JP6470409B2 - シラン系水捕捉剤を含むoled適合接着剤 - Google Patents
シラン系水捕捉剤を含むoled適合接着剤 Download PDFInfo
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- JP6470409B2 JP6470409B2 JP2017523285A JP2017523285A JP6470409B2 JP 6470409 B2 JP6470409 B2 JP 6470409B2 JP 2017523285 A JP2017523285 A JP 2017523285A JP 2017523285 A JP2017523285 A JP 2017523285A JP 6470409 B2 JP6470409 B2 JP 6470409B2
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- JVBXVOWTABLYPX-UHFFFAOYSA-L sodium dithionite Chemical compound [Na+].[Na+].[O-]S(=O)S([O-])=O JVBXVOWTABLYPX-UHFFFAOYSA-L 0.000 description 1
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- 229910000104 sodium hydride Inorganic materials 0.000 description 1
- DVQHRBFGRZHMSR-UHFFFAOYSA-N sodium methyl 2,2-dimethyl-4,6-dioxo-5-(N-prop-2-enoxy-C-propylcarbonimidoyl)cyclohexane-1-carboxylate Chemical compound [Na+].C=CCON=C(CCC)[C-]1C(=O)CC(C)(C)C(C(=O)OC)C1=O DVQHRBFGRZHMSR-UHFFFAOYSA-N 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
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- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229910000348 titanium sulfate Inorganic materials 0.000 description 1
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- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- KAKQVSNHTBLJCH-UHFFFAOYSA-N trifluoromethanesulfonimidic acid Chemical compound NS(=O)(=O)C(F)(F)F KAKQVSNHTBLJCH-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
- DCDZBASUOMHACN-UHFFFAOYSA-N tris(2-dodecylphenyl)sulfanium Chemical compound CCCCCCCCCCCCC1=CC=CC=C1[S+](C=1C(=CC=CC=1)CCCCCCCCCCCC)C1=CC=CC=C1CCCCCCCCCCCC DCDZBASUOMHACN-UHFFFAOYSA-N 0.000 description 1
- ULNJZOIDTANZKR-UHFFFAOYSA-N tris[4-(4-acetylphenyl)sulfanylphenyl]sulfanium Chemical compound C1=CC(C(=O)C)=CC=C1SC1=CC=C([S+](C=2C=CC(SC=3C=CC(=CC=3)C(C)=O)=CC=2)C=2C=CC(SC=3C=CC(=CC=3)C(C)=O)=CC=2)C=C1 ULNJZOIDTANZKR-UHFFFAOYSA-N 0.000 description 1
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- 239000002759 woven fabric Substances 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F287/00—Macromolecular compounds obtained by polymerising monomers on to block polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
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- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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Description
溶解度項Sは、主として、浸透物に対するバリア接着剤の親和力を表している。水蒸気の場合は、例えば疎水性材料によって低いS値が達成される。拡散項Dは、バリア材料中での浸透物の可動性に関する尺度であり、分子の可動性または自由体積のような特性に直接的に左右される。強架橋された材料または高結晶質の材料ではしばしば比較的低いD値が達成される。しかしながら高結晶質の材料は一般的にあまり透明ではなく、比較的強い架橋は柔軟性を相対的に低くする。浸透性Pは、通常は分子の可動性が増すとともに上昇し、例えば温度が上昇する場合またはガラス転移点を超える場合にも上昇する。
・Rはアルキル残基またはアリール残基であり、この際エチルが特に好ましく、
・Xは、グリシジルもしくはエポキシシクロヘキシル基を持つ残基、アクリレートまたはメタクリレートであり、そして
・Zは、アルキル基もしくはアリール基またはアルコキシ基であり、
ここで、残基Zは同一かまたは異なることができる。
・スルホニウム塩(例えばUS4,231,951A(特許文献9)、US4,256,828A(特許文献10)、US4,058,401A(特許文献11)、US4,138,255A(特許文献12)、およびUS2010/063221A1(特許文献13)を参照)、
例えばトリフェニルスルホニウムヘキサフルオロアルセネート、トリフェニルスルホニウムヘキサフルオロボレート、トリフェニルスルホニウムテトラフルオロボレート、トリフェニルスルホニウムテトラキス(ペンタフルオロベンジル)ボレート、メチルジフェニルスルホニウムテトラフルオロボレート、メチルジフェニルスルホニウムテトラキス(ペンタフルオロベンジル)ボレート、ジメチルフェニルスルホニウムヘキサフルオロホスフェート、トリフェニルスルホニウムヘキサフルオロホスフェート、トリフェニルスルホニウムヘキサフルオロアンチモネート、ジフェニルナフチルスルホニウムヘキサフルオロアルセネート、トリトリルスルホニウムヘキサフルオロホスフェート、アニシルジフェニルスルホニウムヘキサフルオロアンチモネート、4−ブトキシフェニルジフェニルスルホニウムテトラフルオロボレート、4−クロロフェニルジフェニルスルホニウムヘキサフルオロアンチモネート、トリス(4−フェノキシフェニル)スルホニウムヘキサフルオロホスフェート、ジ(4−エトキシフェニル)メチルスルホニウムヘキサフルオロアルセネート、4−アセチルフェニルジフェニルスルホニウムテトラフルオロボレート、4−アセチルフェニルジフェニルスルホニウムテトラキス(ペンタフルオロベンジル)ボレート、トリス(4−チオメトキシフェニル)スルホニウムヘキサフルオロホスフェート、ジ(メトキシスルホニルフェニル)メチルスルホニウムヘキサフルオロアンチモネート、ジ(メトキシナフチル)メチルスルホニウムテトラフルオロボレート、ジ(メトキシナフチル)メチルスルホニウムテトラキス(ペンタフルオロベンジル)ボレート、ジ(カルボメトキシフェニル)メチルスルホニウムヘキサフルオロホスフェート、(4−オクチルオキシフェニル)ジフェニルスルホニウムテトラキス(3,5−ビス−トリフルオロメチルフェニル)ボレート、トリス[4−(4−アセチルフェニル)チオフェニル]スルホニウムテトラキス(ペンタフルオロフェニル)ボレート、トリス(ドデシルフェニル)スルホニウムテトラキス(3,5−ビス−トリフルオロメチルフェニル)ボレート、4−アセトアミドフェニルジフェニルスルホニウムテトラフルオロボレート、4−アセトアミドフェニルジフェニルスルホニウムテトラキス(ペンタフルオロベンジル)ボレート、ジメチルナフチルスルホニウムヘキサフルオロホスフェート、トリフルオロメチルジフェニルスルホニウムテトラフルオロボレート、トリフルオロメチルジフェニルスルホニウムテトラキス(ペンタフルオロベンジル)ボレート、フェニルメチルベンジルスルホニウムヘキサフルオロホスフェート、5−メチルチアントレニウムヘキサフルオロホスフェート、10−フェニル−9,9−ジメチルチオキサンテニウムヘキサフルオロホスフェート、10−フェニル−9−オキソチオキサンテニウムテトラフルオロボレート、10−フェニル−9−オキソチオキサンテニウムテトラキス(ペンタフルオロベンジル)ボレート、5−メチル−10−オキソチアントレニウムテトラフルオロボレート、5−メチル−10−オキソチアントレニウムテトラキス(ペンタフルオロベンジル)ボレート、および5−メチル−10,10−ジオキソチアントレニウムヘキサフルオロホスフェートであり、
・ヨードニウム塩(例えばUS3,729,313A(特許文献14)、US3,741,769A(特許文献15)、US4,250,053A(特許文献16)、US4,394,403A(特許文献17)、およびUS2010/063221A1(特許文献13)を参照)、例えば
ジフェニルヨードニウムテトラフルオロボレート、
ジ−(4−メチルフェニル)−ヨードニウムテトラフルオロボレート、
フェニル−4−メチルフェニルヨードニウムテトラフルオロボレート、
ジ−(4−クロロフェニル)−ヨードニウムヘキサフルオロホスフェート、ジナフチルヨードニウムテトラフルオロボレート、
ジ−(4−トリフルオロメチルフェニル)−ヨードニウムテトラフルオロボレート、
ジフェニルヨードニウムヘキサフルオロホスフェート、
ジ−(4−メチルフェニル)−ヨードニウムヘキサフルオロホスフェート、ジフェニルヨードニウムヘキサフルオロアルセネート、
ジ−(4−フェノキシフェニル)−ヨードニウムテトラフルオロボレート、
フェニル−3−チエニルヨードニウムヘキサフルオロホスフェート、
3,5−ジメチルピラゾリル−4−フェニルヨードニウムヘキサフルオロホスフェート、ジフェニルヨードニウムヘキサフルオロアンチモネート、
2,2’−ジフェニルヨードニウムテトラフルオロボレート、
ジ−(2,4−ジクロロフェニル)−ヨードニウムヘキサフルオロホスフェート、
ジ−(4−ブロモフェニル)−ヨードニウムヘキサフルオロホスフェート、
ジ−(4−メトキシフェニル)−ヨードニウムヘキサフルオロホスフェート、
ジ−(3−カルボキシフェニル)−ヨードニウムヘキサフルオロホスフェート、
ジ−(3−メトキシカルボニルフェニル)−ヨードニウムヘキサフルオロホスフェート、
ジ−(3−メトキシスルホニルフェニル)−ヨードニウムヘキサフルオロホスフェート、
ジ−(4−アセトアミドフェニル)−ヨードニウムヘキサフルオロホスフェート、
ジ−(2−ベンゾチエニル)−ヨードニウムヘキサフルオロホスフェート、
ジアリールヨードニウムトリストリフルオロメチルスルホニルメチド、例えば
ジフェニルヨードニウムヘキサフルオロアンチモネート、
ジアリールヨードニウムテトラキス−(ペンタフルオロフェニル)−ボレート、例えば
ジフェニルヨードニウムテトラキス−(ペンタフルオロフェニル)−ボレート、
(4−n−デシロキシフェニル)−フェニルヨードニウムヘキサフルオロアンチモネート、
[4−(2−ヒドロキシ−n−テトラデシロキシ)−フェニル]−フェニルヨードニウムヘキサフルオロアンチモネート、
[4−(2−ヒドロキシ−n−テトラデシロキシ)−フェニル]−フェニルヨードニウムトリフルオロスルホネート、
[4−(2−ヒドロキシ−n−テトラデシロキシ)−フェニル]−フェニルヨードニウムヘキサフルオロホスフェート、
[4−(2−ヒドロキシ−n−テトラデシロキシ)−フェニル]−フェニルヨードニウムテトラキス−(ペンタフロロフェニル)−ボレート、
ビス−(4−tert−ブチルフェニル)−ヨードニウムヘキサフルオロアンチモネート、
ビス−(4−tert−ブチルフェニル)−ヨードニウムヘキサフルオロホスフェート、
ビス−(4−tert−ブチルフェニル)−ヨードニウムトリフルオロスルホネート、
ビス−(4−tert−ブチルフェニル)−ヨードニウムトリフルオロボレート、
ビス−(ドデシルフェニル)−ヨードニウムヘキサフルオロアンチモネート、
ビス−(ドデシルフェニル)−ヨードニウムテトラフルオロボレート、
ビス−(ドデシルフェニル)−ヨードニウムヘキサフルオロホスフェート、
ビス−(ドデシルフェニル)−ヨードニウムトリフルオロメチルスルホネート、
ジ−(ドデシルフェニル)−ヨードニウムヘキサフルオロアンチモネート、
ジ−(ドデシルフェニル)−ヨードニウムトリフレート、
ジフェニルヨードニウムビスルフェート、
4,4’−ジクロロジフェニルヨードニウムジスルフェート、4,4’−ジブロモジフェニルヨードニウムビスルフェート、
3,3’−ジニトロジフェニルヨードニウムビスルフェート、4,4’−ジメチルジフェニルヨードニウムビスルフェート、
4,4’−ビス−スクシンイミドジフェニルヨードニウムビスルフェート、3−ニトロジフェニルヨードニウムビスルフェート、4,4’−ジメトキシジフェニルヨードニウムビスルフェート、
ビス−(ドデシルフェニル)−ヨードニウムテトラキス−(ペンタフルオロフェニル)−ボレート、
(4−オクチルオキシフェニル)−フェニルヨードニウムテトラキス−(3,5−ビス−トリフルオロメチルフェニル)−ボレート、および(トリスクミル)−ヨードニウムテトラキス−(ペンタフルオロフェニル)−ボレート、
および
・フェロセニウム塩(例えばEP0542716B1(特許文献18)参照)、例えば
η5−(2,4−シクロペンタジエン−1−イル)−[(1,2,3,4,5,6,9)−(1−メチルエチル)−ベンゼン]鉄。
・可塑剤、例えば軟化剤油または低分子量液状ポリマー、例えば低分子量ポリブテン。
・一次酸化防止剤、例えば立体障害性フェノール
・二次酸化防止剤、例えばホスファイトまたはチオエーテル
・プロセス安定化剤、例えばCラジカルスカベンジャー
・光保護剤、例えばUV吸収剤または立体障害性アミン
・加工助剤、および
・末端ブロック強化樹脂。
測定は、(別の記載がない限り)23±1℃および相対湿度50±5%の検査雰囲気で実施される。
電子構成物の耐用期間を決定するための尺度としてカルシウム試験を採用した。カルシウム試験を図1に示している。これについては真空中で、10×10mm2の大きさの薄いカルシウム層23をガラスプレート21上に堆積させ、その後、窒素雰囲気下で貯蔵する。カルシウム層23の厚さは約100nmである。カルシウム層23をカプセル化するために、試験すべき接着剤22および支持体材料としての薄いガラス板24(35μm、Schott社)を備えた接着テープ(23×23mm2)を使用する。薄いガラス板は安定化のため、光学的に高透明性のアクリレート感圧接着剤の50μm厚の転写式接着テープ25により、100μm厚のPETフィルム26をラミネートしていた。接着剤22がすべての側ではみ出した6.5mmの縁(A−A)を設けてカルシウム面23を覆うように、接着剤22をガラスプレート21上に適用する。非透過性のガラス支持体24により、感圧接着剤を通るかまたは界面に沿った浸透だけが確定される。
水蒸気の浸透性(WVTR)の決定はASTM F−1249に従い行う。このために、感圧接着剤を、それ自体は浸透バリアに寄与しない高浸透性ポリスルホン膜(Sartorius社から入手可能)上に層厚50μmで施与する。水蒸気透過性は37.5℃および相対湿度90%で、測定装置としてMocon OX−Tran2/21を用いて決定する。
数平均分子量Mnおよび重量平均分子量Mwの分子量決定は、ゲル浸透クロマトグラフィ(GPC)を用いて行った。溶離液としては、トリフルオロ酢酸を0.1体積%含むTHF(テトラヒドロフラン)を用いた。測定は25℃で行った。プレカラムとして、PSS−SDV、5μ、103Å、ID8.0mm×50mmを使用した。分離にはカラムPSS−SDV、5μ、103Å並びに105Åおよび106、それぞれID8.0mm×300mmを用いた。試料濃度は4g/lであり、貫流量は1分当たり1.0mlであった。ポリスチレン標準に対して測定した。
MMAPは、変更を加えたASTM C611方法を使用して決定される混合メチルシクロヘキサンアニリン曇り点である。標準的な試験方法で使用されるヘプタンの代わりにメチルシクロヘキサンを用いる。この方法は、樹脂/アニリン/メチルシクロヘキサンを1/2/1(5g/10ml/5ml)の比で使用し、加熱されて透明なこの3種の成分の混合物を、ちょうど完全に曇るまで冷却することによって曇り点を決定する。
粘着樹脂軟化温度は、環球法として知られておりASTM E28に基づいて標準化されている該当する方法論に基づいて実施される。
ヘイズ値は、透過される光のうち、光を通された試料により前方へ大きな角度で散乱される割合を表す。つまりヘイズ値は、クリアな見通しを妨害する層の光学的特性を定量化する。
接着剤層を製造するため、様々な接着剤を溶液状態で、従来のライナー(シリコーン被覆されたポリエステルフィルム)上に、実験用塗布器によって施し、乾燥した。乾燥後の接着剤層厚は50±5μmである。乾燥は、それぞれの場合に、先ず室温下に10分間、そして実験室用乾燥庫内で120℃で10分間行った。それぞれの場合に、乾燥した接着剤層を、乾燥後直ぐに、第二のライナー(剥離力がより弱いシリコーン被覆したポリエステルフィルム)を用いてその開放面側にラミネートした。
ラジカル重合用に慣用の2Lガラス反応器に、40gの2−ヒドロキシエチルアクリレート、240gの2−エチルヘキシルアクリレート、120gのC17−アクリレート(C3−、C4−鎖セグメントを持つ三分岐状側部、BASF SE)、133gの特殊沸点スピリット69/95、および133gのアセトンを満たした。窒素ガスを45分間、攪拌下に反応溶液中に導通した後、反応器を58℃に加熱し、そして0.2gのVazo 67(DuPont)を加えた。次いで、外部の加熱浴を75℃に加温し、そして反応をこの外部温度で一定に行った。1時間の反応時間の後、50gのトルエンを加えた。2.5時間後、100gのアセトンで希釈した。4時間の反応時間の後、もう一度0.2gのVazo 67を加えた。7時間の重合時間後、100gの特殊沸点スピリット60/95で希釈し、22時間後、100gのアセトンで希釈した。24時間の反応時間後、重合を停止し、そして反応容器を室温に冷却した。分子量Mnは884000g/モルであった。
既知の透明なゲッターを接着剤中に5重量%の割合で配合した。この水捕捉剤の反応性はCa試験おいて既にカルシウム面が攻撃された程に高い。TEEを使用した場合は、カルシウムは影響を受けない。これは図3に写真として記録されている。
1.
接着材料ベースであって、
−少なくとも一つの活性化可能な基を有する少なくとも一種の反応性樹脂、
−少なくとも1種のポリマー、とりわけエラストマー、
−任意選択で少なくとも1種の粘着樹脂、
でできており、反応性樹脂の活性化後に、100g/m 2 d未満、好ましくは50g/m 2 d未満、とりわけ15g/m 2 d未満の水蒸気浸透速度を有する接着材料ベース、
分子状に分散した透明なゲッター材料、並びに
任意選択で、溶剤
を含むバリア接着剤であって、
ゲッター材料が、少なくとも一つのアルコキシ基および少なくとも一つの活性化可能な基を有する少なくとも一種のシランであることを特徴とする、
前記バリア接着剤。
2.
反応性樹脂とシランが同種の、特に同じ活性化可能な基を有することを特徴とする、上記1に記載のバリア接着剤。
3.
アルコキシ基がエトキシ基であることを特徴とする、上記1または2に記載のバリア接着剤。
4.
ゲッター材料の量が、接着剤の少なくとも2重量%、好ましくは少なくとも3重量%、特に少なくとも5重量%であることを特徴とする、上記1〜3の何れか一つに記載のバリア接着剤。
5.
ゲッター材料の量が最大で15重量%であることを特徴とする、上記1〜4の何れか一つに記載のバリア接着剤。
6.
ゲッター材料の量が、3〜15重量%、好ましくは4〜10重量%、特に4.5〜7重量%であることを特徴とする、上記1〜5の何れか一つに記載のバリア接着剤。
7.
活性化可能な基が、環状エーテル基、特にエポキシドおよびオキセタン、アクリレートおよびメタクリレートを含む群から選択される少なくとも一つの基であることを特徴とする、上記1〜6の何れか一つに記載のバリア接着剤。
8.
少なくとも一種の反応性樹脂が、活性化可能な基として、グリシジル基およびエポキシシクロヘキシル基から選択される少なくとも一つの基を含むことを特徴とする、上記1〜7の何れか一つに記載のバリア接着剤。
9.
少なくとも1種のシランが次の一般式の化合物であることを特徴とする、上記1〜8の何れか一つに記載のバリア接着剤。
Zは、アルキル基もしくはアリール基またはアルコキシ基であり、
ここで、残基Zは同一かまたは異なることができる]
10.
少なくとも一つの残基Zがエトキシ基であることを特徴とする、上記9に記載のバリア着剤。
11.
接着剤が感圧接着性であることを特徴とする、上記1〜10の何れか一つに記載の接着剤。
12.
カチオンにより、それも好ましくは熱によりまたは放射線に誘発されて硬化されることを特徴とする、上記1〜11の何れか一つに記載のバリア接着剤。
13.
光開始剤を更に含むことを特徴とする、上記1〜12の何れか一つに記載のバリア接着剤。
14.
上記1〜13の何れか一つに記載のバリア接着剤を含む接着テープ。
15.
有機電子機器内の構成物をカプセル化するための、上記1〜13の何れか一つに記載のバリア接着剤または上記14に記載の接着テープの使用。
16.
土台上に配置された有機電気的装置を保護するための方法であって、
電子的装置が少なくとも部分的にカバーによって覆われるように、電子的装置上にカバーを施し、
さらにカバーを土台および/または電子的装置の少なくとも一部の面に貼付し、
貼付が、上記1〜15の何れか一つに記載の接着材料の少なくとも1つの層によってもたらされる方法。
17.
バリア接着剤が、接着テープの層として存在することを特徴とする、上記16に記載の方法。
18.
最初に接着材料層が、場合によってはさらなる層を含む両面で接着性の接着テープの構成要素としての接着材料層が、およびその後のステップでカバーが、土台および/または電子的装置上に施されることを特徴とする、上記16または17に記載の方法。
19.
接着材料層とカバーが一緒に土台および/または電子的装置上に施されることを特徴とする、上記16〜18の何れか一つに記載の方法。
20.
カバーが電子的装置を完全に覆うことを特徴とする、上記16〜19の何れか一つに記載の方法。
21.
電子的装置の周囲の土台の領域も、カバーにより完全にまたは部分的に覆われることを特徴とする、上記16〜20の何れか一つに記載の方法。
Claims (29)
- 接着材料ベースであって、
−少なくとも一つの活性化可能な基を有する少なくとも一種の反応性樹脂、
−少なくとも1種のエラストマー、
−任意選択で少なくとも1種の粘着樹脂、
でできており、反応性樹脂の活性化後に、100g/m2d未満の水蒸気浸透速度を有する接着材料ベース、
分子状に分散した透明なゲッター材料、並びに
任意選択で、溶剤
を含むバリア接着剤であって、
ゲッター材料が、少なくとも一つのアルコキシ基および少なくとも一つの活性化可能な基を有する少なくとも一種のシランであり、
前記接着剤が感圧接着性であり、
前記エラストマーが少なくとも一種のビニル芳香族系ブロックコポリマーであり、
前記接着剤の破過時間が、60℃/90%相対湿度で貯蔵した時に>1100hであり、および85℃/85%相対湿度で貯蔵した時に>220hであり、および
前記少なくとも一種のシランが次の一般式:
Rは、アルキル残基またはアリール残基であり、
Xは、グリシジル基もしくはエポキシシクロヘキシル基を持つ残基、アクリレートまたはメタクリレートであり;そして
Zは、アルキル基もしくはアリール基またはアルコキシ基であり、
ここで、残基Zは同一かまたは異なることができる]
で表される化合物である、
ことを特徴とする、
前記バリア接着剤。 - Rがエチルであることを特徴とする、請求項1に記載のバリア接着剤。
- 少なくとも一つの残基Zがエトキシ基であることを特徴とする、請求項1または2に記載のバリア接着剤。
- 前記活性化可能な基が、環状エーテル基、アクリレートおよびメタクリレートを含む群から選択される少なくとも一つの基であることを特徴とする、請求項1〜3の何れか一つに記載のバリア接着剤。
- 前記活性化可能な基が、エポキシドおよびオキセタンを含む群から選択される少なくとも一つの基であることを特徴とする、請求項1〜3の何れか一つに記載のバリア接着剤。
- 接着材料ベースであって、
−少なくとも一つの活性化可能な基を有する少なくとも一種の反応性樹脂、
−少なくとも1種のポリマー、
−任意選択で少なくとも1種の粘着樹脂、
でできており、反応性樹脂の活性化後に、100g/m 2 d未満の水蒸気浸透速度を有する接着材料ベース、
分子状に分散した透明なゲッター材料、並びに
任意選択で、溶剤
を含むバリア接着剤であって、
ゲッター材料が、少なくとも一つのアルコキシ基および少なくとも一つの活性化可能な基を有する少なくとも一種のシランであり、および
前記少なくとも一種のシランが次の一般式:
Rは、エチルであり、
Xは、エポキシシクロヘキシル基を持つ残基であり、
Zは、アルキル基もしくはアリール基またはアルコキシ基であり、少なくとも一つの残基Zはエトキシ基である]
で表される化合物である、
ことを特徴とする、前記バリア接着剤。 - 前記接着剤が感圧接着性であることを特徴とする、請求項6に記載のバリア接着剤。
- 前記ポリマーが、少なくとも一種のビニル芳香族系ブロックコポリマーであるエラストマーであることを特徴とする、請求項6または7に記載のバリア接着剤。
- 接着材料ベースが、反応性樹脂の活性化後に、50g/m 2 d未満の水蒸気浸透速度を有することを特徴とする、請求項1〜8の何れか一つに記載のバリア接着剤。
- 接着材料ベースが、反応性樹脂の活性化後に、15g/m 2 d未満の水蒸気浸透速度を有することを特徴とする、請求項1〜8の何れか一つに記載のバリア接着剤。
- 反応性樹脂とシランが同じ活性化可能な基を有することを特徴とする、請求項1〜10の何れか一つに記載のバリア接着剤。
- ゲッター材料の量が、接着剤の少なくとも2重量%であることを特徴とする、請求項1〜11の何れか一つに記載のバリア接着剤。
- ゲッター材料の量が、接着剤の少なくとも3重量%であることを特徴とする、請求項1〜11の何れか一つに記載のバリア接着剤。
- ゲッター材料の量が、接着剤の少なくとも5重量%であることを特徴とする、請求項1〜11の何れか一つに記載のバリア接着剤。
- ゲッター材料の量が最大で15重量%であることを特徴とする、請求項1〜14の何れか一つに記載のバリア接着剤。
- ゲッター材料の量が、3〜15重量%であることを特徴とする、請求項1〜15の何れか一つに記載のバリア接着剤。
- ゲッター材料の量が、4〜10重量%であることを特徴とする、請求項1〜15の何れか一つに記載のバリア接着剤。
- ゲッター材料の量が、4.5〜7重量%であることを特徴とする、請求項1〜15の何れか一つに記載のバリア接着剤。
- カチオンにより硬化されることを特徴とする、請求項1〜18の何れか一つに記載のバリア接着剤。
- 熱によりまたは放射線に誘発されて硬化されることを特徴とする、請求項1〜18の何れか一つに記載のバリア接着剤。
- 光開始剤を更に含むことを特徴とする、請求項1〜20の何れか一つに記載のバリア接着剤。
- 請求項1〜21の何れか一つに記載のバリア接着剤を含む接着テープ。
- 有機電子機器内の構成物をカプセル化するための、請求項1〜21の何れか一つに記載のバリア接着剤または請求項22に記載の接着テープの使用。
- 土台上に配置された有機電気的装置を保護するための方法であって、
電子的装置が少なくとも部分的にカバーによって覆われるように、電子的装置上にカバーを施し、
さらにカバーを土台および/または電子的装置の少なくとも一部の面に貼付し、
貼付が、請求項1〜23の何れか一つに記載の接着材料の少なくとも1つの層によってもたらされる方法。 - バリア接着剤が、接着テープの層として存在することを特徴とする、請求項24に記載の方法。
- 最初に接着材料層が、場合によってはさらなる層を含む両面で接着性の接着テープの構成要素としての接着材料層が、およびその後のステップでカバーが、土台および/または電子的装置上に施されることを特徴とする、請求項24または25に記載の方法。
- 接着材料層とカバーが一緒に土台および/または電子的装置上に施されることを特徴とする、請求項24〜26の何れか一つに記載の方法。
- カバーが電子的装置を完全に覆うことを特徴とする、請求項24〜27の何れか一つに記載の方法。
- 電子的装置の周囲の土台の領域も、カバーにより完全にまたは部分的に覆われることを特徴とする、請求項24〜28の何れか一つに記載の方法。
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Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3729313A (en) | 1971-12-06 | 1973-04-24 | Minnesota Mining & Mfg | Novel photosensitive systems comprising diaryliodonium compounds and their use |
US3741769A (en) | 1972-10-24 | 1973-06-26 | Minnesota Mining & Mfg | Novel photosensitive polymerizable systems and their use |
AU497960B2 (en) | 1974-04-11 | 1979-01-25 | Minnesota Mining And Manufacturing Company | Photopolymerizable compositions |
US4058401A (en) | 1974-05-02 | 1977-11-15 | General Electric Company | Photocurable compositions containing group via aromatic onium salts |
US4256828A (en) | 1975-09-02 | 1981-03-17 | Minnesota Mining And Manufacturing Company | Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials |
US4138255A (en) | 1977-06-27 | 1979-02-06 | General Electric Company | Photo-curing method for epoxy resin using group VIa onium salt |
US4231951A (en) | 1978-02-08 | 1980-11-04 | Minnesota Mining And Manufacturing Company | Complex salt photoinitiator |
US4250053A (en) | 1979-05-21 | 1981-02-10 | Minnesota Mining And Manufacturing Company | Sensitized aromatic iodonium or aromatic sulfonium salt photoinitiator systems |
US5089536A (en) | 1982-11-22 | 1992-02-18 | Minnesota Mining And Manufacturing Company | Energy polmerizable compositions containing organometallic initiators |
US5304419A (en) | 1990-07-06 | 1994-04-19 | Alpha Fry Ltd | Moisture and particle getter for enclosures |
SG120873A1 (en) | 2001-06-29 | 2006-04-26 | Jsr Corp | Acid generator, sulfonic acid, sulfonic acid derivatives and radiation-sensitive resin composition |
US6936131B2 (en) | 2002-01-31 | 2005-08-30 | 3M Innovative Properties Company | Encapsulation of organic electronic devices using adsorbent loaded adhesives |
WO2004009720A2 (en) | 2002-07-24 | 2004-01-29 | Adhesives Research, Inc. | Transformable pressure sensitive adhesive tape and use thereof in display screens |
JP2005187793A (ja) * | 2003-12-24 | 2005-07-14 | Rohm & Haas Electronic Materials Llc | 改良された接着剤 |
NZ540271A (en) * | 2004-05-28 | 2006-12-22 | Bostik Sa | Adhesive composition suitable for use as a motor vehicle windscreen adhesive or sealant |
KR100909169B1 (ko) | 2006-09-11 | 2009-07-23 | 제일모직주식회사 | 선 경화형 반도체 조립용 접착 필름 조성물 |
US20080063871A1 (en) | 2006-09-11 | 2008-03-13 | Jung Ki S | Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package |
US8809458B2 (en) | 2006-12-01 | 2014-08-19 | Kaneka Corporation | Polysiloxane composition |
DE102008003546A1 (de) | 2008-01-09 | 2009-07-16 | Tesa Ag | Liner mit einer Barriereschicht |
DE102008047964A1 (de) | 2008-09-18 | 2010-03-25 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
JP5201347B2 (ja) * | 2008-11-28 | 2013-06-05 | 株式会社スリーボンド | 有機el素子封止用光硬化性樹脂組成物 |
DE102008060113A1 (de) | 2008-12-03 | 2010-07-29 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
DE102009036970A1 (de) | 2009-08-12 | 2011-02-17 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
JP5719647B2 (ja) | 2010-04-09 | 2015-05-20 | 日東電工株式会社 | シーリング組成物、複層ガラスおよび太陽電池パネル |
US9068103B2 (en) * | 2011-02-03 | 2015-06-30 | Carroll Benford Dickens | Waterproof silane-endcapped adhesive mixture |
EP2597697A1 (en) | 2011-11-28 | 2013-05-29 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Sealed thin-film device as well as method of repairing, system for repairing and computer program product |
DE102012211335A1 (de) | 2012-06-29 | 2014-01-02 | Tesa Se | Klebeband für die Kapselung einer organischen elektronischen Anordnung |
CN103756579A (zh) * | 2014-01-09 | 2014-04-30 | 常州斯威克光伏新材料有限公司 | 一种高水汽阻隔性的eva封装胶膜及其制备方法 |
DE102014207074A1 (de) | 2014-04-11 | 2015-10-15 | Tesa Se | Klebeband für die Kapselung einer organischen elektronischen Anordnung |
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- 2015-10-15 JP JP2017523285A patent/JP6470409B2/ja not_active Expired - Fee Related
- 2015-10-15 CN CN201580066338.XA patent/CN107001879A/zh active Pending
- 2015-10-15 US US15/519,711 patent/US10626305B2/en active Active
- 2015-10-15 KR KR1020177013479A patent/KR101930525B1/ko active IP Right Grant
- 2015-10-15 EP EP15781109.2A patent/EP3212725B1/de active Active
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KR20170071579A (ko) | 2017-06-23 |
WO2016066434A1 (de) | 2016-05-06 |
US20170247582A1 (en) | 2017-08-31 |
CN107001879A (zh) | 2017-08-01 |
TW201634635A (zh) | 2016-10-01 |
US10626305B2 (en) | 2020-04-21 |
EP3212725B1 (de) | 2024-03-06 |
KR101930525B1 (ko) | 2018-12-18 |
EP3212725A1 (de) | 2017-09-06 |
JP2017536449A (ja) | 2017-12-07 |
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