CN109791885A - Substrate board treatment - Google Patents
Substrate board treatment Download PDFInfo
- Publication number
- CN109791885A CN109791885A CN201780058617.0A CN201780058617A CN109791885A CN 109791885 A CN109791885 A CN 109791885A CN 201780058617 A CN201780058617 A CN 201780058617A CN 109791885 A CN109791885 A CN 109791885A
- Authority
- CN
- China
- Prior art keywords
- substrate
- follower
- component
- moveable jaw
- driving portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
A kind of substrate board treatment, with control device, the control device rotates follower centered on the rotation axis of substrate together with moveable jaw by control rotation motor, and moves driving portion together with splash guard along vertical direction by control cover lifting unit.Follower and driving portion are in the state of leaving each other, along horizontal or vertical opposite opposite to direction.Later, follower and driving portion contact with each other, and driving portion presses follower along relative direction.Moveable jaw is set to be configured at open position as a result,.Later, follower and driving portion leave each other.Moveable jaw is returned using the power of helical spring to the direction of closed position.
Description
Technical field
The present invention relates to a kind of substrate board treatments for handling substrate.For example including semiconductor in the substrate of process object
(Field Emission Display: field causes hair by chip, base plate for liquid crystal display device, plasma display substrate, FED
Penetrate display) use substrate, light base-board for plate, substrate for magnetic disc, optomagnetic base-board for plate, photomask substrate, ceramic substrate, the sun
Energy battery substrate etc..
Background technique
In the manufacturing processes such as semiconductor device or liquid crystal display device, filled using processing semiconductor wafer or liquid crystal display
Set the substrate board treatment with substrates such as glass substrates.A kind of list handling substrate one by one is disclosed in patent document 1
The substrate board treatment of chip.
There is the substrate board treatment of patent document 1 one side substrate is remained level, the base on one side rotating the substrate
Plate rotating device.Substrate rotating device includes: cricoid rotating disk；Driving mechanism, for rotating driving rotating disk；Multiple fixations
Pawl and multiple movable pawls, are set in rotating disk；And movable pawl actuating mechanism, for acting movable pawl.Each movable pawl
Actuating mechanism includes: wire form springs, for movable pawl to be held in substrate holding position；Pendular body, with lead together with movable pawl
It is swung centered on vertical axis；And pneumatic cylinder, so that movable pawl is moved to substrate by pressing pendular body and keeps releasing position.
Existing technical literature
Patent document
Patent document 1: No. 2891894 bulletins of Japanese Patent No.
Summary of the invention
Problems to be solved by the invention
In patent document 1, being provided with makes movable pawl be moved to the dedicated pneumatic cylinder that substrate keeps releasing position.And
And as pneumatic cylinder be for set by each movable pawl, in the case where movable pawl has multiple, need to be arranged multiple
Pneumatic cylinder.Thus, it is difficult to simplify movable pawl actuating mechanism.
Therefore, it is an object of the present invention to simplify the mechanism that moveable jaw is opened and closed.
The means solved the problems, such as
One embodiment of the present invention provides a kind of substrate board treatment, comprising: multiple clamper components, including movably press from both sides
Tool, the moveable jaw can the peripheral part of pressing substrate closed position and release pressing to the peripheral part of the substrate
It is rotated centered on fixture pivot center between open position, with the movement of the moveable jaw, the multiple clamper component
Switch between the opening state that the holding of the closed state and the substrate that horizontally hold the substrate is released from；Rotate horse
It reaches, generates by making the multiple clamper component by the central portion of the substrate held by the multiple clamper component
The power for being rotated centered on the rotation axis of vertical and rotating the substrate centered on the rotation axis；The splashproof of tubular
Cover surrounds the multiple clamper component around the rotation axis when looking down；Cover lifting unit makes the splash guard along vertical
Direction is mobile；Holding power generates component, generates the power for keeping the moveable jaw mobile to the direction of the closed position；It is driven
Portion, including the outer end more outward compared to the moveable jaw, the follower is together with the moveable jaw with the fixture
It rotates centered on pivot center, is rotated centered on the rotation axis together with the moveable jaw；Driving portion, including compare
The inner end of the outer end of the follower more in the inner part, the driving portion move together with the splash guard along vertical direction；And
Control device makes the follower together with the moveable jaw with the rotation axis by controlling the rotation motor
Center rotation moves the driving portion together with the splash guard along vertical direction by controlling the cover lifting unit.
The control device executes: preparation process, by moving at least one party in the follower and the driving portion
It is dynamic, in the state that the follower and the driving portion leave each other, make the follower and the driving portion horizontal or
It is opposite in the relative direction of vertical；Step is released, after the preparation process, by making the follower and the driving portion
It is relatively moved along the relative direction, the follower and the driving portion is made to contact with each other, and press the driving portion
The follower is until the moveable jaw reaches the open position；And holding step makes after the releasing step
The follower and the driving portion are separated from each other, and generating component by the holding power makes the moveable jaw to the pass
The direction of closed position is mobile.
According to this structure, rotation motor rotates follower centered on the rotation axis of vertical together with moveable jaw.
Cover lifting unit moves driving portion together with splash guard along vertical direction.Rotation motor and cover lifting unit controlled device control
System.
Follower and driving portion are opposite with respect to direction along horizontal or vertical in the state of leaving each other.Later, from
Dynamic portion and driving portion contact with each other, and driving portion presses follower along relative direction.Moveable jaw is set to be configured at open position as a result,
It sets.Later, follower and driving portion leave each other.Moveable jaw generates the power of component to the direction of closed position using holding power
It returns.
In this way, since at least one party in rotation motor and cover lifting unit doubles as making side of the moveable jaw to open position
To the actuator of mobile opening, it is therefore not necessary to which the actuator of dedicated opening is arranged.It can for this purpose, opening and closing can be simplified
The clamp switching mechanism of dynamic fixture.Moreover, because driving portion contacts with follower and press follower, therefore, and magnetic force is utilized
It compares moveable jaw to the mobile situation in the direction of open position, direction of the moveable jaw reliably to open position can be made
It is mobile.
Holding power, which generates component both, to be the elastomers such as spring, rubber and resin, also may include being connected to movable folder
The driven magnet of tool and the drive magnet opposite with driven magnet.
In the present embodiment, at least one feature below can also be increased in the substrate board treatment.
The moveable jaw can be rotated centered on the fixture pivot center of vertical, and the control device is described
It is horizontally opposed the follower and the driving portion in preparation process, makes the follower with institute in the releasing step
It states and rotates centered on rotation axis, the follower and the driving portion is made to contact with each other as a result,.
The moveable jaw can be rotated centered on the horizontal fixture pivot center, and the control device is described
It is with making the follower and the driving portion vertical in preparation process opposite, make the driving portion along lead in the releasing step
Vertical direction is mobile, and the follower and the driving portion is made to contact with each other as a result,.
The moveable jaw includes the handle part for pressing the peripheral part of the substrate, and the moveable jaw can be along encirclement
It is rotated centered on the horizontal fixture pivot center that the tangential direction of the circle of the rotation axis extends, the handle part phase
Configuration more closer to the top than the fixture pivot center, the follower configure more on the lower compared to the fixture pivot center.
According to this structure, follower compares the level extended towards the tangential direction of the circle for the rotation axis for surrounding substrate
Fixture pivot center configures more on the lower.On the other hand, the handle part of the moveable jaw of the peripheral part of substrate is pressed compared to fixture
Pivot center configuration closer to the top.Handle part is configured at around substrate.It is closer to the top compared to fixture pivot center in follower
In the case where configuration, when centrifugal force is applied to follower, the power for keeping handle part mobile towards outside will be generated, that is, generate
The power for leaving handle part from the peripheral part of substrate.In contrast, being configured more on the lower in follower compared to fixture pivot center
In the case where, when centrifugal force is applied to follower, will generate makes power of the handle part towards medial movement, that is, generating will be
Hold the power that portion is pressed to the peripheral part of substrate.For this purpose, substrate can more reliably be held.
The substrate board treatment also has conveying robot, and the conveying robot is on one side by being configured at the substrate
Lower section hand support described in substrate, on one side by the board carrying to the multiple clamper component, the control device exists
The upper end of the splash guard is set more on the lower, to make the follower and institute on one side compared to the hand in the releasing step on one side
Driving portion is stated to contact with each other.
The substrate board treatment also includes rotating basis, is configured at the base held by the multiple clamper component
The power of the rotation motor is transferred to the multiple clamper component by the lower section of plate；Treatment fluid feed unit, make processing by
The treatment fluid for the substrate that the multiple clamper component is held into the upper surface and the lower surface of the substrate at least one
Side's supply；And IH (induction heating: induction heating) heating mechanism, comprising: generating component is configured at by described
Between the substrate and the rotating basis that multiple clamper components are held；Heating coil is configured under the rotating basis
Side；IH circuit generates the alternating magnetic field for being applied to the generating component, so that institute and supplying electric power to the heating coil
State generating component fever.
According to this structure, substrate is held by multiple clamper components.The power of rotation motor is via the lower section for being located at substrate
Rotating basis is transferred to multiple clamper components.Substrate is rotated centered on rotation axis as a result,.The IH circuit of IH heating mechanism exists
Substrate supplies electric power when rotating to heating coil.The alternating magnetic field for being applied to generating component is generated as a result, so that generating component is sent out
Heat.The treatment fluid of processing substrate is supplied to the substrate of rotation.Thereby, it is possible to equably handle substrate.
Since generating component is heated by induction heating, so without making the wiring or the company that supply electric power to generating component
It connects device and is connected to generating component.For this purpose, through this structure without limitation on the revolving speed of substrate.Moreover, the fever heated the substrate
Component is configured between substrate and rotating basis, the inside without being configured at rotating basis.Therefore, rotation is configured at generating component
The situation for turning the inside of pedestal is compared, and the interval between substrate and generating component can be shortened, and can be improved adding for substrate
The thermal efficiency.
The interval of the up and down direction of the heating coil and the rotating basis can also be than the thickness of the heating coil
It is narrower.The thickness of the heating coil refers to, the length of the heating coil in up and down direction.
According to this structure, heating coil is configured near rotating basis.That is, the upper and lower of heating coil and rotating basis
To interval it is more narrower than the thickness of heating coil.Heating coil is configured at the lower section of rotating basis, and generating component is configured at rotation
The top of pedestal.When making heating coil close to rotating basis, the distance from heating coil to generating component can be shortened.As a result,
Alternating magnetic field due to being applied to generating component becomes strong, the electric power that can be fed to heating coil is efficiently converted
At the heat of generating component.
The thickness of the rotating basis can also be smaller than the thickness of the heating coil.
According to this structure, the thickness of rotating basis can be lowered.That is, the thickness of rotating basis than heating coil thickness more
It is small.When rotating basis is thicker, not only the distance from heating coil to generating component be will increase, and be applied to the alternation of generating component
Magnetic field can also die down.For this purpose, the temperature of generating component can be made efficiently to rise by the thickness for reducing rotating basis.
The thickness of the rotating basis refers to, the length of the rotating basis in up and down direction.The thickness of rotating basis
Refer to, the thickness of the rotating basis in region between generating component and heating coil.Rotating basis in other regions
Thickness both can be equal with the thickness of heating coil, can also be shorter than the thickness of heating coil or long.
The generating component can also be directly opposite with the substrate that is held by the multiple clamper component.
According to this structure, between substrate and generating component and other components are not installed with, and generating component is straight with substrate
It connects opposite.For this purpose, the thermal energy of generating component is efficiently transferred to substrate.Thereby, it is possible to improve the heating efficiency of substrate.
The substrate board treatment also has interval change mechanism, and the interval change mechanism is by making the multiple fixture
Component or the generating component move along the vertical direction, the substrate that Lai Biangeng is held by the multiple clamper component with it is described
The interval of the up and down direction of generating component.
According to this structure, interval change mechanism moves multiple clamper components relatively along the vertical direction with generating component.
The interval of the up and down direction of the substrate and generating component that are held by multiple clamper components is changed as a result,.It therefore, can be as needed
To change the distance from generating component to substrate.
The substrate board treatment can also have conveying robot, and the conveying robot is described using being configured on one side
The hand of the lower section of substrate supports the substrate on one side, on one side by the board carrying to the multiple clamper component.Described
It can also make the multiple clamper component or the generating component every change mechanism, in the institute held by the multiple clamper component
State the up and down direction of substrate and the generating component interval retreating position more broader than the thickness of the hand and the interval
It is moved along the vertical direction between the approximated position more narrower than the thickness of the hand.The thickness of the hand refers to, up and down direction
On the hand length.
According to this structure, in the case where the clamper component or generating component are located at the backoff state of retreating position, handling machinery
The substrate being supported on hand is placed on multiple clamper components by hand.Then, conveying robot declines hand and from base
Plate leaves.Later, conveying robot keeps out of the way hand between substrate and generating component.It is taken out in substrate from multiple clamper components
When, hand is inserted between substrate and generating component under backoff state.Later, conveying robot rises hand.As a result,
Substrate leaves from multiple clamper components, and by hand support.
When from the viewpoint of heating efficiency, it is preferable that generating component is configured near substrate.However, when fever
When component gets too close to substrate, hand can not be made to enter between substrate and generating component, and substrate can not be placed in multiple folders
Have on component, or is taken out from multiple clamper components.As described above, the handover of substrate carries out under backoff state.On the other hand, base
The heating of plate is carried out in the case where multiple clamper components or generating component are located adjacent to the proximity state of position.Therefore, it is able to carry out base
The handover of plate, without reducing the heating efficiency of substrate.
The interval change mechanism moves the multiple clamper component along the vertical direction relative to the rotating basis, institute
Stating moveable jaw can be mobile relative to the rotating basis between the closed position and the open position.
According to this structure, multiple clamper components include can be between closed position and open position relative to rotating basis
Mobile moveable jaw.The interval of the up and down direction of substrate and generating component is by making multiple clamper components relative to rotating basis
It moves along the vertical direction to change.Therefore, moveable jaw can not only be between closed position and open position relative to rotation
Pedestal is mobile, additionally it is possible to move along the vertical direction relative to rotating basis.In this way, due to without in order to change substrate and fever structure
The interval of the up and down direction of part and move generating component along the vertical direction, therefore, can simplify support generating component structure.
The interval change mechanism moves the generating component along the vertical direction relative to the rotating basis.
According to this structure, the interval of the up and down direction of substrate and generating component is by making generating component relative to rotating basis
It moves along the vertical direction to change.In this way, due to without making for the interval for changing the up and down direction of substrate and generating component
Multiple clamper components move along the vertical direction, therefore, can simplify the structure for supporting multiple clamper components.
The substrate board treatment can also have a magnetic shield member, and the magnetic shield member is for shielding by described
Alternating magnetic field caused by the power supply of heating coil.The magnetic shield member includes surrounding the tubular of the heating coil
Outside wall portions and lower wall portion positioned at the lower section of the heating coil.
According to this structure, the outside wall portions for absorbing magnetic magnetic shield member surround heating coil.Moreover, absorbing magnetic magnetic
The lower wall portion of shield member is located at the lower section of heating coil.Therefore, it is able to suppress or eliminates and involve around heating coil
Component alternating magnetic field influence.Similarly, it is able to suppress or eliminates the friendship for involving the component positioned at the lower section of heating coil
The influence of varying magnetic field.
The substrate board treatment can also include thermometer, for detecting the temperature of the generating component；And control
Device controls the IH heating mechanism based on the detected value of the thermometer.
According to this structure, the detected value for detecting the thermometer of the temperature of generating component is input into control device.Control device
The electric power of supply to heating coil is controlled based on the detected value.Thereby, it is possible to make the temperature of generating component with higher precision
Close to target temperature.
Preferably, thermometer be in a manner of not being contacted with generating component detect generating component temperature it is contactless
Thermometer.An example of such thermometer is radiation thermometer, the infrared ray which is released by detection from object
Or the intensity of visible rays carrys out the temperature of detection object.
The fluid feeding unit also may include lower surface nozzle, and the lower surface nozzle is configured at when looking down along upper
Lower direction penetrates through in the through-hole of the generating component, sprays towards the lower surface of the substrate held by the multiple clamper component
The treatment fluid out.
According to this structure, lower surface nozzle sprays treatment fluid towards the lower surface of substrate.Lower surface nozzle is when looking down
It is configured in the through-hole of central portion for penetrating through generating component along the vertical direction.Therefore, it is able to suppress or prevents from lower surface nozzle
The treatment fluid of ejection interferes generating component.Thereby, it is possible to securely feed treatment fluid to the lower surface of substrate.
If lower surface nozzle is configured at when looking down in the through-hole of generating component, the lower surface nozzle for the treatment of fluid is sprayed
Ejiction opening can both be configured at the height equal with the upper surface of generating component, the upper table than generating component can also be configured at
The higher or lower position in face.
Above-mentioned or other purposes, feature and effect of the invention is stated under carrying out by referring to accompanying drawing to embodiment
It is bright just clearer.
Detailed description of the invention
Fig. 1 is the inside for horizontally observing chamber possessed by the substrate board treatment of first embodiment of the invention
Schematic diagram.
Fig. 2 is the schematic diagram for indicating the vertical section of the rotary chuck along II-II line shown in Fig. 3.
Fig. 3 is the schematical top view of rotary chuck.
Fig. 4 is the schematic diagram for indicating the horizontal profile of the rotary chuck along IV-IV line shown in Fig. 2.
Fig. 5 is the schematic diagram for indicating the vertical section of the clamp switching mechanism for illustrating to be set to rotary chuck.
Fig. 6 A is to indicate follower and driving portion at spaced intervals along the schematic of the reciprocally opposite state in direction of rotation
Top view.
Fig. 6 B is the state for indicating follower driven part and horizontally pressing until moveable jaw reaches open position
Schematical top view.
Fig. 7 A is the schematic diagram for illustrating the handover of substrate.
Fig. 7 B is the schematic diagram for illustrating the handover of substrate.
Fig. 8 A is the schematic diagram for indicating the vertical section of the IH heating mechanism for illustrating to be set to rotary chuck.
Fig. 8 B is the schematical top view for illustrating the configuration of heating coil.
Fig. 9 is the process chart of an example of the processing of the substrate for illustrating to execute by substrate board treatment.
Figure 10 A is in an example for the processing for indicating substrate shown in Fig. 9 to the schematic diagram of the state of substrate supply SPM.
Figure 10 B is in an example for the processing for indicating substrate shown in Fig. 9 to the schematic diagram of the state of substrate supply pure water.
Figure 10 C is in an example for the processing for indicating substrate shown in Fig. 9 to the schematic diagram of the state of substrate supply SC1.
Figure 10 D is in an example for the processing for indicating substrate shown in Fig. 9 to the schematic diagram of the state of substrate supply IPA.
Figure 10 E is in an example for the processing for indicating substrate shown in Fig. 9 from the schematic diagram of the state of substrate removal IPA.
Figure 10 F be the processing for indicating substrate shown in Fig. 9 an example in make drying substrates state schematic diagram.
Figure 11 is the schematic diagram for indicating the vertical section of the rotary chuck of second embodiment of the present invention.
Figure 12 is directed towards the schematical top view of the direction observation moveable jaw of arrow XII shown in Figure 11.
Figure 13 is the state pressed with indicating follower driven part vertical until moveable jaw reaches open position
Schematic sectional view.
Specific embodiment
(first embodiment)
Fig. 1 is the inside for horizontally observing chamber 4 possessed by the substrate board treatment 1 of first embodiment of the invention
Schematic diagram.
Substrate board treatment 1 is the dress for handling the single sheet type of disk-shaped substrate W of semiconductor wafer etc. one by one
It sets.Substrate board treatment 1 be include: processing unit 2, substrate W is handled using treatment fluids such as treatment fluid or processing gas；It removes
Manipulator R1 (referring to Fig. 3) is transported, for substrate W to be carried to processing unit 2；And control device 3, it is handled for control base board
Device 1.Control device 3 is the computer for including storage memory and processor, which, should for storing the information such as program
Processor carrys out control base board processing unit 1 according to the information for being stored in memory.
Processing unit 2 includes: the chamber 4 of box-shaped, has inner space；Rotary chuck 31, on one side by a substrate W in chamber
Level is remained in room 4, rotates substrate W centered on the rotation axis A1 of the vertical of the central portion by substrate W；
Multiple nozzles, for spraying various fluids towards the substrate W kept by rotary chuck 31；And the cup body (cup) 26 of tubular,
It surrounds around rotary chuck 31.
Multiple nozzles include the first liquid nozzle 5 and the second liquid nozzle 9 that medical fluid is sprayed towards the upper surface of substrate W.
First liquid nozzle 5 is connected to the first medical fluid piping 6 for being equipped with the first medical fluid valve 7.Similarly, the second liquid nozzle 9 connects
10 are piped in the second medical fluid for being equipped with the second medical fluid valve 11.When the first medical fluid valve 7 is opened, from the first medical fluid piping 6 to the
One liquid nozzle 5 supplies medical fluid, and sprays from the first liquid nozzle 5.When the first medical fluid valve 7 is closed, stop coming from the first medicine
The ejection of the medical fluid of nozzle for liquid 5.It is also the same about the second liquid nozzle 11.
The concrete example of the medical fluid (the first medical fluid) sprayed from the first liquid nozzle 5 be SPM (sulfuric acid and aquae hydrogenii dioxidi it is mixed
Close liquid).The concrete example of the medical fluid (the second medical fluid) sprayed from the second liquid nozzle 9 be SC1 (ammonium hydroxide and aquae hydrogenii dioxidi it is mixed
Close liquid).First medical fluid may be phosphoric acid.For first medical fluid other than SPM and phosphoric acid, can also be includes sulfuric acid, nitric acid, salt
Acid, fluoric acid, phosphoric acid, acetic acid, ammonium hydroxide, aquae hydrogenii dioxidi, organic acid (for example, citric acid, oxalic acid etc.), organic base (for example,
TMAH:tetramethylammonium hydroxide: tetramethyl ammonium hydroxide etc.), in interfacial agent and preservative
The liquid of at least one.It is also the same about the second medical fluid.
First liquid nozzle 5 is connected to the first jet mobile mechanism 8 for keeping the first liquid nozzle 5 mobile.Second liquid medicine jet
Mouth 9 is connected to the second nozzle mobile mechanism 12 for keeping the second liquid nozzle 9 mobile.First jet mobile mechanism 8 makes the first medical fluid
Nozzle 5 moves between processing position and position of readiness, which is the position for the upper surface that the first medical fluid lands on substrate W
It sets, which is the position that the first liquid nozzle 5 is located in plan view around cup body 26.Moreover, first jet
Mobile mechanism 8 is by making the first liquid nozzle 5 move horizontally, to make the landing positions of the first medical fluid in the upper surface of substrate W
Interior movement.It is also the same about second nozzle mobile mechanism 12.
Multiple nozzles include the rinse liquid nozzle 13 for spraying flushing liquor downwards towards the upper face center portion of substrate W.Punching
Washing lotion nozzle 13 is fixed on chamber 4.Rinse liquid nozzle 13 also can connect to be moved in the third nozzle for keeping rinse liquid nozzle 13 mobile
Motivation structure.Rinse liquid nozzle 13 is connected to the first flushing liquor piping 14 for being equipped with the first rinse fluid valve 15.From rinse liquid nozzle
The concrete example of 13 flushing liquors sprayed is pure water (deionized water).Flushing liquor may be carbonated water, electrolytic ionic water, hydrogen water,
Flushing liquor other than the pure water such as the hydrochloric acid water of Ozone Water and diluted concentration (for example, 10ppm to 100ppm or so).
Multiple nozzles include the lower surface nozzle 16 for spraying flushing liquor upwards towards the lower surface central portion of substrate W.Under
Surface nozzle 16 is fixed on chamber 4.Lower surface nozzle 16 is connected to the second flushing liquor piping for being equipped with the second rinse fluid valve 18
17.The concrete example of the flushing liquor sprayed from lower surface nozzle 16 is pure water.Flushing liquor may be rushing other than pure water above-mentioned
Washing lotion.In addition, from the liquid that lower surface nozzle 16 sprays may be treatment fluid other than flushing liquor.
Lower surface nozzle 16 includes: plectane portion 16a, between the upper surface of rotating basis 33 and the lower surface of substrate W
Height is maintained as level；And cylindrical portion 16b, extend downward from plectane portion 16a along rotation axis A1.Plectane portion
16a is the annular shape for surrounding rotation axis A1, and has outer diameter more smaller than the diameter of substrate W.The outer diameter of cylindrical portion 16b is than circle
The outer diameter of plate portion 16a is smaller.Cylindrical portion 16b is inserted in the through-hole in the upper face center portion of rotating basis 33 opening.Lower surface
The ejiction opening of nozzle 16 is open in the upper face center portion of plectane portion 16a.The ejiction opening of lower surface nozzle 16 is in the up-down direction
It is opposite with the lower surface central portion of substrate W.
Multiple nozzles include: solvent nozzle 19, spray IPA (liquid) towards the upper surface of substrate W；And gas nozzle
22, gas is sprayed towards the upper surface of substrate W.Solvent nozzle 19 is connected to the solvent piping 20 for being equipped with solvent valve 21.With regard to IPA
For (isopropanol), boiling point is lower than water, and volatility is higher than water, and surface tension is smaller than water.Gas nozzle 22 is connected to peace
Gas pipe 23 equipped with gas trap 24.The concrete example of the gas sprayed from gas nozzle 22 is nitrogen.Gas both can be nitrogen
Non-active gas other than gas, or the gas other than non-active gas.
Solvent nozzle 19 is connected to the 4th nozzle for moving solvent nozzle 19 between processing position and position of readiness and moves
Motivation structure 25.Gas nozzle 22 is also connected to the 4th nozzle moving mechanism 25.Gas nozzle 22 also can connect to be sprayed in the 4th
The 5th different nozzle moving mechanism of mouth mobile mechanism 25.4th nozzle moving mechanism 25 makes solvent nozzle 19 and gas nozzle 22
In solvent nozzle 19 and gas nozzle 22 close to the position of readiness of the processing position of the upper surface of substrate W and the top for handling position
Between gone up and down.4th nozzle moving mechanism 25 or the machine for making solvent nozzle 19 and gas nozzle 22 move horizontally
Structure.
Cup body 26 includes: multiple splash guards 28, for catching the liquid being discharged from substrate W towards outside；And multiple rings
Shape pallet 27, for catching the liquid guided downward by splash guard 28.Multiple splash guards 28 surround rotary chuck 31.It is anti-
The rake 28a that cover 28 includes: tubular is splashed, is extended obliquely upward towards rotation axis A1；And cylindric guide portion 28b,
Extend downward from the lower end (outer end) of rake 28a.Rake 28a includes having than substrate W and rotating basis 33
The circular upper end 28u of bigger internal diameter.The upper end 28u of rake 28a is equivalent to the upper end of cup body 26.Multiple guide portions
28b is respectively arranged at the top of multiple loop trays 27.
Cover lifting unit 29 moves splash guard 28 between upper position and lower position along vertical direction, and position refers on this
The position upper end 28u of rake 28a closer to the top compared to the Support Position for configuring the substrate W supported by multiple clamper components 32
It sets, which refers to the upper end 28u of rake 28a compared to the position of Support Position more on the lower.In medical fluid or flushing liquor etc.
Liquid when supplying to substrate W, splash guard 28 is configured at position.The liquid to disperse from substrate W towards outside is being inclined by portion
After 28a is caught, collected in loop tray 27 by guide portion 28b.
Cover lifting unit 29 goes up and down multiple splash guards 28 individually.Cover lifting unit 29 includes electric motor and will be electronic
The ball-screw and ball nut of the movement for being converted into vertical direction of motor.Cover lifting unit 29 or cylinder.
Control device 3 by control cover lifting unit 29, come make according to the type of liquid supply to substrate W it is selected any one prevent
It is opposite with the outer peripheral surface of substrate W to splash cover 28.
Then, rotary chuck 31 is illustrated.
Fig. 2 is the schematic diagram for indicating the vertical section of the rotary chuck 31 along II-II line shown in Fig. 3.
Fig. 3 is the schematical top view of rotary chuck 31.Fig. 4 is the revotating card indicated along IV-IV line shown in Fig. 2
The schematic diagram of the horizontal profile of disk 31.Fig. 5 is the lead for indicating the clamp switching mechanism 34 for illustrating to be set to rotary chuck 31
The schematic diagram of vertical section.Fig. 6 A is to indicate follower 55 and driving portion 56 shape reciprocally opposite along direction of rotation at spaced intervals
The schematical top view of state.Fig. 6 B is to indicate that 55 driven part 56 of follower horizontally presses until moveable jaw 32a is reached
The schematical top view of state until open position.In Fig. 4, by the exposed portion blacking of drive magnet 68.Fig. 5 and figure
6A indicates that moveable jaw 32a is located at the state of closed position.Fig. 6 B indicates that moveable jaw 32a is located at the state of open position.
As shown in Fig. 2, rotary chuck 31 includes: disk-shaped rotating basis 33, it is maintained as level；Multiple clamper components
32, rotating basis 33 upper horizontal hold substrate W；Clamp switching mechanism 34, for being opened and closed multiple clamper components 32；
And rotation motor 36 is made by rotating rotating basis 33 and clamper component 32 centered on rotation axis A1 by multiple folders
Has the substrate W rotation that component 32 is held.Rotating basis 33 is, for example, the solid circle with the outer diameter bigger than the diameter of substrate W
Plate.
Rotation motor 36 is the servo motor for including rotor 36b and stator 36a.Rotor 36b is via from 33 court of rotating basis
The rotary shaft 35 extended downward is connected to rotating basis 33.Stator 36a surrounds rotor 36b.Rotor 36b and stator 36a configuration
In in chuck shell 37.Rotation motor 36 and chuck shell 37 are configured at the lower section of rotating basis 33.Chuck shell 37 includes: cylinder
The downside cylindrical portion 37a of shape, extends upward from the bottom 4a of chamber 4；Annulus 37b, from the upper end of downside cylindrical portion 37a
Portion extends towards inside；And upside cylindrical portion 37c, extend upward from the inner end of annulus 37b.
Clamper component 32 protrudes upward from the upper surface of rotating basis 33.As shown in figure 3, multiple clamper components 32 every
Compartment of terrain is opened to be configured at around rotation axis A1.Multiple clamper components 32 include: multiple moveable jaw 32a, can be relative to
Lift component 62 described below is mobile；And multiple stationary fixture 32b, it is fixed on lift component 62.Multiple moveable jaw 32a
It is circumferentially arranged in a manner of not gripping fixture 32b between them.Moveable jaw 32a can be pressed in handle part 38a
The closed position of the outer peripheral surface of substrate W and handle part 38a are between the open position that the outer peripheral surface of substrate W leaves, relative to rotation
Turn pedestal 33 and lift component 62 to rotate centered on the fixture pivot center A2 of vertical.
As shown in figure 5, moveable jaw 32a includes: clamp head 38, it is contacted with substrate W；And standard shaft (base shaft)
39, extend downward from clamp head 38.About stationary fixture 32b also the same (referring to Fig. 7 A).Clamp head 38 and standard shaft 39 were both
It can be individual component, or integrated component.Clamp head 38 includes: support portion 38b, from below supporting substrate W；And
Handle part 38a presses the peripheral part of substrate W.Handle part 38a includes forming the receiving that the section opened towards inside is in V shape
Two slot inner faces of slot.Support portion 38b includes the inclination extended obliquely downward towards rotation axis A1 from handle part 38a
Face.Support portion 38b and handle part 38a is configured at the top of rotating basis 33.Handle part 38a is configured at around substrate W.Support
Portion 38b is configured at the lower section of substrate W.
Standard shaft 39 be vertically extend it is cylindric.Standard shaft 39 is inserted in penetrates through rotating basis 33 along the vertical direction
Through portion 33p.Annular seal 41 by surrounding clamper component 32 can prevent liquid from entering through portion 33p.Standard shaft 39 passes through
It is supported by the sliding bearing 42 being configured in through portion 33p by rotating basis 33.In moveable jaw 32a and stationary fixture 32b
The standard shaft 39 of any one can also move along the vertical direction relative to rotating basis 33.The standard shaft 39 of stationary fixture 32b is fixed on
Lift component 62.The standard shaft 39 of moveable jaw 32a can be rotated centered on fixture pivot center A2 relative to lift component 62.
The standard shaft 39 of moveable jaw 32a is inserted in the through portion 62p for penetrating through lift component 62 along the vertical direction.Moveable jaw
The standard shaft 39 of 32a protrudes downward from lift component 62.The standard shaft 39 of moveable jaw 32a is via being configured in through portion 62p
Rolling bearing 44 supported by lift component 62.Moveable jaw 32a can be equivalent to fixture rotation relative to lift component 62
It is rotated centered on the center line of the standard shaft 39 of axis A2.The power for moving lift component 62 along the vertical direction is via rolling bearing 44
It is transferred to moveable jaw 32a.Moveable jaw 32a is moved along the vertical direction together with lift component 62.
Conveying robot R1 puts the substrate W on hand H1 in the state that each moveable jaw 32a is located at open position
It is placed on the support portion 38b of each clamper component 32.In this state, when clamp switching mechanism 34 makes each moveable jaw
When 32a is mobile to the direction of closed position, substrate W is supportted up by multiple support portion 38b on one side, makes multiple handle parts on one side
Peripheral part of the 38a close to substrate W.The support portion 38b of whole clamper components 32 can leave from substrate W as a result, and whole folders
The handle part 38a of tool component 32 can press the peripheral part of substrate W.In this state, when clamp switching mechanism 34 make it is each movable
When fixture 32a is mobile to the direction of open position, the handle part 38a of whole clamper components 32 leaves from substrate W, and whole
The support portion 38b of clamper component 32 can be contacted with the peripheral part of substrate W.
As shown in figure 5, clamp switching mechanism 34 includes: opening mechanism, for making multiple moveable jaw 32a to open position
Direction it is mobile；And closing organ, for keeping multiple moveable jaw 32a mobile to the direction of closed position.Opening mechanism packet
Include: follower 55 is rotated centered on fixture pivot center A2 together with moveable jaw 32a；And driving portion 56, by will be from
Dynamic portion 55 circumferentially presses (around the direction of rotation axis A1), to keep moveable jaw 32a mobile to the direction of open position.It closes
Closing mechanism includes the multiple helical springs 51 for wrapping around multiple moveable jaw 32a.
Helical spring 51 is wound in the standard shaft 39 of moveable jaw 32a.Helical spring 51 is configured at the lower section of lift component 62.
Helical spring 51 is contained in the shell 52 for being installed on lift component 62.The one end of helical spring 51, which is inserted in, is fixed on lifting structure
The insertion hole of maintaining part 53 on part 62.The other end of helical spring 51 is inserted in the outer peripheral surface opening in moveable jaw 32a
Retaining hole 54.The one end of helical spring 51 can limit the movement relative to lift component 62.The other end of helical spring 51
Portion can limit the movement relative to moveable jaw 32a.
Moveable jaw 32a is held in origin position by helical spring 51.Fig. 5 is to indicate that moveable jaw 32a is located at close stance
The state set.Origin position, open position and closed position refer to the difference different around the rotation angle of fixture pivot center A2
Position.Closed position is the position for the direction of rotation of moveable jaw 32a between origin position and open position.When making
When moveable jaw 32a is rotated from origin position to open position, helical spring 51, which is understood flexible deformation and generated, makes moveable jaw 32a
It is back to the recuperability of origin position.The power for keeping moveable jaw 32a mobile to the direction of closed position can be generated as a result,.
As shown in Fig. 2, rotary chuck 31 includes interval change mechanism 61, the interval change mechanism 61 is by making multiple fixtures
Component 32 is gone up and down relative to rotating basis 33, substrate W that Lai Biangeng is held by multiple clamper components 32 and described below
The interval of the up and down direction of generating component 72.Being spaced change mechanism 61 includes: lift component 62, is used to support multiple clamper components
32；Multiple guiding elements 64, for guiding lift component 62 along the vertical direction；And elevation driving unit 66, for generating
The power for moving lift component 62 along the vertical direction.
Lift component 62 is the annular shape for surrounding rotation axis A1.Lift component 62 surrounds chuck shell 37.Lift component
62 are configured at the lower section of rotating basis 33.Lift component 62 is surrounded by the skirt section 63 for being fixed on the tubular of rotating basis 33.It rises
Drop component 62 is configured at the top of the annulus 37b of chuck shell.Upper surface court of multiple clamper components 32 from lift component 62
It protrudes upwards.When lift component 62 moves along the vertical direction, whole clamper components 32 is with lift component 62 together along upper
Lower direction is mobile.
As shown in figure 4, multiple guiding elements 64 circumferentially arrange at spaced intervals.Guiding elements 64 includes: leading axle
(guide shaft) 64a, vertically extends；And guidance retainer (guide stopper) 64b, when looking down than drawing
Guide shaft 64a is bigger.Leading axle 64a is inserted in the through-hole 65 for penetrating through lift component 62 along the vertical direction.Guide retainer 64b configuration
In the lower section of lift component 62.Guide retainer 64b bigger than the through-hole 65 of lift component 62 when looking down.
As shown in Fig. 2, leading axle 64a extends downward from rotating basis 33.Leading axle 64a is fixed on rotating basis
33.Guidance retainer 64b is fixed on leading axle 64a.Lift component 62 configuration rotating basis 33 and guidance retainer 64b it
Between.Lift component 62 can move along the vertical direction between lower position and upper position relative to rotating basis 33, the lower position
Refer to the position that the lower surface of lift component 62 is in contact with guidance retainer 64b, position refers to lift component 62 from drawing on this
Retainer 64b is led to position away from upward.
Elevation driving unit 66 is, for example, the magnetic force generating unit for going up and down lift component 62 using magnetic force.Magnetic force generates
Unit includes: driven magnet 67, is fixed on lift component 62；Drive magnet 68, by rising driven magnet 67, to make to go up and down
Component 62 rises；And lifting actuator 69, by moving drive magnet 68 along the vertical direction, Lai Biangeng acts on driven magnetic
The intensity of magnetic force between iron 67 and drive magnet 68.
Driven magnet 67 is fixed on lift component 62.Driven magnet 67 moves along the vertical direction together with lift component 62.
Driven magnet 67 is configured at the outside of chuck shell 37.Drive magnet 68 and lifting actuator 69 be configured at chuck shell 37 it
In.Drive magnet 68 is separated by chuck shell 37 with driven magnet 67.
Drive magnet 68 compares the more outward configuration of rotation motor 36.Drive magnet 68 is more on the lower compared to driven magnet 67
Configuration.Drive magnet 68 is opposite along the vertical direction with driven magnet 67 via chuck shell 37.Drive magnet 68 when looking down with
At least part of driven magnet 67 is overlapped.Drive magnet 68 can also be not be overlapped with driven magnet 67 when looking down.
As shown in figure 4, driven magnet 67 and drive magnet 68 are configured each along the circle for surrounding rotation axis A1.Driven magnet
67 be arc-shaped when looking down.Drive magnet 68 is when looking down ring-type.Drive magnet 68 both can be the continuous ring of complete cycle,
It may include the multiple magnet being configured on the circumference for surrounding rotation axis A1.
As shown in Fig. 2, lifting actuator 69 is cylinder.Lifting actuator 69 also can have electric motor and will be electronic
The ball-screw and ball nut of the movement for being converted into drive magnet 68 vertically of motor, to replace cylinder.
Going up and down actuator 69 includes: bar (rod), along the axially extending of cylinder；Piston (piston), is connected to bar；And the cylinder of tubular
It manages (cylinder tube), surrounds bar and piston.Drive magnet 68 is connected to the bar of cylinder.The bar of drive magnet 68 and cylinder
It moves along the vertical direction together.
Lifting actuator 69 makes drive magnet 68 in upper position (position shown in the double dot dash line in Fig. 2) and lower position
It is moved along the vertical direction between (position shown in solid in Fig. 2).When the direction of the upward position of drive magnet 68 rises, from
Moving magnet 67 is lifted by the magnetic force (reaction force) acted between driven magnet 67 and drive magnet 68.It is adjoint therewith,
Lift component 62 can rise.When drive magnet 68 reaches upper position, lift component 62 is configured at position.When drive magnet 68
When dropping to lower position from upper position, the guidance retainer 64b of each guiding elements 64 is contacted with lift component 62, and goes up and down structure
Part 62 is configured at lower position.
Whole clamper components 32 move between upper position and lower position with the lifting of lift component 62.Institute below
The generating component 72 stated is configured at the lower section of the substrate W by the support portion 38b support of multiple clamper components 32.Clamper component 32
Upper position refers to the retreating position that substrate W and generating component 72 leave each other.The lower position of clamper component 32 refers to substrate W and hair
The approximated position close to each other of hot component 72.
When multiple clamper components 32 are located at lower position corresponding with approximated position, distance D1 (referring to Fig. 8 A) compares from substrate
The thickness T1 of the hand H1 of the conveying robot R1 of the supported underneath substrate W of W is smaller, and distance D1 refers to from generating component 72
Distance until upper surface to the lower surface of the substrate W held by multiple clamper components 32.Distance D1 be, for example, 0.1mm extremely
10mm.For this purpose, at this point, conveying robot R1 can not be terminated in substrate W is anti-on multiple clamper components 32, or from multiple fixture structures
Part 32 takes out substrate W.
As described above, clamp switching mechanism 34 includes: follower 55, with fixture pivot center together with moveable jaw 32a
It is rotated centered on A2；And driving portion 56, by circumferentially pressing follower 55, to make moveable jaw 32a to open position
Direction is mobile.As shown in figure 3, follower 55 is arranged according to each moveable jaw 32a.Driving portion 56 is according to each follower 55
And it is arranged.Fig. 3 is to indicate that three followers 55 are respectively arranged at three moveable jaw 32a, and three driving portions 56 are respectively along rotation
The direction example opposite with three followers 55.
As shown in figure 5, follower 55 is fixed on clamper component 32.Follower 55 is rotated together with fixture with clamper component 32
It is rotated centered on axis A2.Follower 55 extends from clamper component 32 towards outside.Follower 55 is configured at rotating basis 33
Top.Follower 55 leaves upward from the upper surface of rotating basis 33.The outer end 55o of follower 55 compares rotating basis 33
Outer peripheral surface configure more in the inner part.The outer end 55o of follower 55 compares the more outward configuration of inner end 56i of driving portion 56.
Driving portion 56 is fixed on the splash guard 28A of the top.Driving portion 56 moves together with splash guard 28A along vertical direction
It is dynamic.Driving portion 56 extends from splash guard 28A towards inside.Driving portion 56 includes: longitudinal portion 56a, upward from splash guard 28A
Extend；And transverse part 56b, extend from the upper end of longitudinal portion 56a towards inside.Transverse part 56b is upper compared to splash guard 28A's
Hold 28u closer to the top.The inner end of transverse part 56b is equivalent to the inner end 56i of driving portion 56.The inner end 56i of driving portion 56 is configured at
Upper end 28u compared to splash guard 28A is more in the inner part and compared to the more outward position in outer end of clamper component 32.
As shown in Figure 6A, when the rotation angle of rotating basis 33 is to prepare angle, follower 55 and driving portion 56 are overlooked
When do not overlap.At this point, follower 55 and driving portion 56 are mutually opposite along direction of rotation at spaced intervals when looking down.Cover rises
Drop unit 29 goes up and down splash guard 28A in the range of driving portion 56 is not in contact in rotating basis 33.When splash guard 28A is configured at
When delivery position, follower 55 and driving portion 56 are mutually horizontally opposed along direction of rotation, which refers to driving portion 56
At least part be configured at the position of the height equal with follower 55.In this state, when rotation motor 36 makes to rotate base
When seat 33 rotates, as shown in Figure 6B, follower 55 is rotated centered on rotation axis A1 together with moveable jaw 32a, follower
55 contact with driving portion 56.Follower 55 horizontally presses on driving portion 56 as a result,.
Then, the handover of the substrate W between rotary chuck 31 and conveying robot R1 is illustrated.
Fig. 7 A to Fig. 7 B is the signal for illustrating the handover of the substrate W between rotary chuck 31 and conveying robot R1
Figure.Each process below is executed by 3 control base board processing unit 1 of control device.In other words, control device 3 is programmed
To execute each process below.
When substrate W is placed on multiple clamper components 32 by conveying robot R1, rotation motor 36 makes rotating basis
33 rotations, until the rotation angle of rotating basis 33 is reached with the preparation consistent ready position of angle.Ready position refer to from
Move portion 55 and driving portion 56 nonoverlapping position when looking down.Lifting actuator 69 is located at the shape of ready position in rotating basis 33
Under state, rises to multiple clamper components 32 and be set to only as the upper of delivery position.Moreover, cover lifting unit 29 makes the top
Splash guard 28A rise to delivery position.
The delivery position of splash guard 28A refers to that at least part of driving portion 56 is configured at the height equal with follower 55
Height.Therefore, when splash guard 28A is configured at delivery position, as shown in Figure 6A, driving portion 56 and 55 interval of follower
Ground is horizontally opposed along direction of rotation.In addition, at this point, the upper end 28u of splash guard 28A is compared configured with by multiple clamper components 32
Support portion 38b support substrate W Support Position more on the lower.For this purpose, substrate W is placed in conveying robot R1 multiple
When the substrate W that the support portion 38b of clamper component 32 or taking-up are supported by multiple support portion 38b, the hand H1 of conveying robot R1
It is not contacted with splash guard 28A.
After splash guard 28A is configured at delivery position, rotation motor 36 revolves the rotating basis 33 positioned at ready position
It goes to and releases position.That is, rotation motor 36 makes the rotation angle of rotating basis 33 from angle change is prepared to releasing angle.Such as Fig. 6 B
Shown, in rotating basis 33 towards during releasing position rotation, driving portion 56 is contacted with follower 55, and follower 55 passes through
Driving portion 56 is pressed along direction of rotation.Adjoint therewith, the meeting flexible deformation of helical spring 51, moveable jaw 32a can be rotated with fixture
It is rotated centered on axis A2 to the direction of open position.When rotating basis 33, which is configured at, releases position, whole moveable jaws
32a is configured at open position.
As shown in Figure 7 A, conveying robot R1 keeps hand H1 mobile in the state that rotating basis 33 is located at and releases position
To the upper position for the top for being located at generating component 72 by the substrate W that hand H1 is supported.Later, conveying robot R1 makes under hand H1
It is down to hand H1 and generating component 72 and the discontiguous lower position splash guard 28A.As shown in Figure 7 B, in hand H1 under upper position
During being down to lower position, substrate W is placed on the support portion 38b of multiple clamper components 32 and leaves from hand H1.
Later, conveying robot R1 keeps out of the way hand H1 between substrate W and generating component 72.
Rotation motor 36 after the hand H1 of conveying robot R1 keeps out of the way below substrate W, make rotation motor 36 from
Position is released to rotate to ready position.Follower 55 and driving portion 56 leave each other as a result,.It is adjoint therewith, moveable jaw 32a benefit
It is mobile to the direction of origin position with the recuperability of helical spring 51.Since substrate W is supported by multiple support portion 38b, it can
Dynamic fixture 32a can't reach origin position, but stop in the front position of origin position, that is, closed position.It is movable as a result,
The handle part 38a of fixture 32a presses the peripheral part of substrate W using the recuperability of helical spring 51.It is adjoint therewith, stationary fixture
The handle part 38a of 32b also presses the peripheral part of substrate W.Substrate W is held by multiple clamper components 32 as a result,.
When conveying robot R1 takes out substrate W from multiple clamper components 32, rotation motor 36 is located at rotating basis 33
Ready position, lifting actuator 69 make multiple clamper components 32 be located at upper position.Moreover, cover lifting unit 29 makes the anti-of the top
It splashes cover 28A and is located at delivery position.In this state, rotation motor 36 rotates rotating basis 33 to releasing position from ready position
It sets.The handle part 38a of whole clamper components 32 leaves from the peripheral part of substrate W as a result, the support of whole clamper components 32
Portion 38b is contacted with the peripheral part of substrate W.
Conveying robot R1 inserts hand H1 in the state that substrate W is supported by the support portion 38b of multiple clamper components 32
Enter between substrate W and generating component 72.Later, conveying robot R1 is to move hand H1 upward.Substrate W is in hand
It leaves when H1 is moved upward from the support portion 38b of whole clamper components 32 and is supported by hand H1.Later, rotation motor
36 rotate rotating basis 33, so that follower 55 and driving portion 56 be made mutually to deviate from.For this purpose, moveable jaw 32a can utilize spiral shell
The recuperability of rotation spring 51 is back to origin position.
Then, the IH heating mechanism 71 for heating the substrate W from below is illustrated.
Fig. 8 A is the schematic diagram for indicating the vertical section of the IH heating mechanism 71 for illustrating to be set to rotary chuck 31.Figure
8B is the schematical top view for illustrating the configuration of heating coil 73.Follower 55 is omitted in Fig. 8 A to Fig. 8 B and drives
The diagram in dynamic portion 56.
As shown in Figure 8 A, rotary chuck 31 includes IH heating mechanism 71, and the IH heating mechanism 71 is for heating by multiple folders
Has the substrate W that component 32 is kept.IH heating mechanism 71 includes: generating component 72, for heating the substrate W；Heating coil 73, supply
Electric power；And IH circuit 74, the alternating magnetic field for being applied to generating component 72 is generated by supplying electric power to heating coil 73, with
Generating component 72 is set to generate heat.IH heating mechanism 71 further include: magnetic shield member 77, for protecting the component other than generating component 72
It is not influenced by alternating magnetic field；And supporting member 78, it is used to support heating coil 73.
Generating component 72 is to generate the conductor of Joule heat with the generation due to the eddy current of alternating magnetic field.Generate heat structure
Part 72 is also referred to as warm table (susceptor).At least surface of generating component 72 is by the material shape with chemical resistance
At.Similarly, at least surface of rotating basis 33 is formed by the material with chemical resistance.That is, be in contact with medical fluid
Whole parts are formed by the material with chemical resistance.Generating component 72 and rotating basis about clamper component 32 etc.
Component other than 33 is also the same.
Generating component 72 both can be multiple components of integration, or single integral member.For example, fever structure
Part 72 also may include the coating of silicon carbide (SiC) system on the core material of carbon and the surface of covering core material, can also be by glassy
Carbon (Glassy carbon) formation.Generating component 72 can also by metal etc. these other than material formed.In addition, in order to
Prevent the influence of alternating magnetic field from involving to the element on the surface for being formed in substrate W (device), it can also be by the iron of armoured magnetic field
Soft magnetic materials are waited to form at least part of generating component 72.
Generating component 72 includes the plate-like portion 72a being configured between substrate W and rotating basis 33.Plate-like portion 72a is, for example,
Surround the annular shape of rotation axis A1.The thickness (length of up and down direction) of plate-like portion 72a than rotating basis 33 thickness T3 more
It is small.The upper surface and the lower surface of plate-like portion 72a is parallel with the upper surface and the lower surface of substrate W.The lower surface of plate-like portion 72a via
Space is opposite in parallel with the upper surface of rotating basis 33.Lower surface from the upper surface of rotating basis 33 to plate-like portion 72a is
Distance only, both can be equal with distance D1 until from the upper surface of plate-like portion 72a to the lower surface of substrate W, can also compare
Distance D1 is longer or shorter.
When multiple clamper components 32 hold substrate W and are located at lower position, the upper surface of plate-like portion 72a is close to substrate W's
Lower surface.At this point, the distance D1 of the up and down direction until from the upper surface of plate-like portion 72a to the lower surface of substrate W compares carrying implement
The thickness T1 of the hand H1 of tool hand R1 is shorter.On the other hand, when multiple clamper components 32 hold substrate W and are located at upper position,
Hand of the distance D1 than conveying robot R1 of up and down direction until from the upper surface of plate-like portion 72a to the lower surface of substrate W
The thickness T1 of H1 is longer.Therefore, as long as conveying robot R1 can be by substrate when multiple clamper components 32 are located at upper position
W is placed in multiple clamper components 32, or takes out substrate W from multiple clamper components 32.
Generating component 72 includes the multiple foot 72b extended downward from plate-like portion 72a.Foot 72b may be rotation
Turn a part of pedestal 33.That is, rotating basis 33 also may include: plectane portion, there is the outer diameter bigger than the diameter of substrate W；
And multiple foot 72b, extend upward from the horizontal upper surface in plectane portion.Foot 72b is from the lower surface of plate-like portion 72a
Extend to the upper surface of rotating basis 33.Plate-like portion 72a is supported by multiple foot 72b.Generating component 72 is fixed on rotating basis
33.Generating component 72 is rotated centered on rotation axis A1 together with rotating basis 33.
As shown in figure 3, multiple clamper components 32 are inserted in multiple through portion 72p of generating component 72 respectively.Through portion 72p
The peripheral part of generating component 72 is penetrated through along the vertical direction.Through portion 72p can both cut for what is be open in the outer peripheral surface of plate-like portion 72a
Mouthful, or complete cycle closed through-hole.The outer peripheral surface of plate-like portion 72a is more outward compared to the inner end of clamper component 32.Plate
The outer diameter of outer diameter, that is, generating component 72 of portion 72a is smaller than the outer diameter of rotating basis 33, and the outer diameter than substrate W is bigger.Generate heat structure
The outer diameter of part 72 both can be equal with the outer diameter of substrate W, can also be smaller than the outer diameter of substrate W.
As shown in Figure 8 A, heating coil 73 is configured between supporting member 78 and rotating basis 33.Heating coil 73 is from rotation
The lower surface for turning pedestal 33 separates downward.Heating coil 73 is configured to Chong Die with generating component 72 when looking down.Heater wire
Circle 73 is separated with generating component 72, and is physically not attached to generating component 72.Heating coil 73 is in radially spaced apart compartment of terrain
Surround rotary shaft 35.Multiple clamper components 32 are configured at around heating coil 73.Heating coil 73 is from clamper component 32 along diameter
To leaving.Compare the more outward configuration of outer peripheral surface of rotation motor 36 in the outer end of heating coil 73.
As shown in Figure 8 B, heating coil 73 is configured at the annular section for surrounding rotation axis A1.Fig. 8 B is to indicate mutually solely
Two vertical heating coils 73 are respectively arranged at the example of two annular sections.Two heating coils 73 include: interior loop 73I,
It is configured at the inner annular region RI for surrounding rotation axis A1；And exterior loop 73O, it is configured at and surrounds inner annular region RI
The outside annular section RO of concentric round shape.Two heating coils 73 are connected to two IH circuits 74.It flows and adds in two
The frequency of the alternating current of heat coil 73 can respectively be changed by two IH circuits 74.
Generating component 72 is configured in the alternating magnetic field generated near heating coil 73.It flows in heating coil 73
The frequency of alternating current is changed by IH circuit 74.The temperature of generating component 72 is by flowing in the alternating current of heating coil 73
Frequency change.IH circuit 74 is controlled by control device 3.Due to being provided with mutually independent two heating coils 73, control
Device 3 processed can either make generating component 72 generate heat in such a way that the temperature of generating component 72 becomes uniform, and can be with radial direction
The mode that temperature gradient results from generating component 72 makes generating component 72 generate heat.
The temperature of generating component 72 is detected by thermometer 75.Fig. 8 B is to indicate to be provided in the distance away from rotation axis A1
The example of two thermometers 75 of the temperature of two different position detection generating components 72.The quantity of thermometer 75 both can be
One, or three or more.The detected value of thermometer 75 is input to control device 3.Control device 3 is based on thermometer 75
Detected value controls IH circuit 74, makes the temperature of generating component 72 close to target temperature as a result,.Generating component 72 can be with as a result,
High-precision is maintained at target temperature.
As shown in Figure 8 A, thermometer 75 is configured at the lower section of heating coil 73.Thermometer 75 is via between heating coil 73
Gap and rotating basis 33 are opposite.Thermometer 75 is examined by detecting the intensity of the infrared ray or visible rays that radiate from object
Survey the radiation thermometer of the temperature of object.Thermometer 75 be by with generating component 72 it is discontiguous in a manner of detect generating component 72
Temperature contactless thermometer.Thermometer 75 via the rotating basis 33 blocked by multiple transparent components 76 multiple detections
Window detects the temperature of generating component 72.It detects windowsill up and down direction and penetrates through rotating basis 33.Transparent component 76 includes by making
The transparent material that the light of infrared ray penetrates is formed.
Thermometer 75 is supported by supporting member 78.Even if generating component 72 rotates together with rotating basis 33, thermometer 75
Also it does not rotate.On the other hand, when rotating basis 33 rotates, the multiple detection windows for being set to rotating basis 33 also rotate.Such as figure
Shown in 8B, multiple detection windows of rotating basis 33 circumferentially arrange on the circumference for surrounding rotation axis A1.Therefore, in rotation base
During almost all in 33 rotation of seat, any of multiple detection windows are opposite with thermometer 75.For this purpose, even if in rotation base
When seat 33 rotates, thermometer 75 is also able to detect the temperature of generating component 72.
As shown in Figure 8 A, magnetic shield member 77 includes: the outside wall portions 77a of tubular, surrounds heating coil 73；And lower wall portion
77b, positioned at the lower section of heating coil 73.Magnetic shield member 77 is formed by the soft magnetic material of iron etc..Lower wall portion 77b is located at upper
Between lower section upward heating coil 73 and supporting member 78.Lower wall portion 77b is the annular shape for surrounding rotation axis A1.Outside wall portions
77a extends upward from the peripheral part of lower wall portion 77b.Outside wall portions 77a is located at heating coil 73 and clamper component radially
Between 32.Component near the heating coils 73 such as clamper component 32 shields alternating magnetic field by magnetic shield member 77.
Supporting member 78 is fixed on the bottom 4a of chamber 4.Fig. 8 A is to indicate supporting member 78 by the stator of rotation motor 36
The example of 36a support.Supporting member 78 compares the configuration closer to the top of rotation motor 36.Supporting member 78 is to surround rotation axis A1
Annular shape.The outer diameter of supporting member 78 is bigger than the outer diameter of rotation motor 36.The peripheral part of supporting member 78 is located at outside chuck
The top of the upside cylindrical portion 37c of shell 37.Rotary shaft 35 is inserted in the logical of the central portion for penetrating through supporting member 78 along the vertical direction
Hole.Supporting member 78 surrounds rotary shaft 35 at spaced intervals radially.
When control device 3 starts to supply electric power heating coil 73, alternating magnetic field generates near heating coil 73,
To which generating component 72 generates heat.Adjoint therewith, the temperature of generating component 72 hastily rises, and maintains generating component 72
Target temperature or its near.The temperature of substrate W hastily rises as a result, and maintain generating component 72 target temperature or
Near it.The rotation of rotation motor 36 is transferred to generating component 72 via rotary shaft 35 and rotating basis 33.Therefore, it is filled in control
Set 3 make that generating component 72 generates heat when, if rotation motor 36 rotates, generating component 72 heats the substrate W on one side, on one side and substrate
W rotates together.
As described above, the thickness T1 of the plate-like portion 72a of generating component 72 is smaller than the thickness T3 of rotating basis 33.In this way,
Since generating component 72 is relatively thin, the volume of generating component 72 can be reduced, and the thermal capacitance of generating component 72 can be reduced
Amount.Thereby, it is possible to so that generating component 72 is reached target temperature immediately.Moreover, generating component 72 at least part by carbon etc.
In the case that the biggish material of pyroconductivity is formed, can further shorten generating component 72 reach until target temperature when
Between.It is further possible to reduce the unevenness of the temperature of generating component 72.
Then, an example of the processing of the substrate W executed by substrate board treatment 1 is illustrated.
Fig. 9 is the process chart of an example of the processing of the substrate W for illustrating to execute by substrate board treatment 1.Figure 10 A is extremely
Figure 10 F is the state for indicating substrate W when executing each process included in an example of the processing of substrate W shown in Fig. 9
Schematic diagram.The diagram of follower 55 and driving portion 56 is omitted in Figure 10 A to Figure 10 F.Each process below passes through control
Device 3 control base board processing unit 1 executes.In other words, control device 3 is programmed to execute each process below.
When substrate board treatment 1 handles substrate W, substrate W is moved in chamber 4 and move in process (the step of Fig. 9
S1)。
Specifically, whole splash guards 28 is configured at lower position, including first before substrate W is moved in chamber 4
Whole movable nozzles of liquid nozzle 5 are configured at position of readiness.Moreover, whole clamper components 32 is configured at position.At this
Under state, as described above, whole moveable jaw 32a is configured at open position.Later, conveying robot R1 enters hand H1
In chamber 4, and the substrate W on hand H1 is placed on multiple clamper components 32.Substrate W is moved in chamber 4 as a result,
And it is supported by the support portion 38b of multiple clamper components 32.
Later, conveying robot R1 keeps out of the way hand H1 from the inside of chamber 4.Then, as described above, whole movable folders
Tool 32a is configured at closed position.Substrate W leaves from the support portion 38b of multiple clamper components 32 as a result, and by multiple fixture structures
The handle part 38a of part 32 is held.Later, lifting actuator 69 makes whole clamper components 32 be moved to lower position.Then, it rotates
Motor 36 starts to rotate.The rotation of rotation motor 36 is transferred to substrate W via rotating basis 33 and clamper component 32.Base as a result,
Plate W is rotated centered on rotation axis A1.
Then, as shown in Figure 10 A, the SPM as an example of medical fluid is supplied to the first medical fluid confession of the upper surface of substrate W
It is held parallel to process (the step S2 of Fig. 9) and the first heating process (the step S3 of Fig. 9) for heating the substrate the SPM on W and substrate W
Row.
For the first medical fluid supply step, first jet mobile mechanism 8 keeps the first liquid nozzle 5 mobile from position of readiness
To processing position, cover lifting unit 29 keeps the splash guard 28 of any one opposite with the peripheral part of substrate W.Later, the first medical fluid valve 7
It is opened, the first liquid nozzle 5 starts to spray SPM.First liquid nozzle 5 will (for example, 140 DEG C) more at higher temperature than room temperature SPM
It is sprayed towards the upper surface of the substrate W in rotation.In this state, first jet mobile mechanism 8 is by making the first liquid nozzle 5
It is mobile, move the landing positions of the SPM of the upper surface relative to substrate W between central portion and peripheral part.When the first medical fluid
When after the opening of valve 7 by the stipulated time, the first medical fluid valve 7 is closed, to stop the ejection of SPM.Later, first jet moving machine
Structure 8 makes the first liquid nozzle 5 retreat to position of readiness.
The SPM sprayed from the first liquid nozzle 5 is after the upper surface for landing on substrate W, because centrifugal force is along substrate W's
It is flowed towards outside upper surface.For this purpose, SPM can be supplied to the whole region of the upper surface of substrate W, to be formed on substrate W
Cover the liquid film of the SPM of the whole region of the upper surface of substrate W.The foreign matters such as resist film can be gone by SPM from substrate W as a result,
It removes.Moreover, because first jet mobile mechanism 8 makes the SPM's of the upper surface relative to substrate W in the state that substrate W rotates
Landing positions move between central portion and peripheral part, and therefore, the landing positions of SPM pass through the entire area of the upper surface of substrate W
Domain, so as to the whole region of the upper surface of scanning substrate W.For this purpose, SPM can directly be blown it is entire to the upper surface of substrate W
Region, so that the whole region of the upper surface of substrate W is evenly treated within the entire length.
For the first heating process, control device 3 starts to supply electric power heating coil 73.As long as substrate W and substrate W
On SPM be heated by generating component 72, then the beginning of power supply can both open simultaneously with the first medical fluid valve 7, can also
Before or after the first medical fluid valve 7 is opened.When starting to supply electric power heating coil 73, alternating magnetic field is in heating coil
It is generated near 73, so that generating component 72 generates heat.Then, when from power supply when beginning to pass through the stipulated time, stopping pair
The power supply of heating coil 73.The stopping of power supply can both be closed with the first medical fluid valve 7 it is also possible in the first medicine
Before or after liquid valve 7 is closed.
When starting to supply electric power heating coil 73, generating component 72 reaches defined high temperature immediately.Generating component 72
Such as it is maintained at high temperature more higher than the boiling point of the first medical fluid (SPM).Lower surface court of the upper surface of generating component 72 from substrate W
It leaves downwards, but the hand H1 of conveying robot R1 more cannot be introduced between substrate W and generating component 72, then generating component 72
Upper surface closer to the lower surface of substrate W.Moreover, the whole region or substantially the entire area of substrate W when looking down with fever
Component 72 is overlapped.For this purpose, substrate W is uniformly heated with the SPM on substrate W, so as to improve the processing capacity of SPM.By
This, substrate W can efficiently be handled by SPM.
Then, as shown in Figure 10 B, carry out supplying the pure water as an example of flushing liquor to the upper surface of substrate W and under
The first flushing liquor supply step (the step S4 of Fig. 9) on surface.
Specifically, the first rinse fluid valve 15 is opened and the ejection of the beginning pure water of rinse liquid nozzle 13.Pure water is from punching as a result,
The upper face center portion of washing lotion nozzle 13 towards the substrate W of rotation spray.The pure water of the upper surface of substrate W is landed on along substrate
It is flowed towards outside the upper surface of W.SPM on substrate W is washed away by the pure water sprayed from rinse liquid nozzle 13.It is formed and is covered as a result,
The liquid film of the pure water of the whole region of the upper surface of cover substrate W.When passing through the stipulated time after the first rinse fluid valve 15 is opened,
First rinse fluid valve 15 may turn off, to stop the ejection of pure water.
On the other hand, the second rinse fluid valve 18 is opened and the ejection of the beginning pure water of lower surface nozzle 16.Pure water is under as a result,
The lower surface central portion of surface nozzle 16 towards the substrate W of rotation spray.Second rinse fluid valve 18 both can be with the first flushing liquor
Valve 15 opens simultaneously, and can also open before or after the first rinse fluid valve 15 is opened.Land on the pure of the lower surface of substrate W
Water is flowed along the lower surface of substrate W towards outside.Mist (mist) of the SPM of the lower surface of substrate W etc. is attached to by from following table
The pure water that face nozzle 16 is sprayed washes away.When passing through the stipulated time after the second rinse fluid valve 18 is opened, the second rinse fluid valve
18 close, to stop the ejection of pure water.
Then, as illustrated in figure 10 c, carry out supplying the SC1 as an example of medical fluid to the second medicine of the upper surface of substrate W
Liquid supply step (the step S5 of Fig. 9).
Specifically, second nozzle mobile mechanism 12 makes the second liquid nozzle 9 be moved to processing position, cover from position of readiness
Lifting unit 29 keeps the splash guard 28 different from when the first medical fluid supply step opposite with the peripheral part of substrate W.Later, the second medicine
Liquid valve 11 is opened and the ejection of the second liquid nozzle 9 beginning SC1.In this state, second nozzle mobile mechanism 12 is by making
Two liquid nozzles 9 are mobile, move the landing positions of the SC1 of the upper surface relative to substrate W between central portion and peripheral part.
When passing through the stipulated time after the second medical fluid valve 11 is opened, the second medical fluid valve 11 is closed, to stop the ejection of SC1.Later,
Second nozzle mobile mechanism 12 makes the second liquid nozzle 9 retreat to position of readiness.
The SC1 sprayed from the second liquid nozzle 9 is after the upper surface for landing on substrate W, because centrifugal force is along substrate W's
It is flowed towards outside upper surface.For this purpose, SC1 is supplied to the whole region of the upper surface of substrate W, to be formed on substrate W
Cover the liquid film of the SC1 of the whole region of the upper surface of substrate W.The foreign matters such as particle can be removed by SC1 from substrate W as a result,.And
And since second nozzle mobile mechanism 12 makes the land of the SC1 of the upper surface relative to substrate W in the state that substrate W rotates
Position is moved between central portion and peripheral part, and therefore, the landing positions of SC1 pass through the whole region of the upper surface of substrate W, from
And the whole region of the upper surface of energy scanning substrate W.For this purpose, SC1 can be directly blown to the whole region of the upper surface of substrate W,
To which the whole region of the upper surface of substrate W is evenly treated within the entire length.
Then, as shown in Figure 10 B, carry out supplying the pure water as an example of flushing liquor to the upper surface of substrate W and under
The second flushing liquor supply step (the step S6 of Fig. 9) on surface.
Specifically, the first rinse fluid valve 15 is opened and the ejection of the beginning pure water of rinse liquid nozzle 13.Pure water is from punching as a result,
The upper face center portion of washing lotion nozzle 13 towards the substrate W of rotation spray.The pure water of the upper surface of substrate W is landed on along substrate
It is flowed towards outside the upper surface of W.SC1 on substrate W is washed away by the pure water sprayed from rinse liquid nozzle 13.It is formed and is covered as a result,
The liquid film of the pure water of the whole region of the upper surface of cover substrate W.When passing through the stipulated time after the first rinse fluid valve 15 is opened,
First rinse fluid valve 15 is closed, to stop the ejection of pure water.
On the other hand, the second rinse fluid valve 18 is opened and the ejection of the beginning pure water of lower surface nozzle 16.Pure water is under as a result,
The lower surface central portion of surface nozzle 16 towards the substrate W of rotation spray.Second rinse fluid valve 18 both can be with the first flushing liquor
Valve 15 opens simultaneously, and can also open before or after the first rinse fluid valve 15 is opened.Land on the pure of the lower surface of substrate W
Water is flowed along the lower surface of substrate W towards outside.Mist (mist) of the SC1 of the lower surface of substrate W etc. is attached to by from following table
The pure water that face nozzle 16 sprays washes away.When passing through the stipulated time after the second rinse fluid valve 18 is opened, the second rinse fluid valve 18
It closes, to stop the ejection of pure water.
Then, as shown in Figure 10 D, the solvent as the IPA of an example of organic solvent (liquid) supply to substrate W is supplied
Process (the step S7 of Fig. 9) and the second heating process (the step S8 of Fig. 9) for heating the substrate the IPA and substrate W on W are held parallel
Row.
For solvent supply step, the 4th nozzle moving mechanism 25 makes solvent nozzle 19 be moved to processing from position of readiness
Position, cover lifting unit 29 make the splash guard 28 and substrate different from when the first medical fluid supply step and the second medical fluid supply step
The peripheral part of W is opposite.Later, solvent valve 21 is opened and the ejection of the beginning of solvent nozzle 19 IPA.IPA is from solvent nozzle 19 as a result,
It is sprayed towards the upper face center portion of the substrate W of rotation.The IPA of the upper surface of substrate W is landed on along the upper surface court of substrate W
It flows outward.The liquid film of pure water on substrate W is replaced as the liquid film of the IPA of the whole region of the upper surface of covering substrate W.
When passing through the stipulated time after solvent valve 21 is opened, solvent valve 21 is closed, to stop the ejection of solvent.
For the second heating process, control device 3 starts to supply electric power heating coil 73.As long as substrate W and substrate W
On IPA heated by generating component 72, then the beginning of power supply just can both have been opened with solvent valve 21 it is also possible to
Before or after solvent valve 21 is opened.When starting to supply electric power heating coil 73, alternating magnetic field is attached heating coil 73
It is close to generate, so as to make generating component 72 generate heat.Start the heating of substrate W as a result,.Then, it is begun to pass through when from power supply
When the stipulated time, stopping supplies electric power heating coil 73.Such as drying later is supplied electric power to heating coil 73
Until lasting up to substrate W drying in process.
When starting to supply electric power heating coil 73, generating component 72 can reach defined high temperature immediately.Generating component
72 each portion is maintained at the temperature of the boiling point of IPA or more.The temperature of substrate W the upper surface of substrate W whole region by IPA's
The value of the boiling point of IPA or more is reached in the state of liquid film covering.IPA can steam at the interface of IPA Yu the upper surface of substrate W as a result,
Hair, to form gas blanket between the liquid film of IPA and the upper surface of substrate W.At this point, since the liquid film of IPA is from the upper of substrate W
Surface floats, so the frictional resistance of the liquid film of the IPA acted on substrate W is small to the degree for being considered as zero.For this purpose, the liquid of IPA
Film is in the state of the upper surface slide readily along substrate W.The liquid film of IPA is in IPA removing step as described below from base
Plate W removal.
After carrying out solvent supply step, as shown in figure 10e, the IPA for remove on substrate W IPA removes work
Sequence (the step S9 of Fig. 9).
Specifically, gas nozzle 22 is configured in processing position in solvent supply step.In this state, gas trap
24 open and the ejection of the beginning nitrogen of gas nozzle 22.Gas nozzle 22 towards by IPA liquid film covering substrate W upper surface
Spray nitrogen.In addition, rotation motor 36 accelerates substrate W along direction of rotation, and make substrate W than IPA supply step Shi Geng great
Removal revolving speed rotate.When gas nozzle 22 sprays nitrogen, as long as substrate W is to remove revolving speed rotation, the acceleration of substrate W
Both it can have been opened with gas trap 24 it is also possible to before or after gas trap 24 is opened.Being ejected in for nitrogen is described below
Drying process in last up to substrate W it is dry until.
In the state that gas nozzle 22 is formed with gas blanket between the liquid film of IPA and the upper surface of substrate W, towards substrate
Blowing position in the upper surface of W sprays nitrogen.IPA positioned at blowing position is pushed to around it by the supply of nitrogen.By
This, arid region can be formed in blowing position.Moreover, because by IPA that nitrogen is pushed open from blowing position to moving around it, institute
The outside flowing towards the peripheral part of substrate W can be formed with as opportunity and on the liquid film of IPA using the supply of nitrogen.And
And since the supply of substrate W and nitrogen concurrently accelerates along direction of rotation, so the flowing is promoted using centrifugal force.As a result,
The liquid film of IPA on substrate W can be discharged with block-like state from substrate W, without splitting into most droplets.For this purpose, can
The liquid film of the IPA floated from substrate W is rapidly excluded from substrate W in a short time.
Then, as shown in figure 10f, carry out being attached to the liquid of substrate W by throwing away using centrifugal force and keeping the substrate W dry
Drying process (the step S10 of Fig. 9).
Specifically, rotation motor 36 accelerates substrate W along direction of rotation, and with the high revolving speed bigger than removal revolving speed
(for example, thousands of rpm) rotates substrate W.Biggish centrifugal force would be applied to the liquid for being attached to substrate W as a result, thus liquid
Body is from substrate W towards throwing away around it.Moreover, because generating component 72 constantly generates heat, so can promote the liquid on substrate W
Evaporation.Similarly, due to the ejection of 22 continuing nitrogen of gas nozzle, so the evaporation of the liquid on substrate W can be promoted.By
This, substrate W can be dried in a short time.When after the high speed rotation of substrate W starting by the stipulated time, rotation motor 36 stops
Spin-ended turn.In addition, stopping supplying electric power heating coil 73, gas trap 24 is closed.
Then, carry out moving out substrate W from chamber 4 moves out process (the step S11 of Fig. 9).
Specifically, whole splash guards 28 is configured at lower position, it include whole movable nozzles of the first liquid nozzle 5
It is configured at position of readiness.Moreover, whole clamper components 32 is configured at position.In this state, as described above, whole can
Dynamic fixture 32a is configured at open position.When moveable jaw 32a is moved to open position, holding of the substrate W from clamper component 32
Portion 28a leaves, and is supported by the support portion 38b of clamper component 32.In this state, conveying robot R1 makes hand H1 enter base
Between plate W and generating component 72, and increase hand H1.During hand H1 rises, clamper component of the substrate W from whole
32 support portion 38b leaves, and is supported by the hand H1 of conveying robot R1.Later, conveying robot R1 uses hand H1 on one side
Carry out supporting substrate W, keeps out of the way hand H1 from the inside of chamber 4.Substrate W is moved out from chamber 4 as a result,.
As described above, in the present embodiment, rotation motor 36 makes follower 55 together with moveable jaw 32a with substrate W
Rotation axis A1 centered on rotate.Cover lifting unit 29 moves driving portion 56 together with splash guard 28A along vertical direction.Rotation
Turn motor 36 and cover lifting unit 29 is controlled by control device 3.
Follower 55 and driving portion 56 are opposite opposite to direction horizontally or vertically in the state of being separated from each other.It
Afterwards, follower 55 and driving portion 56 contact with each other, and driving portion 56 presses follower 55 along relative direction.Moveable jaw 32a as a result,
It is configured at open position.Later, follower 55 and driving portion 56 are separated from each other.Moveable jaw 32a is generated using as holding power
The power of the helical spring 51 of an example of component is returned to the direction of closed position.
In this way, since rotation motor 36 doubles as the rush for making moveable jaw 32a to the mobile opening in the direction of open position
Dynamic device, so the actuator of no setting is required dedicated opening.For this purpose, the fixture opening and closing of opening and closing moveable jaw 32a can be simplified
Mechanism 34.Moreover, because driving portion 56 is contacted with follower 55 and therefore pressing follower 55 makes movably to press from both sides with using magnetic force
Tool 32a is compared to the mobile situation in the direction of open position, and moveable jaw 32a can be made reliably to move to the direction of open position
It is dynamic.
In the present embodiment, the IH circuit 74 of IH heating mechanism 71 supplies electricity to heating coil 73 when substrate W is rotated
Power.The alternating magnetic field for being applied to generating component 72 is generated as a result, so that generating component 72 be made to generate heat.Handle the processing stream of substrate W
Body is supplied to the substrate W of rotation.Thereby, it is possible to equably handle substrate W.
Since generating component 72 is heated by induction heating, so without making the wiring supplied electric power to generating component 72
Or connector is connected to generating component 72.For this purpose, through this structure without limitation on the revolving speed of substrate W.Moreover, heating the substrate
The generating component 72 of W is configured between substrate W and rotating basis 33, the inside without being configured at rotating basis 33.Therefore, with hair
The situation that hot component 72 is configured at the inside of rotating basis 33 is compared, and the interval between substrate W and generating component 72 can be shortened,
And it can be improved the heating efficiency of substrate W.
In the present embodiment, heating coil 73 is configured near rotating basis 33.That is, as shown in Figure 8 A, heater wire
Circle 73 is more narrower than the thickness T2 of heating coil 73 with the interval D 2 of the up and down direction of rotating basis 33.Heating coil 73 is configured at rotation
Turn the lower section of pedestal 33, generating component 72 is configured at the top of rotating basis 33.When make heating coil 73 close to rotating basis 33
When, it just can be shortened the distance from heating coil 73 to generating component 72.As a result, due to being applied to the alternating magnetic field of generating component 72
Become strong, therefore, the electric power that can be fed to heating coil 73 is efficiently converted into the heat of generating component 72.
In the present embodiment, the thickness T3 of rotating basis 33 can be reduced.That is, the thickness T3 of rotating basis 33 compares heater wire
The thickness T2 of circle 73 is smaller.When rotating basis 33 is thicker, not only will increase from heating coil 73 to the distance of generating component 72,
The alternating magnetic field for being applied to generating component 72 can also die down.For this purpose, can make to generate heat by the thickness T3 for reducing rotating basis 33
The temperature of component 72 efficiently rises.
In the present embodiment, other components are not installed between substrate W and generating component 72 and, and generating component
72 is directly opposite with substrate W.For this purpose, the thermal energy of generating component 72 is efficiently transferred to substrate W.Thereby, it is possible to improve substrate W
Heating efficiency.
In the present embodiment, interval change mechanism 61 makes multiple clamper components 32 and generating component 72 phase along the vertical direction
It moves over the ground.The interval of the up and down direction of the substrate W and generating component 72 that are held by multiple clamper components 32 is changed as a result,.Cause
This, can change the distance from generating component 72 to substrate W as needed.
In the present embodiment, it is located under the backoff state as the upper position of retreating position in multiple clamper components 32,
The substrate W being supported on hand H1 is prevented terminating on multiple clamper components 32 by conveying robot R1.Then, conveying robot R1
Decline hand H1 and is left from substrate W.Later, conveying robot R1 moves back hand H1 between substrate W and generating component 72
It keeps away.When substrate W takes out from multiple clamper components 32, hand H1 is made to be inserted in substrate W and generating component 72 under backoff state
Between.Later, conveying robot R1 rises hand H1.Substrate W leaves from multiple clamper components 32 as a result, and is supported in hand
Portion H1.
When from the viewpoint of heating efficiency, it is preferable that generating component 72 is configured near substrate W.However, when hair
When hot component 72 gets too close to substrate W, hand H1 can not be made to enter between substrate W and generating component 72, and substrate W can not be put
It is placed on multiple clamper components 32, or is taken out from multiple clamper components 32.As described above, the handover of substrate W is under backoff state
It carries out.On the other hand, the heating of substrate W is located under the proximity state as the lower position of approximated position in multiple clamper components 32
It carries out.Therefore, it is able to carry out the handover of substrate W, without reducing the heating efficiency of substrate W.
In the present embodiment, multiple clamper components 32 include can be between closed position and open position relative to rotation
Turn the mobile moveable jaw 32a of pedestal 33.The interval of the up and down direction of substrate W and generating component 72 is by making multiple clamper components
32 move along the vertical direction relative to rotating basis 33 to change.Therefore, moveable jaw 32a closed position and can not only beaten
It is mobile relative to rotating basis 33 between open position, additionally it is possible to be moved along the vertical direction relative to rotating basis 33.In this way, due to
Without moving generating component 72 along the vertical direction to change the interval of substrate W and the up and down direction of generating component 72, because
This, can simplify the structure of support generating component 72.
In the present embodiment, the outside wall portions 77a for absorbing magnetic magnetic shield member 77 surrounds heating coil 73.Moreover,
The lower wall portion 77b for absorbing magnetic magnetic shield member 77 is located at the lower section of heating coil 73.Therefore, it is able to suppress or eliminates and involve
The influence of the alternating magnetic field of component around heating coil 73.Similarly, it is able to suppress or eliminates to involve and be located at heating
The influence of the alternating magnetic field of the component of the lower section of coil 73.
In the present embodiment, the detected value for detecting the thermometer 75 of the temperature of generating component 72 is input to control device 3.
Control device 3 controls the electric power of supply to heating coil 73 based on the detected value.Thereby, it is possible to make the temperature of generating component 72
With higher precision close to target temperature.
In the present embodiment, lower surface nozzle 16 sprays treatment fluid towards the lower surface of substrate W.Lower surface nozzle 16
It is configured in the through-hole 72c of central portion for penetrating through generating component 72 along the vertical direction when looking down.Therefore, it is able to suppress or prevents
The treatment fluid sprayed from lower surface nozzle 16 interferes generating component 72.Thereby, it is possible to by treatment fluid securely feed to
The lower surface of substrate W.
In the present embodiment, moveable jaw 32a is rotated centered on the fixture pivot center A2 of vertical.In the situation
Under, compared with the case where fixture pivot center A2 is horizontal straight line, easily reduce that moveable jaw 32a passes through by space
Volume.Particularly, under the center line unanimous circumstances of fixture pivot center A2 and moveable jaw 32a, can make to pass through space
Volume it is consistent or substantially uniform with the volume of moveable jaw 32a.
(second embodiment)
Then, second embodiment of the present invention is illustrated.Second embodiment and first embodiment it is main
The difference lies in that generating component 72 is gone up and down and not multiple clamper components 32 and moveable jaw 32a can be with horizontal
It is rotated centered on fixture pivot center A2.
Figure 11 is the schematic diagram for indicating the vertical section of rotary chuck 31 of second embodiment of the present invention.Figure 12 is edge
The schematical top view of the direction observation moveable jaw 32a of arrow XII shown in Figure 11.Figure 13 is to indicate that follower passes through drive
Dynamic portion by vertical presses the schematical cross-sectional view of the state until moveable jaw 32a reaches open position.Figure 11 is
Indicate that moveable jaw 32a is located at the state of closed position, Figure 13 is to indicate that moveable jaw 32a is located at the state of open position.?
Figure 11 assigns and the identical attached drawing marks such as Fig. 1 structure identical with each portion shown in Fig. 1 to Figure 10 F above-mentioned into Figure 13
Remember and the description thereof will be omitted.
Stationary fixture 32b (referring to Fig. 3) is fixed on rotating basis 33.Moveable jaw 32a with horizontal fixture can be turned
The mode rotated centered on shaft line A2 is held in rotating basis 33.
As shown in figure 12, moveable jaw 32a is via the support shaft 281 horizontally extended and the branch inserted with support shaft 281
Support hole 282 is supported by rotating basis 33.Support shaft 281 is set to moveable jaw 32a, and supported hole 282 is set to rotating basis 33.
Support shaft 281 also can be set in rotating basis 33, and supported hole 282 also can be set in moveable jaw 32a.
A pair of of support shaft 281 mutually extends in the opposite direction from moveable jaw 32a.A pair of of support shaft 281 is located at same
On straight line.The tangential direction of support shaft 281 towards the circle for surrounding rotation axis A1 (referring to Fig.1 1) horizontally extends.Supported hole
282 are recessed from the inner face for the through portion 33p for being set to rotating basis 33.A pair of of support shaft 281 is inserted in a pair of of supported hole respectively
282。
Moveable jaw 32a can be centered on the horizontal fixture pivot center A2 of center line for being equivalent to support shaft 281
And it is mobile relative to rotating basis 33.As shown in figure 11, fixture pivot center A2 compares the upper surface of rotating basis 33 more on the lower
Side's configuration.The upper end of moveable jaw 32a is rotated centered on fixture pivot center A2 with moveable jaw 32a and is radially moved
It is dynamic.The through portion 33p of rotating basis 33 refers to the notch extended from the outer peripheral surface of rotating basis 33 towards inside.Rotating basis 33
Through portion 33p be connected to the through portion 63p in skirt section 63.The through portion 63p in skirt section 63 radially penetrates through skirt section 63.Skirt section 63
Through portion 63p refers to the notch that the upper surface from skirt section 63 extends downward.
As shown in figure 13, helical spring 51 is configured at the inside of moveable jaw 32a.One end (the outer end of helical spring 51
Portion) it is held in moveable jaw 32a.The other end (inner end) of helical spring 51 is held in the holding for being set to rotating basis 33
Portion 53.Helical spring 51 configures more on the lower compared to fixture pivot center A2.Helical spring 51 is more compared to fixture pivot center A2
It configures in the inner part.Moveable jaw 32a is held in origin position by helical spring 51.When moveable jaw 32a is from origin position to beating
When the direction rotation of open position, the meeting flexible deformation of helical spring 51, so that generating makes moveable jaw 32a be back to origin position
Recuperability.Figure 13 is to indicate that moveable jaw 32a is located at the state of open position.
Follower 55 is fixed on clamper component 32.During follower 55 and clamper component 32 be with fixture pivot center A2 together
Heart rotation.Follower 55 extends from disk component 32 towards outside.Follower 55 configures more on the lower compared to fixture pivot center A2.
Follower 55 compares the more outward configuration of fixture pivot center A2.A part of follower 55 is configured at the through portion in skirt section 63
In 63p.Follower 55 is protruded outward from the outer peripheral surface in skirt section 63.The outer end 55o of follower 55 is more outward compared to skirt section 63
Side configuration.Follower 55 configures more on the lower compared to driving portion 56.
Lift component 62 is configured at the lower section of shell 52.The upper position of lift component 62 refer to from shell 52 downward from
The position opened.Lift component 62 and multiple 64 1 liftings of guiding elements.Guide retainer 64b from the upper surface of lift component 62
Extend upward, leading axle 64a extends upward from guidance retainer 64b.Leading axle 64a is inserted in be passed through along the vertical direction
The through-hole of logical rotating basis 33.Guidance retainer 64b is configured at the lower section of rotating basis 33.Lift component 62 is relative to rotation base
The movement of 33 upward directions of seat is by guiding retainer 64b to be limited with the contact of rotating basis 33.
Generating component 72 is supported by leading axle 64a.Generating component 72 is fixed on the upper end of leading axle 64a.Generating component
72 with 62 1 lifting of lift component.The foot 72b being installed between the plate-like portion 72a of generating component 72 and rotating basis 33
(referring to Fig. 2) is omitted from generating component 72.Lift component 62, guiding elements 64 and generating component 72 can be relative to rotation bases
Seat 33 moves along the vertical direction.
Generating component 72 is with the lifting of lift component 62 and in upper position (position shown in the double dot dash line in Figure 11)
It is moved along the vertical direction between lower position (position shown in solid in Figure 11).When generating component 72 is located at upper position,
Distance D1 is more shorter than the thickness T1 of the hand H1 of conveying robot R1 (referring to Fig. 8 A), and distance D1 refers to from generating component 72
Distance until upper surface to the lower surface of the substrate W held by the handle part 38a of multiple clamper components 32.In contrast, exist
When generating component 72 is located at lower position, distance D1 is longer than the thickness T1 of hand H1.
Then, the handover of the substrate W between rotary chuck 31 and conveying robot R1 is illustrated.
When substrate W is placed in multiple clamper components 32 by conveying robot R1 (referring to Fig. 3), lifting actuator 69 makes to send out
Hot component 72 is located at the lower position as retreating position.Later, rotation motor 36 makes rotating basis 33 be located at rotating basis 33
Rotation angle and the handover consistent delivery position of angle.The delivery position of rotating basis 33 refer to driving portion 56 when looking down with it is driven
The position that portion 55 is overlapped.Figure 12 indicates that rotating basis 33 is located at the state of delivery position.
Cover lifting unit 29 makes the splash guard 28A of the top from preparation after rotating basis 33 is configured at delivery position
Position, which drops to, releases position.As shown in figure 13, during splash guard 28A is mobile to the direction for releasing position, driving portion
56 can be contacted with follower 55, so that follower 55 is pressed downward by driving portion 56.It is adjoint therewith, helical spring 51
Meeting flexible deformation, so that moveable jaw 32a can be mobile to the direction of open position.When splash guard 28A, which is configured at, releases position,
Moveable jaw 32a is configured at open position.Whole moveable jaw 32a is configured at open position as a result,.
Conveying robot R1 is moved to hand H1 and is propped up by hand H1 in the state that splash guard 28A is located at and releases position
The substrate W of support is located at the upper position of the top of generating component 72.Later, conveying robot R1 makes hand H1 drop to hand H1 not
Generating component 72 and the lower position of splash guard 28A can be contacted with.During hand H1 drops to lower position from upper position, base
Plate W is placed on the support portion 38b of multiple clamper components 32 and leaves from hand H1.Later, conveying robot R1 makes hand
H1 keeps out of the way between substrate W and generating component 72.
Cover lifting unit 29 makes splash guard 28A after the hand H1 of conveying robot R1 keeps out of the way below substrate W
Rise from position is released.Follower 55 and driving portion 56 are separated from each other as a result,.Adjoint therewith, moveable jaw 32a utilizes spiral bullet
The recuperability of spring 51 is mobile to the direction of origin position.Since substrate W is supported by multiple support portion 38b, moveable jaw
32a stops in the front position of origin position, that is, closed position, without reaching origin position.The handle of moveable jaw 32a as a result,
Hold the peripheral part that portion 38a presses substrate W by the recuperability of helical spring 51.Actuator 69 is gone up and down in hand H1 from generating component
After 72 top is kept out of the way, generating component 72 is made to be moved to the upper position as approximated position.
When conveying robot R1 takes out substrate W from multiple clamper components 32, lifting actuator 69 makes generating component 72
In the lower position as retreating position, rotation motor 36 is that rotating basis 33 is made to be located at delivery position.Cover lifting unit 29 is driving
Dynamic portion 56 relative to follower 55 at spaced intervals vertical it is opposite in the state of, so that the splash guard 28A of the top is dropped to solution
Except position.The handle part 38a of whole clamper components 32 leaves from the peripheral part of substrate W as a result, and whole clamper components 32
Support portion 38b contacted with the peripheral part of substrate W.
Conveying robot R1 inserts hand H1 in the state that substrate W is supported by the support portion 38b of multiple clamper components 32
Enter between substrate W and generating component 72, and moves hand H1 upward.In the process, fixture of the substrate W from whole
The support portion 38b of component 32 leaves, and is supported by the hand H1 of conveying robot R1.Later, cover lifting unit 29 makes splash guard
28A rises, and leaves driving portion 56 from follower 55.Moveable jaw 32a is returned by the recuperability of helical spring 51 as a result,
To origin position.
Conveying robot R1 inserts hand H1 in the state that substrate W is supported by the support portion 38b of multiple clamper components 32
Enter between substrate W and generating component 72.Later, conveying robot R1 moves hand H1 upward.Substrate W is in hand H1
When moving upward, left from the support portion 38b of whole clamper components 32, and supported by hand H1.Later, cover lifting is single
Member 29 rises splash guard 28A from position is released, and leaves driving portion 56 upward from follower 55.Movable folder as a result,
Have 32a and origin position is back to by the recuperability of helical spring 51.
As described above, in the present embodiment, since cover lifting unit 29 doubles as making moveable jaw 32a to open position
The actuator of the mobile opening in direction, so the actuator of no setting is required dedicated opening.It can for this purpose, opening and closing can be simplified
The clamp switching mechanism 34 of dynamic fixture 32a.Moreover, because driving portion 56 is contacted with follower 55 and pressing follower 55, therefore,
Compared with the situation for moving moveable jaw 32a to the direction of open position, moveable jaw 32a can be made certainly
It is mobile to the direction of open position.
In the present embodiment, follower 55 is compared prolongs towards the tangential direction of the circle for the rotation axis A1 for surrounding substrate W
The horizontal fixture pivot center A2 stretched is configured more on the lower.On the other hand, the handle part 38a of moveable jaw 32a compares fixture
Pivot center A2 configuration closer to the top.Handle part 38a is configured at around substrate W.Fixture pivot center is compared in follower 55
In the case where A2 configuration closer to the top, when centrifugal force is applied to follower 55, will generate makes handle part 38a towards outer sidesway
Dynamic power, that is, generate the power for leaving handle part 38a from the peripheral part of substrate W.In contrast, comparing fixture in follower 55
In the case that pivot center A2 is configured more on the lower, when centrifugal force is applied to follower 55, will generate makes handle part 38a court
The power moved inward, that is, generate the power for pressing handle part 38a to the peripheral part of substrate W.For this purpose, can more reliably
Hold substrate W.
(other embodiments)
The present invention is not limited to the contents of embodiment above-mentioned, and are able to carry out various changes.
For example, the interval D 2 of the up and down direction of heating coil 73 and rotating basis 33 both can be with the thickness of heating coil 73
T2 is equal, can also be also wider than the thickness T2 of heating coil 73.
The thickness T3 of rotating basis 33 both can be equal with the thickness T2 of heating coil 73, can also be than heating coil 73
Thickness T2 is also big.
The thickness of the plate-like portion 72a of generating component 72 both can be equal with the thickness T3 of rotating basis 33, can also be than rotation
The thickness T3 for turning pedestal 33 is also big.
Generating component 72 can also be indirectly opposite with the substrate W that is held by multiple clamper components 32.That is, other components
It can also be configured between generating component 72 and substrate W.
Also it can be omitted the interval change mechanism 61 at the interval between change substrate W and generating component 72.That is, configured with by
Interval between holding position and the generating component 72 of the substrate W that multiple clamper components 32 are held may be constant.
As long as clamp switching mechanisms 34 etc. also can be omitted shielding alternation without influence on the component other than heating coil 73
The magnetic shield member 77 in magnetic field.
Control device 3 may be to keep the temperature of generating component 72 consistent with target temperature, and change flowing is in heater wire
The instruction value of the alternating current of circle 73, without the detected value of reference temperature(TR) meter 75.That is, also can be omitted thermometer 75.
As long as also can be omitted lower surface nozzle 16 without the lower surface supplying processing fluid to substrate W.In the situation
Under, it also can be omitted the through-hole for penetrating through the central portion of generating component 72 along the vertical direction.It is equally possible that omitting vertically side
To the through-hole of the central portion of perforation rotating basis 33.
The drive magnet 68 of elevation driving unit 66 can also be arc-shaped when looking down.In this case, lift component
62 lifting is located at delivery position (handover angle) Shi Jinhang in rotating basis 33, which refers to that drive magnet 68 is located at
The position of the lower section of driven magnet 67.
In an example of the processing of substrate W above-mentioned, illustrate to execute the first heating process (the step S3 of Fig. 9) and second
The case where both sides of heating process (the step S8 of Fig. 9), but also can be omitted in the first heating process and the second heating process
A side.
In the first embodiment, if follower 55 and driving portion 56 are the positional relationships mutually opposite along direction of rotation,
Then follower 55 can both be protruded outward from rotating basis 33, can not also be protruded outward from rotating basis 33.
In the first embodiment, generating component 72 can also be made to go up and down, to replace clamper component 32.In this case,
Moveable jaw 32a is held in rotating basis 33 in the way of it can rotate centered on the fixture pivot center A2 of vertical.It is fixed
Fixture 32b is fixed on rotating basis 33.
In this second embodiment, follower 55 can also compare fixture pivot center A2 configuration closer to the top.
Support portion 38b can also be omitted from clamper component 32.It in this case, as long as can be in the hand of conveying robot R1
The handover of substrate W is directly carried out between portion H1 and the handle part 38a of clamper component 32.
Also it can be omitted IH heating mechanism 71.
The device of the substrate W of substrate board treatment 1 or processing polygon.
The two or more in whole structure above-mentioned can also be combined.
The application is corresponding with the September Japanese Patent Application 2016-186147 proposed to Japanese Patent Office on the 23rd in 2016, should
The disclosed full content of application refers in the application.
Although detailed description of embodiments of the present invention for needle, these are only for the clear present invention
Technology contents used in concrete example, the present invention should not be limited to these concrete example to explain, design of the invention and model
It encloses and is only defined by the claims.
Description of symbols:
1 substrate board treatment
3 control devices
5 first liquid nozzles (treatment fluid feed unit)
9 second liquid nozzles (treatment fluid feed unit)
13 rinse liquid nozzles (treatment fluid feed unit)
16 lower surface nozzles (treatment fluid feed unit)
19 solvent nozzles (treatment fluid feed unit)
22 gas nozzles (treatment fluid feed unit)
32 clamper components
32a moveable jaw
32b stationary fixture
33 rotating basis
34 clamp switching mechanisms
36 rotation motors
38a handle part
38b support portion
51 helical springs (holding power generation component)
55 followers
The outer end of 55o follower
56 driving portions
Longitudinal portion of 56a driving portion
The transverse part of 56b driving portion
The inner end of 56i driving portion
61 interval change mechanism
62 lift components
66 elevation driving units
67 driven magnets
68 drive magnets
69 lifting actuators
71 IH heating mechanisms
72 generating components
73 heating coils
74 IH circuits
A1 rotation axis
A2 fixture pivot center
H1 hand
R1 conveying robot
W substrate
Claims (9)
1. a kind of substrate board treatment, wherein
It includes
Multiple clamper components, including moveable jaw, the moveable jaw can be in closed position and the solutions for pressing the peripheral part of substrate
Except being rotated centered on fixture pivot center between the open position of the pressing of the peripheral part to the substrate, with described movable
The substrate grasping is being the holding quilt of horizontal closed state and the substrate by the movement of fixture, the multiple clamper component
Switch between the opening state of releasing；
Rotation motor is generated by making the multiple clamper component by the substrate held by the multiple clamper component
Central portion vertical rotation axis centered on rotate and the power that rotates the substrate centered on the rotation axis；
The splash guard of tubular surrounds the multiple clamper component around the rotation axis when looking down；
Cover lifting unit moves the splash guard along vertical direction；
Holding power generates component, generates the power for keeping the moveable jaw mobile to the direction of the closed position；
Follower, including compared to the more outward outer end of the moveable jaw, the follower together with the moveable jaw with
It rotates centered on the fixture pivot center, is rotated centered on the rotation axis together with the moveable jaw；
Driving portion, the inner end including the outer end compared to the follower more in the inner part, the driving portion is together with the splash guard
It is moved along vertical direction；And
Control device makes the follower together with the moveable jaw with the rotary shaft by controlling the rotation motor
It is rotated centered on line, by controlling the cover lifting unit, moves the driving portion together with the splash guard along vertical direction
It is dynamic,
The control device executes:
Preparation process, by keeping at least one party in the follower and the driving portion mobile, in the follower and described
In the state that driving portion leaves each other, keep the follower and the driving portion opposite in horizontal or vertical relative direction；
Step is released, after the preparation process, by making the follower and the driving portion along the relative direction phase
It moves over the ground, the follower and the driving portion is made to contact with each other, and the driving portion is made to press the follower until institute
It states moveable jaw and reaches the open position；And
Holding step is separated from each other the follower and the driving portion after the releasing step, and passes through described
Holding force, which generates component, keeps the moveable jaw mobile to the direction of the closed position.
2. substrate board treatment as described in claim 1, wherein
The moveable jaw can be rotated centered on the fixture pivot center of vertical,
The control device is horizontally opposed the follower and the driving portion in the preparation process, in the releasing
It rotates the follower centered on the rotation axis, makes the follower and the driving portion mutual as a result,
Contact.
3. substrate board treatment as described in claim 1, wherein
The moveable jaw can be rotated centered on the horizontal fixture pivot center,
The control device is with making the follower and the driving portion vertical in the preparation process opposite, in the releasing
It moves the driving portion along vertical direction, the follower and the driving portion is made to contact with each other as a result,.
4. substrate board treatment as claimed in claim 3, wherein
The moveable jaw includes the handle part for pressing the peripheral part of the substrate, and the moveable jaw can be along described in encirclement
It is rotated centered on the horizontal fixture pivot center that the tangential direction of the circle of rotation axis extends,
The handle part compares the fixture pivot center configuration closer to the top,
The follower configures more on the lower compared to the fixture pivot center.
5. substrate board treatment according to any one of claims 1 to 4, wherein
The substrate board treatment also has conveying robot, and the conveying robot is on one side by being configured under the substrate
Substrate described in the hand support of side, on one side by the board carrying to the multiple clamper component,
The control device makes the upper end of the splash guard compared to the hand more on one side in the releasing step, and one
While the follower and the driving portion is made to contact with each other.
6. the substrate board treatment as described in any one of claims 1 to 5, wherein
The substrate board treatment also includes
Rotating basis is configured at the lower section of the substrate held by the multiple clamper component, by the dynamic of the rotation motor
Power is transferred to the multiple clamper component；
Treatment fluid feed unit makes to handle the treatment fluid of the substrate held from the multiple clamper component to the base
At least one party's supply in the upper surface and the lower surface of plate；And
Induction heating heating mechanism, comprising: generating component is configured at the substrate held by the multiple clamper component and institute
It states between rotating basis；Heating coil is configured at the lower section of the rotating basis；Inductive heating circuit, by the heating
Coil supplies electric power and generates the alternating magnetic field for being applied to the generating component, so that the generating component generates heat.
7. substrate board treatment as claimed in claim 6, wherein
The substrate board treatment also has interval change mechanism, and the interval change mechanism is by making the multiple clamper component
Or the generating component moves along the vertical direction, the substrate and the fever that Lai Biangeng is held by the multiple clamper component
The interval of the up and down direction of component.
8. substrate board treatment as claimed in claim 7, wherein
The interval change mechanism moves the multiple clamper component along the vertical direction relative to the rotating basis,
The moveable jaw can be mobile relative to the rotating basis between the closed position and the open position.
9. substrate board treatment as claimed in claim 7, wherein
The interval change mechanism moves the generating component along the vertical direction relative to the rotating basis.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016186147A JP6789048B2 (en) | 2016-09-23 | 2016-09-23 | Board processing equipment |
| JP2016-186147 | 2016-09-23 | ||
| PCT/JP2017/019609 WO2018055834A1 (en) | 2016-09-23 | 2017-05-25 | Substrate processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109791885A true CN109791885A (en) | 2019-05-21 |
Family
ID=61690310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780058617.0A Pending CN109791885A (en) | 2016-09-23 | 2017-05-25 | Substrate board treatment |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6789048B2 (en) |
| KR (1) | KR102185029B1 (en) |
| CN (1) | CN109791885A (en) |
| TW (1) | TWI611501B (en) |
| WO (1) | WO2018055834A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113467199A (en) * | 2021-09-06 | 2021-10-01 | 宁波润华全芯微电子设备有限公司 | Device convenient to dismantle and capable of preventing wafer from being polluted by splashing liquid |
| CN115112280A (en) * | 2021-03-17 | 2022-09-27 | 芝浦机械电子装置株式会社 | Measuring tool, substrate processing apparatus, and substrate manufacturing method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11262380B2 (en) * | 2018-01-19 | 2022-03-01 | Semics Inc. | Wafer prober |
| CN111063652B (en) * | 2018-10-16 | 2022-08-30 | 沈阳芯源微电子设备股份有限公司 | Substrate clamping bearing table |
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| JP2003174008A (en) * | 2001-12-07 | 2003-06-20 | Shibaura Mechatronics Corp | Device and method for spin treatment |
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| JP3657173B2 (en) * | 2000-06-02 | 2005-06-08 | 株式会社荏原製作所 | Substrate plating equipment |
| US20080110861A1 (en) * | 2004-02-24 | 2008-05-15 | Shinji Kajita | Substrate Processing Apparatus and Method |
| JP2007335709A (en) * | 2006-06-16 | 2007-12-27 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus |
| WO2015115239A1 (en) * | 2014-01-28 | 2015-08-06 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing device |
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- 2016-09-23 JP JP2016186147A patent/JP6789048B2/en active Active
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2017
- 2017-05-25 WO PCT/JP2017/019609 patent/WO2018055834A1/en active Application Filing
- 2017-05-25 CN CN201780058617.0A patent/CN109791885A/en active Pending
- 2017-05-25 KR KR1020197002522A patent/KR102185029B1/en active IP Right Grant
- 2017-06-07 TW TW106118875A patent/TWI611501B/en active
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| JPH11251284A (en) * | 1998-03-03 | 1999-09-17 | Tokyo Electron Ltd | Spin processing apparatus |
| JP2003174008A (en) * | 2001-12-07 | 2003-06-20 | Shibaura Mechatronics Corp | Device and method for spin treatment |
| CN103270618A (en) * | 2010-08-13 | 2013-08-28 | 德莎欧洲公司 | Method for encapsulating an electronic arrangement |
| JP2016072428A (en) * | 2014-09-30 | 2016-05-09 | 株式会社ディスコ | Holding method for wafer |
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| CN115112280A (en) * | 2021-03-17 | 2022-09-27 | 芝浦机械电子装置株式会社 | Measuring tool, substrate processing apparatus, and substrate manufacturing method |
| CN113467199A (en) * | 2021-09-06 | 2021-10-01 | 宁波润华全芯微电子设备有限公司 | Device convenient to dismantle and capable of preventing wafer from being polluted by splashing liquid |
| CN113467199B (en) * | 2021-09-06 | 2021-11-12 | 宁波润华全芯微电子设备有限公司 | Device convenient to dismantle and capable of preventing wafer from being polluted by splashing liquid |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI611501B (en) | 2018-01-11 |
| KR20190021427A (en) | 2019-03-05 |
| KR102185029B1 (en) | 2020-12-01 |
| JP2018050013A (en) | 2018-03-29 |
| JP6789048B2 (en) | 2020-11-25 |
| TW201814809A (en) | 2018-04-16 |
| WO2018055834A1 (en) | 2018-03-29 |
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