JP2000216660A - Mount structure for element device and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an element device with excellent economy and high reliability. SOLUTION: The element device includes a frame resin member 8 that is interposed between an element 1 and a circuit board 5 so as to form a space 7, a metallic bump 4 interconnecting the element 1 and electrode pads 3, 6 provided to the circuit board, a function circuit 11 that is placed in the space 7, and an additional resin member 9 enclosing the space 7. A plurality of the frame resin members 8 are provided, the element 1 is mounted on the circuit board, the connection of the frame resin members 8 and the connection of the metallic bump 4 are conducted at the same time, after providing the additional resin member 9 to the outside of the frame resin members 8 altogether, they are separated individually to obtain a plurality of the elements 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an element device such as a surface acoustic wave device or a high-frequency device used as a surface acoustic wave filter or the like, and more particularly to an element mounting structure of a type mounted on a circuit board by face-down bonding. , And its manufacturing method.

[0002]

2. Description of the Related Art As a prior art 1, a surface acoustic wave device or a high-frequency device has a surface acoustic wave element 101 housed in a space 117 formed by a lid 111 and a circuit board 115 as shown in FIG. . A plurality of electrodes 102 are formed on one surface of the element 101. Multiple electrodes 1
02 is provided with an electrode pad 103. The circuit board 115 has a concave shape. A circuit (not shown) is formed on the inner bottom surface of the circuit board 115.
The circuit on the circuit board 115 includes a plurality of electrode pads 116.
Is provided.

The electrode pads 103 of the element 101 and the electrode pads 116 of the circuit board 115 are
4. The element 111 and the substrate 115 are connected only by the metal bump 114.

The circuit board 115 having a concave shape is provided with a lid 111 on the upper surface thereof, so that the element 101 is placed in the space 117.
Is housed in an airtight state. The airtight structure is the lid 11
1 are individually welded to the circuit board 115 after mounting.

FIG. 12 shows a surface acoustic wave device as prior art 2. In addition, about the same element part as the surface acoustic wave device of the prior art 1 shown in FIG.
The following description is given with the same reference numerals.

Referring to FIG. 12, in a surface acoustic wave device according to prior art 2, a frame-shaped resin member 118 is interposed between an element 111 and a plate-shaped circuit board 115. The element 111 and the circuit board 115 are
The electrode pad 103 of the element 101 and the electrode pad 116 of the circuit board 115 are connected to each other by a metal bump 114 with a space 117 by the space 18.

[0007] In this surface acoustic wave device of the prior art, similarly to the prior art 1, an airtight structure is realized at the same time as mounting with the frame-shaped resin 118 (Japanese Patent Laid-Open No. 8-31677).
No. 8).

[0008]

However, in the surface acoustic wave device according to the prior art 1, the circuit board 115 is not used.
Cannot be manufactured at low cost because of the concave shape, and since the element 101 is mounted in the concave circuit board 115, the wall surface of the circuit board 115 and the element 101
A certain distance is required between them, and miniaturization is restricted.

The surface acoustic wave device according to the prior art 2 has a structure that realizes an airtight structure simultaneously with mounting on the frame-shaped resin member 8, but the frame-shaped resin member 118 alone has insufficient adhesion and airtightness. There is a problem that productivity is poor because it is not established and it takes time for thermocompression bonding.

[0010] Therefore, an object of the present invention is to reduce the stress of metal bumps, to improve the strength, and to expect the performance to be stable, to prevent the inflow of resin material, and to obtain an element device with high stability in the manufacturing method. And a method of manufacturing the same.

[0011]

According to the present invention, an element, a circuit board on which the element is mounted, a frame-shaped resin member interposed so as to form a space between the element and the circuit board, and And an electrode pad provided on the circuit board, a metal bump interconnecting the electrode pad of the element and the electrode pad of the circuit board,
In the mounting structure of an element device including the functional circuit provided in the element and located in the space, an additional resin member is provided outside the frame-shaped resin member. can get.

Further, according to the present invention, an element, a circuit board on which the element is mounted, a frame-shaped resin member interposed so as to form a space between the element and the circuit board, and an electrode provided on the element A pad, an electrode pad provided on the circuit board, a metal bump interconnecting the electrode pad of the element and the electrode pad of the circuit board, and a functional circuit provided on the element and located in the space, A plurality of the frame-shaped resin members are provided on the circuit board to hold the space, and the element provided with the metal bump is mounted on an electrode pad of the circuit board. And connection of the metal bumps simultaneously,
A method for manufacturing an element device is provided, wherein the additional resin member is provided outside the frame-shaped resin member at a time, and then the plurality of elements are obtained by dividing the additional resin member.

[0013]

According to the present invention, the connection between the circuit board and the element and the application of the frame-shaped resin member and the additional resin member are collectively performed and cut into individual pieces. In addition, by arranging the metal bumps on the outside, the stress of the metal bumps can be relaxed, and the performance can be stabilized by improving the strength.

Further, the airtightness is enhanced by the frame-shaped resin member and the additional resin member, the reliability is high, and the additional resin member is prevented from flowing into the space inside the frame-shaped resin member.

[0015]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a mounting structure of an element device according to the present invention.

FIG. 1 shows a first embodiment of a mounting structure of an element device of the present invention which is mounted on a circuit board by face-down bonding. The element device is employed for a surface acoustic wave device or a high-frequency device. In this embodiment, a surface acoustic wave device will be described below as a representative example.

Referring to FIG. 1, a surface acoustic wave device according to this embodiment includes a surface acoustic wave element (hereinafter, referred to as an “element”) 1 and a circuit board 5 on which the element 1 is mounted.
And a frame-shaped resin member 8 interposed between the element 1 and the circuit board 5, and an additional resin member 9 filled around the frame-shaped resin member 8.
And

A plurality of electrodes 2 are formed on one surface of the element 1. Each of the plurality of electrodes 2 is provided with an electrode pad 3. A functional circuit 11 is provided between the electrode pads 3. The functional circuit 11 is formed on one surface of the element 1. A circuit (not shown) is formed on one surface of the circuit board 5, and the circuit is connected to the electrode pads 6. Electrode pad 3 of element 1 and electrode pad 6 of circuit board 5
Are connected to each other by a metal bump (gold bump) 4.

Next, a method of manufacturing the surface acoustic wave device according to the first embodiment will be described with reference to FIGS.

Referring to FIG. 2, first, a functional circuit 11, an electrode 2, an electrode pad 3, and a metal bump 4 are formed on one surface of an element 1. At this time, a metal bump 4 such as a gold bump is formed on the electrode 2 by a wire bonding method or the like. The metal bump 4 has a pointed portion 4a. A plurality of electrode pads 6 are formed on the circuit board 5 as shown in FIG.
These electrode pads 6 are surrounded by one surface of the circuit board 5, and a plurality of frame-shaped resin members 8 are formed in advance in order to form a plurality of spaces 7 on the circuit board 5. As the frame-shaped resin member 8, a material having low fluidity at the time of mounting pressurization and selectively formed with high accuracy by printing, etching, or the like is suitable. For example, in order to obtain a plurality of elements 1 by cutting,
Is used as a glass ceramic substrate, a thermosetting photosensitive resin is applied on the circuit board 5 to a uniform thickness by spin coating, and a frame-shaped resin member 8 is formed only at a required portion by exposure and development. The photosensitive resin increases in adhesiveness by heating during mounting, and reaches curing.

Then, as shown in FIG.
Is mounted on the circuit board 5 so as to face one surface thereof. At this time, the pointed portion 4a of the metal bump 4 is brought into contact with the electrode pad 6 on the circuit board 5. And the circuit board 5
A plurality of elements 1 are sequentially mounted thereon. The element 1 is mounted with the functional circuit 11 facing the circuit board 5 side.

Thereafter, as shown in FIG. 5, a plurality of elements 1 are pressurized while being heated by using a heating and pressurizing device 15, and are mounted collectively. In this mounting, a plurality of elements 1 are heated and pressurized at once, the metal bumps 4 formed on the elements 1 in advance and the electrode pads 6 of the circuit board 5 are connected, and the surface of the elements 1 and the frame-shaped resin member 8 are connected. Connection at the same time. Metal bump 4
And the frame-shaped resin member 8 are pushed to almost the same height. At this time, the element 1 is brought into close contact with the frame-shaped resin member 8 due to the thermosetting, thereby forming a closed space 7. A suitable heating method is a pulse heat method in which only a required amount is heated.

Next, as shown in FIGS. 6 and 7, an additional resin member 9 is filled around the frame-shaped resin member 8 and on the circuit board 8 at a time. Further, after the additional resin member 9 is cured, the individual elements 1 are separated along the dividing line 10 shown in FIG.
Divided into The additional resin member 9 is supplied by a method such as dispensing, and the outside of the frame-shaped resin member 8 is filled with the additional resin member 9 all around. In the circuit board 5 where the element 1 is divided into a plurality of parts, the frame-shaped resin member 8 holds the space 7 when the additional resin member 9 is applied collectively. That is, the frame-shaped resin member 8 prevents the additional resin portion member 9 from flowing into the space 7 inside the frame-shaped resin member 8.

After the additional resin member 9 is cured, it is divided by a dividing line 10 into individual pieces.

According to such a manufacturing method, the frame-shaped resin member 8 shown in FIG.
And an additional resin member 9 is filled outside the frame-shaped resin member 8.

In the mounting structure of FIGS. 2 to 8 described above, the embodiment in which the arrangement of the metal bumps 4 is included inside the frame-shaped resin member 8 has been described. It may be located in.

FIGS. 9 and 10 show a second embodiment in which the metal bumps 4 are arranged outside the frame-shaped resin member 8. FIG. The frame-shaped resin member 8 in this embodiment is
It is formed between the functional circuit 11 of the element 1 and the metal bump 4. The periphery of the metal bumps 4 is filled with an additional resin member 9, in which stresses such as thermal stress between the element 1 and the circuit board 5 are dispersed, and the load applied to the metal bumps 4 as the electrical connection portions is reduced. become.

The method of manufacturing the surface acoustic wave device according to the second embodiment is performed in the same manner as the method of manufacturing the surface acoustic wave device according to the first embodiment described with reference to FIGS. Therefore, the description is omitted.

Further, in the above-described embodiment, the frame-shaped resin member 8 is provided on the circuit board 5, but the same mounting structure can be obtained by providing the frame-shaped resin member 8 on the element 1 in a wafer state. It is possible to obtain

In the above-described embodiment, a method has been described in which a thermosetting photosensitive resin is applied onto the circuit board 5 and the frame-shaped resin member 8 is formed only at a required portion by exposure and development. A similar mounting structure can be obtained by attaching a frame-shaped resin member 8, which is a molded sheet made of a material into a required shape, on a circuit board 5.

[0031]

As described above with reference to the embodiment, according to the mounting structure of the surface acoustic wave device of the present invention, since the frame-shaped resin member and the additional resin member are airtight, the reliability is improved. Since it is high and prevents the frame-shaped resin member from flowing into the space of the additional resin member, the stability in the manufacturing method is increased.

In the method of manufacturing a surface acoustic wave device according to the present invention, a plurality of connections and application of a resin are collectively performed and cut into individual pieces. Also, by disposing the metal bumps outside the frame-shaped resin member,
The stress of the metal bump can be relaxed, the strength is improved, and the performance is expected to be stabilized.

Further, as compared with the conventional structure, since the shape of the circuit board to be used can be simplified, the members to be used are inexpensive.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a first embodiment of a mounting structure of a surface acoustic wave device according to the present invention.

FIG. 2 is a cross-sectional view showing an element in the surface acoustic wave device shown in FIG. 1 for describing an embodiment of a manufacturing method.

FIG. 3 is a cross-sectional view showing a circuit board for describing one embodiment of a method of manufacturing the surface acoustic wave device shown in FIG. 1;

FIG. 4 is a cross-sectional view showing a state before mounting the element shown in FIG. 2 on a circuit board in the method of manufacturing the surface acoustic wave device shown in FIG.

FIG. 5 is a cross-sectional view showing a state in which the element and the circuit board shown in FIG. 2 are heated and pressed.

FIG. 6 is a cross-sectional view showing a state where the element and the circuit board are connected from the state of FIG. 5;

FIG. 7 is a plan view of FIG. 6;

8 is a cross-sectional view showing a state where the element shown in FIG. 6 is divided into a plurality.

FIG. 9 is a sectional view showing a second embodiment of the mounting structure of the surface acoustic wave device according to the present invention.

FIG. 10 is a plan view of FIG. 9;

FIG. 11 is a cross-sectional view illustrating a surface acoustic wave device according to the related art 1.

FIG. 12 is a cross-sectional view illustrating a surface acoustic wave device according to Conventional Technique 2.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1, 101 Surface acoustic wave element 4 Metal bump 5, 115 Circuit board 6, 116 Electrode pad 7, 117 Space 8, 118 Frame-shaped resin member 9 Additional resin material 10 Division line 11 Functional circuit 111 Lid

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Michio Tanioka 5-7-1 Shiba, Minato-ku, Tokyo Inside NEC Corporation (72) Inventor Norimasa Watanabe 5-7-1 Shiba, Minato-ku, Tokyo Japan F-term (reference) within Electric Company 5J097 AA28 AA31 AA33 BB11 HA04 HA08 HA09 JJ03 JJ09 KK10

Claims (8)

[Claims] An element, a circuit board on which the element is mounted,
A frame-shaped resin member interposed to create a space between the element and the circuit board, and an electrode pad provided on the element,
An element device including an electrode pad provided on the circuit board, a metal bump interconnecting the electrode pad of the element and the electrode pad of the circuit board, and a functional circuit provided on the element and located in the space. The mounting structure for an element device according to claim 1, wherein an additional resin member is provided outside the frame-shaped resin member. 2. The mounting structure of an element device according to claim 1, wherein the electrode pad provided on the element, the electrode pad provided on the circuit board, the metal bump, and the functional circuit are surrounded by the frame-shaped resin member. A mounting structure for an element device, wherein the mounting structure is located in the space defined above. 3. The mounting structure of an element device according to claim 1, wherein the electrode pad provided on the element, the electrode pad provided on the circuit board, and the metal bump are located outside the frame-shaped resin member. The functional circuit is located in the space surrounded by the frame-shaped resin member,
An electrode device mounting structure, wherein an electrode pad provided on the element, an electrode pad provided on the circuit board, and the metal bump are covered with the additional resin member. 4. An element, a circuit board on which the element is mounted,
A frame-shaped resin member interposed to create a space between the element and the circuit board, an electrode pad provided on the element, an electrode pad provided on the circuit board, an electrode pad of the element and an electrode of the circuit board A metal bump for interconnecting pads and a functional circuit provided on the element and positioned in the space, a plurality of the frame-shaped resin members are provided on the circuit board to hold the space, The element provided with the metal bumps is mounted on the electrode pads of the circuit board, and at this time, the connection of the frame-shaped resin member and the connection of the metal bumps are simultaneously performed, and collectively on the outside of the frame-shaped resin member. A method for manufacturing an element device, comprising: providing the additional resin member; and dividing the individual resin member to obtain a plurality of the elements. 5. The element device mounting method according to claim 4, wherein the electrode pad provided on the element, the electrode pad provided on the circuit board, the metal bump, and the functional circuit are surrounded by the frame-shaped resin member. A method for manufacturing an element device, wherein the element device is located in the space defined above. 6. The method for manufacturing an element device according to claim 4, wherein the electrode pad provided on the element, the electrode pad provided on the circuit board, and the metal bump are located outside the frame-shaped resin member. The functional circuit is located in the space surrounded by the frame-shaped resin member, and the electrode pad provided on the element, the electrode pad provided on the circuit board, and the metal bump are covered with the additional resin member. A method for manufacturing an element device. 7. The method for manufacturing an element device according to claim 4, wherein the element is pressurized while being heated by using a heating and pressurizing device, and the electrode pad of the element and the electrode pad of the circuit board are collectively applied. Are connected by the metal bump. 8. The method for manufacturing an element device according to claim 4, wherein the additional resin member is filled outside the frame-shaped resin member.