JP2002314234A - Electronic device and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the strength of a mechanical connection of the connecting electrode of an electronic component to the conductor pattern of a flexible board or stability of the connection without imparting the influence to the operation of the component with a simple constitution and simple steps and to reduce in size, weight and thickness of the electronic device. SOLUTION: The electronic device 10 comprises the flexible board 11 having a conductor pattern 12 exposed at one surface 11a; the electronic component 13 having the connecting electrode 14 on the one surface 13a in such a manner that the surface 13a is disposed oppositely to the surface 11a of the board 11, and the electrode 14 is electrically connected to the pattern 12 and mechanically connected thereto; and a resin film 15 covering the component 13 and the board 11 so as to be closely contacted with the surface 13b of the opposite side to the board 11 of the component 13 and to be adhered to the board 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having a mounting board and electronic components mounted on the mounting board, and a method of manufacturing the same.

[0002]

2. Description of the Related Art A surface acoustic wave device is one in which a comb-shaped electrode is formed on one surface of a piezoelectric substrate. This surface acoustic wave element is widely used as a filter in a mobile communication device such as a mobile phone.

[0003] By the way, electronic components such as semiconductor components are mounted on a mounting substrate, connection electrodes of the electronic component are electrically connected to conductor patterns of the mounting substrate, and connection electrodes of the electronic component are connected to the mounting substrate. Is often used in the form of a package having a structure in which an electrical connection with the conductive pattern is sealed. The same applies when the electronic component is a surface acoustic wave element. In the present application, a device including a mounting board and electronic components mounted on the mounting board is referred to as an electronic device.

In an electronic device, a method of electrically connecting a connection electrode of an electronic component to a conductor pattern of a mounting board is roughly divided into a method of arranging the electronic component such that a surface of the electronic component having the connection electrode faces the mounting board. Face-down bonding, and face-up bonding in which electronic components are arranged such that the surface of the electronic component having connection electrodes faces the opposite side to the mounting substrate. To reduce the size of electronic devices,
Face-down bonding is more advantageous.

In a conventional method of manufacturing an electronic device employing face-down bonding, a connection electrode of an electronic component is electrically connected to a conductor pattern of a mounting substrate, and then an underfill material is provided between the electronic component and the mounting substrate. To seal the electrical connection between the connection electrode of the electronic component and the conductor pattern of the mounting board.

However, when the electronic component is a surface acoustic wave device, there is a problem peculiar to the surface acoustic wave device, so that the above-described general method is not used. The problem peculiar to the surface acoustic wave element is that, in the surface acoustic wave element, a comb-shaped electrode is formed on the surface thereof, and the surface acoustic wave element is sealed so that foreign substances such as moisture and dust do not adhere to the comb-shaped electrode. On the other hand, it is necessary to prevent sealing resin or the like from contacting the surface acoustic wave propagation region on the surface of the surface acoustic wave element so as not to affect the operation of the surface acoustic wave element. That is.

Therefore, conventionally, as a method of manufacturing an electronic device when the electronic component is a surface acoustic wave element,
For example, after the connection electrode of the surface acoustic wave element is electrically connected to the conductor pattern of the mounting board, the surface acoustic wave element is sealed with a structure such as a cap made of ceramic or metal. The method was used. As another method of manufacturing an electronic device when the electronic component is a surface acoustic wave element, after electrically connecting a connection electrode of the surface acoustic wave element and a conductor pattern of a mounting board, the periphery of the surface acoustic wave element is removed. There is a method in which sealing is performed by surrounding with a sidefill material.

Conventionally, a ceramic substrate, a hard printed substrate, or the like has been used as a mounting substrate.

[0009]

In a method of manufacturing an electronic device in which an electronic component is a surface acoustic wave element, a method of enclosing a surface acoustic wave element with a structure such as a cap and sealing the electronic device is not an electronic device. There is a problem that it is difficult to reduce the size, weight, and thickness of the device. Further, in this method, the structure does not contribute to mechanical joining between the connection electrode of the surface acoustic wave element and the conductor pattern of the mounting board. However, there is a problem that it is not possible to improve the mechanical joining strength and joining stability of the above.

In a method of manufacturing an electronic device in which the electronic component is a surface acoustic wave element, a method of encapsulating a surface acoustic wave element by surrounding the surface acoustic wave element with a side-fill material,
There is a problem that the sidefill material may enter the surface acoustic wave propagation region on the surface of the surface acoustic wave element.

In addition to the surface acoustic wave element, even when the electronic component is a vibrator or a high-frequency circuit component, if the sealing resin or the like contacts the surface of the electronic component, the operation of the electronic component is affected. There is. Therefore, the above problem is not limited to the case where the electronic component is a surface acoustic wave element, but also applies, for example, to the case where the electronic component is a vibrator or a high-frequency circuit component.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and a first object of the present invention is to provide an electronic device having a mounting board and electronic components mounted on the mounting board, and having a simple configuration. Therefore, without affecting the operation of the electronic component, it is possible to improve the mechanical bonding strength and bonding stability between the connection electrode of the electronic component and the conductor pattern of the mounting board,
Another object of the present invention is to provide an electronic device that can be reduced in size, weight, and thickness.

A second object of the present invention is to provide an electronic device capable of sealing an electronic component with a simple structure without affecting the operation of the electronic component, in addition to the first object. Is to provide.

A third object of the present invention is a method of manufacturing an electronic device including a mounting board and an electronic component mounted on the mounting board. Without providing, it is possible to improve the mechanical bonding strength and bonding stability between the connection electrode of the electronic component and the conductor pattern of the mounting board, and to make the electronic device smaller, lighter and thinner. To provide a method for manufacturing an electronic device.

A fourth object of the present invention is to provide an electronic device capable of sealing an electronic component by a simple process without affecting the operation of the electronic component, in addition to the third object. It is to provide a manufacturing method of.

[0016]

An electronic device according to the present invention has a flexible substrate as a mounting substrate having a conductor pattern exposed on one surface, a connection electrode on one surface, and a surface having the connection electrode. Is disposed so as to face one surface of the flexible substrate, and the connection electrode is electrically connected to the conductor pattern of the flexible substrate and is mechanically joined to the electronic component. The electronic component and the flexible substrate are covered so as to be in close contact with the surface, and a resin film adhered to the flexible substrate is provided.

In the electronic device of the present invention, the resin film is
The electronic component and the flexible substrate are covered so as to be in close contact with the surface of the electronic component opposite to the flexible substrate, and are bonded to the flexible substrate. The resin film reinforces the mechanical connection between the connection electrode of the electronic component and the conductor pattern of the flexible board.

In the electronic device of the present invention, the resin film may seal the electronic component. In the electronic device of the present invention, a space may be formed between one surface of the electronic component and one surface of the flexible substrate.

Further, in the electronic device of the present invention, the flexible substrate has a hole used to determine the shape of the resin film by sucking gas from the electronic component side from the side opposite to the electronic component of the flexible substrate. It may be.

According to a method of manufacturing an electronic device of the present invention, a flexible substrate as a mounting substrate having a conductor pattern exposed on one surface and a connection electrode on one surface, and the surface having the connection electrode is a flexible substrate A method of manufacturing an electronic device, comprising: an electronic component disposed so as to face one surface of the electronic device, the connection electrode being electrically connected to the conductor pattern of the flexible substrate, and being mechanically joined. The electronic component and the flexible substrate are arranged such that one surface of the flexible substrate faces one surface of the flexible substrate, and the connection electrodes of the electronic component are electrically connected to the conductor pattern of the flexible substrate and mechanically joined. Process and disposing a resin film in close contact with the surface of the electronic component opposite to the flexible substrate to cover the electronic component and the flexible substrate And extent, is obtained and a step of bonding a resin film to a flexible substrate.

In the method of manufacturing an electronic device according to the present invention, the resin film covers the electronic component and the flexible substrate so as to be in close contact with the surface of the electronic component opposite to the flexible substrate, and is bonded to the flexible substrate. The resin film reinforces the mechanical connection between the connection electrode of the electronic component and the conductor pattern of the flexible board.

In the method of manufacturing an electronic device according to the present invention, the resin film may seal the electronic component. In the method for manufacturing an electronic device according to the present invention, a space may be formed between one surface of the electronic component and one surface of the flexible substrate.

In the method of manufacturing an electronic device according to the present invention, the step of disposing the resin film includes sucking a gas on the electronic component side from a side of the flexible substrate opposite to the electronic component through a hole formed in the flexible substrate. Thereby, the shape of the resin film is such that the resin film adheres to the surface of the electronic component opposite to the flexible substrate and to one surface of the flexible substrate in a peripheral portion of the electronic component to cover the electronic component and the flexible substrate. May be included.

In the method of manufacturing an electronic device according to the present invention, in each step, the flexible substrate may be placed on a support member having a flat upper surface.

[0025]

Embodiments of the present invention will be described below in detail with reference to the drawings. [First Embodiment] First, a configuration of an electronic device according to a first embodiment of the present invention will be described with reference to FIG. Electronic device 10 according to the present embodiment has one surface 11
a, a flexible substrate 11 having a conductor pattern 12 exposed at
The surface 13 a having the connection electrode 14 is disposed so as to face one surface 11 a of the flexible substrate 11, and the connection electrode 14 is electrically connected to the conductor pattern 12 of the flexible substrate 11 and mechanically The bonded electronic component 13, the electronic component 13 and the flexible board 11 are so adhered to a surface 13 b of the electronic component 13 on the side opposite to the flexible board 11 and one surface 11 a of the flexible board 11 in a peripheral portion of the electronic component 13. Cover the substrate 11,
A resin film 15 bonded to the flexible substrate 11.

The base of the flexible substrate 11 is formed of a resin and has flexibility. The thickness of the flexible substrate 11 is, for example, 30 to 100 μm. The electronic component 13 is, for example, a surface acoustic wave element, a vibrator, a high-frequency circuit component, or the like, but may be another electronic component. As described above, the electronic component 13 is mounted on the flexible substrate 11 by face-down bonding in which the surface 13 a having the connection electrode 14 faces the flexible substrate 11. One surface 13 of electronic component 13
A space 16 is formed between a and the one surface 11 a of the flexible substrate 11.

The surface 13b of the electronic component 13 on the side opposite to the flexible substrate 11 is covered with the resin film 15 without any gap. One surface 11 of the flexible substrate 11
The part around a of the electronic component 13 in the area a is also covered with the resin film 15 without any gap. The resin film 15 seals the entire electronic component 13 including the electrical connection between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the flexible substrate 11.

The resin film 15 is made of, for example, a thermosetting resin such as an epoxy resin. The thickness of the resin film 15 is, for example, 50 to 150 μm.

Next, an outline of a method of manufacturing the electronic device 10 according to the present embodiment will be described. In the method of manufacturing the electronic device 10, the electronic component 13 and the flexible substrate 11 are arranged so that the one surface 13 a of the electronic component 13 faces the one surface 11 a of the flexible substrate 11, and the connection electrodes of the electronic component 13 are connected. 14 is electrically connected to the conductor pattern 12 of the flexible substrate 11 and mechanically joined, and the surface 13b of the electronic component 13 on the side opposite to the flexible substrate 11 and the flexible substrate 11 on the peripheral portion of the electronic component 13 Electronic component 1 in close contact with one surface 11a of the
3 and a step of arranging the resin film 15 so as to cover the flexible substrate 11 and bonding the resin film 15 to the flexible substrate 11. Each of the above steps is performed by placing the flexible substrate 11 on a support member having a flat upper surface.

Next, an example of characteristics of the resin film 15 used in the present embodiment will be conceptually described with reference to FIG. In FIG. 2, white circles and solid lines indicate the correspondence between the temperature of the resin film 15 and the length in an arbitrary direction. In FIG. 2, black circles and broken lines indicate BT for comparison with the characteristics of the resin film 15.
(Bismaleimide triazine) Shows the correspondence between the temperature and the length in an arbitrary direction in a resin whose shape is stable against a temperature change such as a resin. As shown by reference numeral 110, the length of the resin whose shape is stable with respect to the temperature change changes almost linearly with the temperature change.

When the temperature of the resin film 15 is room temperature (room temperature) RT, the film shape is maintained. As indicated by reference numeral 101, when the temperature of the resin film 15 is increased from the room temperature RT to the glass transition temperature TG, the resin film 15 gradually softens and changes in length almost linearly with the temperature change. Inflate to do. Code 10
As shown by 2, as the temperature of the resin film 15 is raised from the glass transition temperature TG to the curing start temperature HT, the resin film 15 becomes fluid and expands rapidly. As indicated by reference numeral 103, when the temperature of the resin film 15 is equal to or higher than the curing start temperature HT, the resin film 15 starts to cure. When the curing of the resin film 15 is completed, the resin film 15 contracts as indicated by reference numeral 104. At this time, a force in the contracting direction (hereinafter, referred to as a contracting force) is generated in the resin film 15. After the curing of the resin film 15 is completed, as indicated by reference numeral 105, the resin film 15
The shape is stable against temperature changes without softening or fluidity. The curing start temperature HT varies depending on the characteristics of the resin film 15;
The temperature is about 00 ° C., which is around 150 ° C. in the case of the resin film 15 formed using an epoxy resin. Also,
The time required from the start of the curing of the resin film 15 to the end of the curing also varies depending on the characteristics of the resin film 15.

The characteristics of the resin film 15 shown in FIG. 2 are conceptual only. So, for example,
If the amount of temperature change per unit time changes, resin film 1
5 also changes.

In the method for manufacturing the electronic device 10 according to the present embodiment, for example, the resin film 15 is softened by increasing the temperature of the resin film 15 so that the resin film 15 is Opposite side 1
The shape of the resin film 15 is changed so that the electronic component 13 and the flexible substrate 11 are covered with the uniform contact with the surface 3 a and the one surface 11 a of the flexible substrate 11 around the electronic component 13. Thereafter, the temperature of the resin film 15 is further increased so that the resin film 15 has fluidity, and then the resin film 15 is cured, so that the resin film 15 is
And the shape of the resin film 15 is fixed. When the resin film 15 is cured, a contraction force is generated as described above. The contraction force of the resin film 15 is
It acts to press the electronic component 13 against the flexible substrate 11 side. Thereby, the connection electrode 1 of the electronic component 13
The mechanical connection between the conductor pattern 4 and the conductor pattern 12 of the flexible substrate 11 is more reliably reinforced. In addition, as the resin film 15 shrinks, the resin film 15 more closely adheres to the electronic component 13 and the flexible substrate 11.

If the resin film 15 has sufficient flexibility even at room temperature, the resin film
5 may be deformed to determine its shape, and then the resin film 15 may be cured by increasing the temperature of the resin film 15.

In a state where the resin film 15 is softened at a temperature equal to or lower than the glass transition temperature, the resin film 1
After determining the shape of the resin film 5, the resin film 15 may be cured over a relatively long time at a temperature equal to or lower than the glass transition temperature.

When the resin film 15 is formed of a resin that is softened by ultraviolet rays, instead of increasing the temperature of the resin film 15 to soften the resin film 15, the resin film 15 is irradiated with ultraviolet rays to be softened. The film 15 may be softened. Alternatively, the resin film 15 may be softened by irradiating the resin film 15 with ultraviolet rays while increasing the temperature of the resin film 15.

When the resin film 15 is formed of a resin which is cured by ultraviolet rays, instead of raising the temperature of the resin film 15 to cure the resin film 15, the resin film 15 is irradiated with ultraviolet rays to cure the resin film. The film 15 may be cured. Alternatively, the resin film 15 may be cured by increasing the temperature of the resin film 15 and irradiating the resin film 15 with ultraviolet rays.

In the present embodiment, the resin film 1
Flexible substrate 11 when softening or curing
The material for the flexible substrate 11, the material for the resin film 15, the temperature for softening the resin film 15, and the temperature for curing the resin film 15 are selected so that the resin film 15 is not deformed.

In the present embodiment, various methods can be used for the method of electrical connection and mechanical connection between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the flexible board 11. Hereinafter, several examples of a method of electrical connection and a mechanical connection (hereinafter, simply referred to as a bonding method) between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the flexible substrate 11 will be described.

First, with reference to FIGS. 3 to 5, an example of a conventional method of joining a connection electrode of an electronic component to a conductor pattern of a mounting board will be described for comparison with the present embodiment. 3 to 5, the electrical connection and the mechanical connection between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the mounting board 111 are illustrated larger than other portions.

In the example shown in FIG. 3, a bump 14A made of, for example, gold connected to the conductor pattern 17 of the electronic component 13 is provided as the connection electrode 14 of the electronic component 13. On the other hand, the conductor pattern 12
Is provided, for example, a connection portion 12A made of gold. In this example, the bump 14A and the connecting portion 12A are metal-bonded, so that the bump 14A and the connecting portion 12A are connected.
A is electrically connected and mechanically joined.

In the example shown in FIG. 4, as the connection electrode 14 of the electronic component 13, a bump 14B made of, for example, gold connected to the conductor pattern 17 of the electronic component 13 is provided. On the other hand, the conductor pattern 12
Is provided, for example, a connection portion 12A made of gold. In this example, the bump 14B and the connecting portion 12A
Are electrically connected by the conductive paste 18.
Thereafter, the space between the electronic component 13 and the mounting board 111 is filled with the underfill material 19.
9, the bump 14B and the conductive paste 1
8 and the mechanical connection of the connecting portion 12A are stably secured.

In the example shown in FIG. 5, a bump 14A made of, for example, gold connected to the conductor pattern 17 of the electronic component 13 is provided as the connection electrode 14 of the electronic component 13. On the other hand, the conductor pattern 12
Is provided, for example, a connection portion 12A made of gold. In this example, the bumps 14A and the connection portions 12A are arranged so as to be in contact with each other, and
A and the connection portion 12A are electrically connected. Bump 14A
Non-conductive or anisotropic conductive bonding paste 20 is injected between electronic component 13 and mounting substrate 111 around connection portion 12A. And the mechanical joining of the bump 14A and the connection part 12A is stably ensured by the shrinking force of the joining paste 20.

Next, an example of the joining method according to the present embodiment will be described with reference to FIGS. In addition,
6 to 8, the electrical connection and the mechanical connection between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the flexible substrate 11 are illustrated larger than other portions. Further, the flexible substrate 11 is placed on a support member 51 having a flat upper surface.

In the example shown in FIG. 6, as in the example shown in FIG.
A bump 14A made of, for example, gold and connected to the third conductor pattern 17 is provided. On the other hand, on the flexible substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. Bump 14
A and the connecting portion 12A are metal-joined, whereby the bump 14A and the connecting portion 12A are electrically connected and mechanically joined. In this example, the resin film 15 of the present embodiment is further provided. The contraction of the resin film 15 reinforces the mechanical connection between the bump 14A and the connecting portion 12A.

In the example shown in FIG. 7, as in the example shown in FIG.
A bump 14B made of, for example, gold, which is connected to the third conductor pattern 17 is provided. On the other hand, on the flexible substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. Bump 14
B and the connection portion 12A are electrically connected by the conductive paste 18. In this example, the resin film 15 of the present embodiment is further provided. Then, the resin film 15 is used without using the underfill material 19.
14B, the conductive paste 18
And the mechanical joining of the connection part 12A is stably ensured.

In the example shown in FIG. 8, as in the example shown in FIG.
A bump 14A made of, for example, gold and connected to the third conductor pattern 17 is provided. On the other hand, on the flexible substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. Bump 14
A and the connecting portion 12A are arranged so as to be in contact with each other, whereby the bump 14A and the connecting portion 12A are electrically connected. A non-conductive or anisotropic conductive bonding paste 20 is injected between the electronic component 13 and the flexible substrate 11 around the bumps 14A and the connection portions 12A. And the mechanical joining of the bump 14A and the connection part 12A is stably ensured by the shrinking force of the joining paste 20. In this example, the resin film 15 of the present embodiment is further provided. The contraction of the resin film 15 reinforces the mechanical connection between the bump 14A and the connecting portion 12A.

The bonding method in the present embodiment is as follows.
The bonding method is not limited to those shown in FIGS. 6 to 8, and most of the conventional bonding methods in face-down bonding can be used.

Next, an example of the surface acoustic wave element 13A as the electronic component 13 will be described with reference to FIG. The surface acoustic wave element 13A shown in FIG.
Comb-shaped electrode 22 formed on one surface of this piezoelectric substrate 21
And a conductor pattern 23 and a connection electrode 24 formed at an end of the conductor pattern 23. Connection electrode 24
Corresponds to the connection electrode 14 in FIG. The surface acoustic wave element 13A is an element that uses a surface acoustic wave generated by the comb-shaped electrode 22 for a basic operation, and has a function as a bandpass filter in the present embodiment.

In FIG. 9, the connection electrode 24 labeled "IN" is an input terminal, the connection electrode 24 labeled "OUT" is an output terminal, and the connection electrode 24 labeled "GND" This is a ground terminal. Also, in FIG.
An area surrounded by a broken line indicated by reference numeral 25 is an area including the surface acoustic wave propagation area and in which it is necessary to prevent a sealing material or the like from entering inside.

Next, a method of manufacturing the electronic device 10 according to the present embodiment will be described in detail with reference to FIGS. In the present embodiment, the electronic devices 10 may be manufactured one by one, or a plurality of electronic devices 10 may be manufactured simultaneously. Hereinafter, a case where a plurality of electronic devices 10 are manufactured at the same time will be described.

In the method of manufacturing an electronic device according to the present embodiment, first, as shown in FIG.
The flexible substrate 11 is placed on a supporting member 51 having a flat upper surface such that one surface 11a of the flexible substrate 11 faces upward. Next, the electronic component 13 is arranged on the flexible substrate 11 such that one surface 13a of the electronic component 13 faces the one surface 11a of the flexible substrate 11, and the connection electrodes 14 of the electronic component 13 are connected to the flexible substrate 11. Electrically connected and mechanically bonded to the conductive pattern 12. Next, a resin film 15 formed in substantially the same planar shape as the shape of the one surface 11 a of the flexible substrate 11 is disposed so as to cover the electronic component 13 and the flexible substrate 11.

The flexible substrate 1 shown in FIG.
1 includes parts corresponding to a plurality of electronic components 13. Then, a plurality of electronic components 13 are arranged on the flexible substrate 11. Further, in the present embodiment, a plurality of holes 31 are formed in the flexible substrate 11 in a peripheral portion of a region where each electronic component 13 is arranged. The holes 31 may be provided, for example, at two locations on the opposite side of the electronic component 13 or at four locations outside the four sides of the electronic component 13. The supporting member 51 includes a flexible substrate 1.
A hole 52 is provided at a position corresponding to one hole 31.

Next, as shown in FIG. 11, the resin film 15 is heated so that the resin film 15 is softened.
Of the electronic component 1 of the flexible substrate 11 through the hole 31 of
The gas on the electronic component 13 side is sucked from the side opposite to 3. The gas referred to here is air, nitrogen gas, inert gas, or the like, although it differs depending on the atmosphere in which the processing is performed. As a result, the resin film 15 uniformly adheres to the surface 13b of the electronic component 13 on the side opposite to the flexible substrate 11 and to one surface 11a of the flexible substrate 11 in a peripheral portion of the electronic component 13, and the electronic component 13 and the flexible Substrate 1
1 is changed so that the shape of the resin film 15 is changed. At this time, the temperature of the resin film 15 is set lower than the temperature at which the resin film 15 cures. As described above, the gas on the electronic component 13 side is sucked from the side opposite to the electronic component 13 of the flexible substrate 11 through the hole 31 of the flexible substrate 11 to change the shape of the resin film 15, thereby changing the shape of the resin film 15. Can be easily determined. Further, by changing the shape of the resin film 15 in a state where the resin film 15 is softened, the shape of the resin film 15 can be more easily determined. When the resin film 15 has sufficient flexibility even at room temperature, the shape of the resin film 15 may be changed only by the above-mentioned suction without heating the resin film 15.

When the resin film 15 is formed of a resin that is softened by ultraviolet rays, instead of raising the temperature of the resin film 15 to soften the resin film 15, the resin film 15 is irradiated with ultraviolet rays to be softened. The film 15 may be softened. Alternatively, the resin film 15 may be softened by irradiating the resin film 15 with ultraviolet rays while increasing the temperature of the resin film 15.

In this embodiment, the means for heating the resin film 15 and the electronic parts 13 of the flexible substrate 11
As a means for sucking the gas on the electronic component 13 side from the opposite side, a heating furnace 32 capable of reducing pressure is used. However, other means may be used as the heating means or the gas suction means. The heating furnace 32 has a heater 33 on which the support member 51 is placed. The heater 33 heats the flexible substrate 11 and the resin film 15 via the support member 51. The heater 33 has a hole 34 communicating with the hole 31 of the flexible substrate 11 and the hole 52 of the support member 51. When the gas inside the heating furnace 32 is exhausted and the inside of the heating furnace 32 is depressurized, the gas on the electronic component 13 side is sucked from the side of the flexible substrate 11 opposite to the electronic component 13 through the holes 34, 52, 31.

Next, as shown in FIG.
3, the flexible substrate 11 and the resin film 1
5 is heated so that the temperature of the resin film 15 is equal to or higher than the temperature at which the resin film 15 cures. Thus, after the resin film 15 is made to have fluidity, it is cured, and the resin film 15 is bonded to the flexible substrate 11 and the shape of the resin film 15 is fixed.

When the resin film 15 is formed of a resin that is cured by ultraviolet rays, instead of raising the temperature of the resin film 15 to cure the resin film 15, the resin film 15 is irradiated with ultraviolet rays to cure the resin film. The film 15 may be cured. Alternatively, the resin film 15 may be cured by increasing the temperature of the resin film 15 and irradiating the resin film 15 with ultraviolet rays.

Next, as shown in FIG. 13, the integrated flexible substrate 11, the electronic component 13 and the resin film 15 are removed from the support member 51, and the flexible substrate 11 and the resin The film 15 is cut to complete the individual electronic devices 10.
FIG. 14 shows the flexible substrate 11, the electronic component 13, and the resin film 15 before the cutting step shown in FIG.
FIG. The manufacturing method for manufacturing the electronic devices 10 one by one is described in the above-mentioned flexible substrate 11.
This is the same as the case where a plurality of electronic devices 10 are manufactured at the same time, except that the step of cutting the resin film 15 becomes unnecessary.

As described above, in the electronic device 10 and the method of manufacturing the same according to the present embodiment, the resin film 1
5 covers the electronic component 13 and the flexible substrate 11 so as to be in close contact with a surface 13b of the electronic component 13 opposite to the flexible substrate 11 and one surface 11a of the flexible substrate 11 in a peripheral portion of the electronic component 13. It is adhered to the flexible substrate 11. The resin film 15 reinforces the mechanical connection between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the flexible board 11. In the present embodiment, the space between the electronic component 13 and the flexible substrate 11 is not filled with the underfill material. Therefore, according to the present embodiment, the mechanical connection between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the flexible board 11 is performed with a simple configuration and a simple process without affecting the operation of the electronic component 13. It is possible to improve the bonding strength and the bonding stability.

In particular, in the step of bonding the resin film 15, the resin film 15 is heated to
When the resin film 15 is adhered to the flexible substrate 11 by curing the resin film 15 after the resin film 5 has fluidity, the contraction force of the resin film 15 at the time of curing causes the electronic component 13 to harden. The mechanical bonding strength and bonding stability between the connection electrode 14 and the conductive pattern 12 of the flexible substrate 11 can be more reliably improved.

According to the present embodiment, since the electronic component 13 is sealed with the resin film 15, the operation of the electronic component 13 is not affected by the simple configuration and the simple process without affecting the operation of the electronic component 13. 13 can be sealed. Thereby, the resistance of the electronic device 10 to the environment and the like can be secured.

In this embodiment, the flexible substrate 11
The hole 31 of the resin film 15
In the step of bonding, the resin film 15 is closed, so that the sealed state can be reliably maintained without closing the hole 31.

In FIG. 13, the flexible substrate 11 and the resin film 15 are cut so that the holes 31 remain in the flexible substrate 11 in each electronic device 10. However, the flexible substrate 11 and the resin film 15 are cut at a position closer to the electronic component 13 than the hole 31, and the flexible substrate 11 in each electronic device 10 is cut.
Hole 31 may not be left in the hole.

According to the present embodiment, the electronic component 1
Since the space 16 is formed between the one surface 13a of the electronic component 13 and the one surface 11a of the flexible substrate 11, the one surface 13a of the electronic component 13 comes into contact with another object, whereby the operation of the electronic component 13 is performed. Can be prevented from being affected. This is particularly effective when the electronic component 13 is a surface acoustic wave element, a vibrator, or a high-frequency circuit component.

From the above, according to the present embodiment, the reliability of the electronic device 10 can be improved.

According to the present embodiment, the electronic component 1
3 is covered with a resin film 15 to seal the electronic component 13, and the flexible substrate 11 is used as a mounting substrate.
The electronic device 10 can be made smaller, lighter, and thinner than when the electronic component 13 is sealed using a structure such as a cap.

Further, according to the present embodiment, since the electronic component 13 is sealed using the resin film 15, the above-described effects can be obtained at low cost.

Further, according to the method of manufacturing electronic device 10 according to the present embodiment, in each step, flexible substrate 11 is placed on support member 51 having a flat upper surface. In a stable state,
Each step can be executed reliably.

[Second Embodiment] Next, an electronic device according to a second embodiment of the present invention will be described with reference to FIGS. FIG. 15 is a plan view of the electronic device according to the present embodiment, and FIG. 16 is a side view of the electronic device according to the present embodiment, which is partially cut away. In FIG. 15, illustration of the resin film 15 is omitted.

In the electronic device 10 according to the present embodiment, the shape of the resin film 15 covering the electronic
The flexible substrate 11 has a shape slightly larger than the resin film 15.
The flexible substrate 11 shown in FIG. 15 and FIG.
It has a mounting portion 11A to which the electronic component 13 and the resin film 15 are joined, and an extension 11B extending outward from one side of the mounting portion 11A. A circuit component 60 including, for example, a control circuit for controlling the electronic component 13 is connected to an end of the extension 11B opposite to the mounting portion 11A. A conductive pattern for electrically connecting the electronic component 13 and the circuit component 60 is formed on the extension 11B.

FIG. 17 shows an electronic device 1 according to the present embodiment.
FIG. 9 is a side view showing a part of the electronic device 120 of Comparative Example with respect to “0” and a peripheral portion thereof cut away. Electronic device 1 of this comparative example
Reference numeral 20 includes a mounting substrate 121, an electronic component 123 mounted on the mounting substrate 121, and a cap 125 for sealing the electronic component 123. This electronic device 120
Is a general structure of a conventional electronic device. The mounting substrate 121 of the electronic device 120 is connected to one end of a flexible substrate 131 and the flexible substrate 13
A circuit component 160 is connected to the other end of 1.
A conductor pattern for electrically connecting the electronic component 123 and the circuit component 160 is formed on the flexible substrate 131.

By comparing the electronic device 10 according to the present embodiment with the electronic device 121 of the comparative example, it can be seen that the electronic device 10 according to the present embodiment can be reduced in thickness. In the present embodiment, the electronic component 13 is mounted directly on the flexible board 11 that is electrically connected to the electronic component 13 and the circuit component 60. Therefore, according to the electronic device 10 according to the present embodiment, as compared with the case where the mounting substrate 12 of the electronic device 120 is joined to the flexible substrate 131 as in the comparative example, the periphery of the electronic component 13 including the flexible substrate is reduced. The thickness at the portion can be significantly reduced.

In the comparative example, when the electronic component 123 and the circuit component 160 are electrically connected to each other via the flexible board 131, the step of mounting the electronic component 123 on the mounting board 121 and the step of mounting the Substrate 1
The step of connecting to the base 31 is required separately. In contrast, according to the present embodiment, electronic component 13 and circuit component 6
Directly on the flexible substrate 11 electrically connected to the
Since the electronic component 13 is mounted, a process for electrically connecting the electronic component 13 and the circuit component 60 can be simplified.

Other configurations, operations and effects in the present embodiment are the same as those in the first embodiment.

The present invention is not limited to the above embodiments, and various modifications are possible. For example, the holes 31 in the flexible substrate 11 are not limited to those specially provided for suction, and may be existing holes such as through holes.

[0077]

As described above, claims 1 to 4
In the electronic device according to any one of the above, the resin film covers the electronic component and the flexible substrate so as to be in close contact with a surface of the electronic component opposite to the flexible substrate, and is bonded to the flexible substrate. The resin film reinforces the mechanical connection between the connection electrode of the electronic component and the conductor pattern of the flexible board. Therefore, according to the present invention, the strength of mechanical joining and the stability of joining between the connection electrode of the electronic component and the conductor pattern of the flexible substrate can be improved with a simple configuration without affecting the operation of the electronic component. Is achieved. Further, in the present invention, since the electronic components are covered with the resin film and the flexible substrate is used as the mounting substrate, it is possible to reduce the size, weight, and thickness of the electronic device.

According to the electronic device of the second aspect,
Since the electronic component is sealed by the resin film, the electronic component can be sealed with a simple configuration without affecting the operation of the electronic component.

According to the electronic device of the third aspect,
Since a space is formed between one surface of the electronic component and one surface of the flexible substrate, it is important to note that the operation of the electronic component is affected when one surface of the electronic component comes into contact with another object. This has the effect that it can be prevented.

According to the electronic device of the fourth aspect,
Since the flexible substrate has holes used to determine the shape of the resin film by sucking the gas on the electronic component side from the side opposite to the electronic component of the flexible substrate, it is easy to determine the shape of the resin film. This has the effect that it can be performed.

In the method of manufacturing an electronic device according to any one of claims 5 to 9, the resin film covers the electronic component and the flexible substrate so as to be in close contact with the surface of the electronic component opposite to the flexible substrate. Is bonded to a flexible substrate. And with this resin film,
The mechanical connection between the connection electrode of the electronic component and the conductor pattern of the flexible board is reinforced. Therefore, according to the present invention, the strength of mechanical bonding and the stability of bonding between the connection electrode of the electronic component and the conductor pattern of the flexible board can be improved in a simple process without affecting the operation of the electronic component. Is achieved. Further, in the present invention, since the electronic components are covered with the resin film and the flexible substrate is used as the mounting substrate, it is possible to reduce the size, weight, and thickness of the electronic device.

Further, according to the method of manufacturing an electronic device according to the sixth aspect, the electronic component is sealed with the resin film, so that the operation of the electronic component can be performed in a simple process without affecting the operation of the electronic component. This has the effect of being able to be sealed.

According to the electronic device of the seventh aspect,
A space is formed between one surface of the electronic component and one surface of the flexible board, preventing the operation of the electronic component from being affected by one surface of the electronic component coming into contact with another object It has the effect that it can be done.

According to the electronic device of the eighth aspect,
The step of arranging the resin film is performed by sucking a gas on the electronic component side from a side of the flexible substrate opposite to the electronic component through a hole formed in the flexible substrate,
The shape of the resin film is changed so that the resin film adheres to the surface of the electronic component opposite to the flexible substrate and to one surface of the flexible substrate in a peripheral portion of the electronic component to cover the electronic component and the flexible substrate. Since the process is included, the effect is obtained that the shape of the resin film can be easily determined.

According to the electronic device of the ninth aspect,
In each step, the flexible substrate is placed on the support member having a flat upper surface, so that each step can be reliably executed in a state where the flexible substrate is stabilized.

[Brief description of the drawings]

FIG. 1 is a sectional view of an electronic device according to a first embodiment of the present invention.

FIG. 2 is an explanatory diagram conceptually showing an example of characteristics of a resin film used in the first embodiment of the present invention.

FIG. 3 is a cross-sectional view illustrating an example of a conventional bonding method for comparison with the first embodiment of the present invention.

FIG. 4 is a cross-sectional view showing another example of a conventional bonding method for comparison with the first embodiment of the present invention.

FIG. 5 is a cross-sectional view showing still another example of the conventional joining method for comparison with the first embodiment of the present invention.

FIG. 6 is a cross-sectional view illustrating an example of a bonding method according to the first embodiment of the present invention.

FIG. 7 is a cross-sectional view showing another example of the bonding method according to the first embodiment of the present invention.

FIG. 8 is a sectional view showing still another example of the joining method according to the first embodiment of the present invention.

FIG. 9 is a plan view showing an example of a surface acoustic wave device as an electronic component according to the first embodiment of the present invention.

FIG. 10 is an explanatory view showing one step in the method of manufacturing the electronic device according to the first embodiment of the present invention.

FIG. 11 is an explanatory diagram showing a step that follows the step of FIG. 10;

FIG. 12 is an explanatory diagram showing a step that follows the step of FIG. 11;

FIG. 13 is an explanatory diagram showing a step that follows the step of FIG. 12;

FIG. 14 is a plan view showing a flexible substrate, electronic components, and a resin film before a cutting step shown in FIG. 13;

FIG. 15 is a plan view of an electronic device according to a second embodiment of the present invention.

FIG. 16 is a side view showing an electronic device according to a second embodiment of the present invention with a part cut away.

FIG. 17 is a side view of an electronic device according to a comparative example with respect to the electronic device according to the second embodiment of the present invention and a peripheral portion thereof partially cut away.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Electronic device, 11 ... Flexible board, 12 ... Conductor pattern, 13 ... Electronic component, 14 ... Connection electrode, 15 ... Resin film, 16 ... Space, 31 ... Hole, 51 ... Support member.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Shinya Nakai 1-1-13 Nihonbashi, Chuo-ku, Tokyo Inside TDK Corporation (72) Inventor Seiichi Tajima 1-13-1 Nihonbashi, Chuo-ku, Tokyo Within FDK Corporation (72) Inventor Fumikatsu Kurosawa 1-1-1 Nihonbashi, Chuo-ku, Tokyo 5J097 AA24 AA29 BB11 HA04 HA09 JJ01 JJ10 KK10

Claims (9)

[Claims] 1. A flexible substrate as a mounting substrate having a conductor pattern exposed on one surface, a connection electrode on one surface, and the surface having the connection electrode faces one surface of the flexible substrate. And an electronic component in which the connection electrodes are electrically connected to and mechanically bonded to the conductor pattern of the flexible substrate, and the electronic component is in close contact with a surface of the electronic component opposite to the flexible substrate. An electronic device, comprising: a resin film that covers an electronic component and a flexible substrate and is bonded to the flexible substrate. 2. The electronic device according to claim 1, wherein the resin film seals the electronic component. 3. The electronic device according to claim 1, wherein a space is formed between one surface of the electronic component and one surface of the flexible substrate. 4. The flexible substrate has a hole used to determine the shape of the resin film by sucking gas on the electronic component side from a side of the flexible substrate opposite to the electronic component. The electronic device according to claim 1. 5. A flexible substrate as a mounting substrate having a conductor pattern exposed on one surface, and a connection electrode on one surface, and the surface having the connection electrode faces one surface of the flexible substrate. And an electronic component in which the connection electrodes are electrically connected to the conductor pattern of the flexible substrate and mechanically joined together, wherein one surface of the electronic component is provided. Disposing the electronic component and the flexible substrate so as to face one surface of the flexible substrate, and electrically connecting and mechanically connecting a connection electrode of the electronic component to a conductor pattern of the flexible substrate. A resin filling process so as to cover the electronic component and the flexible substrate in close contact with the surface of the electronic component opposite to the flexible substrate. Disposing a method of manufacturing an electronic device, characterized in that the resin film and a step of bonding the flexible substrate. 6. The method according to claim 5, wherein the resin film seals the electronic component. 7. The method of manufacturing an electronic device according to claim 5, wherein a space is formed between one surface of the electronic component and one surface of the flexible substrate. 8. The step of arranging the resin film, wherein the gas on the electronic component side is sucked from a side of the flexible substrate opposite to the electronic component through a hole formed in the flexible substrate, so that the resin film is Changing the shape of the resin film so as to cover the electronic component and the flexible substrate in close contact with a surface of the component opposite to the flexible substrate and one surface of the flexible substrate in a peripheral portion of the electronic component. The method for manufacturing an electronic device according to claim 5, wherein: 9. The method according to claim 5, wherein in each of the steps, the flexible substrate is mounted on a support member having a flat upper surface. .