CN111063652B - Substrate clamping bearing table - Google Patents
Substrate clamping bearing table Download PDFInfo
- Publication number
- CN111063652B CN111063652B CN201811201811.2A CN201811201811A CN111063652B CN 111063652 B CN111063652 B CN 111063652B CN 201811201811 A CN201811201811 A CN 201811201811A CN 111063652 B CN111063652 B CN 111063652B
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- magnet
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- rotating
- cup
- pin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Abstract
The invention belongs to the field of substrate wet processing in the semiconductor industry, and particularly relates to a substrate clamping bearing table which comprises a motor, a bearing table, a lifting CUP and a fixed CUP, wherein the output end of the motor is connected with the bearing table, the fixed CUP is arranged on the periphery of the motor, and the lifting CUP capable of being lifted is arranged on the periphery of the fixed CUP; the rotary and fixed pins which rotate along with the plummer are respectively installed on the plummer along the circumferential direction, the rotary and fixed pins comprise a cylinder and a clamping block, the cylinder for fixing the pins is fixedly connected on the plummer, the cylinder for rotating the pins is rotatably installed on the plummer, the clamping blocks for rotating the pins and fixing the pins are eccentrically arranged at the top of the cylinder, and a rotary magnet is installed at the bottom of the rotary pin; an inner magnet is arranged in the fixed CUP, an outer magnet is arranged in the lifting CUP, and the inner magnet and the outer magnet are respectively positioned at the inner side and the outer side of the rotating magnet. The invention has no abrasion and pollution to the front surface and the back surface of the substrate, and can drive the substrate to rotate to complete the process treatment of the substrate.
Description
Technical Field
The invention belongs to the field of wet processing of substrates in the semiconductor industry, and particularly relates to a substrate clamping bearing table.
Background
At present, the requirement for substrate cleanliness in the field of semiconductors is higher and higher. In a wet processing apparatus for a substrate, it is important to prevent the front and back surfaces of the substrate from contacting other parts of the apparatus, which may cause abrasion and contamination of the substrate. Therefore, it is very important to design a substrate clamping bearing table which is only contacted with the side surface and the edge of the substrate, has no abrasion and pollution to the front surface and the back surface of the substrate, can drive the substrate to rotate and completes the substrate process treatment.
Disclosure of Invention
The invention aims to provide a substrate clamping bearing table, which aims to meet the requirement of substrate cleanliness and finish a substrate wet processing process.
The purpose of the invention is realized by the following technical scheme:
the invention comprises a motor, a bearing platform, a lifting CUP and a fixed CUP, wherein the output end of the motor is connected with the bearing platform to drive the bearing platform to rotate; the rotary and fixed pins which rotate along with the bearing platform are respectively installed on the bearing platform along the circumferential direction, the rotary and fixed pins comprise a cylinder and a clamping block, the cylinder for fixing the pins is fixedly connected to the bearing platform, the cylinder for rotating the pins is rotatably installed on the bearing platform, the clamping blocks for rotating the pins and fixing the pins are eccentrically arranged at the top of the cylinder, and a rotary magnet is installed at the bottom of the rotary pin; the fixed CUP is internally provided with inner magnets, the lifting CUP is internally provided with outer magnets, and the inner magnets and the outer magnets are respectively positioned at the inner side and the outer side of the rotating magnets;
wherein: the number of the outer magnets is the same as that of the rotating pins, and the mounting positions of the outer magnets on the lifting CUP correspond to the mounting positions of the rotating pins on the plummer one by one;
when the lifting CUP is in a lifting state, the rotating pin rotates towards the direction of clamping the substrate through the magnetic force action of the rotating magnet and the inner magnet on the fixed CUP, and then the substrate is clamped;
when the lifting CUP is in a descending state, the magnetic force between the outer magnet and the rotating magnet on the lifting CUP is larger than the magnetic force between the inner magnet and the rotating magnet, and the rotating pin rotates towards the direction of releasing the substrate so as to release the substrate;
the supporting surface at the top of the cylinder for rotating and fixing the pins is contacted with the edge of the substrate, the side surface of the clamping block is a clamping surface, and the clamping surface is contacted with the side surface of the substrate; the supporting surfaces at the tops of the rotating pin and the column body for fixing the pin are inclined surfaces;
the plurality of inner magnets are uniformly distributed along the circumferential direction of the inner surface of the top of the fixed CUP; the rotary pins and the fixed pins are uniformly distributed along the circumferential direction of the edge of the bearing table;
the inner diameter of the top of the lifting CUP is larger than the outer diameter of the bearing table, the lifting CUP is concentric with the mounting position of the bearing table, and the outer magnet is mounted on the inner surface of the top of the lifting CUP;
the fixed CUP is positioned below the bearing table, the fixed CUP is concentric with the mounting position of the bearing table, and the inner magnet is mounted on the inner surface of the top of the fixed CUP.
The invention has the advantages and positive effects that:
1. according to the magnetic force between the inner magnet and the rotating magnet of the rotating pin, the rotating pin rotates and clamps the substrate together with the fixed pin, the clamping force applied to the substrate is constant, and the substrate does not rotate relative to the fixed pin when rotating at different rotating speeds and accelerations in the process, so that the substrate is well protected.
2. When the CUP descends along with the lifting, the magnetic force between the outer magnet and the rotating magnet is larger than the magnetic force between the inner magnet and the rotating magnet, the rotating pin rotates along with the rotating magnet to open the substrate, the conveying mechanism can carry out the fetching and delivering operation of the substrate, and the structure is simple.
3. In the process of carrying out technological treatment by rotating the driving substrate, only the rotating pins and the fixed pins are contacted with the edge and the side surface of the substrate, and the front surface and the back surface of the substrate are not contacted with any part, so that the front surface and the back surface of the substrate can be effectively prevented from being damaged.
Drawings
FIG. 1 is a schematic view of the overall structure of a descending CUP of the present invention;
FIG. 2 is a schematic diagram of the overall structure of the lifting CUP of the present invention in a lifted state;
FIG. 3 is a schematic diagram of a substrate clamped according to the present invention;
FIG. 4 is a schematic view of the invention with the substrate released;
FIG. 5 is a schematic diagram showing the distribution of inner magnets on a fixed CUP according to the present invention;
FIG. 6 is a schematic structural diagram of the relative positions of the rotary pins and the substrate when the substrate is clamped according to the present invention;
FIG. 7 is a schematic structural diagram of the relative positions of the fixed pins and the substrate when the substrate is clamped according to the present invention;
wherein: 1 is the motor, 2 is the plummer, 3 is lift CUP (collection CUP), 4 is fixed CUP, 5 is rotating pin (pillar), 501 is the rotation magnetite, 502 is holding surface A, 503 is holding surface A, 504 is cylinder A, 505 is grip block A, 6 is fixed pin, 601 is holding surface B, 602 is holding surface B, 603 is cylinder B, 604 is grip block B, 7 is outer magnetite, 8 is interior magnetite, 9 is the base plate, 901 is the edge, 902 is the side, 903 is the front, 904 is the back.
Detailed Description
The present invention will be described in more detail with reference to the accompanying drawings.
As shown in fig. 1 to 7, the invention includes a motor 1, a plummer 2, a lifting CUP3, a fixed CUP4, a rotating pin5, a fixed pin6, an external magnet 7 and an internal magnet 8, wherein an output end of the motor 1 is connected with the plummer 2 to drive the plummer 2 to rotate, a fixed CUP4 positioned below the plummer 2 is arranged on the periphery of the motor, and a lifting CUP3 capable of lifting is arranged on the periphery of the fixed CUP 4.
The plummer 2 is provided with a rotary pin5 and a fixed pin6 which rotate along with the plummer 2 along the circumferential direction, and the rotary pin5 and the fixed pin6 are uniformly distributed along the circumferential direction of the edge of the plummer 2. The rotary pins 5 and the fixed pins 6 both comprise cylindrical columns and cylindrical clamping blocks, the column B603 for fixing the pins 6 is fixedly connected to the plummer 2, and the clamping block B604 is eccentrically arranged at the top of the column B603, that is, the axial center line of the clamping block B604 is parallel to the axial center line of the column B603. The cylinder a504 of the rotary pin5 is rotatably mounted on the carrier 2, and the clamping block a505 is eccentrically arranged on the top of the cylinder a504, that is, the axial center line of the clamping block a505 is parallel to the axial center line of the cylinder a 504. The bottom of the rotary pin5 is provided with a rotary magnet 501.
An inner magnet 8 is arranged in the fixed CUP4, an outer magnet 7 is arranged in the lifting CUP3, and the inner magnet 8 and the outer magnet 7 are respectively positioned at the inner side and the outer side of the rotating magnet 501. The fixed CUP4 is located below the plummer 2, the fixed CUP4 is concentric with the mounting position of the plummer 2, a plurality of inner magnets 8 are arranged on the inner surface of the top of the fixed CUP4 and are evenly distributed along the circumferential direction of the inner surface of the top of the fixed CUP 4. The lifting CUP3 can perform lifting action (this is prior art and is not described in detail here), the inner diameter of the top part is larger than the outer diameter of the carrier table 2, the lifting CUP3 is concentric with the mounting position of the carrier table 2, the outer magnet 7 is mounted on the inner surface of the top part of the lifting CUP3 and lifts along with the lifting CUP 3. The number of the outer magnets 7 is the same as that of the rotating pins 5, and the installation positions of the outer magnets 7 on the lifting CUP3 correspond to the installation positions of the rotating pins 5 on the plummer 2 one by one.
Support surface a502 at the top of cylinder a504 of rotary pin5 and support surface B601 at the top of cylinder B603 of fixed pin6 are both inclined surfaces and only contact edge 901 of the edge of substrate 9, respectively, to avoid abrasion or contamination of front surface 903 or back surface 904 of substrate 9. The side surface of the clamp block a505 is a clamp surface a503, the side surface of the clamp block B604 is a clamp surface B602, and the clamp surfaces a503 and B602 are in contact with only the side surface 902 of the substrate 9.
When the up-down CUP3 is in the up state, the rotary pin5 rotates in the direction of clamping the board 9 by the magnetic force action of the rotary magnet 501 and the inner magnet 8 on the fixed CUP4, and further clamps the board 9. When the elevation CUP3 is in a descending state, the magnetic force between the outer magnet 7 and the turning magnet 501 is larger than the magnetic force between the inner magnet 8 and the turning magnet 501 in the elevation CUP3, and the turning pin5 is rotated in a direction to release the substrate 9, and further the substrate 9 is released.
The working principle of the invention is as follows:
the bearing table 2 is connected with an output shaft of the motor 1. The rotary pins 5 and the fixed pins 6 are circumferentially distributed on the carrier 2. The support surfaces of the rotary pins 5 and the fixed pins 6 are inclined for supporting the substrate 9. The supporting surfaces of the rotating pins 5 and the fixed pins 6 are only in contact with the edge of the substrate 9, avoiding wear or contamination of the front surface 903 or the back surface 904 of the substrate 9. After each substrate 9 is finished, the plummer 2 is driven by the motor 1 to perform a zero returning action to ensure that the position of the fixed pin6 is kept unchanged.
The outer magnet 7 is mounted on the inner surface of the top of the elevation CUP3 and ascends and descends along with the elevation CUP 3. The number of the outer magnets 7 is the same as that of the rotating pins 5, and the installation position of the outer magnets 7 on the lifting CUP3 corresponds to the installation position of the rotating pins 5 on the plummer 2. When the lifting CUP3 is at the lifting position, the outer magnet 7 and the rotating magnet 501 in the rotating pin5 do not have the magnetic force effect; when the up-down CUP3 is at the down position, magnetic force is generated between the outer magnet 7 and the rotary magnet 501, the magnetic force rotates the rotary pin5, and the clamp block a505 on the rotary pin5 tends to rotate in the direction of releasing the substrate 9.
The inner magnets 8 are circumferentially and evenly distributed on the inner surface of the top of the fixed CUP 4. The magnetic force between the inner magnet 8 and the rotary magnet 501 rotates the rotary pin5, and the clamp block a505 on the rotary pin5 tends to rotate in the direction of clamping the substrate 9.
When the transfer mechanism is ready to transfer the substrate 9 onto the stage 2 in the process unit, the lift CUP3 is in the lowered position, the magnetic force between the outer magnet 7 and the rotary magnet 501 is larger than the magnetic force between the inner magnet 8 and the rotary magnet 501, the rotary pin5 rotates in the direction of releasing the substrate 9, and the transfer mechanism places the substrate 9 on the supporting surface a502 of the rotary pin5 and the supporting surface B601 of the fixed pin 6. Subsequently, the transfer mechanism exits the process chamber, the elevation CUP3 rises, the rotary pin5 only has a mutual magnetic force with the inner magnet 8, the magnetic force rotates the rotary pin5, and the clamp block a505 on the rotary pin5 rotates in a direction of clamping the substrate 9. The substrate 9 rotates with the plummer 2 under the driving of the motor 1 under the clamping force action between the rotating pins 5 and the fixed pins 6, and the process treatment of the substrate 9 is carried out. The inner magnets 8 are evenly distributed on the inner surface of the top of the fixed CUP4 in the circumference, the magnetic force between the inner magnets 8 and the rotating magnets 501 keeps unchanged in the rotating process of the rotating magnets 501 along with the plummer 2, namely, the clamping force borne by the substrate 9 in the rotating process keeps unchanged, no relative sliding exists between the substrate 9 and the rotating pins 5 and between the substrate 9 and the fixed pins 6, and the abrasion and pollution of the substrate 9 are avoided.
Claims (7)
1. A substrate clamping bearing table comprises a motor, a bearing table, a lifting CUP and a fixed CUP, wherein the output end of the motor is connected with the bearing table and drives the bearing table to rotate; the method is characterized in that: the bearing platform (2) is provided with a rotating pin (5) and a fixing pin (6) which rotate along with the bearing platform (2) along the circumferential direction, the rotating pin (5) and the fixing pin (6) both comprise a cylinder and a clamping block, the cylinder of the fixing pin (6) is fixedly connected to the bearing platform (2), the cylinder of the rotating pin (5) is rotatably arranged on the bearing platform (2), the clamping blocks of the rotating pin (5) and the fixing pin (6) are eccentrically arranged at the top of the cylinder, and a rotating magnet (501) is arranged at the bottom of the rotating pin (5); an inner magnet (8) is arranged in the fixed CUP (4), an outer magnet (7) is arranged in the lifting CUP (3), and the inner magnet (8) and the outer magnet (7) are respectively positioned at the inner side and the outer side of the rotating magnet (501);
the inner diameter of the top of the lifting CUP (3) is larger than the outer diameter of the bearing table (2), the lifting CUP (3) is concentric with the mounting position of the bearing table (2), and the outer magnet (7) is mounted on the inner surface of the top of the lifting CUP (3);
the fixed CUP (4) is positioned below the bearing table (2), the fixed CUP (4) is concentric with the mounting position of the bearing table (2), and the inner magnet (8) is mounted on the inner surface of the top of the fixed CUP (4).
2. The substrate holding susceptor of claim 1, wherein: the number of the outer magnets (7) is the same as that of the rotating pins (5), and the installation positions of the outer magnets (7) on the lifting CUP (3) correspond to the installation positions of the rotating pins (5) on the plummer (2) one by one.
3. The substrate holding susceptor of claim 1, wherein: when lift CUP (3) are located the rising state, rotate pin (5) through rotate magnetite (501) and fixed CUP (4) on interior magnetite (8) magnetic force effect to the direction rotation that presss from both sides tight base plate (9), and then clamp tight base plate (9).
4. The substrate holding susceptor of claim 1, wherein: when the lifting CUP (3) is in a descending state, the magnetic force between the outer magnet (7) and the rotating magnet (501) on the lifting CUP (3) is larger than the magnetic force between the inner magnet (8) and the rotating magnet (501), the rotating pin (5) rotates in the direction of releasing the substrate (9), and then the substrate (9) is released.
5. The substrate holding susceptor of claim 1, wherein: the supporting surface of the top of the cylinder of the rotary pin (5) and the fixed pin (6) is in contact with the edge (901) of the edge of the substrate (9), the side surface of the clamping block is a clamping surface, and the clamping surface is in contact with the side surface (902) of the substrate (9).
6. The substrate holding susceptor of claim 5, wherein: the supporting surface at the top of the cylinder for rotating the pin (5) and fixing the pin (6) is an inclined surface.
7. The substrate holding susceptor of claim 1, wherein: the inner magnets (8) are uniformly distributed along the circumferential direction of the inner surface of the top of the fixed CUP (4); the rotary pins (5) and the fixed pins (6) are uniformly distributed along the circumferential direction of the edge of the bearing platform (2).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811201811.2A CN111063652B (en) | 2018-10-16 | 2018-10-16 | Substrate clamping bearing table |
| TW107143380A TWI762745B (en) | 2018-10-16 | 2018-12-04 | A substrate holding table |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811201811.2A CN111063652B (en) | 2018-10-16 | 2018-10-16 | Substrate clamping bearing table |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111063652A CN111063652A (en) | 2020-04-24 |
| CN111063652B true CN111063652B (en) | 2022-08-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811201811.2A Active CN111063652B (en) | 2018-10-16 | 2018-10-16 | Substrate clamping bearing table |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111063652B (en) |
| TW (1) | TWI762745B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111696900A (en) * | 2020-06-29 | 2020-09-22 | 沈阳芯源微电子设备股份有限公司 | Wafer substrate cleaning device and method |
| CN111960313A (en) * | 2020-07-21 | 2020-11-20 | 沈阳芯源微电子设备有限公司 | Substrate lifting mechanism |
| CN114653660B (en) * | 2022-05-20 | 2022-09-16 | 智程半导体设备科技(昆山)有限公司 | Magnetic clamping block and semiconductor substrate cleaning device |
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| JPH10335287A (en) * | 1997-06-05 | 1998-12-18 | Toshiba Corp | Substrate processing apparatus |
| JP2015188010A (en) * | 2014-03-26 | 2015-10-29 | 株式会社Ｓｃｒｅｅｎホールディングス | substrate processing apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3647576B2 (en) * | 1996-11-01 | 2005-05-11 | 大日本スクリーン製造株式会社 | Substrate holder |
| KR20070054683A (en) * | 2004-08-23 | 2007-05-29 | 브룩스 오토메이션 인코퍼레이티드 | Elevator-based tool loading and buffering system |
| JP4095613B2 (en) * | 2005-01-13 | 2008-06-04 | 大日本スクリーン製造株式会社 | Substrate holding device |
| KR100829923B1 (en) * | 2006-08-30 | 2008-05-16 | 세메스 주식회사 | Spin head and method using the same for treating substrate |
| JP6045869B2 (en) * | 2012-10-01 | 2016-12-14 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing apparatus and substrate processing method |
| JP6143572B2 (en) * | 2013-06-18 | 2017-06-07 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate holding and rotating apparatus, substrate processing apparatus including the same, and substrate processing method |
| JP6330998B2 (en) * | 2014-02-17 | 2018-05-30 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing equipment |
| CN107393851B (en) * | 2014-02-27 | 2021-02-05 | 斯克林集团公司 | Substrate processing apparatus and substrate processing method |
| US9947572B2 (en) * | 2014-03-26 | 2018-04-17 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus |
| CN104538345B (en) * | 2014-12-31 | 2017-06-06 | 北京七星华创电子股份有限公司 | A kind of pan device for clamping and rotating |
| JP6674679B2 (en) * | 2015-09-29 | 2020-04-01 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate holding / rotating apparatus, substrate processing apparatus having the same, and substrate processing method |
| US9892955B2 (en) * | 2015-09-29 | 2018-02-13 | SCREEN Holdings Co., Ltd. | Substrate holding/rotating device, substrate processing apparatus including the same, and substrate processing method |
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- 2018-12-04 TW TW107143380A patent/TWI762745B/en active
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| JPH10335287A (en) * | 1997-06-05 | 1998-12-18 | Toshiba Corp | Substrate processing apparatus |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI762745B (en) | 2022-05-01 |
| TW202017099A (en) | 2020-05-01 |
| CN111063652A (en) | 2020-04-24 |
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