JPH04367111A - Plezoelectric oscillator and production of the same - Google Patents

Plezoelectric oscillator and production of the same

Info

Publication number
JPH04367111A
JPH04367111A JP16927191A JP16927191A JPH04367111A JP H04367111 A JPH04367111 A JP H04367111A JP 16927191 A JP16927191 A JP 16927191A JP 16927191 A JP16927191 A JP 16927191A JP H04367111 A JPH04367111 A JP H04367111A
Authority
JP
Japan
Prior art keywords
metal wiring
ceramic substrate
piezoelectric
support
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16927191A
Other languages
Japanese (ja)
Other versions
JP2595840B2 (en
Inventor
Shunsuke Sato
俊介 佐藤
Mikio Nakajima
幹雄 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daishinku Corp
Original Assignee
Daishinku Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daishinku Corp filed Critical Daishinku Corp
Priority to JP3169271A priority Critical patent/JP2595840B2/en
Publication of JPH04367111A publication Critical patent/JPH04367111A/en
Application granted granted Critical
Publication of JP2595840B2 publication Critical patent/JP2595840B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a piezoelectric oscillator and its producing method with good productivity by accurately connecting a supporting body to the prescribed position of a ceramic substrate without damaging the spring action of the supporting body using a joining material. CONSTITUTION:The piezoelectric oscillator is composed of a ceramic substrate 1 with metal wirings 21 and 22, at least two metallic supporting bodies 31 and 32 having the junction part with the metallic wire and the mounting part of a piezoelectric diaphragm, a piezoelectric oscillating plate 4 in which the exciting electrodes are formed on the surface, and a cap 5 covering the piezoelectric oscillating plate etc. The junction between the metallic wiring and the supporting body is performed by laser beam welding. As the method for production, a pair of supporting bodies are integrated, continuous lead frames are prepared, and plural ceramic substrate with metallic wiring are arranged while keeping an equal space with a pair of supporting bodies. The supporting body and the metallic wiring are jointed by the laser beam, and the junction between the supporting body and the frame is disconnected.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は圧電振動子とその製造方
法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric vibrator and a method for manufacturing the same.

【0002】0002

【従来の技術】従来の圧電振動子の支持構造を表面実装
型の水晶振動子を例にとり、図5の模式的側面図ととも
に説明する。アルミナ等からなるセラミック基板61の
表面にはメタライズ処理等により金属配線62.63が
形成されている。この金属配線は2ヶ所の支持体接合部
とそれぞれの接合部を電気的に外部に引き出す配線引出
し部とからなっている。これら支持体接合部に導電性接
合材66を塗布し、この上に1対の支持体64,65を
搭載し、加熱乾燥を行い導電性接合材を硬化させ、両者
の電気的機械的接続を行う。そして、これら支持体に励
振電極形成された水晶振動板67を搭載し、水晶振動板
等をキャップ68で被覆し気密封止する。
2. Description of the Related Art A conventional support structure for a piezoelectric resonator will be explained using a surface-mounted crystal resonator as an example, with reference to a schematic side view of FIG. Metal wirings 62 and 63 are formed on the surface of a ceramic substrate 61 made of alumina or the like by metallization or the like. This metal wiring consists of two support joint parts and a wiring lead-out part for electrically drawing out each joint part to the outside. A conductive bonding material 66 is applied to the joints of these supports, a pair of supports 64 and 65 are mounted on this, and the conductive bonding material is cured by heating and drying to establish an electrical and mechanical connection between the two. conduct. Then, a crystal diaphragm 67 on which excitation electrodes are formed is mounted on these supports, and the crystal diaphragm and the like are covered with a cap 68 and hermetically sealed.

【0003】0003

【発明が解決しようとする課題】しかしながら、上記の
ような支持体の接合方法では以下のような問題点を有し
ていた。■.導電性接合材が乾燥硬化するまでの間に、
セラミック基板や支持体に振動衝撃が加わると、支持体
がセラミック基板上の所定の位置からずれたり傾いたり
する。■.導電性接合材が硬化した後でないと、支持体
に水晶振動板(圧電振動板)を搭載することができない
。一般的に接合材の硬化には比較的長い時間を要する。 ■.硬化前の導電性接合材が毛細管現象で支持体と金属
配線あるいはセラミック基板の間を広がり、場合によっ
てはこれが支持体のバネ性を損なわせ、本来の支持体の
役割である衝撃に対する緩衝作用の劣化が生じる。 ■.導電性接合材の塗布量及び塗布位置のばらつきによ
り、接着強度にばらつきが発生する。■.1対の支持体
を個別に搭載するため対称性が失われやすい。特に、支
持体の位置が正しく固定されないと、支持体に搭載する
圧電振動板に応力歪を与えかねず、圧電振動子としての
信頼性に大きく影響するものであった。
[Problems to be Solved by the Invention] However, the above method for joining supports has the following problems. ■. Until the conductive bonding material dries and hardens,
When a vibration impact is applied to the ceramic substrate or the support, the support is displaced from a predetermined position on the ceramic substrate or tilted. ■. A crystal diaphragm (piezoelectric diaphragm) cannot be mounted on the support until after the conductive bonding material has hardened. Generally, it takes a relatively long time for the bonding material to harden. ■. The conductive bonding material before hardening spreads between the support and the metal wiring or ceramic substrate due to capillary action, and in some cases, this may impair the springiness of the support and reduce the ability of the support to buffer against shock, which is the original role of the support. Deterioration occurs. ■. Due to variations in the amount and position of the conductive bonding material applied, variations in adhesive strength occur. ■. Symmetry is likely to be lost because a pair of supports are mounted individually. In particular, if the position of the support is not fixed correctly, stress strain may be applied to the piezoelectric diaphragm mounted on the support, which greatly affects the reliability of the piezoelectric vibrator.

【0004】本発明は上記問題点を解決するためになさ
れたもので、支持体をセラミック基板の所定の位置に正
確に接続でき、接合材で支持体のバネ性を損なわせるこ
とがなく、しかも製造時の作業性もよい圧電振動子並び
にその製造方法を提供することを目的とするものである
The present invention has been made to solve the above-mentioned problems, and it is possible to accurately connect a support to a predetermined position on a ceramic substrate, without impairing the springiness of the support with a bonding material, and furthermore, It is an object of the present invention to provide a piezoelectric vibrator with good workability during manufacturing and a method for manufacturing the same.

【0005】[0005]

【課題を解決するための手段】上記問題点を解決するた
めに、本発明による圧電振動子は、金属配線が施こされ
たセラミック基板と、この金属配線の所定の位置に搭載
され、金属配線との接合部と圧電振動板の搭載部を有す
る少なくとも2つの金属性の支持体と、前記支持体の搭
載部間に架設され、表面に励振電極が形成された圧電振
動板と、圧電振動板等を被覆するキャップとからなる圧
電振動子において、前記金属配線と支持体との接合をレ
ーザービーム溶接で行ったことを特徴とするものである
。レーザービーム溶接は支持体の接合部に1点で行って
もよいし、複数点で行ってもよい。
[Means for Solving the Problems] In order to solve the above problems, a piezoelectric vibrator according to the present invention is provided with a ceramic substrate provided with metal wiring, mounted at a predetermined position of the metal wiring, at least two metal supports having a joint portion with the support body and a mounting portion of the piezoelectric diaphragm, a piezoelectric diaphragm installed between the mounting portions of the supports and having an excitation electrode formed on its surface, and a piezoelectric diaphragm. The piezoelectric vibrator is characterized in that the metal wiring and the support are joined by laser beam welding. Laser beam welding may be performed at one point or at multiple points at the joint of the support.

【0006】なお、支持体の接合部に1つあるいは複数
の小穴を設け、この小穴周辺を中心にレーザービームを
照射すれば、より効率的に金属配線と支持体との接合が
行われる。また、レーザービーム溶接後支持体と金属配
線を少量の接合材で補助的に接合するとより接合の信頼
性が向上する。この場合、その接合部分に1つあるいは
複数の小穴を設け、接合材による接合強度を向上させて
もよい。
[0006] Note that if one or more small holes are provided in the joint portion of the support and a laser beam is irradiated mainly around the small holes, the metal wiring and the support can be joined more efficiently. Furthermore, the reliability of the bonding can be further improved by supplementarily bonding the support and the metal wiring with a small amount of bonding material after laser beam welding. In this case, one or more small holes may be provided in the joint portion to improve the joint strength of the joint material.

【0007】またその製造方法として、一対の支持体を
フレーム枠で一体化し、これが連続的に連なったリード
フレームを用意し、また金属配線が施こされたセラミッ
ク基板を前記一対の支持体の間隔と等間隔に複数個配置
し、支持体の接合部を前記金属配線の接合パッドに当接
させ、レーザービーム溶接にて支持体と金属配線の両接
合部分を接合しするとともに、支持体とフレーム枠との
連結部を同じくレーザービームにて切断したことを特徴
とする製造方法があげられる。もちろん電極導出形態に
よって支持体の必要本数も異なり、3個以上の支持体を
用いることもありうる。
[0007] In addition, as a manufacturing method, a pair of supports are integrated with a frame frame, a lead frame in which these are continuously connected is prepared, and a ceramic substrate on which metal wiring is applied is placed at an interval between the pair of supports. The joint part of the support body is brought into contact with the joint pad of the metal wiring, and both the joint parts of the support body and the metal wiring are joined by laser beam welding, and the support body and the frame are There is a manufacturing method characterized in that the connecting portion with the frame is also cut using a laser beam. Of course, the required number of supports varies depending on the electrode lead-out form, and three or more supports may be used.

【0008】[0008]

【作用】セラミック基板上の金属配線と支持体との接合
をレーザービーム溶接で行うので、両者は異物質が介在
することのない金属間接合が行われ、接合が確実となる
。また、接合材を用いていた場合の諸欠点(例えば硬化
時間が長い、支持体のバネ性を損なわせる場合がある等
)がなくなる。
[Operation] Since the metal wiring on the ceramic substrate and the support body are joined by laser beam welding, metal-to-metal joining is performed between the two without the presence of foreign substances, and the joining is reliable. In addition, the various disadvantages of using a bonding material (for example, the curing time is long, the springiness of the support may be impaired, etc.) are eliminated.

【0009】また、請求項2に示した製造方法によると
、支持体間の距離、位置が正しく定められ、また金属配
線の接合パッドに対する支持体の位置決めがきわめて容
易で、接続における信頼性も高い。
Furthermore, according to the manufacturing method described in claim 2, the distance and position between the supports can be determined correctly, and the positioning of the supports with respect to the bonding pads of the metal wiring is extremely easy, and the reliability of the connection is high. .

【0010】0010

【実施例】次に、本発明について表面実装型の水晶振動
子を例にとり、図面を参照して説明する。図1は本発明
の実施例を示す分解斜視図であり、図2は図1において
水晶振動板を取り付け、キャップを被覆した状態での側
断面図、図3はリードフレームに一体化された支持体を
金属配線にレーザービーム溶接する状態を示す図、図4
は支持体をリードフレームから切り離す状態を示す図で
ある。セラミック基板1はその材質がアルミナからなり
、薄板状に加工され、かつその側面に4つの切り欠き1
a,1b,1c,1dが設けられている。このセラミッ
ク基板1上にはメタライズ処理された金属配線21,2
2が設けられている。金属配線21,22は、それぞれ
支持体との接合パッド21a,22aと、これら接合パ
ッドからセラミック基板端面の切り欠きに延びた引出し
部21b,22bとを有している。支持体31,32は
洋白等の金属からなり、それぞれ金属配線との接合部3
1a,32aと連結部31b,32bと水晶振動板4の
搭載部31c,32cを有している。支持体31,32
を前記接合パッド21a,22aに搭載し、それぞれ両
者をレーザービーム溶接により接合する。水晶振動板4
はATカット水晶板からなり、矩形形状に加工されて、
その表面には励振電極41(裏面については図示せず)
が蒸着等の手段で形成されている。この水晶振動板4を
前記支持体間に懸架し、図示していないが導電性接合材
で導通固着する。そして、セラミック材、あるいは樹脂
材からなるキャップ5でこれら水晶振動板等を被覆し、
気密封止する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings, taking a surface-mounted crystal resonator as an example. FIG. 1 is an exploded perspective view showing an embodiment of the present invention, FIG. 2 is a side sectional view of FIG. 1 with a crystal diaphragm attached and a cap covered, and FIG. 3 is a support integrated into a lead frame. Figure 4 shows a state in which the body is laser beam welded to metal wiring.
FIG. 3 is a diagram showing a state in which the support body is separated from the lead frame. The ceramic substrate 1 is made of alumina, processed into a thin plate shape, and has four notches 1 on its side.
a, 1b, 1c, and 1d are provided. On this ceramic substrate 1 are metal wirings 21 and 2 which have been metallized.
2 is provided. The metal wirings 21 and 22 have bonding pads 21a and 22a with the support, respectively, and lead-out portions 21b and 22b extending from these bonding pads to the notches in the end face of the ceramic substrate. The supports 31 and 32 are made of metal such as nickel silver, and each has a joint 3 with the metal wiring.
It has 1a, 32a, connecting parts 31b, 32b, and mounting parts 31c, 32c for the crystal diaphragm 4. Supports 31, 32
are mounted on the bonding pads 21a and 22a, and the two are bonded by laser beam welding. Crystal diaphragm 4
is made of AT-cut crystal plate, processed into a rectangular shape,
An excitation electrode 41 is on the surface (the back surface is not shown).
is formed by means such as vapor deposition. This crystal diaphragm 4 is suspended between the supports, and is electrically fixed with a conductive bonding material (not shown). Then, these crystal diaphragms, etc. are covered with a cap 5 made of ceramic material or resin material,
Seal hermetically.

【0011】次に、上記した圧電振動子を信頼性を確保
して量産するための製造方法について図3,図4を中心
に説明する。リードフレームLは、一対の支持体31,
32が対向配置され、これら支持体がフレーム枠L1と
連結部分R1,R2,R3,R4でつながった一体物を
一組として、複数組連続して設けられた構成であり、全
体として金属の帯形状をしている。なお、一対の支持体
の接合部間はちょうどセラミック基板の接合パッド21
a,22a間の距離に設定されている。金属配線21,
22が設けられたセラミック基板1は、上記支持体が設
置された間隔と等間隔に複数個連続(セラミック基板群
という)して設けられている。これらセラミック基板群
上に前記リードフレームLを移動させ、接合パッド21
a,22aと接合部31a,32aをそれぞれ接触させ
る。そして、レンズCで集光したレーザービームを前記
各々の接続部分に2ヶ所当て、レーザービーム溶接を行
う。つづいて、図4に示すようにリードフレームから支
持体を切り放すため、連結部分R1,R2,R3,R4
にレーザービームを照射して溶断する。これら一連の作
業を次々に行うことにより、信頼性、量産性に優れた圧
電振動子の支持構造を提供できる。
Next, a manufacturing method for mass-producing the piezoelectric vibrator described above while ensuring reliability will be explained with reference to FIGS. 3 and 4. The lead frame L includes a pair of supports 31,
32 are arranged facing each other, and these supports are connected to the frame L1 by connecting parts R1, R2, R3, and R4. It has a shape. Note that the bonding pad 21 of the ceramic substrate is located just between the bonding portions of the pair of supports.
The distance is set to the distance between a and 22a. metal wiring 21,
A plurality of ceramic substrates 1 having 22 are successively provided (referred to as a ceramic substrate group) at equal intervals to the intervals at which the supports are installed. The lead frame L is moved onto these ceramic substrate groups, and the bonding pads 21
a, 22a and joint portions 31a, 32a, respectively, are brought into contact with each other. Then, a laser beam focused by a lens C is applied to each of the connection parts at two locations to perform laser beam welding. Next, as shown in FIG. 4, in order to cut the support body from the lead frame, the connecting parts R1, R2, R3,
irradiate it with a laser beam and fuse it. By performing these series of operations one after another, it is possible to provide a piezoelectric vibrator support structure that is highly reliable and mass-producible.

【0012】レーザービームの出力は、支持体並びに金
属配線の材質、厚み等を勘案して、これらが必要以上に
損傷を受けない程度に調整する必要がある。例えば、セ
ラミック基板としてAl2O3(アルミナ)を用い、こ
の表面にタングステン層、ニッケル層、金層の順番でメ
タライズされた合計厚さ20μmのメタライズ配線を設
け、このメタライズ配線に板厚が50μmの洋白からな
る支持体をレーザービーム溶接する場合、0.12Jの
出力で強固に電気的機械的接合が行えた。なお、支持体
をリードフレームから切り離す場合、0.13Jの出力
で切断できた。
The output of the laser beam must be adjusted in consideration of the materials, thicknesses, etc. of the support and metal wiring to such an extent that they will not be damaged more than necessary. For example, using Al2O3 (alumina) as a ceramic substrate, metallized wiring with a total thickness of 20 μm, which is metalized in the order of a tungsten layer, a nickel layer, and a gold layer, is provided on the surface of the ceramic substrate, and a nickel silver plate with a plate thickness of 50 μm is attached to this metalized wiring. When laser beam welding the support made of the following materials, strong electrical and mechanical bonding could be achieved with an output of 0.12 J. Note that when the support body was separated from the lead frame, it was possible to cut it with an output of 0.13 J.

【0013】[0013]

【発明の効果】セラミック基板上の金属配線と支持体と
の接合をレーザービーム溶接で行うので、両者は異物質
が介在することのない金属間接合が行われ、接合が確実
となる。また、接合材を用いると一般的にその硬化時間
が長いので、硬化中に振動、衝撃が加わって所定の接合
位置から支持体がずれたり傾いたりすることがあったり
、接合材の塗布量が多すぎることがあり、これが支持体
のバネ性を損なわせること等があったが、このような諸
欠点がなくなり、信頼性の高い圧電振動子を得ることが
できる。
[Effects of the Invention] Since the metal wiring on the ceramic substrate and the support are joined by laser beam welding, metal-to-metal joining is performed without the presence of foreign substances, and the joining is reliable. Additionally, since bonding materials generally take a long time to cure, vibrations and shocks may be applied during curing, which may cause the support to shift or tilt from the specified bonding position, or the amount of bonding material applied may be reduced. In some cases, there is too much, and this impairs the springiness of the support, but these drawbacks can be eliminated and a highly reliable piezoelectric vibrator can be obtained.

【0014】また、本発明に示した製造方法を用いると
、複数個の支持体をリードフレームに一体化し、この支
持体の配置間隔と等間隔にセラミック基板を配置し、レ
ーザービーム溶接あるいは切断を行っているので、量産
性に極めて優れている。また、向かい合う支持体の対称
性が確保され、支持体の位置決めがきわめて容易で接続
おける信頼性も高く、圧電振動板を搭載した場合でも、
支持体の接続位置が不適切なことによる応力歪等の発生
がなく、圧電振動子としての電気的諸特性が経時変化す
ることも少なくなる。
Furthermore, by using the manufacturing method shown in the present invention, a plurality of supports are integrated into a lead frame, ceramic substrates are arranged at equal intervals to the arrangement intervals of the supports, and laser beam welding or cutting is performed. This makes it extremely suitable for mass production. In addition, the symmetry of the opposing supports is ensured, making positioning of the supports extremely easy and reliable connection, even when a piezoelectric diaphragm is installed.
There is no occurrence of stress or strain due to inappropriate connection positions of the support, and the electrical characteristics of the piezoelectric vibrator are less likely to change over time.

【図面の簡単な説明】[Brief explanation of drawings]

【図1】本発明による実施例を示す分解斜視図。FIG. 1 is an exploded perspective view showing an embodiment according to the present invention.

【図2】図1の断面図。FIG. 2 is a cross-sectional view of FIG. 1.

【図3】圧電振動子の製造方法を説明する図。FIG. 3 is a diagram illustrating a method of manufacturing a piezoelectric vibrator.

【図4】圧電振動子の製造方法を説明する図。FIG. 4 is a diagram illustrating a method for manufacturing a piezoelectric vibrator.

【図5】従来例を示す図。FIG. 5 is a diagram showing a conventional example.

【符号の説明】[Explanation of symbols]

1  セラミック基板 21,22  金属配線 31,32  支持体 4  水晶振動板(圧電振動板) 5  キャップ L  リードフレーム 1 Ceramic substrate 21, 22 Metal wiring 31, 32 Support 4 Crystal diaphragm (piezoelectric diaphragm) 5 Cap L lead frame

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】  金属配線が施こされたセラミック基板
と、この金属配線の所定の位置に搭載され、金属配線と
の接合部と圧電振動板の搭載部を有する少なくとも2つ
の金属製の支持体と、前記支持体の搭載部間に架設され
、表面に励振電極が形成された圧電振動板と、圧電振動
板等を被覆するキャップとからなる圧電振動子において
、前記金属配線と支持体との接合をレーザービーム溶接
で行ったことを特徴とする圧電振動子。
1. A ceramic substrate provided with metal wiring, and at least two metal supports mounted at predetermined positions of the metal wiring and having a joint portion with the metal wiring and a mounting portion for a piezoelectric diaphragm. In the piezoelectric vibrator, the piezoelectric vibrator is constructed of a piezoelectric diaphragm installed between the mounting portions of the support and having an excitation electrode formed on its surface, and a cap covering the piezoelectric diaphragm, etc., in which the metal wiring and the support are connected. A piezoelectric vibrator characterized by joining by laser beam welding.
【請求項2】  一対の支持体をフレーム枠で一体化し
、これが連続的に連なったリードフレームを用意し、ま
た金属配線が施こされたセラミック基板を前記一対の支
持体の間隔と等間隔に複数個配置し、支持体の接合部を
前記金属配線の接合パッドに当接させ、レーザービーム
溶接にて支持体と金属配線の両接合部分を接合するとと
もに、支持体とフレーム枠との連結部を同じくレーザー
ビームにて切断したことを特徴とする圧電振動子の製造
方法。
2. A pair of supports are integrated with a frame frame, a lead frame is prepared in which these are continuously connected, and a ceramic substrate on which metal wiring is applied is arranged at equal intervals to the spacing between the pair of supports. A plurality of pieces are arranged, the joint part of the support body is brought into contact with the joint pad of the metal wiring, and both the joint parts of the support body and the metal wiring are joined by laser beam welding, and the connection part between the support body and the frame frame is A method for manufacturing a piezoelectric vibrator, characterized in that the piezoelectric vibrator is cut using a laser beam.
JP3169271A 1991-06-13 1991-06-13 Manufacturing method of piezoelectric vibrator Expired - Lifetime JP2595840B2 (en)

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Application Number Priority Date Filing Date Title
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JPH04367111A true JPH04367111A (en) 1992-12-18
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07122959A (en) * 1993-10-27 1995-05-12 Daishinku Co Surface-mounted type crystal oscillator
US5585687A (en) * 1994-02-23 1996-12-17 Citizen Watch Co., Ltd. Piezolelectric oscillator
US5647932A (en) * 1993-05-18 1997-07-15 Matsushita Electric Industrial Co., Ltd. Method of processing a piezoelectric device
KR100470591B1 (en) * 2002-12-09 2005-03-09 삼성전자주식회사 Gyroscope and fabrication method therefor
JP2007109883A (en) * 2005-10-13 2007-04-26 Tdk Corp Ceramic electronic component and method of manufacturing same

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JPS5333359A (en) * 1976-09-09 1978-03-29 Pioneer Electronic Corp Method of manufacturing choke coil
JPS57132205A (en) * 1981-02-09 1982-08-16 Mitsubishi Electric Corp Programming device
JPS5850813A (en) * 1981-09-21 1983-03-25 Tokyo Denpa Kk Manufacture of crystal oscillator
JPS5936618U (en) * 1982-08-31 1984-03-07 キンセキ株式会社 piezoelectric vibrator container
JPS60197959A (en) * 1984-03-19 1985-10-07 Fujitsu Ltd Manufacture of optical disk
JPS60224254A (en) * 1984-04-20 1985-11-08 Hitachi Yonezawa Denshi Kk Lead frame cutting method
JPS6250096A (en) * 1985-08-29 1987-03-04 Toshiba Corp Laser welding method
JPS62105624U (en) * 1985-12-23 1987-07-06
JPS6381962A (en) * 1986-09-26 1988-04-12 Hitachi Ltd Manufacture of semiconductor device
JPH0249835A (en) * 1988-08-10 1990-02-20 Toyo Tire & Rubber Co Ltd Heat insulative construction panel and method for installation
JPH02155259A (en) * 1988-12-07 1990-06-14 Nec Corp Manufacturing equipment for semiconductor

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Publication number Priority date Publication date Assignee Title
JPS5333359A (en) * 1976-09-09 1978-03-29 Pioneer Electronic Corp Method of manufacturing choke coil
JPS57132205A (en) * 1981-02-09 1982-08-16 Mitsubishi Electric Corp Programming device
JPS5850813A (en) * 1981-09-21 1983-03-25 Tokyo Denpa Kk Manufacture of crystal oscillator
JPS5936618U (en) * 1982-08-31 1984-03-07 キンセキ株式会社 piezoelectric vibrator container
JPS60197959A (en) * 1984-03-19 1985-10-07 Fujitsu Ltd Manufacture of optical disk
JPS60224254A (en) * 1984-04-20 1985-11-08 Hitachi Yonezawa Denshi Kk Lead frame cutting method
JPS6250096A (en) * 1985-08-29 1987-03-04 Toshiba Corp Laser welding method
JPS62105624U (en) * 1985-12-23 1987-07-06
JPS6381962A (en) * 1986-09-26 1988-04-12 Hitachi Ltd Manufacture of semiconductor device
JPH0249835A (en) * 1988-08-10 1990-02-20 Toyo Tire & Rubber Co Ltd Heat insulative construction panel and method for installation
JPH02155259A (en) * 1988-12-07 1990-06-14 Nec Corp Manufacturing equipment for semiconductor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5647932A (en) * 1993-05-18 1997-07-15 Matsushita Electric Industrial Co., Ltd. Method of processing a piezoelectric device
JPH07122959A (en) * 1993-10-27 1995-05-12 Daishinku Co Surface-mounted type crystal oscillator
US5585687A (en) * 1994-02-23 1996-12-17 Citizen Watch Co., Ltd. Piezolelectric oscillator
KR100470591B1 (en) * 2002-12-09 2005-03-09 삼성전자주식회사 Gyroscope and fabrication method therefor
JP2007109883A (en) * 2005-10-13 2007-04-26 Tdk Corp Ceramic electronic component and method of manufacturing same

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