PL2279537T3 - Metoda hermetyzacji układu elektronicznego - Google Patents

Metoda hermetyzacji układu elektronicznego

Info

Publication number
PL2279537T3
PL2279537T3 PL09756304T PL09756304T PL2279537T3 PL 2279537 T3 PL2279537 T3 PL 2279537T3 PL 09756304 T PL09756304 T PL 09756304T PL 09756304 T PL09756304 T PL 09756304T PL 2279537 T3 PL2279537 T3 PL 2279537T3
Authority
PL
Poland
Prior art keywords
encapsulating
electronic circuit
electronic
circuit
Prior art date
Application number
PL09756304T
Other languages
English (en)
Inventor
Thorsten Krawinkel
KLAUS KEITE-TELGENBüSCHER
Jan Ellinger
Alexander Steen
Original Assignee
Tesa Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa Se filed Critical Tesa Se
Publication of PL2279537T3 publication Critical patent/PL2279537T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/005—Modified block copolymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Electroluminescent Light Sources (AREA)
PL09756304T 2008-12-03 2009-11-18 Metoda hermetyzacji układu elektronicznego PL2279537T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008060113A DE102008060113A1 (de) 2008-12-03 2008-12-03 Verfahren zur Kapselung einer elektronischen Anordnung
EP09756304.3A EP2279537B1 (de) 2008-12-03 2009-11-18 Verfahren zur kapselung einer elektronischen anordnung
PCT/EP2009/065393 WO2010063579A1 (de) 2008-12-03 2009-11-18 Verfahren zur kapselung einer elektronischen anordnung

Publications (1)

Publication Number Publication Date
PL2279537T3 true PL2279537T3 (pl) 2015-10-30

Family

ID=41530580

Family Applications (1)

Application Number Title Priority Date Filing Date
PL09756304T PL2279537T3 (pl) 2008-12-03 2009-11-18 Metoda hermetyzacji układu elektronicznego

Country Status (9)

Country Link
US (1) US8460969B2 (pl)
EP (1) EP2279537B1 (pl)
JP (2) JP6074141B2 (pl)
KR (1) KR101660817B1 (pl)
CN (1) CN102132439B (pl)
DE (1) DE102008060113A1 (pl)
PL (1) PL2279537T3 (pl)
TW (1) TWI488242B (pl)
WO (1) WO2010063579A1 (pl)

Families Citing this family (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009018518A1 (de) 2009-04-24 2010-10-28 Tesa Se Transparente Barrierelaminate
DE102009036970A1 (de) 2009-08-12 2011-02-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
TW201130944A (en) * 2009-11-18 2011-09-16 3M Innovative Properties Co Flexible assembly and method of making and using the same
KR20120008359A (ko) * 2010-07-16 2012-01-30 삼성모바일디스플레이주식회사 봉지 기판 및 유기 발광부 사이에 ｕｖ 차단 성능 등을 가지는 층을 포함하는 유기 발광 소자
CN103270618B (zh) 2010-08-13 2016-08-10 德莎欧洲公司 封装电子装置的方法
US20130209800A1 (en) * 2010-09-07 2013-08-15 Lintec Corporation Adhesive sheet and electronic device
DE102010062823A1 (de) 2010-12-10 2012-06-21 Tesa Se Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung
JP6225025B2 (ja) * 2011-08-03 2017-11-01 リンテック株式会社 ガスバリア性粘着シート、その製造方法、並びに電子部材及び光学部材
DE102011080724A1 (de) 2011-08-10 2013-02-14 Tesa Se Elektrisch leitfähige hitzeaktivierbare Klebemasse
DE102011080729A1 (de) 2011-08-10 2013-02-14 Tesa Se Elektrisch leitfähige Haftklebemasse und Haftklebeband
DE102012202377A1 (de) 2011-10-21 2013-04-25 Tesa Se Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung
DE102011085034A1 (de) * 2011-10-21 2013-04-25 Tesa Se Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung
WO2013108731A1 (ja) * 2012-01-16 2013-07-25 味の素株式会社 封止用樹脂組成物
DE102012206273A1 (de) 2012-04-17 2013-10-17 Tesa Se Vernetzbare Klebmasse mit Hart- und Weichblöcken als Permeantenbarriere
DE102012211335A1 (de) 2012-06-29 2014-01-02 Tesa Se Klebeband für die Kapselung einer organischen elektronischen Anordnung
DE102012219877A1 (de) 2012-08-24 2014-02-27 Tesa Se Haftklebemasse insbesondere zur Kapselung einer elektronischen Anordnung
CN104718263B (zh) * 2012-10-29 2017-11-10 琳得科株式会社 粘合剂组合物及粘合片
US9809728B2 (en) * 2012-11-30 2017-11-07 Lintec Corporation Adhesive agent composition, adhesive sheet, and electronic device and production method therefor
KR102115144B1 (ko) * 2012-11-30 2020-05-26 린텍 가부시키가이샤 접착제 조성물, 접착 시트 및 전자 디바이스
DE102013202473A1 (de) 2013-02-15 2014-08-21 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
TW201436855A (zh) 2012-12-21 2014-10-01 Tesa Se 從平面結構物移除滲透物的方法
DE102012224310A1 (de) 2012-12-21 2014-06-26 Tesa Se Gettermaterial enthaltendes Klebeband
DE102012224319A1 (de) 2012-12-21 2014-06-26 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
DE102013011074A1 (de) * 2013-07-03 2015-01-08 Oerlikon Trading Ag An eine indirekte Kühlvorrichtung angepasstes Target mit Kühlplatte
KR101758418B1 (ko) 2013-08-27 2017-07-14 주식회사 엘지화학 내구성이 우수한 고무계 점착제 조성물
KR102100767B1 (ko) * 2013-11-26 2020-04-21 엘지디스플레이 주식회사 유기발광 표시장치 및 그 제조방법
KR20160113112A (ko) * 2013-12-12 2016-09-28 나노포토니카, 인크. 퀀텀닷 발광다이오드의 긍정적 효율의 에이징과 안정화를 촉진시키는 방법 및 구조
US20150185142A1 (en) * 2013-12-30 2015-07-02 Shenzhen China Star Optoelectronics Technology Co. Ltd. OLED Panel And Manufacturing Method Thereof And Method For Inspecting Packaging Effectiveness
DE102014200948A1 (de) 2014-01-20 2015-07-23 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
KR20150097359A (ko) * 2014-02-18 2015-08-26 주식회사 엘지화학 봉지 필름 및 이를 포함하는 유기전자장치
WO2015129625A1 (ja) * 2014-02-25 2015-09-03 リンテック株式会社 接着剤組成物、接着シート及び電子デバイス
WO2015145422A1 (en) 2014-03-26 2015-10-01 Scr Engineers Ltd Livestock location system
JP6137491B2 (ja) * 2014-03-31 2017-05-31 王子ホールディングス株式会社 タイヤ用粘着シート
DE102014207074A1 (de) 2014-04-11 2015-10-15 Tesa Se Klebeband für die Kapselung einer organischen elektronischen Anordnung
DE102014207837A1 (de) 2014-04-25 2015-10-29 Tesa Se Dünnglasverbund und Verfahren zur Lagerung von Dünnglas
DE102014207792A1 (de) 2014-04-25 2015-10-29 Tesa Se Dünnglasverbund und Verfahren zum Lagern einer Dünnglasfolie
DE102014208109A1 (de) 2014-04-29 2015-10-29 Tesa Se Spaltbares Klebend mit dosierfähigen spaltbaren Flüssigklebstoff
DE102014208111A1 (de) 2014-04-29 2015-10-29 Tesa Se Verfahren zur Herstellung einer Verklebung auf Permeat sensiblen Oberflächen
JP6487633B2 (ja) * 2014-05-30 2019-03-20 綜研化学株式会社 粘着剤組成物及びその製造方法、ならびに、粘着剤層及びその製造方法
TWI679259B (zh) * 2014-08-11 2019-12-11 德商漢高智慧財產控股公司 光學透明的熱熔黏著劑及其用途
US11071279B2 (en) 2014-09-05 2021-07-27 Intervet Inc. Method and system for tracking health in animal populations
US10986817B2 (en) 2014-09-05 2021-04-27 Intervet Inc. Method and system for tracking health in animal populations
JP6474489B2 (ja) * 2014-10-29 2019-02-27 テーザ・ソシエタス・ヨーロピア 活性化可能なゲッター材料を含む接着剤
US10626305B2 (en) 2014-10-29 2020-04-21 Tesa Se OLED-compatible adhesive masses having silane water scavengers
CN104460081A (zh) * 2014-12-10 2015-03-25 深圳市华星光电技术有限公司 一种液晶显示器和用于其的双面胶带
DE102015202415B4 (de) * 2015-02-11 2021-02-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Klebstoff, Bauteil, Verfahren zur berührungslosen Temperaturmessung des Klebstoffs, Verfahren zur verbesserten Verbindung zweier Bauteile mit dem Klebstoff und Verwendung des Klebstoffs
US10082734B2 (en) * 2015-02-13 2018-09-25 Taiwan Semiconductor Manufacturing Company, Ltd. Composition and method for lithography patterning
US10357020B2 (en) * 2015-04-13 2019-07-23 Tadbik Advanced Technologies Ltd (Tat) Livestock display tag
CN104834113B (zh) * 2015-04-29 2018-01-16 武汉华星光电技术有限公司 一种窄边框液晶显示模组
DE102015212058A1 (de) 2015-06-29 2016-12-29 Tesa Se Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung
DE102016213840A1 (de) 2016-07-27 2018-02-01 Tesa Se Klebeband zur Verkapselung elektronischer Aufbauten
DE102016213911A1 (de) 2016-07-28 2018-02-01 Tesa Se OLED kompatible Klebemassen mit cyclischen Azasilanwasserfängern
WO2018061003A1 (en) 2016-09-28 2018-04-05 Scr Engineers Ltd Holder for a smart monitoring tag for cows
JP6393362B1 (ja) * 2017-04-25 2018-09-19 住友化学株式会社 有機デバイスの製造方法
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films
WO2018204693A2 (en) * 2017-05-05 2018-11-08 3M Innovative Properties Company Polymeric films and display devices containing such films
CN107275515B (zh) * 2017-06-20 2019-12-03 深圳市华星光电技术有限公司 Oled器件封装方法、结构、oled器件及显示屏
US20200243803A1 (en) * 2017-08-02 2020-07-30 Sumitomo Chemical Company, Limited Method for manufacturing organic device, and organic device
CN107819073B (zh) * 2017-10-26 2020-01-17 武汉华星光电半导体显示技术有限公司 基板及oled器件的制作方法
DE102017219310A1 (de) 2017-10-27 2019-05-02 Tesa Se Plasmarandverkapselung von Klebebändern
DE102018202545A1 (de) 2018-02-20 2019-08-22 Tesa Se Zusammensetzung zur Erzeugung einer Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung
WO2019209712A1 (en) 2018-04-22 2019-10-31 Vence, Corp. Livestock management system and method
DE102018208168A1 (de) 2018-05-24 2019-11-28 Tesa Se Kombination einer transparenten vollflächigen Verkapselung mit einer (intransparenten) Randverkapselung mit hohem Gettergehalt
EP3820920B1 (en) 2018-07-12 2025-05-14 3M Innovative Properties Company Composition comprising styrene isobutylene block copolymer and ethylenically unsaturated monomer
FR3086837B1 (fr) 2018-10-03 2021-06-18 Allflex Europe Pince pour la manipulation d’un dispositif d’identification d’un animal et/ou de prelevement d’un tissu d’un animal comprenant des moyens de maintien a moyens d’actionnement deportes
CN109301087B (zh) * 2018-10-08 2020-08-18 京东方科技集团股份有限公司 封装结构、电子装置及封装方法
BR112021006730A8 (pt) 2018-10-10 2022-09-13 Scr Eng Ltd Método e dispositivo de secagem de animais de pecuária
KR102640257B1 (ko) 2018-11-08 2024-02-26 엘지디스플레이 주식회사 표시패널
BR112021015541A2 (pt) 2019-02-08 2022-01-11 Allflex Australia Pty Ltd Leitor de etiqueta eletrônica de animal
CA3129163A1 (en) 2019-02-08 2020-08-13 Allflex Australia Pty Ltd Determining the location of an animal
BR112021015513A2 (pt) 2019-02-08 2021-10-19 Allflex Australia Pty Ltd Sincronização de leitor de tag de identificação eletrônica de animais
CN115210005B (zh) 2019-08-28 2024-04-23 Scr工程有限公司 流体分析设备
USD990063S1 (en) 2020-06-18 2023-06-20 S.C.R. (Engineers) Limited Animal ear tag
IL275518B (en) 2020-06-18 2021-10-31 Scr Eng Ltd Animal tag
IL275812B (en) 2020-07-01 2022-01-01 Scr Eng Ltd System and method for placing devices
KR20220030512A (ko) * 2020-09-02 2022-03-11 삼성디스플레이 주식회사 전자 장치
CA3200086A1 (en) 2020-11-25 2022-06-02 Identigen Limited A system and method for tracing members of an animal population
IL280374B2 (en) 2021-01-24 2023-11-01 Scr Eng Ltd System and method for controlling animal marking
CA206747S (en) 2021-04-08 2024-12-30 Chevillot Sas Tag applicator for animals
CA206812S (en) 2021-04-08 2023-04-11 Chevillot Sas Tag applicator for animals
US12402596B2 (en) 2022-05-03 2025-09-02 S.C.R. (Engineers) Limited Milk channel and feed inlet coupled thereto, and system and method for conserving wash fluid in a washing process for cleaning a milkmeter system

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4010140A (en) * 1974-10-02 1977-03-01 The Goodyear Tire & Rubber Company Age resistant resin compositions and admixtures useful as adhesives
US4051195A (en) 1975-12-15 1977-09-27 Celanese Polymer Specialties Company Polyepoxide-polyacrylate ester compositions
GB1552046A (en) 1977-02-02 1979-09-05 Ciba Geigy Ag Film adhesives
US4985499A (en) 1988-02-22 1991-01-15 Kuraray Company Ltd. Pressure sensitive adhesive composition
JPH01225656A (ja) * 1988-03-07 1989-09-08 Japan Synthetic Rubber Co Ltd 熱可塑性重合体組成物
JPH0757865B2 (ja) * 1990-10-05 1995-06-21 日本ゼオン株式会社 粘着剤組成物
DE69627715T2 (de) 1996-11-12 2004-03-04 Minnesota Mining And Manufacturing Co., St. Paul Ein thermostatoplastischer vorläufer für einen druckempfindlichen klebstoff
JP2000038460A (ja) * 1998-05-20 2000-02-08 Kanegafuchi Chem Ind Co Ltd シ―ト材料
JP2000080339A (ja) * 1998-05-20 2000-03-21 Kanegafuchi Chem Ind Co Ltd 粘着剤組成物
JP2000144087A (ja) * 1998-08-31 2000-05-26 Kanegafuchi Chem Ind Co Ltd 粘着剤組成物及び粘着剤製品
JP5057626B2 (ja) 2000-06-01 2012-10-24 クレイトン・ポリマーズ・リサーチ・ベー・ベー アルミニウムアセチルアセトナートで架橋された官能化ブロック共重合体を含む組成物
DE10048059A1 (de) * 2000-09-28 2002-04-18 Henkel Kgaa Klebstoff mit Barriereeigenschaften
JP2002169291A (ja) 2000-12-04 2002-06-14 Canon Inc 感光性樹脂組成物、レジスト組成物、パターン形成方法およびデバイス
US20020188053A1 (en) 2001-06-04 2002-12-12 Sipix Imaging, Inc. Composition and process for the sealing of microcups in roll-to-roll display manufacturing
EP1412409A1 (en) 2001-08-03 2004-04-28 Dsm N.V. Curable compositions for display devices
US6936131B2 (en) 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
AU2003261188A1 (en) 2002-07-24 2004-02-09 Adhesives Research, Inc. Transformable pressure sensitive adhesive tape and use thereof in display screens
JP4230240B2 (ja) * 2003-02-14 2009-02-25 株式会社クラレ 固体高分子型燃料電池用シール材
JP2005105164A (ja) * 2003-09-30 2005-04-21 Kaneka Corp 樹脂組成物からなる成形体および改質剤
CA2539719A1 (en) * 2003-10-02 2005-04-14 Kaneka Corporation Sealing material for double-glazing pane comprising resin composition with excellent gas-barrier property and hot-melt tackiness
WO2005093005A1 (ja) * 2004-03-26 2005-10-06 Kaneka Corporation シール材組成物
KR100606605B1 (ko) * 2004-08-13 2006-07-28 도레이새한 주식회사 광학용 감압성 접착제 조성물
WO2006075383A1 (ja) * 2005-01-14 2006-07-20 Nichiban Company Limited 表面保護シート
JP2006273705A (ja) * 2005-03-30 2006-10-12 Kaneka Corp 複層ガラス
US20080214717A1 (en) * 2005-06-07 2008-09-04 Kaneka Corpation Resin Composition
US20070135552A1 (en) 2005-12-09 2007-06-14 General Atomics Gas barrier
JP2007197517A (ja) 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機ｅｌ素子
JP2007314653A (ja) * 2006-05-25 2007-12-06 Kaneka Corp 粘着剤組成物およびマスキングテープ
DE102006037627A1 (de) * 2006-08-10 2008-02-14 Tesa Ag Selbstklebemasse aus hydrierten Blockcopolymeren und daraus hergestellte Schutzfolie für glatte und raue Oberflächen
DE102006037625A1 (de) * 2006-08-10 2008-02-14 Tesa Ag Selbstklebemasse aus hydrierten Blockcopolymeren und daraus hergestellte Schutzfolie für glatte Oberflächen
JP2008248055A (ja) * 2007-03-30 2008-10-16 Kaneka Corp シール材用組成物及びシール材
JP2009096839A (ja) * 2007-10-15 2009-05-07 Three Bond Co Ltd 光硬化性シール剤およびシール層付き部材の製造方法
CN102083930B (zh) * 2008-06-02 2013-12-11 3M创新有限公司 粘合剂封装组合物以及用其制备的电子器件
DE102008047964A1 (de) * 2008-09-18 2010-03-25 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung

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TW201025465A (en) 2010-07-01
CN102132439A (zh) 2011-07-20
KR101660817B1 (ko) 2016-09-28
TWI488242B (zh) 2015-06-11
EP2279537A1 (de) 2011-02-02
WO2010063579A1 (de) 2010-06-10
US20110121356A1 (en) 2011-05-26
JP2012510546A (ja) 2012-05-10
JP2017052964A (ja) 2017-03-16
KR20110103838A (ko) 2011-09-21
CN102132439B (zh) 2014-11-26
US8460969B2 (en) 2013-06-11
DE102008060113A1 (de) 2010-07-29
JP6074141B2 (ja) 2017-02-01
EP2279537B1 (de) 2015-06-03
JP6407940B2 (ja) 2018-10-17

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