JP2013193388A - Injection molding machine, mold, and method of manufacturing hollow sealing structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To consecutively mold a molding by molding of a cap, adhering of the cap to a substrate, and airtight sealing of an inside of the cap, while completely covering the cap with resin.SOLUTION: An injection molding machine includes: a frame 6 stood on a base 3; a main driving unit 60 which is fixed to the frame 6 and made to move forward and backward a sub plate 7b fitted with an upper mold unit 9 including an upper mold 40 and a side mold 50 provided to a periphery of the upper mold 40; a sub driving unit 70A which is fitted to the sub plate 7b and made to move forward and backward the upper mold 40 relatively to the side mold 50; and a slide unit 4 which performs mold matching of the first lower mold 20 with respect to the upper mold 40 or performs mold matching of the second lower mold 30 with respect to the upper mold 40 by sliding a lower mold unit 8 including a first lower mold 20 and a second lower mold 30 disposed side by side with respect to the first lower mold 20.

Description

  The present invention relates to an injection molding machine, a mold, and a method for manufacturing a hollow sealing structure.

  There has been proposed a hollow sealed structure product (hereinafter simply referred to as a hollow package) in which a chip such as a microwave device or an optical semiconductor element is hermetically sealed in a package having a hollow structure.

  In such a hollow package, a cap for housing the chip is put on a substrate mounted on the chip, and a joint for joining the cap and the substrate is formed around the cap so as to seal the inside of the cap. It has a structure.

  Japanese Patent Application Laid-Open No. 2011-1000082 proposes such a hollow package forming apparatus. In this forming apparatus, a first mold that forms an upper mold, a second mold that forms a lower mold in forming a cap, a third mold that forms a lower mold in molding a joint, and a fourth mold that forms a side mold. The hollow package is molded while replacing the respective molds.

  That is, at the time of molding the cap, a second mold is arranged opposite to the first mold, and the cap is molded by filling the cavity formed when these molds are clamped. To do. Then, when the mold is opened, the cap is released from the second mold and is fitted to the first mold.

  Next, the second mold and the third mold are switched, and the fourth mold is inserted between the third mold and the first mold. At this time, a substrate on which a chip is mounted is set in the third mold.

  When the setting of each mold is completed, the third mold and the first mold are clamped with the fourth mold interposed therebetween. By this clamping, the end of the cap abuts against the substrate, and a space is formed around the end of the cap. Therefore, the joint is molded by filling the space with resin.

JP 2011-1000082 A

  However, in the forming apparatus for forming the hollow package according to the above publication, since the joint portion is provided only around the cap, the space in which the chip is stored and the outside air are easily communicated (easy to leak) and highly airtight. It was difficult to maintain a proper state.

  Therefore, the main object of the present invention is to provide an injection molding machine and a mold for continuously forming a cap, attaching a cap to a substrate, and molding a mold that hermetically seals the inside of the cap while completely covering the cap. It is providing the manufacturing method of a hollow sealing structure.

  In order to solve the above problems, an injection molding machine for molding a hollow package includes a frame erected on a base, an upper mold fixed to the frame, and a side mold provided around the upper mold. A main drive unit that advances and retracts the sub-plate to which the mold unit is attached, a sub-drive unit that is attached to the sub-plate and advances and retracts the upper mold relative to the side mold, a first lower mold, and the first Slide the lower mold unit including the second lower mold juxtaposed to the lower mold to match the first lower mold to the upper mold, or to match the second lower mold to the upper mold And a slide unit.

  Further, a mold used for housing a chip placed on a substrate in a cap, forming a hollow package having a mold that covers the cap and is in close contact with the substrate is an upper mold, an upper mold, and the like. A first lower mold that forms a cap molding space for molding the cap when the mold is clamped; a side mold that is provided around the upper mold and moves up and down relatively with respect to the upper mold; and a substrate Is placed, and is replaced with the first lower mold to face the upper mold, and when the upper mold and the side mold are clamped, the cap is placed on the substrate, and the upper mold and the side mold And a second lower mold that forms a molding space for molding the mold.

  Furthermore, a method for producing a hollow sealing structure in which a chip placed on a substrate is housed in a cap, a hollow package provided with a mold that covers the cap and is in close contact with the substrate is formed by molding the cap. A cap molding process, a cap placing process for placing and supporting the cap on the substrate, and a mold molding process for completely molding the mold that completely covers the cap placed on the substrate and is in close contact with the substrate. , Including.

  According to the present invention, the molding of the cap, the deposition of the cap on the substrate, and the molding of the mold for hermetically sealing the inside of the cap while completely covering the cap are continuously performed, so that the occurrence of leakage can be prevented. Become.

1 is a side view of an injection molding machine according to a first embodiment of the present invention. It is sectional drawing of the hollow package as an example of the molded article shape | molded with the injection molding machine in 1st Embodiment. It is a flowchart which shows the manufacturing procedure of the hollow package concerning 1st Embodiment. It is a side view of the injection molding machine which shows the process concerning 1st Embodiment, (a) is the mold open state in a cap molding process, (b) is a figure which shows a mold clamping state. It is a side view of the injection molding machine which shows the process concerning 1st Embodiment, (a) is the cap molding state in a cap molding process, (b) is a figure which shows a mold open state. It is a side view of the injection molding machine which shows the process concerning 1st Embodiment, (a) is the mold clamping state in a molding process, (b) is a figure which shows a cap mounting state. It is a side view of the injection molding machine which shows the process concerning 1st Embodiment, (a) is a seal part molding state in a molding process, (b) is a figure which shows a cover part molding state. It is a figure which shows the state of a pressure sensor, a 2nd plunger, and an upper mold | type in the molding process concerning 1st Embodiment. It is a side view of the injection molding machine concerning the 2nd Embodiment of this invention. It is a flowchart which shows the manufacture procedure of the hollow package concerning 2nd Embodiment. It is a side view of the injection molding machine which shows the process concerning 2nd Embodiment, (a) is the mold open state in a molding process, (b) is a cap mounting state, (c) is a figure which shows a mold clamping state. is there. It is a side view of the injection molding machine which shows the process concerning 2nd Embodiment, (a) is a seal part molding state in a molding process, (b) is a figure which shows a cover part molding state. It is a side view of the injection molding machine concerning the 3rd Embodiment of this invention. It is a flowchart which shows the manufacture procedure of the hollow package concerning 3rd Embodiment. It is a side view of the injection molding machine which shows the process concerning 2nd Embodiment, (a) is the mold open state in a molding process, (b) is a cap mounting state, (c) is a figure which shows a mold molding state. is there.

<First Embodiment>
A first embodiment of the present invention will be described. FIG. 1 is a side view of an injection molding machine 2A according to the present embodiment. This injection molding machine 2 </ b> A includes a base 3, a slide unit 4, an elevating unit 5, and a frame 6 erected on the base 3.

  The lower unit 8 including the first lower mold 20 and the second lower mold 30 is attached to the slide unit 4 so that the lower molds 20 and 30 are moved in the horizontal direction by a drive mechanism (not shown). It has become.

  The elevating unit 5 includes a main plate 7a, a sub plate 7b, a main drive unit 60, and a sub drive unit 70A, and an upper mold unit 9 including an upper mold 40 and a side mold 50 is attached. The main plate 7 a is fixed to the head of the frame 6, and the sub plate 7 b is provided so as to be able to move up and down while being guided by the frame 6.

  The main drive unit 60 includes a main advance / retreat mechanism 61 such as a ball screw, an attachment portion 62, and a main drive portion 63. The main drive portion 63 is fixed to the main plate 7a, and the attachment portion 62 is fixed to the sub plate 7b. The main advance / retreat mechanism 61 is connected to the main drive unit 63 and the attachment unit 62, and the sub-plate 7b moves up and down in accordance with the rotation amount of the main drive unit 63.

  The sub drive unit 70A includes a sub drive unit 71 fixed to the sub plate 7b and a sub advance / retreat mechanism 72 such as a ball screw. One end of the sub advance / retreat mechanism 72 is connected to the sub drive unit 71, and the other end is connected to the upper mold 40. Accordingly, the upper mold 40 moves forward and backward with respect to the sub plate 7b according to the rotation amount of the sub drive unit 71. The upper die 40 is connected to the auxiliary advance / retreat mechanism 72 as described above, and the side die 50 is fixed to the auxiliary plate 7b.

  Next, the configuration of the upper mold 40, the side mold 50, the first lower mold 20, and the second lower mold 30 will be described in detail. At this time, a hollow package 10 as shown in FIG. 2 is assumed as a molded product. FIG. 2 is a cross-sectional view of the hollow package 10. Of course, this hollow package 10 is an example and does not limit the present invention.

  In the hollow package 10, a resin cap 13 is placed on a substrate 12 on which a chip 11 is mounted, and a resin cover (hereinafter referred to as a mold) 14 is provided on the cap 13. ing.

  The cap 13 is a bowl-shaped body having a space K for housing the chip 11, is formed by a cap leg portion 13 a and a cap top portion 13 b, and is placed on the substrate 12 (it is not necessary to be fixed). .

  On the other hand, the mold 14 completely covers the cap 13 and is in close contact with the substrate 12. At this time, a region corresponding to the cap leg portion 13a is referred to as a seal portion 14a, and a region corresponding to the cap top portion 13b is referred to as a cover portion 14b.

  By using various molds such as the injection molding machine 2A and the upper mold 40 described above, the cap 13 is molded (cap molding process), and the molded cap 13 is placed on the substrate 12 (cap placing process). The process of molding the mold 14 on the cap 13 placed on the substrate 12 (molding process) is continuously performed.

  As shown in FIG. 1, the upper mold 40 includes a recess 41 and an upper mold projecting mechanism 42, and is advanced and retracted with respect to the sub plate 7 b by a sub advance / retreat mechanism 72. At that time, the upper die 40 is guided by the side die 50.

  The side mold 50 is provided around the upper mold 40 and is fixed to the sub plate 7b. In the vicinity of the lower end surface 51, a runner 52 that forms a resin injection port and a pressure sensor 53 that measures the pressure (injection pressure) of the injected resin are provided.

  The first lower mold 20 includes a convex portion 21 and a first lower mold protruding mechanism 22. Further, a groove (hereinafter referred to as a seal portion forming groove) 23 is formed so as to surround the periphery of the convex portion 21. The cap leg portion 13a is molded by filling the seal portion forming groove 23 with resin.

  Furthermore, at a position corresponding to the runner 52, a first reservoir 24 that stores the resin is provided, and a first plunger 25 that extrudes the resin stored in the first reservoir 24 is provided. When the upper mold 40 and the first lower mold 20 are clamped, a space (cap molding space) corresponding to the cap 13 is formed between them.

  The second lower mold 30 is provided at a position corresponding to the substrate storage groove 31 in which the substrate 12 is stored, the second lower mold protrusion mechanism 32 that protrudes the substrate 12, and the runner 52, and the second storage portion 33 that stores the resin. A second plunger (resin injection mechanism) 34 for extruding the resin stored in the second storage part 33 is provided.

  Next, with reference to FIGS. 3-7, the manufacturing process of the hollow package 10 is demonstrated using the said injection molding machine 2A. FIG. 3 is a flowchart showing the manufacturing procedure, and FIGS. 4 to 7 are side views of the injection molding machine in the main process. 4 to 7, the molds are shown in cross-sectional views so that the state of the molded product can be easily understood.

  The manufacturing process includes a cap molding process (step SA1 to step SA9) for molding the cap 13, a cap placement process (step SA10 to step SA12) for placing the molded cap 13 on the substrate 12, and the substrate 12 placed on the substrate 12. This is performed by a molding process (step SA13 to step SA20) in which the mold 14 is molded on the cap 13.

  The molding process includes a sealing part process (step SA13 to step SA14) for molding a seal part 14a for molding the resin around the cap 13 to bring the cap 13 and the substrate 12 into close contact with each other, and a cover part for covering the cap 13 And a cover part process (step SA15 to step SA19) for molding 14b.

  Steps SA1 and SA2: First, the slide unit 4 is driven to move the first lower mold 20 below the upper mold 40 (FIG. 4A). As the first lower mold 20 moves, the second lower mold 30 moves to the outside of the frame 6, so that the substrate 12 is stored in the substrate storage groove 31 of the second lower mold 30. Of course, the timing of storing the substrate 12 in the substrate storing groove 31 is not particularly limited, but it is preferable to perform it at least when the second lower mold 30 is located outside the frame 6 because workability is improved.

  Steps SA3 and SA4: Next, the main drive unit 63 of the main drive unit 60 is rotated to move the sub plate 7b downward. As a result, the upper mold 40 and the side mold 50 are lowered and clamped with the first lower mold 20 with a predetermined force. The mold clamping force can be exemplified by 200 to 350 MPa.

  Thereafter, the sub drive unit 71 of the sub drive unit 70A is rotated to further clamp the upper mold 40 and the first lower mold 20. At this time, the forces of the main drive unit 63 that clamps the side mold 50 and the sub-drive unit 71 that clamps the upper mold 40 work in a direction that cancels each other out, so that the entire main drive unit 60 is even with the first lower mold 20. The force ratio between the main drive unit 63 and the sub drive unit 71 is set to 10: 5 so that the mold is clamped.

  Steps SA5 and SA6: When the upper mold 40 and the first lower mold 20 are clamped, a space (cap molding space) K2 corresponding to the cap 13 is formed between them (FIG. 4B). Therefore, the first plunger 25 is driven to fill the cap molding space K2 with the resin stored in the first storage section 24 via the runner 52, and the cap 13 is molded (FIG. 5A). .

The injection pressure at this time is measured by the pressure sensor 53, and when the injection pressure reaches a predetermined value, it is determined that the molding of the cap 13 is completed. In addition, as the resin filling time (cap molding time) at this time, for example, the injection time is 8 to 10 seconds, and the injection pressure is about 50 to 150 Kgf / cm ² . The completion determination of the cap 13 can be determined from the injection time, the injection amount, and the like.

  Step SA7: When the cap molding is completed, the resin waits for the resin to be cured while maintaining the pressure at that time. That is, the injection molding machine is in a pressure holding state. Examples of the pressure holding time include about 60 to 100 seconds.

  Steps SA8 and SA9: Next, the upper mold 40 is raised by driving the sub-driving unit 71. At this time, the cap 13 is pushed out by operating the first lower mold protrusion mechanism 22 at the same time as the upper mold 40 starts to rise. Thereby, the cap 13 is released from the first lower mold 20 in a state of being fitted to the upper mold 40 (FIG. 5B). When the cap 13 is released from the first lower mold 20, the main plate 60 b is raised by operating the main drive unit 60, and the side mold 50 and the upper mold 40 are retracted from the first lower mold 20.

  Step SA10: When the side mold 50 and the upper mold 40 are retracted from the first lower mold 20, the slide unit 4 is operated to move the first lower mold 20 to the outside of the frame 6, and the second lower mold 30 is moved. Move under the upper mold 40.

  Step SA11: Thereafter, the main drive unit 60 is driven to lower the side mold 50 and the upper mold 40 in the direction of the second lower mold 30, and the side mold 50 and the second lower mold 30 are clamped (FIG. 6). (A)). The mold clamping force at this time is about 200 to 350 MPa.

  Step SA12: Next, the auxiliary driving unit 70A is driven to lower the upper mold 40 until the cap leg portion 13a contacts the substrate 12, and the cap leg portion 13a is pressed against the substrate 12 with a predetermined contact force (FIG. 6). (B)). As a result, a space (seal portion molding space) K3 is formed on the side of the cap 13. The purpose of pressing the cap 13 against the substrate 12 is to position and fix the cap 13 with respect to the substrate 12, and the force (clamping force) at that time is about 50 MPa.

Steps SA13 and SA14: Next, the second plunger 34 is driven to fill the seal portion molding space K3 with the resin in the second storage portion 33 through the runner 52 (FIG. 7A). At this stage, the resin is filled only in the seal portion molding space K3 on the side of the cap 13, and the top of the cap 13 remains in contact with the upper mold 40. Therefore, when the resin is filled in this state, the seal portion 14a of the mold 14 is molded. The injection pressure at that time is about 50 to 150 kgf / cm ² . The seal portion 14 a functions as a seal that closely contacts the cap 13 and the substrate 12.

  Steps SA15 to SA17: When the seal portion 14a is molded, no more resin can be filled, and the measured value of the pressure sensor 53 increases. Therefore, when the measured value of the pressure sensor 53 increases, the sub drive unit 70A operates to raise the upper mold 40. Accordingly, the support of the cap 13 by the upper mold 40 is released. However, as described above, since the cap 13 and the substrate 12 are fixed by the seal portion 14a, the cap 13 is not displaced.

  The rise of the upper mold 40 corresponds to the amount of resin filled from the second plunger 34. That is, the upper mold 40 is raised by the amount of resin to be filled, instead of being filled with resin in the space generated by the rise of the upper mold 40. Thereby, the cover part 14b is shape | molded. And if the upper mold | type 40 raises to a predetermined position, operation | movement of the 2nd plunger 34 will stop and the cover part 14b will be shape | molded. That is, the mold 14 composed of the seal portion 14a and the cover portion 14b is formed (FIG. 7D). The rise of the upper mold 40 and the resin injection speed of the second plunger 34 are synchronized.

  Steps SA18 to SA20: After the mold 14 is molded, the pressure holding state is continued for a curing time (for example, about 60 to 100 seconds) for the mold 14 to solidify. After the mold 14 is cured, the main drive unit 60 is driven to open the mold, and the upper mold protrusion mechanism 42 is operated to release the molded hollow package 10.

  FIG. 8 is a diagram showing the measurement value of the pressure sensor 53, the position of the second plunger 34, and the position of the upper mold 40 with time in a molding process including a sealing part molding process and a cover part molding process.

  At time TS, the operation of the second plunger 34 is started (step SA13 is started), and the resin filling for molding the seal portion is started. In the seal portion molding section, the second plunger 34 operates at a constant speed and injects the resin in the second storage portion 33 through the runner 52. At this time, the injection pressure of the resin (measured value of the pressure sensor 53) gradually increases. This is because the flow path when the resin flows in the seal portion molding space K3 becomes narrow with time.

  Then, when the injection pressure reaches P0, the injection into the seal portion molding space K3 is completed. That is, it is assumed that the molding of the seal portion 14a is completed. When the injection pressure reaches P0, the seal portion molding space K3 is completely filled with resin. This is because the pressure applied to the cap 5 is not uniform unless the seal portion molding space K3 is completely filled. At the time of molding the seal portion 14a, the upper die 40 remains stopped.

  When the molding of the seal portion 14a is completed, the upper mold 40 rises at a constant speed and the molding of the cover portion 14b starts. Note that the rise of the upper mold 40 corresponds to the amount of resin filled from the second plunger 34. That is, the upper mold 40 is raised by the amount of resin to be filled, instead of being filled with resin in the space generated by the rise of the upper mold 40. Thereby, the cover part 14b is shape | molded. During the molding of the cover portion 14b, the rise of the upper mold 40 and the resin injection speed of the second plunger 34 are synchronized, so the injection pressure remains constant.

  When the upper mold 40 is raised by a predetermined amount, the upper mold 40 stops rising and the second plunger 34 stops. Thereby, the molding of the cover portion 14b is completed.

  As described above, by using the injection molding machine according to the present embodiment, the molding of the cap, the placement of the cap on the substrate, and the molding of the mold that hermetically seals the inside of the cap while completely covering the cap are continuously performed. Can be done.

  Since the cap is completely covered with the mold and the mold is in close contact with the substrate, the storage space for the chip mounted on the substrate can be hermetically sealed.

Further, when filling the mold molding resin, the cap is supported by the upper mold with respect to the substrate, so that the cap can be prevented from being displaced by the mold molding resin. Accordingly, since a configuration for separately supporting the position of the cap is not required, the manufacturing cost can be suppressed correspondingly, and the yield is also improved, so that productivity is improved.
<Second Embodiment>
Next, a second embodiment of the present invention will be described. In addition, about the same structure as 1st Embodiment, description is abbreviate | omitted suitably using the same code | symbol.

  In the first embodiment, the upper mold is raised by the sub drive unit including the sub drive unit and the like in the molding of the cover unit. On the other hand, the sub drive unit according to the present embodiment includes an upper mold urging mechanism instead of the sub drive section and the like, and automatically raises the upper mold by the resin filling pressure.

  FIG. 9 is a side view of such an injection molding machine 2B. The sub drive unit 70B according to the injection molding machine 2B includes an upper mold urging mechanism 74. The upper die urging mechanism 74 includes an urging portion 75 and a lock portion 76. The urging portion 75 is an elastic member such as a spring having one end connected to the sub plate 7 b and the other end connected to the upper mold 40. The lock portion 76 is a member that restricts the movement of the upper die 40 relative to the side die 50.

  The procedure for molding the hollow package 10 using such an injection molding machine 2B is shown in FIG. The procedure shown in FIG. 10 is substantially the same as the procedure shown in FIG. 3, but mainly the processes in steps SB11 to SB15 are different. That is, Step SB1 to Step SB10 are substantially the same as Step SA1 to Step SA10, and the cap 13 is molded by these procedures. Hereinafter, the processing of step SB11 to step SB15 will be described. 11 and 12 are diagrams showing the state of the injection molding machine 2B in the main process.

  Step SB11: When the cap 13 is molded, the first lower mold 20 and the second lower mold 30 are exchanged (FIG. 11A), and the lock portion 76 is released. By releasing the lock, the upper die 40 can move up and down relatively with respect to the side die 50.

  Step SB12: After unlocking, mold clamping is performed. Clamping is performed by the main drive unit 60 lowering the sub plate 7b. At this time, since the cap leg 13a of the cap 13 is positioned below the side mold 50, the cap leg 13a contacts the substrate 12 before the side mold 50 (FIG. 11B).

  When the sub-plate 7b is further lowered from this state, the urging portion 75 contracts because the cap leg portion 13a is in contact with the substrate 12. That is, the upper mold 40 does not change its position. Then, the side mold 50 continues to descend and comes into contact with the second lower mold 30. Thus, the mold clamping is completed and the cap 13 is supported (FIG. 11C). At this time, a space (seal portion molding space) K3 is formed around the cap leg portion 13a. As described above, the biasing portion 75 contracts, so that the auxiliary driving portion and the like in the first embodiment are not necessary.

  Steps SB13 to SB15: When the mold clamping is completed, the second plunger 34 starts to operate, the resin is filled into the seal portion molding space K3, and the seal portion 14a is shaped (FIG. 12 (a)). When the seal portion 14 a is molded, the resin lifts the upper mold 40 against the force of the biasing portion 75. That is, the upper die 40 is raised by the injection pressure, and the cover portion 14b is molded by filling the resin formed in the space created by the raising of the upper die 40 (FIG. 12B). Thereby, the molding of the mold 14 is completed. Also in this case, since the upper mold 40 is responsive to the pressure of the resin, the sub driving means in the first embodiment is not necessary. Note that the completion of molding of the mold 14 can be determined from the amount of movement of the second plunger 34.

Steps SB16 to SB18: When the molding of the mold 14 is completed, the state is maintained (pressure holding state) only for the curing time of the resin, and then the mold is opened and the product is taken out. When the mold is opened and the product is taken out, the sub-plate 7b is raised. When the position of the upper mold 40 with respect to the side mold 50 reaches a predetermined position, the lock unit 76 automatically locks the upper mold 40.
<Third Embodiment>
Next, a third embodiment of the present invention will be described. In addition, about the same structure as said each embodiment, description is abbreviate | omitted suitably using the same code | symbol.

  In the second embodiment, the upper mold moves up and down with respect to the side mold in response to the injection pressure by using the auxiliary drive unit including the upper mold urging mechanism. On the other hand, in the present embodiment, the side mold is provided with a side mold urging mechanism so that the side mold moves up and down with respect to the upper mold.

  FIG. 13 is a side view of an injection molding machine 2C according to the present embodiment. In the injection molding machine 2C, with respect to the injection molding machine 2A shown in FIG. 1, the sub drive unit 70C includes a side mold urging mechanism 77 to support the side mold 50, and the upper mold 40 is fixed to the sub plate 7b. Are different from each other.

  The procedure for molding the hollow package 10 using such an injection molding machine 2C is shown in FIG. The procedure shown in FIG. 14 is almost the same as the procedure shown in FIG. 3, but the processes in steps SC11 to SCB16 are mainly different. That is, Step SC1 to Step SC10 are substantially the same as Step SA1 to Step SA10, and the cap 13 is molded by these procedures. Hereinafter, different procedures will be described.

  Step SC11: When the cap 13 is molded, the first lower mold 20 and the second lower mold 30 are exchanged (FIG. 15A), and the mold clamping is performed (FIG. 15B).

  Clamping is performed on the second lower mold 30 by driving the main drive unit 60 and lowering the upper mold 40 fixed to the sub plate 7b. At this time, the lower end of the side mold 50 is at a position below the cap leg portion 13a. Accordingly, when the side mold 50 first comes into contact with the second lower mold 30 and the sub plate 7b is further lowered, the cap leg portion 13a comes into contact with the substrate 12.

  Since the cap leg portion 13 a protrudes from the lower end of the upper mold 40, a space is formed between the cap 13 and the side mold 50 when the cap leg portion 13 a comes into contact with the substrate 12. This space becomes a seal portion molding space K3. Therefore, mold clamping is performed between the side mold 50 and the second lower mold 30, and the mold clamping force is a force generated by the side mold biasing mechanism 77. The upper mold 40 supports the cap 13.

  Steps SC12 to SC15: When the mold clamping is completed, the second plunger 34 is injected with resin through the operation. The filled resin fills the seal portion molding space K3 to mold the seal portion 14a (FIG. 15B).

  And if the seal part 14a is shape | molded, the main drive unit 60 will raise the subplate 7b, and will raise the upper mold | type 40. FIG. The upper mold 40 is raised according to the amount of resin filled after the sealing portion 14a is molded. Thereby, the cover part 14b is shape | molded (FIG.15 (c)).

  Thereafter, when the movement amount of the second plunger 34 reaches a predetermined amount, the upper mold 40 stops rising and the second plunger 34 stops, and the molding of the mold 14 is completed.

  Steps SC16 to SC19: When the molding of the mold 14 is completed, the state is maintained (pressure holding state) only for the curing time of the resin, and then the mold is opened and the product is taken out.

  As described above, since the side mold is supported by the sub plate by the side mold urging mechanism, it is possible to provide a space for forming the cover portion by moving the sub plate up and down.

  A part or all of the above embodiment can be described as in the following supplementary notes, but is not limited thereto.

<Appendix 1>
An injection molding machine for molding a hollow package,
A frame standing on the base;
A main drive unit that is fixed to the frame and advances and retracts a sub-plate to which the upper mold unit including the upper mold and the side mold provided around the upper mold is attached;
A sub-drive unit attached to the sub-plate for moving the upper mold relative to the side mold; and
Sliding the lower mold unit including a first lower mold and a second lower mold juxtaposed with the first lower mold to match the first lower mold with the upper mold; or An injection molding machine comprising: a slide unit that molds the second lower mold with respect to the upper mold.
<Appendix 2>
The injection molding machine according to appendix 1,
The sub-driving unit includes the sub-driving unit that moves the upper mold forward and backward with respect to the side mold.
<Appendix 3>
The injection molding machine according to appendix 1,
The sub drive unit includes an upper mold urging mechanism that urges the upper mold downward with respect to the sub plate,
An injection molding machine comprising: a lock portion that defines a position of the upper mold with respect to the side mold.
<Appendix 4>
The injection molding machine according to appendix 1,
The sub drive unit includes a side type biasing mechanism that biases the side mold downward with respect to the sub plate.
An injection molding machine, wherein when the upper mold moves up and down by the main drive unit, the side mold urging mechanism continues the mold clamping state of the side mold and the second lower mold.
<Appendix 5>
An injection molding machine according to appendix 3,
The injection molding machine according to claim 1, wherein the upper die urging mechanism is a spring that urges the upper die toward the lower die unit.
<Appendix 6>
An injection molding machine according to appendix 4,
The injection molding machine according to claim 1, wherein the side-type biasing mechanism is a spring that biases the side-type toward the lower mold unit.
<Appendix 7>
The injection molding machine according to any one of appendices 1 to 6,
The second lower mold is provided with a resin injection mechanism for injecting resin in synchronization with the movement of the upper mold when the upper mold moves up with respect to the side mold.
<Appendix 8>
A mold that is used when a chip mounted on a substrate is housed in a cap, a hollow package provided with a mold that covers the cap and is in close contact with the substrate is formed,
Upper mold,
A first lower mold that forms a cap molding space for molding the cap when the upper mold is clamped;
A side mold that is provided around the upper mold and moves up and down relatively with respect to the upper mold;
The cap is placed on the substrate when the substrate is placed and is replaced with the first lower die to face the upper die and clamped with the upper die and the side die. And a second lower mold that forms a molding space for molding the mold between the upper mold and the side mold.
<Appendix 9>
The mold according to appendix 8,
When the upper mold and the first lower mold are opened, the cap formed by filling the cap molding space with a resin is released from the first lower mold in a state where the cap is fitted to the upper mold. A mold characterized in that a first lower mold projecting mechanism is provided on the first lower mold.
<Appendix 10>
The mold according to appendix 8 or 9,
The upper mold presses the cap against the substrate placed on the second lower mold, and supports the cap against the substrate. At that time, the upper mold, the side mold, and the substrate A mold for forming a seal part for forming a seal part for fixing the cap and the substrate in close contact with each other.
<Appendix 11>
The mold according to appendix 10, wherein
When the seal portion molding space is filled with resin, the cover portion is formed by moving the upper mold away from the substrate according to the amount of the resin filled thereafter, and the seal portion and the cover portion. And forming the mold which covers the cap and is in close contact with the substrate.
<Appendix 12>
The mold according to appendix 11,
When the upper mold moves up relative to the side mold to form the cover part molding space, the speed of the upper mold and the filling speed of the resin filled in the cover part molding space A mold characterized by being synchronized.
<Appendix 13>
A method for producing a hollow sealing structure in which a chip placed on a substrate is housed in a cap, a hollow package provided with a mold that covers the cap and is in close contact with the substrate is formed,
A cap molding process for molding the cap;
A cap placing step of placing and supporting the cap on the substrate;
A method of manufacturing a hollow sealing structure, comprising: a molding step of completely molding the cap placed on the substrate and molding a mold to be in close contact with the substrate.
<Appendix 14>
A method for manufacturing the hollow sealing structure according to attachment 13, wherein
The cap molding process includes
A step of clamping the upper die and the first lower die to form a cap molding space;
Filling the cap molding space with resin and molding the cap;
And a step of opening the upper mold and the first lower mold while releasing the cap from the first lower mold.
<Appendix 15>
A method for producing the hollow sealing structure according to appendix 13 or 14,
The cap placing step includes
Replacing the first lower mold with the second lower mold containing the substrate;
And a step of clamping the upper mold and the side mold to the second lower mold and supporting the cap on the substrate.
<Appendix 16>
A method for producing a hollow sealing structure according to any one of appendices 13 to 15,
The molding step includes
Forming a sealing part molding space between the cap, the substrate, the upper mold and the side mold;
A step of molding a seal portion that fills the seal portion molding space with resin and seals the cap and the substrate;
After forming the seal part, separating the upper mold from the substrate to form a cover part molding space;
Filling the cover portion molding space with a resin, and molding a mold that covers the cap integrally with the seal portion.

K2 Cap molding space K3 Seal portion molding space 2A to 2C Injection molding machine 3 Base 4 Slide unit 5 Lifting unit 6 Frame 7a Main plate 7b Sub plate 8 Lower mold unit 9 Upper mold unit 10 Hollow package 11 Chip 12 Substrate 13 Cap 13a Cap Leg part 13b Cap top part 14 Mold 14a Seal part 14b Cover part 20 1st lower mold 21 Convex part 22 1st lower mold protrusion mechanism 24 1st storage part 25 1st plunger 30 2nd lower mold 31 Substrate storage groove 32 2nd Lower mold protrusion mechanism 33 Second reservoir 34 Second plunger (resin injection mechanism)
40 Upper mold 41 Recess 42 Upper mold protrusion mechanism 50 Side mold 52 Runner 53 Pressure sensor 60 Main drive unit 61 Main advance / retreat mechanism 62 Mounting part 63 Main drive part 70A-70C Sub drive unit 71 Sub drive part 72 Sub advance / retreat mechanism 74 Upper mold Biasing mechanism 75 Biasing part 76 Locking part

Claims (10)

An injection molding machine for molding a hollow package,
A frame standing on the base;
A main drive unit that is fixed to the frame and advances and retracts a sub-plate to which the upper mold unit including the upper mold and the side mold provided around the upper mold is attached;
A sub-drive unit attached to the sub-plate for moving the upper mold relative to the side mold; and
Sliding the lower mold unit including a first lower mold and a second lower mold juxtaposed with the first lower mold to match the first lower mold with the upper mold; or An injection molding machine comprising: a slide unit that molds the second lower mold with respect to the upper mold. An injection molding machine according to claim 1,
The sub-driving unit includes the sub-driving unit that moves the upper mold forward and backward with respect to the side mold. An injection molding machine according to claim 1,
The sub drive unit includes an upper mold urging mechanism that urges the upper mold downward with respect to the sub plate,
An injection molding machine comprising: a lock portion that defines a position of the upper mold with respect to the side mold. An injection molding machine according to claim 1,
The sub drive unit includes a side type biasing mechanism that biases the side mold downward with respect to the sub plate.
An injection molding machine, wherein when the upper mold moves up and down by the main drive unit, the side mold urging mechanism continues the mold clamping state of the side mold and the second lower mold. A mold that is used when a chip mounted on a substrate is housed in a cap, a hollow package provided with a mold that covers the cap and is in close contact with the substrate is formed,
Upper mold,
A first lower mold that forms a cap molding space for molding the cap when the upper mold is clamped;
A side mold that is provided around the upper mold and moves up and down relatively with respect to the upper mold;
The cap is placed on the substrate when the substrate is placed and is replaced with the first lower die to face the upper die and clamped with the upper die and the side die. And a second lower mold that forms a molding space for molding the mold between the upper mold and the side mold. The mold according to claim 5, wherein
When the upper mold and the first lower mold are opened, the cap formed by filling the cap molding space with a resin is released from the first lower mold in a state where the cap is fitted to the upper mold. A mold characterized in that a first lower mold projecting mechanism is provided on the first lower mold. The mold according to claim 5 or 6,
The upper mold presses the cap against the substrate placed on the second lower mold, and supports the cap against the substrate. At that time, the upper mold, the side mold, and the substrate A mold for forming a seal part for forming a seal part for fixing the cap and the substrate in close contact with each other. The mold according to claim 7, wherein
When the seal portion molding space is filled with resin, the cover portion is formed by moving the upper mold away from the substrate according to the amount of the resin filled thereafter, and the seal portion and the cover portion. And forming the mold which covers the cap and is in close contact with the substrate. A method for producing a hollow sealing structure in which a chip placed on a substrate is housed in a cap, a hollow package provided with a mold that covers the cap and is in close contact with the substrate is formed,
A cap molding process for molding the cap;
A cap placing step of placing and supporting the cap on the substrate;
A method of manufacturing a hollow sealing structure, comprising: a molding step of completely molding the cap placed on the substrate and molding a mold to be in close contact with the substrate. It is a manufacturing method of the hollow sealing structure according to claim 9,
The molding step includes
Forming a sealing part molding space between the cap, the substrate, the upper mold and the side mold;
A step of molding a seal portion that fills the seal portion molding space with resin and seals the cap and the substrate;
After forming the seal part, separating the upper mold from the substrate to form a cover part molding space;
Filling the cover portion molding space with a resin, and molding a mold that covers the cap integrally with the seal portion.

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