CN111696900A - Wafer substrate cleaning device and method - Google Patents
Wafer substrate cleaning device and method Download PDFInfo
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- CN111696900A CN111696900A CN202010604210.7A CN202010604210A CN111696900A CN 111696900 A CN111696900 A CN 111696900A CN 202010604210 A CN202010604210 A CN 202010604210A CN 111696900 A CN111696900 A CN 111696900A
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- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/0288—Ultra or megasonic jets
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a cleaning device and a method for a wafer substrate, wherein the cleaning device comprises: the wafer bearing platform is used for placing a substrate to be cleaned; the lifting mechanism adjusts the height of the substrate through lifting; the substrate clamping mechanism is connected to the top end of the wafer bearing table and used for clamping the substrate to be cleaned; the cleaning spray head is arranged between the substrate clamping mechanism and the substrate and is used for cleaning the back surface of the substrate; the movable adjusting mechanism is connected with the tail end of the cleaning spray head and movably adjusts the position of the cleaning spray head; the edge nozzle is used for spraying and cleaning the outer edge of the substrate, so that the back of the substrate can be quickly cleaned without turning over the substrate, and the cleaning efficiency and the cleaning effect are improved.
Description
Technical Field
The invention relates to the technical field of semiconductor wafer processing, in particular to a cleaning device and a cleaning method for a wafer substrate.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and the original material thereof is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed.
The main processing modes of the wafer are sheet processing and batch processing, i.e. 1 or more wafers are processed simultaneously. As semiconductor feature sizes become smaller and smaller, processing and measurement equipment becomes more and more advanced, so that new data characteristics appear in wafer processing. Meanwhile, the characteristic size is reduced, so that the influence of the particle number in the air on the quality and the reliability of the processed wafer is increased during wafer processing, and the particle number has new data characteristics along with the improvement of cleanness.
In the semiconductor industry, wafer wet processing equipment needs to ensure the cleanliness of the equipment, namely, the quantity of micro-particles on the surface of a wafer to be processed cannot be increased. Meanwhile, the back of the substrate of the wafer is required to be cleaned in some special processes, and the traditional cleaning device is often used for directly cleaning the front of the wafer substrate, and the back of the substrate is required to be turned over for cleaning, so that the operation is inconvenient.
Therefore, there is a need to provide a novel apparatus and method for cleaning a wafer substrate to solve the above-mentioned problems in the prior art.
Disclosure of Invention
The invention aims to provide a device and a method for cleaning a wafer substrate, which can realize the rapid cleaning of the back of the substrate without turning the substrate and improve the cleaning efficiency.
In order to achieve the above object, the present invention provides a wafer substrate cleaning apparatus, comprising:
the wafer bearing platform is used for placing a substrate to be cleaned;
the lifting mechanism adjusts the height of the substrate through lifting;
the substrate clamping mechanism is connected to the top end of the wafer bearing table and used for clamping the substrate to be cleaned;
the cleaning spray head is arranged between the substrate clamping mechanism and the substrate and is used for cleaning the back surface of the substrate;
the movable adjusting mechanism is connected with the tail end of the cleaning spray head and movably adjusts the position of the cleaning spray head;
an edge nozzle to spray clean an outer edge of the substrate.
The invention has the beneficial effects that: treat abluent base plate fixed clamp through base plate clamping mechanism and press from both sides tightly on the wafer bearing platform, can directly clean the base plate back through washing the shower nozzle, need not the upset base plate, and easy operation is convenient, the spray rinsing position of shower nozzle is washd through the mode change of rotation regulation and horizontal migration to activity adjustment mechanism simultaneously, make the washing shower nozzle can wash each position at the base plate back, and the efficiency of cleaning is improved, utilize edge nozzle to clean the base plate edge simultaneously, can also carry out secondary washing to the base plate, with base plate edge sanitization, reduce the quantity of microparticle, improve the subsequent processing effect of base plate.
Preferably, elevating system includes the fixing base, fixing base one end is connected with U type supporting seat, U type supporting seat upper surface is connected with at least three lift thimble, the lift thimble is through installing driving motor drive control on the fixing base. The beneficial effects are that: the lifting control is carried out on the substrate by simultaneously lifting and adjusting the lifting thimble of the lifting mechanism, so that the unstable condition of the substrate is avoided.
Preferably, the top end of the lifting thimble is connected with an isolation sheath, and the top end of the isolation sheath is of a frosted structure. The beneficial effects are that: when the lifting thimble contacts the substrate, the isolation sheath with the frosted structure can prevent the substrate from sliding and protect the surface of the substrate.
Preferably, the substrate clamping mechanism comprises at least one fixed supporting column installed on the wafer bearing table and a plurality of rotatable supporting columns installed on the wafer bearing table, the top end of each rotatable supporting column is connected with a rotating column, and the rotating column and the rotatable supporting columns are eccentrically arranged. The beneficial effects are that: the mode of the column spinner and the fixed stay post inter combination through eccentric setting realizes the rotation to the base plate and presss from both sides tightly, and can increase the distance between column spinner and the fixed stay post through the counter rotation and loosen the base plate to realize the clamp of base plate and loosen convenient to use.
Preferably, the fixed supporting columns and the rotatable supporting columns are uniformly arranged at intervals.
Preferably, the movable adjusting mechanism comprises a fixed guide rail, a vertical swing arm is connected to the fixed guide rail through a sliding block, a rotating motor is arranged inside the vertical swing arm, a horizontal swing arm is connected to the side wall of the vertical swing arm, the vertical swing arm passes through the rotating motor to drive the horizontal swing arm to rotate in the horizontal direction, and the end of the horizontal swing arm is connected with the bottom end of the cleaning sprayer. The beneficial effects are that: the vertical swing arm passes through the sliding block and realizes the horizontal migration on fixed guide to the rotation of cooperation rotating electrical machines drives horizontal swing arm's rotation, can horizontal swing arm's position control, and then adjusts the position of the washing shower nozzle of connection on horizontal swing arm, and the shower nozzle of being convenient for wash the different positions at the base plate back.
Preferably, the number of the edge nozzles is at least two, the nozzle openings of the edge nozzles are arranged opposite to the outer edge of the substrate, and the edge nozzles are rotatable nozzles. The beneficial effects are that: the edge position of the substrate is cleaned for the second time through the edge nozzle, so that the cleaning effect can be further improved.
Preferably, the cleaning spray head is an ultrasonic spray head.
The invention provides a cleaning method of a wafer substrate, which comprises the following steps:
s1, placing the substrate to be cleaned above the wafer bearing table by adjusting the height of the lifting mechanism, and rotationally clamping the substrate by the substrate clamping mechanism on the wafer bearing table;
s2, inserting a horizontal swing arm and a cleaning spray head into a gap between the substrate and the wafer bearing table through a movable adjusting mechanism, starting a rotating motor to drive the horizontal swing arm to rotate, adjusting the horizontal position of the horizontal swing arm through a sliding block, driving the cleaning spray head to clean the back of the substrate in a curvilinear motion mode, and starting an edge nozzle to clean the edge position of the substrate;
s3, after cleaning, driving the wafer bearing table to spin-dry the substrate by rotating a spindle motor of the wafer bearing table;
and S4, reversely rotating the clamping mechanism to loosen the substrate to finish the cleaning process.
The invention has the beneficial effects that: the cleaning spray head is movably adjusted to be located between the substrate and the wafer bearing table, so that each position on the back of the substrate can be effectively cleaned, and meanwhile, after the substrate is clamped and cleaned, the substrate is directly dried in a rotating wafer bearing table mode, subsequent treatment is conveniently and directly carried out on the substrate, and the operation is simple and convenient.
Preferably, in step S3, the rotation speed of the spindle motor for spin-drying the substrate is 500-3000rpm, and the rotation time is 10-60S. The beneficial effects are that: the surface of the substrate can be fully dried by the rotating speed and the rotating time, so that the residue of the cleaning liquid is reduced.
Drawings
FIG. 1 is a schematic view of the overall structure of the cleaning apparatus of the present invention;
FIG. 2 is a schematic diagram of a cleaning path of the cleaning showerhead on the backing plate according to the present invention;
FIG. 3 is a schematic view of the overall structure of the lifting mechanism of the present invention;
FIG. 4 is a schematic top view of the adjustable adjustment mechanism of the present invention;
FIG. 5 is a schematic view of the substrate clamping mechanism of the present invention with the substrate loosened by a large distance between the rotating column and the stationary support column;
FIG. 6 is a schematic view of the substrate clamping mechanism of the present invention with a small distance between the rotating column and the fixed supporting column;
FIG. 7 is a schematic view of the overall working flow of the cleaning method of the present invention.
Reference numbers in the figures:
1-a wafer bearing platform;
2-a substrate;
3-a lifting mechanism; 31-a fixed seat; a 32-U-shaped supporting seat; 33-lifting ejector pins; 34-an insulating sheath;
4-a substrate clamping mechanism; 41-fixed support columns; 42-a rotatable support post; 43-spin columns;
5, cleaning the spray head;
6-a movable adjusting mechanism; 61-fixed guide rail; 62-a slider; 63-vertical swing arm; 64-a rotating electrical machine; 65-horizontal swing arm;
7-edge nozzle.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. As used herein, the word "comprising" and similar words are intended to mean that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items.
To solve the problems in the prior art, as shown in fig. 1 to 6, an embodiment of the present invention provides an apparatus for cleaning a wafer substrate, including:
the wafer bearing platform 1 is used for placing a substrate 2 to be cleaned;
a lifting mechanism 3 for adjusting the height of the substrate 2 by lifting;
the substrate clamping mechanism 4 is connected to the top end of the wafer bearing table 1 and used for clamping the substrate 2 to be cleaned;
a cleaning nozzle 5 disposed between the substrate clamping mechanism 4 and the substrate 2, for cleaning the back surface of the substrate 2;
the movable adjusting mechanism 6 is connected with the tail end of the cleaning spray head 5 and movably adjusts the position of the cleaning spray head 5;
and an edge nozzle 7 for performing spray cleaning on the outer edge of the substrate 2.
Treat abluent base plate 2 fixed clamp through base plate clamping mechanism 4 and press from both sides tightly on wafer bearing platform 1, can directly clean the base plate 2 back through washing shower nozzle 5, need not upset base plate 2, and easy operation is convenient, activity adjustment mechanism 6 changes the spray rinsing position of washing shower nozzle 5 through rotation regulation and horizontal migration's mode simultaneously, make washing shower nozzle 5 can wash each position at the base plate 2 back, improve the cleaning efficiency, utilize edge nozzle 7 to clean the base plate edge simultaneously, can also carry out the secondary to base plate 2, with base plate 2 edge sanitization, reduce the quantity of microparticle, improve the subsequent processing effect of base plate 2.
In a possible embodiment, as shown in fig. 1 and 3, the lifting mechanism 3 includes a fixed seat 31, one end of the fixed seat 31 is connected with a U-shaped supporting seat 32, the upper surface of the U-shaped supporting seat 32 is connected with at least three lifting thimbles 33, and the lifting thimbles 33 are transmission-controlled by a driving motor installed on the fixed seat.
When the operation is carried out, the lifting thimble 33 is driven by the rotation of the driving motor and the height thereof is increased, when the substrate 2 to be cleaned and processed is placed on the lifting thimble 33 through an external device such as a manipulator, then the lifting thimble 33 is contracted through the driving motor, so that the substrate 2 falls on the sheet bearing table 1, the position adjustment work of the substrate 2 is completed, and the substrate 2 is fixedly clamped through the substrate clamping mechanism 4.
Further, lift thimble 33 top is connected with isolation sheath 34, isolation sheath 34 top sets up to dull polish structure, and when lift thimble 33 and base plate 2 contact, through isolating sheath 34 to play the guard action to base plate 2, reduce base plate 2's wearing and tearing and collision damage, isolation sheath 34 sets up to dull polish structure simultaneously, is favorable to increasing the frictional action between base plate 2 and the lift thimble 33, prevents that base plate 2 from taking place the condition of landing.
In a possible embodiment, as shown in fig. 1, 5 and 6, the substrate clamping mechanism 4 comprises at least one fixed supporting column 41 mounted on the stage 1, and a plurality of rotatable supporting columns 42 mounted on the stage, the rotatable supporting columns 42 are connected with a rotating column 43 at the top end, the rotating column 43 is eccentrically arranged with respect to the rotatable supporting columns 42, and the dotted lines in fig. 5 and 6 indicate the axes of the rotatable supporting columns 42.
After the substrate 2 falls on the wafer bearing table 1, under the action of the substrate clamping mechanism 4, the substrate 2 is positioned between the fixed supporting column 41 and the rotatable supporting column 42, the rotation of the rotatable supporting column 42 drives the rotating column 43 to eccentrically rotate, and the rotating direction at the moment is that the rotating column 43 is eccentrically arranged, so that the distance between the rotating column 43 and the fixed supporting column 41 is small, and the substrate 2 can be clamped; when the rotatable supporting column 42 is rotated reversely, the rotating column 43 rotates reversely, and similarly, because the eccentrically arranged rotating column 43 approaches in the opposite direction, the distance between the rotating column 43 and the fixed supporting column 41 becomes large, so that the substrate 2 can be loosened from between the rotating column 43 and the fixed supporting column 41, and the clamping and loosening process of the substrate 2 is completed.
Preferably, the fixed supporting columns 41 and the rotatable supporting columns 42 are uniformly spaced, and the uniformly arranged fixed supporting columns 41 and the rotatable supporting columns 42 ensure stability when the substrate 2 is clamped.
In a possible embodiment, as shown in fig. 1 and 4, the movable adjusting mechanism 6 includes a fixed guide rail 61, a vertical swing arm 63 is connected to the fixed guide rail 61 through a sliding block 62, a rotating motor 64 is installed inside the vertical swing arm 63, a horizontal swing arm 65 is connected to a side wall of the vertical swing arm 63, the vertical swing arm 63 drives the horizontal swing arm 65 to rotate in the horizontal direction through the rotating motor 64, and the end of the horizontal swing arm 65 is connected to the bottom end of the cleaning nozzle 5.
During specific adjustment, the rotation of the rotating motor 64 drives the horizontal swing arm 65 to rotate on a plane, so as to drive the cleaning nozzle 5 to continuously rotate on the back of the substrate 2, meanwhile, the vertical swing arm 63 slides outwards along the fixed guide rail 61 through the sliding block 62, when the horizontal swing arm 65 rotates to a position close to the edge of the sheet bearing seat 1 or close to the fixed support column 41 and the rotatable support column 42, the rotating motor 64 rotates reversely, so as to drive the horizontal swing arm 65 to rotate reversely, so as to enable the cleaning nozzle 5 at the tail end of the horizontal swing arm 65 to be always positioned right below the substrate 2 to clean the back of the substrate 2, the horizontal movement and the plane rotation are combined, so that the tail end of the horizontal swing arm 65 is arranged at any position right below the back of the substrate 2, and the cleaning nozzle 5 can complete the cleaning work on the back of the substrate 2 in a continuous curve, the specific moving working path is shown by the arrow in fig. 2.
Further preferably, the rotating motor 64 in the present solution adopts a stepping motor, which ensures that it is more convenient to switch the rotating direction each time.
As shown in fig. 1, in a possible embodiment, the number of the edge nozzles 7 is at least two, the nozzle openings of the edge nozzles 7 are disposed opposite to the outer edge of the substrate 2, and the edge nozzles 7 are rotatable nozzles, so that the edge positions of the substrate 2 are secondarily cleaned by the edge nozzles 7, thereby further improving the cleaning effect, and meanwhile, when the cleaning nozzles 5 are directly cleaned, some micro-particles remain at the edge positions and cannot be cleaned, and the cleaning effect can be effectively improved by performing secondary cleaning by the edge nozzles 7.
Preferably, the number of the edge nozzles 7 in this embodiment is two, and the two edge nozzles are respectively disposed upward and downward, so as to thoroughly clean the edge of the substrate 2.
It should be noted that the cleaning solution used in the present technical solution is deionized water.
In a possible embodiment, the cleaning nozzle 5 is an ultrasonic nozzle, which has better cleaning effect than a common nozzle.
As shown in fig. 7, the present invention further provides a method for cleaning a wafer substrate, comprising the following steps:
s1, placing the substrate to be cleaned above the wafer bearing table by adjusting the height of the lifting mechanism, and rotationally clamping the substrate by the substrate clamping mechanism on the wafer bearing table;
s2, inserting a horizontal swing arm and a cleaning spray head into a gap between the substrate and the wafer bearing table through a movable adjusting mechanism, starting a rotating motor to drive the horizontal swing arm to rotate, adjusting the horizontal position of the horizontal swing arm through a sliding block, driving the cleaning spray head to clean the back of the substrate in a curvilinear motion mode, and starting an edge nozzle to clean the edge position of the substrate;
s3, after cleaning, driving the wafer bearing table to spin-dry the substrate by rotating a spindle motor of the wafer bearing table;
and S4, reversely rotating the clamping mechanism to loosen the substrate to finish the cleaning process.
Through the position that the activity was adjusted and is located the washing shower nozzle 5 between base plate 2 and the wafer platform 1, just can effectively clean each position at the base plate 2 back under the condition of not overturning base plate 2, simultaneously after pressing from both sides tight cleanness, the base plate 2 that spin-dries directly through the mode of rotatory wafer platform 1, the convenience is direct carries out subsequent processing to base plate 2, whole cleaning process easy operation is convenient.
In a possible embodiment, in the step S3, the rotation speed of the spindle motor for spin-drying the substrate is 500-.
Although the embodiments of the present invention have been described in detail hereinabove, it is apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it is to be understood that such modifications and variations are within the scope and spirit of the present invention as set forth in the following claims. Moreover, the invention as described herein is capable of other embodiments and of being practiced or of being carried out in various ways.
Claims (10)
1. An apparatus for cleaning a wafer substrate, comprising:
the wafer bearing platform is used for placing a substrate to be cleaned;
the lifting mechanism adjusts the height of the substrate through lifting;
the substrate clamping mechanism is connected to the top end of the wafer bearing table and used for clamping the substrate to be cleaned;
the cleaning spray head is arranged between the substrate clamping mechanism and the substrate and is used for cleaning the back surface of the substrate;
the movable adjusting mechanism is connected with the tail end of the cleaning spray head and movably adjusts the position of the cleaning spray head;
an edge nozzle to spray clean an outer edge of the substrate.
2. The apparatus of claim 1, wherein the lifting mechanism comprises a fixing base, one end of the fixing base is connected with a U-shaped supporting base, the upper surface of the U-shaped supporting base is connected with at least three lifting pins, and the lifting pins are driven and controlled by a driving motor installed on the fixing base.
3. The apparatus as claimed in claim 2, wherein an isolation sheath is connected to the top end of the lift pin, and the top end of the isolation sheath is provided with a frosted structure.
4. The apparatus of claim 1, wherein the substrate clamping mechanism comprises at least one fixed support column mounted on the stage, and a plurality of rotatable support columns mounted on the stage, and a rotation column is connected to a top end of the rotatable support columns and is eccentrically disposed with respect to the rotatable support columns.
5. The apparatus of claim 4, wherein the fixed support columns and the rotatable support columns are evenly spaced.
6. The apparatus for cleaning wafer substrates as claimed in claim 1, wherein the movable adjusting mechanism comprises a fixed guide rail, a vertical swing arm is connected to the fixed guide rail through a sliding block, a rotating motor is installed inside the vertical swing arm, a horizontal swing arm is connected to a side wall of the vertical swing arm, the vertical swing arm drives the horizontal swing arm to rotate in a horizontal direction through the rotating motor, and a distal end of the horizontal swing arm is connected to a bottom end of the cleaning nozzle.
7. The apparatus of claim 1, wherein the number of the edge nozzles is at least two, the nozzle openings of the edge nozzles are disposed opposite to the outer edge of the substrate, and the edge nozzles are rotatable nozzles.
8. The apparatus of claim 1 or 6, wherein the cleaning nozzle is an ultrasonic nozzle.
9. A method for cleaning a wafer substrate, comprising the steps of:
s1, placing the substrate to be cleaned above the wafer bearing table by adjusting the height of the lifting mechanism, and rotationally clamping the substrate by the substrate clamping mechanism on the wafer bearing table;
s2, inserting a horizontal swing arm and a cleaning spray head into a gap between the substrate and the wafer bearing table through a movable adjusting mechanism, starting a rotating motor to drive the horizontal swing arm to rotate, adjusting the horizontal position of the horizontal swing arm through a sliding block, driving the cleaning spray head to clean the back of the substrate in a curvilinear motion mode, and starting an edge nozzle to clean the edge position of the substrate;
s3, after cleaning, driving the wafer bearing table to spin-dry the substrate by rotating a spindle motor of the wafer bearing table;
and S4, reversely rotating the clamping mechanism to loosen the substrate to finish the cleaning process.
10. The method as claimed in claim 9, wherein in step S3, the spin-drying speed of the spindle motor is 500-3000rpm, and the rotation time is 10-60S.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010604210.7A CN111696900A (en) | 2020-06-29 | 2020-06-29 | Wafer substrate cleaning device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010604210.7A CN111696900A (en) | 2020-06-29 | 2020-06-29 | Wafer substrate cleaning device and method |
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| CN111696900A true CN111696900A (en) | 2020-09-22 |
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| CN202010604210.7A Pending CN111696900A (en) | 2020-06-29 | 2020-06-29 | Wafer substrate cleaning device and method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113539918A (en) * | 2021-06-30 | 2021-10-22 | 北京北方华创微电子装备有限公司 | Wafer cleaning equipment, wafer positioning device and wafer positioning method |
| CN114369876A (en) * | 2021-12-31 | 2022-04-19 | 至微半导体(上海)有限公司 | Spraying method for realizing etching reaction of gradient structure |
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| CN114369876A (en) * | 2021-12-31 | 2022-04-19 | 至微半导体(上海)有限公司 | Spraying method for realizing etching reaction of gradient structure |
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