JP6674679B2 - Substrate holding / rotating apparatus, substrate processing apparatus having the same, and substrate processing method - Google Patents

Description

  The present invention relates to a substrate holding / rotating device, a substrate processing apparatus including the same, and a substrate processing method. The substrate to be held or processed includes, for example, a semiconductor wafer, a liquid crystal display substrate, a plasma display substrate, an FED (Field Emission Display) substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, Photomask substrates, ceramic substrates, solar cell substrates and the like are included.

Patent Literature 1 discloses a rotary table that is rotatable around a rotation axis along a vertical direction, a rotary drive unit that rotates the rotary table about the rotation axis, and a rotating table that is provided on the rotary table and moves a substrate from a surface of the rotary table to a predetermined position. A rotary substrate holding and rotating device including a plurality of (for example, four) holding pins that are horizontally positioned at intervals is disclosed.
The plurality of holding pins include a fixed pin that is immovable with respect to the turntable and a movable pin that is movable with respect to the turntable. The movable pin is provided rotatably about a rotation axis coaxial with its center axis, and has a contact portion for contacting a peripheral edge of the substrate. Due to the rotation of the contact portion, the contact portion is displaced between an open position far away from the rotation axis and a holding position near the rotation axis. A pin driving magnet is connected to the rotating shaft of the contact portion.

  Switching of the open / close state of the movable pin is performed using a lifting magnet arranged below the turntable (magnet switching method). A magnet lifting unit is connected to the lifting magnet. When the elevating magnet is at the predetermined lower position, the elevating magnet does not face the pin driving magnet, so that no external force acts on the movable pin to bias the movable pin toward the holding position. Therefore, when the lifting magnet is at the lower position, the movable pin is held at its open position. On the other hand, when the lifting magnet is at the predetermined upper position, the movable pin is held at the holding position by the magnetic attraction between the lifting magnet and the pin driving magnet.

JP 2013-229552 A

  The above-described substrate holding / rotating device is provided in a single-wafer-type substrate processing device that processes substrates one by one. The upper surface of the substrate rotated by the substrate holding / rotating device is processed by a processing liquid nozzle. A liquid (cleaning liquid) is supplied. The processing liquid supplied to the upper surface of the substrate flows toward the peripheral portion of the substrate under the centrifugal force due to the rotation of the substrate. As a result, the entire upper surface of the substrate and the peripheral end surface of the substrate are subjected to the liquid treatment. Also, depending on the type of substrate processing, there may be a case where it is desired to perform liquid processing on the peripheral edge of the lower surface of the substrate.

  However, in the configuration described in Patent Document 1, since the substrate is always in contact and supported by a plurality of (for example, four) holding pins during the liquid processing, a plurality of contact points of the holding pins on the peripheral end surface of the substrate. The processing liquid does not flow around at the position, and there is a possibility that the cleaning residue may be generated at the peripheral edge of the substrate (the peripheral edge of the substrate and the peripheral edge of the lower surface of the substrate). If the contact support position of the substrate is changed while the substrate is being rotated, the peripheral portion of the substrate can be washed without any remaining cleaning.However, in order to realize such a change in the contact support position, it is necessary to process the substrate during processing. In the above, it is necessary to selectively open only some of the plurality of holding pins provided on the rotating turntable. However, in the magnet switching type substrate holding / rotating device described in Patent Document 1, since the lifting magnet for switching the opening and closing of the movable pin is provided non-rotatably, a plurality of magnets provided on the rotating turntable are provided. It is not possible to selectively open only some of the holding pins of the book. If the lifting magnet is arranged at the lower position during rotation of the turntable and both the movable pins are opened in the above-mentioned Patent Document 1, there is a possibility that the turntable may be separated from the turntable in the rotating state. .

SUMMARY OF THE INVENTION An object of the present invention is to provide a magnet-switching-type substrate holding apparatus that can favorably rotate a substrate while supporting the substrate, and change the position of the contact support of the substrate by a movable pin during the rotation of the substrate. It is to provide a rotating device.
It is another object of the present invention to provide a substrate processing apparatus and a substrate processing method capable of processing the peripheral portion of a substrate satisfactorily without remaining processing.

The invention according to claim 1 for achieving the above object has a rotating table, a rotation drive unit configured to rotate the rotating table around a rotation axis extending in a vertical direction, and a plurality of modules configured to horizontally support the substrate. A movable pin having a support portion movably provided between an open position distant from the rotation axis and a holding position close to the rotation axis; and a movable pin provided to rotate the movable pin of the plurality of comprises a first movable pin group comprising at least three movable pins, provided separately from the first movable pin group, A second movable pin group including at least three movable pins, an urging unit for urging the support portion of each movable pin to one of the open position and the holding position, and a first movable pin Installed corresponding to the group A first driving magnet having a magnetic pole direction that is equal to each other in a direction perpendicular to the axis along the rotation axis, and a first driving magnet mounted corresponding to each second movable pin group, and a direction perpendicular to the axis along the rotation axis; A second driving magnet having a magnetic pole direction opposite to that of the first driving magnet, and a first driving magnet provided in a non-rotational state and in a direction orthogonal to an axis along the rotation axis. A magnetic pole direction that gives a repulsive force or an attractive force between the first movable pin group and the support portion of the first movable pin group. A first moving magnet that is energized, and a magnetic pole direction that is provided in a non-rotating state and provides a repulsive force or an attractive force between the second driving magnet and a direction perpendicular to an axis along the rotation axis. The repulsive force The second movable magnet that urges the support portion of the second movable pin group to the other of the open position and the holding position by the attraction force, and the first movable magnet and the turntable. A first position at which the first moving magnet applies the repulsive force or the attractive force between the first moving magnet and the first driving magnet, and a first position at which the first moving magnet is connected to the first driving magnet. A first relative movement unit that relatively moves between a repulsion force and a second position that does not provide the suction force, and independently of the relative movement of the first movement magnet and the turntable, A second movable magnet and the rotary table, a third position at which the second movable magnet applies the repulsive force or the attractive force between the second movable magnet and the second driving magnet; Applies the repulsive force and the attractive force to the second driving magnet. A second relative movement unit for relatively moving the substrate holding apparatus to a fourth position.

According to this configuration, the rotary table is provided with a plurality of movable pins, and each movable pin has a support portion movably provided between the open position and the holding position. The support of each movable pin is urged by the urging unit to one of the open position and the holding position.
The plurality of movable pins include a first movable pin group and a second movable pin group. The directions of the magnetic poles of the first driving magnets attached to the first movable pin group are equal to each other in the radial direction of the turntable, and the second driving magnets attached to the second movable pin group. The magnetic pole directions of the driving magnet are opposite to the magnetic pole directions of the first driving magnet, and are equal to each other in the radial direction of the turntable.

  In addition, a first moving magnet having a magnetic pole direction that gives a repulsive force or an attractive force to the first driving magnet is provided in a non-rotating state. The first relative position of the first moving magnet and the rotary table is a first position at which the first moving magnet applies a repulsive force or an attractive force to the first driving magnet by the first relative moving unit; The first moving magnet is relatively moved between the first moving magnet and a second position where no repulsive force and no attractive force is applied to the first driving magnet.

  Further, a second moving magnet having a magnetic pole direction that gives a repulsive force or an attractive force between the second moving magnet and the second driving magnet is provided in a non-rotating state. The relative position of the second moving magnet and the rotary table includes a third position at which the second moving magnet applies a repulsive force or an attractive force to the second driving magnet by the second relative moving unit; The second moving magnet is relatively moved between the second moving magnet and a fourth position where no repulsive force and no attractive force are applied between the second moving magnet and the second driving magnet.

  By disposing the first moving magnet at the first position and the second moving magnet at the fourth position while the turntable is rotating, the repulsive force from the moving magnet (first moving magnet) is obtained. Alternatively, the attraction force is applied only to the first driving magnet that is the driving magnet corresponding to the first movable pin group. The support portion of the first movable pin group is urged to the other of the open position and the holding position against the urging force of the urging unit by the repulsion force or the suction force. In this state, the support of the first movable pin group is urged to the other of the open position and the holding position, and the support of the second movable pin group is urged to one of the open position and the hold position. I have. That is, the substrate is supported by at least three movable pins included in the movable pin group (one of the first and second movable pin groups) whose support portion is biased to the holding position.

  On the other hand, by disposing the first moving magnet at the second position and disposing the second moving magnet at the third position in the rotating state of the turntable, the moving magnet (second moving magnet) The repulsive force or the attractive force is applied only to the second driving magnet that is the driving magnet corresponding to the second movable pin group. The support portion of the second movable pin group is urged to the other of the open position and the holding position against the urging force of the urging unit by the repulsion force or the suction force. In this state, the support portion of the first movable pin group is urged to one of the open position and the holding position, and the support portion of the second movable pin group is urged to the other of the open position and the hold position. I have. That is, the substrate is supported by at least three movable pins included in the movable pin group (the other of the first and second movable pin groups) whose support portion is biased to the holding position.

  As described above, when the substrate is rotated, the relative positions of the first movable magnet and the rotary table and the relative positions of the second movable magnet and the rotary table are relatively moved, thereby including three or more movable pins. A transition can be made between a state where the substrate is supported by the first movable pin group and a state where the substrate is supported by the second movable pin group including three or more movable pins.

As described above, it is possible to provide a magnet switching type substrate holding and rotating device that can favorably rotate the substrate while rotating the substrate and change the position of the contact support of the substrate by the movable pins during the rotation of the substrate.
According to a second aspect of the present invention, the first and second moving magnets are located at the first or third position and the rotating table is in a rotating state, respectively. 2. The substrate holding and rotating device according to claim 1, wherein an annular magnetic field generating region coaxial with the rotation axis is formed through which each movable pin that rotates with the rotation of the turntable can pass.

  According to this configuration, since the magnetic field generation region formed by the first moving magnet and the magnetic field generation region formed by the second moving magnet are each formed in an annular shape, all movable regions can be rotated in the rotating state of the turntable. The driving magnets corresponding to the pins (the first driving magnet and the second driving magnet) simultaneously pass through the magnetic field generation region. Therefore, in a state where the first moving magnet is arranged at the first position, a repulsive force or an attractive force is generated between the first moving magnet and the first driving magnets corresponding to all the movable pins included in the first movable pin group. Can be given. Further, in a state where the second movable magnet is arranged at the third position, a repulsive force or an attractive force is generated between the second movable magnet and the second driving magnets corresponding to all the movable pins included in the second movable pin group. Can be given.

In the invention according to claim 3, the first and second moving magnets are provided in the same number each, and the plurality of first moving magnets and the plurality of second moving magnets are respectively provided. 3. The substrate holding and rotating device according to claim 2, wherein the substrate holding and rotating devices are arranged alternately in a circumferential direction of the turntable in a plan view and so as to form an annular shape coaxial with the rotation axis as a whole.
According to this configuration, the plurality of first moving magnets and the plurality of second moving magnets are alternately arranged in the circumferential direction of the turntable. In addition, the plurality of first moving magnets and the plurality of second moving magnets are arranged so as to form an annular shape that is coaxial with the rotation axis as a whole. In this case, focusing on each type of moving magnet (the first moving magnet or the second moving magnet), the moving magnet is intermittently arranged in the circumferential direction of the turntable on the coaxial circumference of the rotation axis. Have been. Even in this case, the magnetic field generation region can be provided in an annular shape depending on the rotation speed of the turntable and / or the circumferential length of each open magnet.

  According to a fourth aspect of the present invention, the first movable pin group includes the same number of the movable pins as the second movable pin group, and the first and second movable pin groups are arranged around the rotary table. A plurality of movable pins included in each movable pin group are alternately arranged in the direction and are arranged at equal intervals, and the first and second movable magnets are included in each movable pin group, respectively. 4. The substrate holding and rotating device according to claim 3, wherein the same number as the number of the movable pins is arranged at equal intervals in a circumferential direction of the rotary table.

  According to this configuration, the first and second movable pin groups are alternately arranged in the circumferential direction of the turntable, and the plurality of movable pins included in each movable pin group are provided at equal intervals. Therefore, in each of the state where the substrate is supported by three or more first movable pin groups and the state where the substrate is supported by three or more second movable pin groups, each movable pin The group can favorably support the substrate.

Further, since the first and second movable magnets are arranged at the same number as the number of the movable pins included in each movable pin group and at equal intervals in the circumferential direction of the rotary table, respectively, Also in the state, the first and second movable magnets can apply a repulsive force or an attractive force to the driving magnets corresponding to the first and second movable pin groups, respectively.
The invention according to claim 5 is the substrate holding device according to claim 2, wherein the first moving magnet and the second moving magnet are arranged coaxially with the rotation axis and in a double annular shape in plan view. It is a rotating device.

According to this configuration, since the first annular moving magnet and the second annular moving magnet are used, the magnetic field generation region can be reliably provided in an annular shape in the rotating state of the turntable.
In the invention according to claim 6, the biasing unit opens the support portion of the first movable pin group by applying a repulsive force or an attractive force between the biasing unit and the first driving magnet. The second movable pin by applying a repulsive force or an attractive force between a first urging magnet for urging the one of the position and the holding position and the second driving magnet. group of the support portion the open position and the holding position the second including a biasing magnet for biasing said one of the substrate holding and rotating according to any one of claims 1 to 5 Device.

According to this configuration, the support portion of each movable pin is urged to one of the open position and the holding position by the first urging magnet and the second urging magnet. This makes it possible to easily realize a configuration in which the support portion of each movable pin is biased to one of the open position and the holding position.
The invention according to claim 7 is the substrate holding and rotating device according to claim 6, wherein the first and second urging magnets are provided so as not to be movable relative to the turntable.

According to this configuration, the support portion of each movable pin can be constantly biased to one of the open position and the holding position.
The invention according to claim 8, wherein the substrate is disposed between the turntable and the substrate holding position by the plurality of movable pins, and is supported by the movable pins at a lower position and above the lower position . And a protection disk attached to the turntable so as to be movable up and down relative to the turntable between an approach position close to the lower surface of the turntable and to rotate around the rotation axis with the turntable. 7. The substrate holding and rotating device according to claim 6, wherein the first and second urging magnets are provided on the protection disk so as to be movable up and down.

According to this configuration, the first and second urging magnets can be moved up and down by moving the protection disk up and down. Therefore, it is not necessary to separately provide the first and second urging magnets in addition to the lifting / lowering unit for vertically moving the protection disk, thereby simplifying the apparatus configuration and reducing the cost.
The invention according to claim 9, wherein the one of the open position and the holding position is the holding position, and the other of the opening position and the holding position is the opening position. The substrate holding and rotating device according to any one of the above.

  According to this configuration, the support portion of each movable pin is urged to the holding position by the urging unit. By disposing the first moving magnet at the first position and the second moving magnet at the fourth position while the turntable is rotating, the repulsive force from the moving magnet (first moving magnet) is obtained. Alternatively, the attraction force is applied only to the first driving magnet that is the driving magnet corresponding to the first movable pin group. The support portion of the first movable pin group is urged to the open position by the repulsion force or the suction force against the urging force of the urging unit. In this state, the support of the first movable pin group is urged to the open position, and the support of the second movable pin group is urged to the holding position. That is, the substrate is supported by at least three movable pins included in the second movable pin group.

  On the other hand, by disposing the first moving magnet at the second position and disposing the second moving magnet at the third position in the rotating state of the turntable, the moving magnet (second moving magnet) The repulsive force or the attractive force is applied only to the second driving magnet that is the driving magnet corresponding to the second movable pin group. The support portion of the second movable pin group is urged to the open position by the repulsion force or the suction force against the urging force of the urging unit. In this state, the support of the first movable pin group is biased to the holding position, and the support of the second movable pin group is biased to the open position. That is, the substrate is supported by at least three movable pins included in the first movable pin group.

The invention according to claim 10, wherein the substrate is disposed between the turntable and the substrate holding position by the plurality of movable pins, and is supported by the movable pin at a lower position and above the lower position . A protection disk attached to the turntable so as to be movable up and down relative to the turntable between an approaching position approaching the lower surface of the turntable and rotating about the rotation axis together with the turntable; A first levitation magnet attached to a disk, a second levitation magnet provided in a non-rotating state and applying a repulsive force to the first levitation magnet, the first moving magnet and the Independently of the relative movement of the turntable and the relative movement of the second moving magnet and the turntable, the distance between the first levitation magnet and the second levitation magnet changes. The second And a third relative movement unit for the levitation magnets and the turntable relative movement, a substrate holding and rotating apparatus according to any one of claims 1 to 9.

  According to this configuration, the relative movement of the second levitation magnet and the rotary table is independent of each of the relative movement of the first movable magnet and the rotary table and the relative movement of the second movable magnet and the rotary table. Do. Thereby, the relative movement operation of the first moving magnet and the turntable and the relative movement operation of the second movement magnet and the turntable can be performed regardless of the vertical position of the protection disk.

According to an eleventh aspect of the present invention, there is provided a substrate holding / rotating device according to any one of the first to tenth aspects, and an upper surface of a substrate held by the substrate holding / rotating device. On the other hand, a substrate processing apparatus includes a processing liquid supply unit that supplies a processing liquid.
According to this configuration, the processing liquid is supplied from the processing liquid supply unit to the main surface of the substrate. The processing liquid supplied to the main surface of the substrate flows toward the peripheral portion of the substrate under the centrifugal force due to the rotation of the substrate. Thereby, the peripheral portion of the substrate is liquid-processed with the processing liquid. According to the present invention, it is possible to change the contact support position of the substrate by the movable pin during the rotation of the substrate. Therefore, the peripheral portion of the substrate can be satisfactorily processed without any remaining processing.

The invention according to claim 12, wherein the rotary drive unit, the processing liquid supply unit further includes a control unit for controlling said first relative movement unit and the second relative movement unit, wherein the control unit A turntable rotating step of rotating the turntable about the rotation axis, a processing liquid supply step of supplying a processing liquid to a substrate rotating with the rotation of the turntable, the turntable rotation step and the processing In parallel with the liquid supply step, the relative position of the first moving magnet and the rotary table is arranged at the first position, and the relative position of the second moving magnet and the rotary table is changed to the fourth position. A first magnet arranging step for disposing the second movable magnet and the rotator in parallel with the turntable rotating step and the processing liquid supplying step when the first magnet arranging step is not performed. A second magnet arranging step of arranging a relative position of a table at the third position and arranging a relative position of the first moving magnet and the rotary table at the second position. 4. The substrate processing apparatus according to item 1.

According to this configuration, the processing liquid is supplied to the main surface of the rotating substrate. The processing liquid supplied to the main surface of the substrate flows toward the peripheral portion of the substrate under the centrifugal force due to the rotation of the substrate. Thereby, the peripheral portion of the substrate is liquid-processed with the processing liquid.
Further, in parallel with the rotation of the turntable and the supply of the processing liquid, the relative positions of the first moving magnet and the turntable are arranged at the first position, and the relative positions of the second movable magnet and the turntable are changed. Arrange at the fourth position (first magnet arrangement step). Thus, the substrate is supported by at least three movable pins included in the movable pin group (one of the first and second movable pin groups) whose support portion is biased to the holding position.

  Further, in parallel with the rotation of the turntable and the supply of the processing liquid, the relative positions of the first moving magnet and the turntable are arranged at the second position, and the relative positions of the second movable magnet and the turntable are changed. It is arranged at a third position (second magnet arrangement step). Accordingly, the substrate is supported by at least three movable pins included in the movable pin group (the other of the first and second movable pin groups) whose support portion is biased to the holding position.

Therefore, in the processing liquid supply step of supplying the processing liquid to the main surface of the substrate while rotating the substrate, the contact support position of the substrate by the movable pin can be changed. Therefore, the processing liquid can be supplied to the entire area of the peripheral portion of the substrate, whereby the peripheral portion of the substrate can be satisfactorily processed without any remaining processing.
The invention according to claim 13 for achieving the above object is characterized in that a turntable, a rotary drive unit for rotating the turntable around a rotation axis along a vertical direction, and a plurality of components for horizontally supporting the substrate. A movable pin having a support portion movably provided between an open position distant from the rotation axis and a holding position close to the rotation axis; and a movable pin provided to rotate the movable pin of the plurality of comprises a first movable pin group comprising at least three movable pins, provided separately from the first movable pin group, A second movable pin group including at least three movable pins, an urging unit for urging the support portion of each movable pin to one of the open position and the holding position, and a first movable pin Attached to the group A first driving magnet having the same magnetic pole direction with respect to a direction orthogonal to the axis along the rotation axis, and a direction perpendicular to the axis along the rotation axis, which is mounted corresponding to each of the second movable pin groups. A second driving magnet having a magnetic pole direction opposite to that of the first driving magnet, and the first driving magnet provided in a non-rotating state and perpendicular to an axis along the rotation axis. A magnetic pole direction that gives a repulsive force or an attractive force between the first movable pin group and the support portion of the first movable pin group at the other of the open position and the holding position by the repulsive force or the attractive force. A first moving magnet to be energized, and a magnetic pole direction provided in a non-rotating state and providing a repulsive force or an attractive force between the first driving magnet and the second driving magnet in a direction perpendicular to an axis along the rotation axis. The repulsive force Or a second moving magnet that urges the support portion of the second movable pin group to the other of the open position and the holding position by the attraction force, the first moving magnet and the turntable. A first position at which the first moving magnet applies the repulsive force or the attractive force between the first moving magnet and the first driving magnet, and wherein the first moving magnet is A first relative movement unit that relatively moves between the repulsive force and a second position that does not provide the suction force, and independently of the relative movement of the first moving magnet and the turntable, A third position where the second moving magnet applies the repulsive force or the attractive force between the second moving magnet and the second driving magnet; A magnet generates the repulsive force and the attractive force between the magnet and the second driving magnet. A substrate holding / rotating device, further comprising a second relative moving unit for relatively moving the substrate holding / rotating device to a fourth position not to be provided, and a process of supplying a processing liquid to the substrate held by the substrate holding / rotating device the substrate processing method performed in a substrate processing apparatus including a liquid supply unit, a turntable rotating step of rotating the front Symbol turntable about said axis of rotation, and rotates with the rotation of the turntable A relative position of the first moving magnet and the rotary table is arranged at the first position in parallel with the processing liquid supply step of supplying the processing liquid to the substrate, the turntable rotating step and the processing liquid supply step. A first magnet arranging step of arranging the relative positions of the second moving magnet and the turntable at the fourth position, and a step of rotating the turntable during the non-execution of the first magnet arranging step. And before In parallel with the processing liquid supply step, the relative position of the second moving magnet and the rotary table is arranged at the third position, and the relative position of the first moving magnet and the rotary table is changed to the second position. And a second magnet arrangement step of arranging the substrate at a position.

According to this method, the processing liquid is supplied to the main surface of the substrate in a rotating state. The processing liquid supplied to the main surface of the substrate flows toward the peripheral portion of the substrate under the centrifugal force due to the rotation of the substrate. Thereby, the peripheral portion of the substrate is liquid-processed with the processing liquid.
Further, in parallel with the rotation of the turntable and the supply of the processing liquid, the relative positions of the first moving magnet and the turntable are arranged at the first position, and the relative positions of the second movable magnet and the turntable are changed. Arrange at the fourth position (first magnet arrangement step). Thus, the substrate is supported by at least three movable pins included in the movable pin group (one of the first and second movable pin groups) whose support portion is biased to the holding position.

  Further, in parallel with the rotation of the turntable and the supply of the processing liquid, the relative positions of the first moving magnet and the turntable are arranged at the second position, and the relative positions of the second movable magnet and the turntable are changed. It is arranged at a third position (second magnet arrangement step). Accordingly, the substrate is supported by at least three movable pins included in the movable pin group (the other of the first and second movable pin groups) whose support portion is biased to the holding position.

  Therefore, in the processing liquid supply step of supplying the processing liquid to the main surface of the substrate while rotating the substrate, the contact support position of the substrate by the movable pin can be changed. Therefore, the processing liquid can be supplied to the entire area of the peripheral portion of the substrate, whereby the peripheral portion of the substrate can be satisfactorily processed without any remaining processing.

FIG. 1 is an illustrative plan view for explaining an internal layout of the substrate processing apparatus according to the first embodiment of the present invention. FIG. 2 is an illustrative sectional view for explaining a configuration example of a processing unit provided in the substrate processing apparatus. FIG. 3 is a plan view for explaining a more specific configuration of the spin chuck provided in the substrate processing apparatus. FIG. 4 is a bottom view of the configuration of FIG. FIG. 5 is a cross-sectional view taken along line VV of FIG. 3. FIG. 6 is an enlarged sectional view showing a part of the configuration of FIG. 5 in an enlarged manner. FIG. 7 is an enlarged cross-sectional view showing a configuration near a movable pin provided in a spin chuck. FIGS. 8A to 8B are schematic diagrams showing states of movable pins included in a first movable pin group in association with an elevating operation of a first open permanent magnet. 9A and 9B are schematic diagrams illustrating states of movable pins included in a second movable pin group in association with a lifting operation of the second open permanent magnet. 10A to 10B are schematic diagrams illustrating states of a first movable pin group and a second movable pin group. 11A and 11B are schematic diagrams illustrating states of a first movable pin group and a second movable pin group. 12A to 12B are schematic diagrams illustrating states of a first movable pin group and a second movable pin group. 13A to 13B are schematic diagrams illustrating states of a first movable pin group and a second movable pin group. FIGS. 14A and 14B are schematic diagrams illustrating states of a first movable pin group and a second movable pin group. FIGS. 15A and 15B are schematic diagrams illustrating states of a first movable pin group and a second movable pin group. FIG. 16 is a block diagram for explaining an electrical configuration of a main part of the substrate processing apparatus. FIG. 17 is a flowchart for explaining an example of the processing liquid processing performed by the substrate processing apparatus. FIG. 18 is a time chart for explaining the treatment liquid treatment. 19A to 19B are schematic views for explaining an example of the processing liquid processing. 19C to 19D are schematic views for illustrating a step following the step shown in FIG. 19B. 19E to 19F are schematic views for explaining a step following FIG. 19D. FIG. 19G is an illustrative view showing a step following FIG. 19F. FIG. 19H is an illustrative view showing a step following FIG. 19G. 19I to 19J are schematic diagrams for explaining a step following FIG. 19H. FIG. 19K is a schematic view for explaining a step following FIG. 19J. FIGS. 20A-20B are diagrams illustrating the state of wraparound of the processing liquid when the movable pin is at the holding position and when the movable pin is at the open position. FIG. 20C is a cross-sectional view illustrating the flow of the processing liquid and the inert gas in the peripheral portion of the substrate. FIG. 21 is an illustrative sectional view for explaining a configuration example of a processing unit according to the second embodiment of the present invention. FIG. 22 is a cross-sectional view for explaining a configuration example of an annular cover of a spin chuck provided in the processing unit. FIG. 23 is a plan view for explaining a more specific configuration of the spin chuck. FIGS. 24A to 24B are schematic diagrams showing states of movable pins included in a first movable pin group in association with a lifting and lowering operation of a protection disk. FIGS. 25A to 25B are schematic diagrams illustrating states of movable pins included in a second movable pin group in association with a lifting operation of the protection disk. FIG. 26 is a flowchart illustrating an example of a processing liquid process performed by the substrate processing apparatus. FIG. 27A is an illustrative view for explaining an example of the processing liquid processing performed by the substrate processing apparatus. FIG. 27B is an illustrative view showing a step following FIG. 27A. FIG. 27C is an illustrative view for explaining a step following FIG. 27B. FIG. 27D is an illustrative view showing a step following FIG. 27C. FIG. 27E is a schematic diagram for explaining a step following the step shown in FIG. 27D. FIG. 27F is a schematic diagram for explaining a step following the step shown in FIG. 27E. FIG. 27G is an illustrative view showing a step following FIG. 27F. FIG. 27H is an illustrative view showing a step following FIG. 27G. FIG. 27I is a schematic diagram for explaining a step following the step shown in FIG. 27H. FIG. 27J is a schematic view for explaining the step following FIG. 27I. FIG. 27K is a schematic view for explaining a step following FIG. 27J.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is an illustrative plan view for explaining an internal layout of a substrate processing apparatus 1 according to one embodiment of the present invention.
The substrate processing apparatus 1 is a single-wafer processing apparatus that processes a disk-shaped substrate W made of a semiconductor wafer (semiconductor substrate) one by one with a processing liquid or a processing gas. The substrate processing apparatus 1 includes a load port LP for holding a plurality of carriers C, a reversing unit TU for reversing the posture of the substrate W, and a plurality of processing units 2 for processing the substrate W. The load port LP and the processing unit 2 are arranged at intervals in the horizontal direction. The reversing unit TU is arranged on a transport path of the substrate W transported between the load port LP and the processing unit 2.

  As shown in FIG. 1, the substrate processing apparatus 1 further includes an indexer robot IR disposed between the load port LP and the reversing unit TU, and a center robot disposed between the reversing unit TU and the processing unit 2. It includes a CR and a control unit 3 that controls the operation of the apparatus provided in the substrate processing apparatus 1 and the opening and closing of valves. The indexer robot IR transports a plurality of substrates W one by one from the carrier C held in the load port LP to the reversing unit TU, and transfers a plurality of substrates W from the reversing unit TU to the carrier C held in the load port LP. The substrates W are transported one by one. Similarly, the center robot CR transports a plurality of substrates W one by one from the reversing unit TU to the processing unit 2 and transports a plurality of substrates W one by one from the processing unit 2 to the reversing unit TU. The center robot CR further transports the substrate W between the plurality of processing units 2.

  The indexer robot IR includes a hand H1 that horizontally supports the substrate W. The indexer robot IR moves the hand H1 horizontally. Further, the indexer robot IR raises and lowers the hand H1, and rotates the hand H1 about a vertical axis. Similarly, the center robot CR includes a hand H2 that horizontally supports the substrate W. The center robot CR moves the hand H2 horizontally. Further, the center robot CR raises and lowers the hand H2, and rotates the hand H2 around a vertical axis.

  The carrier W is accommodated in the carrier C with the surface Wa of the substrate W, which is the device formation surface, facing upward (upward posture). The control unit 3 causes the indexer robot IR to transfer the substrate W from the carrier C to the reversing unit TU with the front surface Wa (see FIG. 2 and the like) facing upward. Then, the control unit 3 reverses the substrate W by the reversing unit TU. Thereby, the back surface Wb (see FIG. 2 and the like) of the substrate W is turned upward. Thereafter, the control unit 3 causes the center robot CR to transfer the substrate W from the reversing unit TU to the processing unit 2 with the back surface Wb facing upward. Then, the control unit 3 causes the processing unit 2 to process the back surface Wb of the substrate W.

  After the rear surface Wb of the substrate W is processed, the control unit 3 causes the center robot CR to transport the substrate W from the processing unit 2 to the reversing unit TU with the rear surface Wb facing upward. Then, the control unit 3 reverses the substrate W by the reversing unit TU. Thereby, the surface Wa of the substrate W is directed upward. After that, the control unit 3 causes the indexer robot IR to transfer the substrate W from the reversing unit TU to the carrier C with the front surface Wa facing upward. Thus, the processed substrate W is stored in the carrier C. The control unit 3 causes the indexer robot IR and the like to repeatedly execute the series of operations, thereby processing a plurality of substrates W one by one.

  FIG. 2 is an illustrative sectional view for explaining a configuration example of the processing unit 2 provided in the substrate processing apparatus 1. FIG. 3 is a plan view for explaining a more specific configuration of the spin chuck 5 provided in the substrate processing apparatus 1. FIG. 4 is a bottom view of the configuration of FIG. FIG. 5 is a cross-sectional view taken along line VV of FIG. 3. FIG. 6 is an enlarged sectional view showing a part of the configuration of FIG. 5 in an enlarged manner. FIG. 7 is an enlarged cross-sectional view showing the configuration near the movable pin 110 provided in the spin chuck 5.

  As shown in FIG. 2, the processing unit 2 includes a box-shaped processing chamber 4 having an internal space, and a single substrate W held in the processing chamber 4 in a horizontal posture. A spin chuck (substrate holding / rotating device) 5 for rotating the substrate W around the rotation axis A1 and a chemical solution (processing) toward an upper surface (back surface (one main surface) Wb) of the substrate W held by the spin chuck 5. A liquid supply unit (treatment liquid supply unit) 7 for supplying an ozone-containing hydrofluoric acid solution (hereinafter, referred to as FOM) as an example of a liquid (liquid), and a rinsing liquid ( A water supply unit (treatment liquid supply unit) 8 for supplying water as a treatment liquid, a cleaning brush 10 for contacting the upper surface of the substrate W and scrubbing the upper surface, and driving the cleaning brush 10 And a protective gas supply unit 12 for supplying an inert gas as a protective gas to the lower surface (the front surface (the other main surface) Wa) of the substrate W held by the spin chuck 5. , A cylindrical processing cup (not shown) surrounding the spin chuck 5.

  As shown in FIG. 2, the processing chamber 4 includes a box-shaped partition (not shown) and an FFU (fan / filter) serving as a blowing unit that sends clean air from above the partition into the partition (corresponding to the inside of the processing chamber 4). A unit (not shown) and an exhaust device (not shown) for discharging gas in the processing chamber 4 from below the partition. A downflow (downflow) is formed in the processing chamber 4 by the FFU and the exhaust device.

  As shown in FIG. 2, the spin chuck 5 includes a turntable 107 rotatable around a rotation axis A1 along the vertical direction. A rotation shaft 108 is coupled to the lower surface of the rotation center of the turntable 107 via a boss 109. The rotation shaft 108 is a hollow shaft, extends in the vertical direction, and is configured to rotate around the rotation axis A1 by receiving a driving force from the rotation drive unit 103. The rotation drive unit 103 may be, for example, an electric motor having the rotation shaft 108 as a drive shaft.

  As shown in FIG. 2, the spin chuck 5 further includes a plurality of (six in this embodiment) movable pins provided on the periphery of the upper surface of the turntable 107 at substantially equal intervals along the circumferential direction. 110 is provided. Each of the movable pins 110 is configured to horizontally hold the substrate W at a substrate holding height above a rotating table 107 having a substantially horizontal upper surface and at a fixed interval. That is, all the holding pins provided in the spin chuck 5 are the movable pins 110.

The turntable 107 is formed in a disk shape along a horizontal plane, and is connected to a boss 109 connected to a rotation shaft 108.
As shown in FIG. 3, the movable pins 110 are arranged at equal intervals along the circumferential direction on the peripheral edge of the upper surface of the turntable 107. The six movable pins 110 are set in one group in which the magnetic pole directions of the corresponding drive permanent magnets 156A and 156B are common to each of the three movable pins 110 that are not adjacent to each other. In other words, the six movable pins 110 include three movable pins 110 included in the first movable pin group 111 and three movable pins 110 included in the second movable pin group 112. Corresponding to the magnetic pole direction of the first driving permanent magnet 156A corresponding to the three movable pins 110 included in the first movable pin group 111, and to the three movable pins 110 included in the second movable pin group 112 The magnetic pole direction of the second driving permanent magnet 156B is different from each other in a direction orthogonal to the rotation axis A3. The movable pins 110 included in the first movable pin group 111 and the movable pins 110 included in the second movable pin group 112 are alternately arranged in the circumferential direction of the turntable 107. Focusing on the first movable pin group 111, the three movable pins 110 are arranged at equal intervals (120 ° intervals). Focusing on the second movable pin group 112, the three movable pins 110 are arranged at equal intervals (120 ° intervals).

  Each movable pin 110 includes a lower shaft portion 151 coupled to the turntable 107 and an upper shaft portion (support portion) 152 integrally formed on the upper end of the lower shaft portion 151. The shaft portions 152 are each formed in a columnar shape. The upper shaft 152 is provided eccentrically from the center axis of the lower shaft 151. The surface connecting the upper end of the lower shaft 151 and the lower end of the upper shaft 152 forms a tapered surface 153 that descends from the upper shaft 152 toward the peripheral surface of the lower shaft 151.

  As shown in FIG. 7, each movable pin 110 is coupled to the turntable 107 such that the lower shaft portion 151 can rotate around a rotation axis A3 coaxial with its central axis. More specifically, a support shaft 155 is provided at the lower end of the lower shaft 151 and is supported by the turntable 107 via a bearing 154. A magnet holding member 157 holding driving permanent magnets (first and second driving magnets) 156A and 156B is coupled to a lower end of the support shaft 155. The drive permanent magnets 156A and 156B are arranged, for example, with the magnetic pole direction oriented in a direction orthogonal to the rotation axis A3 of the movable pin 110. The first driving permanent magnet 156A is a driving permanent magnet corresponding to the movable pin 110 included in the first movable pin group 111. The second driving permanent magnet 156B is a driving permanent magnet corresponding to the movable pin 110 included in the second movable pin group 111. The first driving permanent magnet 156A and the second driving permanent magnet 156B are in a direction orthogonal to the rotation axis A3 in a state where no external force is applied to the movable pins 110 corresponding to the driving permanent magnets 156A, 156B. They are provided so as to have equal magnetic pole directions opposite to each other with respect to (a direction orthogonal to an axis along the rotation axis). The first drive permanent magnets 156A and the second drive permanent magnets 156A are alternately arranged in the circumferential direction of the turntable 107.

  The turntable 107 is provided with the same number of closed permanent magnets 121 and 122 as the number of the movable pins 110. The closed permanent magnets 121 and 122 are provided in one-to-one correspondence with the movable pins 110, and are arranged adjacent to the corresponding movable pins 110. In this embodiment, as shown in FIGS. 3 and 4, the closed permanent magnets 121 and 122 are further away from the rotation axis A1 around the corresponding movable pin 110 than the center position of the movable pin 110 in plan view. It is arranged in the direction to be. Each of the closed permanent magnets 121 and 122 is housed in a magnet holding member 123 provided adjacent to the corresponding magnet holding member 157.

  The plurality of closed permanent magnets 121 and 122 include three first closed permanent magnets (first urging magnets) 121 corresponding to the three movable pins 110 included in the first movable pin group 111, and a second closed permanent magnet 121. And three second closed permanent magnets (second biasing magnets) 122 corresponding to the three movable pins 110 included in the two movable pin groups 112. In other words, the first closing permanent magnet 121 corresponds to the first driving permanent magnet 156A, and the second closing permanent magnet 122 corresponds to the second driving permanent magnet 156B. The first closing permanent magnets 121 and the second driving permanent magnets 156A are alternately arranged in the circumferential direction of the turntable 107. The first closed permanent magnet 121 and the second closed permanent magnet 122 are provided so as to be unable to move up and down with respect to the turntable 107.

  As described above, the first driving permanent magnet 156A and the second driving permanent magnet 156B are provided so as to have the same magnetic pole directions that are opposite to each other with respect to the direction orthogonal to the rotation axis A3. The first closing permanent magnet 121 and the second closing permanent magnet 122 apply a magnetic force to the corresponding driving permanent magnets 156A, 156B to urge the upper shaft 152 of the corresponding movable pin 110 to the holding position. It is provided for. Therefore, the first closed permanent magnet 121 and the second closed permanent magnet 122 are also provided so as to have the same magnetic pole direction opposite to each other with respect to the direction orthogonal to the rotation axis A3.

The first driving permanent magnet 156A receives the attractive magnetic force from the first closing permanent magnet 121, and moves the upper shaft 152 to a holding position closer to the rotation axis A1. That is, the upper shaft 152 of the movable pin 110 included in the first movable pin group 111 is urged to the holding position by the attractive magnetic force of the first closed permanent magnet 121.
The second driving permanent magnet 156B receives the attractive magnetic force from the second closing permanent magnet 122, and moves the upper shaft 152 to the holding position closer to the rotation axis A1. That is, the upper shaft 152 of the movable pin 110 included in the second movable pin group 112 is urged to the holding position by the attractive magnetic force of the second closed permanent magnet 122. Therefore, when the drive permanent magnets 156A and 156B do not receive the attractive magnetic force from the open permanent magnets 125 and 127 described below, the movable pin 110 is located at a holding position away from the rotation axis A1.

  As shown in FIG. 2, below the turntable 107, a first open permanent magnet (first elevating magnet) 125 and a second open permanent magnet (second elevating magnet) 127 are provided. The magnetic pole directions of the first open permanent magnet 125 and the second open permanent magnet 127 are both along the vertical direction but opposite to each other. When the upper surface of the first open permanent magnet 125 is, for example, an N pole, the upper surface of the second open permanent magnet 127 has an S pole of the opposite polarity.

In this embodiment, three first open permanent magnets 125 and two second open permanent magnets 127 are provided (the same number as the number of movable pins 110 included in the movable pin groups 111 and 112). The three first driving permanent magnets 156A and the three second driving permanent magnets 156A are alternately arranged in the circumferential direction of the turntable 107 in plan view.
The three first open permanent magnets 125 have an arc shape centered on the rotation axis A1, and are arranged at common height positions and at intervals in the circumferential direction of the turntable 107. The three first open permanent magnets 125 have the same specifications as each other, and are arranged at regular intervals in the circumferential direction on a circumference coaxial with the rotation axis A1. Each first open permanent magnet 125 is disposed along a plane (horizontal plane) orthogonal to the rotation axis A1.

The first open permanent magnet 125 is formed in an annular shape coaxial with the rotation axis A1, and is arranged along a plane (horizontal plane) orthogonal to the rotation axis A1. More specifically, the first open permanent magnet 125 is disposed at a position farther from the rotation axis A1 than a first levitation magnet 160 described later and closer than the drive permanent magnets 156A and 156B. ing.
The circumferential length (angle) of each first open permanent magnet 125 is about 60 °. The reason that the circumferential length (angle) of each of the first open permanent magnets 125 is about 60 ° is that when the substrate W is rotated at a liquid processing speed (for example, about 500 rpm) as described later, the turntable 107 is rotated. The magnetic field generating region 129A (see FIG. 13A) having an annular shape is formed in an annular region through which the driving permanent magnets 156A and 156B that rotate with the rotation of the motor pass.

  The first open permanent magnet 125 is connected to a first lifting / lowering unit (first relative moving unit) 126 for lifting and lowering the plurality of first open permanent magnets 125 collectively. The first elevating unit 126 has, for example, a configuration including a cylinder provided to be able to expand and contract in the up-down direction, and is supported by the cylinder. Further, the first elevating unit 126 may be configured using an electric motor. Further, the first lifting unit 126 may raise and lower the first open permanent magnet 125 individually.

  The first open permanent magnet 125 generates an attractive magnetic force between itself and the first driving permanent magnet 156A, and the upper magnetic portion 152 of the movable pin 110 included in the first movable pin group 111 is generated by the attractive magnetic force. To the open position. The first open permanent magnet 125 is disposed at an upper position (first position; see FIG. 8B and FIG. 19A) where the magnetic pole approaches the first driving permanent magnet 156A vertically. In the state where the open permanent magnet 125 is laterally opposed to the first drive permanent magnet 156A, a magnetic force (attraction magnetic force) acts between the first open permanent magnet 125 and the first drive permanent magnet 156A. I do.

  The three second open permanent magnets 127 have an arc shape centered on the rotation axis A1, and are arranged at a common height position and at intervals in the circumferential direction of the turntable 107. The three second open permanent magnets 127 have the same specifications as each other, and are arranged at equal intervals in the circumferential direction on a circumference coaxial with the rotation axis A1. Each second open permanent magnet 127 is arranged along a plane (horizontal plane) orthogonal to the rotation axis A1.

The second open permanent magnet 127 is formed in an annular shape coaxial with the rotation axis A1, and is arranged along a plane (horizontal plane) orthogonal to the rotation axis A1. More specifically, the second open permanent magnet 127 is arranged at a position farther from the rotation axis A1 than a first levitation magnet 160 described later and closer than the drive permanent magnets 156A and 156B. ing.
The circumferential length (angle) of each second open permanent magnet 127 is about 60 °. The reason why the circumferential length (angle) of each of the second open permanent magnets 127 is about 60 ° is that when the substrate W is rotated at a liquid processing speed (for example, about 500 rpm) as described later, the turntable 107 is rotated. The magnetic field generating region 129B (see FIG. 13B) is formed in an annular region in which the driving permanent magnets 156A and 156B that rotate with the rotation of.

  The second open permanent magnet 127 is connected to a second lifting / lowering unit (second relative moving unit) 128 for lifting and lowering the plurality of second open permanent magnets 127 collectively. The second elevating unit 128 is configured to include, for example, a cylinder provided to be able to expand and contract in the vertical direction, and is supported by the cylinder. Further, the second lifting unit 128 may be configured using an electric motor. Further, the second lifting unit 128 may raise and lower the second open permanent magnet 127 individually.

  The second open permanent magnet 127 generates an attractive magnetic force between itself and the second drive permanent magnet 156B, and the upper magnetic portion 152 of the movable pin 110 included in the second movable pin group 112 is generated by the attractive magnetic force. To the open position. The second open permanent magnet 127 is disposed at an upper position (third position; see FIG. 9B and FIG. 19A) where the magnetic pole approaches the second drive permanent magnet 156B in the up-down direction. In the state where the open permanent magnet 127 is laterally opposed to the second drive permanent magnet 156B, a magnetic force (attraction magnetic force) acts between the second open permanent magnet 127 and the second drive permanent magnet 156B. I do.

The first open permanent magnet 125 and the second open permanent magnet 127 are moved up and down using the first elevating unit 126 and the second elevating unit 128, respectively. Therefore, the first open permanent magnet 125 and the second open permanent magnet 127 can be formed independently of each other.
As shown in FIG. 2, the spin chuck 5 further includes a protection disk 115 disposed between the upper surface of the turntable 107 and the substrate holding height of the movable pin 110. The protection disk 115 is vertically movably coupled to the turntable 107, and is attached to a lower position near the upper surface of the turntable 107 and a lower surface of the substrate W held by the movable pins 110 above the lower position. It is possible to move between a close position and a close position with a small interval. The protection disk 115 is a disk-shaped member having a diameter slightly larger than the substrate W, and a notch 116 for avoiding the movable pin 110 is formed at a position corresponding to the movable pin 110. ing.

  The rotating shaft 108 is a hollow shaft, into which an inert gas supply pipe 170 is inserted. The lower end of the inert gas supply pipe 170 is connected to an inert gas supply passage 172 for leading an inert gas as an example of a protective gas from an inert gas supply source. Examples of the inert gas guided to the inert gas supply path 172 include an inert gas such as CDA (clean air with low humidity) and nitrogen gas. An inert gas valve 173 and an inert gas flow control valve 174 are provided in the middle of the inert gas supply path 172. The inert gas valve 173 opens and closes the inert gas supply path 172. By opening the inert gas valve 173, the inert gas is sent into the inert gas supply pipe 170. This inert gas is supplied to a space between the protection disk 115 and the lower surface of the substrate W by a configuration described later. As described above, the above-described protective gas supply unit 12 is configured by the inert gas supply pipe 170, the inert gas supply path 172, the inert gas valve 173, and the like.

  The protection disk 115 is a substantially disk-shaped member having the same size as the substrate W. A notch 116 is formed at a position corresponding to the movable pin 110 at a position corresponding to the movable pin 110 at a peripheral edge of the protection disk 115 so as to border the movable pin 110 at a constant interval from the outer peripheral surface of the movable pin 110. A circular opening corresponding to the boss 109 is formed in the central area of the protection disk 115.

  As shown in FIGS. 3 and 5, a guide shaft 117 extending in the vertical direction parallel to the rotation axis A1 is coupled to the lower surface of the protection disk 115 at a position farther from the rotation axis A1 than the boss 109. In this embodiment, the guide shafts 117 are arranged at three places at equal intervals in the circumferential direction of the protection disk 115. More specifically, three guide shafts 117 are arranged at angular positions corresponding to every other movable pin 110 when viewed from the rotation axis A1. The guide shaft 117 is connected to a linear bearing 118 provided at a position corresponding to the turntable 107, and is movable in a vertical direction, that is, a direction parallel to the rotation axis A1 while being guided by the linear bearing 118. Therefore, the guide shaft 117 and the linear bearing 118 constitute a guide unit 119 that guides the protection disk 115 along the vertical direction parallel to the rotation axis A1.

  The guide shaft 117 penetrates the linear bearing 118, and has a flange 120 projecting outward at the lower end thereof. By the flange 120 abutting on the lower end of the linear bearing 118, the upward movement of the guide shaft 117, that is, the upward movement of the protection disk 115 is regulated. That is, the flange 120 is a regulating member that regulates the upward movement of the protection disk 115.

  A magnet holding member 161 holding the first levitation magnet 160 is located at an outer position farther from the rotation axis A1 than the guide shaft 117 and closer to the rotation axis A1 than the movable pin 110. It is fixed to the lower surface of the protection disk 115. In this embodiment, the first levitation magnet 160 is held by the magnet holding member 161 with the magnetic pole direction oriented in the vertical direction. For example, the first levitation magnet 160 may be fixed to the magnet holding member 161 so as to have an S pole on the lower side and an N pole on the upper side. In this embodiment, the magnet holding members 161 are provided at six locations at equal intervals in the circumferential direction. More specifically, each magnet holding member 161 is disposed at an angular position corresponding to a space between adjacent movable pins 110 (in the present embodiment, at the middle) when viewed from the rotation axis A1. Further, among the six angle regions divided (equally divided in this embodiment) by the six magnet holding members 161 as viewed from the rotation axis A1, every other angle region (in this embodiment, the angle region At the (center position), three guide shafts 117 are respectively arranged.

  As shown in FIG. 4, through holes 162 are formed in the rotary table 107 at six locations corresponding to the six magnet holding members 161. Each through hole 162 is formed so that the corresponding magnet holding member 161 can be inserted in a vertical direction parallel to the rotation axis A1. When the protection disk 115 is at the lower position, the magnet holding member 161 passes through the through hole 162 and protrudes below the lower surface of the turntable 107, and the first levitation magnet 160 moves from the lower surface of the turntable 107. Is also located below.

  Below the turntable 107, a second floating magnet 129 for floating the protection disk 115 is provided. The second levitation magnet 129 is formed in an annular shape coaxial with the rotation axis A1, and is arranged along a plane (horizontal plane) orthogonal to the rotation axis A1. The second levitation magnet 129 is located closer to the rotation axis A1 than the first and second open permanent magnets 125 and 127 are. That is, in plan view, it is located on the inner diameter side of the first and second open permanent magnets 125 and 127. Further, the second levitation magnet 129 is disposed at a position lower than the first levitation magnet 160. In this embodiment, the magnetic pole direction of the second levitation magnet 129 is in the horizontal direction, that is, along the radius of rotation of the turntable 107. When the first levitation magnet 160 has an S pole on the lower surface, the second levitation magnet 129 is configured to have the same magnetic pole, that is, the S pole in a ring shape inside in the rotation radial direction.

  The third lifting unit (third relative moving unit) 130 for lifting and lowering the second lifting magnet 129 is connected to the second lifting magnet 129. The third elevating unit 130 is configured to include, for example, a cylinder provided to be able to expand and contract in the vertical direction, and is supported by the cylinder. Further, the third lifting unit 130 may be configured using an electric motor.

  When the second levitation magnet 129 is in the upper position (see FIG. 19B), a repulsive magnetic force acts between the second levitation magnet 129 and the first levitation magnet 160, and the first levitation magnet 160 Receives an upward external force. Accordingly, the protection disk 115 receives an upward force from the magnet holding member 161 holding the first levitation magnet 160, and is held at an approach position close to the lower surface of the substrate W.

In a state where the second levitation magnet 129 is disposed at a lower position (see FIG. 19A) that is separated downward from the upper position, repulsion between the second levitation magnet 129 and the first levitation magnet 160 is performed. Since the magnetic force is small, the protection disk 115 is held at a lower position near the upper surface of the turntable 107 by its own weight.
Therefore, when the second levitation magnet 129 is at the lower position, the protection disk 115 is at the lower position near the upper surface of the turntable 107, and the movable pin 110 is held at its open position. In this state, the center robot CR that carries the substrate W in and out of the spin chuck 5 can make the hand H2 enter the space between the protection disk 115 and the lower surface of the substrate W.

  In this embodiment, a dedicated lifting unit (third lifting unit 130) for lifting and lowering the protection disk 115 is provided. Therefore, the lifting operation of the second floating magnet 129 can be performed independently of the lifting operation of the first open permanent magnet 125 and the lifting operation of the second open permanent magnet 127, respectively. This means that the raising and lowering operation of the first open permanent magnet 125 and the raising and lowering operation of the second open permanent magnet 127 can be realized regardless of the vertical position of the protection disk 115.

  As shown in an enlarged manner in FIG. 6, the boss 109 connected to the upper end of the rotating shaft 108 holds a bearing unit 175 for supporting the upper end of the inert gas supply pipe 170. The bearing unit 175 includes a spacer 177 fitted and fixed in a recess 176 formed in the boss 109, a bearing 178 disposed between the spacer 177 and the inert gas supply pipe 170, and a spacer 177. A magnetic fluid bearing 179 is provided between the active gas supply pipe 170 and the bearing 178.

  As shown in FIG. 5, the boss 109 integrally has a flange 181 that protrudes outward along a horizontal plane, and the turntable 107 is coupled to the flange 181. Further, the above-described spacer 177 is fixed to the flange 181 so as to sandwich the inner peripheral edge of the turntable 107, and the cover 184 is coupled to the spacer 177. The cover 184 is formed in a substantially disk shape, has an opening in the center for exposing the upper end of the inert gas supply pipe 170, and a recess 185 having the opening as a bottom surface is formed on the upper surface thereof. . The recess 185 has a horizontal bottom surface and an inverted conical inclined surface 183 that rises obliquely upward outward from the periphery of the bottom surface. A rectifying member 186 is connected to the bottom surface of the recess 185. The flow regulating member 186 has a plurality of (for example, four) legs 187 discretely arranged at intervals along the circumferential direction around the rotation axis A1. It has a bottom surface 188 spaced from the bottom surface. From the peripheral edge of the bottom surface 188, an inclined surface 189 formed of an inverted conical surface extending obliquely upward and outward is formed.

  As shown in FIGS. 5 and 6, a flange 184 a is formed outward on the outer peripheral edge of the upper surface of the cover 184. The flange 184a is adapted to be aligned with a step 115a formed on the inner peripheral edge of the protection disk 115. That is, when the protection disk 115 is in an approaching position close to the lower surface of the substrate W, the flange 184a and the step portion 115a are engaged with each other, so that the upper surface of the cover 184 and the upper surface of the protection disk 115 are located on the same plane, and The inert gas flow path is formed.

  With such a configuration, the inert gas flowing out from the upper end of the inert gas supply pipe 170 exits into the space defined by the bottom surface 188 of the rectifying member 186 in the recess 185 of the cover 184. The inert gas is further blown out in a radial direction away from the rotation axis A1 via a radial flow path 182 defined by the inclined surface 183 of the recess 185 and the inclined surface 189 of the rectifying member 186. become. This inert gas forms an air flow of the inert gas in a space between the protective disk 115 and the lower surface of the substrate W held by the movable pins 110, and flows outward from the space in the radial direction of rotation of the substrate W. Blow out.

  As shown in FIG. 5, the peripheral edge of the upper surface of the protection disk 115 and the peripheral end of the protection disk 115 are protected by an annular cover 191. The annular cover 191 includes an annular plate portion 192 that protrudes radially outward from a peripheral edge of the upper surface in the horizontal direction, and a cylindrical portion 193 that hangs down from a peripheral end of the annular plate portion 192. The outer periphery of the annular plate portion 192 is located outside the peripheral end of the turntable 107. The annular plate portion 192 and the cylindrical portion 193 are integrally formed using, for example, a resin material having chemical resistance. A cutout 194 for avoiding the movable pin 110 is formed at a position corresponding to the movable pin 110 on the inner periphery of the annular plate portion 192. The notch 194 is formed so as to border the movable pin 110 at a certain interval from the outer peripheral surface of the movable pin 110. The annular plate portion 192 and the cylindrical portion 193 are integrally formed using, for example, a resin material having chemical resistance.

  The annular plate portion 192 of the annular cover 191 has, on its upper surface, a throttle portion 190 (see FIG. 20C) for narrowing the flow path of the inert gas at the periphery of the substrate W held by the movable pins 110. Since the flow rate of the inert gas flow blown outward from the space between the annular cover 191 and the lower surface of the substrate W is increased by the constricted portion 190, the processing liquid (chemical solution or rinse) on the upper surface of the substrate W is increased. Liquid) can be reliably prevented or suppressed from entering inside the peripheral edge of the lower surface of the substrate W.

As shown in FIG. 2, the chemical solution supply unit 13 includes a chemical solution nozzle 6 for discharging FOM (chemical solution) toward the upper surface of the substrate W, a nozzle arm 21 having the chemical solution nozzle 6 attached to a tip portion, and a nozzle arm 21. And a nozzle moving unit 22 that moves the chemical solution nozzle 6 by moving the nozzle.
The chemical liquid nozzle 6 is, for example, a straight nozzle that discharges the FOM in a continuous flow state, and is attached to the nozzle arm 21 in a vertical posture that discharges the FOM in a direction perpendicular to the upper surface of the substrate W, for example. The nozzle arm 21 extends in the horizontal direction, and is provided to be rotatable around a predetermined swing axis (not shown) extending in the vertical direction around the spin chuck 5.

The chemical supply unit 13 includes a chemical pipe 14 that guides the FOM to the chemical nozzle 6, and a chemical valve 15 that opens and closes the chemical pipe 14. When the chemical solution valve 15 is opened, the FOM from the FOM supply source is supplied from the chemical solution pipe 14 to the chemical solution nozzle 6. Thereby, the FOM is discharged from the chemical liquid nozzle 6.
The nozzle moving unit 22 horizontally moves the chemical liquid nozzle 6 along a trajectory passing through the center of the upper surface of the substrate W in plan view by rotating the nozzle arm 21 about the swing axis. The nozzle moving unit 22 moves between the processing position where the FOM discharged from the chemical liquid nozzle 6 lands on the upper surface of the substrate W and the home position where the chemical liquid nozzle 6 is set around the spin chuck 5 in plan view. The chemical liquid nozzle 6 is moved horizontally. Further, the nozzle moving unit 22 is configured such that the FOM discharged from the chemical solution nozzle 6 lands on the central portion of the upper surface of the substrate W, and the FOM discharged from the chemical solution nozzle 6 lands on the peripheral portion of the upper surface of the substrate W. The chemical liquid nozzle 6 is moved horizontally between the peripheral position. The center position and the peripheral position are both processing positions.

In addition, the chemical liquid nozzle 6 may be a fixed nozzle whose discharge port is fixedly arranged toward a predetermined position (for example, the center) on the upper surface of the substrate W.
As shown in FIG. 2, the water supply unit 8 includes a water nozzle 41. The water nozzle 41 is, for example, a straight nozzle that discharges a liquid in a continuous flow state, and is fixedly disposed above the spin chuck 5 with its discharge port facing the center of the upper surface of the substrate W. A water pipe 42 to which water from a water supply source is supplied is connected to the water nozzle 41. A water valve 43 for switching supply / stop of water supply from the water nozzle 41 is provided at an intermediate portion of the water pipe 42. When the water valve 43 is opened, the continuous flow of water supplied from the water pipe 42 to the water nozzle 41 is discharged from a discharge port set at the lower end of the water nozzle 41. When the water valve 43 is closed, the supply of water from the water pipe 42 to the water nozzle 41 is stopped. The water is, for example, deionized water (DIW). Not limited to DIW, it may be any of carbonated water, electrolytic ionic water, hydrogen water, ozone water, and hydrochloric acid water having a diluted concentration (for example, about 10 ppm to 100 ppm).

The water nozzles 41 do not need to be fixedly arranged with respect to the spin chuck 5, for example, are attached to an arm that can swing in a horizontal plane above the spin chuck 5, and A so-called scan nozzle configuration may be adopted in which the liquid landing position on the upper surface of the substrate W is scanned by the swing.
The cleaning brush 10 is a sponge-like scrub member made of, for example, PVA (polyvinyl alcohol), and has a columnar shape. The cleaning brush 10 has a flat cleaning surface 10a on its lower surface. The cleaning surface 10a functions as a contact surface that contacts the upper surface of the substrate W.

  The cleaning brush drive unit 11 includes a swing arm 47 that holds the cleaning brush 10 at the tip, and an arm drive unit 48 that drives the swing arm 47. The arm drive unit 48 is configured to be able to swing the swing arm 47 around a swing axis A2 extending in the vertical direction, and to move the swing arm 47 up and down. With this configuration, when the substrate W is rotating while being held by the spin chuck 5, the cleaning brush 10 is moved between a position above the substrate W and a home position set on the side of the spin chuck 5. It can be moved horizontally.

Further, the cleaning surface 10a of the cleaning brush 10 is pressed against the upper surface (back surface Wb) of the substrate W, and the pressing position of the cleaning brush 10 is set between the central portion of the substrate W and the peripheral portion of the substrate W in the radial direction of the substrate W. Can be moved (scanned).
At the time of this scrub cleaning, water (for example, deionized water) is supplied from the water nozzle 41, so that foreign matter on the back surface Wb of the substrate W can be easily removed. The rubbed foreign matter can be discharged out of the substrate W.

  As described above with reference to FIG. 7, the movable pin 110 has the upper shaft portion 152 at a position eccentric from the rotation axis A2. That is, the center axis B of the upper shaft portion 152 is shifted from the rotation axis A2. Accordingly, the rotation of the lower shaft portion 151 causes the upper shaft portion 152 to move to the far open position (see FIGS. 8A and 9A to be described later) apart from the rotation axis A1 (to the center axis B) and the rotation axis to the center axis B. It will be displaced between the holding position approaching A1 (see FIGS. 8B and 9B described later). The upper shaft 152 of the movable pin 110 is urged to the open position by an elastic pressing force of an elastic pressing member (not shown) such as a spring. When the movable pin 110 is located at the open position, a predetermined gap is formed between the movable pin 110 and the peripheral end surface of the substrate W.

  FIGS. 8A and 8B are schematic diagrams showing states of the movable pins 110 included in the first movable pin group 111 with the elevating operation of the first open permanent magnet 125. FIGS. 9A and 9B are schematic diagrams illustrating states of the movable pins 110 included in the second movable pin group 112 in association with the elevating operation of the second open permanent magnet 127. FIG. 8A shows a state where the first open permanent magnet 125 is at the lower position (second position), and FIG. 8B shows a state where the first open permanent magnet 125 is at the upper position. FIG. 9A shows a state in which the second open permanent magnet 127 is in the lower position, and FIG. 8B shows a state in which the second open permanent magnet 127 is in the upper position.

  Even if the angular positions of the first open permanent magnet 125 and the first drive permanent magnet 156A are aligned, as shown in FIG. 8A, in a state where the first open permanent magnet 125 is at the lower position. The magnetic force from the first open permanent magnet 125 does not act on the first drive permanent magnet 156A. Therefore, the movable pins 110 included in the first movable pin group 111 are located at the holding positions. In this state, the first driving permanent magnet 156A is disposed such that, for example, the N pole faces radially inward of the turntable 107 and the S pole faces radially outward of the turntable 107. I have.

  From the state shown in FIG. 8A, the first open permanent magnet 125 is raised and arranged at the upper position. When the upper surface of the first open permanent magnet 125 approaches the first drive permanent magnet 156A, an attraction magnetic force is generated in the first drive permanent magnet 156A, and the first drive permanent magnet 156A and the first drive permanent magnet 156A are connected to each other. Between the open permanent magnet 125 and the open permanent magnet 125. In a state where the first open permanent magnet 125 is arranged at the upper position, the magnitude of the attracting magnetic force acting on the first driving permanent magnet 156A depends on the attracting magnetic force (biasing force) from the first closing permanent magnet 121. As a result, the upper shaft 152 moves from the holding position approaching the rotation axis A1 to the open position separated from the rotation axis A1 (see FIG. 2). Thereby, the movable pins 110 included in the first movable pin group 111 are urged to the open position. In this state, as shown in FIG. 8B, the first driving permanent magnet 156A has, for example, an S pole facing inward in the radial direction of the turntable 107 and an N pole pointing outward in the radial direction of the turntable 107. It is arranged to face.

  Even if the angular positions of the second open permanent magnet 127 and the second drive permanent magnet 156B are aligned, as shown in FIG. 9A, the second open permanent magnet 127 is in the lower position (fourth permanent magnet 156B). Position), the magnetic force from the second open permanent magnet 127 does not act on the second drive permanent magnet 156B. Therefore, the movable pins 110 included in the second movable pin group 112 are located at the holding position. In this state, the second driving permanent magnet 156B is disposed such that, for example, the S pole faces radially inward of the turntable 107 and the N pole faces radially outward of the turntable 107. I have.

  From the state shown in FIG. 9A, the second open permanent magnet 127 is raised and arranged at the upper position. When the upper surface of the second open permanent magnet 127 approaches the second drive permanent magnet 156B, an attraction magnetic force is generated in the second drive permanent magnet 156B, and the second drive permanent magnet 156B and the second drive permanent magnet 156B are connected to each other. Between the open permanent magnet 127 and the open permanent magnet 127. In a state where the second open permanent magnet 127 is arranged at the upper position, the magnitude of the attracting magnetic force acting on the second driving permanent magnet 156B depends on the attracting magnetic force (biasing force) from the second closing permanent magnet 122. As a result, the upper shaft 152 moves from the holding position approaching the rotation axis A1 to the open position separated from the rotation axis A1 (see FIG. 2). Thereby, the movable pins 110 included in the second movable pin group 112 are urged to the open position. In this state, as shown in FIG. 9B, the second driving permanent magnet 156B has, for example, an N-pole pointing inward in the radial direction of the turntable 107 and an S-pole pointing outward in the radial direction of the turntable 107. It is arranged to face.

  FIGS. 10A to 15B are schematic diagrams showing states of the first movable pin group 111 and the second movable pin group 112. FIG. 10A, 11A, 12A, 13A, 14A, and 15A show the states of the driving permanent magnets 156A and 156B, the open permanent magnets 125 and 127, and the open permanent magnets 125 and 127, respectively. 14B and 15B show the open / closed state of each movable pin 110.

  10A and 10B show a state where the first and second open permanent magnets 125 and 127 are both in the upper position, and FIGS. 11A and 11B show a state where the first and second open permanent magnets 125 and 127 are both Shows the state at the lower position. 12A to 13B show a state in which the first open permanent magnet 125 is in the upper position and the second open permanent magnet 127 is in the lower position. FIGS. 13A and 13B show the rotating state of the turntable 107. FIG. 14A and 15B show a state in which the second open permanent magnet 127 is in the upper position and the first open permanent magnet 125 is in the lower position. FIGS. 15A and 15B show the rotating state of the turntable 107. FIG.

  The open permanent magnets 125 and 127 are arranged at equal intervals of 60 ° in the circumferential direction of the turntable 107. The movable pins 110 are also arranged at regular intervals of 60 °. Therefore, as shown in FIGS. 10B, 11B, 12B, 13B, 14B, and 15B, the angular positions of the first open permanent magnets 125 and the first drive permanent magnets 156A are aligned (facing each other), and An opposed state can be created in which the angular positions of each second open permanent magnet 127 and each second drive permanent magnet 156B are aligned (opposed to each other).

  In this opposed state, as shown in FIGS. 10A and 10B, when the first and second open permanent magnets 125 and 127 are both arranged at the upper position, three movable pins included in the first movable pin group 111 are moved. Each of the pins 110 and the three movable pins 110 included in the second movable pin group 112, that is, all of the six movable pins 110 are arranged at the open position (open).

  In the facing state, as shown in FIGS. 11A and 11B, when the first and second open permanent magnets 125 and 127 are both arranged at the lower position, three of the three movable pins 111 included in the first movable pin group 111 are disposed. Each of the movable pins 110 and the three movable pins 110 included in the second movable pin group 112, that is, all of the six movable pins 110 are arranged at the holding position (close).

  In the facing state, as shown in FIGS. 12A and 12B, in a state where the first open permanent magnet 125 is disposed at the upper position and the second open permanent magnet 127 is disposed at the lower position, the first movable pin is disposed. The three movable pins 110 included in the group 111 are arranged at an open position (open), and the three movable pins 110 included in the second movable pin group 112 are arranged at a holding position (close).

  12A and 12B, a state in which the turntable 107 is rotated will be considered. The rotation speed of the turntable 107 is set to a liquid processing speed (for example, about 500 rpm). In the rotating state of the turntable 107, a magnetic field generation area 129A (see FIG. 13A) is formed in an annular area through which the drive permanent magnets 156A and 156B that rotate as the turntable 107 rotates. The circumferential length (angle) of the magnetic field generation region 129A is longer than the corresponding circumferential length (angle) of the first open permanent magnet 125. Since the length (angle) of the first open permanent magnet 125 in the circumferential direction is 60 ° and the three first open permanent magnets 125 are provided in the circumferential direction of the turntable 107, the substrate W When rotated in the rotation direction Dr at a processing speed (for example, about 500 rpm), as shown in FIGS. 13A and 13B, the annular regions through which the driving permanent magnets 156A and 156B rotate with the rotation of the turntable 107 pass. Then, an all-circular annular magnetic field generation region 129A (see FIG. 13A) is formed.

  Since the magnetic field generation region 129A (see FIG. 13A) forms a full-circular ring, the attractive magnetic force from the first open permanent magnet 125 causes the first driving permanent magnet 156A to be independent of the rotating posture of the turntable 107. Act on. Therefore, in the rotating state of the turntable 107, the three movable pins 110 included in the first movable pin group 111 are arranged at the open position (open). The three movable pins 110 included in the second movable pin group 112 are, of course, arranged at a holding position (close). At this time, the substrate W is supported by the three movable pins 110 included in the second movable pin group 112 and is rotated well.

  In the facing state, as shown in FIGS. 14A and 14B, in a state where the second open permanent magnet 127 is disposed at the upper position and the first open permanent magnet 125 is disposed at the lower position, the second movable pin is disposed. The three movable pins 110 included in the group 112 are arranged at the open position (open), and the three movable pins 110 included in the first movable pin group 111 are arranged at the holding position (close).

  14A and 14B, a state in which the turntable 107 is rotated will be considered. The rotation speed of the turntable 107 is set to a liquid processing speed (for example, about 500 rpm). In the rotating state of the turntable 107, a magnetic field generation area 129B (see FIG. 15A) is formed in an annular area through which the driving permanent magnets 156A and 156B that rotate as the turntable 107 rotates. The circumferential length (angle) of the magnetic field generation region 129B is longer than the circumferential length (angle) of the corresponding second open permanent magnet 127. Since the length (angle) in the circumferential direction of the second open permanent magnet 127 is 60 °, and the three second open permanent magnets 127 are provided in the circumferential direction of the turntable 107, the substrate W When rotated in the rotation direction Dr at a processing speed (for example, about 500 rpm), as shown in FIGS. 15A and 15B, an annular area through which the driving permanent magnets 156A and 156B that rotate with the rotation of the turntable 107 passes. Then, an all-circular annular magnetic field generation region 129B (see FIG. 15A) is formed.

  Since the magnetic field generation region 129B (see FIG. 15A) forms a full-circular ring, the attractive magnetic force from the second open permanent magnet 127 causes the second driving permanent magnet 156B to be independent of the rotation posture of the turntable 107. Act on. Therefore, in the rotating state of the turntable 107, the three movable pins 110 included in the second movable pin group 112 are arranged at the open position (open). The three movable pins 110 included in the first movable pin group 111 are, of course, arranged at holding positions (close). At this time, the substrate W is supported by the three movable pins 110 included in the first movable pin group 111 and is rotated well.

  As described above, in the rotating state of the substrate W, the control unit 3 controls the first elevating unit 126 and the second elevating unit 128 to dispose the first open permanent magnet 125 at the upper position, and (See FIGS. 13A and 13B) and a state in which the second open permanent magnet 127 is located in the upper position and the first open permanent magnet 125 is located in the lower position (see FIGS. 13A and 13B). 15A and 15B), the substrate W is in contact with and supported by the three movable pins 110 included in the first movable pin group 111, and is included in the second movable pin group 112. The state in which the substrate W is in contact with and supported by the three movable pins 110 can be switched.

FIG. 16 is a block diagram for explaining an electrical configuration of a main part of the substrate processing apparatus 1.
The control unit 3 controls the operations of the rotary drive unit 103, the nozzle moving unit 22, the arm drive unit 48, the first to third elevating units 126, 128, and 130 according to a predetermined program. Further, the control unit 3 controls opening and closing operations of the chemical liquid valve 15, the water valve 43, the inert gas valve 173, the inert gas flow control valve 174, and the like.

  FIG. 17 is a flowchart illustrating an example of a cleaning process as a processing liquid process performed by the processing unit 2. FIG. 18 is a time chart for explaining the processing liquid processing. 19A to 19K are schematic views for explaining an example of the processing liquid processing. FIGS. 20A and 20B are diagrams showing the state in which the processing liquid wraps around when the movable pin 110 is at the holding position and when the movable pin 110 is at the open position. FIG. 20C is a cross-sectional view illustrating the flow of the processing liquid and the inert gas in the peripheral portion of the substrate W.

This treatment liquid treatment will be described with reference to FIGS. 1, 2 to 7, 17 and 18. 19A to 19K and FIGS. 20A to 20C are appropriately referred to.
The processing unit 2 targets a substrate W (hereinafter, may be referred to as an “uncleaned substrate”) W after being processed by a preprocessing device such as an annealing device or a film forming device. An example of the substrate W is a circular silicon substrate. The processing unit 2 cleans, for example, the back surface Wb (one main surface; non-device forming surface) of the substrate W opposite to the front surface Wa (the other main surface; device forming surface).

  The carrier C containing the uncleaned substrate W is transported from the pre-processing apparatus to the substrate processing apparatus 1 and placed on the load port LP. The substrate W is accommodated in the carrier C with the surface Wa of the substrate W facing upward. The control unit 3 causes the indexer robot IR to transfer the substrate W from the carrier C to the reversing unit TU with the front surface Wa facing upward. Then, the control unit 3 reverses the transported substrate W by the reversing unit TU (S1: substrate reversal). Thereby, the back surface Wb of the substrate W is turned upward. Thereafter, the control unit 3 takes out the substrate W from the reversing unit TU by the hand H2 of the center robot CR, and carries the substrate W into the processing unit 2 with its back surface Wb facing upward (step S2).

  Prior to loading of the substrate W, the chemical solution nozzle 6 is retracted to a home position set on the side of the spin chuck 5. The cleaning brush 10 is also retracted to a home position set on the side of the spin chuck 5. The angular positions of each first open permanent magnet 125 and each first drive permanent magnet 156A are opposed to each other, and the angle between each second open permanent magnet 127 and each second drive permanent magnet 156B. The rotation direction posture of the turntable 107 is determined so that the positions are opposed to each other. Further, the first open permanent magnet 125 and the second open permanent magnet 127 are both arranged at the upper position. At this time, the state shown in FIGS. 10A and 10B is obtained. In this state, each of the three movable pins 110 included in the first movable pin group 111 and the three movable pins 110 included in the second movable pin group 112, that is, the six movable pins 110 All are located in open positions.

  Further, since the second levitation magnet 129 is disposed at the lower position, and thus the second levitation magnet 129 is largely separated from the turntable 107 downward, the second levitation magnet 129 and the first The repulsive magnetic force acting between the levitation magnet 160 and the levitation magnet 160 is small. Therefore, the protection disk 115 is located at a lower position close to the upper surface of the turntable 107. Therefore, between the substrate holding height of the movable pin 110 and the upper surface of the protection disk 115, a sufficient space for the hand H2 of the center robot CR to enter is secured.

The hand H2 of the center robot CR transports the substrate W above the spin chuck 5 while holding the substrate W at a position higher than the upper end of the movable pin 110. Thereafter, the hand H2 of the center robot CR descends toward the upper surface of the turntable 107 as shown in FIG. 19A.
Next, the control unit 3 controls the first and second elevating units 126 and 128 to lower the first open permanent magnet 125 and the second open permanent magnet 127 toward the lower position, and move the lower and upper positions to the lower position. It is kept as it is (step S3). At this time, the state shown in FIGS. 10A and 10B is obtained. Therefore, thereby, all the movable pins 110 are driven from the open position to the holding position, and are held at the holding position. Thereby, the substrate W is gripped by the six movable pins 110. The substrate W is held by the spin chuck 5 with its front surface Wa facing downward and its back surface Wb facing upward.

Thereafter, the hand H2 of the center robot CR retreats to the side of the spin chuck 5 through the space between the movable pins 110.
Further, the control unit 3 controls the third lifting unit 130 to raise the second levitation magnet 129 toward the upper position as shown in FIG. 19B. The distance between the levitating magnets 129 and 160 is reduced, and accordingly, the repulsive force acting between them is increased. The repulsive magnetic force causes the protection disk 115 to float from the upper surface of the turntable 107 toward the substrate W. Then, when the first open permanent magnet 125 reaches the upper position, the protection disk 115 reaches the approach position where the protective disk 115 approaches the surface Wa (lower surface) of the substrate W at a small interval, and is formed at the lower end of the guide shaft 117. The flange 120 contacts the linear bearing 118. Thus, the protection disk 115 is held at the approach position. In this state, the control unit 3 opens the inert gas valve 173 and starts the supply of the inert gas as shown in FIG. 19B (S4: start of supply of the inert gas). The supplied inert gas is discharged from the upper end of the inert gas supply pipe 170, and a narrow space between the protection disk 115 at the approaching position and the front surface Wa (lower surface) of the substrate W by the function of the rectifying member 186 and the like. Is radially blown around the rotation axis A1.

  Thereafter, the control unit 3 controls the rotation drive unit 103 to start rotating the turntable 107 (turntable rotation step), thereby rotating the substrate W around the rotation axis A1 as shown in FIG. 19C. (Step S5). The rotation speed of the substrate W is increased to a predetermined liquid processing speed (for example, 500 rpm within a range of 300 to 1500 rpm), and is maintained at that liquid processing speed.

  After the rotation speed of the substrate W reaches the liquid processing speed, the control unit 3 performs a FOM supply step (a processing liquid supply step; step S6) of supplying the FOM to the back surface Wb of the substrate W as shown in FIG. In the FOM supply step (S6), the control unit 3 controls the nozzle moving unit 22 to move the chemical liquid nozzle 6 from the home position to the center position. Thereby, the chemical liquid nozzle 6 is arranged above the central portion of the substrate W. After the chemical liquid nozzle 6 is disposed above the substrate W, the control unit 3 opens the chemical liquid valve 15 to discharge the FOM from the discharge port of the chemical liquid nozzle 6 and immerse the liquid in the central portion of the back surface Wb of the substrate W. I do. The FOM supplied to the central portion of the back surface Wb of the substrate W receives the centrifugal force due to the rotation of the substrate W and radially spreads the back surface Wb of the substrate W toward the peripheral portion. Therefore, the FOM can be spread over the entire area of the back surface Wb of the substrate W.

  In the FOM supply step (S6), a silicon oxide film is formed on the back surface Wb of the substrate W, which is a silicon substrate, by the oxidizing action of ozone contained in the FOM. In addition, due to the oxide film etching action of hydrofluoric acid contained in the FOM, scratches (chips, dents, etc.) formed on the back surface Wb of the substrate W are removed, and foreign matter (particles, impurities, The back surface Wb of the substrate W is also removed.

  In the FOM supply step (T6), the inert gas discharged from the upper end of the inert gas supply pipe 170 causes the protective disk 115 and the front surface Wa (lower surface) of the substrate W to approach each other by the function of the rectifying member 186 and the like. Is radially blown around the rotation axis A1. As shown in FIG. 20C, the inert gas is further supplied to a throttle 190 (first step 190a and a first step 190a) formed on an annular plate 192 of an annular cover 191 arranged on the peripheral edge of the protection disk 115. It is accelerated by an orifice formed between the second step portion 190b) and the peripheral portion of the substrate W, and forms a high-speed blown air stream on the side of the substrate W. In this embodiment, the supply of the inert gas to the surface Wa (lower surface) of the substrate W using the protection disk 115 completely prevents the processing liquid (chemical solution or rinsing liquid) from flowing to the surface Wa (lower surface) of the substrate W. Instead of preventing the processing liquid, the processing liquid is allowed to flow only in the peripheral region of the front surface Wa (lower surface) of the substrate W (a minute range of about 1.0 mm from the peripheral end of the substrate W), and the peripheral region of the front surface Wa (lower surface) is removed. Has been washed. Then, by forming a high-speed blown airflow, the amount of wraparound is accurately controlled. The wraparound amount depends on the supply flow rate of the processing liquid to the upper surface of the substrate W, the supply flow rate of the inert gas to the lower surface of the substrate W, the rotation speed of the substrate W, and the like.

In the FOM supply step (S6), the substrate W is supported by the three movable pins 110 during the execution of the step. Further, the substrate W is contacted and supported by the three movable pins 110 included in the first movable pin group 111, and the substrate W is controlled by the three movable pins 110 included in the second movable pin group 112. Switch to the state of contact support.
Specifically, when a predetermined period has elapsed from the start of the FOM discharge, the control unit 3 controls the first lifting / lowering unit 126, and as shown in FIG. The open permanent magnet 125 is raised toward the upper position and held at the upper position. Thereby, the first open permanent magnet 125 is arranged at the upper position and the second open permanent magnet 127 is arranged at the lower position (see FIGS. 13A and 13B), and is included in the first movable pin group 111. The three movable pins 110 are arranged at the open position from the previous holding position. Thus, the substrate W is brought into contact with and supported by the three movable pins 110 included in the second movable pin group 112 (first magnet arrangement step).

  When a predetermined period (for example, 10 seconds) elapses from the rising of the first open permanent magnet 125, the control unit 3 controls the first elevating unit 126, and as shown in FIG. The magnet 125 is lowered toward the lower position and held at the lower position. As a result, the first open permanent magnet 125 and the second open permanent magnet 127 are both located at the lower position, and the three movable pins 110 included in the first movable pin group 111 return to the open position. Thus, the substrate W is again brought into a state in which the substrate W is contacted and supported by the six movable pins 110 in total.

  When a predetermined period (for example, 3 seconds) has elapsed since the lowering of the first open permanent magnet 125, the control unit 3 controls the second lifting / lowering unit 128 to move to the lower position as shown in FIG. 19E. The second permanent magnet 127 is moved upward to the upper position and held at the upper position. Thus, the state where the second open permanent magnet 127 is arranged at the upper position and the first open permanent magnet 125 is arranged at the lower position (see FIGS. 15A and 15B) is included in the second movable pin group 112. The three movable pins 110 are arranged at the open position from the previous holding position. As a result, the substrate W is brought into contact with and supported by the three movable pins 110 included in the first movable pin group 111 (second magnet arrangement step).

  When a predetermined period (for example, 10 seconds) elapses from the rising of the second open permanent magnet 127, the control unit 3 controls the second elevating unit 128 to turn the second open permanent magnet 127 to the lower position. Down and hold it in the lower position. Thereby, the first open permanent magnet 125 and the second open permanent magnet 127 are both located at the lower position, and the three movable pins 110 included in the second movable pin group 112 return to the open position. Thus, the substrate W is again brought into a state in which the substrate W is contacted and supported by the six movable pins 110 in total.

As described above, by switching between the state in which only the first movable pin group 111 supports and contacts the substrate W and the state in which only the second movable pin group 112 supports and contacts the substrate W, the FOM supply is performed. In the step (S6), the contact support position of the movable pin 110 at the peripheral edge of the substrate W in the rotating state can be changed.
The wraparound of the FOM at the intended support positions (six places in the circumferential direction) of the movable pin 110 on the substrate W will be examined. In a state where the movable pin 110 is located at the holding position, the FOM supplied to the upper surface of the substrate W interferes with the upper shaft 152 that contacts the peripheral end surface of the substrate W as shown in FIG. Therefore, in a state where the movable pin 110 is located at the holding position at the intended support position (six positions in the circumferential direction), the FOM supplied to the upper surface of the substrate W is transferred to the lower surface of the substrate W via the peripheral end surface of the substrate W. Cannot be wrapped around the peripheral region of.

On the other hand, when the movable pin 110 is located at the open position, a predetermined gap is formed between the movable pin 110 and the peripheral end surface of the substrate W, as shown in FIG. 20B. The FOM supplied to the upper surface of the substrate W through the gap can be routed to the peripheral region of the lower surface of the substrate W via the peripheral end surface of the substrate W.
When a predetermined period has elapsed from the start of FOM discharge, the FOM supply step (S6) ends. Specifically, the control unit 3 closes the chemical solution valve 15 and stops the discharge of the FOM from the chemical solution nozzle 6. Further, the control unit 3 moves the chemical liquid nozzle 6 from the center position to the home position. Thereby, the chemical liquid nozzle 6 is retracted from above the substrate W.

In the above description in the FOM supply step (S6), the case where the substrate W is supported only by the first movable pin group 111 and the substrate W is supported only by the second movable pin group 112 once is described. However, in the FOM supply step (S6), support by one of these movable pin groups 111 and 112 may be performed a plurality of times.
Subsequent to the end of the FOM supply step (S6), supply of water as a rinsing liquid to the back surface Wb of the substrate W is started (S7; rinsing step; processing liquid supply step).

  Specifically, the control unit 3 opens the water valve 43 and causes the water nozzle 41 to discharge water toward the center of the back surface Wb of the substrate W, as shown in FIG. 19F. The water discharged from the water nozzle 41 lands on the center of the back surface Wb of the substrate W covered by the FOM. The water that has reached the center of the back surface Wb of the substrate W flows on the back surface Wb of the substrate W toward the peripheral portion of the substrate W under the centrifugal force due to the rotation of the substrate W, and reaches the entire area of the back surface Wb of the substrate W. And spread. Therefore, the FOM on the substrate W is flushed outward by the water and discharged to the periphery of the substrate W. As a result, the FOM attached to the back surface Wb of the substrate W is replaced with water.

In the rinsing step (S7), the substrate W is supported by the three movable pins 110 during the execution of the step. Further, the substrate W is contacted and supported by the three movable pins 110 included in the first movable pin group 111, and the substrate W is controlled by the three movable pins 110 included in the second movable pin group 112. Switch to the state of contact support.
Specifically, when a predetermined period has elapsed from the start of water discharge, the control unit 3 controls the first lifting / lowering unit 126, and as shown in FIG. The open permanent magnet 125 is raised toward the upper position and held at the upper position. Thus, the substrate W is brought into contact with and supported by the three movable pins 110 included in the second movable pin group 112 (first magnet arrangement step).

When a predetermined period (for example, 10 seconds) elapses from the rising of the first open permanent magnet 125, the control unit 3 controls the first elevating unit 126, and as shown in FIG. 19F, the first open permanent magnet. The magnet 125 is lowered toward the lower position and held at the lower position. As a result, the substrate W is brought into contact with the movable pins 110 again by a total of six pins.
When a predetermined period (for example, 3 seconds) has elapsed since the lowering of the first open permanent magnet 125, the control unit 3 controls the second elevating unit 128 to move the lower unit to the lower position as shown in FIG. 19H. The second permanent magnet 127 is moved upward to the upper position and held at the upper position. As a result, the substrate W is brought into contact with and supported by the three movable pins 110 included in the first movable pin group 111 (second magnet arrangement step).

When a predetermined period (for example, 10 seconds) elapses from the rise of the second open permanent magnet 127, the control unit 3 controls the second elevating unit 128 to lower the open permanent magnet 127 toward the lower position. , In the lower position. As a result, the substrate W is brought into contact with the movable pins 110 again by a total of six pins.
As described above, by switching between the state in which only the first movable pin group 111 is in contact and supporting the substrate W and the state in which only the second movable pin group 112 is in contact with and supporting the substrate W, the rinsing step is performed. In (S7), the contact support position of the movable pin 110 at the periphery of the substrate W in the rotating state can be changed.

  Consideration of water spillage at desired support positions (six circumferential positions) of the movable pins 110 on the substrate W will be described. In the state where the movable pin 110 is located at the holding position, the water supplied to the upper surface of the substrate W interferes with the upper shaft 152 that contacts the peripheral end surface of the substrate W as shown in FIG. Therefore, when the movable pin 110 is located at the holding position at the intended support position (six places in the circumferential direction), the water supplied to the upper surface of the substrate W is transferred to the lower surface of the substrate W via the peripheral end surface of the substrate W. Cannot be wrapped around the peripheral region of.

  On the other hand, when the movable pin 110 is located at the open position, a predetermined gap is formed between the movable pin 110 and the peripheral end surface of the substrate W, as shown in FIG. 20B. The water supplied to the upper surface of the substrate W through the gap can flow to the peripheral region on the lower surface of the substrate W via the peripheral end surface of the substrate W. Thereby, the FOM attached to the peripheral end surface of the substrate W and the peripheral region on the lower surface of the substrate W can be washed away.

In the above description of the rinsing step (S7), the case where the support of the substrate W by only the first movable pin group 111 and the support of the substrate W by only the second movable pin group 112 are performed once is described. However, in the rinsing step (S7), support by one of these movable pin groups 111 and 112 may be performed a plurality of times.
After a predetermined period has elapsed from the start of water discharge, the control unit 3 controls the arm drive unit 48 to execute scrub cleaning of the back surface Wb of the substrate W by the cleaning brush 10 as shown in FIG. 19F ( S8: Brush cleaning step, treatment liquid supply step). Thus, scrub cleaning by the cleaning brush 10 is performed on the back surface Wb of the substrate W while supplying water. Specifically, the control unit 3 controls the arm drive unit 48 to swing the swing arm 47 around the swing axis A2, thereby disposing the cleaning brush 10 from the home position to above the substrate W. Then, the cleaning brush 10 is lowered, and the cleaning surface 10a of the cleaning brush 10 is pressed against the back surface Wb of the substrate W. Then, the control unit 3 controls the arm drive unit 48 as shown in FIG. 19G to move (scan) the pressing position of the cleaning brush 10 between the central portion of the substrate W and the peripheral portion of the substrate W. Let it. Thus, the pressing position of the cleaning brush 10 scans the entire area of the rear surface Wb of the substrate W, and the entire area of the rear surface Wb of the substrate W is scrubbed by the cleaning brush 10. In the brush cleaning step (S8), the foreign matter separated in the FOM supply step (S6) is scraped off by scrubbing with the cleaning brush 10. The foreign matter scraped off by the cleaning brush 10 is washed away with water. Thereby, the separated foreign matter can be removed from the back surface Wb of the substrate W.

  After the cleaning brush 10 has been moved forward a predetermined number of times (for example, four times), the control unit 3 controls the arm driving unit 48 to return the cleaning brush 10 to the home position from above the spin chuck 5. Thus, the brush cleaning step (S8) ends. Further, the control unit 3 keeps the water valve 43 open. As a result, water as a rinsing liquid is supplied to the back surface Wb of the substrate W, and foreign matter scraped by the cleaning brush 10 is discharged out of the substrate W (see FIG. 19I. S9: final rinsing step; processing liquid supply step). ).

  In addition, the case where the substrate W is supported only by the first movable pin group 111 and the substrate W is supported only by the second movable pin group 112, which has been described in the rinsing step (S7), once, is described. Such support may be performed in at least one of the rinsing step (S7), the brush cleaning step (S8), and the final rinsing step (S9). Of course, it may be performed in all three steps, or may be performed in two of these steps.

  When a predetermined period has elapsed from the start of water supply, the control unit 3 closes the water valve 43 and stops the discharge of water from the water nozzle 41. Further, the control unit 3 closes the protective liquid valve 45 and stops the discharge of the inert gas from the inert gas supply pipe 170. Further, the control unit 3 controls the first elevating unit 126 to lower the first open permanent magnet 125 to the lower position. Thereafter, the substrate W is sandwiched by the six movable pins 110, whereby the substrate W is firmly held.

  Next, a spin drying step (Step S10) of drying the substrate W is performed. Specifically, as shown in FIG. 19J, the control unit 3 controls the rotation drive unit 17 so that the drying rotation speed is higher than the rotation speed from the FOM supply step (S6) to the final rinsing step (S9). (For example, several thousand rpm), and the substrate W is rotated at a drying rotation speed. Accordingly, a large centrifugal force is applied to the liquid on the substrate W, and the liquid adhering to the substrate W is shaken off around the substrate W. Thus, the liquid is removed from the substrate W, and the substrate W is dried. At this time, since the substrate W is held by the six movable pins 110, the substrate W can be rotated at high speed while firmly holding it.

Then, when a predetermined period has elapsed since the start of the high-speed rotation of the substrate W, the control unit 3 controls the rotation drive unit 17 to stop the rotation of the substrate W by the spin chuck 5 (step S11).
Thereafter, the control unit 3 controls the third lifting unit 130 to lower the second levitation magnet 129 to the lower position (step S12). As a result, the distance between the second levitation magnet 129 and the first levitation magnet 160 increases, and the magnetic repulsion between them decreases. Accordingly, the protection disk 115 descends toward the upper surface of the turntable 107. Accordingly, a space is secured between the upper surface of the protection disk 115 and the surface Wa (lower surface) of the substrate W so that the hand H2 of the center robot CR can enter.

Further, the control unit 3 controls the first and second elevating units 126 and 128 to raise the first open permanent magnet 125 and the second open permanent magnet 127 to the upper position, respectively, and to move the permanent magnets to the upper position. Hold. As a result, all of the six movable pins 110 are arranged at the open position, whereby the grip of the substrate W is released.
Next, the substrate W is carried out of the processing chamber 4 (Step S13). Specifically, the control unit 3 controls the center robot CR in a state where all the nozzles and the like are retracted from above the spin chuck 5, and moves the hand H2 to the protection disk 115 and the substrate as shown in FIG. It is caused to enter the space secured between the W and the front surface Wa (lower surface). Then, the hand H2 scoops up the substrate W held by the movable pins 110, and then retreats to the side of the spin chuck 5. As a result, the substrate W after the cleaning processing is carried out of the processing chamber 4.

  The control unit 3 causes the hand H2 of the center robot CR to transport the cleaned substrate W to the reversing unit TU. Then, the control unit 3 reverses the transported substrate W by the reversing unit TU (step S14). Thereby, the surface Wa of the substrate W is directed upward. Thereafter, the control unit 3 takes out the substrate W from the reversing unit TU by the hand H1 of the indexer robot IR, and stores the cleaned substrate W in the carrier C with its front surface Wa facing upward. The carrier C containing the cleaned substrate W is transported from the substrate processing apparatus 1 to a post-processing apparatus such as an exposure apparatus.

  As described above, according to this embodiment, the substrate W is supported by the three movable pins 110 in parallel with the rotation of the turntable 107 and the supply of the processing liquid (S6 to S9 in FIG. 11). The state in which the substrate W is in contact with and supported by the three movable pins 110 included in the movable pin group 111 of the first embodiment, and the state in which the substrate W is contacted and supported by the three movable pins 110 included in the second movable pin group 112. Switch between active and inactive states. The substrate W can be exchanged by the two movable pin groups 111 and 112, whereby the contact support position of the movable pin 110 on the substrate W can be changed. Therefore, the processing liquid (FOM, water) can be supplied to the whole area of the peripheral portion of the substrate W, whereby the peripheral portion of the substrate W can be satisfactorily processed using the processing liquid without any remaining processing. it can.

Further, the substrate processing apparatus 1 according to the first embodiment of the present invention is different from the substrate processing apparatus disclosed in JP-A-2008-135750 in the following two points.
The first point will be described. In Japanese Patent Application Laid-Open No. 2008-135750, magnets (magnets 152b and 162b) have magnetic pole directions along the vertical direction. Further, magnets (magnets 152b and 162b) are connected to first pins (first pins 122, 124, 126) and second pins (second pins 132, 134, 136) via a cam mechanism. . That is, the configuration for opening and closing the first pin and the second pin is very complicated.

  On the other hand, in the first embodiment, the first driving permanent magnet 156A and the second driving permanent magnet 156B have a magnetic pole direction in a direction orthogonal to an axis along the rotation axis A1. Further, the first driving permanent magnet 156A and the second driving permanent magnet 156B are fixed to the support shaft 155 of the movable pin 110. Therefore, a configuration for driving the movable pin 110 to open and close can be realized with a simple configuration.

  The second point will be described. In Japanese Patent Application Laid-Open No. 2008-135750, the magnets (magnets 152b and 162b) each have an annular shape. Therefore, it is necessary to provide the magnet 152b and the magnet 162b in a double annular shape, which may cause the substrate processing apparatus 1 to be enlarged in the radial direction. On the other hand, in the first embodiment, the first driving permanent magnets 156A and the second driving permanent magnets 156B are alternately arranged in the circumferential direction. Therefore, the substrate processing apparatus 1 can be made compact in the radial direction.

  FIG. 21 is an illustrative cross-sectional view for explaining a configuration example of the processing unit 202 according to the second embodiment of the present invention. FIG. 22 is a cross-sectional view for explaining a configuration example of the annular cover 291 of the spin chuck 205 provided in the processing unit 202. FIG. 23 is a plan view for explaining a more specific configuration of the spin chuck 205. FIG. 21 is a view as viewed from the section line XXI-XXI in FIG.

In the second embodiment, portions corresponding to the respective portions shown in the first embodiment are denoted by the same reference numerals as in FIGS. 1 to 20C, and description thereof will be omitted.
The processing unit 202 according to the second embodiment includes a spin chuck 205 as a substrate holding and rotating device. The spin chuck 205 according to the second embodiment is different from the spin chuck 5 according to the first embodiment in that an opening / closing switching permanent magnet 210A as an urging magnet (first and second urging magnets) is provided. , 210B are provided so as to be able to move up and down together with the protection disk 115. In addition, the opening and closing switching permanent magnets 210A and 210B are moved up and down by the operation of moving the protection disk 115 up and down by the third elevating unit 130. Further, the open / close switching permanent magnets 210A and 210B do not bias the movable pin 110 to one or the other of the holding position and the opening position, but switch between the biasing state to the holding position and the biasing state to the opening position. For the magnet. That is, a configuration is employed in which the opening and closing of the movable pin 110 can be switched by raising and lowering the protection disk 115 by the third lifting unit 130.

More specifically, the annular cover 291 is fixed to the protection disk 115, and the open / close switching permanent magnets 210A and 210B are embedded inside the annular cover 291.
The annular ring cover 291 protects the peripheral edge of the upper surface of the protection disk 115 and the peripheral edge of the protection disk 115. The annular cover 291 is attached to the outer periphery of the protection disk 115 via a fixing unit 203 including a fastening member such as a bolt. The peripheral edge of the upper surface of the protection disk 115 and the peripheral edge of the protection disk 115. The annular cover 291 includes an annular plate portion 292 that protrudes radially outward from the peripheral edge of the upper surface in the horizontal direction, and a cylindrical portion 293 that hangs down from the peripheral end of the annular plate portion 292. The outer periphery of the annular plate portion 292 is located outside the peripheral end of the turntable 107. The annular plate portion 292 and the cylindrical portion 293 are integrally formed using, for example, a resin material having chemical resistance. A notch 294 (see FIG. 23) for avoiding the movable pin 110 is formed at a position corresponding to the movable pin 110 on the inner periphery of the annular plate portion 292. The notch 294 is formed so as to border the movable pin 110 at a certain interval from the outer peripheral surface of the movable pin 110. The annular plate portion 292 and the cylindrical portion 293 are integrally formed using, for example, a resin material having chemical resistance.

  The annular plate portion 192 of the annular cover 291 has, on its upper surface, a throttle portion 290 (similar to the throttle portion 190 in FIG. 20C) for narrowing the flow path of the inert gas at the periphery of the substrate W held by the movable pins 110. doing. Since the flow rate of the inert gas flow blown outward from the space between the annular cover 291 and the lower surface of the substrate W is increased by the constricted portion 290, the processing liquid (chemical solution or rinse) on the upper surface of the substrate W is increased. Liquid) can be reliably prevented or suppressed from entering inside the peripheral edge of the lower surface of the substrate W.

  In the cylindrical portion 293, the same number (six in this embodiment) of open / close switching permanent magnets 210A and 210B as the number of the movable pins 110 are embedded. The plurality of open / close switching permanent magnets 210A and 210B are arranged at intervals in the circumferential direction. Each of the open / close switching permanent magnets 210A and 210B has a rod shape, and is embedded in the cylindrical portion 293 so as to extend vertically. The open / close switching permanent magnet includes a first opening / closing switching permanent magnet (first urging magnet) 210A, and a second opening / closing switching permanent magnet whose polarity is opposite to that of the first opening / closing switching permanent magnet 210A in the vertical direction. (A second biasing magnet) 210B. The first open / close switching permanent magnet 210A is a permanent magnet for driving the movable pin 110 included in the first movable pin group 111, and the second open / close switching permanent magnet 210B is a second movable pin group 112. Is a permanent magnet for driving the movable pin 110 included in the above. That is, the plurality of open / close switching permanent magnets 210A and 210B are arranged at equal intervals. The first opening / closing switching permanent magnets 210A and the second opening / closing switching permanent magnets 210B are alternately arranged in the circumferential direction. In this embodiment, the first open / close switching permanent magnet 210A has an N-pole portion 211 indicating N polarity formed on the upper end side, and an S-pole portion 212 indicating S polarity formed on the lower end side.

  FIGS. 24A and 24B are schematic diagrams showing states of the movable pins 110 included in the first movable pin group 111 as the protection disk 115 moves up and down. FIGS. 25A and 25B are schematic diagrams showing states of the movable pins 110 included in the second movable pin group 112 as the protection disk 115 moves up and down. FIGS. 24A and 25A show a state where the protection disk 115 is at the approach position (that is, the upper position), and FIGS. 24B and 25B show a state where the protection disk 115 is at the lower position.

As shown in FIGS. 24A and 24B, the first open / close switching permanent magnet 210A has the protection disk 115 in the approaching position, and the N pole portion 211 on the upper end side approaches the first driving permanent magnet 156A, thereby protecting the first opening permanent magnet 156A. When the disk 115 is in the lower position, the S pole portion 212 at the lower end is disposed so as to approach the first driving permanent magnet 156A.
As shown in FIGS. 25A and 25B, the second opening / closing switching permanent magnet 210B allows the S pole portion 212 on the upper end side to approach the second drive permanent magnet 156B when the protection disk 115 is in the approaching position, thereby protecting the second drive permanent magnet 156B. When the disk 115 is at the lower position, the N pole portion 211 at the lower end is arranged so as to approach the second driving permanent magnet 156B.

  As described above in the first embodiment, when the second levitation magnet 129 is at the upper position (see FIGS. 19B, 24B, and 25B), the second levitation magnet 129 and the first levitation magnet The protection disk 115 is held at an approach position close to the lower surface of the substrate W by the action of the repulsive magnetic force generated between the protection disk 115 and the substrate W. On the other hand, when the second levitation magnet 129 is at the lower position (see FIGS. 19A, 24A, and 25A) separated downward from the upper position, the second levitation magnet 129 and the first levitation magnet The repulsive magnetic force between the magnet 160 and the magnet 160 is small. Therefore, the protection disk 115 is held at a lower position near the upper surface of the turntable 107 by its own weight.

  When the protection disk 115 is in the lower position, as shown in FIG. 24A, the N pole portion 211 on the upper end side of the first open / close switching permanent magnet 210A approaches the first drive permanent magnet 156A. In this state, of the first opening / closing switching permanent magnet 210A, only the magnetic force from the N pole portion 211 acts on the first driving permanent magnet 156A, and the magnetic force from the S pole portion 212 becomes the first driving permanent magnet. It does not act on the magnet 156A. Therefore, the first driving permanent magnet 156A receives the magnetic force from the first opening / closing switching permanent magnet 210A, and as shown in FIG. 24A, the N pole faces inward in the radial direction of the turntable 107 and S The poles are arranged in a posture facing radially outward of the turntable 107. In this state, the upper shaft portion 152 of the movable pin 110 included in the first movable pin group 111 is located at a far open position away from the rotation axis A1 (see FIG. 21).

  In this state (the state where the protection disk 115 is at the lower position), as shown in FIG. 25A, the S pole portion 212 on the upper end side of the second opening / closing switching permanent magnet 210B is moved to the second driving permanent magnet 156B. Approach. In this state, of the second opening / closing switching permanent magnet 210B, only the magnetic force from the S pole portion 212 acts on the second driving permanent magnet 156B, and the magnetic force from the N pole portion 211 becomes the second driving permanent magnet. Does not act on magnet 156B. Therefore, the second driving permanent magnet 156B receives the magnetic force from the second opening / closing switching permanent magnet 210B, and as shown in FIG. 25A, the S pole faces inward in the radial direction of the turntable 107 and N The poles are arranged in a posture facing radially outward of the turntable 107. In this state, in this state, the upper shaft portion 152 of the movable pin 110 included in the second movable pin group 112 is located at a far open position away from the rotation axis A1 (see FIG. 21).

From the state shown in FIGS. 24A and 25A, the second levitation magnet 129 (see FIG. 21) is raised, and the protection disk 115 is levitated. As the protection disk 115 floats, the first and second open / close switching permanent magnets 210A and 210B also rise.
Then, in a state where the protection disk 115 is located at the approach position, as shown in FIG. 24B, the S pole portion 212 on the lower end side of the first open / close switching permanent magnet 210A approaches the first drive permanent magnet 156A. I do. In this state, of the first opening / closing switching permanent magnet 210A, only the magnetic force from the S pole portion 212 acts on the first driving permanent magnet 156A, and the magnetic force from the N pole portion 211 becomes the first driving permanent magnet. It does not act on the magnet 156A. Therefore, the first driving permanent magnet 156A receives the magnetic force from the first opening / closing switching permanent magnet 210A, and as shown in FIG. 24B, the S pole faces inward in the radial direction of the turntable 107 and N The poles are oriented so as to face outward in the radial direction of the turntable 107. In this state, the upper shaft 152 of the movable pin 110 included in the first movable pin group 111 moves to a holding position closer to the rotation axis A1 than the open position. As a result, the movable pins 110 included in the first movable pin group 111 are urged to the holding position.

  In this state (the state in which the protection disk 115 is located at the approach position), as shown in FIG. 25B, the N pole portion 211 on the lower end side of the second opening / closing switching permanent magnet 210B is driven by the second drive permanent magnet. It approaches the magnet 156B. In this state, of the second opening / closing switching permanent magnet 210B, only the magnetic force from the N pole portion 211 acts on the second driving permanent magnet 156B, and the magnetic force from the S pole portion 212 becomes the second driving permanent magnet. Does not act on magnet 156B. Therefore, receiving the magnetic force from the second opening / closing switching permanent magnet 210B, the second driving permanent magnet 156B has the N pole directed inward in the radial direction of the turntable 107 and the S pole as shown in FIG. 25B. The poles are oriented so as to face outward in the radial direction of the turntable 107. In this state, the upper shaft 152 of the movable pin 110 included in the second movable pin group 111 moves to a holding position closer to the rotation axis A1 than the open position. As a result, the movable pins 110 included in the second movable pin group 112 are urged to the holding position.

Also in the processing unit 202 according to the second embodiment, processing equivalent to the processing liquid processing (for example, cleaning processing) shown in FIGS. 17 and 18 is executed. FIG. 27 is a flowchart illustrating an example of a cleaning process as a processing liquid process performed by the processing unit 2.
This processing solution processing will be described with reference to FIGS. 21, 23, 24A, 24B, 25A, 25B, and 26, and FIGS. 27A to 27K as appropriate.

The processing unit 202 cleans the back surface Wb (one main surface; non-device-formed surface) opposite to the front surface Wa (the other main surface; the device-formed surface) of a circular uncleaned substrate such as a silicon substrate.
After the substrate W is reversed by the reversing unit TU (T1: substrate reversal), it is carried into the processing unit 2 by the hand H2 of the center robot CR with the back surface Wb facing upward (step T2). Steps T1 and T2 are the same as steps S1 and S2 shown in FIG. 17, respectively, and thus description thereof will be omitted.

  Before the loading of the substrate W, the second levitation magnet 129 is located at the lower position, and thus the second levitation magnet 129 is largely separated from the turntable 107 downward. The repulsive force acting between the magnet 129 and the first levitation magnet 160 is small. Therefore, the protection disk 115 is located at a lower position close to the upper surface of the turntable 107. Therefore, between the substrate holding height of the movable pin 110 and the upper surface of the protection disk 115, a sufficient space for the hand H2 of the center robot CR to enter is secured.

  Further, since the protection disk 115 is located at the lower position, the N pole portion 211 on the upper end side of the first opening / closing switching permanent magnet 210A approaches the first driving permanent magnet 156A, and the second opening / closing switching. The south pole 212 on the upper end side of the permanent magnet 210B is close to the second driving permanent magnet 156B. In this state, each of the three movable pins 110 included in the first movable pin group 111 and the three movable pins 110 included in the second movable pin group 112, that is, the six movable pins 110 All are located in open positions.

  The hand H2 of the center robot CR transports the substrate W above the spin chuck 5 while holding the substrate W at a position higher than the upper end of the movable pin 110. Thereafter, the hand H2 of the center robot CR descends toward the upper surface of the turntable 107 as shown in FIG. 27A. As a result, the substrate W is delivered to the six movable pins 110 at the open position. Thereafter, the hand H2 of the center robot CR retreats to the side of the spin chuck 5 through the space between the movable pins 110.

  The control unit 3 controls the third lifting unit 130 to raise the second levitation magnet 129 toward the upper position, as shown in FIG. 27B. The distance between the levitating magnets 129 and 160 is reduced, and accordingly, the repulsive force acting between them is increased. The repulsive magnetic force causes the protection disk 115 to float from the upper surface of the turntable 107 toward the substrate W. Then, when the first open permanent magnet 125 reaches the upper position, the protection disk 115 reaches the approach position where the protective disk 115 approaches the surface Wa (lower surface) of the substrate W at a small interval, and is formed at the lower end of the guide shaft 117. The flange 120 contacts the linear bearing 118. Thus, the protection disk 115 is held at the approach position.

  As the protection disk 115 rises from the lower position to the approach position, the N pole portion 211 on the upper end side of the first opening / closing switching permanent magnet 210A separates from the first driving permanent magnet 156A, and The S pole 212 on the lower end side of the open / close switching permanent magnet 210A approaches the first driving permanent magnet 156A. Further, as the protection disk 115 rises from the lower position to the approaching position, the S pole portion 212 on the upper end side of the second opening / closing switching permanent magnet 210B separates from the second driving permanent magnet 156B. The N pole portion 211 on the lower end side of the second opening / closing switching permanent magnet 210B approaches the second driving permanent magnet 156B. Thereby, all the movable pins 110 are driven from the open position to the holding position, and are held at the holding position. As a result, the substrate W is gripped by the six movable pins 110, and the substrate W is held by the spin chuck 5 with its front surface Wa facing downward and its rear surface Wb facing upward.

  Next, the control unit 3 opens the inert gas valve 173 and starts the supply of the inert gas as shown in FIG. 27B (T4: start of supply of the inert gas). Thereafter, the control unit 3 controls the rotation drive unit 103 to start rotating the turntable 107 (turntable rotation step), thereby rotating the substrate W around the rotation axis A1 as shown in FIG. 27C. (Step T5). Steps T4 and T5 are the same as steps S4 and S5 shown in FIG. 17, respectively, and thus description thereof will be omitted.

  After the rotation speed of the substrate W reaches the liquid processing speed, the control unit 3 performs a FOM supply step (a processing liquid supply step; step T6) of supplying the FOM to the back surface Wb of the substrate W. In step T6, the supporting of the substrate W by only the first movable pin group 111 and the supporting of the substrate W by only the second movable pin group 112 are performed once or more while supplying the FOM to the back surface Wb of the substrate W. This is common to step T6 shown in FIG.

  The FOM supply step (T6) is a step equivalent to the FOM supply step (S6) according to the first embodiment, as shown in FIGS. 27C to 27E. In the FOM supply step (T6), the substrate W is supported not by the six movable pins 110 but by the three movable pins 110 during a part of the period. Further, the substrate W is contacted and supported by the three movable pins 110 included in the first movable pin group 111, and the substrate W is controlled by the three movable pins 110 included in the second movable pin group 112. The state of contact support is switched.

  Specifically, when the substrate W is contacted and supported by the three movable pins 110 included in the second movable pin group 112, the control unit 3 controls the first elevating unit 126 to As shown in (1), the first open permanent magnet 125 which has been at the lower position is raised toward the upper position, and is disposed at the upper position. As the first permanent magnet 125 rises, the upper surface of the first permanent magnet 125 approaches the first driving permanent magnet 156A. Thereby, an attractive magnetic force is generated in the first drive permanent magnet 156A, and an attractive force is generated between the first drive permanent magnet 156A and the first open permanent magnet 125. In the state where the first open permanent magnet 125 is arranged at the upper position, the magnitude of the attractive magnetic force acting on the first drive permanent magnet 156A is determined by the S pole portion 212 on the lower end side of the first open / close switching permanent magnet 210A. Thus, the upper shaft 152 moves from the holding position close to the rotation axis A1 to the open position separated from the rotation axis A1 (see FIG. 2). Thereby, the three movable pins 110 included in the first movable pin group 111 are arranged from the holding position up to that point to the open position. As a result, the substrate W is brought into contact with and supported by the three movable pins 110 included in the second movable pin group 112 (first magnet arrangement step).

Further, when the substrate W is contacted and supported by the three movable pins 110 included in the first movable pin group 111, the control unit 3 controls the second elevating unit 128, as shown in FIG. 27E. Then, the second open permanent magnet 127 which has been at the lower position is raised toward the upper position, and is disposed at the upper position. As the second open permanent magnet 127 rises, the upper surface of the second open permanent magnet 127 approaches the second drive permanent magnet 156B. Thereby, an attractive magnetic force is generated in the second drive permanent magnet 156B, and an attractive force is generated between the second drive permanent magnet 156B and the second open permanent magnet 127. In a state where the second open permanent magnet 127 is arranged at the upper position, the magnitude of the attractive magnetic force acting on the second drive permanent magnet 156B is determined by the N pole portion 211 on the lower end side of the second open / close switching permanent magnet 210B. Thus, the upper shaft 152 moves from the holding position close to the rotation axis A1 to the open position separated from the rotation axis A1 (see FIG. 2). As a result, the three movable pins 110 included in the second movable pin group 112 are arranged at the open position from the previous holding position. As a result, the substrate W is brought into contact with and supported by the three movable pins 110 included in the second movable pin group 112 (second magnet arrangement step).
When a predetermined period has elapsed from the start of FOM discharge, the FOM supply step (T6) ends. Specifically, the control unit 3 closes the chemical solution valve 15 and stops the discharge of the FOM from the chemical solution nozzle 6. Further, the control unit 3 moves the chemical liquid nozzle 6 from the center position to the home position. Thereby, the chemical liquid nozzle 6 is retracted from above the substrate W.

Subsequent to the end of the FOM supply step (T6), supply of water as a rinsing liquid to the back surface Wb of the substrate W is started (T7; rinsing step; processing liquid supply step).
As shown in FIGS. 27F to 27I, the rinsing step (T7), the brush cleaning step (T8), and the final rinsing step (T9) respectively include the rinsing step (S7) and the brush cleaning step ( S8) and a final rinsing step (S9). In the rinsing step (T7), the substrate W is supported not by the six movable pins 110 but by the three movable pins 110 during a part of the period. Further, the substrate W is contacted and supported by the three movable pins 110 included in the first movable pin group 111, and the substrate W is controlled by the three movable pins 110 included in the second movable pin group 112. The state of contact support is switched.

  Specifically, when the substrate W is contacted and supported by the three movable pins 110 included in the second movable pin group 112, the control unit 3 controls the first elevating unit 126 to As shown in (1), the first open permanent magnet 125 which has been at the lower position is raised toward the upper position, and is disposed at the upper position. As the first permanent magnet 125 rises, the upper surface of the first permanent magnet 125 approaches the first driving permanent magnet 156A. Thereby, an attractive magnetic force is generated in the first drive permanent magnet 156A, and an attractive force is generated between the first drive permanent magnet 156A and the first open permanent magnet 125. In the state where the first open permanent magnet 125 is arranged at the upper position, the magnitude of the attracting magnetic force acting on the first drive permanent magnet 156A is determined by the S pole portion 212 on the lower end side of the first open / close switching permanent magnet 210A. Thus, the upper shaft 152 moves from the holding position close to the rotation axis A1 to the open position separated from the rotation axis A1 (see FIG. 2). Thereby, the three movable pins 110 included in the first movable pin group 111 are arranged from the holding position up to that point to the open position. As a result, the substrate W is brought into contact with and supported by the three movable pins 110 included in the second movable pin group 112 (first magnet arrangement step).

Further, when the substrate W is contacted and supported by the three movable pins 110 included in the first movable pin group 111, the control unit 3 controls the second elevating unit 128, as shown in FIG. 27E. Then, the second open permanent magnet 127 which has been at the lower position is raised toward the upper position, and is disposed at the upper position. As the second open permanent magnet 127 rises, the upper surface of the second open permanent magnet 127 approaches the second drive permanent magnet 156B. Thereby, an attractive magnetic force is generated in the second drive permanent magnet 156B, and an attractive force is generated between the second drive permanent magnet 156B and the second open permanent magnet 127. In a state where the second open permanent magnet 127 is arranged at the upper position, the magnitude of the attractive magnetic force acting on the second drive permanent magnet 156B is determined by the N pole portion 211 on the lower end side of the second open / close switching permanent magnet 210B. Thus, the upper shaft 152 moves from the holding position close to the rotation axis A1 to the open position separated from the rotation axis A1 (see FIG. 2). As a result, the three movable pins 110 included in the second movable pin group 112 are arranged at the open position from the previous holding position. As a result, the substrate W is brought into contact with and supported by the three movable pins 110 included in the second movable pin group 112 (second magnet arrangement step).
The rinsing step (T7) is a step equivalent to the rinsing step (S7) according to the first embodiment. Like the rinsing step (S7), during the execution of the step, three substrates W are removed. It is supported by a movable pin 110. Further, the substrate W is contacted and supported by the three movable pins 110 included in the first movable pin group 111, and the substrate W is controlled by the three movable pins 110 included in the second movable pin group 112. Switch to the state of contact support.

  Specifically, when the substrate W is contacted and supported by the three movable pins 110 included in the second movable pin group 112, the control unit 3 controls the first elevating unit 126 to As shown in (1), the first open permanent magnet 125, which has been at the lower position, is raised toward the upper position and held at the upper position. Thereby, the first open permanent magnet 125 is arranged at the upper position and the second open permanent magnet 127 is arranged at the lower position (see FIGS. 13A and 13B), and is included in the first movable pin group 111. The three movable pins 110 are arranged at the open position from the previous holding position. Thus, the substrate W is brought into contact with and supported by the three movable pins 110 included in the second movable pin group 112 (first magnet arrangement step).

Further, when the substrate W is contacted and supported by the three movable pins 110 included in the first movable pin group 111, the control unit 3 controls the second elevating unit 128, as shown in FIG. 27H. Then, the second open permanent magnet 127, which has been at the lower position, is raised toward the upper position and held at the upper position. Thus, the state where the second open permanent magnet 127 is arranged at the upper position and the first open permanent magnet 125 is arranged at the lower position (see FIGS. 15A and 15B) is included in the second movable pin group 112. The three movable pins 110 are arranged at the open position from the previous holding position. Thus, the substrate W is brought into contact with and supported by the three movable pins 110 included in the first movable pin group 111 (second magnet arrangement step).
After a predetermined period has elapsed from the start of the rinsing liquid ejection, a spin drying step (Step T10) for drying the substrate W is performed. Specifically, the control unit 3 controls the rotation drive unit 17 so that the drying rotation speed is higher than the rotation speed from the FOM supply step (T6) to the final rinsing step (T9) as shown in FIG. 27J. (For example, several thousand rpm), and the substrate W is rotated at a drying rotation speed. Accordingly, a large centrifugal force is applied to the liquid on the substrate W, and the liquid adhering to the substrate W is shaken off around the substrate W. Thus, the liquid is removed from the substrate W, and the substrate W is dried. At this time, since the substrate W is held by the six movable pins 110, the substrate W can be rotated at high speed while firmly holding it. In this embodiment, the spin-drying step (T10) is performed while the protection disk 115 is located at the approach position.

Then, when a predetermined period has elapsed since the start of the high-speed rotation of the substrate W, the control unit 3 controls the rotation drive unit 17 to stop the rotation of the substrate W by the spin chuck 5 (step T11).
Then, the control unit 3 controls the third lifting unit 130 to lower the second levitation magnet 129 to the lower position (step T12). As a result, the distance between the second levitation magnet 129 and the first levitation magnet 160 increases, and the magnetic repulsion between them decreases. Accordingly, the protection disk 115 descends toward the upper surface of the turntable 107. Accordingly, a space is secured between the upper surface of the protection disk 115 and the surface Wa (lower surface) of the substrate W so that the hand H2 of the center robot CR can enter.

  Further, as the protection disk 115 descends from the approach position to the lower position, the S pole portion 212 on the lower end side of the first open / close switching permanent magnet 210A separates from the first drive permanent magnet 156A, and instead, The N pole portion 211 on the upper end side of the first opening / closing switching permanent magnet 210A approaches the first driving permanent magnet 156A. Further, as the protection disk 115 rises from the approaching position to the lower position, the N pole portion 211 on the upper end side of the second opening / closing switching permanent magnet 210B separates from the second driving permanent magnet 156B. The S pole portion 212 on the upper end side of the second opening / closing switching permanent magnet 210B approaches the second driving permanent magnet 156B. Thereby, all the movable pins 110 are driven from the holding position to the opening position, and are held at the opening position. Thereby, the grip of the substrate W is released.

  Next, the substrate W is unloaded from the processing chamber 4 (see FIG. 27K, step T13), and the unloaded substrate W is inverted by the reversing unit TU (step T14). Steps T13 and T14 are the same as steps S13 and S14 shown in FIG. 17, respectively, and thus description thereof will be omitted. Thereafter, the substrate W having been subjected to the cleaning process is accommodated in the carrier C with its surface Wa facing upward, and is conveyed from the substrate processing apparatus 1 to a post-processing apparatus such as an exposure apparatus.

As described above, according to the second embodiment, the following operation and effect can be obtained in addition to the operation and effect described in relation to the first embodiment.
That is, the first and second open / close switching permanent magnets 210 </ b> A and 210 </ b> B are provided on the protection disk 115 so as to be able to move up and down. Therefore, the opening and closing switching permanent magnets 210A and 210B are moved up and down with the operation of moving the protection disk 115 up and down by the third elevating unit 130. Thus, there is no need to separately provide an elevating unit for driving the first and second opening / closing switching permanent magnets 210A and 210B, thereby simplifying the device configuration and reducing costs.

  The movable pin 110 only needs to be in the holding position only during the rotation process (steps T5 to T11), and does not need to be always in the holding position. During the rotation process (steps T5 to T11), the protection disk 115 is at the approach position. That is, the movable pin 110 needs to be at the holding position only when the protection disk 115 is at the approach position, and the movable pin 110 may be at the open position when the protection disk 115 is at the lower position. Therefore, in this embodiment, when the protection disk 115 is at the approach position, all the movable pins 110 are held at the holding position by the action of the open / close switching permanent magnets 210A and 210B, and when the protection disk 115 is at the lower position, All movable pins 110 are held in the open position by the function of the switching permanent magnets 210A and 210B. Thereby, the movable pin 110 can be opened and closed favorably without impairing the function of the protection disk 115.

  Further, the vertical movement of one of the open / close switching permanent magnets 210A and 210B (the first opening / closing switching permanent magnet 210A or the second opening / closing switching permanent magnet 210B) causes not only the opening operation of the corresponding movable pin 110 but also the movable pin. The closing operation of 110 is also performed. Thereby, the number of magnets for opening and closing the pins can be reduced as compared with the case where the pin opening magnets and the pin closing magnets are separately provided.

  Further, in the processing liquid processing example of the second embodiment, in the FOM supply step (T6) and the rinsing step (T7), the substrate W is supplied only by the first movable pin group 111 while supplying the chemical liquid (FOM) to the substrate W. The support of W and the support of the substrate W by only the second movable pin group 112 are performed once or plural times. However, in the second embodiment, such a change of the substrate need not be performed.

  As described above, in the second embodiment, the opening and closing of the movable pin 110 can be switched by raising and lowering the protection disk 115 by the third lifting unit 130. Therefore, when the substrate W is not switched by the two movable pin groups 111 and 112 in the substrate processing, the configurations of the open permanent magnets 125 and 127 and the closed permanent magnets 121 and 122 may be omitted. In this case, the configurations of the first and second elevating units 126 and 128 are naturally abolished.

That is, both the lifting operation of the protection disk 115 and the opening / closing operation of the movable pin 110 can be performed by only one lifting unit (third lifting unit 130). The cost of the processing apparatus 1 can be reduced.
Further, in the second embodiment, the magnetic pole direction of the first driving permanent magnet 156A and the magnetic pole direction of the second driving permanent magnet 156B are different from each other in a direction orthogonal to the rotation axis. The first and second open / close switching permanent magnets 210A and 210B whose magnetic pole directions are opposite to each other are provided. However, in the second embodiment, the magnetic pole direction of the first driving permanent magnet 156A and the magnetic pole direction of the second driving permanent magnet 156B may be aligned in a direction orthogonal to the rotation axis. In addition, the first and second open / close switching permanent magnets 210A and 210B can also be aligned in the vertical direction.

Further, in the second embodiment, the magnet provided so as to be able to move up and down integrally with the protection disk 115 does not have to be the open / close switching permanent magnets 210A and 210B for switching between opening and closing of the movable pin 110. What is necessary is just to perform any one of the opening operation and the closing operation of 110.
The two embodiments of the present invention have been described above, but the present invention can be embodied in other forms.

  For example, in the first and second embodiments, the first open permanent magnet 125 and the second open permanent magnet 127 may be respectively provided in a double annular shape in a plan view coaxial with the rotation axis A1. In this case, one of the first and second elevating permanent magnets is disposed so as to surround the other outer circumference of the first and second elevating permanent magnets. In this case, each of the first and second elevating permanent magnets may be provided intermittently in the circumferential direction.

In the first and second embodiments, the description has been made assuming that the magnetic pole directions of the first and second open permanent magnets 125 and 127 are along the vertical direction. Alternatively, the direction may be orthogonal to the rotation axis A3 of the movable pin 110.
In the first and second embodiments, the attraction magnetic force generated between the first open permanent magnet 125 and the first drive permanent magnet 156A, and the second open permanent magnet 127 and the drive permanent magnet 156B Although the driving permanent magnets 156A and 156B are driven by the attractive magnetic force generated between the first permanent magnet 125 and the first driving permanent magnet 156A, the repulsive magnetic force generated between the first open permanent magnet 125 and the first driving permanent magnet 156A has been described. The driving permanent magnets 156A and 156B may be driven by a repulsive magnetic force generated between the second open permanent magnet 127 and the driving permanent magnet 156B.

In the first and second embodiments, the first and second closing permanent magnets 121 and 122 are provided as urging units for urging the driving permanent magnets 156A and 156B to the holding position. Instead of the second closing permanent magnets 121 and 122, an elastic pressing unit such as a spring for urging the driving permanent magnets 156A and 156B to the holding position may be provided.
Further, in the first and second embodiments, the number of the movable pins 110 is six, but may be six or more. In this case, if the number of the movable pins 110 is an even number, the number of the movable pins 110 included in the first movable pin group 111 is equal to the number of the movable pins 110 included in the second movable pin group 112. Which is desirable from a layout point of view. For example, when the number of the movable pins 110 is eight, the number of the movable pins included in each of the movable pin groups 111 and 112 becomes four. In this case, the number of the first open permanent magnets 125 also becomes movable. There are four of the same number as the number of pins 110.

  In the first and second embodiments, the open permanent magnets 125 and 127 are lifting magnets provided to be able to move up and down with respect to the turntable 107, and the closed permanent magnets 121 and 122 are moved with respect to the turntable 107. Although the description has been given as the urging magnet provided so as not to be able to ascend or descend, the reverse configuration may be adopted. An elevating magnet provided to be able to move up and down with respect to the turntable 107 may be used as an opening magnet, and an urging magnet provided so as not to move up and down with respect to the turntable 107 may be used as a closing magnet.

For example, although the processing target surface is described as the back surface (device non-forming surface) Wb of the substrate W, the surface (device forming surface) Wa of the substrate W may be the processing target surface. In this case, the reversing unit TU can be eliminated.
Further, in the first and second embodiments, the series of processing liquid processing is not limited to the removal of foreign substances, but may be for the purpose of removing metal and removing impurities embedded in a film. Further, a series of processing liquid processing may be etching processing instead of cleaning processing.

  Further, in the first and second embodiments, FOM is used as the chemical solution supplied to the substrate W, but the chemical solution may be, for example, sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, aqueous ammonia, aqueous hydrogen peroxide, At least one of an organic acid (eg, citric acid, oxalic acid, etc.), an organic alkali (eg, TMAH: tetramethylammonium hydroxide, etc.), an organic solvent (eg, IPA: isopropyl alcohol, etc.), a surfactant, and a corrosion inhibitor It is a liquid containing.

More preferably, the chemical supplied to the substrate W is DHF (dilute hydrofluoric acid), BHF (buffered hydrofluoric acid), SC1 (a solution containing NH ₄ OH and H ₂ O ₂ ), and FPM (HF and H ₂ O ₂₎ . Containing liquid) can be used. In other words, instead of the FOM supply step (S6, T6), a chemical supply step of supplying a chemical containing one of these chemicals to the surface to be processed of the substrate W can be executed. DHF, BHF, SC1, FPM, or the like can be used as the chemical solution to be used. When these liquids are used as chemicals, the surface of the substrate W to be processed does not need to be bare silicon, and the surface of the substrate W to be processed is an oxide film (eg, a silicon oxide film) and / or a nitride film (eg, a silicon nitride film). Film).

Further, in the first and second embodiments, the brush cleaning step (S8, T8) can be eliminated from the above-described processing liquid processing. In this case, since there is no need to perform the final rinsing step (S9), the final rinsing step (S9) can be omitted together.
Further, although the processing target surface is described as the upper surface of the substrate W, the lower surface of the substrate W may be the processing target surface. In this case, the processing liquid is supplied to the lower surface of the substrate W. By allowing the wraparound from the lower surface of the substrate W to the upper surface of the substrate W at the substrate supporting position at the peripheral portion of the substrate W, the processing liquid is supplied. Can be satisfactorily treated using a treatment liquid without remaining treatment.

Also, the case where the substrate processing apparatus 1 is an apparatus for processing a disk-shaped semiconductor substrate has been described, but the substrate processing apparatus 1 is an apparatus for processing a polygonal substrate such as a glass substrate for a liquid crystal display device. Is also good.
In addition, various design changes can be made within the scope of the matters described in the claims.

1: substrate processing apparatus 5: spin chuck 107: turntable 110: movable pin 111: first movable pin group 112: second movable pin group 115: protective disk 121: first closed permanent magnet 122: second Closed permanent magnet 125: first open permanent magnet 126: first elevating unit 127: second open permanent magnet 128: second elevating unit 130: third elevating unit 156A: first driving permanent magnet 156B : Second drive permanent magnet 205: spin chuck 210A: first open / close switching permanent magnet 210B: second open / close switching permanent magnet

Claims (13)

Turntable,
A rotation drive unit that rotates the turntable around a rotation axis along the vertical direction,
A plurality of movable pins for horizontally supporting the substrate, comprising a supporting portion movably provided between an open position far away from the rotation axis and a holding position close to the rotation axis. A movable pin provided to rotate about the rotation axis together with the turntable,
Said plurality of movable pins, a first movable pin group comprising at least three movable pins, provided separately from the first movable pin group, the second movable pin comprising at least three movable pins Group and
An urging unit for urging the support portion of each movable pin to one of the open position and the holding position;
A first driving magnet attached to each first movable pin group and having the same magnetic pole direction with respect to a direction orthogonal to an axis along the rotation axis;
A second driving magnet attached to each second movable pin group and having a magnetic pole direction opposite to the first driving magnet with respect to a direction orthogonal to an axis along the rotation axis;
A magnetic pole direction that is provided in a non-rotating state and that applies a repulsive force or an attractive force between the first driving magnet and a direction perpendicular to an axis along the rotation axis, and the repulsive force or the attractive force A first movable magnet for urging the support of the first movable pin group to the other of the open position and the holding position by a force;
A magnetic pole direction that is provided in a non-rotating state and that provides a repulsive force or an attractive force between the second driving magnet and a direction perpendicular to an axis along the rotation axis; A second moving magnet for urging the support portion of the second movable pin group toward the other of the open position and the holding position by a force;
A first position in which the first moving magnet applies the repulsive force or the attractive force between the first moving magnet and the first driving magnet; A first relative movement unit that causes a magnet to relatively move between the first driving magnet and a second position that does not provide the repulsive force and the attractive force between the first driving magnet and the first driving magnet;
Independently of the relative movement of the first moving magnet and the rotary table, the second moving magnet and the rotary table move the repulsion between the second moving magnet and the second driving magnet. Between a third position at which the force or the attraction force is applied and a fourth position at which the second moving magnet does not apply the repulsive force and the attraction force to the second driving magnet. And a second relative moving unit for moving the substrate.   The first and second moving magnets are respectively associated with the rotation of the turntable when the first and second move magnets are at the first or third position and the turntable is rotating. 2. The substrate holding and rotating device according to claim 1, wherein an annular magnetic field generating region coaxial with the rotation axis is formed, through which each of the rotating movable pins can pass. Each of the first and second moving magnets is provided in a plurality of the same number as each other,
The plurality of first moving magnets and the plurality of second moving magnets are arranged alternately with respect to a circumferential direction of the turntable in plan view, and are arranged so as to form an annular shape coaxial with the rotation axis as a whole. The substrate holding and rotating device according to claim 2, wherein:   The first movable pin group includes the same number of the movable pins as the second movable pin group, and the first and second movable pin groups are alternately arranged in the circumferential direction of the turntable and each movable pin is The plurality of movable pins included in the group are arranged so as to be at equal intervals, and the first and second movable magnets are respectively equal in number to the number of movable pins included in each movable pin group. 4. The substrate holding and rotating device according to claim 3, wherein the substrate holding and rotating device is arranged at equal intervals in a circumferential direction of the turntable.   The substrate holding and rotating device according to claim 2, wherein the first moving magnet and the second moving magnet are coaxial with the rotation axis and arranged in a double annular shape in plan view. The urging unit includes:
A second force for urging the support portion of the first movable pin group to the one of the open position and the holding position by applying a repulsive force or an attractive force to the first drive magnet; A biasing magnet of 1;
A second force for urging the support portion of the second movable pin group to the one of the open position and the holding position by applying a repulsive force or an attractive force to the second drive magnet; including a 2 biasing magnet, a substrate holding and rotating device according to any one of claims 1 to 5.   The substrate holding and rotating device according to claim 6, wherein the first and second urging magnets are provided so as not to be relatively movable with respect to the turntable. Wherein arranged between the turntable and the substrate holding position by the movable pin of the plurality of the lower position, at the upper than the lower position, the proximity position close to the lower surface of the substrate supported by said movable pin A protective disk attached to the turntable so as to be movable up and down relative to the turntable and to rotate about the rotation axis together with the turntable,
The substrate holding and rotating device according to claim 6, wherein the first and second urging magnets are provided on the protection disk so as to be movable up and down. The one of the open position and the holding position is the holding position,
The substrate holding and rotating device according to claim 1, wherein the other of the open position and the holding position is the open position. Wherein arranged between the turntable and the substrate holding position by the movable pin of the plurality of the lower position, at the upper than the lower position, the proximity position close to the lower surface of the substrate supported by said movable pin A protection disk attached to the turntable so as to be movable up and down relative to the turntable and to rotate about the rotation axis together with the turntable;
A first levitation magnet attached to the protection disk;
A second levitation magnet that is provided in a non-rotating state and applies a repulsive force to the first levitation magnet;
Independently of the relative movement of the first moving magnet and the rotary table and the relative movement of the second moving magnet and the rotary table, the first floating magnet and the second floating magnet The substrate holding rotation according to any one of claims 1 to 9, further comprising: a third relative movement unit configured to relatively move the second levitation magnet and the turntable such that a distance between the second levitation magnet and the rotation table changes. apparatus. A substrate holding and rotating device according to any one of claims 1 to 10,
A substrate processing apparatus, comprising: a processing liquid supply unit configured to supply a processing liquid to a main surface of a substrate held by the substrate holding and rotating device. Wherein the rotation driving unit, wherein the processing liquid supply unit, further a control unit for controlling said first relative movement unit and the second relative movement unit,
The control unit includes:
A turntable rotating step of rotating the turntable about the rotation axis,
A processing liquid supply step of supplying a processing liquid to the substrate that is rotating with the rotation of the turntable,
In parallel with the turntable rotating step and the processing liquid supply step, the relative positions of the first moving magnet and the turntable are arranged at the first position, and the second moving magnet and the turntable are A first magnet arranging step of arranging a relative position at the fourth position;
When the first magnet arrangement step is not performed, the relative positions of the second moving magnet and the turntable are arranged at the third position in parallel with the turntable rotation step and the processing liquid supply step. And a second magnet arranging step of arranging the relative positions of the first moving magnet and the rotary table at the second position. A turntable, a rotary drive unit for rotating the turntable about a rotation axis along a vertical direction, and a plurality of movable pins for horizontally supporting a substrate, and a far open position distant from the rotation axis And a supporting portion movably provided between a holding position approaching the rotation axis, and a movable pin provided to rotate about the rotation axis together with the turntable. The movable pin includes a first movable pin group including at least three movable pins, and a second movable pin group provided separately from the first movable pin group and including at least three movable pins. A biasing unit for biasing the support portion of each movable pin to one of the open position and the holding position, and a mounting unit corresponding to each first movable pin group, which is orthogonal to an axis along the rotation axis. Direction to each other A first driving magnet having a new magnetic pole direction, and a first driving magnet mounted in correspondence with each of the second movable pin groups and having a direction opposite to the first driving magnet with respect to a direction orthogonal to an axis along the rotation axis. A second driving magnet having a magnetic pole direction, and a repulsive force or an attractive force provided between the first driving magnet with respect to a direction perpendicular to an axis along the rotation axis and provided in a non-rotating state. A first moving magnet having a magnetic pole direction and urging the support portion of the first movable pin group to the other of the open position and the holding position by the repulsive force or the attractive force; In the direction perpendicular to the axis along the rotation axis has a magnetic pole direction to give a repulsive force or attractive force with the second drive magnet, by the repulsive force or the attractive force, The support of the second movable pin group A second moving magnet that urges the portion to the other of the open position and the holding position; the first moving magnet and the turntable; and the first moving magnet and the first driving magnet. And a second position at which the first moving magnet does not apply the repulsive force and the attractive force between the first moving magnet and the first driving magnet. A first relative moving unit for relatively moving the second moving magnet and the rotating table independently of the relative movement of the first moving magnet and the rotating table. A third position at which a magnet applies the repulsive force or the attraction force to the second driving magnet; and a second position at which the second moving magnet moves between the second driving magnet and the second driving magnet. A second relative movement for relatively moving between a fourth position where the suction force is not applied; A substrate holding method, further comprising a substrate holding and rotating device, and a processing liquid supply unit for supplying a processing liquid to the substrate held by the substrate holding and rotating device. So,
A turntable rotating step of rotating the front Symbol turntable about said axis of rotation,
A processing liquid supply step of supplying a processing liquid to the substrate that is rotating with the rotation of the turntable,
In parallel with the turntable rotating step and the processing liquid supply step, the relative positions of the first moving magnet and the turntable are arranged at the first position, and the second moving magnet and the turntable are A first magnet arranging step of arranging a relative position at the fourth position;
When the first magnet arrangement step is not performed, the relative positions of the second moving magnet and the turntable are arranged at the third position in parallel with the turntable rotation step and the processing liquid supply step. And a second magnet arranging step of arranging the relative positions of the first moving magnet and the turntable at the second position.

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