JP2003224232A - Electronic device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable the bonding between the electrode of an electronic component and a conductor pattern formed on a mounting board to be improved in mechanical strength and stability in a simple structure without adversely affecting the operation of the electronic component and to restrain heat released from the electronic component from adversely affecting its own operation. <P>SOLUTION: An electronic device 10 is equipped with a mounting board 11 provided with a conductor pattern 12 exposed on the one surface 11a of the electronic device 10, an electronic component 13 which is provided with connection electrodes 14 that are located on its one surface 13a which confronts the surface of 11a of the mounting board 11 and electrically, mechanically connected to the conductor pattern 12, a heat dissipating cap 30 which is brought into contact with the electronic component 13 to dissipate heat released from the electronic component 13, and a resin film 15 which covers the electronic component 13, the mounting board 11, and the heat dissipating cap 30 and is bonded to the mounting board 11. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device including a mounting board and electronic components mounted on the mounting board, and a method of manufacturing the same.

[0002]

2. Description of the Related Art A surface acoustic wave device is one in which a comb-shaped electrode is formed on one surface of a piezoelectric substrate. This surface acoustic wave element is widely used as a filter and the like in mobile communication devices such as mobile phones.

By the way, in electronic parts such as semiconductor parts, the electronic parts are mounted on a mounting board, the connecting electrodes of the electronic parts and the conductor patterns of the mounting board are electrically connected, and the connecting electrodes of the electronic parts and the mounting board are mounted. In many cases, it is used in the form of a package having a structure in which an electrical connection portion with the conductor pattern is sealed. The same applies when the electronic component is a surface acoustic wave element. In the present application, an electronic device includes a mounting board and electronic components mounted on the mounting board.

In the electronic device, the method of electrically connecting the connection electrode of the electronic component and the conductor pattern of the mounting substrate is roughly divided into the following arrangement: the electronic component is arranged so that the surface having the connection electrode of the electronic component faces the mounting substrate. There is face down bonding and face up bonding in which the electronic component is arranged such that the surface of the electronic component having the connection electrode faces the side opposite to the mounting substrate. To make electronic devices smaller,
Face-down bonding is more advantageous.

In the conventional method of manufacturing an electronic device employing face-down bonding, after electrically connecting the connection electrode of the electronic component and the conductor pattern of the mounting substrate, an underfill material is provided between the electronic component and the mounting substrate. Is generally filled to seal the electrical connection between the connection electrode of the electronic component and the conductor pattern of the mounting board.

However, when the electronic component is a surface acoustic wave element, there is a problem peculiar to the surface acoustic wave element, and therefore the above-mentioned general method cannot be used. The problem peculiar to the surface acoustic wave element is that the surface acoustic wave element has a comb-shaped electrode formed on the surface thereof, and the surface acoustic wave element is sealed so that foreign matter such as moisture and dust does not adhere to the comb-shaped electrode. While it is necessary to stop it, it is necessary to prevent the sealing resin etc. from contacting the surface acoustic wave propagation region on the surface of the surface acoustic wave element so as not to affect the operation of the surface acoustic wave element. That is.

Therefore, conventionally, as a method of manufacturing an electronic device when the electronic component is a surface acoustic wave element,
For example, after electrically connecting the connection electrode of the surface acoustic wave element and the conductor pattern of the mounting substrate, the surface acoustic wave element is surrounded and sealed by a structure such as a cap formed of ceramic or metal. The method was used. Another method of manufacturing an electronic device in the case where the electronic component is a surface acoustic wave element is, after electrically connecting the connection electrode of the surface acoustic wave element and the conductor pattern of the mounting substrate, surrounding the surface acoustic wave element. There is a method of enclosing with a side fill material for sealing.

[0008]

Among the methods of manufacturing an electronic device in the case where the electronic component is a surface acoustic wave element, the method of enclosing and sealing the surface acoustic wave element with a structure such as a cap There is a problem that downsizing of the device is difficult. Further, in this method, since the structure does not contribute to mechanical joining between the connection electrode of the surface acoustic wave element and the conductor pattern of the mounting board, the connection electrode of the surface acoustic wave element and the conductor pattern of the mounting board are However, there is a problem in that it is impossible to improve the mechanical joining strength and joining stability.

Further, in the method of manufacturing an electronic device in the case where the electronic component is a surface acoustic wave element, a method of enclosing the surface acoustic wave element with a side fill material for sealing is
There is a problem that the side fill material may enter the surface acoustic wave propagation region on the surface of the surface acoustic wave element.

Not only the surface acoustic wave element, but also when the electronic component is a vibrator or a high-frequency circuit component, if the surface of the electronic component is contacted with a sealing resin or the like, the operation of the electronic component is affected. There is. Therefore, the above problem is not limited to the case where the electronic component is a surface acoustic wave element, and is the same when the electronic component is a vibrator or a high frequency circuit component, for example.

Examples of electronic devices in which the electronic component is a surface acoustic wave element include a filter and a diplexer. Among these, there are devices in which electronic components do not generate much heat, such as filters, but there are also devices in which electronic components generate heat, such as diplexers. The heat generated by electrical parts is
The operation and characteristics of the electronic device may be adversely affected.

The present invention has been made in view of the above problems, and a first object thereof is an electronic device including a mounting board and electronic components mounted on the mounting board, which has a simple structure. Thus, it is possible to improve the strength of mechanical connection between the connection electrode of the electronic component and the conductor pattern of the mounting board and the stability of the connection without affecting the operation of the electronic component, and the electronic component is generated. An object of the present invention is to provide an electronic device capable of reducing the adverse effect of the heat generated.

A second object of the present invention is, in addition to the above-mentioned first object, an electronic device having a simple structure and capable of sealing an electronic component without affecting the operation of the electronic component. To provide.

A third object of the present invention is a method of manufacturing an electronic device including a mounting board and electronic components mounted on the mounting board, wherein the operation of the electronic component is affected by a simple process. It is possible to improve the strength of mechanical bonding and the stability of bonding between the connection electrode of the electronic component and the conductor pattern of the mounting board without giving the same, and to reduce the adverse effect of heat generated by the electronic component. Another object of the present invention is to provide a method for manufacturing the electronic device.

A fourth object of the present invention is, in addition to the above-mentioned third object, an electronic device capable of sealing an electronic component by a simple process without affecting the operation of the electronic component. It is to provide a manufacturing method of.

[0016]

The electronic device of the present invention has a mounting substrate having a conductor pattern exposed on one surface and a connecting electrode on one surface, and the surface having the connecting electrode is the mounting substrate. The electronic component, which is arranged so as to face one surface and whose connecting electrode is electrically connected and mechanically bonded to the conductor pattern of the mounting board, contacts the electronic component and removes heat generated from the electronic component. It is provided with a heat dissipation component that dissipates heat, and a resin film that covers the electronic component, the mounting substrate, and the heat dissipation component and is adhered to the mounting substrate.

In the electronic device of the present invention, the resin film is
The electronic component, the mounting substrate and the heat dissipation component are adhered to the mounting substrate in a state of being covered. The resin film reinforces the mechanical connection between the connection electrode of the electronic component and the conductor pattern of the mounting board. Further, the heat generated from the electronic component is radiated by the heat radiating component.

In the electronic device of the present invention, the resin film may seal the electronic component. Further, in the electronic device of the present invention, a space may be formed between one surface of the electronic component and one surface of the mounting board.

In the electronic device of the present invention, the mounting board has a conductor portion provided on the other surface of the mounting board and a through hole for electrically connecting the conductor portion and the conductor pattern. The heat dissipation component may be in contact with the conductor pattern. Further, in the electronic device of the present invention, the heat dissipation component may have a protrusion that penetrates through the resin film and protrudes on the opposite side of the resin film from the electronic component.

In the electronic device of the present invention, the mounting board has a hole used to determine the shape of the resin film by sucking gas on the electronic part side from the side opposite to the electronic part of the mounting board. You may have. In this case, the hole of the mounting board may be arranged in the peripheral portion of the area where the electronic component is arranged on the mounting board, and the hole may be closed by the resin film.

According to the method of manufacturing an electronic device of the present invention, a mounting board having a conductor pattern exposed on one surface and a connection electrode on one surface, and the surface having the connection electrode is one surface of the mounting board. And a connection electrode is electrically connected to a conductor pattern of a mounting substrate and is mechanically joined to the conductor pattern. So as to face one surface of the mounting board, the step of arranging the electronic component and the mounting board, electrically connecting the connection electrodes of the electronic component to the conductor pattern of the mounting board, and mechanically joining them, A step of disposing a heat dissipation component that dissipates heat generated from the part so as to contact the electronic part, and a step of disposing a resin film so as to cover the electronic part, the mounting board and the heat dissipation part and adhering it to the mounting board When It includes those were.

In the method of manufacturing an electronic device according to the present invention, the resin film is adhered to the mounting board while covering the electronic component, the mounting board and the heat dissipation component. The resin film reinforces the mechanical connection between the connection electrode of the electronic component and the conductor pattern of the mounting board. Further, the heat generated from the electronic component is radiated by the heat radiating component.

In the method of manufacturing an electronic device of the present invention, the resin film may seal the electronic component. Further, in the method for manufacturing an electronic device of the present invention, a space may be formed between one surface of the electronic component and one surface of the mounting board.

In the method of manufacturing an electronic device according to the present invention, the mounting board includes a conductor portion provided on the other surface of the mounting board, and a through hole for electrically connecting the conductor portion and the conductor pattern. And the step of disposing the heat dissipation component is
The heat dissipation component may contact the conductor pattern.

In the method of manufacturing an electronic device of the present invention, the heat dissipation component has a protrusion that protrudes on the side opposite to the electronic component, and in the step of disposing and adhering the resin film,
The projecting portion may penetrate the resin film and project to the opposite side of the resin film from the electronic component.

In the method of manufacturing an electronic device of the present invention, the step of disposing and adhering the resin film is performed by passing the gas on the electronic component side from the side opposite to the electronic component of the mounting substrate through the hole formed in the mounting substrate. It may include a step of changing the shape of the resin film so that the resin film comes into close contact with the electronic component, the mounting substrate and the heat dissipation component by suction. In this case, the holes formed in the mounting board are arranged in the peripheral portion of the area where the electronic components are arranged in the mounting board, and the holes may be blocked by the resin film in the step of disposing and adhering the resin film. Good. Also,
In the step of changing the shape of the resin film, the shape of the resin film may be changed while the resin film is softened.

In the method of manufacturing an electronic device of the present invention, the step of disposing and adhering the resin film is performed by heating the resin film so that the resin film has fluidity and then curing the resin film. The resin film may be adhered to the mounting board.

[0028]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. [First Embodiment] First, the configuration of an electronic device according to a first embodiment of the present invention will be described with reference to FIG. The electronic device 10 according to the present embodiment has one surface 11
a mounting board 11 having a conductor pattern 12 exposed at a, and a connection electrode 14 at one surface 13a,
The surface 13a having the connection electrode 14 is arranged so as to face one surface 11a of the mounting substrate 11, and
An electronic component 13 electrically connected to the conductor pattern 12 of the mounting substrate 11 and mechanically joined, and an electronic component 13
And a resin film 15 that covers the electronic component 13, the mounting board 11, and the heat dissipating cap 30 and is adhered to the mounting board 11. The heat dissipation cap 30 is
It corresponds to the heat dissipation component in the present invention.

The mounting substrate 11 is made of glass, resin, ceramic or the like. In addition, the mounting board 11 includes the conductor portion 29 provided on the other surface 11b of the mounting board 11.
And a through hole 31 for electrically connecting the conductor portion 29 and the conductor pattern 12 to each other. Electronic component 1
Reference numeral 3 is, for example, a surface acoustic wave element, a vibrator, a high-frequency circuit component or the like, but may be another electronic component. The electronic component 13 has the surface 13 having the connection electrode 14 as described above.
It is mounted on the mounting board 11 by face-down bonding in which a is arranged so as to face the mounting board 11. A space 16 is formed between the one surface 13 a of the electronic component 13 and the one surface 11 a of the mounting board 11.

The surface 13b of the electronic component 13 on the side opposite to the mounting substrate 11 is covered with a resin film 15 via a heat dissipation cap 30 without any gap. A portion of the one surface 11a of the mounting substrate 11 around the electronic component 13 is covered with the resin film 15 without any gap. Also,
The resin film 15 seals the entire electronic component 13 including the electrical connection portion between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the mounting board 11.

In the present embodiment, the through hole 31 of the mounting board 11 determines the shape of the resin film 15 by sucking the gas on the electronic part 13 side from the side opposite to the electronic part 13 of the mounting board 11. It is also a hole used for. The through hole 31 is arranged in the peripheral portion of the area where the electronic component 13 is arranged on the mounting board 11, and is closed by the resin film 15.

The resin film 15 is formed of a thermosetting resin such as an epoxy resin. The thickness of the resin film 15 is, for example, 50 to 150 μm.

The heat dissipation cap 30 is made of a material having a high thermal conductivity, for example, a metal such as aluminum.
Further, the heat dissipation cap 30 has a substantially rectangular parallelepiped box shape corresponding to the outer shape of the electronic component 13, and has a shape in which one surface facing the mounting board 11 is opened. The edge of the heat dissipation cap 30 on the mounting substrate 11 side is mounted on the mounting substrate 11
Contacting the conductor pattern 12 of
Are connected to the conductor portion 29 on the opposite side through through holes 31. Heat dissipation cap 30, conductor pattern 12,
The through hole 31 and the conductor portion 29 allow heat generated inside the electronic device 10, specifically, heat generated from the electronic component 13, to be transferred to the outside of the electronic device 10, specifically, the mounting substrate 11. A path leading to the outside of the surface 11b opposite to the electronic component 13 is formed. Here, the electronic device 10 is mounted on the printed circuit board, for example, by electrically connecting the conductor portion 29 of the mounting substrate 11 to a conductor portion of a printed circuit board (not shown) with a joining member such as solder. This allows
The heat reaching the conductor portion 29 is quickly conducted to the printed circuit board side through a joining member such as solder, and the heat generated inside the electronic device 10 is efficiently radiated to the printed circuit board side.

Next, an outline of a method of manufacturing the electronic device 10 according to the present embodiment will be described. According to the method of manufacturing the electronic device 10, the electronic component 13 is arranged so that the one surface 13 a of the electronic component 13 faces the one surface 11 a of the mounting board 11.
And the mounting substrate 11 are arranged, and the connection electrode 1 of the electronic component 13 is arranged.
A step of electrically connecting 4 to the conductor pattern 12 of the mounting board 11 and mechanically joining them, a step of covering the electronic component 13 with the heat dissipation cap 30, and a surface of the heat dissipation cap 30 opposite to the electronic part 13. , The resin film 15 is disposed so as to cover the heat dissipation cap 30, the electronic component 13, and the mounting substrate 11 in close contact with the one surface 11a of the mounting substrate 11 in the peripheral portion of the electronic component 13, and the resin film 15 is mounted. And a step of adhering to the substrate 11.

Next, an example of the characteristics of the resin film 15 used in the present embodiment will be conceptually described with reference to FIG. In FIG. 2, white circles and solid lines show the correspondence between the temperature of the resin film 15 and the length in any direction. In addition, in FIG. 2, black circles and broken lines indicate BT for comparison with the characteristics of the resin film 15.
(Bismaleimide triazine) The relationship between the temperature and the length in an arbitrary direction in a resin whose shape is stable against temperature changes is shown. In a resin whose shape is stable with respect to temperature change, as indicated by reference numeral 110, the length changes substantially linearly with respect to temperature change.

The resin film 15 maintains the film shape when the temperature is room temperature (room temperature) RT. As indicated by reference numeral 101, when the temperature of the resin film 15 is increased from the room temperature RT to the glass transition temperature TG, the resin film 15 gradually softens and the length changes substantially linearly with respect to the temperature change. Inflate as you do. Code 10
As indicated by 2, when the temperature of the resin film 15 is increased from the glass transition temperature TG to the curing start temperature HT, the resin film 15 becomes fluid and expands rapidly. As indicated by reference numeral 103, when the temperature of the resin film 15 is set to the curing start temperature HT or higher, the resin film 15 starts to cure. When the curing of the resin film 15 is completed, the resin film 15 shrinks as indicated by reference numeral 104. At this time, a force in the direction of contraction (hereinafter referred to as contraction force) is generated in the resin film 15. After the curing of the resin film 15 is completed, as shown by the reference numeral 105, the resin film 15 is
The shape is stable against temperature changes without softening or having fluidity. The curing start temperature HT varies depending on the characteristics of the resin film 15, but is, for example, 150 to 2
The temperature is about 00 ° C., and is about 150 ° C. in the case of the resin film 15 formed using an epoxy resin. Also,
The time required from the start of curing to the end of curing of the resin film 15 also differs depending on the characteristics of the resin film 15.

The characteristics of the resin film 15 shown in FIG. 2 are conceptual only. So, for example,
Resin film 1 if the amount of temperature change per unit time changes
The characteristics of 5 also change.

In the method of manufacturing the electronic device 10 according to the present embodiment, for example, the resin film 15 is softened by raising the temperature of the resin film 15 so that the resin film 15 covers the upper surface of the heat dissipation cap 30 and the electronic component 13. The electronic component 13, the heat dissipating cap 30, and the mounting board 11 are evenly adhered to the one surface 11a of the mounting board 11 in the peripheral portion thereof.
The shape of the resin film 15 is changed so as to cover the.
After that, the temperature of the resin film 15 is further raised so that the resin film 15 has fluidity, and then the resin film 15 is cured to adhere the resin film 15 to the mounting substrate 11, and Fix the shape. When the resin film 15 is cured, the contracting force is generated as described above. The contracting force of the resin film 15 acts so as to press the electronic component 13 against the mounting substrate 11 side. As a result, mechanical joining between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the mounting board 11 is reinforced more reliably. Further, the resin film 15 contracts more closely, so that the resin film 15 more closely adheres to the heat dissipation cap 30 and the mounting substrate 11.

If the resin film 15 has sufficient flexibility even at room temperature, the resin film 1 will be kept at room temperature.
5 may be deformed to determine its shape, and then the temperature of the resin film 15 may be raised to cure the resin film 15.

The resin film 1 is softened at a temperature below the glass transition temperature and the resin film 1 is softened.
The shape of No. 5 may be determined, and then the resin film 15 may be cured at a temperature below the glass transition temperature for a relatively long time.

When the resin film 15 is formed of a resin that is softened by ultraviolet rays, the resin film 15 is irradiated with ultraviolet rays instead of raising the temperature of the resin film 15 to soften the resin film 15. The film 15 may be softened. Alternatively, the resin film 15 may be softened by raising the temperature of the resin film 15 and irradiating the resin film 15 with ultraviolet rays.

When the resin film 15 is made of a resin which is cured by ultraviolet rays, the resin film 15 is irradiated with ultraviolet rays instead of being heated to cure the resin film 15. The film 15 may be cured. Alternatively, the resin film 15 may be cured by raising the temperature of the resin film 15 and irradiating the resin film 15 with ultraviolet rays.

By the way, in the present embodiment, the connection electrode 14 of the electronic component 13 and the conductor pattern 1 of the mounting substrate 11 are arranged.
Various methods can be used as a method of electrically connecting and mechanically connecting with 2. Hereinafter, some examples of a method (hereinafter, simply referred to as a joining method) of electrically connecting and mechanically joining the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the mounting substrate 11 will be described.

First, an example of a conventional joining method will be described with reference to FIGS. 3 to 5 for comparison with the present embodiment. 3 to 5, the portion of the electrical connection and the mechanical connection between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the mounting substrate 11 is drawn larger than the other portions.

In the example shown in FIG. 3, bumps 14A made of, for example, gold, which are connected to the conductor pattern 17 of the electronic component 13, are provided as the connection electrodes 14 of the electronic component 13. On the other hand, on the mounting substrate 11 side, a connecting portion 12A that is a part of the conductor pattern 12 and is made of, for example, gold is provided. In this example, the bump 14A and the connecting portion 12A are metal-bonded to each other, whereby the bump 14A and the connecting portion 12A are connected.
Are electrically connected and mechanically joined.

In the example shown in FIG. 4, bumps 14B made of, for example, gold, which are connected to the conductor pattern 17 of the electronic component 13, are provided as the connection electrodes 14 of the electronic component 13. On the other hand, on the mounting substrate 11 side, a connecting portion 12A that is a part of the conductor pattern 12 and is made of, for example, gold is provided. In this example, the bump 14B and the connecting portion 12A are
It is electrically connected by the conductive paste 18. After that, the underfill material 19 is filled between the electronic component 13 and the mounting substrate 11, and the contraction force of the underfill material 19 stabilizes the mechanical bonding of the bumps 14B, the conductive paste 18, and the connection portion 12A. Secured in.

In the example shown in FIG. 5, as the connection electrode 14 of the electronic component 13, a bump 14A made of, for example, gold and connected to the conductor pattern 17 of the electronic component 13 is provided. On the other hand, on the mounting substrate 11 side, a connecting portion 12A that is a part of the conductor pattern 12 and is made of, for example, gold is provided. In this example, the bump 14A and the connecting portion 12A are arranged so as to be in contact with each other, whereby the bump 14A
And the connecting portion 12A are electrically connected. A non-conductive or anisotropic conductive bonding paste 20 is injected between the electronic component 13 and the mounting substrate 11 around the bumps 14A and the connecting portions 12A. Then, due to the contracting force of the bonding paste 20, the bump 14A and the connecting portion 12 are
The mechanical joining with A is stably ensured.

Next, an example of the joining method in the present embodiment will be described with reference to FIGS. In addition,
In FIG. 6 to FIG. 8, a portion of electrical connection and mechanical joining between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the mounting board 11 is drawn larger than other portions.

In the example shown in FIG. 6, similarly to the example shown in FIG. 3, the electronic component 1 is used as the connection electrode 14 of the electronic component 13.
Bumps 14A made of, for example, gold, which are connected to the third conductor pattern 17, are provided. On the other hand, on the mounting substrate 11 side, a connecting portion 12A that is a part of the conductor pattern 12 and is made of, for example, gold is provided. The bump 14A and the connecting portion 12A are metal-bonded together, so that the bump 14A and the connecting portion 12A are electrically connected and mechanically joined together. In this example, the resin film 15 according to the present embodiment is further provided. The contraction force of the resin film 15 causes the bump 14A and the connecting portion 12
The mechanical joint with A is reinforced.

In the example shown in FIG. 7, as in the example shown in FIG. 4, the electronic component 1 is used as the connection electrode 14 of the electronic component 13.
Bumps 14B made of, for example, gold, which are connected to the third conductor pattern 17, are provided. On the other hand, on the mounting substrate 11 side, a connecting portion 12A that is a part of the conductor pattern 12 and is made of, for example, gold is provided. The bump 14B and the connecting portion 12A are electrically connected by the conductive paste 18. In this example, the resin film 15 according to the present embodiment is further provided. Then, without using the underfill material 19, the mechanical bonding of the bumps 14B, the conductive paste 18, and the connecting portion 12A is stably ensured by the shrinkage force of the resin film 15.

In the example shown in FIG. 8, similarly to the example shown in FIG. 5, the electronic component 1 is used as the connection electrode 14 of the electronic component 13.
Bumps 14A made of, for example, gold, which are connected to the third conductor pattern 17, are provided. On the other hand, on the mounting substrate 11 side, a connecting portion 12A that is a part of the conductor pattern 12 and is made of, for example, gold is provided. The bump 14A and the connecting portion 12A are arranged so as to be in contact with each other, whereby
The bump 14A and the connecting portion 12A are electrically connected. A non-conductive or anisotropic conductive bonding paste 20 is injected between the electronic component 13 and the mounting substrate 11 around the bumps 14A and the connecting portions 12A. Then, due to the contracting force of the bonding paste 20, the bump 14A
The mechanical joint between the connecting portion 12A and the connecting portion 12A is stably ensured.
In this example, the resin film 15 according to the present embodiment is further provided. And this resin film 15
The contraction force of reinforced the mechanical connection between the bump 14A and the connecting portion 12A.

The joining method in this embodiment is
Not limited to those shown in FIGS. 6 to 8, almost any conventional joining method in face-down bonding can be used.

Next, an example of the surface acoustic wave element 13A as the electronic component 13 will be described with reference to FIG. The surface acoustic wave element 13A shown in FIG. 9 includes a piezoelectric substrate 21 and
The comb-shaped electrode 22 formed on one surface of the piezoelectric substrate 21
And a conductor pattern 23 and a connection electrode 24 formed at an end of the conductor pattern 23. Connection electrode 24
Corresponds to the connection electrode 14 in FIG. The surface acoustic wave element 13A is an element that uses a surface acoustic wave generated by the comb-shaped electrode 22 for a basic operation, and has a function as a bandpass filter in the present embodiment.

In FIG. 9, the connection electrode 24 with the symbol "IN" is an input terminal, the connection electrode 24 with the symbol "OUT" is an output terminal, and the connection electrode 24 with the symbol "GND" is It is a ground terminal. In addition, in FIG.
A region surrounded by a broken line indicated by reference numeral 25 is a region including a surface acoustic wave propagation region and it is necessary to prevent the sealing material and the like from entering the inside thereof.

Next, with reference to FIGS. 10 and 11, an example of the shapes of the conductor pattern 12 and the conductor portion 29 on the mounting board 11 will be described. FIG. 10 shows a mounting board 11
It is a top view which shows one surface 11a. As shown in FIG. 10, the conductor pattern 12 formed on the one surface 11a of the mounting board 11 is formed at the corners 12a formed near the four corners of the surface 11a and at the central portion of the surface 11a. Center part 12b and connecting part 12c for connecting corner part 12a and center part 12b to each other
And an input portion 12d and an output portion 12e formed at positions sandwiching the center portion 12b from both sides.

In FIG. 10, a region surrounded by a broken line indicated by reference numeral 26 is a region where the electronic component 13 is arranged, and a region surrounded by a broken line indicated by reference symbol 27 is arranged with the heat dissipation cap 30. Area. Then, the connection electrode 24 as a ground terminal of the electronic component 13 is connected to the corner portion 12a. A connection electrode 24 as an input terminal of the electronic component 13 is connected to the input section 12d. The connection electrode 24 as an output terminal of the electronic component 13 is connected to the output section 12e. In FIG. 10, reference numeral 28 is a conductor pattern 12 to which each connection electrode 24 of the electronic component 13 is connected.
It represents the position above. Corner section 12a, input section 12
One end of each through hole 31 is arranged in each of the d and the output portion 12e.

FIG. 11 is a bottom view showing the other surface 11b of the mounting board 11 described above. In FIG. 11, the conductor portion 29 formed on the other surface 11 b of the mounting substrate 11 is the surface 1
A corner portion 2 corresponding to each of the corner portion 12a, the input portion 12d, and the output portion 12e formed on the side 1a.
9a, an input unit 29d and an output unit 29e are included.
The other end of each through hole 31 is arranged in each of the corner portion 29a, the input portion 29d, and the output portion 29e. The corner portion 29a, the input portion 29d, and the output portion 29e are electrically connected to the corner portion 12a, the input portion 12d, and the output portion 12e on the surface 11a side through the through holes 31, respectively.

Next, referring to FIG. 12, the heat dissipation cap 3
An example of the 0 shape will be described. FIG. 12 is a perspective view showing an example of the shape of the heat dissipation cap 30. As shown in FIG. 12, the heat dissipation cap 30 has a ceiling portion 30A and four side wall portions 30B, 30C, 30D, 30E. The heat dissipation cap 30 further includes two contact portions 37 protruding horizontally outward from the lower end portion of the side wall portion 30C, and two contact portions horizontally protruding outward from the lower end portion of the side wall portion 30E facing the side wall portion 30C. And 37. Each contact portion 37 is arranged at a position corresponding to each corner portion 12 a formed on one surface 11 a of the mounting board 11, and the heat dissipation cap 30 is provided so as to cover the electronic component 13.
When it is attached to, the corner portions 12a come into contact with each other.

Next, with reference to FIGS. 13 to 17, a method of manufacturing the electronic device 10 according to the present embodiment will be described in detail. In the present embodiment, the electronic devices 10 may be manufactured one by one, or a plurality of electronic devices 10 may be manufactured at the same time. Hereinafter, a case where a plurality of electronic devices 10 are manufactured at the same time will be described.

In the method of manufacturing the electronic device 10 according to the present embodiment, first, as shown in FIG. 13, one surface 13a of the electronic component 13 is opposed to one surface 11a of the mounting substrate 11, The electronic component 13 is arranged on the mounting substrate 11, and the connection electrode 14 of the electronic component 13 is electrically connected to the conductor pattern 12 of the mounting substrate 11 and mechanically joined.
Next, the electronic component 13 is covered with the heat dissipation cap 30 from the other surface 13b side of the electronic component 13. Next, the mounting board 11
The resin film 15 formed in the same plane shape as the shape of the one surface 11a of
It is arranged so as to cover 1.

The mounting board 11 in FIG. 13 includes a portion corresponding to a plurality of electronic components 13.
A plurality of electronic components 13 are mounted on the mounting board 11.
Are placed. Further, in the present embodiment, the mounting substrate 11
A through hole 31 is formed in the periphery of the area where each electronic component 13 is arranged.

Next, as shown in FIG. 14, while the resin film 15 is heated to soften the resin film 15, the resin film 15 is passed through the through-holes 31 of the mounting substrate 11 and is opposite to the electronic component 13 of the mounting substrate 11. The gas on the electronic component 13 side is sucked from the side. The gas referred to here is air, nitrogen gas, inert gas or the like, although it depends on the atmosphere in which the treatment is performed. As a result, the resin film 15 becomes
Of the resin film 15 such that the surface 13b opposite to the mounting board 11 and one surface 11a of the mounting board 11 in the peripheral portion of the electronic component 13 are evenly adhered to cover the electronic component 13 and the mounting board 11. Change the shape of. The temperature of the resin film 15 at this time is set to be lower than the temperature at which the resin film 15 is cured. In this way, the shape of the resin film 15 is changed by sucking the gas on the electronic component 13 side from the side opposite to the electronic component 13 of the mounting substrate 11 through the holes 31 of the mounting substrate 11 to change the shape of the resin film 15. Can be easily determined. Further, by changing the shape of the resin film 15 while the resin film 15 is softened, the resin film 1
The shape of 5 can be more easily determined. If the resin film 15 has sufficient flexibility even at room temperature, the shape of the resin film 15 may be changed only by the above suction without heating the resin film 15.

When the resin film 15 is made of a resin that is softened by ultraviolet rays, the resin film 15 is irradiated with ultraviolet rays instead of raising the temperature of the resin film 15 to soften the resin film 15. The film 15 may be softened. Alternatively, the resin film 15 may be softened by raising the temperature of the resin film 15 and irradiating the resin film 15 with ultraviolet rays.

In the present embodiment, the heating furnace 32 capable of reducing the pressure is used as a means for heating the resin film 15 and a means for sucking the gas on the electronic component 13 side from the side of the mounting substrate 11 opposite to the electronic component 13. There is. However, other means may be used as the heating means or the gas suction means. The heating furnace 32 has a heater 33 on which the mounting board 11 is placed. The heater 33 heats the mounting substrate 11 and the resin film 15. A hole 34 communicating with the through hole 31 of the mounting board 11 is formed in the heater 33. The gas in the heating furnace 32 is discharged to heat the heating furnace 32.
When the pressure inside is reduced, the holes 34 of the heater 33 and the mounting substrate 11
The gas on the electronic component 13 side is sucked from the side of the mounting substrate 11 opposite to the electronic component 13 through the through hole 31 of FIG.

Next, as shown in FIG. 15, the heater 3
The mounting substrate 11 and the resin film 15 are heated by 3 so that the temperature of the resin film 15 is equal to or higher than the temperature at which the resin film 15 is cured. Thereby, the resin film 15
Is made to have fluidity and then cured to bond the resin film 15 to the mounting substrate 11 and fix the shape of the resin film 15.

When the resin film 15 is made of a resin which is hardened by ultraviolet rays, instead of raising the temperature of the resin film 15 to harden the resin film 15, the resin film 15 is irradiated with ultraviolet rays so that the resin film 15 is cured. The film 15 may be cured. Alternatively, the resin film 15 may be cured by raising the temperature of the resin film 15 and irradiating the resin film 15 with ultraviolet rays.

Then, the mounting substrate 11 on which the resin film 15 is mounted
When the bonding to the substrate is completed, the through hole 31 of the mounting substrate 11 is closed by the resin film 15, as shown in FIG. Next, the mounting substrate 11 and the resin film 15 are cut at the cutting position indicated by reference numeral 41 in FIG. 16 to complete the individual electronic devices 10. FIG. 17 is a plan view showing the mounting substrate 11, the electronic component 13, and the resin film 15 before the cutting step shown in FIG.
The manufacturing method in the case of manufacturing the electronic devices 10 one by one is a plurality of electronic devices 10 except that the step of cutting the mounting board 11 and the resin film 15 described above is unnecessary.
This is the same as the case of simultaneously manufacturing.

As described above, in the electronic device 10 and the manufacturing method thereof according to the present embodiment, the resin film 1 is used.
5 is adhered to the mounting substrate 11 in a state where the electronic component 13 and the heat dissipation cap 30 are covered. Therefore, the resin film 15 reinforces the mechanical connection between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the mounting substrate 11. Further, in the present embodiment, the underfill material is not filled between the electronic component 13 and the mounting board 11. Therefore, according to the present embodiment, the mechanical structure of the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the mounting substrate 11 can be mechanically achieved with a simple configuration and a simple process without affecting the operation of the electronic component 13. It is possible to improve the strength of joining and the stability of joining.

In particular, in the step of adhering the resin film 15, the resin film 15 is heated so that the resin film 1
When the resin film 15 is adhered to the mounting substrate 11 by hardening the resin film 15 after making 5 have fluidity, the resin film 15
By the contracting force at the time of hardening, the connection electrode 14 of the electronic component 13
It is possible to more reliably improve the strength of mechanical joining and the stability of joining with the conductor pattern 12 of the mounting substrate 11.

Further, in the electronic device 10 and the manufacturing method thereof according to the present embodiment, the heat dissipation cap 30 that comes into contact with the electronic component 13 is provided, and the contact portion 37 of the heat dissipation cap 30.
Since it is connected to the conductor pattern 12 of the mounting board 11, the heat generated in the electronic component 13 can be released to the mounting board 11 side, and the adverse effect of the heat generated in the electronic component 13 can be reduced. In the present embodiment, in particular, the conductor portion 29 on the opposite side of the mounting substrate 11 through the through hole 31.
The contact portion 37 of the heat dissipation cap 30 is brought into contact with the conductor pattern 12 connected to. Therefore, the electronic component 13
The heat generated in (3) is guided to the conductor portion 29 through the heat dissipation cap 30, the conductor pattern 12 of the mounting board 11 and the through hole 31. Therefore, the adverse effect of heat generated by the electronic component 13 can be reliably reduced. Also,
When the conductor portion 29 of the mounting board 11 is electrically connected to a conductor portion of a printed circuit board (not shown) by a joining member such as solder, the heat reaching the conductor portion 29 is further transferred to the printed circuit board side through the joining member. The heat conducted and generated inside the electronic device 10 is efficiently radiated to the printed circuit board side.
Therefore, the adverse effect of heat generated by the electronic component 13 can be further reduced.

Further, according to the present embodiment, since the electronic component 13 is sealed by the resin film 15, the electronic component 13 can be operated with a simple structure and a simple process without affecting the operation of the electronic component 13. 13 can be sealed. This ensures the resistance of the electronic device 10 to the environment and the like.

Further, in the present embodiment, the resin film 1
In the step of adhering 5 to the mounting substrate 11, since the through hole 31 is closed by the resin film 15, a dedicated sealing means for closing the through hole 31 and a step of closing the through hole 31 by this sealing means are unnecessary. Therefore, the structure of the electronic device 10 and the manufacturing process can be simplified.

Further, in the present embodiment, the gas on the electronic component 13 side is sucked from the side opposite to the electronic component 13 side of the mounting substrate 11 through the through hole 31 formed in the mounting substrate 11, whereby the resin film 15 is formed. I am trying to change the shape. Therefore, according to the present embodiment, the shape of the resin film 15 can be easily determined.

Further, according to the present embodiment, the electronic component 1
Since the space 16 is formed between the one surface 13a of the electronic component 13 and the one surface 11a of the mounting substrate 11, the operation of the electronic component 13 by the contact of the one surface 13a of the electronic component 13 with another object. Can be prevented from being affected. This is particularly effective when the electronic component 13 is a surface acoustic wave element, a vibrator, or a high frequency circuit component.

From these things, according to the present embodiment, the reliability of the electronic device 10 can be improved.
Further, in the present embodiment, the electronic component 13 is reinforced by the heat dissipation cap 30. Therefore, according to the present embodiment, the electronic component 13 housed inside the heat dissipation cap 30.
The thickness of the electronic component 13 and the electronic device 10 can be reduced. Further, according to the present embodiment, since the electronic component 13 is sealed using the resin film 15, the above-mentioned effects can be obtained at low cost.

[Second Embodiment] Next, an electronic device 10A according to a second embodiment of the present invention will be described with reference to FIGS. FIG. 18 is a sectional view of electronic device 10A according to the present embodiment. In addition, FIG.
20 and FIG. 20 are a plan view and a cross-sectional view, respectively, of heat dissipation cap 40 in the present embodiment. As shown in FIG. 18, the electronic device 10A according to the present embodiment has a substantially flat heat dissipation cap 4 instead of the box-like heat dissipation cap 30 in the electronic device 10 according to the first embodiment.
It has 0. The heat dissipation cap 40 is the heat dissipation cap 3
Like 0, it is made of a material having a high thermal conductivity. The heat dissipation cap 40 corresponds to the heat dissipation component of the present invention.

As shown in FIGS. 18 to 20, the heat dissipation cap 40 includes a rectangular flat plate-like flat plate portion 40A slightly smaller than the shape of the surface 13b of the electronic component 13, and the flat plate portion 40A to the electronic component 13. Is a protruding portion 4 protruding to the opposite side
Has 0B. The flat plate portion 40A is in contact with the surface 13b of the electronic component 13. The resin film 15 is provided at a position corresponding to the protruding portion 40B of the heat dissipation cap 40 at the protruding portion 4
An insertion hole 43 for inserting 0B is provided. The protrusion 40 </ b> B of the heat dissipation cap 40 has the insertion hole 4 of the resin film 15.
3 and penetrates through the resin film 15. The tip of the protruding portion 40B protrudes from the surface of the resin film 15 to the side opposite to the electronic component 13. Here, the insertion hole 4
The shape of the horizontal cross section of 3 is slightly smaller than the shape of the horizontal cross section of the protrusion 40B. Thus, when the protrusion 40B is inserted into the insertion hole 43, the portion of the resin film 15 that surrounds the insertion hole 43 is protruded.
It is designed to come into close contact with the outer surface of OB.

As shown in FIG. 18, the resin film 15
A heat dissipation plate 44 may be arranged on the side opposite to the heat dissipation cap 40. In this case, for example, the heat dissipation cap 40
The tip end portion of the projecting portion 40B of the heat radiation plate 40 is fitted into the fitting hole 45 formed in the heat radiation plate 44, and the heat radiation cap 40 and the heat radiation plate 4 are inserted.
4 and may be combined. Like the heat dissipation cap 40,
The heat dissipation plate 44 is also made of a material having a high thermal conductivity. When the electronic device 10A is housed inside a metal casing (not shown), at least part of the casing may also serve as the heat dissipation plate 44. With this configuration, the heat generated by the electronic component 13 is radiated to the outside through the housing.

21 to 24, a method of manufacturing the electronic device according to this embodiment will be described. Similar to the first embodiment, also in the present embodiment, the electronic devices 10A may be manufactured one by one, or a plurality of electronic devices 10A may be manufactured at the same time. Hereinafter, a case where a plurality of electronic devices 10A are manufactured simultaneously will be described.

In the method of manufacturing the electronic device according to the present embodiment, first, as shown in FIG. 21, the mounting is performed so that one surface 13a of the electronic component 13 faces one surface 11a of the mounting substrate 11. The electronic component 13 is arranged on the substrate 11, and the connection electrode 14 of the electronic component 13 is electrically connected to the conductor pattern 12 of the mounting substrate 11 and mechanically joined. Next, the heat dissipation cap 40 is attached to the other surface 13b of the electronic component 13.
Cover. Next, the resin film 15 formed in the same plane shape as the shape of the one surface 11a of the mounting substrate 11 is
The heat radiation cap 40, the electronic component 13, and the mounting board 11 are arranged so as to be covered.

The mounting board 11 in FIG. 21 includes a portion corresponding to a plurality of electronic components 13.
A plurality of electronic components 13 are mounted on the mounting board 11.
Are placed. Further, in the present embodiment, the mounting substrate 11
A plurality of through holes 31 are formed in the periphery of the area where each electronic component 13 is arranged.

Next, as shown in FIG. 22, after inserting at least the tip portion of the protruding portion 40B of the heat dissipation cap 40 into the insertion hole 43 of the resin film 15, the resin film 1
5 is heated to soften the resin film 15, and the mounting substrate 11 is passed through the through holes 31 of the mounting substrate 11.
The gas on the electronic component 13 side is sucked from the side opposite to the electronic component 13. As a result, the resin film 15 becomes the electronic component 1.
3 is a surface 13b opposite to the mounting substrate 11 and the electronic component 13
The shape of the resin film 15 is changed so as to evenly adhere to the one surface 11a of the mounting substrate 11 in the peripheral portion thereof and cover the electronic component 13 and the mounting substrate 11. The temperature of the resin film 15 at this time is set to be lower than the temperature at which the resin film 15 is cured. When the resin film 15 finishes changing its shape, the tip end portion of the protruding portion 40B of the heat dissipation cap 40 passes through the insertion hole 43 of the resin film 15, penetrates through the resin film 15, and the resin film 15
Of the electronic component 13 on the opposite side. Since the shape of the horizontal cross section of the insertion hole 43 is formed to be slightly smaller than the shape of the horizontal cross section of the projection 40B, the projection 4 is formed.
0B and the resin film 15 are in close contact with each other, and gas does not leak from between the protruding portion 40B and the resin film 15. If the resin film 15 has sufficient flexibility even at room temperature, the shape of the resin film 15 may be changed only by the above suction without heating the resin film 15.

In this embodiment, as a means for heating the resin film 15 and a means for sucking the gas on the electronic component 13 side from the side of the mounting substrate 11 opposite to the electronic component 13, the same as in the first embodiment. The heating furnace 32 capable of reducing the pressure is used. However, other means may be used as the heating means or the gas suction means. Before inserting the electronic component 13, the mounting board 11, etc. into the heating furnace 32, it is desirable to insert at least the tip portion of the protruding portion 40B of the heat dissipation cap 40 into the insertion hole 43 of the resin film 15. .

Next, as shown in FIG. 23, the heating furnace 32
The mounting substrate 11 and the resin film 15 are heated by the heater 33 so that the temperature of the resin film 15 is equal to or higher than the temperature at which the resin film 15 is cured. As a result, the resin film 15 is made to have fluidity and then cured to bond the resin film 15 to the mounting substrate 11 and fix the shape of the resin film 15.

Next, as shown in FIG. 24, the mounting substrate 11 and the resin film 1 are cut at the cutting position indicated by reference numeral 41.
After cutting 5, the radiator plate 44 is attached to the tip end portion of the protruding portion 40B of the radiator cap 40 as required to complete each electronic device 10A. The tip edge of the protruding portion 40B of the heat dissipation cap 40 may be sharpened like a blade. With this configuration, when the resin film 15 is brought into close contact with the mounting substrate 11 and the heat dissipation cap 40 by suction of gas, the tip edge of the protruding portion 40B has the resin film 15.
Since there is no need to preliminarily form the insertion hole 43 in the resin film 15, it is possible to omit the step of providing the insertion hole 43 in the resin film 15 in advance.

Other configurations, operations and effects in this embodiment are the same as those in the first embodiment.

The present invention is not limited to the above-mentioned embodiments, and various modifications can be made. For example, the holes formed in the mounting board in order to suck the gas on the electronic part side from the side opposite to the electronic parts of the mounting board are not limited to the holes having other functions and applications such as through holes, but may be gas. It may be a hole provided exclusively for suction.

[0088]

As described above, the first to seventh aspects are as follows.
In any one of the electronic devices described above, the resin film is bonded to the mounting board while covering the electronic component, the mounting board, and the heat dissipation component. And by this resin film,
Mechanical connection between the connection electrode of the electronic component and the conductor pattern of the mounting board is reinforced. Further, the heat generated from the electronic component is radiated by the heat radiating component. Therefore, according to the present invention, with a simple structure, the mechanical connection strength and the connection stability between the connection electrode of the electronic component and the conductor pattern of the mounting board can be improved without affecting the operation of the electronic component. It is possible to reduce the adverse effect of heat generated by the electronic component.

According to the electronic device of the second aspect,
Since the electronic component is sealed by the resin film, it is possible to seal the electronic component with a simple configuration without affecting the operation of the electronic component.

According to the electronic device of the third aspect,
Since a space is formed between the one surface of the electronic component and the one surface of the mounting board, the operation of the electronic component may be affected by the contact of the one surface of the electronic component with another object. There is an effect that it can be prevented.

According to the electronic device of the fourth aspect,
The heat generated from the electronic component is guided from the electronic component to the surface of the mounting board opposite to the electronic component through the heat dissipation component, the conductive pattern, the through hole, and the conductor portion, so that the electronic component is generated. It is possible to further reduce the adverse effect of heat.

According to the electronic device of the fifth aspect,
The heat dissipation component has a protrusion, and this protrusion penetrates the resin film and protrudes to the opposite side of the resin film from the electronic component, that is, to the outside, so that heat can be released to the outside through this protrusion, and the electronic component It is possible to reliably reduce the adverse effect of heat generated by the heat generation.

Further, in the electronic device according to the sixth or seventh aspect, the shape of the resin film is obtained by sucking the gas on the electronic component side from the side opposite to the electronic component of the mounting substrate through the hole formed in the mounting substrate. Can be changed. Therefore, according to the present invention, it is possible to easily determine the shape of the resin film.

Further, in the electronic device according to the present invention, the hole formed in the mounting board is arranged in the peripheral portion of the area where the electronic component is arranged in the mounting board, and the hole is closed by the resin film. ing. Therefore, according to the present invention,
Even when the electronic component is sealed with the resin film, it is possible to reliably maintain the sealed state.

Further, in the method of manufacturing an electronic device according to any one of claims 8 to 16, the resin film is adhered to the mounting substrate while covering the electronic component, the mounting substrate and the heat dissipation component. The resin film reinforces the mechanical connection between the connection electrode of the electronic component and the conductor pattern of the mounting board. Further, the heat generated from the electronic component is radiated by the heat radiating component. Therefore, according to the present invention, the strength and mechanical stability of the mechanical connection between the connection electrode of the electronic component and the conductor pattern of the mounting board can be improved in a simple process without affecting the operation of the electronic component. It is possible to reduce the adverse effect of heat generated by the electronic component.

According to the method of manufacturing an electronic device according to the ninth aspect, since the electronic component is sealed with the resin film, the electronic component can be manufactured in a simple process without affecting the operation of the electronic component. The effect that it can be sealed is exhibited.

According to the method of manufacturing an electronic device of the tenth aspect, since a space is formed between one surface of the electronic component and one surface of the mounting substrate, one surface of the electronic component is It is possible to prevent the operation of the electronic component from being affected by coming into contact with another object.

According to the manufacturing method of the electronic device of the eleventh aspect, the heat generated from the electronic component is
Since the electronic component is guided to the surface of the mounting substrate opposite to the electronic component through the conductive pattern, the through hole, and the conductor portion, the adverse effect of heat generated by the electronic component can be further reduced. Play.

According to the method of manufacturing an electronic device according to the twelfth aspect, the heat dissipation component has a protrusion, and the protrusion penetrates the resin film, that is, the side opposite to the electronic component of the resin film, that is, Since it projects outward, heat can be released to the outside through this projecting portion, and the adverse effect of heat generated by the electronic component can be reliably reduced.

According to the electronic device manufacturing method of any of claims 13 to 15, the gas on the electronic component side is sucked from the side opposite to the electronic component of the mounting substrate through the hole formed in the mounting substrate. By doing so, the shape of the resin film is changed, so that the shape of the resin film can be easily determined.

According to the method of manufacturing an electronic device of the fourteenth aspect, the hole formed in the mounting board is arranged in the peripheral portion of the area where the electronic component is arranged in the mounting board, and the hole is made of resin. Since the resin film is used to close the film in the step of adhering the film, it is possible to reliably maintain the sealed state even when the electronic component is sealed with the resin film.

According to the electronic device manufacturing method of the fifteenth aspect, the step of changing the shape of the resin film comprises:
Since the shape of the resin film is changed while the resin film is softened, it is possible to easily determine the shape of the resin film.

According to the electronic device of the sixteenth aspect, in the step of resin-fill-adhering, the resin film is heated to make the resin film fluid, and then the resin film is cured, whereby the resin film is cured. Since the film is adhered to the mounting board, there is an effect that the strength of mechanical bonding and the stability of bonding between the connection electrode of the electronic component and the conductor pattern of the mounting board can be more reliably improved.

[Brief description of drawings]

FIG. 1 is a sectional view of an electronic device according to a first embodiment of the present invention.

FIG. 2 is an explanatory view conceptually showing an example of characteristics of the resin film used in the first embodiment of the present invention.

FIG. 3 is a cross-sectional view showing an example of a conventional joining method for comparison with the first embodiment of the present invention.

FIG. 4 is a cross-sectional view showing another example of a conventional joining method for comparison with the first embodiment of the present invention.

FIG. 5 is a cross-sectional view showing still another example of the conventional joining method for comparison with the first embodiment of the present invention.

FIG. 6 is a cross-sectional view showing an example of a joining method according to the first embodiment of the present invention.

FIG. 7 is a cross-sectional view showing another example of the joining method according to the first embodiment of the present invention.

FIG. 8 is a sectional view showing still another example of the joining method according to the first embodiment of the present invention.

FIG. 9 is a plan view showing an example of a surface acoustic wave element as an electronic component according to the first embodiment of the invention.

FIG. 10 is a plan view showing one surface of an example of the mounting board according to the first embodiment of the invention.

FIG. 11 is a bottom view showing the other surface of the example of the mounting board according to the first embodiment of the invention.

FIG. 12 is a perspective view showing a heat dissipation cap according to the first embodiment of the invention.

FIG. 13 is an explanatory diagram showing a step of the method of manufacturing the electronic device according to the first embodiment of the invention.

FIG. 14 is an explanatory diagram showing a step that follows the step shown in the step shown in FIG. 13.

FIG. 15 is an explanatory diagram showing a step that follows the step shown in FIG.

16 is an explanatory diagram showing a step that follows the step shown in FIG.

FIG. 17 is a plan view showing a mounting substrate, an electronic component, and a resin film before the cutting step shown in FIG.

FIG. 18 is a sectional view of an electronic device according to a second embodiment of the present invention.

FIG. 19 is a plan view showing a heat dissipation cap according to a second embodiment of the present invention.

20 is a cross-sectional view of the heat dissipation cap shown in FIG.

FIG. 21 is an explanatory diagram showing a step of a method of manufacturing the electronic device according to the second embodiment of the invention.

22 is an explanatory diagram showing a step that follows the step shown in FIG.

23 is an explanatory diagram showing a step that follows the step shown in FIG.

FIG. 24 is an explanatory diagram showing a step that follows the step shown in FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Electronic device, 11 ... Mounting board, 12 ... Conductor pattern, 13 ... Electronic component, 14 ... Connection electrode, 15 ... Resin film, 16 ... Space, 29 ... Conductor part, 30, 40 ... Heat dissipation cap, 31 ... Through hole , 40B ... Projection.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 7/20 H01L 23/36 A 5F061 F term (reference) 4M109 AA01 BA03 CA26 DB04 DB17 EE05 GA05 5E314 AA24 BB01 BB11 CC15 FF01 FF21 GG01 GG11 GG19 GG26 5E322 AA03 AA11 BA01 BA05 5E336 AA04 AA16 CC31 DD28 DD32 EE01 EE17 GG03 GG16 5F036 AA01 BB01 BE01 5F061 AA01 BA03 CA26 FA05

Claims (16)

[Claims] 1. A mounting board having a conductor pattern exposed on one surface and a connection electrode on one surface, and the surface having the connection electrode is arranged so as to face one surface of the mounting board. An electronic component in which the connection electrode is electrically connected to and mechanically joined to a conductor pattern of the mounting substrate; and a heat dissipation component that comes into contact with the electronic component and radiates heat generated from the electronic component, An electronic device, comprising: a resin film that covers an electronic component, a mounting board, and a heat dissipation component, and is adhered to the mounting board. 2. The electronic device according to claim 1, wherein the resin film seals the electronic component. 3. The electronic device according to claim 1, wherein a space is formed between one surface of the electronic component and one surface of the mounting board. 4. The mounting board has a conductor portion provided on the other surface of the mounting board, and a through hole for electrically connecting the conductor portion and the conductor pattern to each other. The electronic device according to claim 1, wherein is in contact with the conductor pattern. 5. The heat dissipation component according to claim 1, further comprising a protrusion that penetrates through the resin film and protrudes on a side of the resin film opposite to the electronic component. Electronic device. 6. The mounting board has a hole used for determining the shape of the resin film by sucking gas on the electronic part side from the side opposite to the electronic part of the mounting board. The electronic device according to claim 1. 7. The hole of the mounting board is arranged in a peripheral portion of a region where electronic parts are arranged in the mounting board, and the hole is closed by the resin film. Electronic device as described. 8. A mounting board having a conductor pattern exposed on one surface and a connection electrode on one surface, and the surface having the connection electrode is arranged so as to face one surface of the mounting board. A method for manufacturing an electronic device, comprising: an electronic component in which the connection electrode is electrically connected to a conductor pattern of the mounting substrate and is mechanically joined, wherein one surface of the electronic component is the mounting substrate. So as to face one surface, the step of arranging the electronic component and the mounting substrate, electrically connecting the connection electrode of the electronic component to the conductor pattern of the mounting substrate and mechanically joining, A heat dissipation component that dissipates the heat generated from electronic parts
An electronic device comprising: a step of placing the resin film in contact with the electronic component; and a step of placing a resin film so as to cover the electronic component, the mounting board and the heat dissipation component and adhering the resin film to the mounting board. Device manufacturing method. 9. The method of manufacturing an electronic device according to claim 8, wherein the resin film seals the electronic component. 10. The method of manufacturing an electronic device according to claim 8, wherein a space is formed between one surface of the electronic component and one surface of the mounting substrate. 11. The heat dissipation component, wherein the mounting board has a conductor portion provided on the other surface of the mounting board and a through hole for electrically connecting the conductor portion and the conductor pattern. 11. The step of arranging a heat-dissipating component contacts the conductor pattern with the heat-radiating component.
A method of manufacturing an electronic device according to any one of 1. 12. The heat dissipation component has a protrusion that protrudes to the side opposite to the electronic component, and in the step of disposing and adhering the resin film, the protrusion penetrates the resin film, 11. The method for manufacturing an electronic device according to claim 8, wherein the resin film is projected on a side opposite to the side where the electronic component is provided. 13. The step of arranging and adhering the resin film comprises sucking gas on the electronic component side from a side of the mounting substrate opposite to the electronic component through a hole formed in the mounting substrate. 9. The step of changing the shape of the resin film so that the resin adheres to the electronic component, the mounting board and the heat dissipation component is included.
13. The method for manufacturing an electronic device according to any one of 1 to 12. 14. The holes formed in the mounting board are arranged in a peripheral portion of a region where electronic components are arranged in the mounting board, and the holes are closed by a resin film in a step of disposing and adhering the resin film. 14. The method for manufacturing an electronic device according to claim 13, wherein the method is performed. 15. The step of changing the shape of the resin film comprises changing the shape of the resin film in a softened state of the resin film.
Or the method for manufacturing an electronic device according to 14. 16. The step of disposing and adhering the resin film comprises heating the resin film so that the resin film has fluidity and then curing the resin film to thereby mount the resin film on a mounting substrate. 16. The method of manufacturing an electronic device according to claim 8, wherein the electronic device is adhered.