PL2465149T3 - Sposób hermetyzacji układu elektronicznego - Google Patents

Sposób hermetyzacji układu elektronicznego

Info

Publication number
PL2465149T3
PL2465149T3 PL10737333T PL10737333T PL2465149T3 PL 2465149 T3 PL2465149 T3 PL 2465149T3 PL 10737333 T PL10737333 T PL 10737333T PL 10737333 T PL10737333 T PL 10737333T PL 2465149 T3 PL2465149 T3 PL 2465149T3
Authority
PL
Poland
Prior art keywords
encapsulating
electronic arrangement
electronic
arrangement
Prior art date
Application number
PL10737333T
Other languages
English (en)
Inventor
Alexander Steen
Thorsten Krawinkel
KLAUS KEITE-TELGENBüSCHER
Jan Ellinger
Original Assignee
Tesa Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa Se filed Critical Tesa Se
Publication of PL2465149T3 publication Critical patent/PL2465149T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electroluminescent Light Sources (AREA)
  • Photovoltaic Devices (AREA)
PL10737333T 2009-08-12 2010-07-30 Sposób hermetyzacji układu elektronicznego PL2465149T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009036970A DE102009036970A1 (de) 2009-08-12 2009-08-12 Verfahren zur Kapselung einer elektronischen Anordnung
PCT/EP2010/061095 WO2011018358A1 (de) 2009-08-12 2010-07-30 Verfahren zur kapselung einer elektronischen anordnung
EP10737333.4A EP2465149B1 (de) 2009-08-12 2010-07-30 Verfahren zur kapselung einer elektronischen anordnung

Publications (1)

Publication Number Publication Date
PL2465149T3 true PL2465149T3 (pl) 2014-06-30

Family

ID=43012701

Family Applications (1)

Application Number Title Priority Date Filing Date
PL10737333T PL2465149T3 (pl) 2009-08-12 2010-07-30 Sposób hermetyzacji układu elektronicznego

Country Status (9)

Country Link
US (1) US8771459B2 (pl)
EP (1) EP2465149B1 (pl)
JP (1) JP5634518B2 (pl)
KR (1) KR101759980B1 (pl)
CN (1) CN102576822B (pl)
DE (1) DE102009036970A1 (pl)
PL (1) PL2465149T3 (pl)
TW (1) TWI493004B (pl)
WO (1) WO2011018358A1 (pl)

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DE102014207837A1 (de) 2014-04-25 2015-10-29 Tesa Se Dünnglasverbund und Verfahren zur Lagerung von Dünnglas
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DE102015202415B4 (de) * 2015-02-11 2021-02-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Klebstoff, Bauteil, Verfahren zur berührungslosen Temperaturmessung des Klebstoffs, Verfahren zur verbesserten Verbindung zweier Bauteile mit dem Klebstoff und Verwendung des Klebstoffs
FR3041970B1 (fr) * 2015-10-05 2019-09-06 Arkema France Encapsulation de dispositifs electroniques flexibles, avec un adhesif incluant des particules extra-fines ameliorant la protection contre la permeabilite aux gaz
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Also Published As

Publication number Publication date
US8771459B2 (en) 2014-07-08
EP2465149A1 (de) 2012-06-20
CN102576822A (zh) 2012-07-11
EP2465149B1 (de) 2014-01-22
US20110036623A1 (en) 2011-02-17
WO2011018358A1 (de) 2011-02-17
KR20120058545A (ko) 2012-06-07
TWI493004B (zh) 2015-07-21
JP2013502028A (ja) 2013-01-17
JP5634518B2 (ja) 2014-12-03
KR101759980B1 (ko) 2017-07-20
CN102576822B (zh) 2015-08-19
DE102009036970A1 (de) 2011-02-17
TW201109401A (en) 2011-03-16

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