JP2002330049A - Surface acoustic wave device and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To protect and seal a surface acoustic wave element without exerting influence on operation of the surface acoustic wave element by using a simple constitution and simple processes. SOLUTION: A surface acoustic wave device 10 is provided with a mounting substrate 11, the surface acoustic wave element 13 mounted on the substrate 11, and a resin film 15 for protecting the surface acoustic wave element 13. A space 16 is formed between the surface 11a of the substrate 11 and the surface 13a of the surface acoustic wave element 13 which surfaces face each other. The resin film 15 is provided with a domed part 15a for covering the surface acoustic wave element 13 and a peripheral part 15b arranged in a part of periphery of the surface acoustic wave element 13. The resin film 15 is so arranged on the substrate 11 that the surface acoustic wave element 13 is surrounded with the domed part 15a, and the peripheral part 15b is bonded to the substrate 11 at the part of the periphery of the surface acoustic wave element 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface acoustic wave device provided with a mounting board and a surface acoustic wave device mounted on the mounting board, and a method of manufacturing the same.

[0002]

2. Description of the Related Art A surface acoustic wave device is one in which a comb-shaped electrode is formed on one surface of a piezoelectric substrate. This surface acoustic wave element is widely used as a filter in a mobile communication device such as a mobile phone.

[0003] By the way, electronic components such as semiconductor components are mounted on a mounting substrate, connection electrodes of the electronic component are electrically connected to conductor patterns of the mounting substrate, and connection electrodes of the electronic component are connected to the mounting substrate. Is often used in the form of a package having a structure in which an electrical connection with the conductive pattern is sealed. The same applies when the electronic component is a surface acoustic wave element. In the present application, a device including a mounting board and electronic components mounted on the mounting board is referred to as an electronic device. A device including a mounting substrate and a surface acoustic wave element mounted on the mounting substrate is called a surface acoustic wave device.

In an electronic device, a method of electrically connecting a connection electrode of an electronic component to a conductor pattern of a mounting board is roughly divided into a method of arranging the electronic component such that a surface of the electronic component having the connection electrode faces the mounting board. Face-down bonding, and face-up bonding in which electronic components are arranged such that the surface of the electronic component having connection electrodes faces the opposite side to the mounting substrate. To reduce the size of electronic devices,
Face-down bonding is more advantageous.

In a conventional method of manufacturing an electronic device employing face-down bonding, a connection electrode of an electronic component is electrically connected to a conductor pattern of a mounting substrate, and then an underfill material is provided between the electronic component and the mounting substrate. To seal the electrical connection between the connection electrode of the electronic component and the conductor pattern of the mounting board.

However, when the electronic component is a surface acoustic wave device, there is a problem peculiar to the surface acoustic wave device, so that the above-described general method is not used. The problem peculiar to the surface acoustic wave element is that, in the surface acoustic wave element, a comb-shaped electrode is formed on the surface thereof, and the surface acoustic wave element is sealed so that foreign substances such as moisture and dust do not adhere to the comb-shaped electrode. On the other hand, it is necessary to prevent sealing resin or the like from contacting the surface acoustic wave propagation region on the surface of the surface acoustic wave element so as not to affect the operation of the surface acoustic wave element. That is.

Therefore, conventionally, as a method of manufacturing an electronic device when the electronic component is a surface acoustic wave element, that is, a method of manufacturing a surface acoustic wave device, for example, a connection electrode of the surface acoustic wave element and a conductor pattern of a mounting board are used. After the electrical connection, a method of protecting and sealing the surface acoustic wave element by surrounding the surface acoustic wave element with a structure such as a cap made of ceramic or metal has been used. As another manufacturing method of the surface acoustic wave device, after electrically connecting the connection electrode of the surface acoustic wave element and the conductor pattern of the mounting board, the periphery of the surface acoustic wave element is surrounded by a side-fill material and sealed. There is a way to do it.

[0008]

In the method of manufacturing a surface acoustic wave device, the surface acoustic wave element is surrounded by a structure such as a cap made of ceramic, metal or the like to protect and seal the surface acoustic wave element. In the method of stopping, it is difficult to reduce the size of the surface acoustic wave device.

In the method of manufacturing a surface acoustic wave device,
The method of sealing the surface acoustic wave element by surrounding it with a sidefill material has a problem that the sidefill material may enter a surface acoustic wave propagation region on the surface of the surface acoustic wave element.

A first object of the present invention is to provide a surface acoustic wave device including a mounting board and a surface acoustic wave element mounted on the mounting board. Another object of the present invention is to provide a surface acoustic wave device capable of protecting a surface acoustic wave element with a simple structure without affecting the operation of the surface acoustic wave element.

According to a second object of the present invention, in addition to the first object, a surface acoustic wave element can be sealed with a simple structure without affecting the operation of the surface acoustic wave element. To provide a surface acoustic wave device.

A third object of the present invention is a method for manufacturing a surface acoustic wave device including a mounting substrate and a surface acoustic wave element mounted on the mounting substrate, and the method comprises the steps of: An object of the present invention is to provide a method of manufacturing a surface acoustic wave device that can protect a surface acoustic wave element without affecting the operation of the element.

A fourth object of the present invention, in addition to the third object, is to seal a surface acoustic wave element by a simple process without affecting the operation of the surface acoustic wave element. To provide a method for manufacturing a surface acoustic wave device.

[0014]

A surface acoustic wave device according to the present invention has a mounting substrate having a conductor pattern exposed on one surface and a connection electrode on one surface, and the surface having the connection electrode is mounted on the surface. A surface acoustic wave which is arranged so as to face one surface of the substrate and form a space between these two surfaces, and the connection electrode is electrically connected to the conductor pattern of the mounting substrate and mechanically joined. The device has a dome-shaped portion surrounding the surface acoustic wave element, and is provided with a resin film that surrounds the surface acoustic wave element and is adhered to the mounting substrate at a portion around the surface acoustic wave element.

In the surface acoustic wave device according to the present invention, the surface acoustic wave element is protected by a resin film having a dome-shaped portion.

In the surface acoustic wave device according to the present invention, the resin film may seal the surface acoustic wave element.

According to the method of manufacturing a surface acoustic wave device of the present invention, there is provided a mounting substrate having a conductor pattern exposed on one surface and a connection electrode on one surface, and the surface having the connection electrode is provided on one side of the mounting substrate. And a surface acoustic wave element in which a connection electrode is electrically connected to the conductor pattern of the mounting substrate and mechanically joined, and is arranged so as to face the surface of the substrate and to form a space between the two surfaces. A method for manufacturing a surface acoustic wave device comprising: a surface acoustic wave device, wherein one surface of a surface acoustic wave element faces one surface of a mounting substrate, and a space is formed between the two surfaces. A step of arranging a wave element and a mounting substrate, electrically connecting a connection electrode of the surface acoustic wave element to a conductor pattern of the mounting board and mechanically joining the same, and a dome-shaped portion surrounding the surface acoustic wave element. Elastic resin film Placing so as to surround the surface wave device, in which a step of adhering a resin film to a mounting substrate in the portion of the periphery of the surface acoustic wave device.

In the method of manufacturing a surface acoustic wave device according to the present invention,
The resin film having a dome-shaped portion is disposed so as to surround the surface acoustic wave element, and is adhered to the mounting substrate at a portion around the surface acoustic wave element. Then, the surface acoustic wave element is protected by the resin film.

In the method of manufacturing a surface acoustic wave device according to the present invention, the resin film may seal the surface acoustic wave element.

In the method of manufacturing a surface acoustic wave device according to the present invention, the step of disposing the resin film includes a dome-shaped inner wall and suction means for sucking gas in a space surrounded by the inner wall. The step of changing the shape of the resin film so that a part thereof becomes a dome shape by sucking the resin film using a jig and holding the resin film, and the step of elastically deforming the resin film held by the jig Arranging so as to surround the surface acoustic wave element. In this case, in the step of bonding the resin film, the resin film may be bonded to the mounting substrate while the resin film is pressed toward the mounting substrate in the peripheral portion of the surface acoustic wave element by a jig.

In the method of manufacturing a surface acoustic wave device according to the present invention, the step of bonding the resin film includes heating the resin film so that the resin film has flexibility and then curing the resin film. Thus, the resin film may be bonded to the mounting substrate.

[0022]

Embodiments of the present invention will be described below in detail with reference to the drawings. First, a configuration of a surface acoustic wave device according to an embodiment of the present invention will be described with reference to FIG. The surface acoustic wave device 10 according to the present embodiment has a mounting substrate 11 having a conductor pattern 12 exposed on one surface 11a, and a connection electrode 14 on one surface 13a.
a is arranged so as to face one surface 11a of the mounting substrate 11 and to form a space 16 between the two surfaces 13a, 11a, and the connection electrode 14 is electrically connected to the conductor pattern 12 of the mounting substrate 11. The surface acoustic wave element 13 is connected and mechanically joined, and a resin film 15 for protecting the surface acoustic wave element 13 is provided.

The resin film 15 is formed on the surface acoustic wave element 13.
(Hereinafter, referred to as a dome-shaped portion) 15a and a portion (hereinafter, referred to as a peripheral portion) 15b disposed around the surface acoustic wave element 13. The cross-sectional shape of the dome-shaped portion 15a may be a part of a circle or an ellipse, or may be a curved shape similar to these. The resin film 15 has a dome-shaped portion 15.
a is disposed on the mounting substrate 11 so as to surround the surface acoustic wave element 13, and a peripheral portion 15 b is adhered to the mounting substrate 11 in a peripheral portion of the surface acoustic wave element 13. The dome-shaped portion 15a is mounted on the mounting substrate 11 of the surface acoustic wave element 13.
Does not contact the opposite surface 13b.

Between the dome-shaped portion 15a and the mounting board 11, there is formed a cavity 17 containing a surface acoustic wave element 13 therein and filled with a predetermined gas. The gas referred to here is air, nitrogen gas, inert gas or the like. Further, the thickness of the resin film 15 and the shape of the dome-shaped portion 15a can be adjusted even if a slight difference occurs in the gas pressure inside and outside the cavity 17 formed between the dome-shaped portion 15a and the mounting substrate 11. The portion 15a is appropriately set so that the shape can be maintained.

The mounting substrate 11 is formed of glass, resin, ceramic, or the like. As described above, the surface acoustic wave element 13 is mounted on the mounting substrate 11 by face-down bonding in which the surface 13 a having the connection electrode 14 faces the mounting substrate 11.

The peripheral portion 15b of the resin film 15 is formed on one surface 11a of the mounting
3 is in close contact with the entire periphery. As a result, the resin film 15 seals the entire surface acoustic wave element 13 including the electrical connection between the connection electrode 14 of the surface acoustic wave element 13 and the conductor pattern 12 of the mounting board 11.

The resin film 15 is made of, for example, a thermosetting resin such as an epoxy resin. The thickness of the resin film 15 is, for example, 50 to 150 μm.

Next, an outline of a method of manufacturing the surface acoustic wave device 10 according to the present embodiment will be described. In the method of manufacturing the surface acoustic wave device 10, one surface 13a of the surface acoustic wave element 13 is opposed to one surface 11a of the mounting substrate 11, and a space 16 is formed between the two surfaces 13a. As described above, the surface acoustic wave element 13 and the mounting board 11 are arranged, and the connection electrodes 14 of the surface acoustic wave element 13 are mounted on the mounting board 1.
Electrically connecting and mechanically joining the first conductive pattern 12 and the resin film 15 having a dome-shaped portion 15 a surrounding the surface acoustic wave element 13.
3 and a step of bonding the resin film 15 to the mounting substrate 11 in a peripheral portion of the surface acoustic wave element 13.

Next, an example of characteristics of the resin film 15 used in the present embodiment will be conceptually described with reference to FIG. In FIG. 2, white circles and solid lines indicate the correspondence between the temperature of the resin film 15 and the length in an arbitrary direction. In FIG. 2, black circles and broken lines indicate BT for comparison with the characteristics of the resin film 15.
(Bismaleimide triazine) Shows the correspondence between the temperature and the length in an arbitrary direction in a resin whose shape is stable against a temperature change such as a resin. As shown by reference numeral 110, the length of the resin whose shape is stable with respect to the temperature change changes almost linearly with the temperature change.

When the temperature of the resin film 15 is room temperature (room temperature) RT, the film shape is maintained. As indicated by reference numeral 101, when the temperature of the resin film 15 is increased from the room temperature RT to the glass transition temperature TG, the resin film 15 gradually softens and changes in length almost linearly with the temperature change. Inflate to do. Code 10
As shown by 2, as the temperature of the resin film 15 is increased from the glass transition temperature TG to the curing start temperature HT, the resin film 15 becomes flexible and expands rapidly. As indicated by reference numeral 103, when the temperature of the resin film 15 is equal to or higher than the curing start temperature HT, the resin film 15 starts to cure. When the curing of the resin film 15 is completed, the resin film 15 contracts as indicated by reference numeral 104. After the curing of the resin film 15 is completed, as indicated by reference numeral 105, the resin film 15
Even when the temperature is increased, the shape is stabilized against a temperature change without softening or having flexibility again. The curing start temperature HT varies depending on the characteristics of the resin film 15, but is, for example, about 150 to 200 ° C., and is 150 ° C. in the case of the resin film 15 formed using an epoxy resin.
It is around ° C. Further, the time required from the start of the curing of the resin film 15 to the end of the curing also varies depending on the characteristics of the resin film 15.

The characteristics of the resin film 15 shown in FIG. 2 are conceptual only. So, for example,
If the amount of temperature change per unit time changes, resin film 1
5 also changes.

In the method of manufacturing the surface acoustic wave device 10 according to the present embodiment, for example, the resin film 15 is softened by increasing the temperature of the resin film 15 so that a part of the resin film 15 becomes a dome shape. Change the shape of 15
This resin film 15 is arranged on the mounting board 11 so as to surround the surface acoustic wave element 13. Thereafter, the temperature of the resin film 15 is further increased to make the resin film 15 flexible, and then the resin film 15 is cured, so that the resin film 15 is adhered to the mounting substrate 11 and the resin film 15 Fix the shape of.

If the resin film 15 has sufficient flexibility even at room temperature, the resin film
5 may be deformed to determine its shape, and then the resin film 15 may be cured by increasing the temperature of the resin film 15.

In a state where the resin film 15 is softened at a temperature equal to or lower than the glass transition temperature, the resin film 1
After determining the shape of the resin film 5, the resin film 15 may be cured over a relatively long time at a temperature equal to or lower than the glass transition temperature.

When the resin film 15 is formed of a resin that is softened by ultraviolet rays, instead of raising the temperature of the resin film 15 to soften the resin film 15, the resin film 15 is irradiated with ultraviolet rays to be softened. The film 15 may be softened. Alternatively, the resin film 15 may be softened by irradiating the resin film 15 with ultraviolet rays while increasing the temperature of the resin film 15.

When the resin film 15 is formed of a resin that is cured by ultraviolet rays, instead of raising the temperature of the resin film 15 to cure the resin film 15, the resin film 15 is irradiated with ultraviolet rays to cure the resin film. The film 15 may be cured. Alternatively, the resin film 15 may be cured by increasing the temperature of the resin film 15 and irradiating the resin film 15 with ultraviolet rays.

As a method for electrically connecting and mechanically connecting the connection electrode 14 of the surface acoustic wave element 13 and the conductor pattern 12 of the mounting board 11, various known bonding methods in face-down bonding can be used. .

Next, with reference to FIG.
An example of the configuration 3 will be described. The surface acoustic wave element 13 shown in FIG. 3 includes a piezoelectric substrate 21, a comb-shaped electrode 22 and a conductor pattern 23 formed on one surface of the piezoelectric substrate 21, and a connection electrode formed at an end of the conductor pattern 23. 24. The connection electrode 24 corresponds to the connection electrode 14 in FIG. The surface acoustic wave element 13 is an element that uses a surface acoustic wave generated by the comb-shaped electrode 22 for a basic operation, and has a function as a bandpass filter in the present embodiment.

In FIG. 3, the connection electrode 24 labeled "IN" is an input terminal, the connection electrode 24 labeled "OUT" is an output terminal, and the connection electrode 24 labeled "GND" This is a ground terminal. Also, in FIG.
An area surrounded by a broken line indicated by reference numeral 25 is an area including the surface acoustic wave propagation area and in which it is necessary to prevent a sealing material or the like from entering inside.

Next, a method for manufacturing the surface acoustic wave device 10 according to the present embodiment will be described in detail with reference to FIGS. In the present embodiment, the surface acoustic wave devices 10 may be manufactured one by one, or a plurality of surface acoustic wave devices 10 may be manufactured.
May be manufactured simultaneously. Hereinafter, a case where a plurality of surface acoustic wave devices 10 are manufactured at the same time will be described.

In the method of manufacturing the surface acoustic wave device according to the present embodiment, first, as shown in FIG. 4, one surface 13a of the surface acoustic wave element 13 is connected to one surface 11a of the mounting substrate 11.
The surface acoustic wave element 13 is disposed on the mounting substrate 11 such that a space 16 is formed between the two surfaces 13a and 11a.
4 is electrically connected to the conductor pattern 12 of the mounting board 11 and mechanically joined. The mounting substrate 1 in FIG.
1 includes a portion corresponding to a plurality of surface acoustic wave elements 13. A plurality of surface acoustic wave elements 13 are arranged on the mounting board 11.

Next, as shown in FIG.
A resin film 15 having a plane shape substantially the same as the shape of the one surface 11a is prepared, and a part of the resin film 15 is placed on the mounting substrate 11 by using a jig 38. The shape of the resin film 15 is changed so as to form a dome shape surrounding the resin film 13, and the resin film 15 is held.

The jig 38 has a jig main body 38A and a suction pipe 38B connected to the jig main body 38A.
The jig body 38A has a dome-shaped inner wall portion 38Aa surrounding the surface acoustic wave element 13 arranged on the mounting board 11, and an opening facing downward. A hole 38Ab is formed at the upper end of the jig body 38A. Suction tube 38B
Is connected to the jig body 38A so as to communicate with the hole 38Ab of the jig body 38A. The other end of the suction tube 38B is connected to a vacuum pump 39. Suction tube 38
B corresponds to the suction means in the present invention. The jig 38 used when simultaneously manufacturing the plurality of surface acoustic wave devices 10 is an aggregate of a plurality of portions corresponding to the respective surface acoustic wave elements 13.

When the shape of the resin film 15 is changed by using the jig 38, the jig body 38A is placed on the resin film 15 with the opening part downward, and the vacuum pump 39 and the suction pipe 38B are used. , Inner wall 3 of jig body 38A
The gas in the space surrounded by 8Aa is sucked. As a result, the resin film 15 is sucked together with the gas, and the resin film 15 is partially deformed into a dome shape surrounding the surface acoustic wave element 13 and held by the jig 38. The gas referred to here is air, nitrogen gas, inert gas, or the like, although it differs depending on the atmosphere in which the processing is performed.

The above processing is performed by heating the resin film 15 with a heater (not shown) or the like.
5 may be performed in a softened state. However, the temperature of the resin film 15 at that time is set lower than the temperature at which the resin film 15 cures. When the resin film 15 is formed of a resin that is softened by ultraviolet rays, instead of raising the temperature of the resin film 15 to soften the resin film 15,
May be irradiated with ultraviolet rays to soften the resin film 15. Alternatively, the resin film 15 is irradiated with ultraviolet rays while the temperature of the resin film 15 is increased.
May be softened.

As described above, by changing the shape of the resin film 15 using the jig 38, the shape of the resin film 15 can be easily determined. Further, by changing the shape of the resin film 15 in a state where the resin film 15 is softened, the shape of the resin film 15 can be more easily determined. If the resin film 15 has sufficient flexibility even at room temperature, the shape of the resin film 15 may be changed only by the jig 38 without heating the resin film 15.

Note that the order of the steps shown in FIG. 4 and the steps shown in FIG. 5 may be reverse to the order in the above description, and the step shown in FIG.

Next, as shown in FIG. 6, the resin film 15 held by the jig 38 is
3 is mounted on the mounting board 11 so as to surround the mounting substrate 3.

Next, as shown in FIG. 7, the resin film 15 is heated by the jig 38 while the resin film 15 is pressed against the mounting substrate 11 in the peripheral portion of the surface acoustic wave element 13. Mounting resin film 15 on mounting substrate 11
Glue to In the present embodiment, a heater 37 on which the mounting substrate 11 is placed is used as a means for heating the resin film 15. However, other means may be used as the heating means. Mounting resin film 15 on mounting substrate 11
When bonding to the mounting substrate 1,
1 and the resin film 15 are heated so that the resin film 1
The temperature of 5 is not less than the temperature at which the resin film 15 cures. As a result, the resin film 15 is made flexible and then cured, so that the resin film 15 is bonded to the mounting board 11 and the shape of the resin film 15 is fixed. The method of pressing the resin film 15 by the jig 38 may be a method of pressing the resin film 15 by its own weight, or a method of pressing the jig 38 downward by a weight (not shown) or a pressing device. Alternatively, the resin film 15 may be pressed.

As described above, by adhering the resin film 15 to the mounting substrate 11 in the peripheral portion of the surface acoustic wave element 13, the space between the dome-shaped portion 15a of the resin film 15 and the mounting substrate 11 A cavity 17 containing a surface acoustic wave element 13 therein and filled with a gas which is an atmosphere for performing the bonding process is formed.

When the resin film 15 is formed of a resin which is cured by ultraviolet rays, instead of raising the temperature of the resin film 15 and curing the resin film 15, the resin film 15 is irradiated with ultraviolet rays to cure the resin film 15. The film 15 may be cured. Alternatively, the resin film 15 may be cured by increasing the temperature of the resin film 15 and irradiating the resin film 15 with ultraviolet rays.

Next, as shown in FIG. 8, the mounting substrate 11 and the resin film 15 are cut at the cutting position indicated by reference numeral 41.
To complete individual surface acoustic wave devices 10.
FIG. 9 shows the mounting substrate 1 before the cutting step shown in FIG.
FIG. 1 is a plan view showing a surface acoustic wave element 13 and a resin film 15. The method of manufacturing the surface acoustic wave devices 10 one by one is the same as the method of manufacturing a plurality of surface acoustic wave devices 10 except that the step of cutting the mounting substrate 11 and the resin film 15 is not required. Is the same as

As described above, in the surface acoustic wave device 10 and the method of manufacturing the same according to the present embodiment, the resin film 15 having the dome-shaped portion 15a surrounding the surface acoustic wave element 13 It is arranged so as to surround it, and is bonded to the mounting substrate 11 at a portion around the surface acoustic wave element 13. Then, the surface acoustic wave element 13 is protected and sealed by the resin film 15. In the present embodiment, the space between the surface acoustic wave element 13 and the mounting substrate 11 is not filled with the underfill material. Therefore, according to the present embodiment, surface acoustic wave element 13 can be protected and sealed with a simple configuration and a simple process without affecting the operation of surface acoustic wave element 13.

In the present embodiment, the cavity 17 formed between the dome-shaped portion 15a and the mounting substrate 11 is formed.
Do not make the difference in gas pressure positively inside and outside. However, in practice, there may be a difference in gas pressure inside and outside the cavity 17. For example, when the resin film 15 is heated and the resin film 15 is bonded to the mounting substrate 11, the surface acoustic wave device 10 is completed after the completion of the surface acoustic wave device 10.
The pressure of the gas in the cavity 17 when is placed at room temperature is
The pressure becomes smaller than the pressure of the gas in the cavity 17 when the resin film 15 is heated. Therefore, the surface acoustic wave device 10
Is at room temperature, the pressure of the gas in the cavity 17 becomes
The pressure may be lower than the pressure of the gas outside the cavity 17.

In the present embodiment, the surface acoustic wave element 13 is protected and sealed by the dome-shaped portion 15a of the resin film 15. It is well known that the dome shape is a shape that is not easily deformed by an external force. Therefore, according to the present embodiment, even if there is a slight difference in gas pressure inside and outside the cavity 17, the dome-shaped portion 15a can maintain its shape.

According to the present embodiment, the shape of the resin film 15 is changed and the resin film 15 is held by using the jig 38, so that the shape of the resin film 15 can be easily determined. In addition, the resin film 15 having the determined shape can be covered on the surface acoustic wave element 13 and the mounting board 11 while holding the resin film 15 by the jig 38, and the handling of the resin film 15 becomes easy.

In this embodiment, the resin film 15 is adhered to the mounting substrate 11 while the resin film 15 is pressed against the mounting substrate 11 at the peripheral portion of the surface acoustic wave element 13 by the jig 38. , Resin film 1
5 can be firmly bonded to the mounting substrate 11. Thereby, the bonding state between the resin film 15 and the mounting board 11 can be kept stable.

According to the present embodiment, since the surface acoustic wave element 13 is sealed by the resin film 15,
With a simple configuration and a simple process, the surface acoustic wave element 13 can be sealed without affecting the operation of the surface acoustic wave element 13. Thereby, the resistance of the surface acoustic wave device 10 to the environment or the like can be secured.

According to the present embodiment, one surface 13 a of surface acoustic wave element 13 and one surface 1
Since the space 16 is formed between the surface acoustic wave element 1a and the other surface, it is possible to prevent the operation of the surface acoustic wave element 13 from being affected by one surface 13a of the surface acoustic wave element 13 coming into contact with another object. it can.

From the above, according to the present embodiment, the reliability of the surface acoustic wave device 10 can be improved. Also, according to the present embodiment, the resin film 15
Is used to seal the surface acoustic wave element 13, so that the surface acoustic wave device 10 is made smaller and lighter than when the surface acoustic wave element 13 is sealed using a structure such as a cap. In addition, the thickness can be reduced. Further, according to the present embodiment, since the surface acoustic wave element 13 is sealed using the resin film 15, the above-described effects can be obtained at low cost.

The present invention is not limited to the above-described embodiment, and various modifications are possible. For example, in the present invention, 1
A plurality of surface acoustic wave elements may be housed in one dome-shaped portion 15a.

[0062]

As described above, claim 1 or claim 2
According to the surface acoustic wave device described above, since a space is formed between one surface of the surface acoustic wave element and one surface of the mounting board, one surface of the surface acoustic wave element is connected to another object. This brings about an effect that the operation of the surface acoustic wave element can be prevented from being affected by the contact. Further, according to the present invention, since it has a dome-shaped portion surrounding the surface acoustic wave element, and has a resin film adhered to the mounting substrate in a portion surrounding the surface acoustic wave element and around the surface acoustic wave element, With the simple configuration, the surface acoustic wave element can be protected without affecting the operation of the surface acoustic wave element. According to the present invention,
Even if there is a slight difference in gas pressure between the inside and outside of the cavity formed between the dome-shaped portion of the resin film and the mounting board, the dome-shaped portion can maintain the shape. .

According to the surface acoustic wave device of the second aspect, since the surface acoustic wave element is sealed by the resin film, the operation of the surface acoustic wave element is not affected by a simple structure. There is an effect that the surface acoustic wave element can be sealed.

According to the method of manufacturing a surface acoustic wave device according to any one of claims 3 to 7, a space is formed between one surface of the surface acoustic wave element and one surface of the mounting board. Therefore, it is possible to prevent the operation of the surface acoustic wave element from being affected by one surface of the surface acoustic wave element coming into contact with another object. Also,
According to the present invention, a resin film having a dome-shaped portion surrounding the surface acoustic wave element is arranged so as to surround the surface acoustic wave element, and the resin film is adhered to the mounting substrate in a peripheral portion of the surface acoustic wave element. Therefore, there is an effect that the surface acoustic wave element can be protected by a simple process without affecting the operation of the surface acoustic wave element. Further, according to the present invention, the dome-shaped portion maintains its shape even if there is a slight difference in gas pressure inside and outside the cavity formed between the dome-shaped portion of the resin film and the mounting substrate. It has the effect that it can be done.

According to the method of manufacturing a surface acoustic wave device according to the fourth aspect, since the surface acoustic wave element is sealed with the resin film, the operation of the surface acoustic wave element is affected in a simple process. There is an effect that the surface acoustic wave element can be sealed without the need.

According to the method of manufacturing a surface acoustic wave device according to the fifth or sixth aspect, the shape of the resin film is changed using the jig, and the resin film is held and arranged. It is possible to easily determine the shape of the resin film and to easily handle the resin film.

According to the method of manufacturing a surface acoustic wave device according to the sixth aspect, the step of bonding the resin film includes the step of applying the resin film to the mounting substrate side in a peripheral portion of the surface acoustic wave element by using a jig. The resin film is bonded to the mounting board while pressing, so that the resin film can be firmly bonded to the mounting board, thereby stably maintaining the bonding state between the resin film and the mounting board. It works.

[Brief description of the drawings]

FIG. 1 is a sectional view of a surface acoustic wave device according to an embodiment of the present invention.

FIG. 2 is an explanatory view conceptually showing an example of characteristics of a resin film used in an embodiment of the present invention.

FIG. 3 is a plan view showing an example of a configuration of a surface acoustic wave device according to one embodiment of the present invention.

FIG. 4 is an explanatory view showing one step in a method for manufacturing a surface acoustic wave device according to one embodiment of the present invention.

FIG. 5 is an explanatory view showing a step following the step shown in FIG. 4;

FIG. 6 is an explanatory view showing a step following the step shown in FIG. 5;

FIG. 7 is an explanatory view showing a step following the step shown in FIG. 6;

FIG. 8 is an explanatory view showing a step following the step shown in FIG. 7;

FIG. 9 shows a mounting board before the cutting step shown in FIG. 8;
FIG. 3 is a plan view showing a surface acoustic wave element and a resin film.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Surface acoustic wave device, 11 ... Mounting board, 12 ... Conductor pattern, 13 ... Surface acoustic wave element, 14 ... Connection electrode, 15
... resin film, 15a ... dome-shaped portion, 16 ... space, 17 ... cavity, 37 ... heater, 38 ... jig.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Shinichiro Hayashi 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDC Corporation (72) Inventor ▲ Taka ▼ Hashiyuki 1 Tsukiji, Kisarazu-shi, Chiba Nippon Steel Inside the Electronic Materials Research Laboratory, Chemical Company (72) Inventor Chihiro Hatano 1 Tsukiji, Kisarazu-shi, Chiba F-term in the Electronic Materials Laboratory, Nippon Steel Chemical Co., Ltd. 5J097 AA24 AA33 HA04 HA09 JJ03

Claims (7)

[Claims] 1. A mounting substrate having a conductor pattern exposed on one surface, a connecting electrode on one surface, a surface having the connecting electrode facing one surface of the mounting substrate, and A surface acoustic wave element arranged so that a space is formed between the surfaces, the connection electrode being electrically connected to the conductor pattern of the mounting substrate and being mechanically joined; and surrounding the surface acoustic wave element A surface acoustic wave device comprising: a dome-shaped portion; and a resin film that surrounds the surface acoustic wave element and is bonded to the mounting substrate at a portion around the surface acoustic wave element. 2. The surface acoustic wave device according to claim 1, wherein the resin film seals the surface acoustic wave element. 3. A mounting substrate having a conductor pattern exposed on one surface and a connection electrode on one surface, the surface having the connection electrode facing one surface of the mounting substrate, and A surface acoustic wave device comprising: a surface acoustic wave element disposed so that a space is formed between the surfaces, wherein the connection electrode is electrically connected to a conductor pattern of the mounting substrate and mechanically joined. A method of manufacturing, wherein the surface acoustic wave element and the mounting substrate are arranged such that one surface of the surface acoustic wave element faces one surface of the mounting substrate and a space is formed between the two surfaces. A step of electrically connecting and mechanically joining a connection electrode of the surface acoustic wave element to a conductor pattern of the mounting board; and a resin film having a dome-shaped portion surrounding the surface acoustic wave element. The bullet Placing so as to surround the surface acoustic wave device, method of manufacturing a surface acoustic wave device, characterized in that said resin film at the portion of the periphery of the surface acoustic wave device and a step of bonding the mounting substrate. 4. The method according to claim 3, wherein the resin film seals the surface acoustic wave element. 5. A step of disposing the resin film, wherein the resin film is sucked by using a jig having a dome-shaped inner wall and a suction means for sucking gas in a space surrounded by the inner wall. A step of changing the shape of the resin film so that a part thereof has a dome shape and holding the resin film; and enclosing the resin film held by the jig with the surface acoustic wave element. 5. The method for manufacturing a surface acoustic wave device according to claim 3, further comprising the step of: 6. The step of bonding the resin film includes bonding the resin film to the mounting board while pressing the resin film toward the mounting board in a peripheral portion of the surface acoustic wave element by the jig. Claim 5
A manufacturing method of the surface acoustic wave device according to the above. 7. The step of bonding the resin film includes bonding the resin film to a mounting substrate by heating the resin film so that the resin film has flexibility and then curing the resin film. A method for manufacturing a surface acoustic wave device according to any one of claims 3 to 6, wherein: