TWI626090B - Substrate holding/rotating device, substrate processing apparatus including the same, and substrate processing method - Google Patents

Abstract

The substrate holding and rotating device includes a pressing unit that presses a support portion of the movable pin to one of an open position and a holding position; a first driving magnet that is mounted corresponding to each of the first movable pin groups, and The magnetic pole directions are the same as each other in a direction orthogonal to the axis along the rotation axis. The second driving magnet is mounted corresponding to each of the second movable pin groups. The direction of intersection is opposite to that of the first driving magnet. The first moving magnet is provided in a non-rotating state and has a direction orthogonal to the axis along the rotation axis. A repulsive force or an attractive magnetic pole direction is imparted between the magnets, and the support portion of the first movable pin group is pressed to the other of the open position and the held position by the repulsive force or the attractive force; and The second moving magnet is provided in a non-rotating state and has a magnetic pole direction that imparts a repulsive force or an attractive force to the second driving magnet in a direction orthogonal to an axis along the rotation axis. The support portion of the second movable pin group is pressed to the other one of the open position and the holding position by the repulsive force or the attractive force.

Description

Substrate holding rotation device, substrate processing device including the same, and substrate processing method

The present invention relates to a substrate holding and rotating device, a substrate processing apparatus including the same, and a substrate processing method. The substrate to be held or processed includes, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for an optical disk, a substrate for a magnetic disk, and a magneto-optical disk. Substrates, substrates for photomasks, ceramic substrates, substrates for solar cells, and the like.

US2013 / 0152971 A1 discloses a rotary substrate holding and rotating device, which includes: a rotating table that can rotate about a rotation axis along a vertical direction; a rotation driving unit that rotates the rotating table around the above rotation axis; and a plurality of Root (for example, 4) holding pins are arranged on the turntable, and the substrate is horizontally positioned at a predetermined interval from the surface of the turntable.

The plurality of holding pins include a fixed pin which is immovable with respect to the turntable, and a movable pin which is movable with respect to the turntable. The movable pin is rotatably provided around a rotation axis coaxial with a central axis thereof, and has a contact portion for contacting a peripheral edge of the substrate. By the rotation of the abutment portion, the abutment portion is displaced between an open position farther from the rotation axis and a holding position closer to the rotation axis. Pin driving is connected to the rotating shaft of the contact part magnet.

The switch of the movable pin is switched using a lifting magnet arranged below the turntable (magnet switching method). A magnet lifting unit is coupled to the lifting magnet. When the lifting magnet is located at a predetermined lower position, the lifting magnet is not opposed to the pin driving magnet. Therefore, no force is applied to the movable pin to press the movable pin toward its holding position. Therefore, when the lifting magnet is in the lower position, the movable pin is held in its open position. On the other hand, when the lifting magnet is positioned above a predetermined position, the movable pin is held in its holding position by a magnetic attraction force between the lifting magnet and the pin driving magnet.

The substrate holding and rotating device is provided in a single-piece substrate processing device that processes substrates one by one, and supplies a processing liquid (cleaning liquid) from a processing liquid nozzle to the upper surface of the substrate that is rotated by the substrate holding and rotating device. The processing liquid supplied to the upper surface of the substrate is affected by the centrifugal force generated by the rotation of the substrate, and flows toward the peripheral edge portion of the substrate. Thereby, the entire area of the upper surface of the substrate and the peripheral end surface of the substrate are subjected to liquid treatment. In addition, depending on the type of substrate processing, there may be a case where the peripheral portion of the lower surface of the substrate is also subjected to liquid processing.

However, in the structure described in US2013 / 0152971 A1, a plurality of (for example, four) holding pins are always in contact with the support substrate during the liquid processing period. Therefore, there are a plurality of positions of the holding pins on the peripheral end surface of the substrate. The processing liquid at the abutting position does not flow back, and a cleaning residue may be generated at the peripheral edge portion of the substrate (the peripheral end surface of the substrate and the peripheral edge portion of the lower surface of the substrate). If the contact and support position of the substrate is changed during the rotation of the substrate, the peripheral portion of the substrate can be cleaned without generating cleaning residues. However, in order to realize such a change in the contact and support position, it is necessary to select only the substrate during the processing One of the plurality of retaining pins provided on the rotating turntable is partially opened. Of course Moreover, the substrate holding rotating device of the magnet switching method described in the above-mentioned Patent Document 1 is provided with a non-rotating lifting magnet for switching the switch of the movable pin, and therefore, it is not possible to selectively only install the rotating table provided on the rotating table. One of the plurality of holding pins is held open. Assuming that the lifting magnet is disposed at the lower position and both of the two movable pins are turned on during the rotation of the rotary table in the above-mentioned Patent Document 1, the substrate may be detached from the rotary table in the rotary state.

Therefore, an object of the present invention is to provide a substrate holding and rotating device with a magnet switching method, which can support and rotate the substrate well, and can change the contact and support position of the movable pin to the substrate during the rotation of the substrate.

Furthermore, another object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of processing a peripheral portion of a substrate well without generating a processing residue.

The invention provides a substrate holding and rotating device, which includes: a rotating table; a rotation driving unit that rotates the rotating table about a rotation axis in a vertical direction; and a movable pin for supporting a plurality of substrates horizontally. The movable pin has a support portion movably disposed between an open position far from the rotation axis and a holding position close to the rotation axis, and is arranged to rotate around the rotation axis together with the rotation table; The plurality of movable pins includes: a first movable pin group including at least three movable pins; and a second movable pin group provided separately from the first movable pin group and including at least three movable pins; and the substrate The holding and rotating device further includes a pressing unit that presses the support portion of each movable pin to one of the open position and the holding position, and a first driving magnet corresponding to each of the first movable pin groups. Mounted and having magnetic pole directions identical to each other in a direction orthogonal to the axis along the rotation axis; a second driving magnet corresponding to each of the second movable pin groups. Loaded, And has a magnetic pole direction opposite to the first driving magnet in a direction orthogonal to the axis along the rotation axis; the first moving magnet is provided in a non-rotating state and has an axis with the axis along the rotation axis A repulsive force or an attractive magnetic pole direction is provided between the orthogonal direction and the first driving magnet, and the support portion of the first movable pin group is pressed to the opening by the repulsive force or the attractive force. The second position or the holding position; the second moving magnet is provided in a non-rotating state and has a repulsive force between the second moving magnet and the second driving magnet in a direction orthogonal to an axis along the rotation axis; Or an attractive magnetic pole direction, and the supporting part of the second movable pin group is pressed to the other one of the open position and the holding position by the repulsive force or the attractive force; the first relative moving unit Wherein the first moving magnet and the turntable are provided at the first position where the repulsive force or the attractive force is provided between the first moving magnet and the first driving magnet, and the first moving magnet A relative movement between the iron and the first driving magnet at a second position that does not impart the repulsive force and the attractive force; and a second relative moving unit that separates the second moving magnet and the rotary table from the first (1) a relative movement between the moving magnet and the turntable, and a third position that imparts the repulsive force or the attractive force between the second moving magnet and the second driving magnet; and the second moving magnet is driven relative to the second drive The fourth position, which does not impart the repulsive force and the attractive force between the magnets, moves relatively.

According to this configuration, a plurality of movable pins are provided on the turntable, and each movable pin has a support portion movably provided between the open position and the holding position. The support portion of each movable pin is pressed by the pressure applying unit to one of the open position and the holding position.

The plurality of movable pins includes a first movable pin group and a second movable pin group. The magnetic pole directions of the first driving magnets installed corresponding to the first movable pin group are the same in the radial direction of the turntable, and the second driving magnets installed corresponding to the second movable pin group are the same. The magnetic pole directions are opposite to the magnetic pole directions of the first driving magnet and are the same as each other in the radial direction of the turntable.

In addition, the first moving magnet having a magnetic pole direction giving repulsive force or attractive force to the first driving magnet is provided in a non-rotating state. The relative position between the first moving magnet and the turntable is a first position that provides repulsive force or attractive force between the first moving magnet and the first driving magnet by the first relative moving unit, and the first moving magnet and the first The relative movement between the 1 driving magnet and the second position where no repulsive force or attractive force is imparted.

Furthermore, the second moving magnet having a magnetic pole direction giving repulsive force or attractive force to the second driving magnet is provided in a non-rotating state. The relative position between the second moving magnet and the turntable is a third position that imparts a repulsive force or an attractive force between the second moving magnet and the second driving magnet by the second relative moving unit. 2 The driving magnets move relative to each other at a fourth position where no repulsive force or attractive force is imparted.

By disposing the first moving magnet at the first position and the second moving magnet at the fourth position in the rotating state of the turntable, the repulsive force or attractive force from the moving magnet (the first moving magnet) is only given to The first driving magnet is a driving magnet corresponding to the first movable pin group. By the repulsive force or the attractive force, the supporting portion of the first movable pin group is pressed to the other of the open position and the held position against the pressure of the pressure applying unit. In this state, the support portion of the first movable pin group is pressed to the other of the open position and the holding position, and the support portion of the second movable pin group is pressed to one of the open position and the holding position. . That is, the substrate is supported by at least three movable pins included in the movable pin group (one of the first and second movable pin groups) pressed to the holding position by the support portion.

On the other hand, the first moving magnet is placed at the second position and the second moving magnet is placed at the third position in the rotating state of the turntable, so that the repulsive force or attraction from the moving magnet (the second moving magnet) is attracted. The force is applied only to the second driving magnet which is a driving magnet corresponding to the second movable pin group. By the repulsive force or the attractive force, the support portion of the second movable pin group is pressed to the other of the open position and the held position against the pressure of the pressure applying unit. In this state, the support portion of the first movable pin group is pressed to one of the open position and the holding position, and the support portion of the second movable pin group is pressed to the other of the open position and the holding position. . That is, the substrate is supported by at least three movable pins included in the movable pin group (the other of the first and second movable pin groups) whose support portion is pressed to the holding position.

The relative positions of the first moving magnet and the rotary table and the relative positions of the second moving magnet and the rotary table are relatively moved respectively in the rotating state of the substrate, so that the first moving magnet and the rotating table can be relatively moved. 1 The state of the substrate supporting the movable pin group and the state of supporting the substrate by the second movable pin group including three or more movable pins.

According to the above, a substrate holding and rotating device with a magnet switching method can be provided, which can support and rotate the substrate well, and can change the contact and support position of the movable pin to the substrate during the rotation of the substrate.

In one embodiment of the present invention, the first and second moving magnets are respectively formed with the rotating table in a state where the first and second moving magnets are located at the first or third position and the rotating table is rotated. A ring-shaped magnetic field generating region that is coaxial with the rotation axis and can pass through each of the movable pins that rotates.

According to this configuration, the magnetic field generating area formed by the first moving magnet and the magnetic field generating area formed by the second moving magnet are formed into a ring shape, respectively. Therefore, the driving magnets (the first driving magnet and the second driving magnet) corresponding to all the movable pins in the rotating state of the turntable simultaneously pass through the magnetic field generation area. Therefore, in a state where the first movable magnet is disposed at the first position, repulsive force or attractive force can be imparted between the first driving magnets corresponding to all the movable pins included in the first movable pin group. Further, in a state where the second moving magnet is arranged at the third position, repulsive force or attractive force can be imparted between the second driving magnets corresponding to all the movable pins included in the second movable pin group.

In addition, the first and second moving magnets may be provided with a plurality of the same number of each other, and the plurality of first moving magnets and the plurality of second moving magnets are arranged on the rotary table in a plan view. They are arranged alternately in the circumferential direction so as to form a ring shape coaxial with the rotation axis as a whole.

According to this configuration, the plurality of first moving magnets and the plurality of second moving magnets are alternately arranged in the circumferential direction of the turntable. The plurality of first moving magnets and the plurality of second moving magnets are arranged so as to form a ring shape coaxial with the rotation axis as a whole. In this case, when focusing on various moving magnets (the first moving magnet or the second moving magnet), the moving magnets are intermittently arranged on the coaxial circumference of the rotation axis in the circumferential direction of the turntable. In this case, it is also possible to set the magnetic field generating area into a ring shape according to the rotation speed of the turntable and / or the circumferential length of each moving magnet.

The first movable pin group may include the same number of movable pins as the second movable pin group, and the first and second movable pin groups may be alternately and individually movable in the circumferential direction of the rotary table. The plurality of movable pins included in the pin group are arranged at equal intervals, and the first and second moving magnets are respectively on the circumference of the rotary table with the same number as the number of the movable pins included in each movable pin group. The directions are arranged at equal intervals.

According to this configuration, the first and second movable pin groups are alternately arranged in the circumferential direction of the turntable, and the plurality of movable pins included in each movable pin group are arranged at equal intervals. In each of the states where the substrate is supported by the first movable pin group and the state where the substrate is supported by the three or more second movable pin groups, the substrate is well supported by each movable pin group.

In addition, since the first and second moving magnets are arranged at equal intervals in the circumferential direction of the rotary table in the same number as the number of the movable pins included in each movable pin group, in the non-rotating state of the rotary table, The first and second moving magnets can also provide a repulsive force or an attractive force between the driving magnets corresponding to the first and second movable pin groups, respectively.

The first moving magnet and the second moving magnet may be disposed coaxially with the rotation axis and having a double circular ring shape in a plan view.

According to this configuration, since the ring-shaped first moving magnet and the ring-shaped second moving magnet are used, it is possible to reliably set the magnetic field generating region in a ring shape while the rotary table is in a rotating state.

Further, the pressure applying unit may further include a first pressing magnet for applying the repulsive force or attractive force to the first driving magnet to form the supporting portion of the first movable pin group. Pressing to one of the open position and the holding position; and a second pressing magnet for moving the second movable part by applying a repulsive force or an attractive force to the second driving magnet. The support portion of the pin group is pressed to one of the open position and the holding position.

According to this configuration, the support portion of each movable pin is pressed to one of the open position and the holding position by the first pressing magnet and the second pressing magnet. With this, The structure of pressing the support part of each movable pin to one of an open position and a holding position can be easily realized.

The first and second pressing magnets may be installed in such a manner that they cannot move relative to the rotary table.

With this configuration, it is possible to always press the support portion of each movable pin to one of the open position and the holding position.

It may further include a protection disc, which is arranged between the rotary table and the substrate holding position based on the plurality of movable pins, so as to be able to be held closer to the holding member and held in the lower position and above the lower position. The first and second pressing magnets are mounted on the rotary table in such a manner as to move up and down relative to the rotary table relative to the lower surface of the substrate, and rotate together with the rotary table about the rotation axis. It is installed in such a way that it can move up and down together with the protection disk.

According to this configuration, the first and second pressing magnets can be moved up and down by moving the protection plate up and down. Therefore, it is not necessary to separately provide the first and second pressure magnets in addition to the lifting unit for protecting the disk from moving up and down, thereby simplifying the device configuration and reducing costs.

One of the open position and the holding position may be the holding position, and the other of the opening position and the holding position may be the opening position.

According to this configuration, the support portion of each movable pin is pressed to the holding position by the pressing unit. By disposing the first moving magnet at the first position and the second moving magnet at the fourth position in the rotating state of the turntable, the repulsive force or attractive force from the moving magnet (the first moving magnet) is only given to The first driving magnet is a driving magnet corresponding to the first movable pin group. The repulsive force or the attractive force makes the first movable pin group The supporting portion is pressed to the open position against the pressing force of the pressing unit. In this state, the support portion of the first movable pin group is pressed to the open position, and the support portion of the second movable pin group is pressed to the holding position. That is, the substrate is supported by at least three movable pins included in the second movable pin group.

On the other hand, the first moving magnet is placed at the second position and the second moving magnet is placed at the third position in the rotating state of the turntable, so that the repulsive force or attraction from the moving magnet (the second moving magnet) is attracted. The force is applied only to the second driving magnet which is a driving magnet corresponding to the second movable pin group. By the repulsive force or the attractive force, the support portion of the second movable pin group is pressed to the open position against the pressure of the pressure applying unit. In this state, the support portion of the first movable pin group is pressed to the holding position, and the support portion of the second movable pin group is pressed to the open position. That is, the substrate is supported by at least three movable pins included in the first movable pin group.

It may further include: a protective disk arranged between the rotary table and the substrate holding position based on the plurality of movable pins, and further approaching the substrate held by the holding member in a lower position and a position higher than the lower position. Between the approaching positions of the lower surface, it is relatively moved up and down relative to the rotary table, and is mounted on the rotary table in such a manner that it rotates with the rotary table about the rotation axis. The first floating magnet is mounted on the protection. Disk; a second floating magnet, which is provided in a non-rotating state, and gives a repulsive force to the first floating magnet; and a third relative moving unit, which separates the second floating magnet and the rotary table from the first Each of the relative movement of the moving magnet and the rotary table and the relative movement of the second moving magnet and the rotary table relatively moves in such a manner that the distance between the first floating magnet and the second floating magnet changes.

According to this configuration, the second floating magnet and the rotary table are relatively moved. It is performed independently of each of the relative movement of the first moving magnet and the rotary table and the relative movement of the second moving magnet and the rotary table. This makes it possible to perform the relative movement operation of the first moving magnet and the rotary table or the relative movement operation of the second moving magnet and the rotary table regardless of the up and down positions of the protective disk.

The present invention provides a substrate processing apparatus including: the substrate holding and rotating device; and a processing liquid supply unit that supplies a processing liquid to an upper surface of a substrate held by the substrate holding and rotating device.

According to this configuration, the processing liquid is supplied from the processing liquid supply unit to the main surface of the substrate. The processing liquid supplied to the main surface of the substrate flows toward the peripheral edge portion of the substrate under the influence of the centrifugal force generated by the rotation of the substrate. Thereby, the peripheral part of a board | substrate is liquid-processed by a processing liquid. In the present invention, the contact support position of the movable pin on the substrate can be changed during the rotation of the substrate. Therefore, the peripheral part of a board | substrate can be processed favorably without generating a process residue.

An embodiment of the present invention further includes a control device that controls the rotation driving unit, the processing liquid supply unit, the first relative movement unit, and the second relative movement unit. In this case, the control device may also perform: a rotating stage rotating step that rotates the rotating stage about the rotation axis; a processing liquid supplying step that supplies a processing liquid to a substrate that rotates with the rotation of the rotating stage; 1 magnet arrangement step, in parallel with the rotation stage rotation step and the treatment liquid supply step, arranging the relative position of the first moving magnet and the rotation stage at the first position, and placing the second moving magnet and the above The relative position of the rotary table is arranged at the fourth position; and the second magnet positioning step moves the second step in parallel with the rotary table rotating step and the processing liquid supply step when the first magnet positioning step is not performed. The relative position of the magnet and the rotary table is arranged in the third section. Position, and the relative position of the first moving magnet and the turntable is arranged at the second position.

According to this configuration, the processing liquid is supplied to the main surface of the substrate in a rotating state. The processing liquid supplied to the main surface of the substrate flows toward the peripheral edge portion of the substrate under the influence of the centrifugal force generated by the rotation of the substrate. Thereby, the peripheral part of a board | substrate is liquid-processed by a processing liquid.

In parallel with the rotation of the rotary table and the supply of the processing liquid, the relative position of the first moving magnet and the rotary table is arranged at the first position, and the relative position of the second moving magnet and the rotary table is arranged at the fourth position. Position (first magnet placement step). As a result, the substrate is supported by at least three movable pins included in the movable pin group (one of the first and second movable pin groups) pressed to the holding position by the support portion.

Further, in parallel with the rotation of the rotary table and the supply of the processing liquid, the relative position of the first moving magnet and the rotary table is arranged at a second position, and the relative position of the second moving magnet and the rotary table is arranged at a third position. Position (second magnet placement step). As a result, the substrate is supported by at least three movable pins included in the movable pin group (the other of the first and second movable pin groups) that is pressed to the holding position by the support portion.

Therefore, the contact support position of the movable pin to the substrate can be changed in the processing liquid supply step of supplying the processing liquid while rotating the substrate while facing the main surface of the substrate. Therefore, the processing liquid can be supplied to the entire area of the peripheral edge portion of the substrate, whereby the peripheral edge portion of the substrate can be favorably processed without generating a processing residue.

The present invention provides a substrate processing method, which is a substrate processing method performed in a substrate processing apparatus including a substrate holding rotating device and a processing liquid supply unit for supplying a processing liquid to a substrate held by the substrate holding rotating device. The rotating device includes: a rotating table; and a rotating driving unit, which rotates the rotating table around the edge. Rotate along the axis of rotation in the vertical direction; and a movable pin, which is a plurality of movable pins used to horizontally support the substrate, and has a movably disposed open position far away from the above-mentioned axis of rotation and a portion near the above-mentioned axis of rotation. The support portion between the holding positions is provided so as to rotate about the rotation axis together with the rotary table; the plurality of movable pins includes: a first movable pin group including at least three movable pins; and a second movable pin Group, which is provided separately from the first movable pin group and includes at least three movable pins; and the substrate holding and rotating device further includes: a pressure applying unit that presses the support portion of each movable pin to the open position and One of the holding positions; a first driving magnet that is mounted corresponding to each of the first movable pin groups and has magnetic pole directions that are the same as each other in a direction orthogonal to the axis along the rotation axis; the second The driving magnet is mounted corresponding to each of the second movable pin groups and has a magnetic pole opposite to the first driving magnet in a direction orthogonal to the axis along the rotation axis. Direction; the first moving magnet is provided in a non-rotating state and has a magnetic pole direction that imparts a repulsive force or an attractive force to the first driving magnet in a direction orthogonal to an axis along the rotation axis, and By the repulsive force or the attractive force, the supporting part of the first movable pin group is pressed to the other of the open position and the holding position; the second moving magnet is provided in a non-rotating state, and has A repulsive force or an attractive magnetic pole direction is provided between the second driving magnet and the second driving magnet in a direction orthogonal to the axis of the rotation axis, and the above-mentioned second movable pin group is provided with the repulsive force or the attractive force. The supporting part is pressed to the other one of the open position and the holding position; a first relative moving unit that connects the first moving magnet and the rotary table to the first moving magnet and the first driving magnet The relative position between the first position where the repulsive force or the attractive force is imparted and the second moving magnet between the second position where the repulsive force and the attractive force are not provided between the first moving magnet and the first driving magnet ; Second relative movement means, which The second moving magnet and the rotary table are independent of the relative movement of the first moving magnet and the rotary table, and the second moving magnet and the second driving magnet are provided with the repulsive force or the attractive force between the second moving magnet and the second driving magnet. The three positions and the second moving magnet are relatively moved between the fourth position and the fourth position where the repulsive force and the attractive force are not imparted to the second driving magnet; and the substrate processing method includes a rotary table rotation step that causes the above The rotary table rotates around the rotation axis; the processing liquid supply step supplies the processing liquid to the substrate that rotates with the rotation of the rotary table; and the first magnet disposing step is performed in parallel with the rotary table rotation step and the processing liquid supply step. Arranging the relative position of the first moving magnet and the turntable at the first position, and arranging the relative position of the second moving magnet and the turntable at the fourth position; and a second magnet arranging step, When the first magnet arrangement step is not performed, the second shift is performed in parallel with the rotation stage rotation step and the processing liquid supply step. The relative position of the moving magnet and the rotary table is arranged at the third position, and the relative position of the first moving magnet and the rotary table is arranged at the second position.

According to this method, the processing liquid is supplied to the main surface of the substrate in a rotating state. The processing liquid supplied to the main surface of the substrate flows toward the peripheral edge portion of the substrate under the influence of the centrifugal force generated by the rotation of the substrate. Thereby, the peripheral part of a board | substrate is liquid-processed by a processing liquid.

In parallel to the rotation of the rotary table and the supply of the processing liquid, the relative position of the first moving magnet and the rotary table is arranged at the first position, and the relative position of the second moving magnet and the rotary table is arranged at the fourth Position (first magnet placement step). As a result, the substrate is supported by at least three movable pins included in the movable pin group (one of the first and second movable pin groups) pressed to the holding position by the support portion.

Further, in parallel with the rotation of the rotary table and the supply of the processing liquid, the first 1 The relative position of the moving magnet and the rotary table is arranged at a second position, and the relative position of the second moving magnet and the rotary table is arranged at a third position (second magnet disposing step). As a result, the substrate is supported by at least three movable pins included in the movable pin group (the other of the first and second movable pin groups) that is pressed to the holding position by the support portion.

Therefore, the contact support position of the movable pin to the substrate can be changed in the processing liquid supply step of supplying the processing liquid while rotating the substrate while facing the main surface of the substrate. Therefore, the processing liquid can be supplied to the entire area of the peripheral edge portion of the substrate, whereby the peripheral edge portion of the substrate can be favorably processed without generating a processing residue.

The above-mentioned or further other objects, features, and effects in the present invention will be made clear by the following description of the embodiments described with reference to the accompanying drawings.

1‧‧‧ substrate processing device

2, 202‧‧‧ processing unit

3‧‧‧control device

4‧‧‧ treatment chamber

5,205‧‧‧Rotary chuck

6‧‧‧ liquid medicine nozzle

7, 13‧‧‧ chemical liquid supply unit

8‧‧‧ Water supply unit

10‧‧‧washing brush

10a‧‧‧washing surface

11‧‧‧Washing brush drive unit

12‧‧‧Protection gas supply unit

14‧‧‧medicine piping

15‧‧‧ liquid medicine valve

17, 103‧‧‧ Rotary drive unit

21‧‧‧ Nozzle Arm

22‧‧‧ Nozzle moving unit

41‧‧‧Water nozzle

42‧‧‧Water piping

43‧‧‧Water valve

45‧‧‧protective fluid valve

47‧‧‧Swing arm

48‧‧‧arm drive unit

107‧‧‧Turntable

108‧‧‧rotation axis

109‧‧‧ convex seat

110‧‧‧ movable pin

111‧‧‧The first movable pin group

112‧‧‧The second movable pin group

115‧‧‧Protection disk

115a‧‧‧step difference

116, 194, 294‧‧‧‧ incision

117‧‧‧Guide shaft

118‧‧‧ Linear Bearing

119‧‧‧Guide unit

120, 181, 184a‧‧‧ flange

121‧‧‧The first closed permanent magnet

122‧‧‧ 2nd closed permanent magnet

123‧‧‧Magnet holding member

125‧‧‧The first open permanent magnet

126‧‧‧The first lifting unit

127‧‧‧ 2nd open permanent magnet

128‧‧‧ 2nd lifting unit

129‧‧‧The second magnet for floating

129A, 129B ‧‧‧ magnetic field generation area

130‧‧‧3rd lifting unit

151‧‧‧ lower shaft

152‧‧‧ Upper shaft

153‧‧‧ cone

154, 178‧‧‧bearing

155‧‧‧Support shaft

156A‧‧‧The first drive permanent magnet

156B‧‧‧Second drive permanent magnet

157, 161‧‧‧ magnet holding member

160‧‧‧The first floating magnet

162‧‧‧through hole

170‧‧‧Inert gas supply pipe

172‧‧‧Inert gas supply path

173‧‧‧Inert gas valve

174‧‧‧Inert gas flow adjustment valve

175‧‧‧bearing unit

176, 185‧‧‧ recess

177‧‧‧ spacer

179‧‧‧ Magnetic fluid bearing

182‧‧‧flow

183, 189‧‧‧ inclined surface

184‧‧‧ Hood

186‧‧‧Rectifying component

187‧‧‧foot

188‧‧‧ underside

190, 290‧‧‧Throttling Department

191, 291‧‧‧circle cover

192, 292‧‧‧circle plate

193, 293‧‧‧ cylindrical

203‧‧‧Fixed unit

210A‧‧‧1st switch permanent magnet

210B‧‧‧The second switch switches the permanent magnet

211‧‧‧N pole

212‧‧‧S pole

A1, A3‧‧‧‧ axis of rotation

A2‧‧‧Swing axis

B‧‧‧ center axis

C‧‧‧ carrier

CR‧‧‧Center Robot

Dr‧‧‧ Direction of rotation

H1, H2‧‧‧Hand

IR‧‧‧ indexing robot

LP‧‧‧ Loading port

S1 ~ S14, T1 ~ T14‧‧‧step

TU‧‧‧ Flip Unit

W‧‧‧ substrate

Wa‧‧‧ surface

Wb‧‧‧ back

FIG. 1 is a schematic plan view for explaining an internal layout of a substrate processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a schematic sectional view for explaining a configuration example of a processing unit provided in the substrate processing apparatus.

FIG. 3 is a plan view for explaining a more specific structure of a rotary chuck provided in the substrate processing apparatus.

FIG. 4 is a bottom view of the structure of FIG. 3.

Fig. 5 is a cross-sectional view taken from a section line V-V in Fig. 3.

FIG. 6 is an enlarged sectional view showing a part of the structure of FIG. 5 in an enlarged manner.

FIG. 7 is an enlarged cross-sectional view showing a structure provided near a movable pin of the rotary chuck.

Figures 8A and 8B show the first part of the lifting operation with the first open permanent magnet. Schematic diagram of the state of the movable pins included in the movable pin group.

9A and 9B are schematic diagrams showing states of movable pins included in a second movable pin group accompanying a lifting operation of a second open permanent magnet.

10A and 10B are schematic diagrams showing states of the first movable pin group and the second movable pin group.

11A and 11B are schematic diagrams showing states of the first movable pin group and the second movable pin group.

12A and 12B are schematic diagrams showing states of the first movable pin group and the second movable pin group.

13A and 13B are schematic diagrams showing states of the first movable pin group and the second movable pin group.

14A and 14B are schematic diagrams showing states of the first movable pin group and the second movable pin group.

15A and 15B are schematic diagrams showing states of the first movable pin group and the second movable pin group.

FIG. 16 is a block diagram for explaining the electrical configuration of the main part of the substrate processing apparatus.

FIG. 17 is a flowchart for explaining an example of processing liquid processing performed by the substrate processing apparatus.

FIG. 18 is a timing chart for explaining the processing liquid.

19A to 19K are diagrams for explaining an example of the treatment liquid treatment described above.

20A and 20B are diagrams showing the flow-back state of the processing liquid at each time when the movable pin is in the holding position and when the movable pin is in the open position.

FIG. 20C is a cross-sectional view showing the flow of the processing liquid and the inert gas at the peripheral portion of the substrate Face view.

FIG. 21 is a schematic sectional view for explaining a configuration example of a processing unit according to a second embodiment of the present invention.

Fig. 22 is a cross-sectional view for explaining a configuration example of a ring cover of a rotary chuck provided in the processing unit;

Fig. 23 is a plan view for explaining a more specific structure of the rotary chuck.

24A and 24B are schematic diagrams showing states of movable pins included in the first movable pin group accompanying the ascending and descending operation of the protective disk.

25A and 25B are schematic diagrams showing states of movable pins included in the second movable pin group accompanying the ascending and descending operation of the protective disk.

FIG. 26 is a flowchart for explaining an example of processing liquid processing performed by the substrate processing apparatus.

27A to 27K are diagrams for explaining an example of processing liquid processing performed by the substrate processing apparatus.

FIG. 1 is a schematic plan view for explaining an internal layout of a substrate processing apparatus 1 according to an embodiment of the present invention.

The substrate processing apparatus 1 is a single-chip apparatus that processes a wafer-shaped substrate W including a semiconductor wafer (semiconductor substrate) one by one using a processing liquid or a processing gas. The substrate processing apparatus 1 includes a loading port LP that holds a plurality of carriers C, a turning unit TU that turns the posture of the substrate W upside down, and a plurality of processing units 2 that process the substrate W. The loading port LP and the processing unit 2 are arranged at intervals in the horizontal direction. The reversing unit TU is arranged on a transport path of the substrate W transported between the loading port LP and the processing unit 2.

As shown in FIG. 1, the substrate processing apparatus 1 further includes: an indexing robot IR disposed between the loading port LP and the turning unit TU; and a central robot CR disposed between the turning unit TU and the processing unit 2; And a control device 3 that controls an operation of a device provided on the substrate processing device 1 or a switch of a valve. The indexing robot IR transfers several substrates W from the carrier C held on the loading port LP to the reversing unit TU one by one, and transfers several substrates W from the reversing unit TU to the carrier C held on the loading port LP one by one. . Similarly, the central robot CR transfers several substrates W to the processing unit 2 one by one from the reversing unit TU, and transfers several substrates W to the reversing unit TU one by one from the processing unit 2. The center robot CR further transfers the substrate W between the plurality of processing units 2.

The indexing robot IR includes a hand H1 that supports the substrate W horizontally. The indexing robot IR moves the hand H1 horizontally. Further, the indexing robot IR raises and lowers the hand H1 and rotates the hand H1 about the vertical axis. Similarly, the center robot CR includes a hand H2 that supports the substrate W horizontally. The center manipulator CR moves the hand H2 horizontally. Further, the center robot CR raises and lowers the hand H2 and rotates the hand H2 about the vertical axis.

The substrate W is housed on the carrier C in a state where the surface Wa of the substrate W serving as a device formation surface faces upward (upward posture). The control device 3 transfers the substrate W from the carrier C to the turning unit TU with the indexing robot IR with the surface Wa (see FIG. 2 and the like) facing upward. Then, the control device 3 reverses the substrate W by the reversing unit TU. Thereby, the back surface Wb (refer to FIG. 2 and the like) of the substrate W faces upward. Thereafter, the control device 3 transfers the substrate W from the reversing unit TU to the processing unit 2 with the central robot CR in a state in which the back surface Wb is upward. Then, the control device 3 processes the back surface Wb of the substrate W by the processing unit 2.

After processing the back surface Wb of the substrate W, the control device 3 transfers the substrate W from the processing unit 2 to the reversing unit TU with the back surface Wb facing upward by the central robot CR. Then, the control device 3 reverses the substrate W by the reversing unit TU. Thereby, the surface Wa of the substrate W faces upward. Thereafter, the control device 3 transfers the substrate W from the turning unit TU to the carrier C with the indexing robot IR with the surface Wa facing upward. Thereby, the processed substrate W is accommodated in the carrier C. The control device 3 processes the plurality of substrates W one by one by causing the indexing robot IR and the like to repeatedly execute the series of operations.

FIG. 2 is a schematic sectional view for explaining a configuration example of a processing unit 2 provided in the substrate processing apparatus 1. FIG. 3 is a plan view for explaining a more specific structure of the rotary chuck 5 provided in the substrate processing apparatus 1. FIG. 4 is a bottom view of the structure of FIG. 3. Fig. 5 is a cross-sectional view taken from a section line V-V in Fig. 3. FIG. 6 is an enlarged sectional view showing a part of the structure of FIG. 5 in an enlarged manner. FIG. 7 is an enlarged cross-sectional view showing a configuration provided near the movable pin 110 of the rotary chuck 5.

As shown in FIG. 2, the processing unit 2 includes: a box-shaped processing chamber 4 having an internal space; a rotary chuck (substrate holding rotation device) 5 that holds a piece of substrate W in a horizontal posture in the processing chamber 4 And the substrate W is rotated around the vertical axis of rotation A1 passing through the center of the substrate W; the chemical liquid supply unit (processing liquid supply unit) 7 is used for the upper surface (back surface) of the substrate W held by the rotary chuck 5 (One main surface) Wb) Supply a hydrofluoric acid solution (hereinafter referred to as FOM) containing ozone as an example of a chemical liquid (treatment liquid); a water supply unit (treatment liquid supply unit) 8 for rotating The upper surface of the substrate W held by the chuck 5 is supplied with water as an eluent (treatment liquid); a cleaning brush 10 is used to contact the upper surface of the substrate W to scrub and clean the upper surface; the cleaning brush driving unit 11 Which is used to drive the cleaning brush 10; the protective gas supply unit 12, which To supply an inert gas as a protective gas to the lower surface (surface (the other main surface) Wa) of the substrate W held by the rotary chuck 5; and a cylindrical processing cup portion (not shown) that surrounds the rotary chuck Head 5.

As shown in FIG. 2, the processing chamber 4 includes: a box-shaped partition wall (not shown); and an FFU (fan, filter, and unit, not shown) as the air supply unit, which extends from the upper part of the partition wall to the partition wall Clean air is conveyed inside (equivalent to the inside of the processing chamber 4); and an exhaust device (not shown) that exhausts the gas in the processing chamber 4 from the lower part of the partition wall. A downflow (downflow) is formed in the processing chamber 4 by the FFU and the exhaust device.

As shown in FIG. 2, the rotary chuck 5 includes a rotary table 107 rotatable about a rotation axis A1 in the vertical direction. A rotation shaft 108 is coupled to a lower surface of a rotation center of the rotation table 107 via a protrusion 109. The rotation shaft 108 is a hollow shaft and extends in the vertical direction. The rotation shaft 108 is configured to rotate around the rotation axis A1 by receiving a driving force from the rotation drive unit 103. The rotation driving unit 103 may be, for example, an electric motor having the rotation shaft 108 as a driving shaft.

As shown in FIG. 2, the rotary chuck 5 further includes a plurality of movable pins 110 (six in this embodiment) provided on a peripheral edge portion of the upper surface of the rotary table 107 at substantially equal intervals along the circumferential direction. Each movable pin 110 is configured so that the substrate W is held horizontally at a substrate holding height above a fixed interval from the turntable 107 having a substantially horizontal upper surface. That is, all the holding pins provided in the rotary chuck 5 are the movable pins 110.

The rotating table 107 is formed in a disc shape along a horizontal plane, and is coupled to a projection 109 coupled to the rotating shaft 108.

As shown in FIG. 3, each movable pin 110 is arrange | positioned at the peripheral part of the upper surface of the turntable 107 at equal intervals along the circumferential direction. 6 movable pins 110 The three adjacent movable pins 110 are set as a group in which the magnetic pole directions of the corresponding driving permanent magnets 156A and 156B are common. In other words, the six movable pins 110 include three movable pins 110 included in the first movable pin group 111 and the three movable pins 110 included in the second movable pin group 112. The pole direction of the first driving permanent magnet 156A corresponding to the three movable pins 110 included in the first movable pin group 111 and the second driving permanent magnet corresponding to the three movable pins 110 included in the second movable pin group 112 The directions of the magnetic poles of the magnet 156B are different from each other in a direction orthogonal to the rotation axis A3. The movable pins 110 included in the first movable pin group 111 and the movable pins 110 included in the second movable pin group 112 are alternately arranged in the circumferential direction of the turntable 107. Focusing on the first movable pin group 111, the three movable pins 110 are arranged at equal intervals (120 ° intervals). When focusing on the second movable pin group 112, the three movable pins 110 are arranged at equal intervals (120 ° intervals).

Each movable pin 110 includes: a lower shaft portion 151 which is coupled to the turntable 107; and an upper shaft portion (support portion) 152 which is integrally formed on the upper end of the lower shaft portion 151; the lower shaft portion 151 and the upper shaft portion 152, respectively It is formed in a cylindrical shape. The upper shaft portion 152 is eccentrically provided from the central axis of the lower shaft portion 151. A surface connecting the upper end of the lower shaft portion 151 and the lower end of the upper shaft portion 152 forms a tapered surface 153 that descends from the upper shaft portion 152 toward the peripheral surface of the lower shaft portion 151.

As shown in FIG. 7, each movable pin 110 is coupled to the rotary table 107 in such a manner that the lower shaft portion 151 can rotate around a rotation axis A3 coaxial with its central axis. More specifically, a support shaft 155 supported on the turntable 107 via a bearing 154 is provided at a lower end portion of the lower shaft portion 151. A magnet holding member 157 holding a driving permanent magnet (first and second driving magnets) 156A and 156B is coupled to a lower end of the support shaft 155. The driving permanent magnets 156A and 156B have, for example, a magnetic pole direction facing the movable pin 110. The rotation axis A3 is arranged orthogonally. The first driving permanent magnet 156A is a driving permanent magnet corresponding to the movable pin 110 included in the first movable pin group 111. The second driving permanent magnet 156B is a driving permanent magnet corresponding to the movable pin 110 included in the second movable pin group 112. The first driving permanent magnets 156A and the second driving permanent magnets 156B are provided in such a manner that the external driving force is applied to the rotating pins 110 without the external force being applied to the movable pins 110 corresponding to the driving permanent magnets 156A and 156B. In the direction orthogonal to the axis A3 (the direction orthogonal to the axis along the rotation axis), the same magnetic pole directions are opposite to each other. The first driving permanent magnets 156A and the second driving permanent magnets 156B are alternately arranged in the circumferential direction of the turntable 107.

The rotary table 107 is provided with the same number of closed permanent magnets 121 and 122 as the number of the movable pins 110. The closed permanent magnets 121 and 122 are provided in a one-to-one correspondence with the movable pin 110 and are disposed adjacent to the corresponding movable pin 110. In this embodiment, as shown in FIG. 3 and FIG. 4, the closed permanent magnets 121 and 122 are arranged around the corresponding movable pin 110, and the center position of the movable pin 110 is more distant from the rotation axis A1 when viewed from above. Configuration. Each of the closed permanent magnets 121 and 122 is housed in a magnet holding member 123 provided adjacent to the corresponding magnet holding member 157.

The plurality of closed permanent magnets 121 and 122 include three first closed permanent magnets (first pressing magnets) 121 corresponding to the three movable pins 110 included in the first movable pin group 111, and the second movable pin group. 112 includes three second closed permanent magnets (second pressure magnets) 122 corresponding to the three movable pins 110 included in 112. In other words, the first closed permanent magnet 121 corresponds to the first driving permanent magnet 156A, and the second closed permanent magnet 122 corresponds to the second driving permanent magnet 156B. The first closed permanent magnet 121 and the second closed permanent magnet 122 are alternately arranged in the circumferential direction of the turntable 107. Configuration. The first closed permanent magnet 121 and the second closed permanent magnet 122 are installed so as not to be able to move up and down with respect to the turntable 107.

As described above, the first driving permanent magnet 156A and the second driving permanent magnet 156B are provided so as to have the same magnetic pole directions that are opposite to each other in a direction orthogonal to the rotation axis A3. The first closed permanent magnet 121 and the second closed permanent magnet 122 are provided to apply a magnetic force to the corresponding driving permanent magnets 156A and 156B, and press the shaft portion 152 of the corresponding movable pin 110 to the holding position. Therefore, the first closed permanent magnet 121 and the second closed permanent magnet 122 are also provided so as to have the same magnetic pole directions that are opposite to each other in a direction orthogonal to the rotation axis A3.

The first driving permanent magnet 156A receives the attracting magnetic force from the first closed permanent magnet 121 and moves the upper shaft portion 152 toward a holding position close to the rotation axis A1. That is, the upper shaft portion 152 of the movable pin 110 included in the first movable pin group 111 is pressed toward the holding position by the attractive magnetic force of the first closed permanent magnet 121.

The second driving permanent magnet 156B receives the attracting magnetic force from the second closed permanent magnet 122 and moves the upper shaft portion 152 toward a holding position close to the rotation axis A1. That is, the upper shaft portion 152 of the movable pin 110 included in the second movable pin group 112 is pressed toward the holding position by the attracting magnetic force of the second closed permanent magnet 122. Therefore, when the driving permanent magnets 156A and 156B are not attracted by the attractive magnetic force from the open permanent magnets 125 and 127 described below, the movable pin 110 is located in an open position away from the rotation axis A1.

As shown in FIG. 2, a first open permanent magnet (first lifting magnet) 125 and a second open permanent magnet (second lifting magnet) 127 are provided below the turntable 107. The magnetic pole directions of the first open permanent magnet 125 and the second open permanent magnet 127 are along Up and down, but opposite to each other. When the upper surface of the first open permanent magnet 125 is, for example, an N-pole, the upper surface of the second open permanent magnet 127 has an S-pole of opposite polarity.

In this embodiment, each of the first open permanent magnet 125 and the second open permanent magnet 127 is provided with three (the same number as the number of the movable pins 110 included in the movable pin groups 111 and 112). The three first open permanent magnets 125 and the three second open permanent magnets 127 are alternately arranged in the circumferential direction of the turntable 107 in a plan view.

The three first open permanent magnets 125 are formed in an arc shape with the rotation axis A1 as the center, and are arranged at a height position common to each other and spaced apart from each other in the circumferential direction of the turntable 107. The three first open permanent magnets 125 have the same specifications as each other, and are arranged at equal intervals in the circumferential direction on the circumference coaxial with the rotation axis A1. Each first open permanent magnet 125 is arranged along a plane (horizontal plane) orthogonal to the rotation axis A1.

The first open permanent magnet 125 is formed in an annular shape coaxial with the rotation axis A1 and is arranged along a plane (horizontal plane) orthogonal to the rotation axis A1. More specifically, the first open permanent magnet 125 is disposed at a position farther than the first floating magnet 160 described below and closer to the driving permanent magnets 156A and 156B with respect to the rotation axis A1.

The circumferential length (angle) of each first open permanent magnet 125 is about 60 °. The reason why the circumferential length (angle) of each of the first open permanent magnets 125 is set to about 60 ° is to set it in such a manner that, when the substrate W is rotated at a liquid processing speed (for example, about 500 rpm), The ring-shaped area passing through the driving permanent magnets 156A and 156B that rotates in accordance with the rotation of the turntable 107 forms a ring-shaped The magnetic field generation region 129A (see FIG. 13A).

A first lifting unit (first relative moving unit) 126 is connected to the first open permanent magnet 125 to uniformly lift and lower the plurality of first open permanent magnets 125. The first elevating unit 126 is configured to include, for example, a cylinder that can be telescopically provided in the vertical direction, and is supported by the cylinder. The first elevating unit 126 may be configured using an electric motor. In addition, the first elevating unit 126 may elevate the first open permanent magnet 125 individually.

The first open permanent magnet 125 is used to generate an attracting magnetic force with the first driving permanent magnet 156A, and the shaft portion 152 of the movable pin 110 included in the first movable pin group 111 is opened toward the open position by the attracting magnetic force. Pressing magnet. The first open permanent magnet 125 is disposed above the first driving permanent magnet 156A in the vertical direction (first position, see FIGS. 8B and 19A), and the first open permanent magnet 125 and the first driving permanent magnet are arranged. In a state where 156A is facing horizontally, a magnetic force (attractive magnetic force) acts between the first open permanent magnet 125 and the first driving permanent magnet 156A.

The three second open permanent magnets 127 are formed in an arc shape with the rotation axis A1 as the center, and are arranged at a height position common to each other and spaced apart from each other in the circumferential direction of the turntable 107. The three second open permanent magnets 127 have the same specifications as each other, and are arranged at equal intervals in the circumferential direction on the circumference coaxial with the rotation axis A1. Each second open permanent magnet 127 is arranged along a plane (horizontal plane) orthogonal to the rotation axis A1.

The second open permanent magnet 127 is formed in an annular shape coaxial with the rotation axis A1 and is arranged along a plane (horizontal plane) orthogonal to the rotation axis A1. More specifically, the second open permanent magnet 127 is disposed with respect to the rotation axis A1. In other words, it is located farther from the first floating magnet 160 as described below and closer to the driving permanent magnets 156A and 156B.

The circumferential length (angle) of each second open permanent magnet 127 is about 60 °. The reason why the circumferential length (angle) of each of the second open permanent magnets 127 is set to about 60 ° is to set it in such a manner that, when the substrate W is rotated at a liquid processing speed (for example, about 500 rpm), An annular magnetic field generating region 129B (see FIG. 13B) is formed in an annular region that passes through the driving permanent magnets 156A and 156B that rotates as the turntable 107 rotates.

A second elevating unit (second relative moving unit) 128 for integrally elevating the plurality of second open permanent magnets 127 is connected to the second open permanent magnet 127. The second elevating unit 128 is configured to include, for example, a cylinder that can be telescopically provided in the vertical direction, and is supported by the cylinder. The second elevating unit 128 may be configured using an electric motor. In addition, the second lifting unit 128 may lift and lower the second open permanent magnet 127 individually.

The second open permanent magnet 127 is used to generate an attractive magnetic force between the second driving permanent magnet 156B and the shaft 152 of the movable pin 110 included in the second movable pin group 112 toward the open position by the attractive magnetic force. Pressing magnet. The second open permanent magnet 127 is arranged at a position where the magnetic pole is close to the second drive permanent magnet 156B in the vertical direction (the third position, see FIGS. 9B and 19A), and the second open permanent magnet 127 and the second drive permanent magnet are arranged. In a state where 156B is facing horizontally, a magnetic force (attraction magnetic force) acts between the second open permanent magnet 127 and the second driving permanent magnet 156B.

The first opening permanent magnet 125 and the second opening permanent magnet 127 are raised and lowered using the first lifting unit 126 and the second lifting unit 128, respectively. Therefore, the first The first open permanent magnet 125 and the second open permanent magnet 127 are raised and lowered independently of each other.

As shown in FIG. 2, the rotary chuck 5 further includes a protective disc 115 disposed between the upper surface of the rotary table 107 and the substrate holding height by the movable pin 110. The protection plate 115 is coupled to be able to move up and down with respect to the rotary table 107, and can be positioned near and below the upper surface of the rotary table 107 and above the lower position and held on the lower surface of the substrate W of the movable pin 110 Move between close positions approached at small intervals. The protective disc 115 is a disc-shaped member having a diameter slightly larger than that of the substrate W, and a cutout 116 for avoiding the movable pin 110 is formed at a position corresponding to the movable pin 110.

The rotating shaft 108 is a hollow shaft, and an inert gas supply pipe 170 is inserted in the rotating shaft 108. An inert gas supply path 172 for introducing an inert gas from an inert gas supply source as an example of a shielding gas is connected to the lower end of the inert gas supply pipe 170. Examples of the inert gas introduced along the inert gas supply path 172 include clean dry air (CDA) (clean air with low humidity) and inert gas such as nitrogen. An inert gas valve 173 and an inert gas flow adjustment valve 174 are installed in the middle of the inert gas supply path 172. The inert gas valve 173 opens and closes the inert gas supply path 172. When the inert gas valve 173 is opened, the inert gas is supplied to the inert gas supply pipe 170. This inert gas system is supplied to the space between the protective disk 115 and the lower surface of the substrate W by the following configuration. In this way, the protective gas supply unit 12 is configured by the inert gas supply pipe 170, the inert gas supply path 172, the inert gas valve 173, and the like.

The protective disk 115 is a substantially disk-shaped member having the same size as the substrate W. A cutout 116 is formed on the peripheral edge portion of the protection plate 115 at a position corresponding to the movable pin 110 so as to be bordered on the movable pin 110 at a fixed interval from the outer peripheral surface of the movable pin 110. A protrusion 109 is formed in a central region of the protection plate 115. Corresponding circular opening.

As shown in FIGS. 3 and 5, a guide shaft 117 extending in the vertical direction parallel to the rotation axis A1 is coupled to the lower surface of the protection plate 115 at a position farther from the rotation axis A1 than the convex seat 109. In the present embodiment, the guide shafts 117 are arranged at three positions at regular intervals along the circumferential direction of the protection plate 115. More specifically, when viewed from the rotation axis A1, three guide shafts 117 are arranged at angular positions corresponding to every other movable pin 110. The guide shaft 117 is combined with a linear bearing 118 provided at a corresponding portion of the rotary table 107, and can be moved in a vertical direction, that is, a direction parallel to the rotation axis A1, while being guided by the linear bearing 118. Therefore, the guide shaft 117 and the linear bearing 118 constitute a guide unit 119 that guides the protection disc 115 in a vertical direction parallel to the rotation axis A1.

The guide shaft 117 penetrates the linear bearing 118 and has a flange 120 protruding outward at a lower end thereof. The flange 120 abuts on the lower end of the linear bearing 118, and restricts the upward movement of the guide shaft 117, that is, the upward movement of the protection disc 115. That is, the flange 120 is a restriction member that restricts the upward movement of the protection disc 115.

At a position farther away from the rotation axis A1 than the guide shaft 117 and inside the rotation pin A1 closer than the movable pin 110, a magnet holding a first floating magnet 160 is fixed to the lower surface of the protection plate 115. Holding member 161. In the present embodiment, the first floating magnet 160 is held on the magnet holding member 161 with the magnetic pole direction facing up and down. For example, the first floating magnet 160 may be fixed to the magnet holding member 161 so as to have an S pole on the lower side and an N pole on the upper side. In this embodiment, the magnet holding members 161 are provided at six positions at regular intervals in the circumferential direction. More specifically, when viewed from the rotation axis A1, each magnet is disposed at an angular position corresponding to an adjacent movable pin 110 (middle in this embodiment). Holding member 161. Furthermore, when viewed from the rotation axis A1, each of the six angular regions divided by six magnet holding members 161 (equivalent in this embodiment) is within every other angular region (in the present embodiment, the center of the angular region). Position) are provided with three guide shafts 117, respectively.

As shown in FIG. 4, through-holes 162 are formed on the turntable 107 at six locations corresponding to the six magnet holding members 161. Each through-hole 162 is formed so that the corresponding magnet holding member 161 can be inserted in the vertical direction parallel to the rotation axis A1, respectively. When the protection plate 115 is in the lower position, the magnet holding member 161 is inserted through the through hole 162 and protrudes below the lower surface of the turntable 107, and the first floating magnet 160 is located closer to the lower surface of the turntable 107. Below.

Below the turntable 107, a second floating magnet 129 is provided for floating the protection plate 115. The second floating magnet 129 is formed in an annular shape coaxial with the rotation axis A1, and is arranged along a plane (horizontal plane) orthogonal to the rotation axis A1. The second floating magnet 129 is located closer to the first and second open permanent magnets 125 and 127 relative to the rotation axis A1. That is, it is located closer to the inner diameter side than the first and second open permanent magnets 125 and 127 in a plan view. The second floating magnet 129 is disposed at a position lower than the first floating magnet 160. In this embodiment, the magnetic pole direction of the second floating magnet 129 is along the horizontal direction, that is, the rotation radius direction of the turntable 107. When the lower surface of the first floating magnet 160 has S poles, the second floating magnet 129 is configured to have the same magnetic poles, that is, the S poles, in a ring shape on the inner side in the radial direction of rotation.

A third lifting unit (third relative moving unit) 130 that lifts and lowers the second floating magnet 129 is connected to the second floating magnet 129. The third lifting unit 130 is, for example, a structure including a cylinder that can be telescopically provided in the vertical direction, and is supported by the cylinder. support. The third lifting unit 130 may be configured using an electric motor.

When the second floating magnet 129 is positioned upward (see FIG. 19B), a repulsive magnetic force acts between the second floating magnet 129 and the first floating magnet 160, and the first floating magnet 160 receives an upward external force. As a result, the protection disk 115 is held by the magnet holding member 161 that holds the first floating magnet 160 upward at a position close to the lower surface of the substrate W under an upward force.

In a state where the second floating magnet 129 is disposed at a lower position (refer to FIG. 19A) from the upper position to the lower position (see FIG. 19A), the repulsive magnetic force between the second floating magnet 129 and the first floating magnet 160 is small. The protection plate 115 is held near the upper surface of the turntable 107 by its own weight.

Therefore, when the second floating magnet 129 is located in the lower position, the protection plate 115 is located near the lower surface of the upper surface of the turntable 107, and the movable pin 110 is held in the open position. In this state, the center robot CR that carries the substrate W in and out of the rotary chuck 5 can cause its hand H2 to enter the space between the protection disk 115 and the lower surface of the substrate W.

In this embodiment, a dedicated lifting unit (third lifting unit 130) for lifting the protection plate 115 is provided. Therefore, the lifting operation of the second floating magnet 129 can be performed independently of each of the lifting operation of the first open permanent magnet 125 and the lifting operation of the second open permanent magnet 127. That is, this means that the lifting operation of the first open permanent magnet 125 and the lifting operation of the second open permanent magnet 127 can be realized regardless of the upper and lower positions of the protection plate 115.

As enlargedly shown in FIG. 6, the convex seat 109 coupled to the upper end of the rotating shaft 108 holds a bearing unit 175 for supporting the upper end of the inert gas supply pipe 170. The bearing unit 175 includes a spacer 177 which is fitted and fixed to the boss formed in the spacer. The recess 176 of 109; the bearing 178 is arranged between the spacer 177 and the inert gas supply pipe 170; and the magnetic fluid bearing 179 is similarly arranged between the spacer 177 and the inert gas supply pipe 170 and compared with the bearing 178 is even higher.

As shown in FIG. 5, the boss 109 integrally has a flange 181 protruding outward along the horizontal plane, and a rotary table 107 is coupled to the flange 181. Further, the spacer 177 is fixed to the flange 181 so as to sandwich the inner peripheral portion of the turntable 107, and a cover portion 184 is coupled to the spacer 177. The cover portion 184 is formed in a substantially disc shape, has an opening at the center for exposing the upper end of the inert gas supply pipe 170, and a recess 185 is formed on the upper surface thereof with the opening as a bottom surface. The recess 185 has a horizontal bottom surface and an inclined cone-shaped inclined surface 183 that rises obliquely upward from the peripheral edge of the bottom surface toward the outside. A rectifying member 186 is coupled to the bottom surface of the recess 185. The rectifying member 186 has a plurality of (for example, four) leg portions 187 that are discretely disposed at intervals around the rotation axis A1 in the circumferential direction, and that the leg portions 187 are disposed at intervals from the bottom surface of the recess 185. Underside 188. An inclined surface 189 including an inverted conical surface extending diagonally upward from the peripheral edge portion of the bottom surface 188 toward the outside is formed.

As shown in FIGS. 5 and 6, a flange 184 a is formed on the outer peripheral edge of the upper surface of the cover portion 184 toward the outside. The flange 184a is aligned with the stepped portion 115a formed on the inner peripheral edge of the protection plate 115. That is, when the protection plate 115 is located close to the lower surface of the substrate W, the flange 184a and the stepped portion 115a meet, and the upper surface of the cover portion 184 and the upper surface of the protection plate 115 are in the same plane to form flat inertia. Gas flow path.

With this configuration, the inert gas system flowing from the upper end of the inert gas supply pipe 170 flows into the space defined by the bottom surface 188 of the rectifying member 186 in the recess 185 of the cover portion 184. The inert gas further passes through the inclined surface 183 of the recess 185 and the rectification. The radial flow path 182 defined by the inclined surface 189 of the member 186 is blown out in a radial direction away from the rotation axis A1. The inert gas system forms a flow of inert gas in the space between the protective disc 115 and the lower surface of the substrate W held by the movable pin 110, and blows out from the space toward the outside of the substrate W in the direction of the radius of rotation.

As shown in FIG. 5, the peripheral edge portion of the upper surface of the protection plate 115 and the peripheral end of the protection plate 115 are protected by a ring-shaped ring cover 191. The ring cover 191 includes a ring plate portion 192 that projects horizontally from a peripheral edge portion of the upper surface toward a radially outer side, and a cylindrical portion 193 that hangs from a peripheral end of the ring plate portion 192. The outer periphery of the annular plate portion 192 is located further outside than the peripheral end of the turntable 107. The annular plate portion 192 and the cylindrical portion 193 are integrally formed using, for example, a resin material having chemical resistance. A cutout 194 is formed at a position corresponding to the movable pin 110 on the inner periphery of the annular plate portion 192 to avoid the movable pin 110. The cutout 194 is formed so that the movable pin 110 is bordered by a fixed interval from the outer peripheral surface of the movable pin 110. The annular plate portion 192 and the cylindrical portion 193 are integrally formed using, for example, a resin material having chemical resistance.

The annular plate portion 192 of the annular cover 191 is a throttle portion 190 (see FIG. 20C) having an upper surface that restricts the flow path of the inert gas to the peripheral edge portion of the substrate W held by the movable pin 110. With the throttle portion 190, the flow rate of the inert gas flow blown outward from the space between the annular cover 191 and the lower surface of the substrate W becomes high speed. Therefore, the processing of the upper surface of the substrate W can be reliably avoided or suppressed. The liquid (medicine solution or eluent) enters more inward than the peripheral edge portion of the lower surface of the substrate W.

As shown in FIG. 2, the medicinal solution supply unit 7 includes a medicinal solution nozzle 6 that discharges a FOM (medicine solution) toward the upper surface of the substrate W; a nozzle arm 21 that is mounted with a medicinal solution nozzle 6 at a front end thereof; A unit 22 moves the medicinal liquid nozzle 6 by moving the nozzle arm 21.

The chemical liquid nozzle 6 is, for example, a DC nozzle that discharges the FOM in a continuous flow state, and is attached to the nozzle arm 21 in a vertical posture that discharges the FOM in a direction perpendicular to the upper surface of the substrate W, for example. The nozzle arm 21 extends in a horizontal direction and is provided so as to be rotatable around a predetermined swing axis (not shown) extending in the vertical direction on the periphery of the rotary chuck 5.

The medicinal solution supply unit 7 includes a medicinal solution pipe 14 that guides the FOM to the medicinal solution nozzle 6 and a medicinal solution valve 15 that opens and closes the medicinal solution pipe 14. When the chemical liquid valve 15 is opened, the FOM from the FOM supply source is supplied from the chemical liquid pipe 14 to the chemical liquid nozzle 6. Thereby, FOM is discharged from the chemical liquid nozzle 6.

The nozzle moving unit 22 horizontally moves the chemical liquid nozzle 6 along the center of the upper surface of the substrate W in a plan view by rotating the nozzle arm 21 around the swing axis. The nozzle moving unit 22 is a processing position at which the chemical liquid nozzle 6 is deposited on the upper surface of the substrate W by the FOM liquid discharged from the chemical liquid nozzle 6 and the initial position of the chemical liquid nozzle 6 is set around the rotary chuck 5 in a plan view. Move horizontally between. Further, the nozzle moving unit 22 causes the chemical liquid nozzle 6 to be injected onto the substrate W at the center position of the central portion of the upper surface of the substrate W and the FOM ejected from the chemical liquid nozzle 6 onto the substrate W. The peripheral positions of the surface peripheral part move horizontally. The central position and the peripheral position are both processing positions.

In addition, the chemical liquid nozzle 6 may be a fixed nozzle in which a discharge port is fixedly arranged at a predetermined position (for example, a central portion) of the upper surface of the substrate W.

As shown in FIG. 2, the water supply unit 8 includes a water nozzle 41. The water nozzle 41 is, for example, a direct-current nozzle that discharges liquid in a continuous flow state, and the discharge nozzle is fixedly disposed above the rotary chuck 5 so that its discharge port faces the upper surface of the substrate W. A water pipe 42 is connected to the water nozzle 41 to supply water from a water supply source. In the water pipe 42 A water valve 43 is provided in the middle part to switch the stop of the supply / supply of water from the water nozzle 41. When the water valve 43 is opened, a continuous flow of water supplied from the water pipe 42 to the water nozzle 41 is discharged from a discharge port set at the lower end of the water nozzle 41. When the water valve 43 is closed, the supply of water from the water pipe 42 to the water nozzle 41 is stopped. Water is, for example, deionized water (DIW). It may be any of carbonated water, electrolytic ion water, hydrogen water, ozone water, and dilute hydrochloric acid water (for example, about 10 ppm to 100 ppm), and is not limited to DIW.

In addition, the water nozzle 41 does not need to be fixedly disposed with respect to the rotary chuck 5, for example, a so-called scanning nozzle may be adopted. The scanning nozzle is mounted on an arm that can swing above the rotary chuck 5 in a horizontal plane. The swing of the arm scans the position of the liquid on the upper surface of the substrate W.

The cleaning brush 10 is a sponge-like scrubbing member containing, for example, polyvinyl alcohol (PVA), and is formed in a cylindrical shape. The cleaning brush 10 has a flat cleaning surface 10a on its lower surface. The cleaning surface 10a functions as a contact surface which contacts the upper surface of the substrate W.

The cleaning brush driving unit 11 includes: a swing arm 47 that holds the cleaning brush 10 at the front end portion; and an arm driving unit 48 that drives the swing arm 47. The arm driving unit 48 is configured to swing the swing arm 47 about a swing axis A2 extending in the vertical direction or to move the swing arm 47 up and down. With this configuration, when the substrate W is held and rotated by the rotary chuck 5, the cleaning brush 10 can be moved horizontally between the position above the substrate W and the initial position set to the side of the rotary chuck 5.

Further, the cleaning surface 10a of the cleaning brush 10 may be pressed against the upper surface (back surface Wb) of the substrate W, and the pressing position of the cleaning brush 10 may be along the substrate W between the central portion of the substrate W and the peripheral edge portion of the substrate W. Move (scan) in the radial direction.

During this scrubbing and washing, water (for example, pure water) is supplied from the water nozzle 41 (deionized water)), and the foreign matter on the back surface Wb of the substrate W can be easily eliminated, and the foreign matter wiped off by the cleaning brush 10 can be discharged to the outside of the substrate W.

As described above with reference to FIG. 7, the movable pin 110 has the upper shaft portion 152 at a position eccentric from the rotation axis A3. That is, the center axis B of the upper shaft portion 152 is offset from the rotation axis A3. Therefore, by the rotation of the lower shaft portion 151, the upper shaft portion 152 is at a relatively open position (the central axis B) away from the rotation axis A1 (see FIGS. 8B and 9B below) and (the central axis B) It is shifted between the holding position (refer to FIG. 8A and FIG. 9A described below) near the rotation axis A1. The upper shaft portion 152 of the movable pin 110 is pressed toward the open position by the elastic pressing force of an elastic pressing member (not shown) such as a spring. When the movable pin 110 is in the open position, a predetermined gap is formed with the peripheral end surface of the substrate W.

8A and 8B are schematic diagrams showing a state of the movable pin 110 included in the first movable pin group 111 accompanying the lifting operation of the first open permanent magnet 125. 9A and 9B are schematic diagrams showing a state of the movable pin 110 included in the second movable pin group 112 accompanying the lifting operation of the second open permanent magnet 127. FIG. 8A shows a state where the first open permanent magnet 125 is in the lower position (second position), and FIG. 8B shows a state where the first open permanent magnet 125 is in the upper position. FIG. 9A shows a state where the second open permanent magnet 127 is in the lower position, and FIG. 9B shows a state where the second open permanent magnet 127 is in the upper position.

Even if the angular position of the first open permanent magnet 125 and the first driving permanent magnet 156A are the same, as shown in FIG. 8A, the first open permanent magnet 125 is located in the lower position, and the first open permanent magnet 125 comes from the first open permanent magnet 125. The magnetic force does not act on the first driving permanent magnet 156A. Therefore, the movable pin 110 included in the first movable pin group 111 is located at the holding position. In this state, the first driving permanent magnet 156A is arranged such that the N pole faces the radially inner side of the turntable 107 and the S pole faces the radially outer side of the turntable 107, for example.

The first open permanent magnet 125 is raised from the state shown in FIG. 8A and is disposed at the upper position. When the upper surface of the first open permanent magnet 125 approaches the first drive permanent magnet 156A, an attractive magnetic force is generated to the first drive permanent magnet 156A, and between the first drive permanent magnet 156A and the first open permanent magnet 125. Be attractive. In a state where the first open permanent magnet 125 is arranged in the upper position, the magnitude of the attractive magnetic force acting on the first driving permanent magnet 156A is much larger than that of the first closed permanent magnet 121 (pressing force). The shaft portion 152 moves from a holding position near the rotation axis A1 to an open position away from the rotation axis A1 (see FIG. 2). Thereby, the movable pin 110 included in the first movable pin group 111 is pressed toward the open position. In this state, as shown in FIG. 8B, the first driving permanent magnet 156A is arranged such that the S pole faces the radially inner side of the turntable 107 and the N pole faces the radially outer side of the turntable 107, for example.

Even if the angular position of the second open permanent magnet 127 and the second driving permanent magnet 156B are the same, the second open permanent magnet 127 is located in the lower position (fourth position) as shown in FIG. 9A. The magnetic force of the 2 open permanent magnet 127 does not act on the second driving permanent magnet 156B. Therefore, the movable pin 110 included in the second movable pin group 112 is located at the holding position. In this state, the second driving permanent magnet 156B is arranged, for example, such that the S pole faces the radially inner side of the turntable 107 and the N pole faces the radially outer side of the turntable 107.

From the state shown in FIG. 9A, the second open permanent magnet 127 is raised and arranged in the upper position. When the upper surface of the second open permanent magnet 127 approaches the second driving permanent magnet 156B, an attractive magnetic force is generated to the second driving permanent magnet 156B. An attractive force is generated between the second driving permanent magnet 156B and the second open permanent magnet 127. In a state where the second open permanent magnet 127 is arranged in the upper position, the magnitude of the attractive magnetic force acting on the second driving permanent magnet 156B is far greater than the attractive magnetic force (pressure) from the second closed permanent magnet 122. The shaft portion 152 moves from a holding position near the rotation axis A1 to an open position away from the rotation axis A1 (see FIG. 2). Thereby, the movable pin 110 included in the second movable pin group 112 is pressed toward the open position. In this state, as shown in FIG. 9B, the second driving permanent magnet 156B is arranged such that the N pole faces the radially inner side of the turntable 107 and the S pole faces the radially outer side of the turntable 107, for example.

10A to 15B are schematic diagrams showing states of the first movable pin group 111 and the second movable pin group 112. The states of the driving permanent magnets 156A and 156B and the open permanent magnets 125 and 127 are shown in Figs. 10A, 11A, 12A, 13A, 14A, and 15A, and the movable states are shown in Figs. 10B, 11B, 12B, 13B, 14B, and 15B. Switching status of pin 110.

FIGS. 10A and 10B show a state where the first and second open permanent magnets 125 and 127 are both in the upper position, and FIGS. 11A and 11B show a state where the first and second open permanent magnets 125 and 127 are in the lower position. Figs. 12A to 13B show a state where the first open permanent magnet 125 is in the upper position and the second open permanent magnet 127 is in the lower position. Figs. 12A and 12B are non-rotating states of the rotary table 107, and Figs. 13A and 13B are rotary tables. 107 rotation state. 14A to 15B show a state in which the second open permanent magnet 127 is in the upper position and the first open permanent magnet 125 is in the lower position. FIGS. 14A and 14B are non-rotating states of the rotary table 107, and FIGS. 15A and 15B are rotary tables 107 rotation state.

The open permanent magnets 125 and 127 are along the circumference of the turntable 107. Arranged at equal intervals of 60 °. The movable pins 110 are also arranged at equal intervals of 60 °. Therefore, as shown in FIGS. 10A, 11A, 12A, 13A, 14A, and 15A, the angular positions of the first open permanent magnets 125 and the first drive permanent magnets 156A can be aligned (opposing each other) and the second open The permanent magnets 127 and the second driving permanent magnets 156B have an angular position in which their angular positions are aligned (opposite each other).

In this opposed state, in a state where the first and second open permanent magnets 125 and 127 are arranged in the upper position as shown in FIGS. 10A and 10B, the three movable pins included in the first movable pin group 111 110 and any of the three movable pins 110 included in the second movable pin group 112, that is, the six movable pins 110 are all arranged in the open position (open).

In the above-mentioned facing state, in a state where the first and second open permanent magnets 125 and 127 are arranged in the lower position as shown in FIGS. 11A and 11B, the three movable pins included in the first movable pin group 111 110 and any of the three movable pins 110 included in the second movable pin group 112, that is, the six movable pins 110 are all arranged in the holding position (closed).

In the above-mentioned facing state, as shown in FIGS. 12A and 12B, the first movable permanent magnet 125 is arranged in the upper position and the second opened permanent magnet 127 is arranged in the lower position, in the first movable pin group 111. The three movable pins 110 included are arranged in an open position (open), and the three movable pins 110 included in the second movable pin group 112 are arranged in a holding position (closed).

Consider a state where the turntable 107 is rotated from the state of FIGS. 12A and 12B. The rotation speed of the turntable 107 is set to a liquid processing speed (for example, about 500 rpm). In the rotating state of the rotary table 107, a magnetic field generating region is formed in a ring-shaped region passed by the driving permanent magnets 156A and 156B that rotates with the rotation of the rotary table 107. 129A (refer to FIG. 13A). The circumferential length (angle) of the magnetic field generating region 129A is longer than the circumferential length (angle) of the corresponding first open permanent magnet 125. Since the length (angle) of the first open permanent magnet 125 in the circumferential direction is 60 °, and three first open permanent magnets 125 are provided in the circumferential direction of the turntable 107, the substrate W is processed at a liquid processing speed (for example, approximately (500rpm) When rotating in the direction of rotation Dr, the ring-shaped area through which the driving permanent magnets 156A and 156B that rotates with the rotation of the turntable 107 passes, as shown in FIGS. 13A and 13B, forms a circumferential magnetic field generating area 129A. (Refer to FIG. 13A).

Since the magnetic field generating region 129A (see FIG. 13A) has a full-circle ring shape, regardless of the rotation posture of the turntable 107, the attractive magnetic force from the first open permanent magnet 125 acts on the first driving permanent magnet 156A. Therefore, in the rotating state of the turntable 107, the three movable pins 110 included in the first movable pin group 111 are arranged in the open position (open). Of course, the three movable pins 110 included in the second movable pin group 112 are arranged at the holding position (closed). At this time, the substrate W is supported by the three movable pins 110 included in the second movable pin group 112 and rotates well.

In the facing state, as shown in FIGS. 14A and 14B, the second movable permanent magnet 127 is arranged in the upper position and the first movable permanent magnet 125 is arranged in the lower position, in the second movable pin group 112. The three movable pins 110 included are arranged in an open position (open), and the three movable pins 110 included in the first movable pin group 111 are arranged in a holding position (closed).

Consider a state where the turntable 107 is rotated from the state of FIGS. 14A and 14B. The rotation speed of the turntable 107 is set to a liquid processing speed (for example, about 500 rpm). In the rotating state of the rotary table 107, a magnetic field generating region is formed in a ring-shaped region passed by the driving permanent magnets 156A and 156B that rotates with the rotation of the rotary table 107. 129B (refer to FIG. 15A). The circumferential length (angle) of the magnetic field generating region 129B is longer than the circumferential length (angle) of the corresponding second open permanent magnet 127. Since the length (angle) of the second open permanent magnet 127 in the circumferential direction is 60 ° and three second open permanent magnets 127 are provided in the circumferential direction of the turntable 107, the substrate W is processed at a liquid processing speed (for example, approximately (500 rpm) When rotating in the direction of rotation Dr, the ring-shaped area passed by the driving permanent magnets 156A and 156B rotating with the rotation of the turntable 107, as shown in FIGS. 15A and 15B, forms a ring-shaped magnetic field generating area 129B. (Refer to FIG. 15A).

Since the magnetic field generation region 129B (see FIG. 15A) has a full-circle shape, regardless of the rotation posture of the turntable 107, the attraction magnetic force from the second open permanent magnet 127 acts on the second driving permanent magnet 156B. Therefore, in the rotating state of the turntable 107, the three movable pins 110 included in the second movable pin group 112 are arranged in the open position (open). Of course, the three movable pins 110 included in the first movable pin group 111 are arranged at the holding position (closed). At this time, the substrate W is supported by the three movable pins 110 included in the first movable pin group 111 and rotates well.

As such, in the rotating state of the substrate W, the control device 3 controls the first lifting unit 126 and the second lifting unit 128 to arrange the first open permanent magnet 125 in the upper position and the second open permanent magnet 127 in the lower position. The state of the position (see FIGS. 13A and 13B) and the state (see FIGS. 15A and 15B) in which the second open permanent magnet 127 is arranged in the upper position and the first open permanent magnet 125 is arranged in the lower position can be switched. The state where the three movable pins 110 included in the first movable pin group 111 are in contact with the support substrate W and the state where the three movable pins 110 included in the second movable pin group 112 are in contact with the support substrate W are switched.

FIG. 16 is an electrical diagram for explaining the main part of the substrate processing apparatus 1 Composition of block diagrams.

The control device 3 controls operations of the rotation driving unit 103, the nozzle moving unit 22, the arm driving unit 48, the first to third lifting units 126, 128, 130, and the like according to a predetermined program. Further, the control device 3 controls switching operations of the chemical liquid valve 15, the water valve 43, the inert gas valve 173, the inert gas flow rate adjustment valve 174, and the like.

FIG. 17 is a flowchart for explaining an example of a cleaning process as a processing liquid process performed by the processing unit 2. Fig. 18 is a timing chart for explaining the treatment liquid treatment. 19A to 19K are diagrams for explaining an example of the treatment liquid treatment described above. 20A and 20B are diagrams showing the flow-back state of the processing liquid at various times when the movable pin 110 is in the holding position and when the movable pin 110 is in the open position. FIG. 20C is a cross-sectional view showing the flow of the processing liquid and the inert gas at the peripheral portion of the substrate W. FIG.

The treatment liquid treatment will be described with reference to FIGS. 1, 2 to 7, 17 and 18. 19A to 19K and FIGS. 20A to 20C are appropriately referred to.

The processing unit 2 sets, for example, a substrate (hereinafter, sometimes referred to as “uncleaned substrate”) W processed by a pretreatment device such as an annealing device or a film forming device as a processing target. An example of the substrate W is a circular silicon substrate. The processing unit 2 cleans, for example, the back surface Wb (one main surface, a non-device-forming surface) of the substrate W opposite to the surface Wa (the other main surface, the device-forming surface).

The carrier C containing the uncleaned substrate W is transferred from the pre-processing apparatus to the substrate processing apparatus 1 and is placed in the loading port LP. A substrate W is housed on the carrier C with the surface Wa of the substrate W facing upward. The control device 3 transfers the substrate W from the carrier C to the turning unit TU with the indexing robot IR with the surface Wa facing upward. Then, the control device 3 reverses the conveyed substrate W by the reversing unit TU (S1: Substrate flipped). Thereby, the back surface Wb of the substrate W is directed upward. After that, the control device 3 takes out the substrate W from the reversing unit TU through the hand H2 of the center robot CR, and carries the substrate W into the processing unit 2 with its back surface Wb facing upward (step S2).

Before the substrate W is carried in, the chemical liquid nozzle 6 retracts to the initial position set on the side of the rotary chuck 5. In addition, the cleaning brush 10 is also retracted to the initial position set on the side of the rotary chuck 5. The angular positions of the first open permanent magnets 125 and the first driving permanent magnets 156A face each other, and the angular positions of the second open permanent magnets 127 and the second driving permanent magnets 156B face each other. The state mode determines the rotation direction posture of the turntable 107. Both the first open permanent magnet 125 and the second open permanent magnet 127 are arranged at the upper position. At this time, the state shown in FIGS. 11A and 11B is obtained. In this state, all of the three movable pins 110 included in the first movable pin group 111 and the three movable pins 110 included in the second movable pin group 112, that is, the six movable pins 110 are all disposed in the open state. position.

In addition, since the second floating magnet 129 is disposed in a lower position, the second floating magnet 129 is largely spaced downward from the turntable 107, and therefore acts between the second floating magnet 129 and the first floating magnet 160. Its repulsive magnetic force is small. Therefore, the protection plate 115 is located close to the lower surface of the upper surface of the turntable 107. Thereby, a sufficient space that the hand H2 of the center robot CR can enter is ensured between the substrate holding height based on the movable pin 110 and the upper surface of the protection plate 115.

The hand H2 of the center robot CR holds the substrate W at a position higher than the upper end of the movable pin 110, and carries the substrate W above the rotary chuck 5. Thereafter, as shown in FIG. 19A, the hand H2 of the center robot CR descends toward the upper surface of the turntable 107.

Then, the control device 3 controls the first and second lifting units 126 and 128 to lower the first open permanent magnet 125 and the second open permanent magnet 127 toward the lower position and maintain the lower position (step S3). At this time, the state shown in FIGS. 10A and 10B is obtained. Therefore, by this, all the movable pins 110 are driven from the open position toward the holding position, and are held in the holding position. Accordingly, the substrate W is held by the six movable pins 110. The substrate W is held by the spin chuck 5 with its surface Wa facing downward and its back surface Wb facing upward.

Thereafter, the hand H2 of the center robot CR passes between the movable pins 110 and retracts to the side of the rotary chuck 5.

In addition, the control device 3 controls the third elevating unit 130, and as shown in FIG. 19B, raises the second floating magnet 129 toward the upper position. The distance between the floating magnets 129 and 160 is reduced, and accordingly, the repulsive magnetic force acting between them increases. By the repulsive magnetic force, the protection disk 115 floats from the upper surface of the turntable 107 toward the substrate W. Then, when the first open permanent magnet 125 reaches the upper position, the protection disc 115 reaches the approach position which is close to the surface Wa (lower surface) of the substrate W at a slight interval, and is formed on the flange at the lower end of the guide shaft 117 120 is in abutment with the linear bearing 118. Thereby, the protection plate 115 is maintained at the above-mentioned close position. In this state, the control device 3 opens the inert gas valve 173, and starts the supply of the inert gas as shown in FIG. 19B (S4: start of the inert gas supply). The supplied inert gas system is ejected from the upper end of the inert gas supply pipe 170, and is directed toward a narrow space between the protection disk 115 located at the close position and the surface Wa (lower surface) of the substrate W by the action of the rectifying member 186 and the like. It blows out radially around the rotation axis A1.

Thereafter, the control device 3 controls the rotation driving unit 103 to start the rotation of the rotary table 107 (the rotary table rotation step), thereby, as shown in FIG. 19C, the substrate W rotates around the rotation axis A1 (step S5). The rotation speed of the substrate W is increased to a predetermined liquid processing speed (in a range of 300 to 1500 rpm, for example, 500 rpm), and maintained at the liquid processing speed.

After the rotation speed of the substrate W reaches the liquid processing speed, the control device 3 performs a FOM supply step (a processing liquid supply step, step S6) of supplying the FOM to the back surface Wb of the substrate W as shown in FIG. 19C. In the FOM supply step (S6), the control device 3 moves the chemical liquid nozzle 6 from the starting position to the center position by controlling the nozzle moving unit 22. Thereby, the chemical | medical solution nozzle 6 is arrange | positioned above the center part of the board | substrate W. After the medicinal liquid nozzle 6 is disposed above the substrate W, the control device 3 opens the medicinal liquid valve 15, whereby the FOM is ejected from the discharge port of the medicinal liquid nozzle 6 and impinges on the center of the back surface Wb of the substrate W. The FOM supplied to the central portion of the back surface Wb of the substrate W is expanded radially toward the peripheral edge portion of the back surface Wb of the substrate W by the centrifugal force generated by the rotation of the substrate W. Therefore, the FOM can cover the entire area of the back surface Wb of the substrate W.

In the FOM supply step (S6), a silicon oxide film is formed on the back surface Wb of the substrate W as a silicon substrate by the oxidation of ozone contained in the FOM. In addition, the scratches (notches, recesses, etc.) formed on the back surface Wb of the substrate W are removed by the etching effect of the hydrofluoric acid oxide film included in the FOM, and foreign matter is also removed from the back surface Wb of the substrate W ( Particles, impurities, exfoliation of the back surface Wb of the substrate W, etc.).

In the FOM supply step (S6), the inert gas system discharged from the upper end of the inert gas supply pipe 170 is directed toward the protection disk 115 and the surface Wa (lower surface) of the substrate W located at the close position by the action of the rectifying member 186 and the like. The narrow space between them is blown out radially with the rotation axis A1 as the center. As shown in FIG. 20C, the inert gas is further formed by a ring cover formed on a peripheral portion of the protection plate 115. The orifice 191 between the throttle plate 190 of the annular plate portion 192 and the peripheral edge portion of the substrate W accelerates, and a high-speed blowing air current is formed on the side of the substrate W. In this embodiment, the supply of an inert gas to the surface Wa (lower surface) of the substrate W using the protective disc 115 does not completely prevent the processing liquid (medicine or eluent) from coming toward the surface Wa (lower surface) of the substrate W The surface) flows back, and only the processing liquid flows back to the peripheral area of the surface Wa (lower surface) of the substrate W (a small range of about 1.0 mm from the peripheral end of the substrate W), and the surface Wa (lower surface) The peripheral area is cleaned. Furthermore, by forming a high-speed blowing airflow, the flow-back amount can be controlled with high accuracy. The flow-back amount depends on the supply flow rate of the processing liquid to the upper surface of the substrate W, the supply flow rate of the inert gas to the lower surface of the substrate W, the rotation speed of the substrate W, and the like.

In the FOM supply step (S6), the substrate W is supported by the three movable pins 110 during the execution of this step. Further, a state in which the three movable pins 110 included in the first movable pin group 111 are in contact with the support substrate W and a state in which the three movable pins 110 included in the second movable pin group 112 are in contact with the support substrate W are switched.

Specifically, if a predetermined period has elapsed from the start of the discharge of the FOM, the control device 3 controls the first lifting unit 126, and as shown in FIG. 19D, the first open permanent magnet 125 in the lower position as of that time is directed upward. The position rises and remains in the upper position. As a result, the first open permanent magnet 125 is placed in the upper position and the second open permanent magnet 127 is placed in the lower position (see FIGS. 13A and 13B). The three movable pins included in the first movable pin group 111 110 has been placed in the open position from the holding position up to that time. As a result, a state in which the three movable pins 110 included in the second movable pin group 112 are in contact with the support substrate W is obtained (a first magnet disposing step).

If a predetermined period elapses from the rise of the first open permanent magnet 125 (For example, 10 seconds), the control device 3 controls the first lifting unit 126, and as shown in FIG. 19C, the first open permanent magnet 125 is lowered toward the lower position and held in the lower position. As a result, the first open permanent magnet 125 and the second open permanent magnet 127 are both placed in the lower position, and the three movable pins 110 included in the first movable pin group 111 are returned to the open position. A total of six movable pins 110 are in contact with the support substrate W.

When a predetermined period (for example, 3 seconds) has elapsed since the first open permanent magnet 125 was lowered, the control device 3 controls the second lifting unit 128, and as shown in FIG. 19E, the second lifting unit 128 is positioned in the lower position until then. The open permanent magnet 127 rises toward the upper position and is held in the upper position. As a result, the second open permanent magnet 127 is placed in the upper position and the first open permanent magnet 125 is placed in the lower position (see FIGS. 15A and 15B). The three movable pins included in the second movable pin group 112 110 has been placed in the open position from the holding position up to that time. As a result, a state where the three movable pins 110 included in the first movable pin group 111 are in contact with the support substrate W (a second magnet disposing step) is obtained.

When a predetermined period of time (for example, 10 seconds) has elapsed since the rise of the second open permanent magnet 127, the control device 3 controls the second lifting unit 128 to lower the second open permanent magnet 127 toward the lower position and maintains the position Down position. As a result, the first open permanent magnet 125 and the second open permanent magnet 127 are both placed in the lower position, and the three movable pins 110 included in the second movable pin group 112 are returned to the open position. A total of six movable pins 110 are in contact with the support substrate W.

By switching between the state in which the support substrate W is contacted only by the first movable pin group 111 and the state in which the support substrate W is contacted only by the second movable pin group 112 in this way, the rotation state can be made in the FOM supply step (S6). Perimeter of substrate W The contact support position of the movable pin 110 of the part changes.

The flow back of the FOM at the ideal support position (six points in the circumferential direction) of the movable pin 110 on the substrate W is studied. When the movable pin 110 is in the holding position, the FOM supplied to the upper surface of the substrate W interferes with the shaft portion 152 on the peripheral end surface of the contact substrate as shown in FIG. 20A. Therefore, the FOM supplied to the upper surface of the substrate W cannot flow back to the lower surface of the substrate W through the peripheral end surface of the substrate W in a state where the movable pin 110 is in the holding position at an ideal support position (6 locations in the circumferential direction). Peripheral area.

On the other hand, in a state where the movable pin 110 is in the open position, as shown in FIG. 20B, a predetermined gap is formed with the peripheral end surface of the substrate W. The FOM supplied to the upper surface of the substrate W can flow back to the peripheral region of the lower surface of the substrate W through the peripheral end surface of the substrate W through the gap.

When a predetermined period has elapsed from the start of the discharge of the FOM, the FOM supply step (S6) ends. Specifically, the control device 3 closes the chemical liquid valve 15 and stops discharging the FOM from the chemical liquid nozzle 6. The control device 3 moves the chemical liquid nozzle 6 from the center position to the starting position. As a result, the chemical liquid nozzle 6 retracts from above the substrate W.

In the above description in the FOM supply step (S6), the case where the support using only the substrate W of the first movable pin group 111 and the support using only the substrate W of the second movable pin group 112 was performed every other time. Explanation, but it is also possible to use the support of one of these movable pin groups 111 and 112 several times in the FOM supply step (S6).

Immediately after the FOM supply step (S6) is completed, the supply of water as the eluent to the back surface Wb of the substrate W is started (S7: the eluent step, the process liquid supply step).

Specifically, the control device 3 opens the water valve 43 and, as shown in FIG. 19F, water is discharged from the water nozzle 41 toward the center portion of the back surface Wb of the substrate W. Since water The water solution discharged from the nozzle 41 is located at the center of the back surface Wb of the substrate W covered by the FOM. The water that has been deposited on the central portion of the back surface Wb of the substrate W is affected by the centrifugal force generated by the rotation of the substrate W, and flows on the back surface Wb of the substrate W toward the peripheral edge portion of the substrate W and toward the entire area of the back surface Wb of the substrate W Expansion. Therefore, the FOM on the substrate W is washed away to the outside by the water and discharged to the periphery of the substrate W. Thereby, the FOM attached to the back surface Wb of the substrate W is replaced with water.

In the rinsing step (S7), the substrate W is supported by the three movable pins 110 during the step. Further, a state in which the three movable pins 110 included in the first movable pin group 111 are in contact with the support substrate W and a state in which the three movable pins 110 included in the second movable pin group 112 are in contact with the support substrate W are switched.

Specifically, if a predetermined period has elapsed since the start of the water spout, the control device 3 controls the first lifting unit 126, and as shown in FIG. 19G, the first open permanent magnet 125 in the lower position as of that time is directed upward. The position rises and remains in the upper position. As a result, a state in which the three movable pins 110 included in the second movable pin group 112 are in contact with the support substrate W is obtained (a first magnet disposing step).

If a predetermined period (for example, 10 seconds) has passed since the first open permanent magnet 125 was raised, the control device 3 controls the first lifting unit 126, and as shown in FIG. 19F, the first open permanent magnet 125 faces downward. Lower and stay in this lower position. As a result, the support substrate W is brought into contact with the total of six movable pins 110 again.

When a predetermined period of time (for example, 3 seconds) has passed since the first open permanent magnet 125 was lowered, the control device 3 controls the second lifting unit 128, and as shown in FIG. 19H, the second lifting unit 128 is positioned in the lower position until then. The open permanent magnet 127 rises toward the upper position and is held in the upper position. As a result, the first movable pin group 111 A state in which the three movable pins 110 are in contact with the support substrate W (second magnet arrangement step).

When a predetermined period of time (for example, 10 seconds) has elapsed since the rise of the second open permanent magnet 127, the control device 3 controls the second lifting unit 128 so that the second open permanent magnet 127 descends toward the lower position and is held there. position. As a result, the support substrate W is brought into contact with the total of six movable pins 110 again.

By switching between the state in which the support substrate W is contacted only by the first movable pin group 111 and the state in which the support substrate W is contacted only by the second movable pin group 112, the rotation can be performed in the washing step (S7). The contact support position of the movable pin 110 in the peripheral portion of the substrate W in the state is changed.

The flow back of water at the ideal support position (six points in the circumferential direction) of the movable pin 110 on the substrate W is studied. In a state where the movable pin 110 is in the holding position, the water supplied to the upper surface of the substrate W interferes with the shaft portion 152 on the peripheral end surface of the contact substrate as shown in FIG. 20A. Therefore, in a state where the movable pin 110 is in the holding position at an ideal support position (6 places in the circumferential direction), water supplied to the upper surface of the substrate W cannot flow back to the lower surface of the substrate W through the peripheral end surface of the substrate W. Peripheral area.

On the other hand, in a state where the movable pin 110 is in the open position, as shown in FIG. 20B, a predetermined gap is formed with the peripheral end surface of the substrate W. The water supplied to the upper surface of the substrate W can flow back to the peripheral region of the lower surface of the substrate W through the peripheral end surface of the substrate W through the gap. Thereby, the FOM attached to the peripheral end surface of the substrate W or the peripheral area of the lower surface of the substrate W can be washed away.

In the above description in the rinsing step (S7), the support using only the substrate W of the first movable pin group 111 and the support using only the substrate W of the second movable pin group 112 were performed every other time. Instructions, but can also be plural in the elution step (S7) This time, the support of one of the movable pin groups 111 and 112 is used.

If a predetermined period has elapsed from the start of the discharge of water, the control device 3 controls the arm driving unit 48, and as shown in FIG. 19F, performs scrubbing cleaning using the back surface Wb of the substrate W of the cleaning brush 10 (S8: brush cleaning step, Process liquid supply step). Thereby, the back surface Wb of the substrate W is scrubbed and cleaned by the cleaning brush 10 while supplying water. Specifically, the control device 3 controls the arm driving unit 48 to swing the swing arm 47 about the swing axis A2, so that the cleaning brush 10 is arranged above the substrate W from the starting position, and the cleaning brush 10 is lowered, and the cleaning brush is lowered. The cleaning surface 10a of 10 is pressed against the back surface Wb of the substrate W. Next, as shown in FIG. 19I, the control device 3 controls the arm driving unit 48 to move (scan) the pressing position of the cleaning brush 10 between the central portion of the substrate W and the peripheral portion of the substrate W. Thereby, the entire area of the back surface Wb of the substrate W is scanned by the pressing position of the cleaning brush 10, and the entire area of the back surface Wb of the substrate W is scrubbed by the cleaning brush 10. In the brush cleaning step (S8), the foreign matter peeled off in the FOM supplying step (S6) is scraped off by scrubbing with the cleaning brush 10. Moreover, the foreign matter scraped off by the cleaning brush 10 is washed away by water. Thereby, the peeled foreign matter can be removed from the back surface Wb of the substrate W.

After the cleaning brush 10 has been moved for a predetermined number of times (for example, 4 times), the control device 3 controls the arm driving unit 48 to return the cleaning brush 10 from above the rotating chuck 5 to the starting position. Thereby, the brush cleaning step (S8) ends. The control device 3 maintains the water valve 43 in an open state. Thereby, water as an eluent is supplied to the back surface Wb of the substrate W, and foreign matter scraped off by the cleaning brush 10 is discharged out of the substrate W (see FIG. 19I, S9: final eluent step, processing liquid supply step).

Further, the case where the support using only the substrate W of the first movable pin group 111 and the support using only the substrate W of the second movable pin group 112 described in the leaching step (S7) was performed every other time. Explanation, but this kind of support is in the leaching step (S7), The brush cleaning step (S8) and the final rinse step (S9) may be performed in at least one of the steps. Of course, it can also be performed in 3 steps, that is, all steps, and also in 2 of these steps.

When a predetermined period has elapsed from the start of the water supply, the control device 3 closes the water valve 43 and stops the water from being discharged from the water nozzle 41. In addition, the control device 3 closes the inert gas valve 173 and stops discharging the inert gas from the inert gas supply pipe 170. The control device 3 controls the first lifting unit 126 to lower the first open permanent magnet 125 to a lower position. After that, the substrate W is held by the six movable pins 110, whereby the substrate W is firmly held.

Then, a spin-drying step of drying the substrate W is performed (step S10). Specifically, the control device 3 controls the rotation driving unit 17, thereby, as shown in FIG. 19J, the substrate W is accelerated to a dry rotation speed higher than the rotation speed from the FOM supply step (S6) to the final rinse step (S9). At a speed (for example, several thousand rpm), the substrate W is rotated at a dry rotation speed. Thereby, a large centrifugal force is applied to the liquid on the substrate W, and the liquid adhered to the substrate W is thrown around the substrate W. In this manner, the liquid is removed from the substrate W, and the substrate W is dried. At this time, the substrate W is held by the six movable pins 110. Therefore, the substrate W can be rotated at a high speed while the substrate W is firmly held.

Then, when a predetermined period has elapsed after the high-speed rotation of the substrate W is started, the control device 3 controls the rotation drive unit 17 to stop the rotation of the substrate W using the rotation chuck 5 (step S11).

After that, the control device 3 controls the third lifting unit 130 to lower the second floating magnet 129 to a lower position (step S12). Thereby, the distance between the second floating magnet 129 and the first floating magnet 160 is increased, and the magnetic repulsive force between them is gradually reduced. Along with this, the protection plate 115 faces the upper surface of the turntable 107 decline. Thereby, a space is secured between the upper surface of the protection disc 115 and the surface Wa (lower surface) of the substrate W so that only the hand H2 of the center robot CR can enter.

In addition, the control device 3 controls the first and second elevating units 126 and 128 to raise the first open permanent magnet 125 and the second open permanent magnet 127 to an upward position, respectively, and maintain them in the upper position. Thereby, all the six movable pins 110 are arranged in the open position, thereby releasing the holding of the substrate W.

Then, the substrate W is carried out from the processing chamber 4 (step S13). Specifically, the control device 3 controls the center robot CR in a state where all the nozzles and the like retreat from above the rotary chuck 5, and as shown in FIG. 19K, the hand H2 enters the protection disk 115 and the substrate W. The space secured between the surfaces Wa (lower surface). Then, the hand H2 picks up the substrate W held by the movable pin 110 and then retreats to the side of the rotary chuck 5. Thereby, the cleaning-processed substrate W is carried out from the processing chamber 4.

The control device 3 transfers the cleaned and processed substrate W to the turning unit TU through the hand H2 of the center robot CR. Then, the control device 3 reverses the substrate W transferred by the reversing unit TU (step S14). Thereby, the surface Wa of the substrate W faces upward. After that, the control device 3 takes out the substrate W from the reversing unit TU by the hand H1 of the indexing robot IR, and stores the cleaned and processed substrate W to the carrier C with its surface Wa facing upward. The carrier C containing the cleaned and processed substrate W is transferred from the substrate processing apparatus 1 to a post-processing apparatus such as an exposure apparatus.

Based on the above, according to this embodiment, the substrate W is supported by the three movable pins 110 in parallel with the rotation of the rotary table 107 and the supply of the processing liquid (S6 to S9 in FIG. 11), and further, the first movable pin group The state where the three movable pins 110 included in 111 are in contact with the support substrate W and the state where the three movable pins 110 included in the second movable pin group 112 are in contact with the support substrate W are switched. With two movable pin groups 111, 112 changes and holds the substrate W, whereby the contact support position of the movable pin 110 on the substrate W can be changed. Therefore, the processing liquid (FOM, water) can be supplied to the entire area of the peripheral edge portion of the substrate W, whereby the peripheral edge portion of the substrate W can be favorably processed without using the processing liquid to generate processing residues.

The substrate processing apparatus 1 according to the first embodiment of the present invention is different from the substrate processing apparatus disclosed in US2008 / 0127888 A1 in two aspects described below.

The first aspect will be described. In US2008 / 0127888 A1, the magnet has a magnetic pole direction along the up-down direction. The magnet and the first and second pins are connected via a cam mechanism. That is, the configuration for driving the first pin and the second pin switch is very complicated.

On the other hand, in the first embodiment, the first driving permanent magnet 156A and the second driving permanent magnet 156B have a magnetic pole direction in a direction orthogonal to the axis along the rotation axis A1. The first driving permanent magnet 156A and the second driving permanent magnet 156B are fixed to the support shaft 155 of the movable pin 110. Therefore, a structure for driving the movable pin 110 to switch can be realized with a simple structure.

The second aspect will be described. In US2008 / 0127888 A1, the magnets are respectively ring-shaped. Therefore, it is necessary to provide the magnet in a double ring shape, and therefore the substrate processing apparatus 1 may be enlarged in the radial direction. In contrast, in the first embodiment, the first driving permanent magnets 156A and the second driving permanent magnets 156B are alternately arranged in the circumferential direction. Therefore, the substrate processing apparatus 1 can be miniaturized in the radial direction.

FIG. 21 is a schematic sectional view for explaining a configuration example of the processing unit 202 according to the second embodiment of the present invention. 22 is a cross-sectional view for explaining a configuration example of a ring cover 291 of a rotary chuck 205 provided in the processing unit 202. Figure 23 is used to say A plan view of a more specific structure of the rotary chuck 205 is shown. FIG. 21 is a diagram obtained by observing the cutting plane line XXI-XXI in FIG. 23.

In the second embodiment, parts corresponding to the respective parts shown in the first embodiment are denoted by the same reference numerals as in the case of FIGS. 1 to 20C, and descriptions thereof are omitted.

The processing unit 202 of the second embodiment includes a rotation chuck 205 as a substrate holding rotation device. The rotary chuck 205 of the second embodiment is different from the rotary chuck 5 of the first embodiment in that it is provided as a pressure magnet (the first and second pressure The magnet) switches the permanent magnets 210A and 210B. In addition, the switch switching permanent magnets 210A and 210B are raised and lowered in accordance with the raising and lowering operation of the protection plate 115 using the third raising and lowering unit 130. Further, the switch switching permanent magnets 210A and 210B are not configured to press the movable pin 110 to one or the other of the holding position and the open position, but are used to press the state toward the holding position and toward the open position. Magnet for switching the state of pressure. That is, a configuration is adopted in which the switch of the movable pin 110 can be switched by raising and lowering the protection plate 115 by the third lifting unit 130.

More specifically, the ring cover 291 is fixed to the protection plate 115, and the switch-switching permanent magnets 210A and 210B are buried inside the ring cover 291.

The ring-shaped ring cover 291 protects the peripheral edge portion of the upper surface of the protective plate 115 and the peripheral end of the protective plate 115. The ring-shaped ring cover 291 is attached to the outer periphery of the protection plate 115 via a fixing unit 203 including a fastening member such as a bolt. The ring cover 291 includes a ring plate portion 292 that projects horizontally from a peripheral edge portion of the upper surface toward a radially outer side, and a cylindrical portion 293 that hangs from a peripheral end of the ring plate portion 292. The outer periphery of the annular plate portion 292 is located further outside than the peripheral end of the turntable 107. Ring plate 292 and the cylindrical portion 293 are integrally formed using, for example, a resin material having drug resistance. A cutout 294 (see FIG. 23) is formed at a position corresponding to the movable pin 110 on the inner periphery of the annular plate portion 292 to avoid the movable pin 110. The cutouts 294 are formed so as to border the movable pin 110 at a fixed interval from the outer peripheral surface of the movable pin 110. The annular plate portion 292 and the cylindrical portion 293 are integrally formed using, for example, a resin material having chemical resistance.

The ring plate portion 292 of the ring cover 291 is a throttle portion 290 (the same as the throttle portion 190 in FIG. 20C) having an upper surface that throttles the flow path of the inert gas at the peripheral edge portion of the substrate W held by the movable pin 110. ). With this throttle portion 290, the flow velocity of the inert gas flow blown outward from the space between the ring cover 291 and the lower surface of the substrate W becomes high speed. Therefore, the upper surface of the substrate W can be reliably avoided or suppressed. The treatment liquid (medicine solution or eluent) enters more inward than the peripheral edge portion of the lower surface of the substrate W.

Buried in the cylindrical portion 293 are the same number of switchable permanent magnets 210A and 210B as the number of the movable pins 110 (six in this embodiment). The plurality of switchable permanent magnets 210A and 210B are arranged at intervals in the circumferential direction. Each of the switch switching permanent magnets 210A and 210B is formed in a rod shape, and is buried in the cylindrical portion 293 in a state of extending in the vertical direction. The switch-switching permanent magnet includes a first switch-switching permanent magnet (first pressure-applying magnet) 210A, and a second switch-switching permanent magnet having a polarity opposite to that of the first switch-switching permanent-magnet 210A in the vertical direction (second pressure-applying magnet). 210B. The first switch-switching permanent magnet 210A is a permanent magnet used to drive the movable pin 110 included in the first movable pin group 111, and the second switch-switching permanent magnet 210B is used to drive the movable pin 110 included in the second movable pin group 112. Permanent magnet. That is, the plurality of switch switching permanent magnets 210A and 210B are arranged at regular intervals. The first switch-switching permanent magnets 210A and the second switch-switching permanent magnets 210B are alternately arranged in the circumferential direction. In this embodiment, the first switch switches the permanent magnet 210A. The N-pole portion 211 showing the N polarity is formed on the upper end side, and the S-pole portion 212 showing the S polarity is formed on the lower end side.

24A and 24B are schematic diagrams showing a state of the movable pin 110 included in the first movable pin group 111 accompanying the ascending and descending operation of the protective plate 115. 25A and 25B are schematic diagrams showing a state of the movable pin 110 included in the second movable pin group 112 accompanying the ascending and descending operation of the protective plate 115. In Figs. 24A and 25A, the state where the protection disc 115 is located at the close position (that is, the upper position) is shown, and in Figs. 24B and 25B, the state where the protection disc 115 is located at the lower position.

As shown in FIGS. 24A and 24B, the first switch-switching permanent magnet 210A is arranged in such a manner that the N-pole portion 211 on the upper end side approaches the first driving permanent magnet 156A when the protection disc 115 is in the close position, and the protection disc is placed on the protection disc. The S pole portion 212 on the lower end side in a state where 115 is in the lower position approaches the first driving permanent magnet 156A.

As shown in FIGS. 25A and 25B, the second switch-switching permanent magnet 210B is arranged such that the S-pole portion 212 on the upper end side approaches the second driving permanent magnet 156B when the protection disc 115 is positioned close to the protection disc. The N-pole portion 211 on the lower end side in a state where 115 is located in the lower position approaches the second driving permanent magnet 156B.

As described above in the first embodiment, when the second floating magnet 129 is in the upper position (see FIGS. 19B, 24B, and 25B), the second floating magnet 129 and the first floating magnet are generated. The repulsive magnetic force between 160 keeps the protection disc 115 at a close position close to the lower surface of the substrate W. In contrast, when the second floating magnet 129 is located at a lower position from the upper position (see FIGS. 19A, 24A, and 25A), the distance between the second floating magnet 129 and the first floating magnet 160 The repulsive magnetic force is small, and therefore, the protection disc 115 is held near the upper surface of the turntable 107 by its own weight.

In a state where the protection disc 115 is in the lower position, as shown in FIG. 24A, the N-pole portion 211 on the upper end side of the first switch switching permanent magnet 210A approaches the first driving permanent magnet 156A. In this state, in the first switching permanent magnet 210A, only the magnetic force from the N pole portion 211 acts on the first driving permanent magnet 156A, and the magnetic force from the S pole portion 212 does not act on the first driving permanent magnet. 156A. Therefore, as shown in FIG. 24A, the first driving permanent magnet 156A receives the magnetic force from the first switch-switching permanent magnet 210A and is arranged such that the N pole faces the inside of the radial direction of the rotary table 107 and the S pole faces the radial direction of the rotary table 107. Outside pose. In this state, the shaft portion 152 above the movable pin 110 included in the first movable pin group 111 is located at a relatively open position far from the rotation axis A1 (see FIG. 21).

In this state (a state where the protective disk 115 is in the lower position), as shown in FIG. 25A, the S pole portion 212 on the upper end side of the second switch switching permanent magnet 210B approaches the second driving permanent magnet 156B. In this state, in the second switching permanent magnet 210B, only the magnetic force from the S pole portion 212 acts on the second driving permanent magnet 156B, and the magnetic force from the N pole portion 211 does not act on the second driving permanent magnet. 156B. Therefore, as shown in FIG. 25A, the second driving permanent magnet 156B receives the magnetic force from the second switch-switching permanent magnet 210B, and the S pole is disposed toward the inner side in the radial direction of the rotary table 107 and the N pole is directed toward the radial direction in the rotary table 107 Outside pose. In this state, the upper shaft portion 152 of the movable pin 110 included in the second movable pin group 112 is located at a relatively open position away from the rotation axis A1 (see FIG. 21).

From the state shown in FIGS. 24A and 25A, the second floating magnet 129 (see FIG. 21) is raised, and the protection disc 115 is floated. As the protection disc 115 floats up, the first and second switch switching permanent magnets 210A and 210B also rise.

Moreover, in a state where the protection disk 115 is arranged at the close position, as shown in FIG. As shown in FIG. 24B, the S pole portion 212 on the lower end side of the first switch switching permanent magnet 210A approaches the first driving permanent magnet 156A. In this state, in the first switching permanent magnet 210A, only the magnetic force from the S pole portion 212 acts on the first driving permanent magnet 156A, and the magnetic force from the N pole portion 211 does not act on the first driving permanent magnet. 156A. Therefore, as shown in FIG. 24B, the first driving permanent magnet 156A receives the magnetic force from the first switch-switching permanent magnet 210A, and the S pole faces the radially inner side of the turntable 107 and the N pole faces the radially outer side of the turntable 107 as shown in FIG. 24B. Posture. In this state, the shaft portion 152 above the movable pin 110 included in the first movable pin group 111 moves to a holding position closer to the rotation axis A1 than the open position. As a result, the movable pin 110 included in the first movable pin group 111 is pressed toward the holding position.

In this state (a state where the protective disk 115 is disposed at the close position), as shown in FIG. 25B, the N-pole portion 211 on the lower end side of the second switch switching permanent magnet 210B approaches the second driving permanent magnet 156B. In this state, in the second switching permanent magnet 210B, only the magnetic force from the N pole portion 211 acts on the second driving permanent magnet 156B, and the magnetic force from the S pole portion 212 does not act on the second driving permanent magnet. 156B. Therefore, the second driving permanent magnet 156B receives the magnetic force from the second switch-switching permanent magnet 210B, and as shown in FIG. 25B, the N pole faces the radially inner side of the rotary table 107 and the S pole faces the radially outer side of the rotary table 107. Posture. In this state, the shaft portion 152 above the movable pin 110 included in the second movable pin group 112 moves to a holding position closer to the rotation axis A1 than the open position. As a result, the movable pin 110 included in the second movable pin group 112 is pressed toward the holding position.

The processing unit 202 of the second embodiment also performs processing equivalent to the processing liquid processing (for example, washing processing) shown in FIG. 17 and FIG. 18. FIG. 26 is a diagram for explaining an example of a cleaning process as a processing liquid process performed by the processing unit 202 Flowchart.

21, 23, 24A, 24B, 25A, 25B, and 26, the processing liquid process will be described. 27A to 27K are appropriately referred to.

The processing unit 202 cleans a circular uncleaned substrate such as a silicon substrate, and the back surface Wb (the other main surface, the device formation surface) is the back surface Wb (the main surface, the device non-formation surface) on the opposite side.

After the substrate W is inverted by the inversion unit TU (T1: substrate inversion), the hand H2 of the center robot CR is carried into the processing unit 202 with the back surface Wb facing upward (step T2). Steps T1 and T2 are respectively equivalent to steps S1 and S2 shown in FIG. 17, and therefore descriptions thereof are omitted.

Before the substrate W is carried in, the second floating magnet 129 is disposed at a lower position. Therefore, the second floating magnet 129 is far away from the rotary table 107 to a large extent, and therefore acts on the second floating magnet 129 and The repulsive magnetic force between the first floating magnets 160 is small. Therefore, the protection plate 115 is located close to the lower surface of the upper surface of the turntable 107. This ensures a sufficient space for the hand H2 of the center robot CR to enter between the substrate holding height by the movable pin 110 and the upper surface of the protection plate 115.

Since the protection plate 115 is located at the lower position, the N pole portion 211 on the upper end side of the first switch switching permanent magnet 210A is close to the first drive permanent magnet 156A, and the S pole portion on the upper end side of the second switching switching permanent magnet 210B. 212 is close to the second driving permanent magnet 156B. In this state, all of the three movable pins 110 included in the first movable pin group 111 and the three movable pins 110 included in the second movable pin group 112, that is, the six movable pins 110 are all disposed in the open state. position.

The hand H2 of the center robot CR is higher than that of the movable pin 110. The substrate W is held above the rotary chuck 5 while the substrate W is held at the upper end. Thereafter, as shown in FIG. 27A, the hand H2 of the center robot CR descends toward the upper surface of the turntable 107. Thereby, the substrate W is delivered to the six movable pins 110 located in the open position. After that, the hand H2 of the center robot CR retreats to the side of the rotary chuck 5 through the movable pin 110.

The control device 3 controls the third lifting unit 130 to raise the second floating magnet 129 toward the upper position as shown in FIG. 27B. The distance between the floating magnets 129 and 160 is reduced, and accordingly, the repulsive magnetic force acting between them increases. By the repulsive magnetic force, the protection disk 115 is caused to float from the upper surface of the turntable 107 toward the substrate W. Then, when the first open permanent magnet 125 reaches the upper position, the protection disc 115 reaches the approach position which is close to the surface Wa (lower surface) of the substrate W at a slight interval, and is formed on the flange at the lower end of the guide shaft 117 120 is in abutment with the linear bearing 118. Thereby, the protection plate 115 is maintained at the above-mentioned close position.

As the protection plate 115 rises from the lower position to the close position, the N-pole portion 211 on the upper end side of the first switch switching permanent magnet 210A moves away from the first driving permanent magnet 156A. Instead, the first switch switching permanent magnet 210A The S pole portion 212 on the lower end side approaches the first driving permanent magnet 156A. As the protection plate 115 rises from the lower position to the near position, the S pole portion 212 on the upper end side of the second switch switching permanent magnet 210B is away from the second driving permanent magnet 156B, instead, the second switch switching permanent magnet is replaced. The N-pole portion 211 on the lower end side of 210B approaches the second driving permanent magnet 156B. Thereby, all the movable pins 110 are driven from the open position toward the holding position, and are held in the holding position. Thereby, the substrate W is held by the six movable pins 110, and the substrate W is held on the rotary chuck 5 with its surface Wa facing downward and its back surface Wb facing upward.

Then, the control device 3 opens the inert gas valve 173 and starts the supply of the inert gas as shown in FIG. 27B (T4: start of the inert gas supply). Thereafter, the control device 3 controls the rotation driving unit 103 to start the rotation of the rotary table 107 (the rotary table rotation step), thereby rotating the substrate W about the rotation axis A1 as shown in FIG. 27C (step T5). Steps T4 and T5 are respectively equivalent to steps S4 and S5 shown in FIG. 17, and therefore descriptions thereof are omitted.

After the rotation speed of the substrate W reaches the liquid processing speed, the control device 3 performs a FOM supply step (processing liquid supply step, step T6) of supplying the FOM to the back surface Wb of the substrate W. Step T6 is the same as step S6 shown in FIG. 17 in that, while the FOM is supplied to the back surface Wb of the substrate W, it is performed every one or more times using only the support and movement of the substrate W of the first movable pin group 111. Only the support of the substrate W of the second movable pin group 112 is used.

The FOM supply step (T6) is the same step as the FOM supply step (S6) of the first embodiment, as shown in FIGS. 27C to 27E. In the FOM supply step (T6), the substrate W is supported by the three movable pins 110 instead of the six movable pins 110 during one of them. Further, a state in which the three movable pins 110 included in the first movable pin group 111 are in contact with the support substrate W and a state in which the three movable pins 110 included in the second movable pin group 112 are in contact with the support substrate W are switched.

Specifically, when the three movable pins 110 included in the second movable pin group 112 are in contact with the support substrate W, the control device 3 controls the first lifting unit 126, and as shown in FIG. The first open permanent magnet 125 at the position rises toward the upper position and is arranged at the upper position. As the first open permanent magnet 125 rises, the upper surface of the first open permanent magnet 125 approaches the first driving permanent magnet 156A. Thereby, an attractive magnetic force is generated to the first driving permanent magnet 156A, An attractive force is generated between the first driving permanent magnet 156A and the first open permanent magnet 125. In a state where the first open permanent magnet 125 is arranged in the upper position, the magnitude of the attractive magnetic force acting on the first driving permanent magnet 156A is far larger than the attractive force from the S pole portion 212 on the lower end side of the first switch switching permanent magnet 210A. As a result, the upper shaft portion 152 moves from a holding position close to the rotation axis A1 to an open position away from the rotation axis A1 (see FIG. 2). Accordingly, the three movable pins 110 included in the first movable pin group 111 are arranged from the holding position to the opening position until then. As a result, the support substrate W is brought into contact with the three movable pins 110 included in the second movable pin group 112 (first magnet arrangement step).

In addition, when the three movable pins 110 included in the first movable pin group 111 contact the support substrate W, the control device 3 controls the second lifting unit 128, and as shown in FIG. The second open permanent magnet 127 rises toward the upper position and is disposed at the upper position. As the second open permanent magnet 127 rises, the upper surface of the second open permanent magnet 127 approaches the second driving permanent magnet 156B. Thereby, an attractive magnetic force is generated to the second driving permanent magnet 156B, and an attractive force is generated between the second driving permanent magnet 156B and the second open permanent magnet 127. In the state where the second open permanent magnet 127 is arranged in the upper position, the magnitude of the attraction magnetic force acting on the second driving permanent magnet 156B far exceeds the attractive force from the N-pole portion 211 on the lower end side of the second switch switching permanent magnet 210B. As a result, the upper shaft portion 152 moves from a holding position close to the rotation axis A1 to an open position away from the rotation axis A1 (see FIG. 2). Thereby, the three movable pins 110 included in the second movable pin group 112 are arranged from the holding position to the opening position until then. As a result, the support substrate W is brought into contact with the three movable pins 110 included in the first movable pin group 111 (second magnet arrangement step).

When a predetermined period has elapsed from the start of the discharge of the FOM, the FOM supply step (T6) ends. Specifically, the control device 3 closes the chemical liquid valve 15 and stops discharging the FOM from the chemical liquid nozzle 6. In addition, the control device 3 moves the chemical liquid nozzle 6 from the center position toward the starting position. As a result, the chemical liquid nozzle 6 retracts from above the substrate W.

Immediately after the FOM supply step (T6) is completed, the supply of water as the eluent to the back surface Wb of the substrate W is started (T7: eluent step, processing solution supply step).

The leaching step (T7), the brush cleaning step (T8), and the final leaching step (T9) are shown in FIGS. 27F to 27I, which are the leaching step (S7) and the brush cleaning step (S8) of the first embodiment, respectively. It is the same step as the final rinse step (S9).

In the rinsing step (T7), the substrate W is supported by the three movable pins 110 instead of the six movable pins 110 during one of them. Further, a state in which the three movable pins 110 included in the first movable pin group 111 are in contact with the support substrate W and a state in which the three movable pins 110 included in the second movable pin group 112 are in contact with the support substrate W are switched.

Specifically, when the three movable pins 110 included in the second movable pin group 112 are in contact with the support substrate W, the control device 3 controls the first lifting unit 126, and as shown in FIG. The first open permanent magnet 125 at the position rises toward the upper position and is arranged at the upper position. As the first open permanent magnet 125 rises, the upper surface of the first open permanent magnet 125 approaches the first driving permanent magnet 156A. Thereby, an attractive magnetic force is generated to the first driving permanent magnet 156A, and an attractive force is generated between the first driving permanent magnet 156A and the first open permanent magnet 125. In a state where the first open permanent magnet 125 is arranged in the upper position, the magnitude of the attractive magnetic force acting on the first driving permanent magnet 156A is far larger than the attractive force from the S pole portion 212 on the lower end side of the first switch switching permanent magnet 210A. By this, the upper axis The portion 152 moves from a holding position near the rotation axis A1 to an open position away from the rotation axis A1 (see FIG. 2). Accordingly, the three movable pins 110 included in the first movable pin group 111 are arranged from the holding position to the opening position until then. As a result, the support substrate W is brought into contact with the three movable pins 110 included in the second movable pin group 112 (first magnet arrangement step).

In addition, when the three movable pins 110 included in the first movable pin group 111 contact the support substrate W, the control device 3 controls the second lifting unit 128, and as shown in FIG. The second open permanent magnet 127 rises toward the upper position and is disposed at the upper position. As the second open permanent magnet 127 rises, the upper surface of the second open permanent magnet 127 approaches the second driving permanent magnet 156B. Thereby, an attractive magnetic force is generated to the second driving permanent magnet 156B, and an attractive force is generated between the second driving permanent magnet 156B and the second open permanent magnet 127. In the state where the second open permanent magnet 127 is arranged in the upper position, the magnitude of the attraction magnetic force acting on the second driving permanent magnet 156B far exceeds the attractive force from the N-pole portion 211 on the lower end side of the second switch switching permanent magnet 210B. As a result, the upper shaft portion 152 moves from a holding position close to the rotation axis A1 to an open position away from the rotation axis A1 (see FIG. 2). Thereby, the three movable pins 110 included in the second movable pin group 112 are arranged from the holding position to the opening position until then. As a result, the support substrate W is brought into contact with the three movable pins 110 included in the first movable pin group 111 (second magnet arrangement step).

When a predetermined period has elapsed from the start of the eluent discharge, a spin-drying step of drying the substrate W is performed (step T10). Specifically, the control device 3 controls the rotation driving unit 17, thereby, as shown in FIG. 27J, the substrate W is accelerated to a dry rotation speed higher than the rotation speed from the FOM supply step (T6) to the final rinse step (T9). The rotation speed (for example, several thousand rpm) causes the substrate W to rotate at a dry rotation speed. Thereby, a large centrifugal force is applied to the liquid on the substrate W, and the liquid adhered to the substrate W is thrown around the substrate W. In this manner, the liquid is removed from the substrate W, and the substrate W is dried. At this time, the substrate W is held by the six movable pins 110. Therefore, the substrate W can be rotated at a high speed while the substrate W is firmly held. In the present embodiment, the spin-drying step (T10) is performed while the protective disk 115 is arranged at the close position.

Then, if a predetermined period elapses after the high-speed rotation of the substrate W is started, the control device 3 controls the rotation drive unit 17 to stop the rotation of the substrate W using the rotary chuck 5 (step T11).

Then, the control device 3 controls the third lifting unit 130 to lower the second floating magnet 129 to a lower position (step T12). Thereby, the distance between the second floating magnet 129 and the first floating magnet 160 is increased, and the magnetic repulsive force between them is gradually reduced. Along with this, the protection plate 115 is lowered toward the upper surface of the turntable 107. Thereby, a space is secured between the upper surface of the protection disc 115 and the surface Wa (lower surface) of the substrate W so that only the hand H2 of the center robot CR can enter.

In addition, as the protection plate 115 is lowered from the approach position to the lower position, the S pole portion 212 on the lower end side of the first switch switching permanent magnet 210A is away from the first driving permanent magnet 156A. Instead, the first switch switching permanent magnet is replaced. The N-pole portion 211 on the upper end side of 210A approaches the first driving permanent magnet 156A. In addition, as the protection plate 115 is lowered from the approach position to the lower position, the N-pole portion 211 on the lower end side of the second switch switching permanent magnet 210B is separated from the second driving permanent magnet 156B. The S pole portion 212 on the upper end side of 210B approaches the second driving permanent magnet 156B. Thereby, all the movable pins 110 are driven from the holding position toward the open position, and are held in the open position. Thereby, the holding of the substrate W is released.

Then, the substrate W is carried out from the processing chamber 4 (see FIG. 27K, step T13), and the carried-out substrate W is turned by the turning unit TU (step T14). Steps T13 and T14 are respectively equivalent to steps S13 and S14 shown in FIG. 17, and therefore descriptions thereof are omitted. Thereafter, the cleaned and processed substrate W is accommodated in the carrier C with its surface Wa facing upward, and is conveyed from the substrate processing apparatus 1 to a post-processing apparatus such as an exposure apparatus.

Based on the above, according to the second embodiment, in addition to the functions and effects described in the first embodiment, the following functions and effects are exhibited.

That is, the first and second switch-switching permanent magnets 210A and 210B are provided so as to be able to be raised and lowered together with the protection plate 115. Therefore, the switch switching permanent magnets 210A and 210B are raised and lowered in accordance with the raising and lowering operation of the protection plate 115 of the third raising and lowering unit 130. Thereby, it is not necessary to separately provide a lifting unit for driving the first and second switch switching permanent magnets 210A and 210B, thereby simplifying the device configuration and reducing the cost.

In addition, the movable pin 110 only needs to be located in the holding position during the rotation processing (step T5 to step T11), and need not always be in the holding position. During the rotation process (step T5 to step T11), the protection plate 115 is located at the close position. That is, the movable pin 110 must be in the holding position only when the protection disc 115 is in the close position, and the movable pin 110 can also be in the open position when the protection disc 115 is in the lower position. Therefore, in this embodiment, when the protection plate 115 is in the close position, all the movable pins 110 are held in the holding position by switching the roles of the permanent magnets 210A and 210B, and when the protection plate 115 is in the lower position, the switch is opened by the switch. Switching the roles of the permanent magnets 210A and 210B keeps all the movable pins 110 in the open position. Thereby, the movable pin 110 can be opened and closed well without damaging the function of the protection disk 115.

In addition, by one switch switching permanent magnet 210A, 210B (the first switch switching permanent magnet 210A or the second switch switching permanent magnet 210B) moving up and down, not only the corresponding opening operation of the movable pin 110 is performed, but also the movable The action of the pin 110. As a result, the number of magnets used for the pin switch can be reduced compared with the case where the magnets for the pin opening and the magnets for the pin closing are separately provided.

Moreover, in the processing liquid processing example of the second embodiment, in the FOM supply step (T6) and the rinsing step (T7), the chemical liquid (FOM) is supplied to the substrate W, and it is performed every one or more times. The support using only the substrate W of the first movable pin group 111 and the support using only the substrate W of the second movable pin group 112. However, in the second embodiment, such a substrate may not be exchanged and held.

As described above, in the second embodiment, the switch of the movable pin 110 can be switched by raising and lowering the protection plate 115 by the third lifting unit 130. Therefore, when the substrate W is not exchanged and held by the two movable pin groups 111 and 112 during the substrate processing, the configurations of the open permanent magnets 125 and 127 and the closed permanent magnets 121 and 122 may be eliminated. In this case, of course, the configuration of the first and second lifting units 126 and 128 is also abolished.

That is, both the lifting operation of the protection plate 115 and the opening and closing operation of the movable pin 110 can be performed by using only one lifting unit (third lifting unit 130), whereby the number of parts can be omitted and the substrate processing apparatus 1 can be obtained. Reduce costs.

Furthermore, in the second embodiment, the magnetic pole direction of the first driving permanent magnet 156A and the magnetic pole direction of the second driving permanent magnet 156B are different from each other in a direction orthogonal to the rotation axis. The first and second switches of the magnetic pole directions opposite to each other in the vertical direction switch the permanent magnets 210A and 210B. However, in the second embodiment, the direction of the magnetic pole of the first driving permanent magnet 156A may be different from that of the second driving permanent magnet 156A. The magnetic pole direction of the driving permanent magnet 156B is aligned in a direction orthogonal to the rotation axis. In this case, the first and second switch switching permanent magnets 210A and 210B may be aligned in the vertical direction.

Also, in the second embodiment, the permanent magnets 210A and 210B may not be switched by the magnets that can be integrated with the protection plate 115 to be raised and lowered integrally, as long as the movable pins 110 are opened. Either an action or a closed action is sufficient.

The two embodiments of the present invention have been described above, but the present invention can be implemented in still other forms.

For example, in the first and second embodiments, each of the first open permanent magnet 125 and the second open permanent magnet 127 may be provided in a double annular shape in a plan view coaxial with the rotation axis A1. In this case, one of the first and second lifting permanent magnets is arranged so as to surround the outer periphery of the other of the first and second lifting permanent magnets. In this case, each of the first and second lifting permanent magnets may be provided intermittently in the circumferential direction.

In addition, in the first and second embodiments, it has been described that the magnetic pole directions of the first and second open permanent magnets 125 and 127 are along the vertical direction, but the magnetic pole direction of the first open permanent magnet 125 may be A direction orthogonal to the rotation axis A3 of the movable pin 110.

In the first and second embodiments, it is assumed that an attractive magnetic force is generated between the first open permanent magnet 125 and the first drive permanent magnet 156A, and the second open permanent magnet 127 and the second open magnet are generated. The driving force of the driving permanent magnets 156A and 156B was explained by the attractive magnetic force between the driving permanent magnets 156B. However, the driving permanent magnets 156A and 156B may be driven by the first open permanent magnets 125 and the first driving permanent magnets. The repulsive magnetic force between 156A and / or the repulsive magnetic force generated between the second open permanent magnet 127 and the second driving permanent magnet 156B drives the driving permanent magnets 156A and 156B.

Further, in the first and second embodiments, the first and second closed permanent magnets 121 and 122 are provided as pressing means for pressing the driving permanent magnets 156A and 156B to the holding position, but it is also possible to provide a driving force Instead of the first and second closed permanent magnets 121 and 122, elastic pressing means such as a spring that presses the permanent magnets 156A and 156B to the holding position.

In the first and second embodiments, the number of the movable pins 110 is six, but it may be six or more. In this case, as long as the number of the movable pins 110 is an even number, the number of the movable pins 110 included in the first movable pin group 111 and the number of the movable pins 110 included in the second movable pin group 112 can be changed. It is preferable that the numbers are the same as each other from the viewpoint of layout. For example, when the number of movable pins 110 is set to eight, the number of movable pins included in each of the movable pin groups 111 and 112 becomes four. In this case, the number of the first open permanent magnets 125 is one. The number is also 4 of the same number as the number of movable pins 110.

Further, in the first and second embodiments, the open permanent magnets 125 and 127 are set as lifting magnets that can be raised and lowered with respect to the turntable 107, and the closed permanent magnets 121 and 122 are set such that they cannot be moved with respect to the turntable 107. The pressurizing magnet provided in the vertical direction has been described, but the opposite configuration may be adopted. A lifting magnet that can be raised and lowered relative to the turntable 107 can be used as a closed magnet, and a pressing magnet that cannot be raised and lowered relative to the turntable 107 can be used as an open magnet.

For example, it has been described that the processing target surface is the back surface (device non-formation surface) Wb of the substrate W, but the surface (device formation surface) Wa of the substrate W may be set It is the processing target surface. In this case, the turning unit TU can also be abolished.

In addition, in the first and second embodiments, the series of treatment liquid treatment is not limited to the removal of foreign matter, but may also be used for the removal of metal and the removal of impurities buried in the film. Moreover, a series of processing liquid processes may be an etching process rather than a cleaning process.

In the first and second embodiments, FOM is used as the chemical solution supplied to the substrate W, but the chemical solution includes, for example, sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, ammonia water, hydrogen peroxide water, and organic acids. (For example, citric acid, oxalic acid, etc.), organic alkali metals (for example, TMAH: tetramethylammonium hydroxide, etc.), organic solvents (for example, IPA: isopropyl alcohol, etc.), and at least one of a surfactant and an anticorrosive Liquid.

As the chemical solution to be supplied to the substrate W, dilute hydrofluoric acid (DHF), buffered hydrofluoric acid (BHF), SC1 (including NH ₄ OH and H ₂ O ₂ Liquid), FPM (liquid containing HF and H ₂ O ₂ ), etc. That is, instead of the FOM supply step (S6, T6), a chemical liquid supply step of supplying a chemical liquid containing one of these chemical liquids to the processing target surface of the substrate W may be performed as a drug used in the chemical liquid supply step. Liquid, DHF, BHF, SC1, FPM, etc. can be used. When these liquids are used as the chemical liquid, the processing target surface of the substrate W does not have to be bare silicon, and the processing target surface of the substrate W may also include an oxide film (such as a silicon oxide film) and / or a nitride film (such as nitrogen Silicon film).

Further, in the first and second embodiments, the brush cleaning step (S8, T8) may be eliminated from each of the treatment liquid treatments described above. In this case, it is not necessary to perform the final leaching step (S9, T9), and therefore, the final leaching step (S9, T9) can be eliminated together.

In addition, although the description has been given assuming that the processing target surface is the upper surface of the substrate W, the lower surface of the substrate W may be the processing target surface. In that case, report to The processing liquid is supplied to the lower surface of the substrate W, but the substrate is allowed to flow back from the lower surface of the substrate W to the upper surface of the substrate W by the substrate supporting position on the peripheral portion of the substrate W, and the processing liquid can be used without causing any processing residue The peripheral portion of the substrate W is processed on the ground.

In addition, the case where the substrate processing apparatus 1 is a device for processing a disc-shaped semiconductor substrate has been described, but the substrate processing apparatus 1 may be a device for processing a polygonal substrate such as a glass substrate for a liquid crystal display device.

The embodiments of the present invention have been described in detail, but these are only specific examples for clarifying the technical content of the present invention, and the present invention should not be limited to these specific examples for explanation. The scope of the present invention is only limited by The scope of the attached patent is limited.

This application corresponds to Japanese Patent Application No. 2015-192155 filed with Japan Patent Office on September 29, 2015, and Japanese Patent Application No. 2016-30154 filed with Japan Patent Office on February 19, 2016, All disclosures of these applications are incorporated herein by reference.

Claims (10)

A substrate holding and rotating device includes: a rotating table; a rotation driving unit that rotates the rotating table about a rotation axis in a vertical direction; and a movable pin, which is a plurality of movable pins for horizontally supporting a substrate. Having a support portion movably disposed between an open position far from the rotation axis and a holding position close to the rotation axis, and provided in a manner to rotate around the rotation axis together with the rotation table; the plurality of roots The movable pin includes: a first movable pin group including at least three movable pins; and a second movable pin group provided separately from the first movable pin group and including at least three movable pins; the substrate holds the rotation device and further Including: a pressing unit that presses the support portion of each movable pin to one of the open position and the held position; a first driving magnet that is installed corresponding to each first movable pin group and has a The magnetic pole directions are the same as each other in a direction orthogonal to the axis along the rotation axis; the second driving magnet is mounted corresponding to each second movable pin group, and has A magnetic pole direction opposite to the first driving magnet in a direction orthogonal to the axis along the rotation axis; the first moving magnet is provided in a non-rotating state and has a direction orthogonal to the axis along the rotation axis The repulsive force or attractive force is applied to the magnetic pole direction between the first driving magnet and the first driving magnet, and the supporting part of the first movable pin group is pressed to the open position and held by the repulsive force or the attractive force. The other position; the second moving magnet is provided in a non-rotating state and has a repulsive force or an attractive force between the second driving magnet and the second driving magnet in a direction orthogonal to the axis along the rotation axis. In the magnetic pole direction, the supporting part of the second movable pin group is pressed to the other of the open position and the holding position by the repulsive force or the attractive force; the first relative moving unit makes the first The moving magnet and the turntable, a first position that imparts the repulsive force or the attractive force between the first moving magnet and the first driving magnet, and the first moving magnet Relative movement between the second position where the first driving magnet does not impart the repulsive force and the attractive force; and a second relative movement unit that separates the second moving magnet and the turntable from the first moving magnet and A third position where the reciprocating force or the attractive force is provided between the second moving magnet and the second driving magnet, and the second moving magnet is between the second driving magnet and the second driving magnet Relative movement between the fourth position that does not impart the repulsive force and the attractive force; the first and second moving magnets are located at the first or third position and the rotary table In a rotating state, a ring-shaped magnetic field generating region is formed in which each movable pin that rotates with the rotation of the rotary table can pass and is coaxial with the rotation axis. The first and second moving magnets are respectively provided with the same number of each other. A plurality of the plurality of first moving magnets and the plurality of second moving magnets alternate with each other in the circumferential direction of the turntable in a plan view, and become the same as a whole. Said circular configuration concentric to the axis of rotation of the annular mode. For example, the substrate holding rotating device of claim 1, wherein the first movable pin group includes the same number of the movable pins as the second movable pin group, and the first and second movable pin groups are in a circumferential direction of the rotary table. The first and second moving magnets are arranged alternately and at equal intervals so that the plurality of movable pins included in each movable pin group are the same as the number of the movable pins included in each movable pin group. , Arranged at equal intervals in the circumferential direction of the rotary table. The substrate holding and rotating device according to claim 1, wherein the pressure applying unit further includes: a first pressure-applying magnet for applying the repulsive force or attractive force to the first drive magnet to make the first The support portion of the movable pin group is pressed to one of the open position and the holding position; and a second pressure magnet is used to provide repulsive force or attractive force with the second drive magnet. The support portion of the second movable pin group is pressed to one of the open position and the holding position. For example, the substrate holding and rotating device of claim 3, wherein the first and second pressing magnets are provided so as to be unable to move relative to the rotary table. For example, the substrate holding and rotating device of claim 3 further includes a protective disk, which is disposed between the above-mentioned turntable and the substrate holding position based on the plurality of movable pins, so that it can be more in the lower position than in the lower position. At a position close to the lower surface of the substrate held by the holding member above, it is mounted on the rotary table in such a manner that it moves up and down relative to the rotary table and rotates with the rotary table about the rotation axis; The first and second pressing magnets are provided so as to be movable up and down together with the protective disk. In the substrate holding and rotating device according to claim 1, wherein one of the open position and the holding position is the holding position, and the other of the opening position and the holding position is the open position. For example, the substrate holding and rotating device of claim 1 further includes: a protection disc, which is arranged between the rotating table and the substrate holding position based on the plurality of movable pins so as to be closer to the lower position than to the lower position. At a position close to the lower surface of the substrate held by the holding member above, it is mounted on the rotary table in such a manner that it moves up and down relative to the rotary table and rotates with the rotary table about the rotation axis; A floating magnet is mounted on the protection disk; a second floating magnet is provided in a non-rotating state and a repulsive force is given to the first floating magnet; and a third relative moving unit is configured to cause the second floating magnet And the rotary table are independent of each of the relative movement of the first moving magnet and the rotary table and the relative movement of the second moving magnet and the rotary table, and the first floating magnet and the second floating magnet are used separately. The distance between the magnets changes in a relative manner. A substrate processing apparatus includes: the substrate holding and rotating device according to any one of claims 1 to 7; and a processing liquid supply unit that supplies a processing liquid to a main surface of a substrate held by the substrate holding and rotating device. For example, the substrate processing apparatus of claim 8 further includes a control device that controls the rotation driving unit, the processing liquid supply unit, the first relative movement unit, and the second relative movement unit. The control device executes: a rotary table. A rotation step that rotates the rotary table about the rotation axis; a processing liquid supply step that supplies a processing liquid to a substrate that rotates with the rotation of the rotary table; a first magnet disposition step that is the same as the rotary table rotation step and the above The processing liquid supplying step is arranged in parallel with the relative position of the first moving magnet and the turntable at the first position, and the relative position of the second moving magnet and the turntable at the fourth position; and 2 magnet arrangement steps, in which, when the first magnet arrangement step is not performed, in parallel with the rotation stage rotation step and the processing liquid supply step, the relative position of the second moving magnet and the rotation stage is arranged at the third place Position, and the relative position of the first moving magnet and the turntable is arranged at the second position. A substrate processing method, which is a substrate processing method performed in a substrate processing apparatus including a substrate holding and rotating device and a processing liquid supply unit for supplying a processing liquid to a substrate held on the substrate holding and rotating device, the substrate holding and rotating device includes: A rotary table; a rotary drive unit that rotates the rotary table about a rotation axis in a vertical direction; and a movable pin, which is a plurality of movable pins for horizontally supporting a substrate, and is movably disposed away from the above The support portion between a relatively open position of the rotation axis and a holding position close to the rotation axis is provided in a manner to rotate around the rotation axis together with the rotation table; the plurality of movable pins include: a first movable pin group , Which includes at least 3 movable pins; and a second movable pin group, which is provided separately from the first movable pin group and includes at least 3 movable pins; the substrate holding rotating device further includes: a pressure applying unit, which The supporting part of the movable pin is pressed to one of the open position and the holding position; the first driving magnet corresponds to Each first movable pin group is mounted and has magnetic pole directions identical to each other in a direction orthogonal to an axis along the rotation axis; a second driving magnet is mounted corresponding to each second movable pin group, and It has a magnetic pole direction opposite to the first drive magnet in a direction orthogonal to the axis along the rotation axis. The first moving magnet is provided in a non-rotating state and has a positive position perpendicular to the axis along the rotation axis. In the direction of intersection, a repulsive force or attractive magnetic pole direction is imparted to the first driving magnet, and the supporting part of the first movable pin group is pressed to the open position by the repulsive force or the attractive force. And the other of the holding positions; the second moving magnet is provided in a non-rotating state and has a repulsive force or attraction between the second driving magnet and the second driving magnet in a direction orthogonal to an axis along the rotation axis. The force-like magnetic pole direction presses the supporting part of the second movable pin group to the other one of the open position and the holding position by the repulsive force or the attractive force; the first relative movement A unit that places the first moving magnet and the turntable at a first position that imparts the repulsive force or the attractive force between the first moving magnet and the first driving magnet, and the first moving magnet is in contact with the first Relative movement between the second position where the first driving magnet does not impart the repulsive force and the attractive force; and a second relative movement unit that separates the second moving magnet and the turntable from the first moving magnet and A third position where the reciprocating force or the attractive force is provided between the second moving magnet and the second driving magnet, and the second moving magnet is between the second driving magnet and the second driving magnet Relative movement between the fourth position that does not impart the repulsive force and the attractive force; the first and second moving magnets are located at the first or third position and the rotary table In the rotating state, a circular magnetic field generating region is formed in which each movable pin that rotates in accordance with the rotation of the rotary table can pass and is coaxial with the rotation axis. The first and second moving magnets are formed. The plurality of the first moving magnets and the plurality of the second moving magnets are alternately arranged in the circumferential direction of the rotary table in plan view, and are connected to the rotation axis as a whole. In the coaxial processing method of arranging the substrate, the control device implements the following steps: a rotary table rotation step, which rotates the rotary table about the rotation axis; a processing liquid supply step, which The rotating and rotating substrate supplies the processing liquid; the first magnet disposing step is arranged in parallel with the rotating table rotating step and the processing liquid supplying step, and the relative position of the first moving magnet and the rotating table is arranged at the first position And the relative position of the second moving magnet and the rotary table is arranged at the fourth position; and the second magnet arranging step, when the first magnet arranging step is not performed, is related to the rotary table rotating step and the above processing In the liquid supply step, the relative position of the second moving magnet and the turntable is arranged in the third position in parallel. The relative position of the first moving magnet and the turntable is arranged at the second position.