JP2002184884A - Electronic device and manufacturing method thereof - Google Patents
Electronic device and manufacturing method thereofInfo
- Publication number
- JP2002184884A JP2002184884A JP2000384381A JP2000384381A JP2002184884A JP 2002184884 A JP2002184884 A JP 2002184884A JP 2000384381 A JP2000384381 A JP 2000384381A JP 2000384381 A JP2000384381 A JP 2000384381A JP 2002184884 A JP2002184884 A JP 2002184884A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- resin film
- mounting substrate
- mounting board
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/13144—Gold [Au] as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16238—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area protruding from the surface of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/819—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector with the bump connector not providing any mechanical bonding
- H01L2224/81901—Pressing the bump connector against the bonding areas by means of another connector
- H01L2224/81903—Pressing the bump connector against the bonding areas by means of another connector by means of a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/819—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector with the bump connector not providing any mechanical bonding
- H01L2224/81901—Pressing the bump connector against the bonding areas by means of another connector
- H01L2224/81904—Pressing the bump connector against the bonding areas by means of another connector by means of an encapsulation layer or foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83104—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus by applying pressure, e.g. by injection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、実装基板と、この
実装基板に実装された電子部品とを備えた電子装置およ
びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having a mounting board and electronic components mounted on the mounting board, and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】弾性表面波素子は、圧電基板の一方の面
に櫛形電極が形成されたものである。この弾性表面波素
子は、携帯電話等の移動体通信機器におけるフィルタ等
に広く利用されている。2. Description of the Related Art A surface acoustic wave device is one in which a comb-shaped electrode is formed on one surface of a piezoelectric substrate. This surface acoustic wave element is widely used as a filter in a mobile communication device such as a mobile phone.
【０００３】ところで、半導体部品等の電子部品は、電
子部品が実装基板上に実装され、電子部品の接続電極と
実装基板の導体パターンが電気的に接続され、且つ電子
部品の接続電極と実装基板の導体パターンとの電気的接
続部分が封止された構造を有するパッケージの形態で使
用される場合が多い。電子部品が弾性表面波素子である
場合も同様である。なお、本出願において、実装基板
と、この実装基板に実装された電子部品とを備えたもの
を電子装置と言う。[0003] By the way, electronic components such as semiconductor components are mounted on a mounting substrate, connection electrodes of the electronic component are electrically connected to conductor patterns of the mounting substrate, and connection electrodes of the electronic component are connected to the mounting substrate. Is often used in the form of a package having a structure in which an electrical connection with the conductive pattern is sealed. The same applies when the electronic component is a surface acoustic wave element. In the present application, a device including a mounting board and electronic components mounted on the mounting board is referred to as an electronic device.
【０００４】電子装置において、電子部品の接続電極と
実装基板の導体パターンとの電気的接続方法には、大き
く分けて、電子部品の接続電極を有する面が実装基板に
向くように電子部品を配置するフェースダウンボンディ
ングと、電子部品の接続電極を有する面が実装基板とは
反対側に向くように電子部品を配置するフェースアップ
ボンディングとがある。電子装置の小型化のためには、
フェースダウンボンディングの方が有利である。In an electronic device, a method of electrically connecting a connection electrode of an electronic component to a conductor pattern of a mounting board is roughly divided into a method of arranging the electronic component such that a surface of the electronic component having the connection electrode faces the mounting board. Face-down bonding, and face-up bonding in which electronic components are arranged such that the surface of the electronic component having connection electrodes faces the opposite side to the mounting substrate. To reduce the size of electronic devices,
Face-down bonding is more advantageous.
【０００５】フェースダウンボンディングを採用した従
来の電子装置の製造方法では、電子部品の接続電極と実
装基板の導体パターンとを電気的に接続した後、電子部
品と実装基板との間にアンダーフィル材を充填して、電
子部品の接続電極と実装基板の導体パターンとの電気的
接続部分を封止するのが一般的である。In a conventional method of manufacturing an electronic device employing face-down bonding, a connection electrode of an electronic component is electrically connected to a conductor pattern of a mounting substrate, and then an underfill material is provided between the electronic component and the mounting substrate. To seal the electrical connection between the connection electrode of the electronic component and the conductor pattern of the mounting board.
【０００６】しかしながら、電子部品が弾性表面波素子
である場合には、弾性表面波素子に特有の問題があるた
め、上述のような一般的な方法を用いることはではな
い。弾性表面波素子に特有の問題とは、弾性表面波素子
では、その表面に、櫛形電極が形成されており、この櫛
形電極に水分、塵埃等の異物が付着しないように弾性表
面波素子を封止する必要がある一方で、弾性表面波素子
の動作に影響を与えないように、弾性表面波素子の表面
における弾性表面波伝搬領域に封止用の樹脂等が接触し
ないようにする必要があることである。However, when the electronic component is a surface acoustic wave device, there is a problem peculiar to the surface acoustic wave device, so that the above-described general method is not used. The problem peculiar to the surface acoustic wave element is that the surface acoustic wave element has a comb-shaped electrode formed on its surface, and the surface acoustic wave element is sealed so that foreign substances such as moisture and dust do not adhere to the comb-shaped electrode. On the other hand, it is necessary to prevent sealing resin or the like from contacting the surface acoustic wave propagation region on the surface of the surface acoustic wave element so as not to affect the operation of the surface acoustic wave element. That is.
【０００７】そのため、従来は、電子部品が弾性表面波
素子である場合における電子装置の製造方法としては、
例えば、弾性表面波素子の接続電極と実装基板の導体パ
ターンとを電気的に接続した後、セラミックや金属等で
形成されたキャップのような構造体によって弾性表面波
素子を囲って封止を行う方法が用いられていた。電子部
品が弾性表面波素子である場合における電子装置のその
他の製造方法としては、弾性表面波素子の接続電極と実
装基板の導体パターンとを電気的に接続した後、弾性表
面波素子の周囲をサイドフィル材で囲って封止を行う方
法がある。Therefore, conventionally, as a method of manufacturing an electronic device when the electronic component is a surface acoustic wave element,
For example, after the connection electrode of the surface acoustic wave element is electrically connected to the conductor pattern of the mounting board, the surface acoustic wave element is sealed with a structure such as a cap made of ceramic or metal. The method was used. As another method of manufacturing an electronic device when the electronic component is a surface acoustic wave element, after electrically connecting a connection electrode of the surface acoustic wave element and a conductor pattern of a mounting board, the periphery of the surface acoustic wave element is removed. There is a method in which sealing is performed by surrounding with a sidefill material.
【０００８】[0008]
【発明が解決しようとする課題】電子部品が弾性表面波
素子である場合における電子装置の製造方法のうち、キ
ャップのような構造体によって弾性表面波素子を囲って
封止を行う方法では、電子装置の小型化が困難であると
いう問題点がある。また、この方法では、上記構造体
は、弾性表面波素子の接続電極と実装基板の導体パター
ンとの機械的な接合には寄与しないため、弾性表面波素
子の接続電極と実装基板の導体パターンとの機械的な接
合の強度や接合の安定性の向上を図ることができないと
いう問題点がある。In a method of manufacturing an electronic device in which an electronic component is a surface acoustic wave element, a method of enclosing a surface acoustic wave element with a structure such as a cap and sealing the electronic device is not an electronic device. There is a problem that it is difficult to reduce the size of the device. Further, in this method, the structure does not contribute to mechanical joining between the connection electrode of the surface acoustic wave element and the conductor pattern of the mounting board. However, there is a problem that it is not possible to improve the mechanical joining strength and joining stability of the above.
【０００９】また、電子部品が弾性表面波素子である場
合における電子装置の製造方法のうち、弾性表面波素子
の周囲をサイドフィル材で囲って封止を行う方法では、
サイドフィル材が弾性表面波素子の表面における弾性表
面波伝搬領域に入り込むおそれがあるという問題点があ
る。In the method of manufacturing an electronic device in the case where the electronic component is a surface acoustic wave element, the method of enclosing the surface acoustic wave element with a sidefill material and sealing the surface acoustic wave element includes:
There is a problem that the sidefill material may enter the surface acoustic wave propagation region on the surface of the surface acoustic wave element.
【００１０】なお、弾性表面波素子に限らず、電子部品
が振動子や高周波回路部品の場合でも、電子部品の表面
に封止用の樹脂等が接触すると、電子部品の動作に影響
を与える場合がある。従って、上記の問題点は、電子部
品が弾性表面波素子である場合に限らず、例えば、電子
部品が振動子や高周波回路部品である場合についても同
様である。In addition to the surface acoustic wave element, even when the electronic component is a vibrator or a high-frequency circuit component, if the sealing resin or the like contacts the surface of the electronic component, the operation of the electronic component is affected. There is. Therefore, the above problem is not limited to the case where the electronic component is a surface acoustic wave element, but also applies, for example, to the case where the electronic component is a vibrator or a high-frequency circuit component.
【００１１】本発明はかかる問題点に鑑みてなされたも
ので、その第１の目的は、実装基板と、この実装基板に
実装された電子部品とを備えた電子装置であって、簡単
な構成で、電子部品の動作に影響を与えることなく、電
子部品の接続電極と実装基板の導体パターンとの機械的
な接合の強度や接合の安定性の向上を図ることができる
ようにした電子装置を提供することにある。The present invention has been made in view of the above problems, and a first object of the present invention is to provide an electronic device having a mounting board and electronic components mounted on the mounting board, and having a simple configuration. Thus, an electronic device capable of improving the strength and stability of mechanical bonding between a connection electrode of an electronic component and a conductor pattern of a mounting board without affecting the operation of the electronic component. To provide.
【００１２】本発明の第２の目的は、上記第１の目的に
加え、簡単な構成で、電子部品の動作に影響を与えるこ
となく、電子部品を封止することができるようにした電
子装置を提供することにある。A second object of the present invention is to provide an electronic device capable of sealing an electronic component with a simple structure and without affecting the operation of the electronic component, in addition to the first object. Is to provide.
【００１３】本発明の第３の目的は、実装基板と、この
実装基板に実装された電子部品とを備えた電子装置の製
造方法であって、簡単な工程で、電子部品の動作に影響
を与えることなく、電子部品の接続電極と実装基板の導
体パターンとの機械的な接合の強度や接合の安定性の向
上を図ることができるようにした電子装置の製造方法を
提供することにある。A third object of the present invention is a method of manufacturing an electronic device including a mounting board and an electronic component mounted on the mounting board. An object of the present invention is to provide a method of manufacturing an electronic device capable of improving mechanical bonding strength and bonding stability between a connection electrode of an electronic component and a conductor pattern of a mounting board without giving the same.
【００１４】本発明の第４の目的は、上記第３の目的に
加え、簡単な工程で、電子部品の動作に影響を与えるこ
となく、電子部品を封止することができるようにした電
子装置の製造方法を提供することにある。A fourth object of the present invention is to provide an electronic device capable of sealing an electronic component by a simple process without affecting the operation of the electronic component, in addition to the third object. It is to provide a manufacturing method of.
【００１５】[0015]
【課題を解決するための手段】本発明の電子装置は、一
方の面において露出する導体パターンを有する実装基板
と、一方の面において接続電極を有し、この接続電極を
有する面が実装基板の一方の面に対向するように配置さ
れ、接続電極が実装基板の導体パターンに電気的に接続
され且つ機械的に接合された電子部品と、電子部品の実
装基板とは反対側の面に密着するように電子部品および
実装基板を覆い、実装基板に接着された樹脂フィルムと
を備えたものである。An electronic device according to the present invention has a mounting substrate having a conductor pattern exposed on one surface and a connection electrode on one surface, and the surface having the connection electrode is provided on the mounting substrate. The electronic component, which is arranged so as to face one surface and is electrically connected to the conductor pattern of the mounting substrate and is mechanically joined thereto, is in close contact with the surface of the electronic component opposite to the mounting substrate. Thus, the electronic component and the mounting board are covered, and a resin film adhered to the mounting board is provided.
【００１６】本発明の電子装置では、樹脂フィルムは、
電子部品の実装基板とは反対側の面に密着するように電
子部品および実装基板を覆い、実装基板に接着される。
そして、この樹脂フィルムによって、電子部品の接続電
極と実装基板の導体パターンとの機械的な接合が補強さ
れる。In the electronic device of the present invention, the resin film is
The electronic component and the mounting board are covered so as to be in close contact with the surface of the electronic component opposite to the mounting board, and are adhered to the mounting board.
The resin film reinforces the mechanical connection between the connection electrode of the electronic component and the conductor pattern of the mounting board.
【００１７】本発明の電子装置において、樹脂フィルム
は電子部品を封止してもよい。また、本発明の電子装置
において、電子部品の一方の面と実装基板の一方の面と
の間には空間が形成されていてもよい。In the electronic device of the present invention, the resin film may seal the electronic component. In the electronic device of the present invention, a space may be formed between one surface of the electronic component and one surface of the mounting board.
【００１８】本発明の電子装置の製造方法は、一方の面
において露出する導体パターンを有する実装基板と、一
方の面において接続電極を有し、この接続電極を有する
面が実装基板の一方の面に対向するように配置され、接
続電極が実装基板の導体パターンに電気的に接続され且
つ機械的に接合された電子部品とを備えた電子装置を製
造する方法であって、電子部品の一方の面が実装基板の
一方の面に対向するように、電子部品と実装基板とを配
置し、電子部品の接続電極を実装基板の導体パターンに
電気的に接続し且つ機械的に接合する工程と、電子部品
の実装基板とは反対側の面に密着して電子部品および実
装基板を覆うように樹脂フィルムを配置し、樹脂フィル
ムを実装基板に接着する工程とを備えたものである。According to the method of manufacturing an electronic device of the present invention, there is provided a mounting substrate having a conductor pattern exposed on one surface and a connection electrode on one surface, and the surface having the connection electrode is formed on one surface of the mounting substrate. And a connection electrode is electrically connected to the conductor pattern of the mounting substrate, and a mechanically bonded electronic component, comprising: A step of arranging the electronic component and the mounting board so that the surface faces one surface of the mounting board, electrically connecting a connection electrode of the electronic component to a conductor pattern of the mounting board, and mechanically joining the connecting electrodes. A step of arranging a resin film in close contact with the surface of the electronic component opposite to the mounting substrate and covering the electronic component and the mounting substrate, and bonding the resin film to the mounting substrate.
【００１９】本発明の電子装置の製造方法では、樹脂フ
ィルムは、電子部品の実装基板とは反対側の面に密着す
るように電子部品および実装基板を覆い、実装基板に接
着される。そして、この樹脂フィルムによって、電子部
品の接続電極と実装基板の導体パターンとの機械的な接
合が補強される。In the method of manufacturing an electronic device according to the present invention, the resin film covers the electronic component and the mounting substrate so as to be in close contact with the surface of the electronic component opposite to the mounting substrate, and is bonded to the mounting substrate. The resin film reinforces the mechanical connection between the connection electrode of the electronic component and the conductor pattern of the mounting board.
【００２０】本発明の電子装置の製造方法において、樹
脂フィルムは電子部品を封止してもよい。また、本発明
の電子装置の製造方法において、電子部品の一方の面と
実装基板の一方の面との間には空間が形成されてもよ
い。In the method of manufacturing an electronic device according to the present invention, the resin film may seal the electronic component. In the method of manufacturing an electronic device according to the present invention, a space may be formed between one surface of the electronic component and one surface of the mounting board.
【００２１】[0021]
【発明の実施の形態】以下、本発明の実施の形態につい
て図面を参照して詳細に説明する。［第１の実施の形
態］まず、図１を参照して、本発明の第１の実施の形態
に係る電子装置の構成について説明する。本実施の形態
に係る電子装置１０は、一方の面１１ａにおいて露出す
る導体パターン１２を有する実装基板１１と、一方の面
１３ａにおいて接続電極１４を有し、この接続電極１４
を有する面１３ａが実装基板１１の一方の面１１ａに対
向するように配置され、接続電極１４が実装基板１１の
導体パターン１２に電気的に接続され且つ機械的に接合
された電子部品１３と、電子部品１３の実装基板１１と
は反対側の面１３ｂと電子部品１３の周辺の部分におけ
る実装基板１１の一方の面１１ａとに密着するように電
子部品１３および実装基板１１を覆い、実装基板１１に
接着された樹脂フィルム１５とを備えている。Embodiments of the present invention will be described below in detail with reference to the drawings. [First Embodiment] First, a configuration of an electronic device according to a first embodiment of the present invention will be described with reference to FIG. The electronic device 10 according to the present embodiment includes a mounting substrate 11 having a conductor pattern 12 exposed on one surface 11a and a connection electrode 14 on one surface 13a.
An electronic component 13 in which a surface 13a having the following structure is disposed so as to face one surface 11a of the mounting substrate 11, and the connection electrode 14 is electrically connected to the conductor pattern 12 of the mounting substrate 11 and mechanically joined thereto; The electronic component 13 and the mounting substrate 11 are covered so as to be in close contact with the surface 13b of the electronic component 13 on the side opposite to the mounting substrate 11 and one surface 11a of the mounting substrate 11 in the peripheral portion of the electronic component 13. And a resin film 15 adhered to the substrate.
【００２２】実装基板１１は、ガラス、樹脂またはセラ
ミック等で形成されている。電子部品１３は、例えば弾
性表面波素子、振動子、高周波回路部品等であるが、そ
の他の電子部品であってもよい。電子部品１３は、前述
のように、接続電極１４を有する面１３ａが実装基板１
１に向くように配置されるフェースダウンボンディング
によって、実装基板１１に実装されている。電子部品１
３の一方の面１３ａと実装基板１１の一方の面１１ａと
の間には空間１６が形成されている。The mounting substrate 11 is formed of glass, resin, ceramic, or the like. The electronic component 13 is, for example, a surface acoustic wave element, a vibrator, a high-frequency circuit component, or the like, but may be another electronic component. As described above, the electronic component 13 has the surface 13 a having the connection electrode 14 on the mounting substrate 1.
1 is mounted on the mounting board 11 by face-down bonding arranged so as to face. Electronic component 1
A space 16 is formed between one surface 13 a of the mounting substrate 3 and one surface 11 a of the mounting board 11.
【００２３】電子部品１３の実装基板１１とは反対側の
面１３ｂは、樹脂フィルム１５によって隙間なく覆われ
ている。実装基板１１の一方の面１１ａのうち、電子部
品１３の周辺の部分も、隙間なく樹脂フィルム１５によ
って覆われている。また、樹脂フィルム１５は、電子部
品１３の接続電極１４と実装基板１１の導体パターン１
２との電気的接続部分を含めて、電子部品１３の全体を
封止している。The surface 13 b of the electronic component 13 on the side opposite to the mounting substrate 11 is covered with the resin film 15 without any gap. A part around the electronic component 13 on one surface 11a of the mounting substrate 11 is also covered with the resin film 15 without any gap. In addition, the resin film 15 includes the connection electrode 14 of the electronic component 13 and the conductor pattern 1 of the mounting board 11.
The entire electronic component 13 is sealed, including the portion electrically connected to the electronic component 2.
【００２４】樹脂フィルム１５は、例えば、エポキシ樹
脂等の熱硬化性の樹脂によって形成されている。樹脂フ
ィルム１５の厚みは、例えば５０〜１５０μｍである。The resin film 15 is made of, for example, a thermosetting resin such as an epoxy resin. The thickness of the resin film 15 is, for example, 50 to 150 μm.
【００２５】次に、本実施の形態に係る電子装置１０の
製造方法の概略について説明する。この電子装置１０の
製造方法は、電子部品１３の一方の面１３ａが実装基板
１１の一方の面１１ａに対向するように、電子部品１３
と実装基板１１とを配置し、電子部品１３の接続電極１
４を実装基板１１の導体パターン１２に電気的に接続し
且つ機械的に接合する工程と、電子部品１３の実装基板
１１とは反対側の面１３ｂと電子部品１３の周辺の部分
における実装基板１１の一方の面１１ａとに密着して電
子部品１３および実装基板１１を覆うように樹脂フィル
ム１５を配置し、樹脂フィルム１５を実装基板１１に接
着する工程とを備えている。Next, an outline of a method of manufacturing the electronic device 10 according to the present embodiment will be described. The method of manufacturing the electronic device 10 is such that the electronic component 13 has one surface 13 a facing the one surface 11 a of the mounting substrate 11.
And the mounting board 11 are arranged, and the connection electrodes 1 of the electronic component 13 are arranged.
Electrically connecting the substrate 4 to the conductor pattern 12 of the mounting substrate 11 and mechanically joining the same, and mounting the substrate 13 on the surface 13 b of the electronic component 13 on the side opposite to the mounting substrate 11 and on the peripheral portion of the electronic component 13. A resin film 15 is disposed so as to cover the electronic component 13 and the mounting substrate 11 in close contact with one surface 11a of the first substrate 11 and adhere the resin film 15 to the mounting substrate 11.
【００２６】次に、図２を参照して、本実施の形態にお
いて用いられる樹脂フィルム１５の特性の一例を概念的
に説明する。図２において、白丸および実線は、樹脂フ
ィルム１５の温度と任意の方向についての長さとの対応
関係を示している。また、図２において、黒丸および破
線は、樹脂フィルム１５の特性との比較のために、ＢＴ
（Bismaleimide triazine）樹脂のように温度変化に対
して形状が安定している樹脂における温度と任意の方向
についての長さとの対応関係を示している。温度変化に
対して形状が安定している樹脂では、符号１１０で示し
たように、温度変化に対してほぼ直線的に長さが変化す
る。Next, an example of characteristics of the resin film 15 used in the present embodiment will be conceptually described with reference to FIG. In FIG. 2, white circles and solid lines indicate the correspondence between the temperature of the resin film 15 and the length in an arbitrary direction. In FIG. 2, black circles and broken lines indicate BT for comparison with the characteristics of the resin film 15.
(Bismaleimide triazine) Shows the correspondence between the temperature and the length in an arbitrary direction in a resin whose shape is stable against a temperature change such as a resin. As shown by reference numeral 110, the length of the resin whose shape is stable with respect to the temperature change changes almost linearly with the temperature change.
【００２７】樹脂フィルム１５は、その温度が常温（室
温）ＲＴのときにはフィルム形状を維持している。符号
１０１で示したように、樹脂フィルム１５の温度を常温
ＲＴからガラス転移温度ＴＧまで上げて行くと、樹脂フ
ィルム１５は徐々に軟化すると共に、温度変化に対して
ほぼ直線的に長さが変化するように膨張する。符号１０
２で示したように、樹脂フィルム１５の温度をガラス転
移温度ＴＧから硬化開始温度ＨＴまで上げて行くと、樹
脂フィルム１５は流動性を有するようになると共に、急
激に膨張する。符号１０３で示したように、樹脂フィル
ム１５の温度を硬化開始温度ＨＴ以上とすると、樹脂フ
ィルム１５は硬化し始める。樹脂フィルム１５の硬化が
終了すると、符号１０４で示したように、樹脂フィルム
１５は収縮する。このとき、樹脂フィルム１５には収縮
する方向の力（以下、収縮力と言う。）が生じる。樹脂
フィルム１５の硬化が終了した後は、符号１０５で示し
たように、樹脂フィルム１５は、温度を上げても再度、
軟化したり、流動性を有したりすることなく、温度変化
に対して形状が安定する。硬化開始温度ＨＴは、樹脂フ
ィルム１５の特性によって異なるが、例えば１５０〜２
００℃程度であり、エポキシ樹脂を用いて形成された樹
脂フィルム１５の場合には１５０℃前後である。また、
樹脂フィルム１５の硬化開始から硬化終了までに要する
時間も、樹脂フィルム１５の特性によって異なる。When the temperature of the resin film 15 is room temperature (room temperature) RT, the film shape is maintained. As indicated by reference numeral 101, when the temperature of the resin film 15 is increased from the room temperature RT to the glass transition temperature TG, the resin film 15 gradually softens and changes in length almost linearly with the temperature change. Inflate to do. Code 10
As shown by 2, as the temperature of the resin film 15 is raised from the glass transition temperature TG to the curing start temperature HT, the resin film 15 becomes fluid and expands rapidly. As indicated by reference numeral 103, when the temperature of the resin film 15 is equal to or higher than the curing start temperature HT, the resin film 15 starts to cure. When the curing of the resin film 15 is completed, the resin film 15 contracts as indicated by reference numeral 104. At this time, a force in the contracting direction (hereinafter, referred to as a contracting force) is generated in the resin film 15. After the curing of the resin film 15 is completed, as indicated by reference numeral 105, the resin film 15
The shape is stable against temperature changes without softening or fluidity. The curing start temperature HT varies depending on the characteristics of the resin film 15;
The temperature is about 00 ° C., which is around 150 ° C. in the case of the resin film 15 formed using an epoxy resin. Also,
The time required from the start of the curing of the resin film 15 to the end of the curing also varies depending on the characteristics of the resin film 15.
【００２８】なお、図２に示した樹脂フィルム１５の特
性は、あくまで概念的なものである。従って、例えば、
単位時間あたりの温度変化量が変われば樹脂フィルム１
５の特性も変化する。The characteristics of the resin film 15 shown in FIG. 2 are conceptual only. So, for example,
If the amount of temperature change per unit time changes, resin film 1
5 also changes.
【００２９】本実施の形態に係る電子装置１０の製造方
法では、例えば、樹脂フィルム１５の温度を上げて樹脂
フィルム１５を軟化させた状態で、樹脂フィルム１５が
電子部品１３の実装基板１１とは反対側の面１３ｂと電
子部品１３の周辺の部分における実装基板１１の一方の
面１１ａとに均一に密着して電子部品１３および実装基
板１１を覆うように、樹脂フィルム１５の形状を変化さ
せる。その後、更に樹脂フィルム１５の温度を上げて、
樹脂フィルム１５が流動性を有するようにした後、樹脂
フィルム１５を硬化させることによって、樹脂フィルム
１５を実装基板１１に接着すると共に、樹脂フィルム１
５の形状を固定する。樹脂フィルム１５が硬化する際に
は、前述のように収縮力が発生する。この樹脂フィルム
１５の収縮力は、電子部品１３を実装基板１１側に押し
付けるように作用する。これにより、電子部品１３の接
続電極１４と実装基板１１の導体パターン１２との機械
的な接合がより確実に補強される。また、樹脂フィルム
１５が収縮することにより、樹脂フィルム１５は、より
緊密に電子部品１３および実装基板１１に密着する。In the method of manufacturing the electronic device 10 according to the present embodiment, for example, the resin film 15 is softened by increasing the temperature of the resin film 15 so that the resin film 15 is The shape of the resin film 15 is changed so that the opposite surface 13b and the one surface 11a of the mounting substrate 11 in the peripheral portion of the electronic component 13 are uniformly adhered to cover the electronic component 13 and the mounting substrate 11. Thereafter, the temperature of the resin film 15 is further increased,
After the resin film 15 is made to have fluidity, the resin film 15 is cured, so that the resin film 15 is adhered to the mounting substrate 11 and the resin film 1 is cured.
5 is fixed. When the resin film 15 is cured, a contraction force is generated as described above. The contraction force of the resin film 15 acts so as to press the electronic component 13 against the mounting board 11 side. Thereby, the mechanical connection between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the mounting board 11 is more reliably reinforced. In addition, since the resin film 15 contracts, the resin film 15 comes into close contact with the electronic component 13 and the mounting board 11.
【００３０】なお、樹脂フィルム１５が常温でも十分な
柔軟性を有する場合には、常温において樹脂フィルム１
５を変形させて、その形状を決定し、その後、樹脂フィ
ルム１５の温度を上げて樹脂フィルム１５を硬化させて
もよい。If the resin film 15 has sufficient flexibility even at room temperature, the resin film 1 may be formed at room temperature.
5 may be deformed to determine its shape, and then the resin film 15 may be cured by increasing the temperature of the resin film 15.
【００３１】また、ガラス転移温度以下の温度において
樹脂フィルム１５を軟化させた状態で、樹脂フィルム１
５の形状を決定し、その後、ガラス転移温度以下の温度
において比較的長い時間をかけて樹脂フィルム１５を硬
化させてもよい。The resin film 15 is softened at a temperature lower than the glass transition temperature.
After determining the shape of the resin film 5, the resin film 15 may be cured over a relatively long time at a temperature equal to or lower than the glass transition temperature.
【００３２】また、樹脂フィルム１５が紫外線によって
硬化する樹脂によって形成されている場合には、樹脂フ
ィルム１５の温度を上げて樹脂フィルム１５を硬化させ
る代わりに、樹脂フィルム１５に紫外線を照射して樹脂
フィルム１５を硬化させてもよい。あるいは、樹脂フィ
ルム１５の温度を上げると共に樹脂フィルム１５に紫外
線を照射して樹脂フィルム１５を硬化させてもよい。When the resin film 15 is formed of a resin which is cured by ultraviolet rays, instead of raising the temperature of the resin film 15 to cure the resin film 15, the resin film 15 is irradiated with ultraviolet rays to cure the resin film. The film 15 may be cured. Alternatively, the resin film 15 may be cured by increasing the temperature of the resin film 15 and irradiating the resin film 15 with ultraviolet rays.
【００３３】ところで、本実施の形態において、電子部
品１３の接続電極１４と実装基板１１の導体パターン１
２との電気的接続および機械的接合の方法としては、種
々の方法を用いることができる。以下、電子部品１３の
接続電極１４と実装基板１１の導体パターン１２との電
気的接続および機械的接合の方法（以下、単に接合方法
と言う。）のいくつかの例について説明する。In the present embodiment, the connection pattern 14 of the electronic component 13 and the conductive pattern 1
Various methods can be used as the method of electrical connection and mechanical joining with the second. Hereinafter, several examples of a method of electrical connection and mechanical bonding (hereinafter, simply referred to as a bonding method) between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the mounting board 11 will be described.
【００３４】まず、図３ないし図５を参照して、本実施
の形態との比較のために、従来の接合方法の例について
説明する。なお、図３ないし図５では、電子部品１３の
接続電極１４と実装基板１１の導体パターン１２との電
気的接続および機械的接合の部分を、他の部分に比べて
大きく描いている。First, an example of a conventional bonding method will be described with reference to FIGS. 3 to 5 for comparison with the present embodiment. 3 to 5, the electrical connection and the mechanical connection between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the mounting board 11 are illustrated larger than other portions.
【００３５】図３に示した例では、電子部品１３の接続
電極１４として、電子部品１３の導体パターン１７に接
続された、例えば金よりなるバンプ１４Ａが設けられて
いる。一方、実装基板１１側には、導体パターン１２の
一部をなす、例えば金よりなる接続部１２Ａが設けられ
ている。この例では、バンプ１４Ａと接続部１２Ａは金
属接合され、これにより、バンプ１４Ａと接続部１２Ａ
は電気的に接続されると共に機械的に接合される。In the example shown in FIG. 3, as the connection electrode 14 of the electronic component 13, a bump 14A made of, for example, gold connected to the conductor pattern 17 of the electronic component 13 is provided. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. In this example, the bump 14A and the connecting portion 12A are metal-bonded, so that the bump 14A and the connecting portion 12A
Are electrically connected and mechanically joined.
【００３６】図４に示した例では、電子部品１３の接続
電極１４として、電子部品１３の導体パターン１７に接
続された、例えば金よりなるバンプ１４Ｂが設けられて
いる。一方、実装基板１１側には、導体パターン１２の
一部をなす、例えば金よりなる接続部１２Ａが設けられ
ている。この例では、バンプ１４Ｂと接続部１２Ａは、
導電性ペースト１８によって電気的に接続される。その
後、電子部品１３と実装基板１１との間にはアンダーフ
ィル材１９が充填され、このアンダーフィル材１９の収
縮力によって、バンプ１４Ｂ、導電性ペースト１８およ
び接続部１２Ａの機械的接合が安定的に確保される。In the example shown in FIG. 4, a bump 14B made of, for example, gold connected to the conductor pattern 17 of the electronic component 13 is provided as the connection electrode 14 of the electronic component 13. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. In this example, the bump 14B and the connecting portion 12A
It is electrically connected by the conductive paste 18. Thereafter, an underfill material 19 is filled between the electronic component 13 and the mounting board 11, and the mechanical bonding of the bump 14B, the conductive paste 18, and the connection portion 12A is stabilized by the contraction force of the underfill material 19. Is secured.
【００３７】図５に示した例では、電子部品１３の接続
電極１４として、電子部品１３の導体パターン１７に接
続された、例えば金よりなるバンプ１４Ａが設けられて
いる。一方、実装基板１１側には、導体パターン１２の
一部をなす、例えば金よりなる接続部１２Ａが設けられ
ている。この例では、バンプ１４Ａと接続部１２Ａは互
いに接するように配置され、これにより、バンプ１４Ａ
と接続部１２Ａは電気的に接続される。バンプ１４Ａお
よび接続部１２Ａの周囲における電子部品１３と実装基
板１１との間には、非導電性または異方性導電性の接合
用ペースト２０が注入される。そして、この接合用ペー
スト２０の収縮力によって、バンプ１４Ａと接続部１２
Ａとの機械的接合が安定的に確保される。In the example shown in FIG. 5, a bump 14A made of, for example, gold connected to the conductor pattern 17 of the electronic component 13 is provided as the connection electrode 14 of the electronic component 13. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. In this example, the bumps 14A and the connection portions 12A are arranged so as to be in contact with each other, whereby the bumps 14A
And the connection portion 12A are electrically connected. A non-conductive or anisotropic conductive bonding paste 20 is injected between the electronic component 13 and the mounting substrate 11 around the bumps 14A and the connection portions 12A. Then, the bumps 14A and the connection portions 12 are formed by the contraction force of the joining paste 20.
A mechanical connection with A is stably ensured.
【００３８】次に、図６ないし図８を参照して、本実施
の形態における接合方法の例について説明する。なお、
図６ないし図８では、電子部品１３の接続電極１４と実
装基板１１の導体パターン１２との電気的接続および機
械的接合の部分を、他の部分に比べて大きく描いてい
る。Next, an example of a joining method according to the present embodiment will be described with reference to FIGS. In addition,
6 to 8, the portions of the electrical connection and the mechanical connection between the connection electrodes 14 of the electronic component 13 and the conductor patterns 12 of the mounting board 11 are drawn larger than other portions.
【００３９】図６に示した例では、図３に示した例と同
様に、電子部品１３の接続電極１４として、電子部品１
３の導体パターン１７に接続された、例えば金よりなる
バンプ１４Ａが設けられている。一方、実装基板１１側
には、導体パターン１２の一部をなす、例えば金よりな
る接続部１２Ａが設けられている。バンプ１４Ａと接続
部１２Ａは金属接合され、これにより、バンプ１４Ａと
接続部１２Ａは電気的に接続されると共に機械的に接合
される。この例では、更に、本実施の形態における樹脂
フィルム１５が設けられている。そして、この樹脂フィ
ルム１５の収縮力によって、バンプ１４Ａと接続部１２
Ａとの機械的な接合が補強される。In the example shown in FIG. 6, as in the example shown in FIG.
A bump 14A made of, for example, gold and connected to the third conductor pattern 17 is provided. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. The bump 14A and the connecting portion 12A are metal-joined, whereby the bump 14A and the connecting portion 12A are electrically connected and mechanically joined. In this example, the resin film 15 of the present embodiment is further provided. Then, the bumps 14A and the connection portions 12 are formed by the contraction force of the resin film 15.
The mechanical connection with A is reinforced.
【００４０】図７に示した例では、図４に示した例と同
様に、電子部品１３の接続電極１４として、電子部品１
３の導体パターン１７に接続された、例えば金よりなる
バンプ１４Ｂが設けられている。一方、実装基板１１側
には、導体パターン１２の一部をなす、例えば金よりな
る接続部１２Ａが設けられている。バンプ１４Ｂと接続
部１２Ａは、導電性ペースト１８によって電気的に接続
される。この例では、更に、本実施の形態における樹脂
フィルム１５が設けられている。そして、アンダーフィ
ル材１９を用いることなく、樹脂フィルム１５の収縮力
によって、バンプ１４Ｂ、導電性ペースト１８および接
続部１２Ａの機械的接合が安定的に確保される。In the example shown in FIG. 7, as in the example shown in FIG.
A bump 14B made of, for example, gold, which is connected to the third conductor pattern 17 is provided. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. The bump 14B and the connection portion 12A are electrically connected by the conductive paste 18. In this example, the resin film 15 of the present embodiment is further provided. Then, without using the underfill material 19, mechanical contraction of the bump 14 </ b> B, the conductive paste 18, and the connection part 12 </ b> A is stably secured by the contraction force of the resin film 15.
【００４１】図８に示した例では、図５に示した例と同
様に、電子部品１３の接続電極１４として、電子部品１
３の導体パターン１７に接続された、例えば金よりなる
バンプ１４Ａが設けられている。一方、実装基板１１側
には、導体パターン１２の一部をなす、例えば金よりな
る接続部１２Ａが設けられている。バンプ１４Ａと接続
部１２Ａは互いに接するように配置され、これにより、
バンプ１４Ａと接続部１２Ａは電気的に接続される。バ
ンプ１４Ａおよび接続部１２Ａの周囲における電子部品
１３と実装基板１１との間には、非導電性または異方性
導電性の接合用ペースト２０が注入される。そして、こ
の接合用ペースト２０の収縮力によって、バンプ１４Ａ
と接続部１２Ａとの機械的接合が安定的に確保される。
この例では、更に、本実施の形態における樹脂フィルム
１５が設けられている。そして、この樹脂フィルム１５
の収縮力によって、バンプ１４Ａと接続部１２Ａとの機
械的な接合が補強される。In the example shown in FIG. 8, as in the example shown in FIG.
A bump 14A made of, for example, gold and connected to the third conductor pattern 17 is provided. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. The bump 14A and the connecting portion 12A are arranged so as to be in contact with each other,
The bump 14A and the connection portion 12A are electrically connected. A non-conductive or anisotropic conductive bonding paste 20 is injected between the electronic component 13 and the mounting substrate 11 around the bumps 14A and the connection portions 12A. Then, the bumps 14A are formed by the contraction force of the joining paste 20.
Mechanical connection between the wire and the connecting portion 12A is stably secured.
In this example, the resin film 15 of the present embodiment is further provided. And this resin film 15
, The mechanical joining between the bump 14A and the connecting portion 12A is reinforced.
【００４２】なお、本実施の形態における接合方法は、
図６ないし図８に示したものに限らず、フェースダウン
ボンディングにおける従来の接合方法をほとんど利用す
ることができる。The joining method in the present embodiment is as follows.
The bonding method is not limited to those shown in FIGS. 6 to 8, and most of the conventional bonding methods in face-down bonding can be used.
【００４３】次に、図９を参照して、電子部品１３とし
ての弾性表面波素子１３Ａの一例について説明する。図
９に示した弾性表面波素子１３Ａは、圧電基板２１と、
この圧電基板２１の一方の面に形成された櫛形電極２２
および導体パターン２３と、導体パターン２３の端部に
形成された接続電極２４とを有している。接続電極２４
は、図１等における接続電極１４に対応する。弾性表面
波素子１３Ａは、櫛形電極２２によって発生される弾性
表面波を基本動作に使用する素子であり、本実施の形態
ではバンドパスフィルタとしての機能を有する。Next, an example of the surface acoustic wave element 13A as the electronic component 13 will be described with reference to FIG. The surface acoustic wave element 13A shown in FIG.
Comb-shaped electrode 22 formed on one surface of this piezoelectric substrate 21
And a conductor pattern 23 and a connection electrode 24 formed at an end of the conductor pattern 23. Connection electrode 24
Corresponds to the connection electrode 14 in FIG. The surface acoustic wave element 13A is an element that uses a surface acoustic wave generated by the comb-shaped electrode 22 for a basic operation, and has a function as a bandpass filter in the present embodiment.
【００４４】図９において、記号“ＩＮ”を付した接続
電極２４は入力端子であり、記号“ＯＵＴ”を付した接
続電極２４は出力端子であり、記号“ＧＮＤ”を付した
接続電極２４は接地端子である。また、図９において、
符号２５で示す破線で囲まれた領域は、弾性表面波伝搬
領域を含み、その内側に封止材等が入り込まないように
する必要のある領域である。In FIG. 9, the connection electrode 24 labeled "IN" is an input terminal, the connection electrode 24 labeled "OUT" is an output terminal, and the connection electrode 24 labeled "GND" This is a ground terminal. Also, in FIG.
An area surrounded by a broken line indicated by reference numeral 25 is an area including the surface acoustic wave propagation area and in which it is necessary to prevent a sealing material or the like from entering inside.
【００４５】次に、図１０ないし図１４を参照して、本
実施の形態に係る電子装置１０の製造方法について詳し
く説明する。本実施の形態では、電子装置１０を１個ず
つ製造してもよいし、複数の電子装置１０を同時に製造
してもよい。以下では、複数の電子装置１０を同時に製
造する場合について説明する。Next, a method of manufacturing the electronic device 10 according to the present embodiment will be described in detail with reference to FIGS. In the present embodiment, the electronic devices 10 may be manufactured one by one, or a plurality of electronic devices 10 may be manufactured simultaneously. Hereinafter, a case where a plurality of electronic devices 10 are manufactured at the same time will be described.
【００４６】本実施の形態に係る電子装置の製造方法で
は、まず、図１０に示したように、電子部品１３の一方
の面１３ａが実装基板１１の一方の面１１ａに対向する
ように、実装基板１１の上に電子部品１３を配置し、電
子部品１３の接続電極１４を実装基板１１の導体パター
ン１２に電気的に接続し且つ機械的に接合する。次に、
実装基板１１の一方の面１１ａの形状とほぼ同じ平面形
状に形成された樹脂フィルム１５を、電子部品１３およ
び実装基板１１を覆うように配置する。In the method for manufacturing an electronic device according to the present embodiment, first, as shown in FIG. 10, mounting is performed such that one surface 13a of the electronic component 13 faces one surface 11a of the mounting substrate 11. The electronic component 13 is arranged on the substrate 11, and the connection electrodes 14 of the electronic component 13 are electrically connected to the conductor pattern 12 of the mounting substrate 11 and mechanically joined. next,
A resin film 15 having a substantially same planar shape as the shape of one surface 11a of the mounting board 11 is disposed so as to cover the electronic component 13 and the mounting board 11.
【００４７】なお、図１０における実装基板１１は、複
数の電子部品１３に対応する部分を含んだものである。
そして、この実装基板１１上には、複数の電子部品１３
が配置される。また、本実施の形態では、実装基板１１
には、各電子部品１３が配置される領域の中央部におい
て、孔３１が形成されている。The mounting board 11 shown in FIG. 10 includes portions corresponding to a plurality of electronic components 13.
Then, a plurality of electronic components 13 are mounted on the mounting board 11.
Is arranged. In the present embodiment, the mounting substrate 11
Has a hole 31 in the center of the region where each electronic component 13 is arranged.
【００４８】次に、図１１に示したように、樹脂フィル
ム１５を加熱して樹脂フィルム１５を軟化させた状態
で、実装基板１１の孔３１を通して、実装基板１１の電
子部品１３とは反対側から電子部品１３側の空気を吸引
する。これにより、樹脂フィルム１５が電子部品１３の
実装基板１１とは反対側の面１３ｂと電子部品１３の周
辺の部分における実装基板１１の一方の面１１ａとに均
一に密着して電子部品１３および実装基板１１を覆うよ
うに、樹脂フィルム１５の形状を変化させる。このとき
の樹脂フィルム１５の温度は、樹脂フィルム１５が硬化
する温度よりも低くなるようにする。樹脂フィルム１５
を加熱して、樹脂フィルム１５を軟化させた状態で、樹
脂フィルム１５の形状を変化させることにより、樹脂フ
ィルム１５の形状を容易に決定することができる。な
お、樹脂フィルム１５が常温でも十分な柔軟性を有する
場合には、樹脂フィルム１５を加熱せずに、上述の吸引
のみで樹脂フィルム１５の形状を変化させてもよい。Next, as shown in FIG. 11, the resin film 15 is heated and the resin film 15 is softened, and is passed through the hole 31 of the mounting board 11 on the side opposite to the electronic component 13 of the mounting board 11. From the electronic component 13 side. As a result, the resin film 15 uniformly adheres to the surface 13 b of the electronic component 13 on the side opposite to the mounting substrate 11 and to one surface 11 a of the mounting substrate 11 in a peripheral portion of the electronic component 13 so that the electronic component 13 and the mounting The shape of the resin film 15 is changed so as to cover the substrate 11. At this time, the temperature of the resin film 15 is set lower than the temperature at which the resin film 15 cures. Resin film 15
Is heated to change the shape of the resin film 15 in a state where the resin film 15 is softened, whereby the shape of the resin film 15 can be easily determined. When the resin film 15 has sufficient flexibility even at room temperature, the shape of the resin film 15 may be changed only by the above-mentioned suction without heating the resin film 15.
【００４９】本実施の形態では、樹脂フィルム１５を加
熱する手段および実装基板１１の電子部品１３とは反対
側から電子部品１３側の空気を吸引する手段として、減
圧可能な加熱炉３２を用いている。しかし、加熱する手
段や空気を吸引する手段としては他の手段を用いてもよ
い。加熱炉３２は、実装基板１１が載置されるヒーター
３３を有している。ヒーター３３は、実装基板１１およ
び樹脂フィルム１５を加熱する。ヒーター３３には、実
装基板１１の孔３１に連通する孔３４が形成されてい
る。加熱炉３２内の空気を排出して加熱炉３２内を減圧
すると、ヒーター３３の孔３４と実装基板１１の孔３１
を通して、実装基板１１の電子部品１３とは反対側から
電子部品１３側の空気が吸引される。In this embodiment, a heating furnace 32 capable of reducing pressure is used as a means for heating the resin film 15 and a means for sucking air on the electronic component 13 side from the side opposite to the electronic component 13 of the mounting board 11. I have. However, other means may be used as a means for heating or a means for sucking air. The heating furnace 32 has a heater 33 on which the mounting substrate 11 is placed. The heater 33 heats the mounting board 11 and the resin film 15. The heater 33 has a hole 34 communicating with the hole 31 of the mounting board 11. When the air in the heating furnace 32 is exhausted and the inside of the heating furnace 32 is decompressed, the holes 34 of the heater 33 and the holes 31 of the mounting board 11 are removed.
The air on the electronic component 13 side is sucked from the side of the mounting board 11 opposite to the electronic component 13.
【００５０】次に、図１２に示したように、ヒーター３
３によって実装基板１１および樹脂フィルム１５を加熱
して、樹脂フィルム１５の温度を樹脂フィルム１５が硬
化する温度以上とする。これにより、樹脂フィルム１５
を、流動性を有するようにした後、硬化させて、樹脂フ
ィルム１５を実装基板１１に接着すると共に、樹脂フィ
ルム１５の形状を固定する。Next, as shown in FIG.
3, the mounting substrate 11 and the resin film 15 are heated so that the temperature of the resin film 15 is equal to or higher than the temperature at which the resin film 15 is cured. Thereby, the resin film 15
Is made to have fluidity, and then cured to bond the resin film 15 to the mounting substrate 11 and fix the shape of the resin film 15.
【００５１】なお、樹脂フィルム１５が紫外線によって
硬化する樹脂によって形成されている場合には、樹脂フ
ィルム１５の温度を上げて樹脂フィルム１５を硬化させ
る代わりに、樹脂フィルム１５に紫外線を照射して樹脂
フィルム１５を硬化させてもよい。あるいは、樹脂フィ
ルム１５の温度を上げると共に樹脂フィルム１５に紫外
線を照射して樹脂フィルム１５を硬化させてもよい。When the resin film 15 is formed of a resin which is cured by ultraviolet rays, instead of raising the temperature of the resin film 15 and curing the resin film 15, the resin film 15 is irradiated with ultraviolet rays to cure the resin film 15. The film 15 may be cured. Alternatively, the resin film 15 may be cured by increasing the temperature of the resin film 15 and irradiating the resin film 15 with ultraviolet rays.
【００５２】次に、図１３に示したように、必要に応じ
て、実装基板１１の孔３１を、封止材等よりなる栓部材
３５によって塞ぐ。次に、図１３において符号４１で示
した切断位置で、実装基板１１および樹脂フィルム１５
を切断して、個々の電子装置１０を完成させる。図１４
は、図１３に示した切断工程の前における実装基板１
１、電子部品１３および樹脂フィルム１５を示す平面図
である。電子装置１０を１個ずつ製造する場合における
製造方法は、上述の実装基板１１および樹脂フィルム１
５を切断する工程が不要になること以外は、複数の電子
装置１０を同時に製造する場合と同様である。Next, as shown in FIG. 13, the hole 31 of the mounting board 11 is closed by a plug member 35 made of a sealing material or the like, if necessary. Next, at the cutting position indicated by reference numeral 41 in FIG.
To complete individual electronic devices 10. FIG.
Is the mounting substrate 1 before the cutting step shown in FIG.
1 is a plan view showing an electronic component 13 and a resin film 15. The manufacturing method for manufacturing the electronic device 10 one by one includes the mounting substrate 11 and the resin film 1 described above.
This is the same as the case where a plurality of electronic devices 10 are manufactured at the same time, except that the step of cutting 5 is unnecessary.
【００５３】以上説明したように、本実施の形態に係る
電子装置１０およびその製造方法では、樹脂フィルム１
５が、電子部品１３の実装基板１１とは反対側の面１３
ｂと電子部品１３の周辺の部分における実装基板１１の
一方の面１１ａとに密着するように電子部品１３および
実装基板１１を覆い、実装基板１１に接着される。そし
て、この樹脂フィルム１５によって、電子部品１３の接
続電極１４と実装基板１１の導体パターン１２との機械
的な接合が補強される。また、本実施の形態では、電子
部品１３と実装基板１１との間にアンダーフィル材は充
填されない。従って、本実施の形態によれば、簡単な構
成および簡単な工程で、電子部品１３の動作に影響を与
えることなく、電子部品１３の接続電極１４と実装基板
１１の導体パターン１２との機械的な接合の強度や接合
の安定性の向上を図ることができる。As described above, in the electronic device 10 and the method of manufacturing the same according to the present embodiment, the resin film 1
5 is a surface 13 of the electronic component 13 opposite to the mounting substrate 11.
The electronic component 13 and the mounting board 11 are covered and adhered to the mounting board 11 so as to be in close contact with “b” and one surface 11 a of the mounting board 11 in a peripheral portion of the electronic component 13. The resin film 15 reinforces the mechanical connection between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the mounting board 11. In the present embodiment, the space between the electronic component 13 and the mounting board 11 is not filled with the underfill material. Therefore, according to the present embodiment, the mechanical structure between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the mounting board 11 can be achieved with a simple configuration and a simple process without affecting the operation of the electronic component 13. It is possible to improve the bonding strength and the bonding stability.
【００５４】特に、樹脂フィルム１５を接着する工程に
おいて、樹脂フィルム１５を加熱して、樹脂フィルム１
５が流動性を有するようにした後に樹脂フィルム１５を
硬化させることによって、樹脂フィルム１５を実装基板
１１に接着するようにした場合には、樹脂フィルム１５
の硬化時の収縮力により、電子部品１３の接続電極１４
と実装基板１１の導体パターン１２との機械的な接合の
強度や接合の安定性をより確実に向上させることができ
る。Particularly, in the step of bonding the resin film 15, the resin film 15 is heated to
When the resin film 15 is adhered to the mounting substrate 11 by curing the resin film 15 after the resin film 5 has fluidity, the resin film 15
Of the connection electrode 14 of the electronic component 13 due to the shrinkage force of the
It is possible to more reliably improve the strength of mechanical joining and the stability of joining between the conductive pattern 12 and the conductive pattern 12 of the mounting board 11.
【００５５】また、本実施の形態によれば、樹脂フィル
ム１５によって電子部品１３が封止されるので、簡単な
構成および簡単な工程で、電子部品１３の動作に影響を
与えることなく、電子部品１３を封止することができ
る。これにより、環境等に対する電子装置１０の耐性を
確保することができる。なお、実装基板１１の孔３１
が、電子部品１３が配置される領域の中央部に配置され
ている場合でも、この孔３１を栓部材３５によって塞ぐ
ことにより、確実に電子部品１３の封止状態を保つこと
ができる。また、孔３１が電子部品１３の封止状態に影
響を与えないほど小さい場合には、孔３１を塞がなくて
もよい。Further, according to the present embodiment, since the electronic component 13 is sealed with the resin film 15, the operation of the electronic component 13 is not affected by the simple configuration and the simple process without affecting the operation of the electronic component 13. 13 can be sealed. Thereby, the resistance of the electronic device 10 to the environment and the like can be secured. The hole 31 of the mounting board 11
However, even when the electronic component 13 is disposed at the center of the region where the electronic component 13 is disposed, the sealing state of the electronic component 13 can be reliably maintained by closing the hole 31 with the plug member 35. When the hole 31 is small enough not to affect the sealing state of the electronic component 13, the hole 31 need not be closed.
【００５６】また、本実施の形態によれば、電子部品１
３の一方の面１３ａと実装基板１１の一方の面１１ａと
の間に空間１６が形成されているので、電子部品１３の
一方の面１３ａが他の物に接触することによって電子部
品１３の動作が影響を受けることを防止することができ
る。これは、特に、電子部品１３が弾性表面波素子や振
動子や高周波回路部品の場合に有効である。According to the present embodiment, the electronic component 1
Since the space 16 is formed between the one surface 13a of the electronic component 13 and the one surface 11a of the mounting board 11, the operation of the electronic component 13 is caused by the one surface 13a of the electronic component 13 coming into contact with another object. Can be prevented from being affected. This is particularly effective when the electronic component 13 is a surface acoustic wave element, a vibrator, or a high-frequency circuit component.
【００５７】これらのことから、本実施の形態によれ
ば、電子装置１０の信頼性を向上させることができる。
また、本実施の形態によれば、樹脂フィルム１５を用い
て電子部品１３の封止を行うので、キャップのような構
造体を用いて電子部品１３の封止を行う場合に比べて、
電子装置１０の小型化、軽量化、薄型化が可能になる。
また、本実施の形態によれば、樹脂フィルム１５を用い
て電子部品１３の封止を行うので、低コストで上述の各
効果を得ることができる。As described above, according to the present embodiment, the reliability of the electronic device 10 can be improved.
Further, according to the present embodiment, since the electronic component 13 is sealed using the resin film 15, compared to the case where the electronic component 13 is sealed using a structure such as a cap,
The electronic device 10 can be reduced in size, weight, and thickness.
In addition, according to the present embodiment, since the electronic component 13 is sealed using the resin film 15, the above-described respective effects can be obtained at low cost.
【００５８】［第２の実施の形態］次に、図１５ないし
図１８を参照して、本発明の第２の実施の形態に係る電
子装置の製造方法について説明する。第１の実施の形態
と同様に、本実施の形態でも、電子装置１０を１個ずつ
製造してもよいし、複数の電子装置１０を同時に製造し
てもよい。以下では、複数の電子装置１０を同時に製造
する場合について説明する。[Second Embodiment] Next, a method for manufacturing an electronic device according to a second embodiment of the present invention will be described with reference to FIGS. As in the first embodiment, in the present embodiment, the electronic devices 10 may be manufactured one by one, or a plurality of electronic devices 10 may be manufactured simultaneously. Hereinafter, a case where a plurality of electronic devices 10 are manufactured at the same time will be described.
【００５９】本実施の形態に係る電子装置の製造方法で
は、まず、図１５に示したように、電子部品１３の一方
の面１３ａが実装基板１１の一方の面１１ａに対向する
ように、実装基板１１の上に電子部品１３を配置し、電
子部品１３の接続電極１４を実装基板１１の導体パター
ン１２に電気的に接続し且つ機械的に接合する。次に、
実装基板１１の一方の面１１ａの形状とほぼ同じ平面形
状に形成された樹脂フィルム１５を、電子部品１３およ
び実装基板１１を覆うように配置する。In the method of manufacturing an electronic device according to the present embodiment, first, as shown in FIG. 15, mounting is performed so that one surface 13a of electronic component 13 faces one surface 11a of mounting substrate 11. The electronic component 13 is arranged on the substrate 11, and the connection electrodes 14 of the electronic component 13 are electrically connected to the conductor pattern 12 of the mounting substrate 11 and mechanically joined. next,
A resin film 15 having a substantially same planar shape as the shape of one surface 11a of the mounting board 11 is disposed so as to cover the electronic component 13 and the mounting board 11.
【００６０】なお、図１５における実装基板１１は、複
数の電子部品１３に対応する部分を含んだものである。
そして、この実装基板１１上には、複数の電子部品１３
が配置される。また、本実施の形態では、実装基板１１
には、各電子部品１３が配置される領域の周辺部におい
て、複数の孔３１が形成されている。孔３１は、例え
ば、電子部品１３を中心として互いに反対側の２箇所に
設けられていてもよいし、電子部品１３の４つの側部の
外側の４個所に設けられていてもよい。The mounting board 11 in FIG. 15 includes portions corresponding to the plurality of electronic components 13.
Then, a plurality of electronic components 13 are mounted on the mounting board 11.
Is arranged. In the present embodiment, the mounting substrate 11
Has a plurality of holes 31 formed in a peripheral portion of a region where each electronic component 13 is arranged. The holes 31 may be provided, for example, at two locations on the opposite side of the electronic component 13 or at four locations outside the four sides of the electronic component 13.
【００６１】次に、図１６に示したように、樹脂フィル
ム１５を加熱して樹脂フィルム１５を軟化させた状態
で、実装基板１１の孔３１を通して、実装基板１１の電
子部品１３とは反対側から電子部品１３側の空気を吸引
する。これにより、樹脂フィルム１５が電子部品１３の
実装基板１１とは反対側の面１３ｂと電子部品１３の周
辺の部分における実装基板１１の一方の面１１ａとに均
一に密着して電子部品１３および実装基板１１を覆うよ
うに、樹脂フィルム１５の形状を変化させる。このとき
の樹脂フィルム１５の温度は、樹脂フィルム１５が硬化
する温度よりも低くなるようにする。なお、樹脂フィル
ム１５が常温でも十分な柔軟性を有する場合には、樹脂
フィルム１５を加熱せずに、上述の吸引のみで樹脂フィ
ルム１５の形状を変化させてもよい。Next, as shown in FIG. 16, the resin film 15 is heated to soften the resin film 15, and then, through the hole 31 of the mounting board 11, on the opposite side of the mounting board 11 to the electronic component 13. From the electronic component 13 side. As a result, the resin film 15 uniformly adheres to the surface 13 b of the electronic component 13 on the side opposite to the mounting substrate 11 and to one surface 11 a of the mounting substrate 11 in a peripheral portion of the electronic component 13 so that the electronic component 13 and the mounting The shape of the resin film 15 is changed so as to cover the substrate 11. At this time, the temperature of the resin film 15 is set lower than the temperature at which the resin film 15 cures. When the resin film 15 has sufficient flexibility even at room temperature, the shape of the resin film 15 may be changed only by the above-mentioned suction without heating the resin film 15.
【００６２】本実施の形態では、樹脂フィルム１５を加
熱する手段および実装基板１１の電子部品１３とは反対
側から電子部品１３側の空気を吸引する手段として、第
１の実施の形態と同様に、減圧可能な加熱炉３２を用い
ている。しかし、加熱する手段や空気を吸引する手段と
しては他の手段を用いてもよい。In the present embodiment, the means for heating the resin film 15 and the means for sucking air on the electronic component 13 side from the side opposite to the electronic component 13 of the mounting board 11 are the same as in the first embodiment. A heating furnace 32 capable of reducing pressure is used. However, other means may be used as a means for heating or a means for sucking air.
【００６３】次に、図１７に示したように、加熱炉３２
のヒーター３３によって実装基板１１および樹脂フィル
ム１５を加熱して、樹脂フィルム１５の温度を樹脂フィ
ルム１５が硬化する温度以上とする。これにより、樹脂
フィルム１５を、流動性を有するようにした後、硬化さ
せて、樹脂フィルム１５を実装基板１１に接着すると共
に、樹脂フィルム１５の形状を固定する。Next, as shown in FIG.
The mounting substrate 11 and the resin film 15 are heated by the heater 33 to make the temperature of the resin film 15 equal to or higher than the temperature at which the resin film 15 is cured. Thus, after the resin film 15 is made to have fluidity, it is cured, and the resin film 15 is adhered to the mounting substrate 11 and the shape of the resin film 15 is fixed.
【００６４】次に、図１８に示したように、符号４１で
示した切断位置で、実装基板１１および樹脂フィルム１
５を切断して、個々の電子装置１０を完成させる。本実
施の形態では、実装基板１１の孔３１は、樹脂フィルム
１５を実装基板１１に接着する工程において、樹脂フィ
ルム１５によって塞がれるので、第１の実施の形態にお
ける栓部材３５によって孔３１を塞がなくとも、確実に
封止状態を保つことができる。Next, as shown in FIG. 18, the mounting substrate 11 and the resin film 1 are cut at the cutting position indicated by reference numeral 41.
5 are cut to complete the individual electronic devices 10. In the present embodiment, since the hole 31 of the mounting board 11 is closed by the resin film 15 in the step of bonding the resin film 15 to the mounting board 11, the hole 31 is closed by the plug member 35 in the first embodiment. Even if there is no blockage, the sealed state can be reliably maintained.
【００６５】なお、図１８では、個々の電子装置１０に
おける実装基板１１に孔３１が残るように、実装基板１
１および樹脂フィルム１５を切断している。しかし、孔
３１よりも電子部品１３に近い位置で実装基板１１およ
び樹脂フィルム１５を切断して、個々の電子装置１０に
おける実装基板１１に孔３１が残らないようにしてもよ
い。In FIG. 18, the mounting board 1 is mounted such that the holes 31 remain in the mounting board 11 of each electronic device 10.
1 and the resin film 15 are cut. However, the mounting substrate 11 and the resin film 15 may be cut at a position closer to the electronic component 13 than the hole 31 so that the hole 31 does not remain in the mounting substrate 11 in each electronic device 10.
【００６６】本実施の形態におけるその他の構成、作用
および効果は、第１の実施の形態と同様である。Other configurations, operations, and effects of the present embodiment are the same as those of the first embodiment.
【００６７】なお、本発明は上記各実施の形態に限定さ
れず、種々の変更が可能である。例えば、実装基板１１
における孔３１は、吸引用に特別に設けたものに限ら
ず、スルーホール等の既存の孔であってもよい。The present invention is not limited to the above embodiments, and various modifications are possible. For example, the mounting substrate 11
The hole 31 in is not limited to a hole specially provided for suction, and may be an existing hole such as a through hole.
【００６８】[0068]
【発明の効果】以上説明したように、請求項１ないし３
のいずれかに記載の電子装置では、樹脂フィルムは、電
子部品の実装基板とは反対側の面に密着するように電子
部品および実装基板を覆い、実装基板に接着される。そ
して、この樹脂フィルムによって、電子部品の接続電極
と実装基板の導体パターンとの機械的な接合が補強され
る。従って、本発明によれば、簡単な構成で、電子部品
の動作に影響を与えることなく、電子部品の接続電極と
実装基板の導体パターンとの機械的な接合の強度や接合
の安定性の向上を図ることができるという効果を奏す
る。As described above, claims 1 to 3 are described.
In the electronic device according to any one of the above, the resin film covers the electronic component and the mounting board so as to be in close contact with a surface of the electronic component opposite to the mounting board, and is bonded to the mounting board. The resin film reinforces the mechanical connection between the connection electrode of the electronic component and the conductor pattern of the mounting board. Therefore, according to the present invention, the strength of mechanical connection and the stability of bonding between the connection electrode of the electronic component and the conductor pattern of the mounting board can be improved with a simple configuration and without affecting the operation of the electronic component. Is achieved.
【００６９】また、請求項２記載の電子装置によれば、
樹脂フィルムによって電子部品が封止されるので、簡単
な構成で、電子部品の動作に影響を与えることなく、電
子部品を封止することができるという効果を奏する。Further, according to the electronic device of the second aspect,
Since the electronic component is sealed by the resin film, the electronic component can be sealed with a simple configuration without affecting the operation of the electronic component.
【００７０】また、請求項３記載の電子装置によれば、
電子部品の一方の面と実装基板の一方の面との間に空間
が形成されているので、電子部品の一方の面が他の物に
接触することによって電子部品の動作が影響を受けるこ
とを防止することができるという効果を奏する。According to the electronic device of the third aspect,
Since a space is formed between one surface of the electronic component and one surface of the mounting board, it is important to note that the operation of the electronic component is affected when one surface of the electronic component comes into contact with another object. This has the effect that it can be prevented.
【００７１】また、請求項４ないし６のいずれかに記載
の電子装置の製造方法では、樹脂フィルムは、電子部品
の実装基板とは反対側の面に密着するように電子部品お
よび実装基板を覆い、実装基板に接着される。そして、
この樹脂フィルムによって、電子部品の接続電極と実装
基板の導体パターンとの機械的な接合が補強される。従
って、本発明によれば、簡単な工程で、電子部品の動作
に影響を与えることなく、電子部品の接続電極と実装基
板の導体パターンとの機械的な接合の強度や接合の安定
性の向上を図ることができるという効果を奏する。In the method of manufacturing an electronic device according to any one of claims 4 to 6, the resin film covers the electronic component and the mounting board so as to be in close contact with the surface of the electronic component opposite to the mounting board. Is bonded to the mounting substrate. And
This resin film reinforces the mechanical connection between the connection electrode of the electronic component and the conductor pattern of the mounting board. Therefore, according to the present invention, the strength of mechanical bonding and the stability of bonding between the connection electrode of the electronic component and the conductor pattern of the mounting board can be improved in a simple process without affecting the operation of the electronic component. Is achieved.
【００７２】また、請求項５記載の電子装置の製造方法
によれば、樹脂フィルムによって電子部品が封止される
ので、簡単な工程で、電子部品の動作に影響を与えるこ
となく、電子部品を封止することができるという効果を
奏する。According to the method of manufacturing an electronic device according to the fifth aspect, the electronic component is sealed with the resin film, so that the operation of the electronic component can be easily performed without affecting the operation of the electronic component. This has the effect of being able to be sealed.
【００７３】また、請求項６記載の電子装置によれば、
電子部品の一方の面と実装基板の一方の面との間に空間
が形成されるので、電子部品の一方の面が他の物に接触
することによって電子部品の動作が影響を受けることを
防止することができるという効果を奏する。According to the electronic device of the sixth aspect,
A space is formed between one surface of the electronic component and one surface of the mounting board, preventing the operation of the electronic component from being affected by one surface of the electronic component coming into contact with another object It has the effect that it can be done.
【図１】本発明の第１の実施の形態に係る電子装置の断
面図である。FIG. 1 is a sectional view of an electronic device according to a first embodiment of the present invention.
【図２】本発明の第１の実施の形態において用いられる
樹脂フィルムの特性の一例を概念的に示す説明図であ
る。FIG. 2 is an explanatory diagram conceptually showing an example of characteristics of a resin film used in the first embodiment of the present invention.
【図３】本発明の第１の実施の形態との比較のために従
来の接合方法の一例を示す断面図である。FIG. 3 is a cross-sectional view illustrating an example of a conventional bonding method for comparison with the first embodiment of the present invention.
【図４】本発明の第１の実施の形態との比較のために従
来の接合方法の他の例を示す断面図である。FIG. 4 is a cross-sectional view showing another example of a conventional bonding method for comparison with the first embodiment of the present invention.
【図５】本発明の第１の実施の形態との比較のために従
来の接合方法の更に他の例を示す断面図である。FIG. 5 is a sectional view showing still another example of the conventional joining method for comparison with the first embodiment of the present invention.
【図６】本発明の第１の実施の形態における接合方法の
一例を示す断面図である。FIG. 6 is a cross-sectional view illustrating an example of a bonding method according to the first embodiment of the present invention.
【図７】本発明の第１の実施の形態における接合方法の
他の例を示す断面図である。FIG. 7 is a cross-sectional view showing another example of the bonding method according to the first embodiment of the present invention.
【図８】本発明の第１の実施の形態における接合方法の
更に他の例を示す断面図である。FIG. 8 is a sectional view showing still another example of the joining method according to the first embodiment of the present invention.
【図９】本発明の第１の実施の形態における電子部品と
して弾性表面波素子の一例を示す平面図である。FIG. 9 is a plan view showing an example of a surface acoustic wave device as an electronic component according to the first embodiment of the present invention.
【図１０】本発明の第１の実施の形態に係る電子装置の
製造方法における一工程を示す説明図である。FIG. 10 is an explanatory diagram illustrating one step in the method of manufacturing the electronic device according to the first embodiment of the present invention.
【図１１】図１０に続く工程を示す説明図である。FIG. 11 is an explanatory diagram showing a step that follows the step of FIG. 10;
【図１２】図１１に続く工程を示す説明図である。FIG. 12 is an explanatory diagram showing a step that follows the step of FIG. 11;
【図１３】図１２に続く工程を示す説明図である。FIG. 13 is an explanatory diagram showing a step that follows the step of FIG. 12;
【図１４】図１３に示した切断工程の前における実装基
板、電子部品および樹脂フィルムを示す平面図である。FIG. 14 is a plan view showing a mounting board, electronic components, and a resin film before a cutting step shown in FIG. 13;
【図１５】本発明の第２の実施の形態に係る電子装置の
製造方法における一工程を示す説明図である。FIG. 15 is an explanatory view showing one step in the method of manufacturing the electronic device according to the second embodiment of the invention.
【図１６】図１５に続く工程を示す説明図である。FIG. 16 is an explanatory view showing a step following the step shown in FIG. 15;
【図１７】図１６に続く工程を示す説明図である。FIG. 17 is an explanatory diagram showing a step that follows the step of FIG. 16;
【図１８】図１７に続く工程を示す説明図である。FIG. 18 is an explanatory view showing a step following the step shown in FIG. 17.
１０…電子装置、１１…実装基板、１２…導体パター
ン、１３…電子部品、１４…接続電極、１５…樹脂フィ
ルム、１６…空間、３１…孔。DESCRIPTION OF SYMBOLS 10 ... Electronic device, 11 ... Mounting board, 12 ... Conductor pattern, 13 ... Electronic components, 14 ... Connection electrode, 15 ... Resin film, 16 ... Space, 31 ... Hole.
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 5E314 AA25 AA27 AA32 BB15 CC15 EE03 EE04 FF01 FF21 GG24 5F061 AA01 BA03 CA26 5J097 AA34 EE05 HA04 JJ06 KK10 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E314 AA25 AA27 AA32 BB15 CC15 EE03 EE04 FF01 FF21 GG24 5F061 AA01 BA03 CA26 5J097 AA34 EE05 HA04 JJ06 KK10
Claims (6)
を有する実装基板と、 一方の面において接続電極を有し、この接続電極を有す
る面が前記実装基板の一方の面に対向するように配置さ
れ、前記接続電極が前記実装基板の導体パターンに電気
的に接続され且つ機械的に接合された電子部品と、 前記電子部品の実装基板とは反対側の面に密着するよう
に前記電子部品および実装基板を覆い、前記実装基板に
接着された樹脂フィルムとを備えたことを特徴とする電
子装置。1. A mounting board having a conductor pattern exposed on one surface, a connection electrode on one surface, and a connection electrode disposed on a surface facing the one surface of the mounting substrate. An electronic component in which the connection electrode is electrically connected to and mechanically bonded to the conductor pattern of the mounting substrate; and the electronic component and the mounting so that the electronic component is in close contact with a surface of the electronic component opposite to the mounting substrate. An electronic device comprising: a substrate; and a resin film bonded to the mounting substrate.
止することを特徴とする請求項１記載の電子装置。2. The electronic device according to claim 1, wherein the resin film seals the electronic component.
の一方の面との間には空間が形成されていることを特徴
とする請求項１または２記載の電子装置。3. The electronic device according to claim 1, wherein a space is formed between one surface of the electronic component and one surface of the mounting board.
を有する実装基板と、一方の面において接続電極を有
し、この接続電極を有する面が前記実装基板の一方の面
に対向するように配置され、前記接続電極が前記実装基
板の導体パターンに電気的に接続され且つ機械的に接合
された電子部品とを備えた電子装置の製造方法であっ
て、 前記電子部品の一方の面が前記実装基板の一方の面に対
向するように、前記電子部品と実装基板とを配置し、前
記電子部品の接続電極を前記実装基板の導体パターンに
電気的に接続し且つ機械的に接合する工程と、 前記電子部品の実装基板とは反対側の面に密着して前記
電子部品および実装基板を覆うように樹脂フィルムを配
置し、前記樹脂フィルムを前記実装基板に接着する工程
とを備えたことを特徴とする電子装置の製造方法。4. A mounting substrate having a conductor pattern exposed on one surface and a connection electrode on one surface, and is arranged such that the surface having the connection electrode faces one surface of the mounting substrate. An electronic device manufacturing method, comprising: an electronic component in which the connection electrode is electrically connected to a conductor pattern of the mounting substrate and mechanically joined thereto, wherein one surface of the electronic component is the mounting substrate. Arranging the electronic component and the mounting board so as to face one surface of the electronic component, electrically connecting a connection electrode of the electronic component to a conductor pattern of the mounting board, and mechanically joining the connection electrodes; Mounting a resin film so as to cover the electronic component and the mounting board in close contact with the surface opposite to the mounting board of the electronic component, and bonding the resin film to the mounting board. You A method of manufacturing an electronic apparatus.
止することを特徴とする請求項４記載の電子装置の製造
方法。5. The method according to claim 4, wherein the resin film seals the electronic component.
の一方の面との間には空間が形成されることを特徴とす
る請求項４または５記載の電子装置の製造方法。6. The method according to claim 4, wherein a space is formed between one surface of the electronic component and one surface of the mounting board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000384381A JP2002184884A (en) | 2000-12-18 | 2000-12-18 | Electronic device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000384381A JP2002184884A (en) | 2000-12-18 | 2000-12-18 | Electronic device and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002184884A true JP2002184884A (en) | 2002-06-28 |
Family
ID=18851853
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000384381A Pending JP2002184884A (en) | 2000-12-18 | 2000-12-18 | Electronic device and manufacturing method thereof |
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| Country | Link |
|---|---|
| JP (1) | JP2002184884A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004207341A (en) * | 2002-12-24 | 2004-07-22 | Sanken Electric Co Ltd | Emitted light wavelength converting semiconductor light emitting device and its manufacturing method |
| JP2006032478A (en) * | 2004-07-13 | 2006-02-02 | Nippon Steel Chem Co Ltd | Process for manufacturing semiconductor device |
| US7183124B2 (en) | 2002-10-04 | 2007-02-27 | Toyo Communication Equipment Co., Ltd. | Surface mount saw device manufacturing method |
| US7183125B2 (en) | 2003-06-03 | 2007-02-27 | Toyo Communication Equipment Co., Ltd. | Method for manufacturing surface acoustic wave device |
| WO2008026247A1 (en) * | 2006-08-29 | 2008-03-06 | Nihon Houzai Co., Ltd. | Electromagnetic wave shield structure and formation method thereof |
| US11315804B2 (en) | 2017-12-04 | 2022-04-26 | Nagase Chemtex Corporation | Manufacturing method of mounting structure |
-
2000
- 2000-12-18 JP JP2000384381A patent/JP2002184884A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7183124B2 (en) | 2002-10-04 | 2007-02-27 | Toyo Communication Equipment Co., Ltd. | Surface mount saw device manufacturing method |
| JP2004207341A (en) * | 2002-12-24 | 2004-07-22 | Sanken Electric Co Ltd | Emitted light wavelength converting semiconductor light emitting device and its manufacturing method |
| US7183125B2 (en) | 2003-06-03 | 2007-02-27 | Toyo Communication Equipment Co., Ltd. | Method for manufacturing surface acoustic wave device |
| JP2006032478A (en) * | 2004-07-13 | 2006-02-02 | Nippon Steel Chem Co Ltd | Process for manufacturing semiconductor device |
| JP4593187B2 (en) * | 2004-07-13 | 2010-12-08 | 新日鐵化学株式会社 | Manufacturing method of semiconductor device |
| WO2008026247A1 (en) * | 2006-08-29 | 2008-03-06 | Nihon Houzai Co., Ltd. | Electromagnetic wave shield structure and formation method thereof |
| JPWO2008026247A1 (en) * | 2006-08-29 | 2010-01-14 | 日本包材株式会社 | Electromagnetic wave shield structure and formation method thereof |
| US11315804B2 (en) | 2017-12-04 | 2022-04-26 | Nagase Chemtex Corporation | Manufacturing method of mounting structure |
| US11710645B2 (en) | 2017-12-14 | 2023-07-25 | Nagase Chemtex Corporation | Manufacturing method of mounting structure, and sheet therefor |
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