JP2002313828A - Electronic device and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce a substantially mounting area of a plurality of electronic components by mounting the plurality of the components on one mounting board, and to improve stability of a strength of a mechanical connection of the connecting electrode of an electronic component with a conductor pattern of a mounting board, and its connection without affecting an influence to the operation of the component in a simple step with a simple constitution. SOLUTION: An electronic device 10 comprises the mounting substrate 11 having a conductor pattern 12 exposed with one surface 11a, the plurality of electronic components 13 having connecting electrodes 14 on a surface 13a, disposing the surface 13a having the electrodes 14 oppositely to the one surface 11a of the board 11, electronically and mechanically connecting the electrodes 14 to the pattern 12 of the board 11, and a resin film 15 covering the plurality of the components 13 and the board 11, so as to closely contact with the opposite side surface 13b to the board 11 of the plurality of the components 13 and to be adhered to the board 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having a mounting board and electronic components mounted on the mounting board, and a method of manufacturing the same.

[0002]

2. Description of the Related Art A surface acoustic wave device is one in which a comb-shaped electrode is formed on one surface of a piezoelectric substrate. This surface acoustic wave element is widely used as a filter in a mobile communication device such as a mobile phone.

[0003] By the way, electronic components such as semiconductor components are mounted on a mounting substrate, connection electrodes of the electronic component are electrically connected to conductor patterns of the mounting substrate, and connection electrodes of the electronic component are connected to the mounting substrate. Is often used in the form of a package having a structure in which an electrical connection with the conductive pattern is sealed. The same applies when the electronic component is a surface acoustic wave element. In the present application, a device including a mounting board and electronic components mounted on the mounting board is referred to as an electronic device.

In an electronic device, a method of electrically connecting a connection electrode of an electronic component to a conductor pattern of a mounting board is roughly divided into a method of arranging the electronic component such that a surface of the electronic component having the connection electrode faces the mounting board. Face-down bonding, and face-up bonding in which electronic components are arranged such that the surface of the electronic component having connection electrodes faces the opposite side to the mounting substrate. To reduce the size of electronic devices,
Face-down bonding is more advantageous.

In a conventional method of manufacturing an electronic device employing face-down bonding, a connection electrode of an electronic component is electrically connected to a conductor pattern of a mounting substrate, and then an underfill material is provided between the electronic component and the mounting substrate. To seal the electrical connection between the connection electrode of the electronic component and the conductor pattern of the mounting board.

However, when the electronic component is a surface acoustic wave device, there is a problem peculiar to the surface acoustic wave device, so that the above-described general method is not used. The problem peculiar to the surface acoustic wave element is that, in the surface acoustic wave element, a comb-shaped electrode is formed on the surface thereof, and the surface acoustic wave element is sealed so that foreign substances such as moisture and dust do not adhere to the comb-shaped electrode. On the other hand, it is necessary to prevent sealing resin or the like from contacting the surface acoustic wave propagation region on the surface of the surface acoustic wave element so as not to affect the operation of the surface acoustic wave element. That is.

Therefore, conventionally, as a method of manufacturing an electronic device when the electronic component is a surface acoustic wave element,
For example, after the connection electrode of the surface acoustic wave element is electrically connected to the conductor pattern of the mounting board, the surface acoustic wave element is sealed with a structure such as a cap made of ceramic or metal. The method was used. As another method of manufacturing an electronic device when the electronic component is a surface acoustic wave element, after electrically connecting a connection electrode of the surface acoustic wave element and a conductor pattern of a mounting board, the periphery of the surface acoustic wave element is removed. There is a method in which sealing is performed by surrounding with a sidefill material.

[0008]

In a method of manufacturing an electronic device in which an electronic component is a surface acoustic wave element, a method of enclosing a surface acoustic wave element with a structure such as a cap and sealing the electronic device is not an electronic device. There is a problem that it is difficult to reduce the size of the device. Further, in this method, the structure does not contribute to mechanical joining between the connection electrode of the surface acoustic wave element and the conductor pattern of the mounting board. However, there is a problem that it is not possible to improve the mechanical joining strength and joining stability of the above.

In the method of manufacturing an electronic device in the case where the electronic component is a surface acoustic wave element, the method of enclosing the surface acoustic wave element with a sidefill material and sealing the surface acoustic wave element includes:
There is a problem that the sidefill material may enter the surface acoustic wave propagation region on the surface of the surface acoustic wave element.

In addition to the surface acoustic wave element, even when the electronic component is a vibrator or a high-frequency circuit component, if the sealing resin or the like contacts the surface of the electronic component, the operation of the electronic component is affected. There is. Therefore, the above problem is not limited to the case where the electronic component is a surface acoustic wave element, but also applies, for example, to the case where the electronic component is a vibrator or a high-frequency circuit component.

Conventionally, an electronic device in which an electronic component is a surface acoustic wave element has a structure in which one surface acoustic wave element is surrounded and sealed by a structure such as a cap. Therefore, in a circuit using a plurality of surface acoustic wave elements, as a substantial mounting area of the plurality of surface acoustic wave elements, in addition to an area occupied by each surface acoustic wave element, sealing of each surface acoustic wave element is performed. Therefore, there is a problem that a substantial mounting area of the plurality of surface acoustic wave elements is increased.

The present invention has been made in view of such a problem, and a first object of the present invention is to reduce a substantial mounting area of a plurality of electronic components by mounting the plurality of electronic components on one mounting board. Improved strength and stability of mechanical bonding between the connection electrodes of multiple electronic components and the conductor pattern of the mounting board without affecting the operation of multiple electronic components with a simple and simple configuration It is an object of the present invention to provide an electronic device capable of achieving the following.

A second object of the present invention, in addition to the first object, is to seal a plurality of electronic components with a simple structure without affecting the operation of the plurality of electronic components. To provide an electronic device.

[0014] A third object of the present invention is to mount a plurality of electronic components on one mounting board so that a substantial mounting area of the plurality of electronic components can be reduced, and a plurality of electronic components can be formed in a simple process. Manufacture of an electronic device capable of improving mechanical bonding strength and bonding stability between connection electrodes of a plurality of electronic components and a conductor pattern of a mounting board without affecting the operation of the components. It is to provide a method.

According to a fourth object of the present invention, in addition to the third object, a plurality of electronic components can be sealed by a simple process without affecting the operation of the plurality of electronic components. To provide a method for manufacturing an electronic device.

[0016]

An electronic device according to the present invention has a mounting substrate having a conductor pattern exposed on one surface and a connection electrode on one surface, and the surface having the connection electrode is mounted on the mounting substrate. A plurality of electronic components, which are arranged so as to face one surface of the substrate and whose connection electrodes are electrically connected to and mechanically joined to the conductor pattern of the mounting substrate, are opposite to the mounting substrate of the plurality of electronic components. And a resin film that covers the plurality of electronic components and the mounting board so as to be in close contact with the side surface, and is bonded to the mounting board.

In the electronic device according to the present invention, the plurality of electronic components are mounted on one mounting board, and the resin film is attached to the plurality of electronic components so as to be in close contact with the surface of the plurality of electronic components opposite to the mounting board. It covers the mounting board and is bonded to the mounting board. The resin film reinforces the mechanical connection between the connection electrodes of the plurality of electronic components and the conductor pattern of the mounting board.

In the electronic device of the present invention, the resin film may seal a plurality of electronic components. In the electronic device of the present invention, a space may be formed between each one surface of the plurality of electronic components and one surface of the mounting board.

Further, in the electronic device of the present invention, the mounting board has a hole used to determine the shape of the resin film by sucking a gas on the electronic component side from a side of the mounting board opposite to the electronic component. It may be.

According to the method of manufacturing an electronic device of the present invention, there is provided a mounting substrate having a conductor pattern exposed on one surface and a connecting electrode on one surface, and the surface having the connecting electrode is formed on one side of the mounting substrate. A method for manufacturing an electronic device comprising: a plurality of electronic components that are arranged so as to face each other, and a plurality of electronic components in which connection electrodes are electrically connected to a conductor pattern of a mounting board and are mechanically joined. The plurality of electronic components and the mounting board are arranged such that one surface of each of the electronic components faces one surface of the mounting board, and connection electrodes of the plurality of electronic components are electrically connected to the conductor pattern of the mounting board. Connecting to the substrate and mechanically bonding, mounting a resin film so as to cover the plurality of electronic components and the mounting board in close contact with a surface of the plurality of electronic components opposite to the mounting substrate, and mounting the resin film Base It is obtained by a step of bonding the.

In the method of manufacturing an electronic device according to the present invention, the resin film covers the plurality of electronic components and the mounting board so as to be in close contact with a surface of the plurality of electronic components opposite to the mounting board.
It is bonded to the mounting board. The resin film reinforces the mechanical connection between the connection electrodes of the plurality of electronic components and the conductor pattern of the mounting board.

In the method of manufacturing an electronic device according to the present invention, the resin film may seal a plurality of electronic components. Also,
In the method of manufacturing an electronic device according to the present invention, a space may be formed between each one surface of the plurality of electronic components and one surface of the mounting board.

In the method of manufacturing an electronic device according to the present invention, the step of disposing the resin film includes sucking a gas on the electronic component side from a side of the mounting substrate opposite to the electronic component through a hole formed in the mounting substrate. By doing so, the resin film covers the plurality of electronic components and the mounting board in close contact with the surface of the plurality of electronic components opposite to the mounting substrate and one surface of the mounting board in a peripheral portion of the plurality of electronic components. In addition, a step of changing the shape of the resin film may be included.

[0024]

Embodiments of the present invention will be described below in detail with reference to the drawings. First, a configuration of an electronic device according to an embodiment of the present invention will be described with reference to FIG. The electronic device 10 according to the present embodiment has a mounting substrate 11 having a conductor pattern 12 exposed on one surface 11a and a connection electrode 14 on one surface 13a, respectively. The surface 13a having the connection electrode 14 Two electronic components 13 arranged so as to face one surface 11 a of the mounting substrate 11, the connection electrodes 14 being electrically connected to the conductor pattern 12 of the mounting substrate 11, and being mechanically joined to each other; 13, the two electronic components 13 and the mounting substrate 11 are covered so as to be in close contact with the surface 13b on the opposite side to the mounting substrate 11 and one surface 11a of the mounting substrate 11 in the peripheral portion of the two electronic components 13. Substrate 11
And a resin film 15 adhered to the substrate.

The mounting substrate 11 is formed of glass, resin, ceramic, or the like. Each electronic component 13 is, for example, a surface acoustic wave element, a vibrator, a high-frequency circuit component, or the like.
Other electronic components may be used. Further, the two electronic components 13 may be the same type of electronic components or different types of electronic components. Each of the two electronic components 13 is mounted on the mounting board 11 by face-down bonding in which the surface 13a having the connection electrode 14 faces the mounting board 11 as described above. 2
Spaces 16 are formed between each one surface 13a of the two electronic components 13 and one surface 11a of the mounting board 11, respectively. The two electronic components 13 are arranged side by side as close as possible within a range where the operation of one electronic component 13 does not affect the operation of the other electronic component 13. The interval between the two electronic components 13 is, for example, 50 to 200.
It is about μm.

The surface 13b of the two electronic components 13 on the side opposite to the mounting board 11 is covered with the resin film 15 without any gap. Of the one surface 11a of the mounting substrate 11,
The peripheral portions of the two electronic components 13 are also covered with the resin film 15 without gaps. In addition, resin film 1
5 is the connection electrode 14 of the two electronic components 13 and the mounting substrate 1
2 including the electrical connection with the conductor pattern 12
One electronic component 13 is entirely sealed.

The resin film 15 is made of, for example, a thermosetting resin such as an epoxy resin. The thickness of the resin film 15 is, for example, 50 to 150 μm.

Next, an outline of a method of manufacturing the electronic device 10 according to the present embodiment will be described. In the method of manufacturing the electronic device 10, the two electronic components 13 and the mounting board 11 are arranged such that each one surface 13 a of the two electronic components 13 faces one surface 11 a of the mounting substrate 11. Electrically connecting and mechanically connecting the connection electrodes 14 of the two electronic components 13 to the conductor patterns 12 of the mounting board 11;
Surface 13b of one electronic component 13 on the side opposite to mounting substrate 11
And the mounting substrate 1 in a peripheral portion of the two electronic components 13
A resin film 15 is disposed so as to cover the two electronic components 13 and the mounting substrate 11 in close contact with one surface 11a of the first substrate 11 and adhere the resin film 15 to the mounting substrate 11.

Next, an example of characteristics of the resin film 15 used in the present embodiment will be conceptually described with reference to FIG. In FIG. 2, white circles and solid lines indicate the correspondence between the temperature of the resin film 15 and the length in an arbitrary direction. In FIG. 2, black circles and broken lines indicate BT for comparison with the characteristics of the resin film 15.
(Bismaleimide triazine) Shows the correspondence between the temperature and the length in an arbitrary direction in a resin whose shape is stable against a temperature change such as a resin. As shown by reference numeral 110, the length of the resin whose shape is stable with respect to the temperature change changes almost linearly with the temperature change.

When the temperature of the resin film 15 is room temperature (room temperature) RT, the film shape is maintained. As indicated by reference numeral 101, when the temperature of the resin film 15 is increased from the room temperature RT to the glass transition temperature TG, the resin film 15 gradually softens and changes in length almost linearly with the temperature change. Inflate to do. Code 10
As shown by 2, as the temperature of the resin film 15 is raised from the glass transition temperature TG to the curing start temperature HT, the resin film 15 becomes fluid and expands rapidly. As indicated by reference numeral 103, when the temperature of the resin film 15 is equal to or higher than the curing start temperature HT, the resin film 15 starts to cure. When the curing of the resin film 15 is completed, the resin film 15 contracts as indicated by reference numeral 104. At this time, a force in the contracting direction (hereinafter, referred to as a contracting force) is generated in the resin film 15. After the curing of the resin film 15 is completed, as indicated by reference numeral 105, the resin film 15
The shape is stable against temperature changes without softening or fluidity. The curing start temperature HT varies depending on the characteristics of the resin film 15;
The temperature is about 00 ° C., which is around 150 ° C. in the case of the resin film 15 formed using an epoxy resin. Also,
The time required from the start of the curing of the resin film 15 to the end of the curing also varies depending on the characteristics of the resin film 15.

The characteristics of the resin film 15 shown in FIG. 2 are conceptual only. So, for example,
If the amount of temperature change per unit time changes, resin film 1
5 also changes.

In the manufacturing method of the electronic device 10 according to the present embodiment, for example, the resin film 15 is softened by increasing the temperature of the resin film 15, and the resin film 15 is mounted on the mounting substrate 11 of the two electronic components 13. The other side 13
The shape of the resin film 15 is changed so that the resin film 15 and the two electronic components 13 and the mounting substrate 11 are uniformly adhered to the one surface 11a of the mounting substrate 11 in a peripheral portion of the two electronic components 13 so as to cover the two electronic components 13 and the mounting substrate 11. After that, the resin film 1
After raising the temperature of 5 to make the resin film 15 flowable, the resin film 15 is cured, thereby bonding the resin film 15 to the mounting substrate 11 and fixing the shape of the resin film 15. When the resin film 15 is cured, a contraction force is generated as described above. The contraction force of the resin film 15 acts to press the two electronic components 13 against the mounting board 11 side. Thereby, the mechanical connection between the connection electrodes 14 of the two electronic components 13 and the conductor pattern 12 of the mounting board 11 is more reliably reinforced. In addition, as the resin film 15 shrinks, the resin film 15 comes into close contact with the two electronic components 13 and the mounting board 11.

If the resin film 15 has sufficient flexibility even at room temperature, the resin film
5 may be deformed to determine its shape, and then the resin film 15 may be cured by increasing the temperature of the resin film 15.

In a state where the resin film 15 is softened at a temperature equal to or lower than the glass transition temperature, the resin film 1
After determining the shape of the resin film 5, the resin film 15 may be cured over a relatively long time at a temperature equal to or lower than the glass transition temperature.

When the resin film 15 is formed of a resin that is softened by ultraviolet rays, instead of raising the temperature of the resin film 15 to soften the resin film 15, the resin film 15 is irradiated with ultraviolet rays to be softened. The film 15 may be softened. Alternatively, the resin film 15 may be softened by irradiating the resin film 15 with ultraviolet rays while increasing the temperature of the resin film 15.

When the resin film 15 is formed of a resin that is cured by ultraviolet rays, instead of raising the temperature of the resin film 15 to cure the resin film 15, the resin film 15 is irradiated with ultraviolet rays to cure the resin film. The film 15 may be cured. Alternatively, the resin film 15 may be cured by increasing the temperature of the resin film 15 and irradiating the resin film 15 with ultraviolet rays.

In the present embodiment, the connection pattern 14 of the electronic component 13 and the conductor pattern 1
Various methods can be used as the method of electrical connection and mechanical joining with the second. Hereinafter, several examples of a method of electrical connection and mechanical bonding (hereinafter, simply referred to as a bonding method) between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the mounting board 11 will be described.

First, an example of a conventional bonding method will be described with reference to FIGS. 3 to 5 for comparison with the present embodiment. 3 to 5, the electrical connection and the mechanical connection between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the mounting board 11 are illustrated larger than other portions.

In the example shown in FIG. 3, as the connection electrode 14 of the electronic component 13, a bump 14 A made of, for example, gold and connected to the conductor pattern 17 of the electronic component 13 is provided. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. In this example, the bump 14A and the connecting portion 12A are metal-bonded, so that the bump 14A and the connecting portion 12A
Are electrically connected and mechanically joined.

In the example shown in FIG. 4, a bump 14B made of, for example, gold connected to the conductor pattern 17 of the electronic component 13 is provided as the connection electrode 14 of the electronic component 13. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. In this example, the bump 14B and the connecting portion 12A
It is electrically connected by the conductive paste 18. After that, an underfill material 19 is filled between the electronic component 13 and the mounting board 11, and mechanical contraction of the bump 14 </ b> B, the conductive paste 18, and the connection portion 12 </ b> A is stabilized by the contraction force of the underfill material 19. Is secured.

In the example shown in FIG. 5, a bump 14A made of, for example, gold connected to the conductor pattern 17 of the electronic component 13 is provided as the connection electrode 14 of the electronic component 13. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. In this example, the bumps 14A and the connection portions 12A are arranged so as to be in contact with each other, whereby the bumps 14A
And the connection portion 12A are electrically connected. A non-conductive or anisotropic conductive bonding paste 20 is injected between the electronic component 13 and the mounting substrate 11 around the bumps 14A and the connection portions 12A. Then, the bumps 14A and the connection portions 12 are formed by the contraction force of the joining paste 20.
A mechanical connection with A is stably ensured.

Next, an example of the joining method according to the present embodiment will be described with reference to FIGS. In addition,
6 to 8, the portions of the electrical connection and the mechanical connection between the connection electrodes 14 of the electronic component 13 and the conductor patterns 12 of the mounting board 11 are drawn larger than other portions.

In the example shown in FIG. 6, as in the example shown in FIG.
A bump 14A made of, for example, gold and connected to the third conductor pattern 17 is provided. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. The bump 14A and the connecting portion 12A are metal-joined, whereby the bump 14A and the connecting portion 12A are electrically connected and mechanically joined. In this example, the resin film 15 of the present embodiment is further provided. Then, the bumps 14A and the connection portions 12 are formed by the contraction force of the resin film 15.
The mechanical connection with A is reinforced.

In the example shown in FIG. 7, as in the example shown in FIG.
A bump 14B made of, for example, gold, which is connected to the third conductor pattern 17 is provided. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. The bump 14B and the connection portion 12A are electrically connected by the conductive paste 18. In this example, the resin film 15 of the present embodiment is further provided. Then, without using the underfill material 19, mechanical contraction of the bump 14 </ b> B, the conductive paste 18, and the connection part 12 </ b> A is stably secured by the contraction force of the resin film 15.

In the example shown in FIG. 8, as in the example shown in FIG.
A bump 14A made of, for example, gold and connected to the third conductor pattern 17 is provided. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. The bump 14A and the connecting portion 12A are arranged so as to be in contact with each other,
The bump 14A and the connection portion 12A are electrically connected. A non-conductive or anisotropic conductive bonding paste 20 is injected between the electronic component 13 and the mounting substrate 11 around the bumps 14A and the connection portions 12A. Then, the bumps 14A are formed by the contraction force of the joining paste 20.
Mechanical connection between the wire and the connecting portion 12A is stably secured.
In this example, the resin film 15 of the present embodiment is further provided. And this resin film 15
, The mechanical joining between the bump 14A and the connecting portion 12A is reinforced.

The joining method in the present embodiment is as follows.
The bonding method is not limited to those shown in FIGS. 6 to 8, and most of the conventional bonding methods in face-down bonding can be used.

Next, an example of the surface acoustic wave device 13A as the electronic component 13 will be described with reference to FIG. The surface acoustic wave element 13A shown in FIG.
Comb-shaped electrode 22 formed on one surface of this piezoelectric substrate 21
And a conductor pattern 23 and a connection electrode 24 formed at an end of the conductor pattern 23. Connection electrode 24
Corresponds to the connection electrode 14 in FIG. The surface acoustic wave element 13A is an element that uses a surface acoustic wave generated by the comb-shaped electrode 22 for a basic operation, and has a function as a bandpass filter in the present embodiment.

In FIG. 9, the connection electrode 24 with the symbol “IN” is an input terminal, the connection electrode 24 with the symbol “OUT” is an output terminal, and the connection electrode 24 with the symbol “GND” is This is a ground terminal. Also, in FIG.
An area surrounded by a broken line indicated by reference numeral 25 is an area including the surface acoustic wave propagation area and in which it is necessary to prevent a sealing material or the like from entering inside.

Next, a method of manufacturing the electronic device 10 according to the present embodiment will be described in detail with reference to FIGS. In the present embodiment, the electronic devices 10 may be manufactured one by one, or a plurality of electronic devices 10 may be manufactured simultaneously. Hereinafter, a case where a plurality of electronic devices 10 are manufactured at the same time will be described.

In the method of manufacturing an electronic device according to the present embodiment, first, as shown in FIG.
The two electronic components 1 are mounted on the mounting substrate 11 such that each one surface 13a of the electronic component 1 faces one surface 11a of the mounting substrate 11.
3 and the connection electrodes 14 of the two electronic components 13
Is electrically connected to the conductor pattern 12 of the mounting board 11 and mechanically joined. Next, one surface 1 of the mounting substrate 11
A resin film 15 formed in a substantially same planar shape as the shape of 1a is arranged so as to cover the two electronic components 13 and the mounting board 11.

The mounting board 11 in FIG.
It includes a set, that is, a part corresponding to two electronic components 13. A plurality of sets of electronic components 13 are arranged on the mounting board 11. Further, in the present embodiment, a plurality of holes 31 are formed in the mounting board 11 in a peripheral portion of a rectangular area where one set of electronic components 13 is arranged. The holes 31 may be provided, for example, at two positions on the opposite sides of the center of the arrangement region of the set of electronic components 13, or may be provided at four sides of the arrangement region of the set of electronic components 13. May be provided at four places outside of the above, or may be provided at more places than that.

Next, as shown in FIG. 11, the resin film 15 is heated and the resin film 15 is softened, and is passed through the hole 31 of the mounting board 11 on the side opposite to the electronic component 13 of the mounting board 11. From the electronic component 13 side. The gas referred to here is air, nitrogen gas, inert gas, or the like, although it differs depending on the atmosphere in which the processing is performed. As a result, the resin film 15 is connected to the surface 13 b of the two electronic components 13 on the opposite side to the mounting board 11 and the two electronic components 13.
The two electronic components 13 and the mounting board 1 are in uniform contact with one surface 11a of the mounting board 11 in a peripheral portion of
1 is changed so that the shape of the resin film 15 is changed. At this time, the temperature of the resin film 15 is set lower than the temperature at which the resin film 15 cures. In this manner, the mounting board 11 is inserted through the hole 31 of the mounting board 11.
The shape of the resin film 15 can be easily determined by sucking the gas on the electronic component 13 side from the side opposite to the electronic component 13 and changing the shape of the resin film 15. Further, by changing the shape of the resin film 15 in a state where the resin film 15 is softened, the shape of the resin film 15 can be more easily determined.
When the resin film 15 has sufficient flexibility even at room temperature, the shape of the resin film 15 may be changed only by the above-mentioned suction without heating the resin film 15.

When the resin film 15 is formed of a resin that is softened by ultraviolet rays, instead of raising the temperature of the resin film 15 to soften the resin film 15, the resin film 15 is irradiated with ultraviolet rays to be softened. The film 15 may be softened. Alternatively, the resin film 15 may be softened by irradiating the resin film 15 with ultraviolet rays while increasing the temperature of the resin film 15.

In the present embodiment, a heating furnace 32 capable of reducing pressure is used as a means for heating the resin film 15 and a means for sucking gas from the electronic component 13 side of the mounting substrate 11 from the side opposite to the electronic component 13. I have. However, other means may be used as the heating means or the gas suction means. The heating furnace 32 has a heater 33 on which the mounting substrate 11 is placed. The heater 33 heats the mounting board 11 and the resin film 15. The heater 33 has a hole 34 communicating with the hole 31 of the mounting board 11. When the gas in the heating furnace 32 is exhausted and the inside of the heating furnace 32 is decompressed, the holes 34 of the heater 33 and the holes 31 of the mounting substrate 11 are removed.
Through this, the gas on the electronic component 13 side is sucked from the side of the mounting substrate 11 opposite to the electronic component 13.

Next, as shown in FIG.
3, the mounting substrate 11 and the resin film 15 are heated so that the temperature of the resin film 15 is equal to or higher than the temperature at which the resin film 15 is cured. Thereby, the resin film 15
Is made to have fluidity, and then cured to bond the resin film 15 to the mounting substrate 11 and fix the shape of the resin film 15.

When the resin film 15 is formed of a resin that is cured by ultraviolet rays, instead of raising the temperature of the resin film 15 to cure the resin film 15, the resin film 15 is irradiated with ultraviolet rays to cure the resin film. The film 15 may be cured. Alternatively, the resin film 15 may be cured by increasing the temperature of the resin film 15 and irradiating the resin film 15 with ultraviolet rays.

Next, as shown in FIG. 13, the mounting substrate 11 and the resin film 1 are cut at the cutting position indicated by reference numeral 41.
5 are cut to complete the individual electronic devices 10. FIG.
4 is the mounting substrate 1 before the cutting step shown in FIG.
1 is a plan view showing an electronic component 13 and a resin film 15. The manufacturing method for manufacturing the electronic device 10 one by one includes the mounting substrate 11 and the resin film 1 described above.
This is the same as the case where a plurality of electronic devices 10 are manufactured at the same time, except that the step of cutting 5 is unnecessary.

In FIG. 13, the mounting substrate 11 and the resin film 15 are cut at a cutting position 41 passing through the center of the hole 31 so that only a half of the hole 31 remains in the mounting substrate 11 in each electronic device 10. ing. However, hole 31
The mounting board 11 and the resin film 15 are cut at a cutting position farther from the electronic component 13 than the individual electronic devices 10.
The hole 31 may be completely left in the mounting substrate 11 in the above. Alternatively, the mounting substrate 11 and the resin film 15 may be cut at a position closer to the electronic component 13 than the hole 31, and the mounting substrate 11 in each electronic device 10 may be cut. Hole 31 may not be left in the hole.

As described above, in the electronic device 10 and the method of manufacturing the same according to the present embodiment, two electronic components 13 are mounted on one mounting substrate 11 and the resin film 15 is mounted.
Seals the two electronic components 13. Therefore, according to the present embodiment, an area for sealing the two electronic components 13 between the two electronic components 13 becomes almost unnecessary. Therefore, according to the present embodiment, in a circuit using two electronic components 13, compared to a case where two electronic devices each having one electronic component 13 mounted on one mounting board 11 are prepared, two electronic devices are used. The substantial mounting area of the component 13 can be reduced. This point will be described later in detail with a specific example.

In the present embodiment, the resin film 1
The two electronic components 13 and 5 are in close contact with a surface 13 b of the two electronic components 13 on the opposite side to the mounting substrate 11 and one surface 11 a of the mounting substrate 11 in a peripheral portion of the two electronic components 13. The mounting substrate 11 is covered,
Adhered to. The connection film 14 of the two electronic components 13 and the mounting substrate 11 are formed by the resin film 15.
Mechanical reinforcement with the conductive pattern 12 is reinforced. In the present embodiment, each electronic component 13 and the mounting board 11
Is not filled with the underfill material. Therefore, according to the present embodiment, with a simple configuration and a simple process,
Without affecting the operation of the two electronic components 13,
It is possible to improve the mechanical bonding strength and bonding stability between the connection electrode 14 of the two electronic components 13 and the conductor pattern 12 of the mounting board 11.

In particular, in the step of bonding the resin film 15, the resin film 15 is heated to
When the resin film 15 is adhered to the mounting substrate 11 by curing the resin film 15 after the resin film 5 has fluidity, the resin film 15
By the contraction force at the time of curing, the strength of mechanical joining and the stability of joining between the connection electrodes 14 of the two electronic components 13 and the conductor patterns 12 of the mounting board 11 can be more reliably improved.

Further, according to the present embodiment, since the two electronic components 13 are sealed by the resin film 15,
With a simple configuration and a simple process, the two electronic components 13 can be sealed without affecting the operation of the two electronic components 13. Thereby, the resistance of the electronic device 10 to the environment and the like can be secured.

In the present embodiment, the hole 31 of the mounting board 11 is closed by the resin film 15 in the step of bonding the resin film 15 to the mounting board 11. Therefore, the holes 3 are formed in the mounting substrate 11 of each electronic device 10.
Even when 1 remains, the sealed state can be reliably maintained without closing the hole 31.

According to the present embodiment, since spaces 16 are formed between one surface 13a of each of two electronic components 13 and one surface 11a of mounting substrate 11, a plurality of electronic components 13 are formed. The operation of the plurality of electronic components 13 can be prevented from being affected by one surface 13a of the component 13 coming into contact with another object. This is particularly effective when each electronic component 13 is a surface acoustic wave element, a vibrator, or a high-frequency circuit component.

As described above, according to the present embodiment, the reliability of the electronic device 10 can be improved.
Further, according to the present embodiment, since the two electronic components 13 are sealed using the resin film 15, compared with the case where the two electronic components 13 are sealed using a structure such as a cap. Thus, the electronic device 10 can be reduced in size, weight, and thickness. Also, according to the present embodiment, since the two electronic components 13 are sealed using the resin film 15,
The above effects can be obtained at low cost.

Here, referring to FIGS. 15 to 17,
According to the present embodiment, the substantial mounting area of the two electronic components 13 can be reduced as compared with the case where two electronic devices each having one electronic component 13 mounted on one mounting board 11 are prepared. A detailed description will be given with reference to specific examples.

FIG. 15 is a plan view of an electronic device for illustrating an example of the arrangement and dimensions of a mounting board and two electronic components in the electronic device according to the present embodiment. In the electronic device 10 in this example, the horizontal dimension of the electronic component 13 is set to 1.3.
0 mm and the vertical dimension is 0.80 mm.
In this example, the two electronic components 13 are arranged on the mounting board 11 such that the sides of 1.30 mm face each other. Lateral dimension _{X 2} of the mounting substrate 11 is 2.00
a mm, longitudinal dimension _{Y 2} is 2.50 mm.
In the electronic device 10 in this example, two electronic components 13
Occupies 1.30 × 0.80 × 2 = 2.08 (m
m ² ). The substantial mounting area of the two electronic components 13 is the area occupied by the two electronic components 13 and the two electronic components 1.
3 is the area obtained by adding the area for sealing, that is, the area occupied by the mounting substrate 11, which is 2.00 × 2.50 =
5.00 (mm ² ). Therefore, two electronic components 1
The area for sealing 3 is 5.00−2.08 = 2.9.
2 (mm ² ). The area for sealing per electronic component 13 is 1.46 (mm ² ). The sealing area per one electronic component 13 is 1.40 times the occupied area of one electronic component 13.

FIG. 16 is a sectional view of an electronic device of a comparative example with respect to the electronic device according to the present embodiment. FIG. 17 is a plan view of the electronic device for illustrating an example of the arrangement and dimensions of the mounting board and the electronic components in the electronic device of the comparative example shown in FIG. The electronic device 50 of the comparative example shown in FIGS. 16 and 17 is one in which one electronic component 13 is mounted on a mounting board 11, and the other configuration is the same as that of the electronic device 10 according to the present embodiment. It is. In the electronic device 50 of this comparative example, similarly to the electronic device 10 shown in FIG.
3 has a horizontal dimension of 1.30 mm and a vertical dimension of 0.80 mm. In this comparative example, the lateral dimension _{X 1} of the mounting substrate 11 is 2.00 mm, the longitudinal dimension _{Y 1} is 1.50 mm. In this comparative example, the distance between the outer edge of the electronic component 13 and the outer edge of the mounting board 11 is the same as that of the electronic device 10 shown in FIG. In this comparative example, the occupied area of the electronic component 13 is 1.30 × 0.80 = 1.04 (mm ² ). The actual mounting area of the electronic component 13 is
Is the area obtained by adding the area for sealing the electronic component 13 to the area occupied by the electronic component 13, that is, the area occupied by the mounting substrate 11, which is 2.00 × 1.50 = 3.00 (mm ² ).
Therefore, the area for sealing the electronic component 13 is 3.00.
−1.04 = 1.96 (mm ² ). In this comparative example, the area for sealing per electronic component 13 is:
The area occupied by one electronic component 13 is 1.88 times.

In the electronic device 10 shown in FIG. 15, compared with the electronic device 50 of the comparative example, the area for sealing per electronic component 13 is about 25.5% ((1.96−
1.46) {1.96 x 100%) and the actual mounting area of the two electronic components 13 is reduced by about 17%.
((6.00-5.00) ÷ 6.00 × 100%).

The present invention is not limited to the above embodiment, and various changes can be made. For example, in the embodiment, two electronic components 13 are mounted on one mounting board 11, but three or more electronic components 13 may be mounted on one mounting board 11.

The holes 31 in the mounting board 11 are not limited to those specially provided for suction, and may be existing holes such as through holes.

[0072]

As described above, claims 1 to 4
In the electronic device according to any one of the above, a plurality of electronic components are mounted on one mounting board, and the resin film is formed of a plurality of electronic components and a plurality of electronic components so as to be in close contact with a surface of the plurality of electronic components opposite to the mounting board. It covers the mounting board and is bonded to the mounting board. The resin film reinforces the mechanical connection between the connection electrodes of the plurality of electronic components and the conductor pattern of the mounting board. Therefore, according to the present invention, by mounting a plurality of electronic components on one mounting board, the substantial mounting area of the plurality of electronic components can be reduced, and the operation of the plurality of electronic components can be performed with a simple configuration. There is an effect that the strength of mechanical joining and the stability of joining between the connecting electrodes of the plurality of electronic components and the conductor pattern of the mounting board can be improved without affecting the structure.

According to the electronic device of the second aspect,
Since the plurality of electronic components are sealed by the resin film, it is possible to seal the plurality of electronic components with a simple configuration without affecting the operation of the plurality of electronic components.

According to the electronic device of the third aspect,
Since a space is formed between one surface of each of the plurality of electronic components and one surface of the mounting board, each of the plurality of electronic components comes into contact with another object so that the plurality of electronic components contact each other. This has the effect of preventing the operation of the component from being affected.

According to the electronic device of the fourth aspect,
Since the mounting board has holes used to determine the shape of the resin film by sucking the gas on the electronic component side from the side opposite to the electronic component of the mounting board, it is easy to determine the shape of the resin film This has the effect that it can be performed.

In the method of manufacturing an electronic device according to any one of claims 5 to 8, a plurality of electronic components are mounted on one mounting substrate, and the resin film is opposite to the mounting substrate of the plurality of electronic components. The plurality of electronic components and the mounting board are covered so as to be in close contact with the side surface, and are bonded to the mounting board. The resin film reinforces the mechanical connection between the connection electrodes of the plurality of electronic components and the conductor pattern of the mounting board. Therefore, according to the present invention, a plurality of electronic components are
By mounting on a single mounting board, the actual mounting area of a plurality of electronic components can be reduced, and the connection electrodes of the plurality of electronic components can be easily connected without affecting the operation of the plurality of electronic components. There is an effect that the strength of mechanical joining and the stability of joining with the conductor pattern of the mounting board can be improved.

According to the method of manufacturing an electronic device according to the sixth aspect, the plurality of electronic components are sealed by the resin film, so that the operations of the plurality of electronic components are not affected by the simple process. This has the effect that a plurality of electronic components can be sealed.

According to the electronic device of the seventh aspect,
Since a space is formed between one surface of each of the plurality of electronic components and one surface of the mounting board, the one surface of each of the plurality of electronic components comes into contact with another object so that the plurality of electronic components can be connected to each other. It is possible to prevent the operation from being affected.

According to the electronic device of the eighth aspect,
In the step of disposing the resin film, the gas on the electronic component side is sucked from the side opposite to the electronic component of the mounting board through the hole formed in the mounting board, so that the resin film is on the opposite side to the mounting board of the electronic component. And a step of changing the shape of the resin film so as to cover the two electronic components and the mounting substrate in close contact with the surface of the mounting substrate and one surface of the mounting substrate in a peripheral portion of the two electronic components. There is an effect that the shape can be easily determined.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of an electronic device according to an embodiment of the present invention.

FIG. 2 is an explanatory view conceptually showing an example of characteristics of a resin film used in an embodiment of the present invention.

FIG. 3 is a cross-sectional view showing an example of a conventional joining method for comparison with an embodiment of the present invention.

FIG. 4 is a cross-sectional view showing another example of a conventional joining method for comparison with one embodiment of the present invention.

FIG. 5 is a cross-sectional view showing still another example of the conventional joining method for comparison with one embodiment of the present invention.

FIG. 6 is a cross-sectional view illustrating an example of a bonding method according to an embodiment of the present invention.

FIG. 7 is a cross-sectional view showing another example of the bonding method according to the embodiment of the present invention.

FIG. 8 is a sectional view showing still another example of the joining method according to the embodiment of the present invention.

FIG. 9 is a plan view showing an example of a surface acoustic wave device as an electronic component according to one embodiment of the present invention.

FIG. 10 is an explanatory view showing one step in the method of manufacturing the electronic device according to the embodiment of the present invention.

FIG. 11 is an explanatory diagram showing a step that follows the step of FIG. 10;

FIG. 12 is an explanatory diagram showing a step that follows the step of FIG. 11;

FIG. 13 is an explanatory diagram showing a step that follows the step of FIG. 12;

FIG. 14 is a plan view showing a mounting board, electronic components, and a resin film before a cutting step shown in FIG. 13;

FIG. 15 is a plan view of the electronic device for illustrating an example of arrangement and dimensions of a mounting board and two electronic components in the electronic device according to one embodiment of the present invention.

FIG. 16 is a sectional view of an electronic device of a comparative example with respect to the electronic device according to one embodiment of the present invention;

17 is a plan view of the electronic device for illustrating an example of the arrangement and dimensions of the mounting board and the electronic components in the electronic device of the comparative example shown in FIG. 16;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Electronic device, 11 ... Mounting board, 12 ... Conductor pattern, 13 ... Electronic components, 14 ... Connection electrode, 15 ... Resin film, 16 ... Space, 31 ... Hole.

Continued on the front page (72) Inventor Shinichiro Hayashi 1-1-13 Nihonbashi, Chuo-ku, Tokyo TDK Corporation (72) Inventor Seiichi Tajima 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDK Corporation (72) Inventor Fumikatsu Kurosawa 1-13-1, Nihonbashi, Chuo-ku, Tokyo T-D Corporation F-term (reference) 5E336 AA04 AA11 CC32 CC51 DD26 EE11 GG14 5F061 AA01 BA04 CA24 FA06 5J097 AA24 AA30 AA34 HA04 HA07 HA08 JJ10 KK10

Claims (8)

[Claims] 1. A mounting board having a conductor pattern exposed on one surface, each having a connection electrode on one surface, and a surface having the connection electrode facing one surface of the mounting substrate. A plurality of electronic components arranged and electrically connected to the conductor pattern of the mounting board and mechanically bonded to the conductor pattern of the mounting board; and And a resin film that covers the plurality of electronic components and the mounting board, and is bonded to the mounting board. 2. The electronic device according to claim 1, wherein the resin film seals the plurality of electronic components. 3. The electronic device according to claim 1, wherein a space is formed between one surface of each of the plurality of electronic components and one surface of the mounting board. 4. The mounting board has a hole used to determine the shape of the resin film by sucking a gas on the electronic component side from a side of the mounting board opposite to the electronic component. The electronic device according to claim 1. 5. A mounting board having a conductor pattern exposed on one surface and a connection electrode on one surface, respectively, such that the surface having the connection electrode faces one surface of the mounting substrate. A method of manufacturing an electronic device, comprising: a plurality of electronic components arranged, wherein the connection electrodes are electrically connected to a conductor pattern of the mounting substrate, and are mechanically joined, each of the plurality of electronic components. The plurality of electronic components and the mounting board are arranged so that one surface of the mounting substrate faces one surface of the mounting substrate, and connection electrodes of the plurality of electronic components are electrically connected to the conductor pattern of the mounting substrate. Connecting and mechanically bonding; and disposing a resin film so as to cover the plurality of electronic components and the mounting board in close contact with a surface of the plurality of electronic components opposite to the mounting substrate; Method of manufacturing an electronic device characterized by comprising a step of bonding arm on the mounting substrate. 6. The method according to claim 5, wherein the resin film seals the plurality of electronic components. 7. The manufacturing of an electronic device according to claim 5, wherein a space is formed between one surface of each of the plurality of electronic components and one surface of the mounting board. Method. 8. The step of arranging the resin film is performed by sucking gas on the electronic component side from a side of the mounting board opposite to the electronic component through a hole formed in the mounting board, so that a plurality of the resin films are formed. The shape of the resin film so as to cover the plurality of electronic components and the mounting board in close contact with the surface opposite to the mounting substrate of the electronic component and one surface of the mounting board in a peripheral portion of the plurality of electronic components. 8. The method for manufacturing an electronic device according to claim 5, further comprising: