TW201814809A - Substrate processing device - Google Patents
Substrate processing device Download PDFInfo
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- TW201814809A TW201814809A TW106118875A TW106118875A TW201814809A TW 201814809 A TW201814809 A TW 201814809A TW 106118875 A TW106118875 A TW 106118875A TW 106118875 A TW106118875 A TW 106118875A TW 201814809 A TW201814809 A TW 201814809A
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- substrate
- chuck
- follower
- rotation axis
- movable
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
本發明係關於一種處理基板的基板處理裝置。在處理對象的基板中，例如包含有半導體晶圓(wafer)、液晶顯示裝置用基板、電漿顯示器(plasma display)用基板、FED(Field Emission Display；場發射顯示器)用基板、光碟用基板、磁碟用基板、磁光碟用基板、光罩(photomask)用基板、陶瓷(ceramic)基板、太陽能電池用基板等。 The present invention relates to a substrate processing apparatus for processing a substrate. The substrates to be processed include, for example, semiconductor wafers, substrates for liquid crystal display devices, substrates for plasma displays, substrates for FED (Field Emission Display), substrates for optical disks, A substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, a substrate for a solar cell, and the like.
在半導體裝置或液晶顯示裝置等的製程中係有使用一種處理半導體晶圓或液晶顯示裝置用玻璃基板等之基板的基板處理裝置。在專利文獻1中已有揭示一種逐片處理基板的單片式之基板處理裝置。 In the manufacturing process of a semiconductor device or a liquid crystal display device, there is a substrate processing apparatus using a substrate that processes a semiconductor wafer or a substrate such as a glass substrate for a liquid crystal display device. Patent Document 1 discloses a single-piece substrate processing apparatus that processes substrates one by one.
專利文獻1的基板處理裝置係具備使基板一邊保持於水平一邊旋轉的基板旋轉裝置。基板旋轉裝置係包含有：環狀之旋轉盤；驅動機構，用以旋轉驅動旋轉盤；複數個固定爪及複數個可動爪，係設置於旋轉盤上；以及可動爪動作機構，用以使可動爪動作。各個可動爪動作機構係包含有：線狀彈簧，用以將可動爪保持於基板保持位置；擺動體，係與可動爪一起繞著鉛直軸線擺動；以及氣壓缸(pneumatic cylinder)，係藉由按壓擺動體來使可動爪移動至基板保持解除位置。 The substrate processing apparatus of Patent Document 1 includes a substrate rotation device that rotates a substrate while holding the substrate horizontally. The substrate rotating device includes: a ring-shaped rotating disk; a driving mechanism for rotating the rotating disk; a plurality of fixed claws and a plurality of movable claws provided on the rotating disk; and a movable claw operation mechanism for making the movable Claw action. Each movable claw action mechanism includes: a linear spring to hold the movable claw at the substrate holding position; a swinging body that swings around the vertical axis together with the movable claw; and a pneumatic cylinder that is pressed by pressing The swinging body moves the movable claw to the substrate holding release position.
[先前技術文獻] [Prior technical literature]
[專利文獻] [Patent Literature]
專利文獻1：日本特許第2891894號公報。 Patent Document 1: Japanese Patent No. 2891894.
在專利文獻1中係設置有使可動爪移動至基板保持解除位置的專用之氣壓缸。更且，由於氣壓缸係針對每一可動爪所設置，所以在可動爪有複數個的情況下，有必要設置複數個氣壓缸。為此，難以簡化可動爪動作機構。 Patent Document 1 is provided with a dedicated pneumatic cylinder for moving the movable claw to the substrate holding release position. Furthermore, since a pneumatic cylinder is provided for each movable claw, it is necessary to provide a plurality of pneumatic cylinders when there are a plurality of movable claws. For this reason, it is difficult to simplify the movable claw operation mechanism.
於是，本發明的目的之一係在於簡化使可動夾盤進行開閉的機構。 Then, one object of the present invention is to simplify the mechanism for opening and closing the movable chuck.
本發明之一實施形態係提供一種基板處理裝置，具備：複數個夾盤構件，係包含有可動夾盤，且伴隨前述可動夾盤之移動而在水平地夾持前述基板的閉合狀態與前述基板之夾持被解除的開啟狀態之間切換，前述可動夾盤係能夠在壓抵於基板之外周部的閉合位置與相對於前述基板之外周部的壓抵被解除的開啟位置之間繞著夾盤轉動軸線轉動；旋轉馬達，係使前述複數個夾盤構件繞著通過由前述複數個夾盤構件所夾持的前述基板之中央部的鉛直之旋轉軸線旋轉，藉此產生使前述基板繞著前述旋轉軸線旋轉的動力；筒狀之防濺罩(splash guard)，係在俯視觀察下繞著前述旋轉軸線包圍前述複數個夾盤構件；罩升降單元，用以使前述防濺罩朝向鉛直方向移動；夾持力產生構件， 用以產生使前述可動夾盤移動至前述閉合位置的方向之力；隨動部，係包含有位於比前述可動夾盤更外側的外端，且與前述可動夾盤一起繞著前述夾盤轉動軸線轉動，與前述可動夾盤一起繞著前述旋轉軸線旋轉；驅動部，係包含有位於比前述隨動部的外端更內側的內端，且與前述防濺罩一起朝向鉛直方向移動；以及控制裝置，係藉由控制前述旋轉馬達來使前述隨動部與前述可動夾盤一起繞著前述旋轉軸線旋轉，且藉由控制前述罩升降單元來使前述驅動部與前述防濺罩一起朝向鉛直方向移動。 According to an embodiment of the present invention, there is provided a substrate processing apparatus including a plurality of chuck members including a movable chuck and a closed state in which the substrate is horizontally held and the substrate are accompanied by the movement of the movable chuck. The movable chuck can switch between the closed position pressed against the outer peripheral portion of the substrate and the opened position released from the open position relative to the outer peripheral portion of the substrate. The disk rotation axis rotates; the rotation motor rotates the plurality of chuck members about a vertical rotation axis passing through the central portion of the substrate held by the plurality of chuck members, thereby generating the substrate around Power for rotation of the rotation axis; cylindrical splash guard surrounds the plurality of chuck members around the rotation axis in a plan view; and a cover lifting unit for orienting the splash guard in a vertical direction Movement; a clamping force generating member for generating a force in a direction to move the movable chuck to the closed position; a follower section including a The outer end of the movable chuck rotates together with the movable chuck about the rotation axis of the chuck, and rotates with the movable chuck about the rotation axis; the driving part includes The outer end of the part is further the inner end and moves in the vertical direction together with the splash guard; and a control device that controls the rotating motor to cause the follow-up part and the movable chuck to surround the rotation axis together Rotate and control the cover raising and lowering unit to move the driving unit and the splash cover in a vertical direction together.
前述控制裝置係執行以下的步驟：準備步驟，係使前述隨動部及前述驅動部之至少一方移動，藉此在前述隨動部及前述驅動部相互地離開的狀態下使前述隨動部及前述驅動部於水平或鉛直之相對向方向相對向；解除步驟，係在前述準備步驟之後，藉由使前述隨動部及前述驅動部朝向前述相對向方向相對地移動，來使前述隨動部及前述驅動部相互地接觸，並使前述隨動部按壓於前述驅動部直至前述可動夾盤到達前述開啟位置為止；以及夾持步驟，係在前述解除步驟之後，使前述隨動部及前述驅動部相互地背離，並使前述夾持力產生構件將前述可動夾盤移動至前述閉合位置的方向。 The control device executes the following steps: a preparation step of moving at least one of the follower portion and the drive portion, thereby moving the follower portion and the drive portion in a state where the follower portion and the drive portion are separated from each other. The driving portion is opposed in a horizontal or vertical opposite direction; the releasing step is after the preparation step, and the following portion is moved relative to the opposite direction by moving the following portion and the driving portion in the opposite direction to make the following portion And the driving portion are in contact with each other, and the follower portion is pressed against the drive portion until the movable chuck reaches the open position; and the clamping step is to make the follower portion and the drive after the releasing step. The parts face away from each other, and the clamping force generating member moves the movable chuck to a direction in which the movable chuck is moved to the closed position.
依據該構成，旋轉馬達係與可動夾盤一起使隨動部繞著鉛直之旋轉軸線旋轉。罩升降單元係使驅動部與防濺罩一起朝向鉛直方向移動。旋轉馬達及罩升降單元係藉由控制裝置所控制。 According to this configuration, the rotary motor rotates the follower around the vertical rotation axis together with the movable chuck. The cover raising and lowering unit moves the driving portion in a vertical direction together with the splash cover. The rotary motor and the hood lifting unit are controlled by a control device.
隨動部及驅動部係在相互地離開的狀態下於水平或鉛直之相對向方向相對向。之後，隨動部及驅動部會相互地接觸，且驅動部會將隨動部朝向相對向方向按壓。藉此，能使可動夾盤配置於開啟位置。之後，隨動部及驅動部會相互地離開。可動夾盤係能利用夾持力產生構件之力返回至閉合位置的方向。 The follower and the drive are opposed to each other in a horizontal or vertical opposite direction in a state where they are separated from each other. After that, the follower part and the drive part will contact each other, and the drive part will press the follower part in the opposite direction. Thereby, the movable chuck can be arranged in the open position. After that, the follower and drive will leave each other. The movable chuck is a direction capable of returning to the closed position by the force of the clamping force generating member.
如此，由於旋轉馬達及罩升降單元之至少一方係兼作使可動夾盤移動至開啟位置的方向的開啟用之致動器(actuator)，所以沒有必要設置專用的開啟用之致動器。為此，可以簡化開閉可動夾盤的夾盤開閉機構。更且，由於驅動部係接觸於隨動部且按壓隨動部，所以與利用磁力使可動夾盤移動至開啟位置的方向的情況相較，可以使可動夾盤確實地移動至開啟位置的方向。 As described above, since at least one of the rotary motor and the hood lifting unit doubles as an actuator for opening in a direction in which the movable chuck is moved to the open position, it is not necessary to provide a dedicated actuator for opening. Therefore, the chuck opening and closing mechanism for opening and closing the movable chuck can be simplified. Furthermore, since the driving portion is in contact with the follower and presses the follower, compared with the case where the movable chuck is moved to the open position by magnetic force, the movable chuck can be surely moved to the open position. .
夾持力產生構件既可為彈簧、橡膠及樹脂等之彈性體，又可包含有連結於可動夾盤的隨動磁鐵以及與隨動磁鐵相對向的驅動磁鐵。 The clamping force generating member may be an elastic body such as a spring, rubber, or resin, or may include a follower magnet connected to the movable chuck and a drive magnet opposite to the follower magnet.
在本實施形態中亦可在前述基板處理裝置中增加以下之至少一個的特徵。 In this embodiment, at least one of the following features may be added to the substrate processing apparatus.
前述可動夾盤係能夠繞著鉛直之前述夾盤轉動軸線轉動；前述控制裝置係在前述準備步驟中使前述隨動部及前述驅動部水平地相對向，且在前述解除步驟中使前述隨動部繞著前述旋轉軸線轉動，藉此使前述隨動部及前述驅動部相互地接觸。 The movable chuck is capable of rotating about the vertical chuck rotation axis; the control device horizontally opposes the follower and the drive part in the preparation step, and makes the follower in the release step The part rotates around the rotation axis, thereby bringing the follow-up part and the drive part into contact with each other.
前述可動夾盤係能夠繞著水平之前述夾盤轉動軸線轉動；前述控制裝置係在前述準備步驟中使前述隨動部及前述驅動部鉛直地相對向，且在前述解除步驟中使前述驅動部朝向鉛直方向移動，藉此使前述隨動部及前述驅動部相互地接觸。 The movable chuck is capable of rotating about the horizontal chuck rotation axis; the control device vertically opposes the follow-up portion and the drive portion in the preparation step, and makes the drive portion in the release step By moving in the vertical direction, the follower portion and the drive portion are brought into contact with each other.
前述可動夾盤係包含有壓抵於前述基板之外周部的夾持部，且能夠繞著朝向包圍前述旋轉軸線的圓之切線方向延伸的水平之前述夾盤轉動軸線轉動；前述夾持部係配置於比前述夾盤轉動軸線更上方；前述隨動部係配置於比前述夾盤轉動軸線更下方。 The movable chuck system includes a clamping portion pressed against an outer peripheral portion of the substrate, and is rotatable about the chuck rotation axis extending horizontally in a tangential direction of a circle surrounding the rotation axis; It is arranged above the rotation axis of the chuck; the follower is arranged below the rotation axis of the chuck.
依據該構成，隨動部係配置於比朝向包圍基板之旋轉軸線的圓之切線方向延伸的水平之夾盤轉動軸線更下方。另一方面，壓抵於基板之外周部的可動夾盤之夾持部係配置於比夾盤轉動軸線更上方。夾持部係配置於基板之周圍。在隨動部配置於比夾盤轉動軸線更上方的情況下，當離心力施加於隨動部時，就會產生使夾持部朝向外側移動之力，換句話說，產生將夾持部從基板之外周部離開之力。相對於此，在隨動部配置於比夾盤轉動軸線更下方的情況下，當離心力施加於隨動部時，就會產生使夾持部朝向內側移動之力，換句話說，產生將夾持部壓抵於基板之外周部之力。為此，可以更確實地夾持基板。 According to this configuration, the follower is arranged below the horizontal chuck rotation axis extending toward the tangential direction of the circle surrounding the rotation axis of the substrate. On the other hand, the clamping portion of the movable chuck that is pressed against the outer peripheral portion of the substrate is disposed above the rotation axis of the chuck. The clamping portion is arranged around the substrate. In the case where the follower is disposed above the rotation axis of the chuck, when a centrifugal force is applied to the follower, a force is generated to move the chuck to the outside. The force of leaving the periphery. In contrast, when the follower is disposed below the rotation axis of the chuck, when a centrifugal force is applied to the follower, a force that moves the chuck toward the inside is generated. In other words, a chuck is generated. The force by which the holding portion is pressed against the outer peripheral portion of the substrate. For this reason, the substrate can be clamped more reliably.
前述基板處理裝置係更具備：搬運機器人，係用配置於前述基板之下方的手部一邊支撐前述基板一邊將前述基板搬運至前述複數個夾盤構件；前述控制裝置係在前述解 除步驟中一邊使前述防濺罩之上端位於比前述手部更下方，一邊使前述隨動部及前述驅動部相互地接觸。 The substrate processing apparatus further includes: a transport robot that transports the substrate to the plurality of chuck members while supporting the substrate with a hand disposed below the substrate; and the control device causes the The upper end of the splash guard is positioned lower than the hand, and the follow-up portion and the drive portion are brought into contact with each other.
前述基板處理裝置係更具備：旋轉基座(spin base)，係配置於由前述複數個夾盤構件所夾持的前述基板之下方，且將前述旋轉馬達之動力傳遞至前述複數個夾盤構件；處理流體供給單元，用以將處理由前述複數個夾盤構件所夾持的前述基板之處理流體供給至前述基板之上表面及下表面之至少一方；以及IH(induction heating；感應加熱)加熱機構，係包含有發熱構件、加熱線圈及IH電路，該發熱構件係配置於由前述複數個夾盤構件所夾持的前述基板與前述旋轉基座之間，該加熱線圈係配置於前述旋轉基座之下方，該IH電路係藉由將電力供給至前述加熱線圈來產生施加於前述發熱構件的交變磁場以使前述發熱構件發熱。 The substrate processing apparatus further includes a spin base, which is disposed below the substrate held by the plurality of chuck members, and transmits the power of the rotation motor to the plurality of chuck members. A processing fluid supply unit configured to supply a processing fluid for processing the substrate held by the plurality of chuck members to at least one of an upper surface and a lower surface of the substrate; and IH (induction heating) heating The mechanism includes a heating element, a heating coil, and an IH circuit. The heating element is disposed between the substrate and the rotating base sandwiched by the plurality of chuck members. The heating coil is disposed on the rotating base. Below the base, the IH circuit generates electricity by supplying electric power to the heating coil to generate an alternating magnetic field applied to the heating element to generate heat.
依據該構成，基板能由複數個夾盤構件所夾持。旋轉馬達之動力係能透過位於基板之下方的旋轉基座傳遞至複數個夾盤構件。藉此，基板能繞著旋轉軸線旋轉。IH加熱機構的IH電路係在基板旋轉時將電力供給至加熱線圈。藉此，能產生施加於發熱構件的交變磁場，而發熱構件能發熱。處理基板的處理流體係供給至旋轉中的基板。藉此，可以均一地處理基板。 According to this configuration, the substrate can be held by a plurality of chuck members. The power system of the rotary motor can be transmitted to a plurality of chuck members through a rotary base located below the substrate. Thereby, the substrate can be rotated around the rotation axis. The IH circuit of the IH heating mechanism supplies power to the heating coil when the substrate is rotated. Thereby, an alternating magnetic field applied to the heat generating member can be generated, and the heat generating member can generate heat. A processing flow system for processing a substrate is supplied to the substrate in rotation. Thereby, the substrate can be processed uniformly.
由於發熱構件係藉由感應加熱所加熱，所以沒有必要將對發熱構件供給電力的配線或連接器連接於發熱構件。為此，基板之轉速不會藉由如此的構造而受到限制。更且，加熱基板的發熱構件係配置於基板與旋轉基座之間，而非 配置於旋轉基座之內部。從而，與發熱構件配置於旋轉基座之內部的情況相較，可以縮短基板與發熱構件之間隔，且可以提高基板之加熱效率。 Since the heating element is heated by induction heating, it is not necessary to connect the wiring or connector that supplies power to the heating element to the heating element. For this reason, the rotation speed of the substrate is not limited by such a structure. Furthermore, the heat generating member that heats the substrate is disposed between the substrate and the rotating base, rather than being disposed inside the rotating base. Therefore, compared with the case where the heat generating member is disposed inside the rotating base, the interval between the substrate and the heat generating member can be shortened, and the heating efficiency of the substrate can be improved.
前述加熱線圈與前述旋轉基座之上下方向的間隔亦可比前述加熱線圈之厚度更窄。前述加熱線圈之厚度係意指上下方向上的前述加熱線圈之長度。 The space between the heating coil and the rotating base in the up-down direction may be narrower than the thickness of the heating coil. The thickness of the heating coil means the length of the heating coil in the vertical direction.
依據該構成，加熱線圈能配置於旋轉基座之附近。換句話說，加熱線圈與旋轉基座之上下方向的間隔係比加熱線圈之厚度更窄。加熱線圈係配置於旋轉基座之下方，發熱構件係配置於旋轉基座之上方。當使加熱線圈接近旋轉基座時，就能縮短從加熱線圈至發熱構件的距離。藉此，由於施加於發熱構件的交變磁場會變強，所以可以將供給至加熱線圈的電力有效率地轉換成發熱構件的熱。 According to this configuration, the heating coil can be arranged near the rotating base. In other words, the distance between the heating coil and the rotating base in the up-down direction is narrower than the thickness of the heating coil. The heating coil is arranged below the rotary base, and the heating element is arranged above the rotary base. When the heating coil is brought close to the rotating base, the distance from the heating coil to the heating member can be shortened. Thereby, since the alternating magnetic field applied to the heat generating member becomes strong, the electric power supplied to the heating coil can be efficiently converted into the heat of the heat generating member.
前述旋轉基座之厚度亦可比前述加熱線圈之厚度更小。 The thickness of the rotating base may be smaller than the thickness of the heating coil.
依據該構成，能減低旋轉基座之厚度。換句話說，旋轉基座之厚度係比加熱線圈之厚度更小。當旋轉基座較厚時，不僅從加熱線圈至發熱構件的距離會增加，施加於發熱構件的交變磁場也會變弱。為此，可以藉由減低旋轉基座之厚度來使發熱構件的溫度有效率地上升。 According to this configuration, the thickness of the rotary base can be reduced. In other words, the thickness of the rotating base is smaller than the thickness of the heating coil. When the rotating base is thicker, not only the distance from the heating coil to the heating element increases, but also the alternating magnetic field applied to the heating element becomes weak. Therefore, the temperature of the heat generating member can be efficiently raised by reducing the thickness of the rotating base.
前述旋轉基座之厚度係意指上下方向上的前述旋轉基座之長度。旋轉基座之厚度係指在發熱構件與加熱線圈之間的區域上的旋轉基座之厚度。在其他區域上的旋轉基 座之厚度既可與加熱線圈之厚度相等，又可比加熱線圈之厚度還短或還長。 The thickness of the aforementioned rotating base means the length of the aforementioned rotating base in the vertical direction. The thickness of the rotating base refers to the thickness of the rotating base in the area between the heating member and the heating coil. The thickness of the rotating base in other areas may be equal to the thickness of the heating coil, or it may be shorter or longer than the thickness of the heating coil.
前述發熱構件亦可直接與由前述複數個夾盤構件所夾持的前述基板相對向。 The heat generating member may directly face the substrate held by the plurality of chuck members.
依據該構成，在基板與發熱構件之間並未夾設其他的構件，而是發熱構件直接與基板相對向。為此，發熱構件的熱能有效率地傳遞至基板。藉此，可以提高基板之加熱效率。 According to this configuration, no other member is interposed between the substrate and the heat generating member, but the heat generating member directly faces the substrate. For this reason, the thermal energy of the heat generating member is efficiently transferred to the substrate. Thereby, the heating efficiency of the substrate can be improved.
更具備：間隔變更機構，係藉由使前述複數個夾盤構件或前述發熱構件朝向上下方向移動，來變更由前述複數個夾盤構件所夾持的前述基板與前述發熱構件之上下方向的間隔。 It further includes an interval changing mechanism for moving the plurality of chuck members or the heat generating member in an up-down direction to change an interval between the substrate held by the plurality of chuck members and the heat generating member in a vertical direction. .
依據該構成，間隔變更機構能使複數個夾盤構件與發熱構件朝向上下方向相對地移動。藉此，能變更由複數個夾盤構件所夾持的基板與發熱構件之上下方向的間隔。從而，可以依需要來變更從發熱構件至基板的距離。 According to this configuration, the interval changing mechanism can relatively move the plurality of chuck members and the heat generating member in the vertical direction. This makes it possible to change the distance between the substrate sandwiched by the plurality of chuck members and the heat generating member in the vertical direction. Therefore, the distance from the heat generating member to the substrate can be changed as needed.
前述基板處理裝置係更具備：搬運機器人，係用配置於前述基板之下方的手部一邊支撐前述基板一邊將前述基板搬運至前述複數個夾盤構件。前述間隔變更機構亦可在由前述複數個夾盤構件所夾持的前述基板與前述發熱構件之上下方向的間隔比前述手部之厚度更寬的退避位置、與前述間隔比前述手部之厚度更窄的鄰近位置之間，使前述複數個夾盤構件或前述發熱構件朝向上下方向移動。前述手部之厚度係意指上下方向上的前述手部之長度。 The substrate processing apparatus further includes a transfer robot that transfers the substrate to the plurality of chuck members while supporting the substrate with a hand disposed below the substrate. The interval changing mechanism may be a retreat position in which the interval between the substrate and the heat generating member held by the plurality of chuck members in the up-down direction is wider than the thickness of the hand, and the interval is larger than the thickness of the hand Between the narrower adjacent positions, the plurality of chuck members or the heat generating members are moved in the vertical direction. The thickness of the hand means the length of the hand in the vertical direction.
依據該構成，在前述夾盤構件或發熱構件位於退避位置的退避狀態下，搬運機器人係將支撐於手部上的基板置放於複數個夾盤構件之上。其次，搬運機器人係使手部下降且從基板離開。之後，搬運機器人係使手部從基板與發熱構件之間退避開。在基板從複數個夾盤構件取出時係在退避狀態下將手部插入於基板與發熱構件之間。之後，搬運機器人係使手部上升。藉此，基板能從複數個夾盤構件離開且支撐於手部。 According to this configuration, in a retracted state where the chuck member or the heat generating member is in the retracted position, the transfer robot places the substrate supported on the hand on the plurality of chuck members. Next, the transfer robot lowers the hand and moves away from the substrate. Thereafter, the transfer robot retracts the hand from between the substrate and the heat generating member. When the substrate is taken out from the plurality of chuck members, a hand is inserted between the substrate and the heating member in a retracted state. After that, the transfer robot raises the hand. Thereby, the substrate can be separated from the plurality of chuck members and supported by the hand.
當從加熱效率之觀點來看時，發熱構件較佳是配置於基板之附近。然而，當發熱構件過於接近基板時，就無法使手部進入基板與發熱構件之間，且無法將基板置放於複數個夾盤構件，或從複數個夾盤構件取出。如前述般，基板之遞送係能在退避狀態下進行。另一方面，基板之加熱係在複數個夾盤構件或發熱構件位於鄰近位置的鄰近狀態下進行。從而，可以不使基板之加熱效率降低地進行基板之遞送。 From the viewpoint of heating efficiency, the heat generating member is preferably disposed near the substrate. However, when the heat generating member is too close to the substrate, it is impossible to let the hand enter between the substrate and the heat generating member, and the substrate cannot be placed on or taken out from the plurality of chuck members. As described above, the substrate can be delivered in a retracted state. On the other hand, the substrate is heated in a state in which a plurality of chuck members or heat generating members are located adjacent to each other. Therefore, the substrate can be delivered without reducing the heating efficiency of the substrate.
前述間隔變更機構係使前述複數個夾盤構件相對於前述旋轉基座朝向上下方向移動；前述可動夾盤係能夠在前述閉合位置與前述開啟位置之間相對於前述旋轉基座移動。 The interval changing mechanism moves the plurality of chuck members in an up-and-down direction relative to the rotary base; and the movable chuck is movable relative to the rotary base between the closed position and the open position.
依據該構成，複數個夾盤構件係包含有能夠在閉合位置與開啟位置之間相對於旋轉基座移動的可動夾盤。基板與發熱構件之上下方向的間隔係能藉由使複數個夾盤構件相對於旋轉基座朝向上下方向移動來變更。從而，可動夾 盤不僅能夠在閉合位置與開啟位置之間相對於旋轉基座移動，還能夠相對於旋轉基座朝向上下方向移動。如此，由於沒有必要為了變更基板與發熱構件之上下方向的間隔而使發熱構件朝向上下方向移動，所以可以簡化支撐發熱構件的構造。 According to this configuration, the plurality of chuck members include a movable chuck capable of moving relative to the rotary base between a closed position and an open position. The distance between the substrate and the heat generating member in the up-down direction can be changed by moving a plurality of chuck members in the up-down direction relative to the rotary base. Therefore, the movable chuck can be moved not only relative to the rotary base between the closed position and the open position, but also in the vertical direction relative to the rotary base. In this way, since it is not necessary to move the heat generating member in the up and down direction in order to change the interval between the substrate and the heat generating member in the up and down direction, the structure for supporting the heat generating member can be simplified.
前述間隔變更機構係使前述發熱構件相對於前述旋轉基座朝向上下方向移動。 The interval changing mechanism moves the heat generating member in the vertical direction with respect to the rotation base.
依據該構成，基板與發熱構件之上下方向的間隔係能藉由使發熱構件相對於旋轉基座朝向上下方向移動來變更。如此，由於沒有必要為了變更基板與發熱構件之上下方向的間隔而使複數個夾盤構件朝向上下方向移動，所以可以簡化支撐複數個夾盤構件的構造。 According to this configuration, the distance between the substrate and the heat generating member in the up and down direction can be changed by moving the heat generating member in the up and down direction relative to the rotation base. As described above, since it is not necessary to move the plurality of chuck members in the up-down direction in order to change the interval between the substrate and the heat generating member in the up-down direction, the structure for supporting the plurality of chuck members can be simplified.
前述基板處理裝置亦可更具備：磁屏蔽構件，用以屏蔽藉由往前述加熱線圈之電力供給所產生的交變磁場。前述磁屏蔽構件係包含有：包圍前述加熱線圈的筒狀之外壁部；以及位於前述加熱線圈之下方的下壁部。 The substrate processing apparatus may further include a magnetic shielding member for shielding an alternating magnetic field generated by a power supply to the heating coil. The magnetic shielding member includes a cylindrical outer wall portion surrounding the heating coil, and a lower wall portion located below the heating coil.
依據該構成，吸收磁性的磁屏蔽構件之外壁部係包圍加熱線圈。更且，吸收磁性的磁屏蔽構件之下壁部係位於加熱線圈之下方。從而，可以抑制或消除波及位於加熱線圈之周圍的構件的交變磁場之影響。同樣地可以抑制或消除波及位於加熱線圈之下方的構件的交變磁場之影響。 According to this configuration, the outer wall portion of the magnetically absorbing magnetic shield member surrounds the heating coil. Furthermore, the lower wall portion of the magnetically absorbing magnetic shield member is located below the heating coil. Thereby, it is possible to suppress or eliminate the influence of the alternating magnetic field affecting the members located around the heating coil. It is also possible to suppress or eliminate the influence of an alternating magnetic field that affects a component located below the heating coil.
前述基板處理裝置亦可具備：溫度計，用以檢測前述發熱構件之溫度；以及控制裝置，係基於前述溫度計之檢測值來控制前述IH加熱機構。 The substrate processing apparatus may further include a thermometer for detecting a temperature of the heat generating component, and a control device for controlling the IH heating mechanism based on a detection value of the thermometer.
依據該構成，檢測發熱構件之溫度的溫度計之檢測值係輸入於控制裝置。控制裝置係基於該檢測值來控制供給至加熱線圈的電力。藉此，可以使發熱構件之溫度以較高的精度接近目標溫度。 According to this configuration, the detection value of the thermometer that detects the temperature of the heating element is input to the control device. The control device controls the power supplied to the heating coil based on the detected value. Thereby, the temperature of the heat generating member can be brought close to the target temperature with high accuracy.
溫度計較佳是以非接觸於發熱構件的方式來檢測發熱構件之溫度的非接觸式溫度計。如此的溫度計之一例為輻射式溫度計，該輻射式溫度計係藉由檢測從物體所釋放出的紅外線或可視光線之強度來檢測物體的溫度。 The thermometer is preferably a non-contact thermometer that detects the temperature of the heat-generating member in a non-contact manner with the heat-generating member. An example of such a thermometer is a radiation thermometer, which detects the temperature of an object by detecting the intensity of infrared or visible light emitted from the object.
前述流體供給單元亦可包含有：下表面噴嘴，係在俯視觀察下配置於朝向上下方向貫通前述發熱構件的貫通孔內，用以將前述處理流體朝向由前述複數個夾盤構件所夾持的前述基板之下表面吐出。 The fluid supply unit may further include a lower surface nozzle disposed in a through hole penetrating the heat generating member in an up-down direction in a plan view to direct the processing fluid toward a plurality of chuck members held by the plurality of chuck members. The lower surface of the substrate is ejected.
依據該構成，下表面噴嘴能朝向基板之下表面吐出處理流體。下表面噴嘴係在俯視觀察下配置於朝向上下方向貫通發熱構件之中央部的貫通孔內。從而，可以抑制或防止從下表面噴嘴所吐出的處理流體妨礙發熱構件。藉此，可以將處理流體確實地供給至基板之下表面。 According to this configuration, the lower surface nozzle can discharge the processing fluid toward the lower surface of the substrate. The lower nozzle is arranged in a through hole that penetrates the central portion of the heat generating member in the vertical direction in a plan view. Accordingly, it is possible to suppress or prevent the processing fluid discharged from the lower surface nozzle from interfering with the heat generating member. Thereby, the processing fluid can be reliably supplied to the lower surface of the substrate.
只要下表面噴嘴是在俯視觀察下配置於發熱構件之貫通孔內，則吐出處理流體的下表面噴嘴之吐出口既可配置於與發熱構件之上表面相等的高度，又可配置於比發熱構件之上表面更高或更低的位置。 As long as the lower surface nozzle is disposed in the through hole of the heat generating member in a plan view, the outlet of the lower surface nozzle that discharges the processing fluid can be disposed at the same height as the upper surface of the heat generating member, or it can be disposed at a level higher than the heat generating member The top surface is higher or lower.
本發明中的前述之、或更進一步之其他的目的、特徵及功效係能藉由參照附圖而敘述如下的實施形態之說明中所明白。 The foregoing, or further other objects, features, and effects in the present invention will be apparent from the following description of embodiments with reference to the drawings.
1‧‧‧基板處理裝置 1‧‧‧ substrate processing device
2‧‧‧處理單元 2‧‧‧ processing unit
3‧‧‧控制裝置 3‧‧‧control device
4‧‧‧腔室 4‧‧‧ chamber
4a‧‧‧底部 4a‧‧‧ bottom
5‧‧‧第一藥液噴嘴 5‧‧‧The first liquid medicine nozzle
6‧‧‧第一藥液配管 6‧‧‧The first liquid medicine piping
7‧‧‧第一藥液閥 7‧‧‧The first liquid medicine valve
8‧‧‧第一噴嘴移動機構 8‧‧‧ the first nozzle moving mechanism
9‧‧‧第二藥液噴嘴 9‧‧‧Second chemical liquid nozzle
10‧‧‧第二藥液配管 10‧‧‧Second liquid medicine piping
11‧‧‧第二藥液閥 11‧‧‧Second liquid medicine valve
12‧‧‧第二噴嘴移動機構 12‧‧‧Second nozzle moving mechanism
13‧‧‧沖洗液噴嘴 13‧‧‧Flushing liquid nozzle
14‧‧‧第一沖洗液配管 14‧‧‧First flushing liquid pipe
15‧‧‧第一沖洗液閥 15‧‧‧The first flushing liquid valve
16‧‧‧下表面噴嘴 16‧‧‧ lower surface nozzle
16a‧‧‧圓板部 16a‧‧‧Circular Section
16b‧‧‧筒狀部 16b‧‧‧Tube
17‧‧‧第二沖洗液配管 17‧‧‧Second flushing pipe
18‧‧‧第二沖洗液閥 18‧‧‧Second flushing valve
19‧‧‧溶劑噴嘴 19‧‧‧ Solvent Nozzle
20‧‧‧溶劑配管 20‧‧‧ Solvent piping
21‧‧‧溶劑閥 21‧‧‧ Solvent Valve
22‧‧‧氣體噴嘴 22‧‧‧gas nozzle
23‧‧‧氣體配管 23‧‧‧Gas piping
24‧‧‧氣體閥 24‧‧‧Gas valve
25‧‧‧第四噴嘴移動機構 25‧‧‧Fourth nozzle moving mechanism
26‧‧‧杯體 26‧‧‧ cup body
27‧‧‧環狀承盤 27‧‧‧Ring
28‧‧‧防濺罩 28‧‧‧ Splash guard
28A‧‧‧最上方的防濺罩 28A‧‧‧The top splash guard
28a‧‧‧傾斜部 28a‧‧‧inclined
28b‧‧‧導引部 28b‧‧‧Guide
28u‧‧‧防濺罩之上端 28u‧‧‧ Upper end of splash guard
29‧‧‧罩升降單元 29‧‧‧ Hood lifting unit
31‧‧‧旋轉夾盤 31‧‧‧Rotary Chuck
32‧‧‧夾盤構件 32‧‧‧Chuck member
32a‧‧‧可動夾盤 32a‧‧‧movable chuck
32b‧‧‧固定夾盤 32b‧‧‧Fixed chuck
33‧‧‧旋轉基座 33‧‧‧Swivel base
33p‧‧‧貫通部 33p‧‧‧through
34‧‧‧夾盤開閉機構 34‧‧‧Chuck opening and closing mechanism
35‧‧‧旋轉軸 35‧‧‧rotation axis
36‧‧‧旋轉馬達 36‧‧‧Rotary motor
36a‧‧‧定子 36a‧‧‧Stator
36b‧‧‧轉子 36b‧‧‧rotor
37‧‧‧夾盤外殼 37‧‧‧chuck housing
37a‧‧‧下側筒狀部 37a‧‧‧Lower cylindrical part
37b‧‧‧環狀部 37b‧‧‧Ring
37c‧‧‧上側筒狀部 37c‧‧‧upper tube
38‧‧‧夾盤頭 38‧‧‧Chuck head
38a‧‧‧夾持部 38a‧‧‧Clamping section
38b‧‧‧支撐部 38b‧‧‧ support
39‧‧‧基軸 39‧‧‧ base shaft
41‧‧‧環狀密封 41‧‧‧Ring Seal
42‧‧‧滑動軸承 42‧‧‧ plain bearing
44‧‧‧滾動軸承 44‧‧‧ Rolling bearings
51‧‧‧線圈彈簧 51‧‧‧coil spring
52‧‧‧殼體 52‧‧‧shell
53‧‧‧保持部 53‧‧‧holding department
54‧‧‧保持孔 54‧‧‧ holding hole
55‧‧‧隨動部 55‧‧‧ follower
55o‧‧‧隨動部的外端 55o‧‧‧ Outer end of follower
56‧‧‧驅動部 56‧‧‧Driver
56a‧‧‧驅動部之縱向部 56a‧‧‧Vertical part of driving part
56b‧‧‧驅動部之橫向部 56b‧‧‧Horizontal part of driving part
56i‧‧‧驅動部的內端 56i‧‧‧ Inner end of drive section
61‧‧‧間隔變更機構 61‧‧‧Interval change agency
62‧‧‧升降構件 62‧‧‧Lifting member
62p‧‧‧貫通部 62p‧‧‧through section
63‧‧‧裙部 63‧‧‧skirt
63p‧‧‧貫通部 63p‧‧‧through
64‧‧‧導引構件 64‧‧‧Guide members
64a‧‧‧導引軸 64a‧‧‧Guide shaft
64b‧‧‧導引止動件 64b‧‧‧Guide stopper
65‧‧‧貫通孔 65‧‧‧through hole
66‧‧‧升降驅動單元 66‧‧‧Lifting drive unit
67‧‧‧隨動磁鐵 67‧‧‧ follower magnet
68‧‧‧驅動磁鐵 68‧‧‧Drive magnet
69‧‧‧升降致動器 69‧‧‧ Lifting actuator
71‧‧‧IH加熱機構 71‧‧‧IH heating mechanism
72‧‧‧發熱構件 72‧‧‧ Heating element
72a‧‧‧板狀部 72a‧‧‧ plate
72b‧‧‧腳部 72b‧‧‧foot
72c‧‧‧貫通孔 72c‧‧‧through hole
72p‧‧‧貫通部 72p‧‧‧through
73‧‧‧加熱線圈 73‧‧‧Heating coil
73I‧‧‧內線圈 73I‧‧‧Inner coil
73O‧‧‧外線圈 73O‧‧‧Outer coil
74‧‧‧IH電路 74‧‧‧IH circuit
75‧‧‧溫度計 75‧‧‧ thermometer
76‧‧‧透明構件 76‧‧‧ transparent member
77‧‧‧磁屏蔽構件 77‧‧‧ Magnetic shielding member
77a‧‧‧外壁部 77a‧‧‧outer wall
77b‧‧‧下壁部 77b‧‧‧ lower wall
78‧‧‧支撐構件 78‧‧‧ support member
281‧‧‧支撐軸 281‧‧‧Support shaft
282‧‧‧支撐孔 282‧‧‧Support hole
A1‧‧‧旋轉軸線 A1‧‧‧axis of rotation
A2‧‧‧夾盤轉動軸線 A2‧‧‧ Chuck rotation axis
D1‧‧‧從發熱構件至基板之 距離 D1‧‧‧ Distance from heating element to substrate
D2‧‧‧加熱線圈與旋轉基座 之上下方向的間隔 D2‧‧‧The distance between the heating coil and the rotating base
H1‧‧‧手部 H1‧‧‧Hand
R1‧‧‧搬運機器人 R1‧‧‧handling robot
RI‧‧‧內側環狀區域 RI‧‧‧ inside annular area
RO‧‧‧外側環狀區域 RO‧‧‧ outer ring area
T1‧‧‧手部之厚度 T1‧‧‧thickness of hand
T2‧‧‧加熱線圈之厚度 T2‧‧‧thickness of heating coil
T3‧‧‧旋轉基座之厚度 T3‧‧‧thickness of rotating base
W‧‧‧基板 W‧‧‧ substrate
圖1係水平地觀察本發明之第一實施形態的基板處理裝置中所具備的腔室(chamber)之內部的示意圖。 FIG. 1 is a schematic view of the interior of a chamber provided in a substrate processing apparatus according to a first embodiment of the present invention.
圖2係顯示沿著圖3所示之II-II線的旋轉夾盤之鉛直剖面的示意圖。 FIG. 2 is a schematic view showing a vertical cross section of the rotating chuck along line II-II shown in FIG. 3.
圖3係旋轉夾盤的示意俯視圖。 Fig. 3 is a schematic plan view of a rotary chuck.
圖4係顯示沿著圖2所示之IV-IV線的旋轉夾盤之水平剖面的示意圖。 FIG. 4 is a schematic diagram showing a horizontal cross section of the rotating chuck along line IV-IV shown in FIG. 2.
圖5係顯示針對設置於旋轉夾盤的夾盤開閉機構加以說明用的鉛直剖面的示意圖。 FIG. 5 is a schematic view showing a vertical cross-section for explaining a chuck opening and closing mechanism provided on a rotary chuck.
圖6A係顯示隨動部及驅動部隔出間隔朝向旋轉方向相互地相對向之狀態的示意俯視圖。 FIG. 6A is a schematic plan view showing a state where the follower portion and the drive portion are opposed to each other in the direction of rotation at intervals.
圖6B係顯示隨動部藉由驅動部水平地按壓直至可動夾盤到達開啟位置為止之狀態的示意俯視圖。 6B is a schematic plan view showing a state in which the follower is horizontally pressed by the drive section until the movable chuck reaches the open position.
圖7A係針對基板之遞送加以說明用的示意圖。 FIG. 7A is a schematic diagram for explaining substrate delivery.
圖7B係針對基板之遞送加以說明用的示意圖。 FIG. 7B is a schematic diagram for explaining the substrate delivery.
圖8A係顯示針對設置於旋轉夾盤的IH加熱機構加以說明用的鉛直剖面之示意圖。 FIG. 8A is a schematic view showing a vertical cross section for explaining an IH heating mechanism provided on a rotary chuck.
圖8B係針對加熱線圈之配置加以說明用的示意俯視圖。 FIG. 8B is a schematic plan view for explaining the arrangement of the heating coil.
圖9係針對藉由基板處理裝置所執行的基板之處理之一例加以說明用的工序圖。 FIG. 9 is a process diagram for explaining an example of processing of a substrate performed by a substrate processing apparatus.
圖10A係顯示在圖9所示的基板之處理之一例中對基板供給SPM(sulfuric acid/hydrogen peroxide mixture；硫酸與 過氧化氫水的混合液)之狀態的示意圖。 FIG. 10A is a schematic view showing a state in which an SPM (sulfuric acid / hydrogen peroxide mixture; a mixed solution of sulfuric acid and hydrogen peroxide water) is supplied to the substrate in an example of the processing of the substrate shown in FIG. 9.
圖10B係顯示在圖9所示的基板之處理之一例中對基板供給純水之狀態的示意圖。 FIG. 10B is a schematic diagram showing a state in which pure water is supplied to the substrate in an example of the processing of the substrate shown in FIG. 9.
圖10C係顯示在圖9所示的基板之處理之一例中對基板供給SC1(ammonia-hydrogen peroxide mixture；氨水與過氧化氫水與水的混合液)之狀態的示意圖。 FIG. 10C is a schematic diagram showing a state in which SC1 (ammonia-hydrogen peroxide mixture; a mixture of ammonia water and hydrogen peroxide water and water) is supplied to the substrate in an example of the processing of the substrate shown in FIG. 9.
圖10D係顯示在圖9所示的基板之處理之一例中對基板供給IPA(Isopropyl Alcohol；異丙醇)之狀態的示意圖。 FIG. 10D is a schematic diagram showing a state in which IPA (Isopropyl Alcohol; isopropyl alcohol) is supplied to the substrate in an example of the processing of the substrate shown in FIG. 9.
圖10E係顯示在圖9所示的基板之處理之一例中從基板去除IPA之狀態的示意圖。 FIG. 10E is a schematic diagram showing a state in which IPA is removed from the substrate in an example of the processing of the substrate shown in FIG. 9.
圖10F係顯示在圖9所示的基板之處理之一例中使基板乾燥之狀態的示意圖。 FIG. 10F is a schematic view showing a state where the substrate is dried in an example of the processing of the substrate shown in FIG. 9.
圖11係顯示本發明之第二實施形態的旋轉夾盤之鉛直剖面的示意圖。 FIG. 11 is a schematic view showing a vertical cross section of a rotary chuck according to a second embodiment of the present invention.
圖12係朝向圖11所示的箭頭XII之方向觀察可動夾盤的示意俯視圖。 FIG. 12 is a schematic plan view of the movable chuck viewed in a direction of an arrow XII shown in FIG. 11.
圖13係顯示隨動部藉由驅動部鉛直地按壓直至可動夾盤到達開啟位置為止之狀態的示意剖視圖。 13 is a schematic cross-sectional view showing a state in which the follower is vertically pressed by the drive section until the movable chuck reaches the open position.
圖1係水平地觀察本發明之第一實施形態的基板處理裝置1中所具備的腔室4之內部的示意圖。 FIG. 1 is a schematic view of the inside of a chamber 4 included in a substrate processing apparatus 1 according to a first embodiment of the present invention.
基板處理裝置1係指逐片處理半導體晶圓等的圓板狀之基板W的單片式之裝置。基板處理裝置1係包含有：處 理單元2，係用處理液或處理氣體等的處理流體來處理基板W；搬運機器人(robot)R1(參照圖3)，用以將基板W搬運至處理單元2；以及控制裝置3，用以控制基板處理裝置1。控制裝置3係指包含有記憶體(memory)及處理器(processor)的電腦(computer)，該記憶體係記憶程式等的資訊，該處理器係按照記憶於記憶體的資訊來控制基板處理裝置1。 The substrate processing apparatus 1 refers to a single-chip apparatus that processes a disc-shaped substrate W such as a semiconductor wafer one by one. The substrate processing apparatus 1 includes a processing unit 2 for processing the substrate W with a processing fluid such as a processing liquid or a processing gas, and a robot R1 (see FIG. 3) for transferring the substrate W to the processing unit 2. And a control device 3 for controlling the substrate processing device 1. The control device 3 refers to information including a computer including a memory and a processor, and a memory system to store programs and the like. The processor controls the substrate processing device 1 according to the information stored in the memory. .
處理單元2係包含有：箱形之腔室4，係具有內部空間；旋轉夾盤31，係使一片的基板W在腔室4內一邊保持於水平，一邊繞著通過基板W之中央部的鉛直之旋轉軸線A1旋轉；複數個噴嘴，用以朝向由旋轉夾盤31所保持的基板W吐出各種的流體；以及筒狀之杯體(cup)26，係包圍旋轉夾盤31之周圍。 The processing unit 2 includes: a box-shaped chamber 4 having an internal space; and a rotating chuck 31 so that one piece of the substrate W is held horizontally in the chamber 4 while bypassing the center of the substrate W passing therethrough. The vertical rotation axis A1 is rotated; a plurality of nozzles are used to discharge various fluids toward the substrate W held by the rotation chuck 31; and a cylindrical cup 26 surrounds the periphery of the rotation chuck 31.
複數個噴嘴係包含有朝向基板W之上表面吐出藥液的第一藥液噴嘴5及第二藥液噴嘴9。第一藥液噴嘴5係連接於夾設有第一藥液閥7的第一藥液配管6。同樣地，第二藥液噴嘴9係連接於夾設有第二藥液閥11的第二藥液配管10。當第一藥液閥7開啟時，就能從第一藥液配管6對第一藥液噴嘴5供給藥液且從第一藥液噴嘴5吐出。當第一藥液閥7關閉時，就停止來自第一藥液噴嘴5的藥液之吐出。有關第二藥液噴嘴11亦為同樣。 The plurality of nozzles include a first chemical liquid nozzle 5 and a second chemical liquid nozzle 9 that discharge the chemical liquid toward the upper surface of the substrate W. The first chemical liquid nozzle 5 is connected to a first chemical liquid pipe 6 in which a first chemical liquid valve 7 is interposed. Similarly, the second chemical liquid nozzle 9 is connected to the second chemical liquid pipe 10 in which the second chemical liquid valve 11 is interposed. When the first chemical liquid valve 7 is opened, the chemical liquid can be supplied from the first chemical liquid pipe 6 to the first chemical liquid nozzle 5 and discharged from the first chemical liquid nozzle 5. When the first chemical liquid valve 7 is closed, the discharge of the chemical liquid from the first chemical liquid nozzle 5 is stopped. The same applies to the second chemical liquid nozzle 11.
從第一藥液噴嘴5所吐出的藥液(第一藥液)之具體例為SPM。從第二藥液噴嘴9所吐出的藥液(第二藥液)之具體例為SC1。第一藥液亦可為磷酸。第一藥液係除了SPM 及磷酸以外，亦可為包含有硫酸、硝酸、鹽酸、氟酸、磷酸、醋酸、氨水、過氧化氫水、有機酸(例如檸檬酸(citric acid)、草酸鹽(oxalate)等)、有機鹼(alkali)(例如，TMAH：tetramethylammonium hydroxide；氫氧化四甲基銨等)、界面活性劑以及防腐劑之至少一個的液體。有關第二藥液亦為同樣。 A specific example of the chemical solution (first chemical solution) discharged from the first chemical solution nozzle 5 is SPM. A specific example of the chemical solution (second chemical solution) discharged from the second chemical solution nozzle 9 is SC1. The first chemical solution may also be phosphoric acid. In addition to SPM and phosphoric acid, the first chemical solution may include sulfuric acid, nitric acid, hydrochloric acid, hydrofluoric acid, phosphoric acid, acetic acid, ammonia water, hydrogen peroxide water, organic acids such as citric acid, and oxalate. (oxalate, etc.), organic alkali (alkali) (for example, TMAH: tetramethylammonium hydroxide; tetramethylammonium hydroxide, etc.), a liquid of at least one of a surfactant and a preservative. The same applies to the second medicinal solution.
第一藥液噴嘴5係連接於使第一藥液噴嘴5移動的第一噴嘴移動機構8。第二藥液噴嘴9係連接於使第二藥液噴嘴9移動的第二噴嘴移動機構12。第一噴嘴移動機構8係使第一藥液噴嘴5在處理位置與待機位置之間移動，該處理位置係指第一藥液著液於基板W之上表面的位置，該待機位置係指第一藥液噴嘴5在俯視觀察下位於杯體26之周圍的位置。更且，第一噴嘴移動機構8係藉由使第一藥液噴嘴5水平地移動來使第一藥液的著液位置在基板W之上表面內移動。有關第二噴嘴移動機構12亦為同樣。 The first chemical liquid nozzle 5 is connected to a first nozzle moving mechanism 8 that moves the first chemical liquid nozzle 5. The second chemical liquid nozzle 9 is connected to a second nozzle moving mechanism 12 that moves the second chemical liquid nozzle 9. The first nozzle moving mechanism 8 moves the first chemical liquid nozzle 5 between a processing position and a standby position. The processing position refers to a position where the first chemical liquid is deposited on the upper surface of the substrate W, and the standby position refers to the first A liquid medicine nozzle 5 is located around the cup 26 in a plan view. Moreover, the first nozzle moving mechanism 8 moves the first chemical liquid nozzle 5 horizontally to move the liquid injection position of the first chemical liquid within the upper surface of the substrate W. The same applies to the second nozzle moving mechanism 12.
複數個噴嘴係包含有朝向基板W之上表面中央部將沖洗液向下吐出的沖洗液噴嘴13。沖洗液噴嘴13係固定於腔室4。沖洗液噴嘴13亦可連接於使沖洗液噴嘴13移動的第三噴嘴移動機構。沖洗液噴嘴13係連接於夾設有第一沖洗液閥15的第一沖洗液配管14。從沖洗液噴嘴13所吐出的沖洗液之具體例為純水(去離子水)。沖洗液亦可為碳酸水、電解離子水、氫水、臭氧水以及稀釋濃度(例如，10ppm至100ppm左右)的鹽酸水等之純水以外的沖洗液。 The plurality of nozzles include a washing liquid nozzle 13 that discharges the washing liquid downward toward a center portion of the upper surface of the substrate W. The rinsing liquid nozzle 13 is fixed to the chamber 4. The rinse liquid nozzle 13 may be connected to a third nozzle moving mechanism that moves the rinse liquid nozzle 13. The rinse liquid nozzle 13 is connected to a first rinse liquid pipe 14 with a first rinse liquid valve 15 interposed therebetween. A specific example of the rinsing liquid discharged from the rinsing liquid nozzle 13 is pure water (deionized water). The rinsing liquid may be a rinsing liquid other than pure water such as carbonated water, electrolytic ion water, hydrogen water, ozone water, and hydrochloric acid water having a diluted concentration (for example, about 10 ppm to 100 ppm).
複數個噴嘴係包含有朝向基板W之下表面中央部將 沖洗液向上吐出的下表面噴嘴16。下表面噴嘴16係固定於腔室4。下表面噴嘴16係連接於夾設有第二沖洗液閥18的第二沖洗液配管17。從下表面噴嘴16所吐出的沖洗液之具體例為純水。沖洗液亦可為前述之純水以外的沖洗液。又，從下表面噴嘴16所吐出的液體亦可為沖洗液以外的處理液。 The plurality of nozzles include a lower surface nozzle 16 which discharges the rinse liquid upward toward the center of the lower surface of the substrate W. The lower surface nozzle 16 is fixed to the chamber 4. The lower surface nozzle 16 is connected to a second flushing liquid pipe 17 with a second flushing liquid valve 18 interposed therebetween. A specific example of the rinsing liquid discharged from the lower surface nozzle 16 is pure water. The rinsing liquid may be a rinsing liquid other than the aforementioned pure water. The liquid discharged from the lower surface nozzle 16 may be a treatment liquid other than a rinse liquid.
下表面噴嘴16係包含有：圓板部16a，係以旋轉基座33之上表面與基板W之下表面之間的高度來保持於水平；以及筒狀部16b，係從圓板部16a沿著旋轉軸線A1朝向下方延伸。圓板部16a係包圍旋轉軸線A1的圓環狀，且具有比基板W之直徑更小的外徑。筒狀部16b之外徑係比圓板部16a之外徑更小。筒狀部16b係插入於在旋轉基座33之上表面中央部所開設的貫通孔。下表面噴嘴16之吐出口係在圓板部16a之上表面中央部開口。下表面噴嘴16之吐出口係朝向上下方向與基板W之下表面中央部相對向。 The lower surface nozzle 16 includes a circular plate portion 16a maintained at a level between the upper surface of the rotation base 33 and the lower surface of the substrate W, and a cylindrical portion 16b extending from the circular plate portion 16a It extends downward toward the rotation axis A1. The circular plate portion 16 a has an annular shape surrounding the rotation axis A1 and has an outer diameter smaller than the diameter of the substrate W. The outer diameter of the cylindrical portion 16b is smaller than the outer diameter of the circular plate portion 16a. The cylindrical portion 16 b is inserted into a through hole opened in the center portion of the upper surface of the rotation base 33. The discharge port of the lower surface nozzle 16 is opened at the central portion of the upper surface of the circular plate portion 16a. The discharge port of the lower surface nozzle 16 faces the center of the lower surface of the substrate W in a vertical direction.
複數個噴嘴係包含有：溶劑噴嘴19，係朝向基板W之上表面吐出IPA(液體)；以及氣體噴嘴22，係朝向基板W之上表面吐出氣體。溶劑噴嘴19係連接於夾設有溶劑閥21的溶劑配管20。IPA係沸點比水更低，揮發性比水更高，表面張力比水更小。氣體噴嘴22係連接於夾設有氣體閥24的氣體配管23。從氣體噴嘴22所吐出的氣體之具體例為氮氣。氣體既可為氮氣以外的惰性氣體，又可為惰性氣體以外的氣體。 The plurality of nozzles include a solvent nozzle 19 that discharges IPA (liquid) toward the upper surface of the substrate W, and a gas nozzle 22 that discharges gas toward the upper surface of the substrate W. The solvent nozzle 19 is connected to a solvent pipe 20 in which a solvent valve 21 is sandwiched. IPA has a lower boiling point than water, higher volatility than water, and lower surface tension than water. The gas nozzle 22 is connected to a gas pipe 23 with a gas valve 24 interposed therebetween. A specific example of the gas discharged from the gas nozzle 22 is nitrogen. The gas may be an inert gas other than nitrogen, or a gas other than an inert gas.
溶劑噴嘴19係連接於使溶劑噴嘴19在處理位置與待 機位置之間移動的第四噴嘴移動機構25。氣體噴嘴22亦連接於第四噴嘴移動機構25。氣體噴嘴22亦可連接於與第四噴嘴移動機構25不同的第五噴嘴移動機構。第四噴嘴移動機構25係使溶劑噴嘴19及氣體噴嘴22在溶劑噴嘴19及氣體噴嘴22已鄰近於基板W之上表面的處理位置、與處理位置之上方的待機位置之間進行升降。第四噴嘴移動機構25亦可為使溶劑噴嘴19及氣體噴嘴22水平地移動的機構。 The solvent nozzle 19 is connected to a fourth nozzle moving mechanism 25 that moves the solvent nozzle 19 between the processing position and the standby position. The gas nozzle 22 is also connected to the fourth nozzle moving mechanism 25. The gas nozzle 22 may be connected to a fifth nozzle moving mechanism different from the fourth nozzle moving mechanism 25. The fourth nozzle moving mechanism 25 raises and lowers the solvent nozzle 19 and the gas nozzle 22 between a processing position where the solvent nozzle 19 and the gas nozzle 22 are adjacent to the upper surface of the substrate W and a standby position above the processing position. The fourth nozzle moving mechanism 25 may be a mechanism that moves the solvent nozzle 19 and the gas nozzle 22 horizontally.
杯體26係包含有：複數個防濺罩28，用以接住從基板W朝向外側排出的液體；以及複數個環狀承盤27，用以接住藉由防濺罩28朝向下方導引的液體。複數個防濺罩28係包圍旋轉夾盤31。防濺罩28係包含有：筒狀之傾斜部28a，係面向旋轉軸線A1而朝向斜上方延伸；以及圓筒狀之導引部28b，係從傾斜部28a之下端部(外端部)朝向下方延伸。傾斜部28a係包含有具有比基板W及旋轉基座33更大之內徑的圓環狀之上端28u。傾斜部28a之上端28u係相當於杯體26之上端。複數個導引部28b係分別配置於複數個環狀承盤27之上方。 The cup 26 includes: a plurality of splash guards 28 for receiving the liquid discharged from the substrate W to the outside; and a plurality of ring-shaped trays 27 for catching downward guidance through the splash guards 28. Liquid. The plurality of splash guards 28 surround the spin chuck 31. The splash guard 28 includes a cylindrical inclined portion 28a that extends obliquely upwardly facing the rotation axis A1, and a cylindrical guide portion 28b that faces from the lower end (outer end) of the inclined portion 28a. Extend below. The inclined portion 28 a includes an annular upper end 28 u having an inner diameter larger than that of the substrate W and the rotation base 33. The upper end 28 u of the inclined portion 28 a corresponds to the upper end of the cup body 26. The plurality of guide portions 28 b are respectively disposed above the plurality of annular receiving plates 27.
罩升降單元29係使防濺罩28在上位置與下位置之間朝向鉛直方向移動，該上位置係指傾斜部28a之上端28u位於比可供由複數個夾盤構件32所支撐的基板W配置的支撐位置更上方的位置，該下位置係指傾斜部28a之上端28u位於比支撐位置更下方的位置。在藥液或沖洗液等的液體供給至基板W時，防濺罩28係配置於上位置。從基 板W朝向外側飛散的液體係在藉由傾斜部28a接住之後，藉由導引部28b集中於環狀承盤27內。 The hood lifting unit 29 moves the splash guard 28 in a vertical direction between an upper position and a lower position. The upper position means that the upper end 28u of the inclined portion 28a is located higher than the substrate W which can be supported by the chuck members 32 The support position is arranged at an upper position, and the lower position refers to a position where the upper end 28u of the inclined portion 28a is positioned lower than the support position. When a liquid such as a chemical solution or a rinsing liquid is supplied to the substrate W, the splash guard 28 is disposed at an upper position. After the liquid system scattered from the substrate W to the outside is caught by the inclined portion 28a, it is concentrated in the annular receiving plate 27 by the guide portion 28b.
罩升降單元29係使複數個防濺罩28個別地升降。罩升降單元29係包含有：電動馬達；以及將電動馬達之旋轉轉換成鉛直方向之運動的滾珠螺桿(ball screw)及滾珠螺帽(ball nut)。罩升降單元29亦可為氣缸(air cylinder)。控制裝置3係藉由控制罩升降單元29來使依供給至基板W的液體之種類所選出的任一個防濺罩28與基板W之外周面相對向。 The cover raising / lowering unit 29 raises and lowers a some splash cover 28 individually. The hood lifting unit 29 includes: an electric motor; and a ball screw and a ball nut that convert the rotation of the electric motor into vertical motion. The hood lifting unit 29 may also be an air cylinder. The control device 3 controls the cover raising / lowering unit 29 so that any one of the splash guards 28 selected according to the type of liquid supplied to the substrate W faces the outer peripheral surface of the substrate W.
其次，針對旋轉夾盤31加以說明。 Next, the spin chuck 31 will be described.
圖2係顯示沿著圖3所示之II-II線的旋轉夾盤31之鉛直剖面的示意圖。圖3係旋轉夾盤31的示意俯視圖。圖4係顯示沿著圖2所示之IV-IV線的旋轉夾盤31之水平剖面的示意圖。圖5係顯示針對設置於旋轉夾盤31的夾盤開閉機構34加以說明用的鉛直剖面的示意圖。圖6A係顯示隨動部55及驅動部56隔出間隔朝向旋轉方向相互地相對向之狀態的示意俯視圖。圖6B係顯示隨動部55藉由驅動部56水平地按壓直至可動夾盤32a到達開啟位置為止之狀態的示意俯視圖。在圖4中係用黑色來塗滿驅動磁鐵68的露出部分。圖5及圖6A係顯示可動夾盤32a位於閉合位置的狀態。圖6B係顯示可動夾盤32a位於開啟位置的狀態。 FIG. 2 is a schematic view showing a vertical cross section of the rotating chuck 31 along a line II-II shown in FIG. 3. FIG. 3 is a schematic plan view of the rotary chuck 31. FIG. 4 is a schematic view showing a horizontal cross section of the rotating chuck 31 taken along the line IV-IV shown in FIG. 2. FIG. 5 is a schematic view showing a vertical cross-section for explaining the chuck opening and closing mechanism 34 provided on the rotary chuck 31. FIG. 6A is a schematic plan view showing a state where the follower portion 55 and the drive portion 56 face each other in the direction of rotation at intervals. FIG. 6B is a schematic plan view showing a state in which the follower portion 55 is horizontally pressed by the drive portion 56 until the movable chuck 32 a reaches the open position. In FIG. 4, the exposed portion of the driving magnet 68 is painted in black. 5 and 6A show a state where the movable chuck 32a is in the closed position. FIG. 6B shows a state where the movable chuck 32a is in the open position.
如圖2所示，旋轉夾盤31係包含有：圓板狀之旋轉基座33，係保持於水平；複數個夾盤構件32，係在旋轉基座 33之上方水平地夾持基板W；夾盤開閉機構34，用以使複數個夾盤構件32開閉；以及旋轉馬達36，係藉由使旋轉基座33及夾盤構件32繞著旋轉軸線A1旋轉來使由複數個夾盤構件32所夾持的基板W旋轉。旋轉基座33例如是具有比基板W之直徑更大之外徑的實心之圓板。 As shown in FIG. 2, the rotating chuck 31 includes: a circular plate-shaped rotating base 33 that is held horizontally; a plurality of chuck members 32 that horizontally hold the substrate W above the rotating base 33; The chuck opening and closing mechanism 34 is used to open and close the plurality of chuck members 32; and the rotary motor 36 is configured to rotate the rotation base 33 and the chuck member 32 about the rotation axis A1 to rotate the chuck members 32 The sandwiched substrate W is rotated. The rotation base 33 is, for example, a solid circular plate having an outer diameter larger than the diameter of the substrate W.
旋轉馬達36為包含有轉子(rotor)36b及定子(stator)36a的伺服馬達(servo motor)。轉子36b係透過從旋轉基座33朝向下方延伸的旋轉軸35連結於旋轉基座33。定子36a係包圍轉子36b。轉子36b及定子36a係配置於夾盤外殼(chuck housing)37內。旋轉馬達36及夾盤外殼37係配置於旋轉基座33之下方。夾盤外殼37係包含有：筒狀之下側筒狀部37a，係從腔室4之底部4a朝向上方延伸；環狀部37b，係從下側筒狀部37a之上端部朝向內側延伸；以及上側筒狀部37c，係從環狀部37b之內端朝向上方延伸。 The rotary motor 36 is a servo motor including a rotor 36b and a stator 36a. The rotor 36 b is connected to the rotation base 33 via a rotation shaft 35 extending downward from the rotation base 33. The stator 36a surrounds the rotor 36b. The rotor 36 b and the stator 36 a are arranged in a chuck housing 37. The rotation motor 36 and the chuck housing 37 are disposed below the rotation base 33. The chuck housing 37 includes: a cylindrical lower cylindrical portion 37a extending upward from the bottom 4a of the chamber 4; an annular portion 37b extending from the upper end of the lower cylindrical portion 37a toward the inside; And the upper cylindrical portion 37c extends upward from the inner end of the annular portion 37b.
夾盤構件32係從旋轉基座33之上表面朝向上方突出。如圖3所示，複數個夾盤構件32係隔出間隔地配置於旋轉軸線A1之周圍。複數個夾盤構件32係包含有：複數個可動夾盤32a，係能夠相對於後面所述的升降構件62移動；以及複數個固定夾盤32b，係固定於升降構件62。複數個可動夾盤32a係在其等之間不包夾固定夾盤32b地排列於圓周方向。可動夾盤32a係能夠在夾持部38a壓抵於基板W之外周面的閉合位置與夾持部38a從基板W之外周面離開的開啟位置之間，相對於旋轉基座33及升降構件62繞著鉛直之夾盤轉動軸線A2旋轉。 The chuck member 32 projects upward from the upper surface of the rotation base 33. As shown in FIG. 3, a plurality of chuck members 32 are arranged around the rotation axis A1 at intervals. The plurality of chuck members 32 include: a plurality of movable chucks 32 a that can be moved relative to a lifting member 62 described later; and a plurality of fixed chucks 32 b that are fixed to the lifting member 62. The plurality of movable chucks 32a are arranged in a circumferential direction without sandwiching the fixed chucks 32b therebetween. The movable chuck 32 a is capable of opposing the rotating base 33 and the lifting member 62 between the closed position where the clamping portion 38 a is pressed against the outer peripheral surface of the substrate W and the open position where the clamping portion 38 a is separated from the outer peripheral surface of the substrate W. Rotate around the vertical chuck rotation axis A2.
如圖5所示，可動夾盤32a係包含有：夾盤頭(chuck head)38，係接觸於基板W；以及基軸(base shaft)39，係從夾盤頭38朝向下方延伸。有關固定夾盤32b亦為同樣(參照圖7A)。夾盤頭38及基軸39既可為各別的構件，又可為一體的構件。夾盤頭38係包含有：支撐部38b，用以從下方支撐基板W；以及夾持部38a，係壓抵於基板W之外周部。夾持部38a係包含有形成朝向內側所開設的剖面V字狀之收容槽的二個槽內面。支撐部38b係包含有面向旋轉軸線A1而從夾持部38a朝向斜下方延伸的傾斜面。支撐部38b及夾持部38a係配置於旋轉基座33之上方。夾持部38a係配置於基板W之周圍。支撐部38b係配置於基板W之下方。 As shown in FIG. 5, the movable chuck 32 a includes a chuck head 38 that is in contact with the substrate W, and a base shaft 39 that extends downward from the chuck head 38. The same applies to the fixed chuck 32b (see FIG. 7A). The chuck head 38 and the base shaft 39 may be separate components or integrated components. The chuck head 38 includes a support portion 38b for supporting the substrate W from below, and a chuck portion 38a pressed against the outer peripheral portion of the substrate W. The clamping portion 38a includes two groove inner surfaces forming a V-shaped receiving groove formed inwardly in the cross section. The support portion 38b includes an inclined surface that faces the rotation axis A1 and extends obliquely downward from the clamping portion 38a. The support portion 38 b and the clamping portion 38 a are disposed above the rotation base 33. The clamping portion 38a is arranged around the substrate W. The support portion 38b is disposed below the substrate W.
基軸39係朝向上下方向延伸的圓柱狀。基軸39係插入於朝向上下方向貫通旋轉基座33的貫通部33p。往貫通部33p的液體之進入係能藉由包圍夾盤構件32的環狀密封41來防止。基軸39係透過已配置於貫通部33p內的滑動軸承42來支撐於旋轉基座33。可動夾盤32a及固定夾盤32b中之任一個的基軸39亦能夠相對於旋轉基座33朝向上下方向移動。固定夾盤32b的基軸39係固定於升降構件62。可動夾盤32a的基軸39係能夠相對於升降構件62而繞著夾盤轉動軸線A2旋轉。 The base shaft 39 has a cylindrical shape extending in the vertical direction. The base shaft 39 is inserted into a penetrating portion 33 p penetrating the rotary base 33 in the vertical direction. The ingress of liquid into the penetrating portion 33 p can be prevented by an annular seal 41 surrounding the chuck member 32. The base shaft 39 is supported by the rotation base 33 through a slide bearing 42 which is arranged in the through portion 33p. The base shaft 39 of either the movable chuck 32 a or the fixed chuck 32 b can also be moved in the up-down direction with respect to the rotation base 33. The base shaft 39 of the fixed chuck 32 b is fixed to the elevating member 62. The base shaft 39 of the movable chuck 32 a is rotatable about the chuck rotation axis A2 with respect to the lifting member 62.
可動夾盤32a的基軸39係插入於朝向上下方向貫通升降構件62的貫通部62p。可動夾盤32a的基軸39係從升降構件62朝向下方突出。可動夾盤32a的基軸39係透過已 配置於貫通部62p內的滾動軸承44來支撐於升降構件62。可動夾盤32a係能夠相對於升降構件62而繞著相當於夾盤轉動軸線A2的基軸39之中心線旋轉。使升降構件62朝向上下方向移動之力係能透過滾動軸承44傳遞至可動夾盤32a。可動夾盤32a係與升降構件62一起朝向上下方向移動。 The base shaft 39 of the movable chuck 32 a is inserted into a penetration portion 62 p that penetrates the elevating member 62 in the vertical direction. The base shaft 39 of the movable chuck 32 a projects downward from the lifting member 62. The base shaft 39 of the movable chuck 32a is supported by the elevating member 62 through a rolling bearing 44 disposed in the penetration portion 62p. The movable chuck 32 a is rotatable relative to the elevating member 62 about the center line of the base shaft 39 corresponding to the chuck rotation axis A2. The force for moving the elevating member 62 in the vertical direction is transmitted to the movable chuck 32 a through the rolling bearing 44. The movable chuck 32 a moves in the vertical direction together with the elevating member 62.
搬運機器人R1係在各個可動夾盤32a位於開啟位置的狀態下將手部H1上的基板W置放於各個夾盤構件32的支撐部38b之上方。在此狀態下，當夾盤開閉機構34使各個可動夾盤32a移動至閉合位置的方向時，就能一邊藉由複數個支撐部38b使基板W往上撐，一邊使複數個夾持部38a接近基板W之外周部。藉此，全部的夾盤構件32之支撐部38b會從基板W離開，且全部的夾盤構件32之夾持部38a會壓抵於基板W之外周部。在此狀態下，當夾盤開閉機構34使各個可動夾盤32a移動至開啟位置的方向時，全部的夾盤構件32之夾持部38a就會從基板W離開，且全部的夾盤構件32之支撐部38b會與基板W之外周部相接觸。 The transfer robot R1 places the substrate W on the hand H1 above the support portion 38b of each chuck member 32 with each movable chuck 32a in an open position. In this state, when the chuck opening / closing mechanism 34 moves each movable chuck 32a to the closed position, the substrate W can be supported by the plurality of supporting portions 38b while the plurality of clamping portions 38a are supported It is close to the outer periphery of the substrate W. Accordingly, the support portions 38 b of all the chuck members 32 are separated from the substrate W, and the clamping portions 38 a of all the chuck members 32 are pressed against the outer peripheral portion of the substrate W. In this state, when the chuck opening / closing mechanism 34 moves each movable chuck 32 a to the open position, the clamping portions 38 a of all the chuck members 32 are separated from the substrate W, and all of the chuck members 32 The supporting portion 38b is in contact with the outer peripheral portion of the substrate W.
如圖5所示，夾盤開閉機構34係包含有：開啟機構，用以使複數個可動夾盤32a移動至開啟位置的方向；以及閉合機構，用以使複數個可動夾盤32a移動至閉合位置的方向。開啟機構係包含有：隨動部55，係與可動夾盤32a一起繞著夾盤轉動軸線A2轉動；以及驅動部56，係藉由將隨動部55朝向圓周方向(繞著旋轉軸線A1的方向)按壓 來使可動夾盤32a移動至開啟位置的方向。閉合機構係包含有分別盤繞著於複數個可動夾盤32a的複數個線圈彈簧(coil spring)51。 As shown in FIG. 5, the chuck opening and closing mechanism 34 includes: an opening mechanism for moving a plurality of movable chucks 32 a to the open position; and a closing mechanism for moving the plurality of movable chucks 32 a to a closed position The direction of the location. The opening mechanism includes: a follower part 55 that rotates with the movable chuck 32a about the chuck rotation axis A2; and a drive part 56 that directs the follower part 55 toward the circumferential direction (about the rotation axis A1) (Direction) Press to move the movable chuck 32a to the open position. The closing mechanism includes a plurality of coil springs 51 each coiled around a plurality of movable chucks 32a.
線圈彈簧51係盤繞著於可動夾盤32a的基軸39。線圈彈簧51係配置於升降構件62之下方。線圈彈簧51係收容於已安裝於升降構件62的殼體(casing)52。線圈彈簧51的一端部係插入於已固定在升降構件62上的保持部53之插入孔。線圈彈簧51的另一端部係插入於在可動夾盤32a之外周面所開設的保持孔54。線圈彈簧51的一端部係能限制相對於升降構件62的移動。線圈彈簧51的另一端部係能限制相對於可動夾盤32a的移動。 The coil spring 51 is wound around the base shaft 39 of the movable chuck 32a. The coil spring 51 is disposed below the elevating member 62. The coil spring 51 is housed in a casing 52 that is attached to the elevating member 62. One end portion of the coil spring 51 is inserted into an insertion hole of a holding portion 53 fixed to the lifting member 62. The other end of the coil spring 51 is inserted into a holding hole 54 opened in the outer peripheral surface of the movable chuck 32a. One end portion of the coil spring 51 can restrict movement with respect to the lifting member 62. The other end portion of the coil spring 51 can restrict movement with respect to the movable chuck 32a.
線圈彈簧51係將可動夾盤32a保持於原點位置。圖5係顯示可動夾盤32a位於閉合位置的狀態。原點位置、開啟位置及閉合位置係指繞著夾盤轉動軸線A2之旋轉角不同的各別之位置。閉合位置係就可動夾盤32a之旋轉方向而言為原點位置及開啟位置之間的位置。當使可動夾盤32a從原點位置轉動至開啟位置時，線圈彈簧51就會彈性變形且產生使可動夾盤32a返回至原點位置的復原力。藉此，能產生使可動夾盤32a移動至閉合位置的方向之力。 The coil spring 51 holds the movable chuck 32a at the origin position. FIG. 5 shows a state where the movable chuck 32a is in the closed position. The origin position, the open position, and the closed position refer to different positions with different rotation angles around the rotation axis A2 of the chuck. The closed position is a position between the origin position and the open position in terms of the rotation direction of the movable chuck 32a. When the movable chuck 32a is rotated from the original position to the open position, the coil spring 51 is elastically deformed and a restoring force is generated to return the movable chuck 32a to the original position. Thereby, a force can be generated in a direction to move the movable chuck 32 a to the closed position.
如圖2所示，旋轉夾盤31係包含有：間隔變更機構61，係藉由使複數個夾盤構件32相對於旋轉基座33進行升降來變更由複數個夾盤構件32所夾持的基板W與後面所述的發熱構件72之上下方向的間隔。間隔變更機構61係包含有：升降構件62，用以支撐複數個夾盤構件32；複 數個導引構件64，用以將升降構件62朝向上下方向導引；以及升降驅動單元66，用以產生使升降構件62朝向上下方向移動的動力。 As shown in FIG. 2, the rotating chuck 31 includes an interval changing mechanism 61 that changes the number of chucks held by the plurality of chuck members 32 by raising and lowering the plurality of chuck members 32 relative to the rotation base 33. The distance between the substrate W and the heat generating member 72 described later in the up-down direction. The interval changing mechanism 61 includes: a lifting member 62 for supporting a plurality of chuck members 32; a plurality of guide members 64 for guiding the lifting member 62 in an up-down direction; and a lifting driving unit 66 for generating Power for moving the elevating member 62 in the vertical direction.
升降構件62係包圍旋轉軸線A1的圓環狀。升降構件62係包圍夾盤外殼37。升降構件62係配置於旋轉基座33之下方。升降構件62係由固定於旋轉基座33的筒狀之裙部(skirt)63所包圍。升降構件62係配置於夾盤外殼的環狀部37b之上方。複數個夾盤構件32係從升降構件62之上表面朝向上方突出。當升降構件62朝向上下方向移動時，全部的夾盤構件32就會與升降構件62一起朝向上下方向移動。 The elevating member 62 has a ring shape surrounding the rotation axis A1. The lifting member 62 surrounds the chuck housing 37. The elevating member 62 is disposed below the rotation base 33. The elevating member 62 is surrounded by a cylindrical skirt 63 fixed to the rotation base 33. The elevating member 62 is arranged above the annular portion 37b of the chuck housing. The plurality of chuck members 32 protrude upward from the upper surface of the elevating member 62. When the lifting member 62 moves in the vertical direction, all the chuck members 32 move in the vertical direction together with the lifting member 62.
如圖4所示，複數個導引構件64係隔出間隔地排列於圓周方向。導引構件64係包含有：導引軸(guide shaft)64a，係朝向上下方向延伸；以及導引止動件(guide stopper)64b，係在俯視觀察下比導引軸64a更大。導引軸64a係插入於朝向上下方向貫通升降構件62的貫通孔65。導引止動件64b係配置於升降構件62之下方。導引止動件64b係在俯視觀察下比升降構件62的貫通孔65更大。 As shown in FIG. 4, the plurality of guide members 64 are arranged at intervals in the circumferential direction. The guide member 64 includes a guide shaft 64a that extends upward and downward, and a guide stopper 64b that is larger than the guide shaft 64a in a plan view. The guide shaft 64 a is inserted into a through hole 65 that penetrates the elevating member 62 in the vertical direction. The guide stopper 64 b is disposed below the elevating member 62. The guide stopper 64 b is larger than the through hole 65 of the elevating member 62 in a plan view.
如圖2所示，導引軸64a係從旋轉基座33朝向下方延伸。導引軸64a係固定於旋轉基座33。導引止動件64b係固定於導引軸64a。升降構件62係配置於旋轉基座33與導引止動件64b之間。升降構件62係能夠在下位置與上位置之間相對於旋轉基座33朝向上下方向移動，該下位置係指升降構件62之下表面與導引止動件64b相接觸的位置，該 上位置係指升降構件62從導引止動件64b朝向上方離開的位置。 As shown in FIG. 2, the guide shaft 64 a extends downward from the rotation base 33. The guide shaft 64 a is fixed to the rotation base 33. The guide stopper 64b is fixed to the guide shaft 64a. The elevating member 62 is disposed between the rotation base 33 and the guide stopper 64b. The lifting member 62 is capable of moving up and down with respect to the rotation base 33 between a lower position and an upper position. The lower position refers to a position where the lower surface of the lifting member 62 contacts the guide stopper 64b. The upper position is The finger raising and lowering member 62 is a position separated upward from the guide stopper 64b.
升降驅動單元66，例如是利用磁力來使升降構件62升降的磁力產生單元。磁力產生單元係包含有：隨動磁鐵67，係固定於升降構件62；驅動磁鐵68，係藉由使隨動磁鐵67上升來使升降構件62上升；以及升降致動器69，係藉由使驅動磁鐵68朝向上下方向移動來變更作用於隨動磁鐵67與驅動磁鐵68之間的磁力之強度。 The elevating driving unit 66 is, for example, a magnetic force generating unit that elevates the elevating member 62 using magnetic force. The magnetic force generating unit includes: a follower magnet 67 that is fixed to the lifting member 62; a driving magnet 68 that raises the lifting member 62 by raising the follower magnet 67; and a lifting actuator 69 that causes The driving magnet 68 moves in the up-and-down direction to change the strength of the magnetic force acting between the following magnet 67 and the driving magnet 68.
隨動磁鐵67係固定於升降構件62。隨動磁鐵67係與升降構件62一起朝向上下方向移動。隨動磁鐵67係配置於夾盤外殼37之外側。驅動磁鐵68及升降致動器69係配置於夾盤外殼37之中。驅動磁鐵68係藉由夾盤外殼37從隨動磁鐵67隔開。 The follower magnet 67 is fixed to the elevating member 62. The follower magnet 67 moves in the vertical direction together with the elevating member 62. The follower magnet 67 is disposed outside the chuck housing 37. The driving magnet 68 and the lifting actuator 69 are disposed in the chuck housing 37. The drive magnet 68 is separated from the follower magnet 67 by the chuck housing 37.
驅動磁鐵68係配置於比旋轉馬達36更外側。驅動磁鐵68係配置於比隨動磁鐵67更下方。驅動磁鐵68係透過夾盤外殼37朝向上下方向與隨動磁鐵67相對向。驅動磁鐵68係在俯視觀察下重疊於隨動磁鐵67之至少一部分。驅動磁鐵68亦可在俯視觀察下不重疊於隨動磁鐵67。 The driving magnet 68 is disposed outside the rotary motor 36. The drive magnet 68 is disposed below the follower magnet 67. The drive magnet 68 faces the follower magnet 67 through the chuck housing 37 in the vertical direction. The driving magnet 68 overlaps at least a part of the follower magnet 67 in a plan view. The drive magnet 68 may not overlap the follower magnet 67 in a plan view.
如圖4所示，隨動磁鐵67及驅動磁鐵68都是沿著包圍旋轉軸線A1的圓所配置。隨動磁鐵67係在俯視觀察下為圓弧狀。驅動磁鐵68係在俯視觀察下為環狀。驅動磁鐵68既可為連續及於全周的環，又可包含有配置於包圍旋轉軸線A1之圓周上的複數個磁鐵。 As shown in FIG. 4, the follower magnet 67 and the drive magnet 68 are both arranged along a circle surrounding the rotation axis A1. The follower magnet 67 has an arc shape in a plan view. The driving magnet 68 is annular in a plan view. The driving magnet 68 may be a continuous ring over the entire circumference, or may include a plurality of magnets arranged on a circumference surrounding the rotation axis A1.
如圖2所示，升降致動器69為氣缸。升降致動器69 亦可具備電動馬達、以及將電動馬達之旋轉轉換成往上下方向的驅動磁鐵68之移動的滾珠螺桿及滾珠螺帽，來取代氣缸。升降致動器69係包含有：桿(rod)，係朝向氣缸之軸向延伸；活塞(piston)，係連結於桿；以及筒狀之缸管(cylinder tube)，用以包圍桿及活塞。驅動磁鐵68係連結於氣缸的桿。驅動磁鐵68係與氣缸的桿一起朝向上下方向移動。 As shown in FIG. 2, the lift actuator 69 is a cylinder. Instead of the air cylinder, the lift actuator 69 may include an electric motor and a ball screw and a ball nut that convert the rotation of the electric motor into a movement of the driving magnet 68 in the vertical direction. The lifting actuator 69 includes a rod extending axially toward the cylinder, a piston connected to the rod, and a cylindrical cylinder tube surrounding the rod and the piston. The driving magnet 68 is a rod connected to the cylinder. The driving magnet 68 moves in the vertical direction together with the rod of the air cylinder.
升降致動器69係在上位置(圖2中之二點鏈線所示的位置)與下位置(圖2中之實線所示的位置)之間使驅動磁鐵68朝向上下方向移動。當驅動磁鐵68上升至上位置的方向時，隨動磁鐵67就藉由作用於隨動磁鐵67與驅動磁鐵68之間的磁力(反作用力)往上撐。伴之，升降構件62會上升。當驅動磁鐵68到達上位置時，升降構件62就會配置於上位置。當驅動磁鐵68從上位置下降至下位置時，各個導引構件64的導引止動件64b就會接觸於升降構件62，而升降構件62會配置於下位置。 The lift actuator 69 moves the drive magnet 68 in the vertical direction between an upper position (the position shown by the two-point chain line in FIG. 2) and a lower position (the position shown by the solid line in FIG. 2). When the drive magnet 68 rises to the upper position, the follower magnet 67 is supported upward by a magnetic force (reaction force) acting between the follower magnet 67 and the drive magnet 68. As a result, the lifting member 62 is raised. When the driving magnet 68 reaches the upper position, the elevating member 62 is disposed in the upper position. When the driving magnet 68 is lowered from the upper position to the lower position, the guide stopper 64b of each guide member 64 contacts the lifting member 62, and the lifting member 62 is disposed in the lower position.
全部的夾盤構件32係伴隨升降構件62之升降而在上位置與下位置之間移動。後面所述的發熱構件72係配置於由複數個夾盤構件32之支撐部38b所支撐的基板W之下方。夾盤構件32之上位置係指基板W及發熱構件72相互地離開的退避位置。夾盤構件32之下位置係指基板W及發熱構件72相互地鄰近的鄰近位置。 All the chuck members 32 are moved between the upper position and the lower position as the lifting member 62 is raised and lowered. The heat generating member 72 described later is disposed below the substrate W supported by the support portions 38 b of the plurality of chuck members 32. The position above the chuck member 32 refers to a retreated position where the substrate W and the heat generating member 72 are separated from each other. The position below the chuck member 32 refers to an adjacent position where the substrate W and the heat generating member 72 are adjacent to each other.
在複數個夾盤構件32位於與鄰近位置對應的下位置時，距離D1(參照圖8A)係比從基板W之下方支撐基板W 的搬運機器人R1的手部H1之厚度T1更小，該距離D1係指從發熱構件72之上表面至由複數個夾盤構件32所夾持的基板W之下表面為止的距離。該距離D1，例如是0.1mm至10mm。為此，此時的搬運機器人R1係無法將基板W置放於複數個夾盤構件32之上，或從複數個夾盤構件32取出基板W。 When the plurality of chuck members 32 are located at the lower positions corresponding to the adjacent positions, the distance D1 (refer to FIG. 8A) is smaller than the thickness T1 of the hand H1 of the transfer robot R1 that supports the substrate W from below the substrate W, and the distance is smaller. D1 is a distance from the upper surface of the heat generating member 72 to the lower surface of the substrate W held by the plurality of chuck members 32. The distance D1 is, for example, 0.1 mm to 10 mm. For this reason, the transfer robot R1 at this time cannot place the substrate W on the plurality of chuck members 32 or take out the substrate W from the plurality of chuck members 32.
如前述般，夾盤開閉機構34係包含有：隨動部55，係與可動夾盤32a一起繞著夾盤轉動軸線A2轉動；以及驅動部56，係藉由將隨動部55朝向圓周方向按壓來使可動夾盤32a移動至開啟位置的方向。如圖3所示，隨動部55係依每一可動夾盤32a所設置。驅動部56係依每一隨動部55所設置。圖3係顯示三個隨動部55分別設置於三個可動夾盤32a，三個驅動部56分別朝向旋轉方向與三個隨動部55相對向之例。 As described above, the chuck opening / closing mechanism 34 includes: a follower portion 55 that rotates about the chuck rotation axis A2 together with the movable chuck 32a; and a driving portion 56 that directs the follower portion 55 in a circumferential direction. Press to move the movable chuck 32a to the open position. As shown in FIG. 3, the follower portion 55 is provided for each movable chuck 32a. The driving section 56 is provided for each follower section 55. FIG. 3 shows an example in which the three follower sections 55 are respectively provided on the three movable chucks 32 a, and the three drive sections 56 face the rotation directions and oppose the three follower sections 55 respectively.
如圖5所示，隨動部55係固定於夾盤構件32。隨動部55係與夾盤構件32一起繞著夾盤轉動軸線A2轉動。隨動部55係從夾盤構件32朝向外側延伸。隨動部55係配置於旋轉基座33之上方。隨動部55係從旋轉基座33之上表面朝向上方離開。隨動部55之外端55o係配置於比旋轉基座33之外周面更內側。隨動部55之外端55o係配置於比驅動部56之內端56i更外側。 As shown in FIG. 5, the follower portion 55 is fixed to the chuck member 32. The follower 55 rotates with the chuck member 32 about the chuck rotation axis A2. The follower 55 extends outward from the chuck member 32. The follower 55 is disposed above the rotation base 33. The follower 55 is spaced upward from the upper surface of the rotation base 33. The outer end 55o of the follower part 55 is arrange | positioned inside more than the outer peripheral surface of the rotation base 33. The outer end 55o of the follower portion 55 is disposed more outward than the inner end 56i of the driving portion 56.
驅動部56係固定於最上方的防濺罩28A。驅動部56係與防濺罩28A一起朝向鉛直方向移動。驅動部56係從防濺罩28A朝向內側延伸。驅動部56係包含有：縱向部 56a，係從防濺罩28A朝向上方延伸；以及橫向部56b，係從縱向部56a之上端部朝向內側延伸。橫向部56b係位於比防濺罩28A之上端28u更上方。橫向部56b之內端係相當於驅動部56之內端56i。驅動部56之內端56i係配置於比防濺罩28A之上端28u更內側的位置，且配置於比夾盤構件32之外端更外側的位置。 The driving portion 56 is fixed to the uppermost splash guard 28A. The drive unit 56 moves in the vertical direction together with the splash guard 28A. The driving portion 56 extends inward from the splash guard 28A. The driving portion 56 includes a longitudinal portion 56a extending upward from the splash cover 28A, and a lateral portion 56b extending from the upper end portion of the longitudinal portion 56a toward the inside. The lateral portion 56b is located above the upper end 28u of the splash guard 28A. The inner end of the lateral portion 56b corresponds to the inner end 56i of the driving portion 56. The inner end 56i of the driving portion 56 is disposed at an inner position than the upper end 28u of the splash cover 28A, and is disposed at an outer position than the outer end of the chuck member 32.
如圖6A所示，在旋轉基座33之旋轉角為準備角度時，隨動部55及驅動部56係在俯視觀察下不相互地重疊。此時，隨動部55及驅動部56係在俯視觀察下隔出間隔朝向旋轉方向相互地相對向。罩升降單元29係在驅動部56未接觸於旋轉基座33的範圍內使防濺罩28A升降。當防濺罩28A配置於遞送位置時，隨動部55及驅動部56就會互為水平地於旋轉方向相對向，該遞送位置係指驅動部56之至少一部分配置於與隨動部55相等之高度的位置。在此狀態下，當旋轉馬達36使旋轉基座33旋轉時，就如圖6B所示，隨動部55會與可動夾盤32a一起繞著旋轉軸線A1旋轉，而隨動部55會接觸於驅動部56。藉此，隨動部55會水平地按壓於驅動部56。 As shown in FIG. 6A, when the rotation angle of the rotation base 33 is a preparation angle, the follower portion 55 and the driving portion 56 do not overlap each other in a plan view. At this time, the follower portion 55 and the drive portion 56 are opposed to each other in the direction of rotation with a separation interval in a plan view. The cover raising and lowering unit 29 raises and lowers the splash guard 28A in a range where the driving portion 56 does not contact the rotation base 33. When the splash guard 28A is disposed at the delivery position, the follower portion 55 and the drive portion 56 face each other horizontally and in the rotation direction, and the delivery position means that at least a part of the drive portion 56 is disposed at the same level as the follower portion 55 Its height. In this state, when the rotation motor 36 rotates the rotation base 33, as shown in FIG. 6B, the follower 55 and the movable chuck 32a rotate about the rotation axis A1, and the follower 55 contacts Driving section 56. As a result, the follower 55 is pressed horizontally against the drive 56.
其次，針對在旋轉夾盤31與搬運機器人R1之間的基板W之遞送加以說明。 Next, the transfer of the substrate W between the spin chuck 31 and the transfer robot R1 will be described.
圖7A至圖7B係針對在旋轉夾盤31與搬運機器人R1之間的基板W之遞送加以說明用的示意圖。以下的各個工序係藉由控制裝置3控制基板處理裝置1來執行。換言之，控制裝置3係以執行以下之各個工序的方式所編程。 7A to 7B are schematic diagrams for explaining the delivery of the substrate W between the spin chuck 31 and the transfer robot R1. Each of the following steps is executed by the control device 3 controlling the substrate processing apparatus 1. In other words, the control device 3 is programmed to execute the following steps.
在搬運機器人R1將基板W置放於複數個夾盤構件32之上時，旋轉馬達36係使旋轉基座33旋轉直至旋轉基座33之旋轉角一致於準備角度的準備位置為止。準備位置係指隨動部55及驅動部56在俯視觀察下不重疊的位置。升降致動器69係在旋轉基座33位於準備位置的狀態下，使複數個夾盤構件32上升至作為遞送位置的上位置為止。更且，罩升降單元29係使最上方的防濺罩28A上升至遞送位置為止。 When the transfer robot R1 places the substrate W on the plurality of chuck members 32, the rotation motor 36 rotates the rotation base 33 until the rotation angle of the rotation base 33 coincides with the preparation position at the preparation angle. The preparation position refers to a position where the follower portion 55 and the drive portion 56 do not overlap in a plan view. The lift actuator 69 raises the plurality of chuck members 32 to the upper position which is the delivery position in a state where the rotation base 33 is in the ready position. Furthermore, the cover raising and lowering unit 29 raises the uppermost splash guard 28A to the delivery position.
防濺罩28A之遞送位置係指驅動部56之至少一部分配置於與隨動部55相等之高度的高度。從而，當防濺罩28A配置於遞送位置時，就如圖6A所示，驅動部56會相對於隨動部55隔出間隔而水平地於旋轉方向相對向。又，此時的防濺罩28A之上端28u係位於可供由複數個夾盤構件32之支撐部38b所支撐的基板W配置的支撐位置更下方。為此，在搬運機器人R1將基板W置放於複數個夾盤構件32的支撐部38b，或取出由複數個支撐部38b所支撐的基板W時，搬運機器人R1的手部H1不會接觸於防濺罩28A。 The delivery position of the splash guard 28A means that at least a part of the driving portion 56 is disposed at a height equal to the height of the follower portion 55. Therefore, when the splash guard 28A is disposed at the delivery position, as shown in FIG. 6A, the driving portion 56 is opposed to the follower portion 55 horizontally and oppositely in the rotation direction. The upper end 28u of the splash guard 28A at this time is further below the support position where the substrate W supported by the support portions 38b of the plurality of chuck members 32 can be arranged. For this reason, when the transfer robot R1 places the substrate W on the support portions 38b of the plurality of chuck members 32, or takes out the substrate W supported by the plurality of support portions 38b, the hand H1 of the transfer robot R1 does not touch Splash guard 28A.
在防濺罩28A已配置於遞送位置之後，旋轉馬達36係使位於準備位置的旋轉基座33旋轉至解除位置為止。換句話說，旋轉馬達36係使旋轉基座33之旋轉角從準備角度變化至解除角度。如圖6B所示，在旋轉基座33朝向解除位置旋轉的過程中，驅動部56會接觸於隨動部55，而隨動部55會藉由驅動部56朝向旋轉方向按壓。伴之，線 圈彈簧51會彈性變形而可動夾盤32a會繞著夾盤轉動軸線A2轉動至開啟位置的方向。當旋轉基座33配置於解除位置時，全部的可動夾盤32a就配置於開啟位置。 After the splash guard 28A has been placed in the delivery position, the rotation motor 36 rotates the rotation base 33 in the preparation position to the release position. In other words, the rotation motor 36 changes the rotation angle of the rotation base 33 from the preparation angle to the release angle. As shown in FIG. 6B, during the rotation of the rotation base 33 toward the release position, the driving portion 56 contacts the follower portion 55, and the follower portion 55 is pressed by the drive portion 56 in the rotation direction. Accompanying this, the coil spring 51 is elastically deformed and the movable chuck 32a is rotated in the direction of the chuck rotation axis A2 to the open position. When the rotation base 33 is disposed in the release position, all the movable chucks 32a are disposed in the open position.
如圖7A所示，搬運機器人R1係在旋轉基座33位於解除位置的狀態下使手部H1移動至由手部H1所支撐的基板W位於發熱構件72之上方的上位置。之後，搬運機器人R1係使手部H1下降至手部H1未接觸於發熱構件72及防濺罩28A的下位置為止。如圖7B所示，在手部H1從上位置下降至下位置的過程中，基板W係置放於複數個夾盤構件32的支撐部38b之上且從手部H1離開。之後，搬運機器人R1係使手部H1從基板W與發熱構件72之間退避開。 As shown in FIG. 7A, the transfer robot R1 moves the hand H1 to an upper position where the substrate W supported by the hand H1 is above the heat generating member 72 in a state where the rotation base 33 is in the released position. Thereafter, the transfer robot R1 lowers the hand H1 until the hand H1 does not contact the lower position of the heat generating member 72 and the splash guard 28A. As shown in FIG. 7B, during the process of lowering the hand H1 from the upper position to the lower position, the substrate W is placed on the support portions 38 b of the plurality of chuck members 32 and separated from the hand H1. Thereafter, the transfer robot R1 retracts the hand H1 from between the substrate W and the heat generating member 72.
旋轉馬達36係在搬運機器人R1的手部H1已從基板W之下方退避開之後，使旋轉馬達36從解除位置旋轉至準備位置為止。藉此，隨動部55及驅動部56會相互地離開。伴之，可動夾盤32a係利用線圈彈簧51的復原力移動至原點位置的方向。由於基板W係由複數個支撐部38b所支撐，所以可動夾盤32a並不會到達原點位置，而是在作為原點位置之前方位置的閉合位置停止。藉此，可動夾盤32a的夾持部38a能利用線圈彈簧51的復原力壓抵於基板W之外周部。伴之，固定夾盤32b的夾持部38a亦能壓抵於基板W之外周部。藉此，基板W能由複數個夾盤構件32所夾持。 The rotation motor 36 rotates the rotation motor 36 from the release position to the preparation position after the hand H1 of the transfer robot R1 has withdrawn from below the substrate W. Thereby, the follower part 55 and the drive part 56 are mutually separated. Accompanying this, the movable chuck 32 a is moved in a direction to the origin position by the restoring force of the coil spring 51. Since the substrate W is supported by the plurality of support portions 38b, the movable chuck 32a does not reach the origin position, but stops at a closed position that is located in front of the origin position. Thereby, the clamping portion 38 a of the movable chuck 32 a can be pressed against the outer peripheral portion of the substrate W by the restoring force of the coil spring 51. Accordingly, the clamping portion 38a of the fixed chuck 32b can also be pressed against the outer peripheral portion of the substrate W. Thereby, the substrate W can be held by the plurality of chuck members 32.
在搬運機器人R1從複數個夾盤構件32取出基板W時， 旋轉馬達36會使旋轉基座33位於準備位置，而升降致動器69會使複數個夾盤構件32位於上位置。更且，罩升降單元29會使最上方的防濺罩28A位於遞送位置。在此狀態下，旋轉馬達36會使旋轉基座33從準備位置旋轉至解除位置。藉此，全部的夾盤構件32之夾持部38a會從基板W之外周部離開，而全部的夾盤構件32之支撐部38b會與基板W之外周部相接觸。 When the transfer robot R1 takes out the substrate W from the plurality of chuck members 32, the rotation motor 36 causes the rotation base 33 to be in a prepared position, and the lift actuator 69 causes the plurality of chuck members 32 to be in an upper position. Furthermore, the cover lifting unit 29 places the uppermost splash guard 28A in the delivery position. In this state, the rotation motor 36 rotates the rotation base 33 from the preparation position to the release position. Thereby, the clamping portions 38 a of all the chuck members 32 are separated from the outer peripheral portion of the substrate W, and the support portions 38 b of all the chuck members 32 are in contact with the outer peripheral portion of the substrate W.
搬運機器人R1係在基板W由複數個夾盤構件32之支撐部38b所支撐的狀態下，將手部H1插入於基板W與發熱構件72之間。之後，搬運機器人R1係使手部H1朝向上方移動。基板W係在手部H1朝向上方移動時從全部的夾盤構件32之支撐部38b離開且由手部H1所支撐。之後，旋轉馬達36係使旋轉基座33旋轉且使隨動部55及驅動部56相互地背離。為此，可動夾盤32a係能利用線圈彈簧51的復原力返回至原點位置。 The conveyance robot R1 inserts the hand H1 between the substrate W and the heating member 72 in a state where the substrate W is supported by the support portions 38 b of the plurality of chuck members 32. Thereafter, the transfer robot R1 moves the hand H1 upward. The substrate W is separated from the support portions 38 b of all the chuck members 32 when the hand H1 moves upward, and is supported by the hand H1. Thereafter, the rotation motor 36 rotates the rotation base 33 and separates the follower 55 and the drive 56 from each other. For this reason, the movable chuck 32 a can return to the original position by the restoring force of the coil spring 51.
其次，針對從下方加熱基板W的IH加熱機構71加以說明。 Next, the IH heating mechanism 71 that heats the substrate W from below will be described.
圖8A係顯示針對設置於旋轉夾盤31的IH加熱機構71加以說明用的鉛直剖面之示意圖。圖8B係針對加熱線圈73之配置加以說明用的示意俯視圖。在圖8A至圖8B中係省略了隨動部55及驅動部56的圖示。 FIG. 8A is a schematic view showing a vertical cross section for explaining the IH heating mechanism 71 provided on the rotary chuck 31. FIG. 8B is a schematic plan view for explaining the arrangement of the heating coil 73. The illustration of the follower 55 and the drive 56 is omitted in FIGS. 8A to 8B.
如圖8A所示，旋轉夾盤31係包含有：IH加熱機構71，用以加熱由複數個夾盤構件32所保持的基板W。IH加熱機構71係包含有：發熱構件72，用以加熱基板W； 加熱線圈73，係供給有電力；以及IH電路74，係藉由對加熱線圈73供給電力來產生施加於發熱構件72的交變磁場以使發熱構件72發熱。IH加熱機構71係更包含有：磁屏蔽構件77，用以保護發熱構件72以外的構件不受交變磁場影響；以及支撐構件78，用以支撐加熱線圈73。 As shown in FIG. 8A, the rotating chuck 31 includes an IH heating mechanism 71 for heating the substrate W held by the plurality of chuck members 32. The IH heating mechanism 71 includes: a heating element 72 for heating the substrate W; a heating coil 73 for supplying electric power; and an IH circuit 74 for supplying power to the heating coil 73 to generate an interaction applied to the heating element 72. The magnetic field is changed to generate heat from the heat generating member 72. The IH heating mechanism 71 further includes a magnetic shielding member 77 to protect components other than the heating member 72 from an alternating magnetic field, and a support member 78 to support the heating coil 73.
發熱構件72係指伴隨起因於交變磁場的渦電流之產生而產生焦耳熱的導體。發熱構件72亦被稱為加熱台(susceptor)。發熱構件72之至少表面係由具有耐藥品性的材料所形成。同樣地，旋轉基座33之至少表面係由具有耐藥品性的材料所形成。亦即，與藥液相接觸之全部的部分係由具有耐藥品性的材料所形成。此針對夾盤構件32等之發熱構件72及旋轉基座33以外的構件而言亦為同樣。 The heat generating member 72 is a conductor that generates Joule heat with the generation of an eddy current caused by an alternating magnetic field. The heat generating member 72 is also called a susceptor. At least the surface of the heat generating member 72 is formed of a material having chemical resistance. Similarly, at least the surface of the rotation base 33 is formed of a material having chemical resistance. That is, all the parts in contact with the drug liquid phase are formed of a material having chemical resistance. The same applies to members other than the heat generating member 72 such as the chuck member 32 and the rotation base 33.
發熱構件72既可為一體化後的複數個構件，又可為單一的一體構件。例如，發熱構件72既可包含有碳製的芯材和覆蓋芯材之表面的碳化矽(SiC)製的塗布層，又可由玻璃狀碳(Glassy carbon)所形成。發熱構件72亦可由金屬等之此等以外的材料所形成。又，為了防止交變磁場之影響及於基板W之表面上所形成的元件(device)，亦可用屏蔽磁場的鐵等之軟磁性材料來形成發熱構件72之至少一部分。 The heat generating component 72 may be a plurality of integrated components or a single integrated component. For example, the heat generating member 72 may include a carbon core material and a coating layer made of silicon carbide (SiC) covering the surface of the core material, or may be formed of glassy carbon. The heat generating member 72 may be formed of a material other than these, such as metal. In addition, in order to prevent the influence of an alternating magnetic field and a device formed on the surface of the substrate W, at least a part of the heat generating member 72 may be formed of a soft magnetic material such as iron that shields the magnetic field.
發熱構件72係包含有配置於基板W與旋轉基座33之間的板狀部72a。板狀部72a例如是包圍旋轉軸線A1的圓環狀。板狀部72a之厚度(上下方向之長度)係比旋轉基座33之厚度T3更小。板狀部72a之上表面及下表面係與基 板W之上表面及下表面平行。板狀部72a之下表面係透過空間平行地與旋轉基座33之上表面相對向。從旋轉基座33之上表面至板狀部72a之下表面為止的距離，既可與從板狀部72a之上表面至基板W之下表面為止的距離D1相等，又可比該距離D1更長或更短。 The heat generating member 72 includes a plate-like portion 72 a disposed between the substrate W and the rotation base 33. The plate-like portion 72a has, for example, a ring shape surrounding the rotation axis A1. The thickness (length in the vertical direction) of the plate-like portion 72a is smaller than the thickness T3 of the rotation base 33. The upper and lower surfaces of the plate-like portion 72a are parallel to the upper and lower surfaces of the base plate W. The lower surface of the plate-like portion 72a is opposed to the upper surface of the rotation base 33 in parallel through the space. The distance from the upper surface of the rotation base 33 to the lower surface of the plate-shaped portion 72a may be equal to the distance D1 from the upper surface of the plate-shaped portion 72a to the lower surface of the substrate W, or may be longer than the distance D1. Or shorter.
在複數個夾盤構件32夾持著基板W且位於下位置時，板狀部72a之上表面係鄰近於基板W之下表面。此時，從板狀部72a之上表面至基板W之下表面為止之上下方向的距離D1係比搬運機器人R1的手部H1之厚度T1更短。另一方面，在複數個夾盤構件32夾持著基板W且位於上位置時，從板狀部72a之上表面至基板W之下表面為止之上下方向的距離D1係比搬運機器人R1的手部H1之厚度T1更長。從而，只要是在複數個夾盤構件32位於上位置時，搬運機器人R1就可以將基板W置放於複數個夾盤構件32，或從複數個夾盤構件32取出基板W。 When the substrate W is sandwiched between the plurality of chuck members 32, the upper surface of the plate-like portion 72 a is adjacent to the lower surface of the substrate W. At this time, the distance D1 in the up-down direction from the upper surface of the plate-like portion 72a to the lower surface of the substrate W is shorter than the thickness T1 of the hand H1 of the transfer robot R1. On the other hand, when the plurality of chuck members 32 are positioned at the upper position while holding the substrate W, the distance D1 from the upper surface of the plate-like portion 72a to the lower surface of the substrate W is lower than the hand of the transport robot R1. The thickness T1 of the portion H1 is longer. Therefore, as long as the chuck members 32 are at the upper position, the transfer robot R1 can place the substrate W on the chuck members 32 or take out the substrate W from the chuck members 32.
發熱構件72係包含有從板狀部72a朝向下方延伸的複數個腳部72b。腳部72b亦可為旋轉基座33的一部分。亦即，旋轉基座33亦可包含有：圓板部，係具有比基板W之直徑更大的外徑；以及複數個腳部72b，係從圓板部之水平的上表面朝向上方延伸。腳部72b係從板狀部72a之下表面延伸至旋轉基座33之上表面。板狀部72a係藉由複數個腳部72b所支撐。發熱構件72係固定於旋轉基座33。發熱構件72係與旋轉基座33一起繞著旋轉軸線A1旋轉。 The heat generating member 72 includes a plurality of leg portions 72b extending downward from the plate-like portion 72a. The leg portion 72 b may be a part of the rotation base 33. That is, the rotating base 33 may include a circular plate portion having an outer diameter larger than the diameter of the substrate W, and a plurality of leg portions 72b extending upward from the horizontal upper surface of the circular plate portion. The leg portion 72 b extends from the lower surface of the plate-shaped portion 72 a to the upper surface of the rotation base 33. The plate-shaped portion 72a is supported by a plurality of leg portions 72b. The heat generating member 72 is fixed to the rotation base 33. The heat generating member 72 rotates together with the rotation base 33 about the rotation axis A1.
如圖3所示，複數個夾盤構件32係分別插入於發熱構 件72之複數個貫通部72p。貫通部72p係朝向上下方向貫通發熱構件72之外周部。貫通部72p既可為在板狀部72a之外周面所開設的缺口，又可為全周已封閉的貫通孔。板狀部72a之外周面係位於比夾盤構件32之內端更外側。板狀部72a之外徑，換句話說發熱構件72之外徑係比旋轉基座33之外徑更小，比基板W之外徑更大。發熱構件72之外徑既可與基板W之外徑相等，又可比基板W之外徑更小。 As shown in Fig. 3, the plurality of chuck members 32 are inserted into the plurality of through-holes 72p of the heat generating member 72, respectively. The penetrating portion 72p penetrates the outer peripheral portion of the heat generating member 72 in the vertical direction. The through portion 72p may be a notch opened on the outer peripheral surface of the plate-like portion 72a, or may be a through hole that has been closed all around. The outer peripheral surface of the plate-like portion 72 a is positioned further outside than the inner end of the chuck member 32. The outer diameter of the plate-like portion 72a, in other words, the outer diameter of the heat generating member 72 is smaller than the outer diameter of the rotation base 33 and larger than the outer diameter of the substrate W. The outer diameter of the heat generating member 72 may be equal to the outer diameter of the substrate W, or may be smaller than the outer diameter of the substrate W.
如圖8A所示，加熱線圈73係配置於支撐構件78與旋轉基座33之間。加熱線圈73係從旋轉基座33之下表面朝向下方離開。加熱線圈73係在俯視觀察下以重疊於發熱構件72的方式所配置。加熱線圈73係從發熱構件72離開，且在物理上並未連接於發熱構件72。加熱線圈73係在徑向隔出間隔地包圍旋轉軸35。複數個夾盤構件32係配置於加熱線圈73之周圍。加熱線圈73係從夾盤構件32朝向徑向離開。加熱線圈73之外端係配置於比旋轉馬達36之外周面更外側。 As shown in FIG. 8A, the heating coil 73 is disposed between the support member 78 and the rotation base 33. The heating coil 73 is spaced downward from the lower surface of the rotation base 33. The heating coil 73 is arranged so as to overlap the heating member 72 in a plan view. The heating coil 73 is separated from the heat generating member 72 and is not physically connected to the heat generating member 72. The heating coil 73 surrounds the rotation shaft 35 at intervals in the radial direction. The plurality of chuck members 32 are arranged around the heating coil 73. The heating coil 73 is separated from the chuck member 32 in the radial direction. The outer end of the heating coil 73 is disposed further outside than the outer peripheral surface of the rotary motor 36.
如圖8B所示，加熱線圈73係配置於包圍旋轉軸線A1的環狀區域。圖8B係顯示互為獨立的二個加熱線圈73分別配置於二個環狀區域之例。二個加熱線圈73係包含有：內線圈73I，係配置於包圍旋轉軸線A1的內側環狀區域RI；以及外線圈73O，係配置於將內側環狀區域RI包圍成同心圓狀的外側環狀區域RO。二個加熱線圈73係分別連接於二個IH電路74。流動於二個加熱線圈73的交流電流之頻 率係能藉由二個IH電路74個別地變更。 As shown in FIG. 8B, the heating coil 73 is arranged in an annular region surrounding the rotation axis A1. FIG. 8B shows an example in which two heating coils 73 which are independent of each other are respectively arranged in two annular regions. The two heating coils 73 include an inner coil 73I disposed in an inner annular region RI surrounding the rotation axis A1, and an outer coil 73O disposed in an outer annular region surrounding the inner annular region RI in a concentric circle. Area RO. The two heating coils 73 are respectively connected to two IH circuits 74. The frequency of the AC current flowing through the two heating coils 73 can be individually changed by the two IH circuits 74.
發熱構件72係配置於在加熱線圈73之近旁所產生的交變磁場內。流動於加熱線圈73的交流電流之頻率係藉由IH電路74所變更。發熱構件72之溫度係藉由流動於加熱線圈73的交流電流之頻率所變更。IH電路74係由控制裝置3所控制。由於設置有互為獨立的二個加熱線圈73，所以控制裝置3既可以以發熱構件72之溫度成為均一的方式使發熱構件72發熱，又可以以徑向之溫度梯度產生於發熱構件72的方式使發熱構件72發熱。 The heat generating member 72 is arranged in an alternating magnetic field generated near the heating coil 73. The frequency of the alternating current flowing through the heating coil 73 is changed by the IH circuit 74. The temperature of the heating element 72 is changed by the frequency of the alternating current flowing through the heating coil 73. The IH circuit 74 is controlled by the control device 3. Since the two heating coils 73 are provided independently of each other, the control device 3 can generate heat to the heating member 72 in such a manner that the temperature of the heating member 72 becomes uniform, or can generate the temperature gradient in the heating member 72 in a radial direction. The heat generating member 72 is heated.
發熱構件72之溫度係能藉由溫度計75所檢測。圖8B係顯示設置有在從旋轉軸線A1起算之距離為不同的二個位置檢測發熱構件72之溫度的二個溫度計75之例。溫度計75之數目既可為一個，又可為三個以上。溫度計75之檢測值係輸入於控制裝置3。控制裝置3係基於溫度計75之檢測值來控制IH電路74，藉此使發熱構件72之溫度接近目標溫度。藉此，發熱構件72能以高精度維持於目標溫度。 The temperature of the heat generating member 72 can be detected by the thermometer 75. FIG. 8B shows an example in which two thermometers 75 are provided to detect the temperature of the heat generating member 72 at two positions having different distances from the rotation axis A1. The number of the thermometers 75 may be one or three or more. The detection value of the thermometer 75 is input to the control device 3. The control device 3 controls the IH circuit 74 based on the detection value of the thermometer 75, thereby bringing the temperature of the heating member 72 closer to the target temperature. Thereby, the heat generating member 72 can be maintained at a target temperature with high precision.
如圖8A所示，溫度計75係配置於加熱線圈73之下方。溫度計75係透過加熱線圈73之間隙與旋轉基座33相對向。溫度計75係指藉由檢測從物體所輻射出的紅外線或可視光線之強度來檢測物體之溫度的輻射式溫度計。溫度計75係指以非接觸於發熱構件72的方式來檢測發熱構件72之溫度的非接觸式溫度計。溫度計75係透過已由複數個透明構件76所堵塞後的旋轉基座33之複數個檢測窗來檢測發 熱構件72之溫度。檢測窗係朝向上下方向貫通旋轉基座33。透明構件76係由使包含有紅外線之光線穿透的透明之材料所形成。 As shown in FIG. 8A, the thermometer 75 is disposed below the heating coil 73. The thermometer 75 is opposed to the rotating base 33 through a gap of the heating coil 73. The thermometer 75 is a radiation thermometer that detects the temperature of an object by detecting the intensity of infrared or visible light emitted from the object. The thermometer 75 refers to a non-contact type thermometer that detects the temperature of the heat-generating member 72 so as not to contact the heat-generating member 72. The thermometer 75 detects the temperature of the heat-generating member 72 through a plurality of detection windows of the rotating base 33 which has been blocked by a plurality of transparent members 76. The detection window penetrates the rotation base 33 in the vertical direction. The transparent member 76 is formed of a transparent material that transmits light including infrared rays.
溫度計75係由支撐構件78所支撐。即便發熱構件72與旋轉基座33一起旋轉，溫度計75仍不會旋轉。另一方面，當旋轉基座33旋轉時，設置於旋轉基座33的複數個檢測窗亦會旋轉。如圖8B所示，旋轉基座33之複數個檢測窗係在包圍旋轉軸線A1的圓周上排列於圓周方向。從而，在旋轉基座33旋轉中的幾乎全部期間，複數個檢測窗中之任一個係與溫度計75相對向。為此，即便是在旋轉基座33旋轉中時，溫度計75仍可以檢測發熱構件72之溫度。 The thermometer 75 is supported by a support member 78. Even if the heat generating member 72 rotates together with the rotation base 33, the thermometer 75 does not rotate. On the other hand, when the rotation base 33 is rotated, a plurality of detection windows provided on the rotation base 33 are also rotated. As shown in FIG. 8B, a plurality of detection windows of the rotation base 33 are arranged in a circumferential direction on a circumference surrounding the rotation axis A1. Therefore, during almost all of the rotation of the rotation base 33, any one of the plurality of detection windows faces the thermometer 75. For this reason, the thermometer 75 can detect the temperature of the heat generating member 72 even when the rotation base 33 is rotating.
如圖8A所示，磁屏蔽構件77係包含有：筒狀之外壁部77a，用以包圍加熱線圈73；以及下壁部77b，係位於加熱線圈73之下方。磁屏蔽構件77係由鐵等的軟磁性材料所形成。下壁部77b係位於上下方向上的加熱線圈73與支撐構件78之間。下壁部77b係包圍旋轉軸線A1的圓環狀。外壁部77a係從下壁部77b之外周部朝向上方延伸。外壁部77a係位於徑向上的加熱線圈73與夾盤構件32之間。位於夾盤構件32等的加熱線圈73之近旁的構件係藉由磁屏蔽構件77來屏蔽交變磁場。 As shown in FIG. 8A, the magnetic shielding member 77 includes a cylindrical outer wall portion 77 a to surround the heating coil 73, and a lower wall portion 77 b located below the heating coil 73. The magnetic shield member 77 is formed of a soft magnetic material such as iron. The lower wall portion 77b is located between the heating coil 73 and the support member 78 in the vertical direction. The lower wall portion 77b has an annular shape surrounding the rotation axis A1. The outer wall portion 77a extends upward from the outer peripheral portion of the lower wall portion 77b. The outer wall portion 77 a is located between the heating coil 73 and the chuck member 32 in the radial direction. The members located near the heating coil 73 such as the chuck member 32 are shielded from the alternating magnetic field by the magnetic shielding member 77.
支撐構件78係固定於腔室4的底部4a。圖8A係顯示支撐構件78由旋轉馬達36的定子36a所支撐之例。支撐構件78係配置於比旋轉馬達36更上方。支撐構件78係包 圍旋轉軸線A1的圓環狀。支撐構件78之外徑係比旋轉馬達36之外徑更大。支撐構件78之外周部係位於夾盤外殼37的上側筒狀部37c之上方。旋轉軸35係插入於朝向上下方向貫通支撐構件78之中央部的貫通孔。支撐構件78係在徑向隔出間隔地包圍旋轉軸35。 The support member 78 is fixed to the bottom 4 a of the chamber 4. FIG. 8A shows an example in which the support member 78 is supported by the stator 36 a of the rotary motor 36. The support member 78 is disposed above the rotary motor 36. The support member 78 has a ring shape surrounding the rotation axis A1. The outer diameter of the support member 78 is larger than the outer diameter of the rotary motor 36. The outer peripheral portion of the support member 78 is located above the upper cylindrical portion 37 c of the chuck housing 37. The rotation shaft 35 is inserted into a through hole that penetrates the central portion of the support member 78 in the vertical direction. The support member 78 surrounds the rotation shaft 35 at intervals in the radial direction.
當控制裝置3開始對加熱線圈73供給電力時，交變磁場就會在加熱線圈73之近旁產生，而發熱構件72會發熱。伴之，發熱構件72之溫度會急速地上升且維持於發熱構件72之目標溫度或其附近。藉此，基板W之溫度會急速地上升且維持於發熱構件72之目標溫度或其附近。旋轉馬達36之旋轉係透過旋轉軸35及旋轉基座33傳遞至發熱構件72。從而，在控制裝置3使發熱構件72發熱的時候，當旋轉馬達36旋轉時，發熱構件72就會一邊加熱基板W一邊與基板W一起旋轉。 When the control device 3 starts to supply power to the heating coil 73, an alternating magnetic field is generated near the heating coil 73, and the heating member 72 generates heat. Accompanying this, the temperature of the heat-generating member 72 rises rapidly and is maintained at or near the target temperature of the heat-generating member 72. As a result, the temperature of the substrate W rapidly rises and is maintained at or near the target temperature of the heat generating member 72. The rotation of the rotation motor 36 is transmitted to the heat generating member 72 through the rotation shaft 35 and the rotation base 33. Therefore, when the control device 3 heats the heating member 72, when the rotary motor 36 rotates, the heating member 72 rotates together with the substrate W while heating the substrate W.
如前述般，發熱構件72的板狀部72a之厚度T1係比旋轉基座33之厚度T3更小。如此，由於發熱構件72較薄，所以可以減少發熱構件72之體積，且可以減少發熱構件72之熱容量。藉此，可以使發熱構件72立即到達目標溫度。更且，在發熱構件72之至少一部分是由碳等之熱傳導率較大的材料所形成的情況下，可以更進一步縮短發熱構件72到達目標溫度為止的時間。此外，亦可以減低發熱構件72之溫度的不均等。 As described above, the thickness T1 of the plate-like portion 72a of the heat generating member 72 is smaller than the thickness T3 of the rotation base 33. As such, since the heat generating member 72 is thin, the volume of the heat generating member 72 can be reduced, and the heat capacity of the heat generating member 72 can be reduced. Thereby, the heating member 72 can be made to reach a target temperature immediately. Furthermore, when at least a part of the heat generating member 72 is formed of a material having a large thermal conductivity such as carbon, the time until the heat generating member 72 reaches the target temperature can be further reduced. In addition, the temperature unevenness of the heat generating member 72 can be reduced.
其次，針對藉由基板處理裝置1所執行的基板W之處理之一例加以說明。 Next, an example of the processing of the substrate W performed by the substrate processing apparatus 1 will be described.
圖9係針對藉由基板處理裝置1所執行的基板W之處理之一例加以說明用的工序圖。圖10A至圖10F係顯示執行圖9所示的基板W之處理之一例中所包含有的各個工序時的基板W之狀態的示意圖。在圖10A至圖10F中係省略了隨動部55及驅動部56的圖示。以下的各個工序係藉由控制裝置3控制基板處理裝置1所執行。換言之，控制裝置3係以執行以下之各個工序的方式所編程。 FIG. 9 is a process diagram for explaining an example of processing of the substrate W performed by the substrate processing apparatus 1. 10A to 10F are schematic diagrams showing the state of the substrate W when each step included in an example of the processing of the substrate W shown in FIG. 9 is performed. The illustration of the follower 55 and the drive 56 is omitted in FIGS. 10A to 10F. The following steps are executed by the control device 3 controlling the substrate processing apparatus 1. In other words, the control device 3 is programmed to execute the following steps.
在基板處理裝置1處理基板W時係進行將基板W搬入於腔室4內的搬入工序(圖9的步驟S1)。 When the substrate processing apparatus 1 processes the substrate W, a carrying-in process of carrying the substrate W into the chamber 4 is performed (step S1 in FIG. 9).
具體而言，在基板W搬入於腔室4內之前，全部的防濺罩28係配置於下位置，而包含有第一藥液噴嘴5的全部可動噴嘴係配置於待機位置。更且，全部的夾盤構件32係配置於上位置。在此狀態下，如前述般，全部的可動夾盤32a係配置於開啟位置。之後，搬運機器人R1係使手部H1進入腔室4內且將手部H1上的基板W置放於複數個夾盤構件32之上。藉此，基板W能搬入於腔室4內且由複數個夾盤構件32的支撐部38b所支撐。 Specifically, before the substrate W is carried into the chamber 4, all of the splash guards 28 are arranged in the lower position, and all the movable nozzles including the first chemical liquid nozzle 5 are arranged in the standby position. Moreover, all the chuck members 32 are arrange | positioned at an upper position. In this state, as described above, all the movable chucks 32a are arranged in the open position. Thereafter, the transfer robot R1 causes the hand H1 to enter the chamber 4 and places the substrate W on the hand H1 on the plurality of chuck members 32. Thereby, the substrate W can be carried into the chamber 4 and supported by the support portions 38 b of the plurality of chuck members 32.
之後，搬運機器人R1係使手部H1從腔室4之內部退避開。接著，如前述般，全部的可動夾盤32a係配置於閉合位置。藉此，基板W能從複數個夾盤構件32的支撐部38b離開且由複數個夾盤構件32的夾持部38a所夾持。之後，升降致動器69係使全部的夾盤構件32移動至下位置。接著，旋轉馬達36開始旋轉。旋轉馬達36之旋轉係透過旋轉基座33及夾盤構件32傳遞至基板W。藉此，基板W 能繞著旋轉軸線A1旋轉。 Thereafter, the transfer robot R1 retracts the hand H1 from the inside of the chamber 4. Next, as described above, all the movable chucks 32a are arranged in the closed position. Thereby, the substrate W can be separated from the support portions 38 b of the plurality of chuck members 32 and held by the holding portions 38 a of the plurality of chuck members 32. Thereafter, the lift actuator 69 moves all the chuck members 32 to the lower position. Then, the rotation motor 36 starts to rotate. The rotation of the rotation motor 36 is transmitted to the substrate W through the rotation base 33 and the chuck member 32. Thereby, the substrate W can rotate around the rotation axis A1.
其次，如圖10A所示，同時進行將作為藥液之一例的SPM供給至基板W之上表面的第一藥液供給工序(圖9的步驟S2)以及加熱基板W與基板W上之SPM的第一加熱工序(圖9的步驟S3)。 Next, as shown in FIG. 10A, the first chemical liquid supply step (step S2 in FIG. 9) of supplying the SPM as an example of the chemical liquid to the upper surface of the substrate W is simultaneously performed, and First heating step (step S3 in FIG. 9).
有關第一藥液供給工序，第一噴嘴移動機構8係使第一藥液噴嘴5從待機位置移動至處理位置，罩升降單元29係使其中任一個的防濺罩28與基板W之外周部相對向。之後，第一藥液閥7開啟且第一藥液噴嘴5開始吐出SPM。第一藥液噴嘴5係將比室溫更高溫(例如，140℃)的SPM朝向旋轉中的基板W之上表面吐出。在此狀態下，第一噴嘴移動機構8係藉由使第一藥液噴嘴5移動來使相對於基板W之上表面的SPM之著液位置在中央部與外周部之間移動。當第一藥液閥7開啟之後經過預定時間時，第一藥液閥7就會關閉且停止SPM之吐出。之後，第一噴嘴移動機構8係使第一藥液噴嘴5退避至待機位置。 Regarding the first chemical liquid supply process, the first nozzle moving mechanism 8 moves the first chemical liquid nozzle 5 from the standby position to the processing position, and the cover raising and lowering unit 29 makes any one of the splash guard 28 and the outer periphery of the substrate W Opposite. After that, the first chemical liquid valve 7 is opened and the first chemical liquid nozzle 5 starts to eject SPM. The first chemical liquid nozzle 5 discharges an SPM that is higher in temperature (for example, 140 ° C.) than the room temperature toward the upper surface of the substrate W during rotation. In this state, the first nozzle moving mechanism 8 moves the first chemical liquid nozzle 5 to move the liquid injection position of the SPM relative to the upper surface of the substrate W between the central portion and the outer peripheral portion. When a predetermined time elapses after the first chemical liquid valve 7 is opened, the first chemical liquid valve 7 is closed and the discharge of the SPM is stopped. After that, the first nozzle moving mechanism 8 retracts the first chemical liquid nozzle 5 to the standby position.
從第一藥液噴嘴5所吐出的SPM係在著液於基板W之上表面之後藉由離心力沿著基板W之上表面朝向外側流動。為此，SPM能供給至基板W之上表面全區，而覆蓋基板W之上表面全區的SPM之液膜則能形成於基板W上。藉此，阻劑膜(resist film)等的異物能藉由SPM從基板W去除。更且，由於第一噴嘴移動機構8係在基板W旋轉的狀態下使相對於基板W之上表面的SPM之著液位置在中央部與外周部之間移動，所以SPM之著液位置會通過基板W 之上表面全區而能掃描基板W之上表面全區。為此，SPM能直接噴吹至基板W之上表面全區，而基板W之上表面全區能獲得均一處理。 The SPM discharged from the first chemical liquid nozzle 5 flows onto the upper surface of the substrate W and then flows outward along the upper surface of the substrate W by centrifugal force. For this reason, SPM can be supplied to the entire area on the upper surface of the substrate W, and a liquid film of SPM covering the entire area on the upper surface of the substrate W can be formed on the substrate W. Thereby, foreign matter such as a resist film can be removed from the substrate W by the SPM. Furthermore, since the first nozzle moving mechanism 8 moves the SPM injection position with respect to the upper surface of the substrate W between the central portion and the outer peripheral portion while the substrate W is rotating, the SPM injection position passes The entire area of the upper surface of the substrate W can be scanned. For this reason, the SPM can be directly sprayed on the entire area of the upper surface of the substrate W, and the entire area of the upper surface of the substrate W can be uniformly processed.
有關第一加熱工序，控制裝置3係開始對加熱線圈73供給電力。只要基板W與基板W上的SPM係能藉由發熱構件72所加熱，則電力供給之開始既可與第一藥液閥7開啟同時，又可在第一藥液閥7開啟之前或之後。當開始對加熱線圈73供給電力時，交變磁場就會在加熱線圈73之近旁產生，而發熱構件72會發熱。然後，當從電力供給之開始經過預定時間時，就停止對加熱線圈73的電力供給。電力供給之停止既可與第一藥液閥7關閉同時，又可在第一藥液閥7關閉之前或之後。 Regarding the first heating step, the control device 3 starts to supply power to the heating coil 73. As long as the SPM on the substrate W and the substrate W can be heated by the heating member 72, the power supply can be started at the same time as the first chemical liquid valve 7 is opened, or before or after the first chemical liquid valve 7 is opened. When power is supplied to the heating coil 73, an alternating magnetic field is generated near the heating coil 73, and the heating member 72 generates heat. Then, when a predetermined time has passed from the start of the power supply, the power supply to the heating coil 73 is stopped. The power supply can be stopped either simultaneously with the first chemical liquid valve 7 being closed, or before or after the first chemical liquid valve 7 is closed.
當開始對加熱線圈73供給電力時，發熱構件72就會立即到達預定的高溫。發熱構件72例如是維持於比第一藥液(SPM)之沸點更高的高溫。發熱構件72之上表面係從基板W之下表面朝向下方離開，若搬運機器人R1的手部H1越無法進入基板W與發熱構件72之間就會越鄰近於基板W之下表面。更且，基板W之全區或大致全區係在俯視觀察下重疊於發熱構件72。為此，能使基板W與基板W上的SPM均一地加熱且能提高SPM的處理能力。藉此，基板W能藉由SPM而有效率地處理。 When the power supply to the heating coil 73 is started, the heat generating member 72 immediately reaches a predetermined high temperature. The heat generating member 72 is maintained at a higher temperature than the boiling point of the first chemical solution (SPM), for example. The upper surface of the heat-generating member 72 moves downward from the lower surface of the substrate W. If the hand H1 of the transfer robot R1 cannot enter between the substrate W and the heat-generating member 72, the closer to the lower surface of the substrate W. Furthermore, the entire area or substantially the entire area of the substrate W is superimposed on the heat generating member 72 in a plan view. For this reason, the substrate W and the SPM on the substrate W can be uniformly heated, and the processing capacity of the SPM can be improved. Thereby, the substrate W can be efficiently processed by the SPM.
其次，如圖10B所示，進行將作為沖洗液之一例的純水供給至基板W之上表面及下表面之雙方的第一沖洗液供給工序(圖9的步驟S4)。 Next, as shown in FIG. 10B, a first rinse liquid supply step of supplying pure water as an example of the rinse liquid to both the upper surface and the lower surface of the substrate W is performed (step S4 in FIG. 9).
具體而言，第一沖洗液閥15開啟而沖洗液噴嘴13開始純水之吐出。藉此，純水能從沖洗液噴嘴13朝向旋轉中的基板W之上表面中央部吐出。已著液於基板W之上表面的純水係沿著基板W之上表面朝向外側流動。基板W上的SPM係能藉由從沖洗液噴嘴13所吐出的純水來沖走。藉此，形成有覆蓋基板W之上表面全區的純水之液膜。當第一沖洗液閥15開啟之後經過預定時間時，第一沖洗液閥15就會關閉且停止純水之吐出。 Specifically, the first flushing liquid valve 15 is opened and the flushing liquid nozzle 13 starts to spit out pure water. Thereby, pure water can be discharged from the rinse liquid nozzle 13 toward the center of the upper surface of the substrate W in rotation. The pure water that has been deposited on the upper surface of the substrate W flows outward along the upper surface of the substrate W. The SPM on the substrate W can be washed away by pure water discharged from the rinse liquid nozzle 13. As a result, a liquid film of pure water covering the entire surface of the upper surface of the substrate W is formed. When a predetermined time elapses after the first flushing liquid valve 15 is opened, the first flushing liquid valve 15 is closed and the discharge of pure water is stopped.
另一方面，第二沖洗液閥18開啟而下表面噴嘴16開始純水之吐出。藉此，純水能從下表面噴嘴16朝向旋轉中的基板W之下表面中央部吐出。第二沖洗液閥18既可與第一沖洗液閥15同時開啟，又可在第一沖洗液閥15開啟之前或之後開啟。已著液於基板W之下表面的純水係沿著基板W之下表面朝向外側流動。已附著於基板W之下表面的SPM之霧氣(mist)等係能藉由從下表面噴嘴16所吐出的純水來沖走。當第二沖洗液閥18開啟之後經過預定時間時，第二沖洗液閥18就會關閉且停止純水之吐出。 On the other hand, the second flushing liquid valve 18 is opened and the lower surface nozzle 16 starts to spit out pure water. Thereby, pure water can be discharged from the lower surface nozzle 16 toward the center of the lower surface of the substrate W in rotation. The second flushing liquid valve 18 can be opened at the same time as the first flushing liquid valve 15, or it can be opened before or after the first flushing liquid valve 15 is opened. The pure water that has been deposited on the lower surface of the substrate W flows outward along the lower surface of the substrate W. The mist or the like of the SPM that has adhered to the lower surface of the substrate W can be washed away by pure water discharged from the lower surface nozzle 16. When a predetermined time elapses after the second flushing liquid valve 18 is opened, the second flushing liquid valve 18 is closed and the discharge of pure water is stopped.
其次，如圖10C所示，進行將作為藥液之一例的SC1供給至基板W之上表面的第二藥液供給工序(圖9的步驟S5)。 Next, as shown in FIG. 10C, a second chemical liquid supply step of supplying SC1 as an example of the chemical liquid to the upper surface of the substrate W is performed (step S5 in FIG. 9).
具體而言，第二噴嘴移動機構12係使第二藥液噴嘴9從待機位置移動至處理位置，罩升降單元29係使與第一藥液供給工序時不同的防濺罩28與基板W之外周部相對向。之後，第二藥液閥11開啟而第二藥液噴嘴9開始SC1之吐 出。在此狀態下，第二噴嘴移動機構12係藉由使第二藥液噴嘴9移動來使相對於基板W之上表面的SC1之著液位置在中央部與外周部之間移動。當第二藥液閥11開啟之後經過預定時間時，第二藥液閥11就會關閉且停止SC1之吐出。之後，第二噴嘴移動機構12係使第二藥液噴嘴9退避至待機位置。 Specifically, the second nozzle moving mechanism 12 moves the second chemical liquid nozzle 9 from the standby position to the processing position, and the cover raising and lowering unit 29 makes the splash guard 28 and the substrate W different from those in the first chemical liquid supplying step. The outer periphery is facing away. After that, the second chemical liquid valve 11 is opened and the second chemical liquid nozzle 9 starts ejecting SC1. In this state, the second nozzle moving mechanism 12 moves the second chemical liquid nozzle 9 to move the liquid injection position of SC1 relative to the upper surface of the substrate W between the central portion and the outer peripheral portion. When a predetermined time elapses after the second chemical liquid valve 11 is opened, the second chemical liquid valve 11 is closed and the discharge of SC1 is stopped. Thereafter, the second nozzle moving mechanism 12 retracts the second chemical liquid nozzle 9 to the standby position.
從第二藥液噴嘴9所吐出的SC1係在著液於基板W之上表面之後藉由離心力沿著基板W之上表面朝向外側流動。為此，SC1能供給至基板W之上表面全區，而覆蓋基板W之上表面全區的SC1之液膜能形成於基板W上。藉此，微粒子等的異物能藉由SC1從基板W去除。更且，由於第二噴嘴移動機構12係在基板W旋轉的狀態下使相對於基板W之上表面的SC1之著液位置在中央部與外周部之間移動，所以SC1之著液位置會通過基板W之上表面全區而能掃描基板W之上表面全區。為此，SC1能直接噴吹至基板W之上表面全區，而基板W之上表面全區能獲得均一處理。 The SC1 discharged from the second chemical liquid nozzle 9 flows onto the upper surface of the substrate W and flows outward along the upper surface of the substrate W by centrifugal force. For this reason, SC1 can be supplied to the entire surface of the upper surface of the substrate W, and a liquid film of SC1 covering the entire surface of the upper surface of the substrate W can be formed on the substrate W. Thereby, foreign matter such as fine particles can be removed from the substrate W by SC1. Furthermore, the second nozzle moving mechanism 12 moves the SC1 liquid injection position relative to the upper surface of the substrate W between the central portion and the outer peripheral portion while the substrate W is rotating, so the SC1 liquid injection position passes. The entire area of the upper surface of the substrate W can be scanned. For this reason, SC1 can be directly sprayed on the entire area of the upper surface of the substrate W, and the entire area of the upper surface of the substrate W can be uniformly processed.
其次，如圖10B所示，進行將作為沖洗液之一例的純水供給至基板W之上表面及下表面之雙方的第二沖洗液供給工序(圖9的步驟S6)。 Next, as shown in FIG. 10B, a second rinse liquid supply step of supplying pure water as an example of the rinse liquid to both the upper and lower surfaces of the substrate W is performed (step S6 in FIG. 9).
具體而言，第一沖洗液閥15開啟而沖洗液噴嘴13開始純水之吐出。藉此，純水能從沖洗液噴嘴13朝向旋轉中的基板W之上表面中央部吐出。已著液於基板W之上表面的純水係沿著基板W之上表面朝向外側流動。基板W 上的SC1係能藉由從沖洗液噴嘴13所吐出的純水來沖走。藉此，形成有覆蓋基板W之上表面全區的純水之液膜。當第一沖洗液閥15開啟之後經過預定時間時，第一沖洗液閥15就會關閉且停止純水之吐出。 Specifically, the first flushing liquid valve 15 is opened and the flushing liquid nozzle 13 starts to spit out pure water. Thereby, pure water can be discharged from the rinse liquid nozzle 13 toward the center of the upper surface of the substrate W in rotation. The pure water that has been deposited on the upper surface of the substrate W flows outward along the upper surface of the substrate W. The SC1 on the substrate W can be washed away by pure water discharged from the rinse liquid nozzle 13. As a result, a liquid film of pure water covering the entire surface of the upper surface of the substrate W is formed. When a predetermined time elapses after the first flushing liquid valve 15 is opened, the first flushing liquid valve 15 is closed and the discharge of pure water is stopped.
另一方面，第二沖洗液閥18開啟而下表面噴嘴16開始純水之吐出。藉此，純水能從下表面噴嘴16朝向旋轉中的基板W之下表面中央部吐出。第二沖洗液閥18既可與第一沖洗液閥15同時開啟，又可在第一沖洗液閥15開啟之前或之後開啟。已著液於基板W之下表面的純水係沿著基板W之下表面朝向外側流動。已附著於基板W之下表面的SC1之霧氣(mist)等係能藉由從下表面噴嘴16所吐出的純水來沖走。當第二沖洗液閥18開啟之後經過預定時間時，第二沖洗液閥18就會關閉且停止純水之吐出。 On the other hand, the second flushing liquid valve 18 is opened and the lower surface nozzle 16 starts to spit out pure water. Thereby, pure water can be discharged from the lower surface nozzle 16 toward the center of the lower surface of the substrate W in rotation. The second flushing liquid valve 18 can be opened at the same time as the first flushing liquid valve 15, or it can be opened before or after the first flushing liquid valve 15 is opened. The pure water that has been deposited on the lower surface of the substrate W flows outward along the lower surface of the substrate W. The mist or the like of SC1 attached to the lower surface of the substrate W can be washed away by pure water discharged from the lower surface nozzle 16. When a predetermined time elapses after the second flushing liquid valve 18 is opened, the second flushing liquid valve 18 is closed and the discharge of pure water is stopped.
其次，如圖10D所示，同時進行將作為有機溶劑之一例的IPA(液體)供給至基板W的溶劑供給工序(圖9的步驟S7)以及加熱基板W上之IPA與基板W的第二加熱工序(圖9的步驟S8)。 Next, as shown in FIG. 10D, a solvent supply step of supplying IPA (liquid) as an example of an organic solvent to the substrate W (step S7 in FIG. 9) and a second heating for heating the IPA on the substrate W and the substrate W are performed simultaneously. Process (step S8 in FIG. 9).
有關溶劑供給工序，第四噴嘴移動機構25係使溶劑噴嘴19從待機位置移動至處理位置，罩升降單元29係使與第一藥液供給工序及第二藥液供給工序時不同的防濺罩28與基板W之外周部相對向。之後，溶劑閥21開啟而溶劑噴嘴19開始IPA之吐出。藉此，IPA能從溶劑噴嘴19朝向旋轉中的基板W之上表面中央部吐出。已著液於基板W之上表面的IPA係沿著基板W之上表面朝向外側流動。 基板W上的純水之液膜係能置換成覆蓋基板W之上表面全區的IPA之液膜。當溶劑閥21開啟之後經過預定時間時，溶劑閥21就會關閉且停止溶劑之吐出。 Regarding the solvent supply process, the fourth nozzle moving mechanism 25 moves the solvent nozzle 19 from the standby position to the processing position, and the cover raising and lowering unit 29 makes a splash guard different from that in the first and second chemical liquid supply processes. 28 is opposed to the outer peripheral portion of the substrate W. After that, the solvent valve 21 is opened and the solvent nozzle 19 starts to discharge the IPA. Thereby, the IPA can be discharged from the solvent nozzle 19 toward the center portion of the upper surface of the substrate W in rotation. The IPA deposited on the upper surface of the substrate W flows outward along the upper surface of the substrate W. The liquid film of pure water on the substrate W can be replaced with a liquid film of IPA covering the entire area on the upper surface of the substrate W. When a predetermined time elapses after the solvent valve 21 is opened, the solvent valve 21 is closed and the discharge of the solvent is stopped.
有關第二加熱工序，控制裝置3係開始對加熱線圈73供給電力。只要基板W與基板W上之IPA係能藉由發熱構件72所加熱，則電力供給之開始就既可與溶劑閥21開啟同時，又可在溶劑閥21開啟之前或之後。當開始對加熱線圈73供給電力時，交變磁場就會在加熱線圈73之近旁產生且能使發熱構件72發熱。藉此，能開始基板W之加熱。然後，當從電力供給之開始經過預定時間時，就停止對加熱線圈73供給電力。對加熱線圈73供給電力，例如是在後面所述的乾燥工序中繼續直至基板W乾燥為止。 Regarding the second heating step, the control device 3 starts to supply power to the heating coil 73. As long as the IPA on the substrate W and the substrate W can be heated by the heating member 72, the power supply can be started at the same time as the solvent valve 21 is opened, or before or after the solvent valve 21 is opened. When the power supply to the heating coil 73 is started, an alternating magnetic field is generated near the heating coil 73 and the heating member 72 can generate heat. Thereby, heating of the substrate W can be started. When a predetermined time has elapsed from the start of the power supply, the supply of power to the heating coil 73 is stopped. The supply of electric power to the heating coil 73 is continued until the substrate W is dried in a drying step described later, for example.
當開始對加熱線圈73供給電力時，發熱構件72就會立即到達預定之高溫。發熱構件72之各部係能維持於IPA之沸點以上的溫度。基板W之溫度係在基板W之上表面全區由IPA之液膜所覆蓋的狀態下到達IPA之沸點以上的值。藉此，IPA會在IPA與基板W之上表面的界面蒸發，且在IPA之液膜與基板W之上表面之間形成有氣體層。此時，由於IPA之液膜係從基板W之上表面浮起，所以作用於基板W上的IPA之液膜的摩擦阻力係越使其為零就越小。為此，IPA之液膜係處於容易沿著基板W之上表面滑動的狀態。IPA之液膜係能在以下所述的IPA去除工序中從基板W去除。 When the power supply to the heating coil 73 is started, the heat generating member 72 immediately reaches a predetermined high temperature. Each part of the heat generating member 72 can be maintained at a temperature above the boiling point of IPA. The temperature of the substrate W is a value that reaches the boiling point of the IPA in a state in which the entire surface of the upper surface of the substrate W is covered with the liquid film of the IPA. As a result, the IPA evaporates at the interface between the IPA and the upper surface of the substrate W, and a gas layer is formed between the liquid film of the IPA and the upper surface of the substrate W. At this time, since the liquid film of the IPA floats from the upper surface of the substrate W, the frictional resistance of the liquid film of the IPA acting on the substrate W becomes smaller as it becomes zero. For this reason, the liquid film of IPA is in a state where it is easy to slide along the upper surface of the substrate W. The liquid film of IPA can be removed from the substrate W in the IPA removal step described below.
在進行溶劑供給工序之後，如圖10E所示，進行從基 板W之上方去除IPA的IPA去除工序(圖9的步驟S9)。 After the solvent supply step is performed, as shown in Fig. 10E, an IPA removal step is performed to remove IPA from above the substrate W (step S9 in Fig. 9).
具體而言，氣體噴嘴22係在溶劑供給工序中已配置於處理位置。在此狀態下，氣體閥24開啟而氣體噴嘴22開始氮氣之吐出。氣體噴嘴22係朝向由IPA之液膜所覆蓋的基板W之上表面吐出氮氣。又，旋轉馬達36係使基板W朝向旋轉方向加速且以比IPA供給工序時更大的去除轉速來使基板W旋轉。在氣體噴嘴22吐出氮氣時，只要基板W係以去除轉速旋轉，則基板W之加速既可與氣體閥24開啟同時，又可在氣體閥24開啟之前或之後。氮氣之吐出係在後面所述的乾燥工序中繼續直至基板W乾燥為止。 Specifically, the gas nozzle 22 is disposed at the processing position in the solvent supply step. In this state, the gas valve 24 is opened and the gas nozzle 22 starts to emit nitrogen. The gas nozzle 22 emits nitrogen toward the upper surface of the substrate W covered by the liquid film of IPA. The rotation motor 36 accelerates the substrate W in the rotation direction and rotates the substrate W at a higher removal speed than during the IPA supply process. When the gas nozzle 22 emits nitrogen, as long as the substrate W is rotated at the removal speed, the acceleration of the substrate W can be performed at the same time as the gas valve 24 is opened, or before or after the gas valve 24 is opened. The discharge of nitrogen is continued until the substrate W is dried in a drying step described later.
氣體噴嘴22係在IPA之液膜與基板W之上表面之間形成有氣體層的狀態下，朝向基板W之上表面內的噴吹位置吐出氮氣。位於噴吹位置的IPA係藉由氮氣之供給朝向其周圍推開。藉此，乾燥區域能形成於噴吹位置。更且，由於被氮氣推開的IPA係從噴吹位置朝向其周圍移動，所以會以氮氣之供給為契機而在IPA之液膜上形成有轉向基板W之外周部的向外之流動。更且，由於基板W會與氮氣之供給同時進行而朝向旋轉方向加速，所以該流動能利用離心力來促進。藉此，基板W上的IPA之液膜就不會分裂成多數的小滴而能以塊狀的狀態從基板W排出。為此，可以將從基板W浮起的IPA之液膜在短時間內從基板W飛快地排除。 The gas nozzle 22 discharges nitrogen toward a spraying position in the upper surface of the substrate W in a state where a gas layer is formed between the liquid film of the IPA and the upper surface of the substrate W. The IPA located at the blowing position is pushed away from the surroundings by the supply of nitrogen. Thereby, a dry area can be formed in a blowing position. Furthermore, since the IPA pushed by the nitrogen gas moves from the blowing position toward the periphery, the outward flow of the steering substrate W is formed on the liquid film of the IPA with the supply of nitrogen as an opportunity. Furthermore, since the substrate W is accelerated in the rotation direction simultaneously with the supply of nitrogen, this flow can be promoted by centrifugal force. Thereby, the liquid film of IPA on the substrate W can be discharged from the substrate W in a block state without being split into a plurality of droplets. For this reason, the liquid film of IPA floating from the substrate W can be quickly removed from the substrate W in a short time.
其次，如圖10F所示，進行藉由以離心力甩開已附著於基板W的液體來使基板W乾燥的乾燥工序(圖9的步驟 S10)。 Next, as shown in FIG. 10F, a drying step of drying the substrate W by spinning off the liquid adhered to the substrate W with a centrifugal force is performed (step S10 in FIG. 9).
具體而言，旋轉馬達36係使基板W朝向旋轉方向加速且以比去除轉速更大的高轉速(例如數千rpm)使基板W旋轉。藉此，較大的離心力就會施加於已附著於基板W的液體上，且液體能從基板W朝向其周圍甩開。更且，由於發熱構件72係持續著發熱，所以能促進基板W上的液體之蒸發。同樣地，由於氣體噴嘴22係持續著氮氣之吐出，所以能促進基板W上的液體之蒸發。藉此，基板W會在短時間內乾燥。當基板W之高速旋轉開始之後經過預定時間時，旋轉馬達36就會停止旋轉。又，停止對加熱線圈73供給電力而氣體閥24會關閉。 Specifically, the rotation motor 36 accelerates the substrate W in the rotation direction and rotates the substrate W at a high rotation speed (for example, several thousand rpm) higher than the removal rotation speed. As a result, a large centrifugal force is applied to the liquid that has been attached to the substrate W, and the liquid can be thrown away from the substrate W toward its surroundings. Furthermore, since the heat generating member 72 continuously generates heat, the evaporation of the liquid on the substrate W can be promoted. Similarly, since the gas nozzle 22 continuously emits nitrogen, evaporation of the liquid on the substrate W can be promoted. Thereby, the substrate W is dried in a short time. When a predetermined time elapses after the high-speed rotation of the substrate W is started, the rotation motor 36 stops rotating. Further, the supply of power to the heating coil 73 is stopped and the gas valve 24 is closed.
其次，進行將基板W從腔室4搬出的搬出工序(圖9的步驟S11)。 Next, a carrying-out process of carrying out the board | substrate W from the chamber 4 is performed (step S11 of FIG. 9).
具體而言，全部的防濺罩28係配置於下位置，包含有第一藥液噴嘴5的全部可動噴嘴係配置於待機位置。更且，全部的夾盤構件32係配置於上位置。在此狀態下，如前述般，全部的可動夾盤32a係配置於開啟位置。當可動夾盤32a移動至開啟位置時，基板W就從夾盤構件32之夾持部28a離開且由夾盤構件32的支撐部38b所支撐。在此狀態下，搬運機器人R1係使手部H1進入基板W與發熱構件72之間且使手部H1上升。在手部H1上升的過程中，基板W係從全部的夾盤構件32之支撐部38b離開且由搬運機器人R1之手部H1所支撐。之後，搬運機器人R1係一邊用手部H1來支撐基板W一邊使手部H1從腔室4之內部退 避開。藉此，基板W能從腔室4搬出。 Specifically, all the splash guards 28 are arranged in the lower position, and all the movable nozzles including the first chemical liquid nozzle 5 are arranged in the standby position. Moreover, all the chuck members 32 are arrange | positioned at an upper position. In this state, as described above, all the movable chucks 32a are arranged in the open position. When the movable chuck 32 a is moved to the open position, the substrate W is separated from the clamping portion 28 a of the chuck member 32 and is supported by the support portion 38 b of the chuck member 32. In this state, the transfer robot R1 moves the hand H1 between the substrate W and the heat generating member 72 and raises the hand H1. During the ascent of the hand H1, the substrate W is separated from the support portions 38b of all the chuck members 32 and is supported by the hand H1 of the transfer robot R1. Thereafter, the transport robot R1 retracts the hand H1 from the inside of the chamber 4 while supporting the substrate W with the hand H1. Thereby, the substrate W can be carried out from the chamber 4.
如以上，在本實施形態中，旋轉馬達36係使隨動部55與可動夾盤32a一起繞著基板W之旋轉軸線A1旋轉。罩升降單元29係使驅動部56與防濺罩28A一起朝向鉛直方向移動。旋轉馬達36及罩升降單元29係藉由控制裝置3所控制。 As described above, in the present embodiment, the rotation motor 36 rotates the follower portion 55 together with the movable chuck 32 a about the rotation axis A1 of the substrate W. The cover elevating unit 29 moves the driving portion 56 in the vertical direction together with the splash cover 28A. The rotary motor 36 and the hood lifting unit 29 are controlled by the control device 3.
隨動部55及驅動部56係在相互地離開的狀態下於水平或垂直之相對向方向相對向。之後，隨動部55及驅動部56係相互地接觸，而驅動部56係將隨動部55朝向相對向方向按壓。藉此，可動夾盤32a能配置於開啟位置。之後，隨動部55及驅動部56會相互地離開。可動夾盤32a係利用作為夾持力產生構件之一例的線圈彈簧51之力返回至閉合位置的方向。 The follower portion 55 and the drive portion 56 face each other in a horizontal or vertical opposite direction in a state where they are separated from each other. Thereafter, the follower portion 55 and the drive portion 56 are in contact with each other, and the drive portion 56 presses the follower portion 55 toward the opposite direction. Thereby, the movable chuck 32a can be arrange | positioned in an open position. After that, the follower 55 and the drive 56 are separated from each other. The movable chuck 32 a is a direction to return to the closed position by the force of the coil spring 51 as an example of a clamping force generating member.
如此，由於旋轉馬達36係兼作使可動夾盤32a移動至開啟位置的方向的開啟用之致動器，所以沒有必要設置專用的開啟用之致動器。為此，可以簡化開閉可動夾盤32a的夾盤開閉機構34。更且，由於驅動部56係接觸於隨動部55且按壓隨動部55，所以與利用磁力使可動夾盤32a移動至開啟位置的方向的情況相較，可以使可動夾盤32a確實地移動至開啟位置的方向。 As described above, since the rotary motor 36 also serves as an actuator for opening that moves the movable chuck 32 a to the open position, it is not necessary to provide a dedicated actuator for opening. For this reason, the chuck opening-closing mechanism 34 which opens and closes the movable chuck 32a can be simplified. Furthermore, since the driving portion 56 is in contact with the follower portion 55 and presses the follower portion 55, the movable chuck 32a can be reliably moved compared to a case where the movable chuck 32a is moved to the open position by magnetic force. Direction to the open position.
在本實施形態中，IH加熱機構71的IH電路74係在基板W旋轉時對加熱線圈73供給電力。藉此，能產生施加於發熱構件72的交變磁場且使發熱構件72發熱。處理基板W的處理流體係供給至旋轉中的基板W。藉此，可以 均一地處理基板W。 In this embodiment, the IH circuit 74 of the IH heating mechanism 71 supplies power to the heating coil 73 when the substrate W is rotated. Thereby, an alternating magnetic field applied to the heat generating member 72 can be generated and the heat generating member 72 can generate heat. The processing flow system for processing the substrate W is supplied to the substrate W in rotation. Thereby, the substrate W can be processed uniformly.
由於發熱構件72係藉由感應加熱所加熱，所以沒有必要將對發熱構件72供給電力的配線或連接器連接於發熱構件72。為此，基板W之轉速不會藉由如此的構造而受到限制。更且，加熱基板W的發熱構件72係配置於基板W與旋轉基座33之間，而非配置於旋轉基座33之內部。從而，與發熱構件72配置於旋轉基座33之內部的情況相較，可以縮短基板W與發熱構件72之間隔，且可以提高基板W之加熱效率。 Since the heat generating member 72 is heated by induction heating, it is not necessary to connect a wiring or a connector that supplies power to the heat generating member 72. For this reason, the rotation speed of the substrate W is not limited by such a structure. Furthermore, the heat generating member 72 that heats the substrate W is disposed between the substrate W and the rotation base 33, instead of being disposed inside the rotation base 33. Therefore, compared with the case where the heat generating member 72 is disposed inside the rotation base 33, the interval between the substrate W and the heat generating member 72 can be shortened, and the heating efficiency of the substrate W can be improved.
在本實施形態中，加熱線圈73係配置於旋轉基座33之附近。換句話說，如圖8A所示，加熱線圈73與旋轉基座33之上下方向的間隔D2係比加熱線圈73之厚度T2更窄。加熱線圈73係配置於旋轉基座33之下方，發熱構件72係配置於旋轉基座33之上方。當使加熱線圈73接近旋轉基座33時，就能縮短從加熱線圈73至發熱構件72的距離。藉此，由於施加於發熱構件72的交變磁場會變強，所以可以將供給至加熱線圈73的電力有效率地轉換成發熱構件72的熱。 In this embodiment, the heating coil 73 is disposed near the rotation base 33. In other words, as shown in FIG. 8A, the interval D2 between the heating coil 73 and the rotating base 33 in the up-down direction is narrower than the thickness T2 of the heating coil 73. The heating coil 73 is disposed below the rotation base 33, and the heating member 72 is disposed above the rotation base 33. When the heating coil 73 is brought close to the rotation base 33, the distance from the heating coil 73 to the heat generating member 72 can be shortened. Thereby, since the alternating magnetic field applied to the heat generating member 72 becomes strong, the electric power supplied to the heating coil 73 can be efficiently converted into the heat of the heat generating member 72.
在本實施形態中，能減低旋轉基座33之厚度T3。換句話說，旋轉基座33之厚度T3係比加熱線圈73之厚度T2更小。當旋轉基座33較厚時，不僅從加熱線圈73至發熱構件72的距離會增加，施加於發熱構件72的交變磁場也會變弱。為此，可以藉由減低旋轉基座33之厚度T3來使發熱構件72的溫度有效率地上升。 In this embodiment, the thickness T3 of the rotary base 33 can be reduced. In other words, the thickness T3 of the rotating base 33 is smaller than the thickness T2 of the heating coil 73. When the rotation base 33 is thick, not only the distance from the heating coil 73 to the heating member 72 increases, but also the alternating magnetic field applied to the heating member 72 becomes weak. For this reason, the temperature T of the heat generating member 72 can be efficiently increased by reducing the thickness T3 of the rotation base 33.
在本實施形態中，在基板W與發熱構件72之間並未夾設其他的構件，而是發熱構件72直接與基板W相對向。為此，發熱構件72的熱能有效率地傳遞至基板W。藉此，可以提高基板W之加熱效率。 In this embodiment, no other member is interposed between the substrate W and the heat generating member 72, but the heat generating member 72 directly faces the substrate W. For this reason, the thermal energy of the heat generating member 72 is efficiently transferred to the substrate W. Thereby, the heating efficiency of the substrate W can be improved.
在本實施形態中，間隔變更機構61能使複數個夾盤構件32與發熱構件72朝向上下方向相對地移動。藉此，能變更由複數個夾盤構件32所夾持的基板W與發熱構件72之上下方向的間隔。從而，可以依需要來變更從發熱構件72至基板W的距離。 In this embodiment, the interval changing mechanism 61 can relatively move the plurality of chuck members 32 and the heat generating member 72 in the vertical direction. This makes it possible to change the distance between the substrate W sandwiched between the plurality of chuck members 32 and the heat generating member 72 in the up-down direction. Therefore, the distance from the heat generating member 72 to the substrate W can be changed as necessary.
在本實施形態中，在複數個夾盤構件32位於作為退避位置的上位置的退避狀態下，搬運機器人R1係將支撐於手部H1上的基板W置放於複數個夾盤構件32之上。其次，搬運機器人R1係使手部H1下降且從基板W離開。之後，搬運機器人R1係使手部H1從基板W與發熱構件72之間退避開。在基板W從複數個夾盤構件32取出時係能在退避狀態下將手部H1插入於基板W與發熱構件72之間。之後，搬運機器人R1係使手部H1上升。藉此，基板W能從複數個夾盤構件32離開且支撐於手部H1。 In the present embodiment, in a retracted state in which the plurality of chuck members 32 are positioned at an upper position as the retreat position, the transfer robot R1 places the substrate W supported on the hand H1 on the plurality of chuck members 32. . Next, the transfer robot R1 lowers the hand H1 and moves away from the substrate W. Thereafter, the transfer robot R1 retracts the hand H1 from between the substrate W and the heat generating member 72. When the substrate W is taken out from the plurality of chuck members 32, the hand H1 can be inserted between the substrate W and the heat generating member 72 in a retracted state. Thereafter, the transport robot R1 raises the hand H1. Thereby, the substrate W can be separated from the plurality of chuck members 32 and supported by the hand H1.
當從加熱效率之觀點來看時，發熱構件72較佳是配置於基板W之附近。然而，當發熱構件72過於接近基板W時，就無法使手部H1進入基板W與發熱構件72之間，且無法將基板W置放於複數個夾盤構件32，或從複數個夾盤構件32取出。如前述般，基板W之遞送係能在退避狀態下進行。另一方面，基板W之加熱係能在複數個夾盤構 件32位於作為鄰近位置的下位置的鄰近狀態下進行。從而，可以不使基板W之加熱效率降低地進行基板W之遞送。 From the viewpoint of heating efficiency, the heat generating member 72 is preferably disposed near the substrate W. However, when the heating member 72 is too close to the substrate W, the hand H1 cannot enter between the substrate W and the heating member 72, and the substrate W cannot be placed on or from the plurality of chuck members 32. 32 Take out. As described above, the substrate W can be delivered in a retracted state. On the other hand, the heating of the substrate W can be performed in a state in which the plurality of chuck members 32 are positioned in a lower position which is a lower position. Therefore, the substrate W can be delivered without reducing the heating efficiency of the substrate W.
在本實施形態中，複數個夾盤構件32係包含有能夠在閉合位置與開啟位置之間相對於旋轉基座33移動的可動夾盤32a。基板W與發熱構件72之上下方向的間隔係能藉由使複數個夾盤構件32相對於旋轉基座33朝向上下方向移動來變更。從而，可動夾盤32a不僅能夠在閉合位置與開啟位置之間相對於旋轉基座33移動，還能夠相對於旋轉基座33朝向上下方向移動。如此，由於沒有必要為了變更基板W與發熱構件72之上下方向的間隔而使發熱構件72朝向上下方向移動，所以可以簡化支撐發熱構件72的構造。 In the present embodiment, the plurality of chuck members 32 include a movable chuck 32 a that can be moved relative to the rotation base 33 between a closed position and an open position. The distance between the substrate W and the heat generating member 72 in the up-down direction can be changed by moving the plurality of chuck members 32 in the up-down direction relative to the rotation base 33. Therefore, the movable chuck 32 a can move not only relative to the rotary base 33 between the closed position and the open position, but also can move upward and downward relative to the rotary base 33. As described above, since it is not necessary to move the heat generating member 72 in the vertical direction in order to change the interval between the substrate W and the heat generating member 72 in the up-down direction, the structure of supporting the heat generating member 72 can be simplified.
在本實施形態中，吸收磁性的磁屏蔽構件77之外壁部77a係包圍加熱線圈73。更且，吸收磁性的磁屏蔽構件77之下壁部77b係位於加熱線圈73之下方。從而，可以抑制或消除波及位於加熱線圈73之周圍的構件的交變磁場之影響。同樣地可以抑制或消除波及位於加熱線圈73之下方的構件的交變磁場之影響。 In this embodiment, the outer wall portion 77 a of the magnetically absorbing magnetic shield member 77 surrounds the heating coil 73. Furthermore, the lower wall portion 77 b of the magnetically absorbing magnetic shield member 77 is located below the heating coil 73. Accordingly, it is possible to suppress or eliminate the influence of the alternating magnetic field that spreads to the members located around the heating coil 73. Similarly, it is possible to suppress or eliminate the influence of an alternating magnetic field that affects a member located below the heating coil 73.
在本實施形態中，檢測發熱構件72之溫度的溫度計75之檢測值係輸入於控制裝置3。控制裝置3係基於該檢測值來控制供給至加熱線圈73的電力。藉此，可以使發熱構件72之溫度以較高的精度接近目標溫度。 In the present embodiment, the detection value of the thermometer 75 that detects the temperature of the heating member 72 is input to the control device 3. The control device 3 controls the power supplied to the heating coil 73 based on the detected value. Thereby, the temperature of the heat generating member 72 can be approached to the target temperature with high accuracy.
在本實施形態中，下表面噴嘴16係能將處理流體朝向基板W之下表面吐出。下表面噴嘴16係在俯視觀察下配 置於朝向上下方向貫通發熱構件72之中央部的貫通孔72c內。從而，可以抑制或防止從下表面噴嘴16所吐出的處理流體妨礙發熱構件72。藉此，可以將處理流體確實地供給至基板W之下表面。 In this embodiment, the lower surface nozzle 16 is capable of discharging the processing fluid toward the lower surface of the substrate W. The lower surface nozzle 16 is disposed in a through hole 72c penetrating the central portion of the heat generating member 72 in the vertical direction in a plan view. Accordingly, it is possible to suppress or prevent the processing fluid discharged from the lower surface nozzle 16 from interfering with the heat generating member 72. Thereby, the processing fluid can be reliably supplied to the lower surface of the substrate W.
在本實施形態中，可動夾盤32a係繞著鉛直之夾盤轉動軸線A2轉動。在此情況下，與夾盤轉動軸線A2為水平之直線的情況相較，容易減少可動夾盤32a所通過的通過空間之體積。特別是在夾盤轉動軸線A2一致於可動夾盤32a之中心線的情況下，可以使通過空間之體積一致或大致一致於可動夾盤32a之體積。 In this embodiment, the movable chuck 32a is rotated about the vertical chuck rotation axis A2. In this case, compared with the case where the chuck rotation axis A2 is a horizontal straight line, it is easy to reduce the volume of the passing space through which the movable chuck 32a passes. Especially in the case where the chuck rotation axis A2 coincides with the center line of the movable chuck 32a, the volume of the passing space can be made uniform or approximately the same as the volume of the movable chuck 32a.
其次，針對本發明之第二實施形態加以說明。相對於第一實施形態的第二實施形態之主要差異點不僅在於複數個夾盤構件32，還在於發熱構件72升降、以及可動夾盤32a能夠繞著水平之夾盤轉動軸線A2轉動。 Next, a second embodiment of the present invention will be described. The main differences between the second embodiment and the first embodiment are not only the plurality of chuck members 32, but also the raising and lowering of the heat generating member 72, and the movable chuck 32a can be rotated about the horizontal chuck rotation axis A2.
圖11係顯示本發明之第二實施形態的旋轉夾盤31之鉛直剖面的示意圖。圖12係朝向圖11所示的箭頭XII之方向觀察可動夾盤32a的示意俯視圖。圖13係顯示隨動部藉由驅動部鉛直地按壓直至可動夾盤32a到達開啟位置為止之狀態的示意剖視圖。圖11係顯示可動夾盤32a位於閉合位置的狀態，圖13係顯示可動夾盤32a位於開啟位置的狀態。在圖11至圖13中，有關與前述之圖1至圖10F所示的各部同等的構成係附記與圖1等相同的參照符號並省略其說明。 FIG. 11 is a schematic view showing a vertical cross section of a rotary chuck 31 according to a second embodiment of the present invention. FIG. 12 is a schematic plan view of the movable chuck 32 a viewed in a direction of an arrow XII shown in FIG. 11. FIG. 13 is a schematic cross-sectional view showing a state in which the follower portion is vertically pressed by the drive portion until the movable chuck 32a reaches the open position. FIG. 11 shows a state where the movable chuck 32a is in the closed position, and FIG. 13 shows a state where the movable chuck 32a is in the open position. In FIGS. 11 to 13, the same components as those shown in FIGS. 1 to 10F described above are appended with the same reference numerals as those in FIG. 1 and the like, and descriptions thereof are omitted.
固定夾盤32b(參照圖3)係固定於旋轉基座33。可動夾盤32a係能夠繞著水平之夾盤轉動軸線A2轉動地保持於旋轉基座33。 The fixed chuck 32 b (see FIG. 3) is fixed to the rotation base 33. The movable chuck 32a is rotatably held on the rotation base 33 about a horizontal chuck rotation axis A2.
如圖12所示，可動夾盤32a係透過水平延伸的支撐軸281和已插入有支撐軸281的支撐孔282由旋轉基座33所支撐。支撐軸281係設置於可動夾盤32a，支撐孔282係設置於旋轉基座33。支撐軸281亦可設置於旋轉基座33，支撐孔282亦可設置於可動夾盤32a。 As shown in FIG. 12, the movable chuck 32 a is supported by the rotation base 33 through a horizontally extending support shaft 281 and a support hole 282 into which the support shaft 281 has been inserted. The support shaft 281 is provided on the movable chuck 32 a, and the support hole 282 is provided on the rotation base 33. The support shaft 281 may also be provided on the rotation base 33, and the support hole 282 may also be provided on the movable chuck 32a.
一對支撐軸281係從可動夾盤32a相互地朝向相反的方向延伸。一對支撐軸281係位於同一直線上。支撐軸281係朝向包圍旋轉軸線A1(參照圖11)的圓之切線方向水平地延伸。支撐孔282係從已設置於旋轉基座33的貫通部33p之內面凹陷。一對支撐軸281係分別插入於一對支撐孔282。 A pair of support shafts 281 extend from the movable chuck 32a in mutually opposite directions. The pair of support shafts 281 are located on the same straight line. The support shaft 281 extends horizontally toward a tangential direction of a circle surrounding the rotation axis A1 (see FIG. 11). The support hole 282 is recessed from the inner surface of the penetrating portion 33 p provided in the rotation base 33. The pair of support shafts 281 are respectively inserted into the pair of support holes 282.
可動夾盤32a係能夠繞著相當於支撐軸281之中心線的水平之夾盤轉動軸線A2而相對於旋轉基座33移動。如圖11所示，夾盤轉動軸線A2係配置於旋轉基座33之上表面更下方。可動夾盤32a之上端部係伴隨可動夾盤32a繞著夾盤轉動軸線A2轉動而朝向徑向移動。旋轉基座33的貫通部33p係指從旋轉基座33之外周面朝向內側延伸的缺口。旋轉基座33的貫通部33p係連通至裙部63的貫通部63p。裙部63的貫通部63p係朝向徑向貫通裙部63。裙部63的貫通部63p係指從裙部63之上表面朝向下方延伸的缺口。 The movable chuck 32 a is capable of moving relative to the rotation base 33 around a horizontal chuck rotation axis A2 corresponding to the center line of the support shaft 281. As shown in FIG. 11, the chuck rotation axis A2 is disposed further below the upper surface of the rotation base 33. The upper end portion of the movable chuck 32a moves in the radial direction as the movable chuck 32a rotates about the chuck rotation axis A2. The penetrating portion 33 p of the rotation base 33 is a notch extending from the outer peripheral surface of the rotation base 33 toward the inside. The penetrating portion 33 p of the rotation base 33 communicates with the penetrating portion 63 p of the skirt portion 63. The penetration portion 63 p of the skirt portion 63 penetrates the skirt portion 63 in the radial direction. The through portion 63 p of the skirt portion 63 is a notch extending downward from the upper surface of the skirt portion 63.
如圖13所示，線圈彈簧51係配置於可動夾盤32a之內側。線圈彈簧51的一端部(外端部)係保持於可動夾盤32a。線圈彈簧51的另一端部(內端部)係保持於已設置於旋轉基座33的保持部53。線圈彈簧51係配置於比夾盤轉動軸線A2更下方。線圈彈簧51係將可動夾盤32a保持於原點位置。當可動夾盤32a從原點位置轉動至開啟位置的方向時，線圈彈簧51就會彈性變形且產生使可動夾盤32a返回至原點位置的復原力。圖13係顯示可動夾盤32a位於開啟位置的狀態。 As shown in FIG. 13, the coil spring 51 is arrange | positioned inside the movable chuck 32a. One end portion (outer end portion) of the coil spring 51 is held by the movable chuck 32a. The other end portion (inner end portion) of the coil spring 51 is held by a holding portion 53 provided in the rotation base 33. The coil spring 51 is arranged below the chuck rotation axis A2. The coil spring 51 holds the movable chuck 32a at the origin position. When the movable chuck 32a is turned from the original position to the open position, the coil spring 51 is elastically deformed and a restoring force is generated to return the movable chuck 32a to the original position. FIG. 13 shows a state where the movable chuck 32a is in the open position.
隨動部55係固定於夾盤構件32。隨動部55係與夾盤構件32一起繞著夾盤轉動軸線A2轉動。隨動部55係從盤構件32朝向外側延伸。隨動部55係配置於比夾盤轉動軸線A2更下方。隨動部55係配置於比夾盤轉動軸線A2更外側。隨動部55之一部分係配置於裙部63的貫通部63p內。隨動部55係從裙部63之外周面朝向外側突出。隨動部55的外端55o係配置於比裙部63更外側。隨動部55係配置於比驅動部56更下方。 The follower 55 is fixed to the chuck member 32. The follower 55 rotates with the chuck member 32 about the chuck rotation axis A2. The follower portion 55 extends outward from the disk member 32. The follower 55 is arranged below the chuck rotation axis A2. The follower 55 is disposed further outside than the chuck rotation axis A2. A part of the follower portion 55 is arranged in the through portion 63 p of the skirt portion 63. The follower portion 55 projects outward from the outer peripheral surface of the skirt portion 63. The outer end 55o of the follower part 55 is arrange | positioned further outside than the skirt part 63. The follower portion 55 is disposed below the drive portion 56.
升降構件62係配置於殼體52之下方。升降構件62之上位置係指從殼體52朝向下方離開的位置。升降構件62係與複數個導引構件64一起升降。導引止動件64b係從升降構件62之上表面朝向上方延伸，導引軸64a係從導引止動件64b朝向上方延伸。導引軸64a係插入於朝向上下方向貫通旋轉基座33的貫通孔。導引止動件64b係配置於旋轉基座33之下方。升降構件62之往相對於旋轉基座33之 上方向的移動係藉由導引止動件64b與旋轉基座33之接觸所限制。 The lifting member 62 is disposed below the casing 52. The upper position of the elevating member 62 refers to a position spaced downward from the housing 52. The lifting member 62 is raised and lowered together with the plurality of guide members 64. The guide stopper 64b extends upward from the upper surface of the elevating member 62, and the guide shaft 64a extends upward from the guide stopper 64b. The guide shaft 64a is inserted into a through hole penetrating the rotation base 33 in the vertical direction. The guide stopper 64 b is disposed below the rotation base 33. The upward movement of the elevating member 62 with respect to the rotation base 33 is restricted by the contact between the guide stopper 64b and the rotation base 33.
發熱構件72係由導引軸64a所支撐。發熱構件72係固定於導引軸64a之上端部。發熱構件72係與升降構件62一起升降。夾設於發熱構件72的板狀部72a與旋轉基座33之間的腳部72b(參照圖2)係從發熱構件72中省略。升降構件62、導引構件64及發熱構件72係能夠相對於旋轉基座33朝向上下方向移動。 The heat generating member 72 is supported by the guide shaft 64a. The heat generating member 72 is fixed to an upper end portion of the guide shaft 64a. The heat generating member 72 is raised and lowered together with the raising and lowering member 62. The leg portion 72 b (see FIG. 2) sandwiched between the plate-like portion 72 a of the heat generating member 72 and the rotation base 33 is omitted from the heat generating member 72. The elevating member 62, the guide member 64, and the heat generating member 72 are movable in the vertical direction with respect to the rotation base 33.
發熱構件72係伴隨升降構件62之升降而在上位置(圖11中之二點鏈線所示的位置)與下位置(圖11中之實線所示的位置)之間朝向上下方向移動。在發熱構件72位於上位置時，距離D1係比搬運機器人R1的手部H1之厚度T1(參照圖8A)更短，該距離D1係指從發熱構件72之上表面至由複數個夾盤構件32之夾持部38a所夾持的基板W之下表面為止的距離。與此相反，在發熱構件72位於下位置時，該距離D1係比手部H1之厚度T1更長。 The heating member 72 moves upward and downward between the upper position (the position shown by the two-dot chain line in FIG. 11) and the lower position (the position shown by the solid line in FIG. 11) as the elevating member 62 moves up and down. When the heating element 72 is in the upper position, the distance D1 is shorter than the thickness T1 (see FIG. 8A) of the hand H1 of the transfer robot R1, and the distance D1 is from the upper surface of the heating element 72 to a plurality of chuck members. The distance to the lower surface of the substrate W held by the clamping portion 38a of 32. In contrast, when the heat generating member 72 is in the lower position, the distance D1 is longer than the thickness T1 of the hand H1.
其次，針對在旋轉夾盤31與搬運機器人R1之間的基板W之遞送加以說明。 Next, the transfer of the substrate W between the spin chuck 31 and the transfer robot R1 will be described.
在搬運機器人R1(參照圖3)將基板W置放於複數個夾盤構件32時，升降致動器69係使發熱構件72位於作為退避位置的下位置。之後，旋轉馬達36係使旋轉基座33位於旋轉基座33之旋轉角一致於遞送角度的遞送位置。旋轉基座33之遞送位置係指驅動部56在俯視觀察下重疊於隨動部55的位置。圖12係顯示旋轉基座33位於遞送位置的 狀態。 When the transfer robot R1 (see FIG. 3) places the substrate W on the plurality of chuck members 32, the lifting actuator 69 positions the heat generating member 72 at a lower position as a retreat position. Thereafter, the rotation motor 36 positions the rotation base 33 at a delivery position where the rotation angle of the rotation base 33 coincides with the delivery angle. The delivery position of the rotary base 33 refers to a position where the driving portion 56 overlaps the follower portion 55 in a plan view. Fig. 12 shows a state where the rotary base 33 is located at the delivery position.
罩升降單元29係在旋轉基座33已配置於遞送位置之後，使最上方的防濺罩28A從準備位置下降至解除位置為止。如圖13所示，在防濺罩28A移動至解除位置的方向的過程中，驅動部56會接觸於隨動部55而隨動部55會藉由驅動部56朝向下方按壓。伴之，線圈彈簧51會彈性變形而可動夾盤32a會移動至開啟位置的方向。當防濺罩28A配置於解除位置時，可動夾盤32a就會配置於開啟位置。藉此，全部的可動夾盤32a會配置於開啟位置。 The cover raising and lowering unit 29 lowers the uppermost splash guard 28A from the preparation position to the release position after the rotation base 33 has been disposed at the delivery position. As shown in FIG. 13, during the direction in which the splash guard 28A is moved to the release position, the driving portion 56 contacts the follower portion 55 and the follower portion 55 is pressed downward by the drive portion 56. Accompanying this, the coil spring 51 is elastically deformed and the movable chuck 32a is moved to the direction of the open position. When the splash guard 28A is placed in the released position, the movable chuck 32a is placed in the open position. Thereby, all the movable chucks 32a are arranged in the open position.
搬運機器人R1係在防濺罩28A位於解除位置的狀態下，使手部H1移動至由手部H1所支撐的基板W位於發熱構件72之上方的上位置。之後，搬運機器人R1係使手部H1下降至手部H1不會接觸於發熱構件72及防濺罩28A的下位置為止。在手部H1從上位置下降至下位置的過程中，基板W係置放於複數個夾盤構件32的支撐部38b之上且從手部H1離開。之後，搬運機器人R1係使手部H1從基板W與發熱構件72之間退避開。 The transfer robot R1 moves the hand H1 to an upper position where the substrate W supported by the hand H1 is positioned above the heat generating member 72 with the splash guard 28A in the released position. Thereafter, the transport robot R1 lowers the hand H1 to a position where the hand H1 does not contact the heating member 72 and the splash guard 28A. During the lowering of the hand H1 from the upper position to the lower position, the substrate W is placed on the support portions 38b of the plurality of chuck members 32 and separated from the hand H1. Thereafter, the transfer robot R1 retracts the hand H1 from between the substrate W and the heat generating member 72.
罩升降單元29係在搬運機器人R1的手部H1已從基板W之下方退避開之後，使防濺罩28A從解除位置上升。藉此，隨動部55及驅動部56會相互地離開。伴之，可動夾盤32a係利用線圈彈簧51之復原力移動至原點位置的方向。由於基板W係由複數個支撐部38b所支撐，所以可動夾盤32a不會到達原點位置而是在作為原點位置之前方位置的閉合位置停止。藉此，可動夾盤32a的夾持部38a能 利用線圈彈簧51之復原力壓抵於基板W之外周部。升降致動器69係在手部H1已從發熱構件72之上方退避開之後，使發熱構件72移動至作為鄰近位置的上位置。 The cover raising and lowering unit 29 raises the splash guard 28A from the release position after the hand H1 of the transfer robot R1 has withdrawn from below the substrate W. Thereby, the follower part 55 and the drive part 56 are mutually separated. Accompanying this, the movable chuck 32a is moved in the direction of the origin position by the restoring force of the coil spring 51. Since the substrate W is supported by the plurality of support portions 38b, the movable chuck 32a does not reach the origin position but stops at the closed position which is a position immediately before the origin position. Thereby, the holding portion 38a of the movable chuck 32a can be pressed against the outer peripheral portion of the substrate W by the restoring force of the coil spring 51. The lift actuator 69 moves the heat generating member 72 to an upper position as an adjacent position after the hand H1 has retreated from above the heat generating member 72.
在搬運機器人R1從複數個夾盤構件32取出基板W時，升降致動器69係使發熱構件72位於作為退避位置的下位置，而旋轉馬達36係使旋轉基座33位於遞送位置。罩升降單元29係在驅動部56相對於隨動部55隔出間隔鉛直地相對向的狀態下，使最上方的防濺罩28A下降至解除位置為止。藉此，全部的夾盤構件32之夾持部38a會從基板W之外周部離開，且全部的夾盤構件32之支撐部38b會與基板W之外周部相接觸。 When the transfer robot R1 takes out the substrate W from the plurality of chuck members 32, the lifting actuator 69 sets the heating member 72 to a lower position as a retreat position, and the rotary motor 36 sets the rotary base 33 to a delivery position. The cover raising / lowering unit 29 lowers the uppermost splash guard 28A to the release position in a state where the driving portion 56 is vertically opposed to the follower portion 55 at an interval. Thereby, the clamping portions 38 a of all the chuck members 32 are separated from the outer peripheral portion of the substrate W, and the support portions 38 b of all the chuck members 32 are brought into contact with the outer peripheral portion of the substrate W.
搬運機器人R1係在基板W由複數個夾盤構件32之支撐部38b所支撐的狀態下，將手部H1插入於基板W與發熱構件72之間且使手部H1朝向上方移動。在此過程中，基板W係從全部的夾盤構件32之支撐部38b離開且由搬運機器人R1的手部H1所支撐。之後，罩升降單元29係使防濺罩28A上升且使驅動部56從隨動部55離開。藉此，可動夾盤32a會利用線圈彈簧51之復原力返回至原點位置。 In the state where the substrate W is supported by the support portions 38 b of the plurality of chuck members 32, the transfer robot R1 inserts the hand H1 between the substrate W and the heating member 72 and moves the hand H1 upward. In this process, the substrate W is separated from the support portions 38b of all the chuck members 32 and is supported by the hand H1 of the transfer robot R1. Thereafter, the cover lifting unit 29 raises the splash guard 28A and separates the driving portion 56 from the follower portion 55. Thereby, the movable chuck 32 a is returned to the original position by the restoring force of the coil spring 51.
搬運機器人R1係在基板W由複數個夾盤構件32之支撐部38b所支撐的狀態下，將手部H1插入於基板W與發熱構件72之間。之後，搬運機器人R1係使手部H1朝向上方移動。基板W係在手部H1朝向上方移動時，從全部的夾盤構件32之支撐部38b離開且由手部H1所支撐。之 後，罩升降單元29係使防濺罩28A從解除位置上升且使驅動部56從隨動部55朝向上方離開。藉此，可動夾盤32a會利用線圈彈簧51的復原力返回至原點位置。 The conveyance robot R1 inserts the hand H1 between the substrate W and the heating member 72 in a state where the substrate W is supported by the support portions 38 b of the plurality of chuck members 32. Thereafter, the transfer robot R1 moves the hand H1 upward. When the substrate W is moved upward by the hand H1, it is separated from the support portions 38b of all the chuck members 32 and is supported by the hand H1. Thereafter, the hood raising / lowering unit 29 raises the splash guard 28A from the release position and moves the driving portion 56 upward from the follower portion 55. Thereby, the movable chuck 32 a is returned to the original position by the restoring force of the coil spring 51.
如以上，在本實施形態中，由於罩升降單元29係兼作使可動夾盤32a移動至開啟位置的方向的開啟用之致動器，所以沒有必要設置專用的開啟用之致動器。為此，可以簡化開閉可動夾盤32a的夾盤開閉機構34。更且，由於驅動部56係接觸於隨動部55且按壓隨動部55，所以與利用磁力使可動夾盤32a移動至開啟位置的方向的情況相較，可以使可動夾盤32a確實地移動至開啟位置的方向。 As described above, in this embodiment, since the cover lifting unit 29 serves as an actuator for opening that moves the movable chuck 32a to the open position, it is not necessary to provide a dedicated actuator for opening. For this reason, the chuck opening-closing mechanism 34 which opens and closes the movable chuck 32a can be simplified. Furthermore, since the driving portion 56 is in contact with the follower portion 55 and presses the follower portion 55, the movable chuck 32a can be reliably moved compared to a case where the movable chuck 32a is moved to the open position by magnetic force. Direction to the open position.
在本實施形態中，隨動部55係配置於比朝向包圍基板W之旋轉軸線A1的圓之切線方向延伸的水平之夾盤轉動軸線A2更下方。另一方面，可動夾盤32a之夾持部38a係配置於比夾盤轉動軸線A2更上方。夾持部38a係配置於基板W之周圍。在隨動部55配置於比夾盤轉動軸線A2更上方的情況下，當離心力施加於隨動部55時，就會產生使夾持部38a朝向外側移動之力，換句話說，產生使夾持部38a從基板W之外周部離開之力。相對於此，在隨動部55配置於比夾盤轉動軸線A2更下方的情況下，當離心力施加於隨動部55時，就會產生使夾持部38a朝向內側移動之力，換句話說，產生將夾持部38a壓抵於基板W之外周部之力。為此，可以更確實地夾持基板W。 In this embodiment, the follower portion 55 is disposed below the horizontal chuck rotation axis A2 extending in a tangential direction of a circle surrounding the rotation axis A1 of the substrate W. On the other hand, the clamping portion 38a of the movable chuck 32a is disposed above the chuck rotation axis A2. The clamping portion 38a is arranged around the substrate W. In the case where the follower portion 55 is disposed above the chuck rotation axis A2, when a centrifugal force is applied to the follower portion 55, a force to move the gripping portion 38a to the outside is generated, in other words, a gripper is generated. The force by which the holding portion 38a is separated from the outer peripheral portion of the substrate W. In contrast, when the follower portion 55 is disposed below the chuck rotation axis A2, when a centrifugal force is applied to the follower portion 55, a force to move the gripping portion 38a toward the inside is generated, in other words, A force is generated to press the clamping portion 38a against the outer peripheral portion of the substrate W. For this reason, the substrate W can be more reliably held.
本發明並非被限定於前述的實施形態之內容，而是能 夠進行各種的變更。 The present invention is not limited to the contents of the foregoing embodiments, but can be modified in various ways.
例如，加熱線圈73與旋轉基座33之上下方向的間隔D2既可與加熱線圈73之厚度T2相等，又可比加熱線圈73之厚度T2還寬。 For example, the distance D2 between the heating coil 73 and the rotating base 33 in the up-down direction may be equal to the thickness T2 of the heating coil 73 or wider than the thickness T2 of the heating coil 73.
旋轉基座33之厚度T3既可與加熱線圈73之厚度T2相等，又可比加熱線圈73之厚度T2還大。 The thickness T3 of the rotating base 33 may be equal to the thickness T2 of the heating coil 73 or larger than the thickness T2 of the heating coil 73.
發熱構件72的板狀部72a之厚度既可與旋轉基座33之厚度T3相等，又可比旋轉基座33之厚度T3還大。 The thickness of the plate-like portion 72a of the heating member 72 may be equal to the thickness T3 of the rotation base 33, or may be larger than the thickness T3 of the rotation base 33.
發熱構件72亦可間接地與由複數個夾盤構件32所夾持的基板W相對向。亦即，其他的構件亦可配置於發熱構件72與基板W之間。 The heat generating member 72 may also be indirectly opposed to the substrate W held by the plurality of chuck members 32. That is, other members may be disposed between the heat generating member 72 and the substrate W.
亦可省略變更基板W與發熱構件72之間隔的間隔變更機構61。亦即，可供由複數個夾盤構件32所夾持的基板W配置的夾持位置與發熱構件72之間隔亦可為固定。 The interval changing mechanism 61 that changes the interval between the substrate W and the heat generating member 72 may be omitted. That is, the interval between the chucking position where the substrate W held by the plurality of chuck members 32 can be arranged and the heat generating member 72 may be fixed.
只要夾盤開閉機構34等沒有影響到加熱線圈73以外的構件，亦可省略屏蔽交變磁場的磁屏蔽構件77。 As long as the chuck opening and closing mechanism 34 and the like do not affect members other than the heating coil 73, the magnetic shielding member 77 that shields the alternating magnetic field may be omitted.
控制裝置3亦可為了使發熱構件72之溫度一致於目標溫度，不參照溫度計75的檢測值，而是變更流動於加熱線圈73的交流電流之指令值。亦即，亦可省略溫度計75。 The control device 3 may also change the command value of the AC current flowing through the heating coil 73 without referring to the detection value of the thermometer 75 in order to make the temperature of the heating member 72 coincide with the target temperature. That is, the thermometer 75 may be omitted.
只要沒有必要對基板W之下表面供給處理流體，亦可省略下表面噴嘴16。在此情況下，亦可省略朝向上下方向貫通發熱構件72之中央部的貫通孔。同樣地，亦可省略朝向上下方向貫通旋轉基座33之中央部的貫通孔。 As long as it is not necessary to supply the processing fluid to the lower surface of the substrate W, the lower surface nozzle 16 may be omitted. In this case, a through hole that penetrates the central portion of the heat generating member 72 in the vertical direction may be omitted. Similarly, a through hole penetrating the central portion of the rotary base 33 in the up-down direction may be omitted.
升降驅動單元66的驅動磁鐵68亦可在俯視觀察下為 圓弧狀。在此情況下，升降構件62之升降係在旋轉基座33位於遞送位置(遞送角度)時進行，該遞送位置係指驅動磁鐵68位於隨動磁鐵67之下方的位置。 The driving magnet 68 of the elevating driving unit 66 may be arc-shaped in plan view. In this case, the lifting of the lifting member 62 is performed when the rotary base 33 is located at a delivery position (delivery angle), which refers to a position where the drive magnet 68 is located below the follower magnet 67.
在前述的基板W之處理之一例中，雖然已針對執行第一加熱工序(圖9的步驟S3)及第二加熱工序(圖9的步驟S8)之雙方的情況加以說明，但是亦可省略第一加熱工序及第二加熱工序之一方。 In the aforementioned example of the processing of the substrate W, although the case where both the first heating step (step S3 in FIG. 9) and the second heating step (step S8 in FIG. 9) is performed has been described, the first One of the first heating process and the second heating process.
在第一實施形態中，只要隨動部55及驅動部56係處於朝向旋轉方向相互地相對向的位置關係，則隨動部55既可從旋轉基座33朝向外側突出，又可不從旋轉基座33朝向外側突出。 In the first embodiment, as long as the follower portion 55 and the drive portion 56 are in a positional relationship facing each other in the direction of rotation, the follower portion 55 may protrude outward from the rotation base 33 or not from the rotation base. The seat 33 projects outward.
在第一實施形態中，亦可使發熱構件72升降來取代夾盤構件32。在此情況下，可動夾盤32a係能夠繞著鉛直之夾盤轉動軸線A2轉動地保持於旋轉基座33。固定夾盤32b係固定於旋轉基座33。 In the first embodiment, the heat generating member 72 may be raised and lowered instead of the chuck member 32. In this case, the movable chuck 32a is held on the rotation base 33 so as to be rotatable about a vertical chuck rotation axis A2. The fixed chuck 32 b is fixed to the rotation base 33.
在第二實施形態中，隨動部55亦可配置於比夾盤轉動軸線A2更上方。 In the second embodiment, the follower portion 55 may be disposed above the chuck rotation axis A2.
亦可從夾盤構件32中省略支撐部38b。在此情況下，只要能在搬運機器人R1的手部H1與夾盤構件32的夾持部38a之間直接進行基板W之遞送即可。 The support portion 38 b may be omitted from the chuck member 32. In this case, it suffices that the substrate W can be directly delivered between the hand H1 of the transfer robot R1 and the clamping portion 38 a of the chuck member 32.
亦可省略IH加熱機構71。 The IH heating mechanism 71 may be omitted.
基板處理裝置1亦可為處理多角形之基板W的裝置。 The substrate processing apparatus 1 may be an apparatus for processing a polygonal substrate W.
亦可組合前述之全部的構成之二個以上。 It is also possible to combine two or more of all the aforementioned structures.
本申請案係對應於2016年9月23日在日本特許廳所 提出的特願2016-186147號，本申請案的全部揭示係藉由引用而編入於此。 This application corresponds to Japanese Patent Application No. 2016-186147 filed at the Japan Patent Office on September 23, 2016, and the entire disclosure of this application is incorporated herein by reference.
雖然已針對本發明之實施形態加以詳細說明，但是此等只不過是為了明確本發明之技術內容所用的具體例，本發明不應被限定於此等的具體例來解釋，本發明的精神及範圍係僅藉由所附的申請專利範圍所界定。 Although the embodiments of the present invention have been described in detail, these are only specific examples used to clarify the technical content of the present invention, and the present invention should not be limited to these specific examples for explanation. The spirit of the present invention and The scope is defined solely by the scope of the attached patent application.
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| JP2016186147A JP6789048B2 (en) | 2016-09-23 | 2016-09-23 | Board processing equipment |
| JP2016-186147 | 2016-09-23 |
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| TW201814809A true TW201814809A (en) | 2018-04-16 |
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| TWI692059B (en) * | 2018-01-19 | 2020-04-21 | 韓商賽米克斯股份有限公司 | Wafer prober |
| TWI762745B (en) * | 2018-10-16 | 2022-05-01 | 大陸商瀋陽芯源微電子設備股份有限公司 | A substrate holding table |
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| JP2022143176A (en) * | 2021-03-17 | 2022-10-03 | 芝浦メカトロニクス株式会社 | Measurement tool, substrate processing apparatus and substrate manufacturing method |
| CN113467199B (en) * | 2021-09-06 | 2021-11-12 | 宁波润华全芯微电子设备有限公司 | Device convenient to dismantle and capable of preventing wafer from being polluted by splashing liquid |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS63153839A (en) * | 1986-08-13 | 1988-06-27 | Dainippon Screen Mfg Co Ltd | Rotary holding device for substrate |
| JP2891894B2 (en) | 1995-03-30 | 1999-05-17 | 大陽東洋酸素株式会社 | Substrate rotating device |
| JP3322630B2 (en) * | 1998-03-03 | 2002-09-09 | 東京エレクトロン株式会社 | Rotary processing device |
| JP3657173B2 (en) * | 2000-06-02 | 2005-06-08 | 株式会社荏原製作所 | Substrate plating equipment |
| JP4050505B2 (en) * | 2001-12-07 | 2008-02-20 | 芝浦メカトロニクス株式会社 | Spin processing apparatus and processing method |
| US20080110861A1 (en) * | 2004-02-24 | 2008-05-15 | Shinji Kajita | Substrate Processing Apparatus and Method |
| JP2007335709A (en) * | 2006-06-16 | 2007-12-27 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus |
| DE112011102705A5 (en) * | 2010-08-13 | 2013-05-29 | Tesa Se | Method for encapsulating an electronic device |
| WO2015115239A1 (en) * | 2014-01-28 | 2015-08-06 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing device |
| JP2016072428A (en) * | 2014-09-30 | 2016-05-09 | 株式会社ディスコ | Holding method for wafer |
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| TWI692059B (en) * | 2018-01-19 | 2020-04-21 | 韓商賽米克斯股份有限公司 | Wafer prober |
| TWI762745B (en) * | 2018-10-16 | 2022-05-01 | 大陸商瀋陽芯源微電子設備股份有限公司 | A substrate holding table |
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