CN105008480A - Thermally conductive sheet - Google Patents

Thermally conductive sheet Download PDF

Info

Publication number
CN105008480A
CN105008480A CN201480013296.9A CN201480013296A CN105008480A CN 105008480 A CN105008480 A CN 105008480A CN 201480013296 A CN201480013296 A CN 201480013296A CN 105008480 A CN105008480 A CN 105008480A
Authority
CN
China
Prior art keywords
adhesivity
heat
resin layer
thermal conductivity
thin slice
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201480013296.9A
Other languages
Chinese (zh)
Other versions
CN105008480B (en
Inventor
杉田纯一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to CN201710131494.0A priority Critical patent/CN107033800B/en
Publication of CN105008480A publication Critical patent/CN105008480A/en
Application granted granted Critical
Publication of CN105008480B publication Critical patent/CN105008480B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/22—Layered products comprising a layer of synthetic resin characterised by the use of special additives using plasticisers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/11—Esters; Ether-esters of acyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/222—Magnesia, i.e. magnesium oxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/2224—Magnesium hydroxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/204—Applications use in electrical or conductive gadgets use in solar cells
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2431/00—Presence of polyvinyl acetate
    • C09J2431/006—Presence of polyvinyl acetate in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C09J2475/006—Presence of polyurethane in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The purpose of the present invention is to improve the workability and reworkability of a thermally conductive sheet by making one surface of the thermally conductive sheet moderately tacky. This thermally conductive sheet comprises a tacky thermal conduction layer and a non-tacky resin layer which have been superposed. The tacky thermal conduction layer comprises an acrylic resin and a thermally conductive filler, the acrylic resin having a glass transition temperature of -80 to 15 DEG C, and has higher tackiness than the non-tacky resin layer. The non-tacky resin layer has a glass transition temperature of 60 to 110 DEG C. The tackiness is determined in terms of probe tack by pressing a cylindrical aluminum probe against the tacky thermal conduction layer or non-tacky resin layer and separating the probe, under the conditions of a pressing speed of 30 mm/min, separtion speed of 120 mm/min, load of 196 g, pressing period of 5.0 sec, pulling distance of 5 mm, probe heating at 40 DEG C, and sheet stage heating at 40 DEG C. The non-tacky resin layer has a probe tackiness of 6-30 kN/m2. Alternatively, the T-peel strength of the non-tacky resin layer and the tacky thermal conduction layer is 0.2 N/cm or greater.

Description

Thermal conductivity thin slice
Technical field
The present invention relates to a kind of thermal conductivity thin slice affixing to the scattering of electronic unit raising electronic unit.
Background technology
Thermal conductivity thin slice for filling the gap between the electronic unit that becomes pyrotoxin etc. and the scatterer of heating panel, housing etc., for the thermal diffusivity improving electronic unit.As thermal conductivity thin slice, from the viewpoint of processibility when its assembling electronic parts of use and scatterer, preferably there is adhesivity.Further, the position skew when assembling from correcting electronic parts and scatterer, and can carry out dismantling also the viewpoint of the re-workability of assembling again etc. after assembling because of something, preferably improve the adhesivity in a face, reduce the adhesivity in another face.
Therefore, (patent documentation 1) proposes following scheme: when forming thermal conductivity thin slice with silicon rubber and conducting filler, utilizes uviolizing to implement non-adhesive processing to the surface of thermal conductivity thin slice.
In addition, (patent documentation 2) proposes following scheme: in the adhesivity thermal conductivity thin slice containing the acrylic acid or the like urethane resin with or without functional acrylic's polymkeric substance and conducting filler, by make acrylic acid or the like urethane resin different from without the proportioning of functionalized propylene's acid polymer in positive layer and back layer and repetitive coatings to each layer, thus make the adhesivity of just carrying on the back of adhesivity thermal conductivity thin slice different.
Prior art document
Patent documentation
Patent documentation 1: No. 3498823rd, Japanese patent gazette
Patent documentation 2: No. 2010-93077th, Japanese Laid Open Patent
But, as described in patent document 1, which, the adhesivity in the face of in order to reduce thermal conductivity thin slice and perform uviolizing time, bear heat conduction layer can deterioration.
In addition, as as described in patent documentation 2, when positive layer and back layer make acrylic acid or the like urethane resin different with without the proportioning of functional acrylic's polymkeric substance and overlapping coating, because positive layer and back layer easily mix, be therefore difficult to according to desired such adhesivity changing positive layer and back layer.
In addition, as the adhesivity diverse ways just carried on the back making thermal conductivity thin slice, when forming adhesivity heat-conducting layer by acrylic resin and heat conductive filler, although consider the method for a surface layer of thermal conductivity thin slice being folded to non-adhesive film, but in this case, the adhesivity adhering to object due to pellicular front sharply declines, therefore as the processibility deterioration of thermal conductivity thin slice.
Summary of the invention
For this problem, the object of the invention is to, for the thermal conductivity thin slice that adhesivity heat-conducting layer is formed by acrylic resin and conducting filler, it is lower than this adhesivity heat-conducting layer but have appropriate adhering layer, to improve processibility and the re-workability of thermal conductivity thin slice that face in adhesivity heat-conducting layer forms adhesivity.
The present inventor finds, above-mentioned purpose can be realized by the following method: a surface layer in the adhesivity heat-conducting layer formed by acrylic resin and conducting filler is folded in the thermal conductivity thin slice of non-adhesive resin layer, by making the viscosity of this adhesivity heat-conducting layer of the viscosity ratio of non-adhesive resin layer lower and making the probe adhesive power of this non-adhesive resin layer in specific scope, or make the stripping strength of non-adhesive resin layer and adhesivity heat-conducting layer in specific scope, thus complete the present invention.
In other words, the invention provides a kind of adhesivity heat-conducting layer and the stacked thermal conductivity thin slice of non-adhesive resin layer, the feature of described thermal conductivity thin slice is,
Adhesivity heat-conducting layer contains the acrylic resin after acrylic compounds solidification and conducting filler, and the second-order transition temperature of this acrylic resin is between-80 to 15 DEG C, the viscosity of adhesivity heat-conducting layer higher than the viscosity of described non-adhesive resin layer,
The second-order transition temperature of non-adhesive resin layer is 60 to 110 DEG C,
The viscosity of non-adhesive resin layer as by being heated to 40 DEG C at pressing speed 30mm/min, peeling rate 120mm/min, load 196g, compressing time 5.0 seconds, stretching distance 5mm, probe, thin slice platform is heated to Aluminum cylindrical shape probe is pressed into this non-adhesive resin layer under the condition of 40 DEG C and peels off and determined probe adhesive power is 6 to 30kN/m 2.
In addition, the invention provides a kind of adhesivity heat-conducting layer and the stacked thermal conductivity thin slice of non-adhesive resin layer, the feature of described thermal conductivity thin slice is,
Adhesivity heat-conducting layer contains the acrylic resin after acrylic compounds solidification and conducting filler, and the second-order transition temperature of this acrylic resin is between-80 to 15 DEG C, the viscosity of adhesivity heat-conducting layer higher than the viscosity of non-adhesive resin layer,
The second-order transition temperature of non-adhesive resin layer is 60 to 110 DEG C,
The T-shaped stripping strength of non-adhesive resin layer and adhesivity heat-conducting layer is more than 0.2N/cm.
Beneficial effect
According to thermal conductivity thin slice of the present invention, owing to being laminated with adhesivity heat-conducting layer and lower than the viscosity of this adhesivity heat-conducting layer and there is the non-adhesive resin layer of specific size viscosity, therefore, improve processibility when using thermal conductivity thin slice assembling electronic parts and scatterer, and also improve the re-workability that assembling object is re-assemblied.
Accompanying drawing explanation
Fig. 1 is the explanatory view of the measuring method of T-shaped stripping strength between non-adhesive resin layer and adhesivity heat-conducting layer.
Embodiment
Below the present invention is described in detail.
Adhesivity heat-conducting layer and non-adhesive resin layer is laminated with in thermal conductivity thin slice of the present invention.
In adhesivity heat-conducting layer, in the acrylic resin after acrylic compounds solidification, be dispersed with conducting filler.In the present invention, from the processibility improved when using thermal conductivity thin slice assembling electronic parts and scatterer and the viewpoint to the re-workability that assembling object re-assemblies, as acrylic compounds, the second-order transition temperature of the acrylic resin of its cured article is used as to be-80 to 15, the acrylic compounds of preferred-70 to-10.As this acrylic compounds, simple function (methyl) acrylate etc. such as 2-ethylhexyl, lauryl, normal-butyl, isobutyl-, different nonyl, 2-hydroxyethyl, 4-hydroxyl butyl can be listed, wherein, preferred ethyl acrylate, lauryl acrylate.In addition, more than one and acrylic compound used in combination can there is (methyl) vinylformic acid of interpolymerization, NVP, methylene-succinic acid, tetrahydrofurfuryl acrylate, (methyl) ethyl propenoate, (methyl) vinylformic acid-2-hydroxyl ethyl ester, (methyl) 2-hydroxypropyl acrylate, (methyl) isobornyl acrylate, (methyl) ethoxyethyl acrylate, (methyl) acrylate, butoxy ethyl, (methyl) acrylate, (methyl) phenyl acrylate, (methyl) cyclohexyl acrylate etc.
In addition, as the curing of acrylic compounds, such as can for using Photoepolymerizationinitiater initiater, photocrosslinking agent, the method for irradiation ultraviolet radiation.In this case, only irradiate the UVA (wavelength 320 to 400nm) making the amount of Photoepolymerizationinitiater initiater cracking energy requirement, thus there will not be the problem of adhesivity heat-conducting layer deterioration due to uviolizing.
As the conducting filler that adhesivity heat-conducting layer contains, the metal hydroxides such as aluminium hydroxide, magnesium hydroxide can be used; The metals such as aluminium, steel, silver; The metal oxide such as aluminum oxide, magnesium oxide; The nitride such as aluminium nitride, boron nitride, silicon nitride; Carbon nanotube etc.In addition, the median size of conducting filler preferably 0.5 to 100 μm, particularly, from viewpoint that is dispersed and thermal conductivity, preferably also with median size to be the filler of the minor diameter of 3 to 20 μm and median size the be large diameter filler of 25 to 100 μm.
In adhesivity heat-conducting layer, the content of conducting filler is relative to monomeric unit 100 mass parts of aforesaid propylene acid compounds, preferably 100 to 200 mass parts, more preferably 300 to 1000 mass parts.The content of conducting filler is very few, then fully can not improve the thermal conductivity of thermal conductivity thin slice, if too much contrary, then the flexibility of thermal conductivity thin slice reduces, thus all not preferred.
When two kinds of conducting filler that adhesivity heat-conducting layer uses median size different, the proportioning of preferred minor diameter filler and major diameter filler is 15:85 to 90:10.
In addition, adhesivity heat-conducting layer is preferably selected from acrylic compounds containing more than one, low molecular weight propylene acid polymer, softening agent in wax and tackifier etc., described acrylic compounds is for being selected from by Octyl adipate containing more than one, the hexanodioic acid compounds such as diisononyl adipate, octyl sebacate, the sebacic acid compounds such as DI(2ETHYLHEXYL)SEBACATE, the phosphate compounds such as Tritolyl Phosphate, Viscotrol C or derivatives thereof, stearic acid, the higher fatty acid such as oleic acid and derivative, dibutyl phthalate, the O-phthalic acid compounds such as dioctyl phthalate (DOP), butyl acrylate, ethyl acrylate, the homopolymer of the monomer in the group of vinylformic acid-2-methoxy acrylate composition or multipolymer, or above-mentioned monomer be selected from by alpha-olefin, vinyl ester, the multipolymer etc. of the monomer in the group of the monomer composition of vinyl ether, is more preferably selected from by hexanodioic acid class containing more than one, sebacic acid class, phosphoric acid class, castor-oil plant oils, softening agent in oleic-acid and acrylic acid or the like.In adhesivity heat-conducting layer, the content of softening agent is relative to monomeric unit 100 mass parts of aforesaid propylene acid compounds, preferably 20 to 80 mass parts, more preferably 30 to 70 mass parts.
In addition, as required, adhesivity heat-conducting layer can mix antioxidant, solar heat protection degradation, fire retardant, tinting material etc.
The layer thickness of adhesivity heat-conducting layer preferably 200 to 3000 μm.When crossing thin, can not get the concavo-convex abundant adaptability to adherend, when blocked up, solidification needs the long period that productivity can be caused to reduce.
The viscosity of adhesivity heat-conducting layer and non-adhesive resin layer be heated to 40 DEG C at pressing speed 30mm/min, peeling rate 120mm/min, load 196g, compressing time 5.0 seconds, stretching distance 5mm, probe, thin slice platform is heated to be pressed into by Aluminum cylindrical shape probe under the condition of 40 DEG C adhesivity heat-conducting layer or non-adhesive resin layer and the viscosity peeled off and carry out measuring as probe adhesive power.
The viscosity of adhesivity heat-conducting layer needs the viscosity higher than non-adhesive resin layer.
In the first embodiment, the viscosity of non-adhesive resin layer is 6 to 30kN/m as probe adhesive power 2, preferably 7 arrive 25kN/m 2.
In addition, the problems such as the bonding strength between this non-adhesive resin layer and adhesivity heat-conducting layer is little may be brought adding man-hour, splitting between working life when reprocessing.In this second embodiment, in order to be suitable for operability, T-shaped stripping strength needs at more than 0.2N/cm, preferably can between 0.2 to 6N/cm.
When the probe tack that the viscosity of non-adhesive resin layer is formed as having specified range as above-mentioned and stripping strength between non-adhesive resin layer and adhesivity heat-conducting layer are more than specific size, though non-adhesive resin layer is adhesion when using thermal conductivity thin slice assembling electronic parts and scatterer, but still appropriateness plays low-adhesion, owing to also improving re-workability when re-assemblying the object of assembling while improve processibility, because of but preferably.
Owing to making the viscosity of non-adhesive resin layer be above-mentioned scope, the lower limit therefore forming the second-order transition temperature of the resin of non-adhesive resin layer is more than 60 DEG C, more preferably more than 70 DEG C.Like this, not be used in the resin forming non-adhesive resin layer and coordinate solidifying agent implement solidification treatment and the probe adhesive power of non-adhesive resin layer can be made to be 30kN/m 2below, 25kN/m is specially 2below.
On the other hand, about the upper limit of the second-order transition temperature of the resin of formation non-adhesive resin layer, from making non-adhesive resin layer appropriateness play low-adhesion and obtain the viewpoint with the bonding strength of adhesivity heat-conducting layer, be less than 110 DEG C.
In addition, the resin forming non-adhesive resin layer is preferably with the acrylic compounds forming adhesivity heat-conducting layer immiscible.In this way, even if repetitive coatings forms the application composition of each layer to form the sandwich of adhesivity heat-conducting layer and non-adhesive resin layer, each layer is also difficult to mix in its interface, thus can obtain the viscosity of expection.On the other hand, when the resin forming non-adhesive resin layer mixes with the acrylic compounds forming adhesivity heat-conducting layer, before repetitive coatings, by implementing solidification treatment to the coating layer forming non-adhesive resin layer in advance, each layer is also difficult to mix in its interface, thus can obtain the viscosity of expection.
As the preferred resin for the formation of non-adhesive resin layer, namely second-order transition temperature is 60 to 110 DEG C, with the resin that the acrylic compounds forming adhesivity heat-conducting layer is immiscible, polyvinyl butyral resin, vibrin, urethane resin etc. can be listed.In addition, these resins molecular weight with number-average molecular weight represent be preferably 10000 to 500000.
As required, non-adhesive resin layer can contain conducting filler, the tinting material such as the organic such as solidifying agent, melamine cyanurate fire retardant, aluminium hydroxide of the resin forming non-adhesive resin layer.
The thickness of non-adhesive resin layer is preferably 0.5 to 25 μm, is more preferably 1 to 20 μm.When the thickness of non-adhesive resin layer is crossed thin, due to the mixing and made by the friction damage of conducting filler adhesivity increase of adhesivity heat-conducting layer, and can be insufficient as the thermal conductivity of thermal conductivity thin slice time blocked up.
Now, as the thermal conductivity of thermal conductivity thin slice, in practical application, the mensuration of thermal conductivity thin slice thermal conductivity in a thickness direction by carrying out based on the hot gradient method of ASTM D5470, need at more than 1W/mK, can at more than 1.5W/mK according to the present invention, preferred at more than 2W/mK.
As the manufacture method of thermal conductivity thin slice of the present invention, such as, thermal conductivity thin slice of the present invention can be obtained by the following method: the modulation adhesivity heat-conducting layer formation coating that is mixed with each composition forming former adhesive heat-conducting layer and the non-adhesive resin layer formation coating that will be formed after each composition of non-adhesive resin layer and solvent respectively in advance, by PET, PEN, polyolefine, the stripping film that glassine paper etc. are formed applies non-adhesive resin layer formation coating and drying, subsequently, repetitive coatings adhesivity heat-conducting layer formation coating on the application face of this non-adhesive resin layer, the coated side of adhesivity heat-conducting layer formation coating covers PET, PEN, the mulch film of polyolefine etc., from upper irradiation ultraviolet radiation to solidify the coat of adhesivity heat-conducting layer formation coating.
In addition, also thermal conductivity thin slice of the present invention can be manufactured by following method: on stripping film, apply non-adhesive resin layer formation coating and drying, adhesivity heat-conducting layer formation coating is applied on the other hand on other stripping film, make to replace mulch film with relative covering the in application face of previous non-adhesive resin layer, irradiation ultraviolet radiation is to solidify the coat of adhesivity heat-conducting layer formation coating.
Now, after manufacturing thermal conductivity thin slice in this way, non-adhesive resin layer can be peeled off and thermal conductivity winding of webs is carried out keeping.The stripping film of the thermal conductivity thin slice peel adhesion heat-conducting layer side reeled in this way is for the assembling of electronic unit and scatterer.
Embodiment
Below, according to embodiment, the present invention is specifically described.
Embodiment 1 to 7, comparative example 1 to 3
By the resin shown in table 1 and solidifying agent at toluene: being modulated into solid content in the mixed solvent of methylethylketone=1:1 is 10 quality %, PET film is coated to by scraping strip coating machine, 90 DEG C of dryings 5 minutes, thus form the non-adhesive resin layer of the coating thickness shown in table 1.
On the other hand, using ethyl acrylate 100 mass parts as monofunctional acrylate, Viscotrol C as softening agent derives fatty acid ester 47 mass parts, Photoepolymerizationinitiater initiater (Irgacure 819, BASF) 1.4 mass parts, as hydroxyl trimethylacetic acid neopentylglycol diacrylate (KAYARAD FM-400 Japan chemical drug) 1.5 mass parts of solidifying agent, as aluminium-hydroxide powder (median size 80 μm) 400 mass parts of conducting filler, the mixing of aluminium-hydroxide powder (median size 8 μm) 400 mass parts is to modulate adhesivity heat-conducting layer formation coating.And the second-order transition temperature of the cured article of this ethyl acrylate is-50 to-40 DEG C.
By the adhesivity heat-conducting layer formation coating modulated in this way with 2mm coat-thickness repetitive coatings on above-mentioned non-adhesive resin layer, cover the mulch film be made up of PET thereon, irradiate 5 minutes UVAs from the both sides chemical lamp of PET film side and mulch film side, thus produce the thermal conductivity thin slice of embodiment 1 to 7 and comparative example 1 to 3.
Comparative example 4
The adhesivity heat-conducting layer modulated similarly to Example 1 is coated to PET film when not arranging non-adhesive resin layer, cover the mulch film be made up of PET thereon, irradiate 5 minutes from the both sides chemical lamp of PET film side and mulch film side, thus produce the thermal conductivity thin slice of comparative example 4.
Evaluate
About each embodiment and comparative example, to the viscosity of (a) non-adhesive resin layer and adhesivity heat-conducting layer; B the thermal conductivity of () thermal conductivity thin slice, the re-workability of (c) thermal conductivity thin slice, the non-adhesive resin layer of (d) thermal conductivity thin slice and the interlaminar strength of adhesivity heat-conducting layer are evaluated as follows.Result is as shown in table 1.
The viscosity of (a) non-adhesive resin layer and adhesivity heat-conducting layer
As tack meter, use the tack meter TAC-II of RHESCA Inc., pressing speed 30mm/min, peeling rate 120mm/min, load 196g, compressing time 5.0 seconds, stretching distance 5mm, probe are heated to 40 DEG C, thin slice platform being when being pressed into the non-adhesive resin layer of the thermal conductivity thin slice of embodiment 1 to 7 and comparative example 1 to 3 by the Aluminum cylindrical shape probe of diameter 10mm and peeling off under being heated to the condition of 40 DEG C, measure probe adhesive power.Now, owing to not having non-adhesive resin layer in the thermal conductivity thin slice of comparative example 4, the viscosity of adhesivity heat-conducting layer is thus determined.
The thermal conductivity of (b) thermal conductivity thin slice
Thermal conductivity thin slice thermal conductivity in a thickness direction measures (well heater output 8W, slice surfaces pressure 1kgf/cm according to the thermal conductivity instrument (Sony's system) of ASTM D-5470 standard 2).
The re-workability of (c) thermal conductivity thin slice
Thermal conductivity thin slice is interposed between copper rod facing with each other parallel up and down, at pressure 1kgf/cm in the mode that non-adhesive resin layer is downside 2lower placement 10 minutes, peels off rod afterwards.Now, be evaluated as O when being peeling between the non-adhesive resin layer and copper coin of thermal conductivity thin slice, otherwise be evaluated as ×.
The non-adhesive resin layer of (d) thermal conductivity thin slice and the T-shaped stripping strength of adhesivity heat-conducting layer
Use tensile testing machine (RTG-1225, Orientec society), as shown in fig. 1, be laminated to non-adhesive resin layer 2 in PET film 1, measured the interlaminar strength of non-adhesive resin layer 2 and adhesivity heat-conducting layer 3 under state that mulch film 4 is laminated to adhesivity heat-conducting layer 3 by T-shaped stripping test.In this case, tensile strength is 500mm/min, Sample Width is 2cm.
Known according to table 1, be in the embodiment 1,2,4 to 7 of 60 to 110 DEG C at the second-order transition temperature of the resin forming non-adhesive resin layer, even if mismatch solidifying agent, the adhesion values of non-adhesive resin layer is still 6 to 25kN/m 2, and the interlayer strength of glass of non-adhesive resin layer and adhesivity heat-conducting layer (T-shaped stripping strength) is more than 0.2N/cm, re-workability is good.
In addition known, the thickness of non-adhesive resin layer is less than 20 μm, and thermal conductivity thin slice has sufficient thermal conductivity.
On the other hand, in the adhesion values of non-adhesive resin layer more than 30kN/m 2comparative example 1,2 and adhesive resins layer nothing but comparative example 4 in, because adherend pastes thermal conductivity thin slice, thus re-workability deterioration.In addition, at the interlaminar strength according to T-shaped stripping test of non-adhesive resin layer and adhesivity heat-conducting layer less than in the comparative example 3 of 0.2N/cm, because non-adhesive resin layer is easily peeled off from adhesivity heat-conducting layer, thus processibility is inferior.
Application possibility in industry
According to thermal conductivity thin slice of the present invention, owing to being laminated with adhesivity heat-conducting layer and lower than the viscosity of this adhesivity heat-conducting layer and there is the non-adhesive resin layer of the viscosity of specific size, therefore, improve processibility when using thermal conductivity thin slice assembling electronic parts and scatterer, and also improve the re-workability that assembling object is re-assemblied.
Although explain invention has been with reference to specific embodiment, various changes and modifications can be carried out to the present invention without departing from the spirit and scope of the present invention to those skilled in the art.
The present invention is based on the Japanese patent application (application number JP 2013-068724) of application on March 28th, 2013, during its content is incorporated herein as a reference.
Nomenclature
1 PET film
2 non-adhesive resin layers
3 adhesivity heat-conducting layers
4 mulch films (PET)

Claims (6)

1. a thermal conductivity thin slice, is the thermal conductivity thin slice of stacked adhesivity heat-conducting layer and non-adhesive resin layer, it is characterized in that,
Adhesivity heat-conducting layer contains the acrylic resin after acrylic compounds solidification and conducting filler, the second-order transition temperature of this acrylic resin is-80 to 15 DEG C, the viscosity of adhesivity heat-conducting layer is higher than the viscosity of non-adhesive resin layer, and the viscosity of non-adhesive resin layer is 6 to 30kN/m 2,
The second-order transition temperature of non-adhesive resin layer is 60 to 110 DEG C,
Wherein, viscosity be heated to 40 DEG C at pressing speed 30mm/min, peeling rate 120mm/min, load 196g, compressing time 5.0 seconds, stretching distance 5mm, probe, thin slice platform is heated to be pressed into by Aluminum cylindrical shape probe under the condition of 40 DEG C this adhesivity heat-conducting layer or this non-adhesive resin layer and the viscosity peeled off and carry out measuring as probe adhesive power.
2. a thermal conductivity thin slice, is the thermal conductivity thin slice of stacked adhesivity heat-conducting layer and non-adhesive resin layer, it is characterized in that,
Adhesivity heat-conducting layer contains the acrylic resin after acrylic compounds solidification and conducting filler, and the second-order transition temperature of this acrylic resin is between-80 to 15 DEG C, the viscosity of adhesivity heat-conducting layer higher than the viscosity of non-adhesive resin layer,
The second-order transition temperature of non-adhesive resin layer is 60 to 110 DEG C,
The T-shaped stripping strength of non-adhesive resin layer and adhesivity heat-conducting layer is more than 0.2N/cm,
Wherein, viscosity be heated to 40 DEG C at pressing speed 30mm/min, peeling rate 120mm/min, load 196g, compressing time 5.0 seconds, stretching distance 5mm, probe, thin slice platform is heated to be pressed into by Aluminum cylindrical shape probe under the condition of 40 DEG C this adhesivity heat-conducting layer or this non-adhesive resin layer and the viscosity peeled off and carry out measuring as probe adhesive power.
3. thermal conductivity thin slice according to claim 1 and 2, is characterized in that, thermal conductivity thin slice thermal conductivity is in a thickness direction more than 1.5W/mK.
4. thermal conductivity thin slice according to any one of claim 1 to 3, is characterized in that, the resin forming non-adhesive resin layer is selected from polyvinyl butyral resin, vibrin and urethane resin.
5. thermal conductivity thin slice according to any one of claim 1 to 4, is characterized in that, the acrylic compounds forming adhesivity heat-conducting layer is simple function (methyl) acrylate monomer.
6. thermal conductivity thin slice according to any one of claim 1 to 5, it is characterized in that, relative to monomeric unit 100 mass parts of acrylic compounds, adhesivity heat-conducting layer contains more than one softening agent 20 to 80 mass parts in two acids of selecting oneself, sebacic acid class, phosphoric acid class, castor-oil plant oils, oleic-acid and acrylic acid or the like.
CN201480013296.9A 2013-03-28 2014-03-26 Heat conductivity thin slice Active CN105008480B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710131494.0A CN107033800B (en) 2013-03-28 2014-03-26 Thermally conductive sheet

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013068724A JP6098289B2 (en) 2013-03-28 2013-03-28 Thermally conductive sheet
JP2013-068724 2013-03-28
PCT/JP2014/058625 WO2014157378A1 (en) 2013-03-28 2014-03-26 Thermally conductive sheet

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201710131494.0A Division CN107033800B (en) 2013-03-28 2014-03-26 Thermally conductive sheet

Publications (2)

Publication Number Publication Date
CN105008480A true CN105008480A (en) 2015-10-28
CN105008480B CN105008480B (en) 2017-03-15

Family

ID=51624341

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201480013296.9A Active CN105008480B (en) 2013-03-28 2014-03-26 Heat conductivity thin slice
CN201710131494.0A Active CN107033800B (en) 2013-03-28 2014-03-26 Thermally conductive sheet

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201710131494.0A Active CN107033800B (en) 2013-03-28 2014-03-26 Thermally conductive sheet

Country Status (6)

Country Link
US (1) US10550296B2 (en)
JP (1) JP6098289B2 (en)
KR (1) KR102057029B1 (en)
CN (2) CN105008480B (en)
TW (1) TWI620808B (en)
WO (1) WO2014157378A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105493274A (en) * 2013-09-13 2016-04-13 迪睿合株式会社 Thermally conductive sheet
US10040979B2 (en) 2013-09-13 2018-08-07 Dexerials Corporation Thermally conductive sheet
CN110050041A (en) * 2016-12-07 2019-07-23 3M创新有限公司 Flexible abrasive article
CN110050021A (en) * 2016-10-13 2019-07-23 奥林匹克控股有限公司 Thermal conductance acrylic type adhesive tape and preparation method thereof
CN111511556A (en) * 2017-12-21 2020-08-07 3M创新有限公司 Multilayer heat conducting sheet

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI818911B (en) * 2017-06-21 2023-10-21 日商力森諾科股份有限公司 Adhesive for semiconductors, manufacturing method of semiconductor device, and semiconductor device
KR102617131B1 (en) * 2020-09-29 2023-12-27 주식회사 엘지화학 Curing composition
US20230312796A1 (en) * 2020-09-29 2023-10-05 Lg Chem, Ltd. Curable Composition
DE102022200002A1 (en) * 2022-01-03 2023-07-06 Continental Automotive Technologies GmbH heat dissipation device, electronic device and automobile
KR102558761B1 (en) * 2022-06-22 2023-07-24 한국자동차연구원 Multi layer sheet for automobile battery

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3257391B2 (en) * 1996-03-18 2002-02-18 東洋インキ製造株式会社 Inkjet recording liquid
JP3498823B2 (en) 1996-04-30 2004-02-23 電気化学工業株式会社 Heat radiation spacer and its use
JPH10316953A (en) * 1997-05-16 1998-12-02 Nitto Denko Corp Releasable thermally conductive pressuer-sensitive adhesive and adhesive sheet prepared therefrom
JP2002194306A (en) * 2000-12-26 2002-07-10 Sekisui Chem Co Ltd Heat-conductive sheet
JP2004225022A (en) * 2002-11-29 2004-08-12 Sekisui Chem Co Ltd Adhesive resin sheet
JP4443962B2 (en) * 2004-03-17 2010-03-31 日東電工株式会社 Dicing die bond film
KR20080040758A (en) * 2005-08-30 2008-05-08 듀폰-미츠이 폴리케미칼 가부시키가이샤 Flame-retardant resin composition
JP2007169568A (en) * 2005-12-26 2007-07-05 Nitto Shinko Kk Thermally conductive adhesive and thermally conductive adhesive sheet using the thermally conductive adhesive
DE102007045166A1 (en) * 2007-09-20 2009-04-02 Tesa Ag Transparent tape
WO2010035614A1 (en) * 2008-09-26 2010-04-01 日本ゼオン株式会社 Thermally conductive pressure-sensitive adhesive composition, thermally conductive pressure-sensitive adhesive sheet, and electronic component
JP5153558B2 (en) * 2008-10-08 2013-02-27 日本ジッパーチュービング株式会社 Adhesive heat conductive sheet
US8568849B2 (en) * 2009-05-20 2013-10-29 Ming Kun Shi Surface treated film and/or laminate
WO2010147363A2 (en) 2009-06-15 2010-12-23 (주)Lg화학 Wafer processing sheet
JP5651344B2 (en) 2010-02-04 2015-01-14 日東電工株式会社 Thermally conductive double-sided adhesive sheet
KR20130084608A (en) 2010-05-19 2013-07-25 닛토덴코 가부시키가이샤 Thermally conductive adhesive sheet
WO2012141101A1 (en) * 2011-04-15 2012-10-18 日東電工株式会社 Pressure-sensitive adhesive sheet

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105493274A (en) * 2013-09-13 2016-04-13 迪睿合株式会社 Thermally conductive sheet
US10040979B2 (en) 2013-09-13 2018-08-07 Dexerials Corporation Thermally conductive sheet
CN105493274B (en) * 2013-09-13 2019-06-04 迪睿合株式会社 Thermal conductivity thin slice
CN110050021A (en) * 2016-10-13 2019-07-23 奥林匹克控股有限公司 Thermal conductance acrylic type adhesive tape and preparation method thereof
CN110050021B (en) * 2016-10-13 2022-05-10 奥林匹克控股有限公司 Thermally conductive acrylic adhesive tape and method for producing same
CN110050041A (en) * 2016-12-07 2019-07-23 3M创新有限公司 Flexible abrasive article
CN111511556A (en) * 2017-12-21 2020-08-07 3M创新有限公司 Multilayer heat conducting sheet
CN111511556B (en) * 2017-12-21 2022-08-05 3M创新有限公司 Multilayer heat conducting sheet

Also Published As

Publication number Publication date
CN107033800A (en) 2017-08-11
JP2014189727A (en) 2014-10-06
TWI620808B (en) 2018-04-11
CN107033800B (en) 2021-06-01
WO2014157378A1 (en) 2014-10-02
JP6098289B2 (en) 2017-03-22
KR102057029B1 (en) 2019-12-19
US10550296B2 (en) 2020-02-04
CN105008480B (en) 2017-03-15
US20160009963A1 (en) 2016-01-14
KR20150135258A (en) 2015-12-02
TW201444946A (en) 2014-12-01

Similar Documents

Publication Publication Date Title
CN105008480A (en) Thermally conductive sheet
CN106164200B (en) Adhesive sheet and method for producing same
JP6461524B2 (en) Thermally conductive sheet
EP3480270A1 (en) Thermally conductive pressure-sensitive adhesive sheet
EP2532724B1 (en) Double-faced adhesive tape and process for producing same
CN106030784B (en) The manufacturing method of multi-layered type heat exchange sheet, multi-layered type heat exchange sheet
JP6582904B2 (en) Hot melt adhesive sheet for electromagnetic induction heating, adhesive structure using the same, and method for producing adhesive structure
JP5958610B1 (en) Hot melt adhesive sheet, method for producing adhesive structure using the same, and method for peeling
JP6989380B2 (en) Graphite adhesive tape with peeling liner
JP2017154410A (en) Laminated body for decoration, decorative molded body, and method for producing decorative molded body
JP2016130294A (en) Adhesive sheet, use method of adhesive sheet and precision electronic apparatus
US20230039626A1 (en) Heat Separable Two-Layer Adhesive System and Process of Adhesive Debonding Using the Same
CN105493274B (en) Thermal conductivity thin slice
JP6582881B2 (en) Hot melt adhesive sheet for electromagnetic induction heating, adhesive structure using the same, and method for producing adhesive structure
TWI667316B (en) Adhesive sheet
JP6870991B2 (en) Thermal conductivity sheet
JP6690416B2 (en) Laminate having hot-melt adhesive layer for electromagnetic induction heating, adhesive structure using the same, and peeling method

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant