of the present invention.

FIG. 9 is a plan view showing an example of a surface acoustic wave device as an electronic component according to one embodiment of the present invention.

FIG. 10 is an explanatory view showing one step in the method of manufacturing the electronic device according to the embodiment of the present invention.

FIG. 11 is an explanatory diagram showing a step that follows the step of FIG. 10;

FIG. 12 is an explanatory diagram showing a step that follows the step of FIG. 11;

FIG. 13 is an explanatory diagram showing a step that follows the step of FIG. 12;

FIG. 14 is an explanatory diagram showing a step that follows the step of FIG. 13;

FIG. 15 is an explanatory diagram showing a step that follows the step of FIG. 14;

16 is a plan view showing the collective substrate, the electronic component, and the resin film before the cutting step shown in FIG.

FIG. 17 is an explanatory view showing another example of the step following FIG. 14;

18 is a plan view showing an assembly board, electronic components, and a resin film before the cutting step shown in FIG. 17;

FIG. 19 is an explanatory diagram showing an example of a conductor pattern on a collective board and a cutting position corresponding to the example shown in FIG. 17;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Electronic device, 11 ... Mounting board, 12 ... Conductor pattern, 13 ... Electronic component, 14 ... Connection electrode, 15 ... Resin film, 16 ... Space, 31 ... Hole, 36 ... Jig, 37 ... Cut, 111 ... Assembly substrate.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification FI FI Theme Court ゛ (Reference) H05K 3/28 H05K 3/28 G (72) Inventor Shinichiro Hayashi 1-13-1 Nihonbashi, Chuo-ku, Tokyo Within TDK Corporation (72) Inventor Seiichi Tajima 1-13-1 Nihonbashi, Chuo-ku, Tokyo F-term within TDK Corporation (reference) BB45 BB46 BB75 EE26 EE27 EE30 5F044 LL01 RR17 RR18 RR19 5F061 AA01 BA03 CA26 CB13 5J097 AA24 AA32 AA34 HA03 HA04 HA07 HA08

Claims (4)

[Claims] 1. A mounting substrate having a conductor pattern exposed on one surface and a connection electrode on one surface, wherein the surface having the connection electrode is disposed so as to face one surface of the mounting substrate. A method for manufacturing an electronic device, comprising: an electronic component in which the connection electrode is electrically connected to a conductor pattern of the mounting board and mechanically joined, wherein a plurality of electronic components corresponding to a plurality of electronic devices are provided. The plurality of electronic components and the collective board are arranged such that one surface of each of the plurality of electronic devices faces one surface of the collective substrate including a portion to be a plurality of mounting substrates, and connection electrodes of the plurality of electronic components are arranged. Electrically connecting to the conductor pattern of the collective substrate and mechanically joining the plurality of electronic components, and covering the plurality of electronic components and the collective substrate in close contact with a surface of the plurality of electronic components opposite to the collective substrate. Like tree A step of disposing a film; a step of making a cut in the resin film between portions to be a plurality of electronic devices; a step of bonding the resin film to the collective substrate; and a step of completing a plurality of electronic devices. And a step of cutting the resin film and the collective substrate between portions to be a plurality of electronic devices. 2. The method according to claim 1, wherein the resin film seals the electronic component. 3. The method according to claim 1, wherein a space is formed between one surface of the electronic component and one surface of the mounting board. 4. A step of arranging the resin film, wherein a plurality of the resin films are formed by sucking gas on the electronic component side from a side of the collective substrate opposite to the electronic component through a hole formed in the collective substrate. The shape of the resin film so as to be in close contact with a surface of the electronic component opposite to the collective substrate and one surface of the collective substrate in a peripheral portion of the plurality of electronic components to cover the plurality of electronic components and the collective substrate. 4. The method for manufacturing an electronic device according to claim 1, further comprising the step of: