HK1161504A1 - 用於製造電子設備外殼的方法 - Google Patents

用於製造電子設備外殼的方法

Info

Publication number
HK1161504A1
HK1161504A1 HK12101583.7A HK12101583A HK1161504A1 HK 1161504 A1 HK1161504 A1 HK 1161504A1 HK 12101583 A HK12101583 A HK 12101583A HK 1161504 A1 HK1161504 A1 HK 1161504A1
Authority
HK
Hong Kong
Prior art keywords
manufacturing
electronic device
device enclosure
enclosure
electronic
Prior art date
Application number
HK12101583.7A
Other languages
English (en)
Inventor
．肯尼
Original Assignee
蘋果公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 蘋果公司 filed Critical 蘋果公司
Publication of HK1161504A1 publication Critical patent/HK1161504A1/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B29C45/0055—Shaping
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3475—Displays, monitors, TV-sets, computer screens

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
HK12101583.7A 2010-01-25 2012-02-17 用於製造電子設備外殼的方法 HK1161504A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/692,803 US8511498B2 (en) 2010-01-25 2010-01-25 Method for manufacturing an electronic device enclosure

Publications (1)

Publication Number Publication Date
HK1161504A1 true HK1161504A1 (zh) 2012-08-24

Family

ID=44308194

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12101583.7A HK1161504A1 (zh) 2010-01-25 2012-02-17 用於製造電子設備外殼的方法

Country Status (4)

Country Link
US (1) US8511498B2 (zh)
CN (1) CN102159045B (zh)
HK (1) HK1161504A1 (zh)
TW (1) TWI484320B (zh)

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Also Published As

Publication number Publication date
CN102159045B (zh) 2015-09-09
CN102159045A (zh) 2011-08-17
TWI484320B (zh) 2015-05-11
US8511498B2 (en) 2013-08-20
US20110180557A1 (en) 2011-07-28
TW201200994A (en) 2012-01-01

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20230125