CN107001879A - 包含硅烷水清除剂的oled相容性胶粘剂 - Google Patents
包含硅烷水清除剂的oled相容性胶粘剂 Download PDFInfo
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- CN107001879A CN107001879A CN201580066338.XA CN201580066338A CN107001879A CN 107001879 A CN107001879 A CN 107001879A CN 201580066338 A CN201580066338 A CN 201580066338A CN 107001879 A CN107001879 A CN 107001879A
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- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
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- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
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- 238000006471 dimerization reaction Methods 0.000 description 1
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- FXIXJKOVGVATTM-UHFFFAOYSA-N diphenyl(trifluoromethyl)sulfanium Chemical compound C=1C=CC=CC=1[S+](C(F)(F)F)C1=CC=CC=C1 FXIXJKOVGVATTM-UHFFFAOYSA-N 0.000 description 1
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- 229910052735 hafnium Inorganic materials 0.000 description 1
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- BHZRJJOHZFYXTO-UHFFFAOYSA-L potassium sulfite Chemical class [K+].[K+].[O-]S([O-])=O BHZRJJOHZFYXTO-UHFFFAOYSA-L 0.000 description 1
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- JVBXVOWTABLYPX-UHFFFAOYSA-L sodium dithionite Chemical compound [Na+].[Na+].[O-]S(=O)S([O-])=O JVBXVOWTABLYPX-UHFFFAOYSA-L 0.000 description 1
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- DVQHRBFGRZHMSR-UHFFFAOYSA-N sodium methyl 2,2-dimethyl-4,6-dioxo-5-(N-prop-2-enoxy-C-propylcarbonimidoyl)cyclohexane-1-carboxylate Chemical compound [Na+].C=CCON=C(CCC)[C-]1C(=O)CC(C)(C)C(C(=O)OC)C1=O DVQHRBFGRZHMSR-UHFFFAOYSA-N 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
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- 238000007711 solidification Methods 0.000 description 1
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- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 1
- YTZKOQUCBOVLHL-UHFFFAOYSA-N tert-butylbenzene Chemical class CC(C)(C)C1=CC=CC=C1 YTZKOQUCBOVLHL-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 235000019587 texture Nutrition 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229910000348 titanium sulfate Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- 238000005829 trimerization reaction Methods 0.000 description 1
- GQPJXIYUADMUPC-UHFFFAOYSA-N trimethoxy(7-oxabicyclo[4.1.0]heptan-6-yl)silane Chemical compound C1CCCC2OC21[Si](OC)(OC)OC GQPJXIYUADMUPC-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000007704 wet chemistry method Methods 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 229940102001 zinc bromide Drugs 0.000 description 1
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- 235000005074 zinc chloride Nutrition 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F287/00—Macromolecular compounds obtained by polymerising monomers on to block polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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Abstract
本发明涉及用于封装(光)电子器件的阻隔胶粘剂,其包含:由至少一种具有至少一个可活化基团的中至少一种反应性树脂、至少一种聚合物(特别是弹性体)、和至少一种胶粘剂树脂组成的胶粘剂基础物,所述胶粘剂基础物在反应性树脂活化之后具有小于100g/m2d、优选地小于50g/m2d、特别地小于15g/m2d的水蒸气渗透速率;透明的分子分散的吸气剂材料;和任选地溶剂;其特征在于,所述吸气剂材料为具有至少一个烷氧基基团和至少一个可活化基团的至少一种硅烷。
Description
本发明涉及用于封装(光)电子器件的阻隔胶粘剂,其包括:由具有至少一个可活化基团的至少一种反应性树脂、至少一种聚合物(特别地弹性体)、任选地至少一种增粘树脂组成的胶粘剂基础物,其中所述胶粘剂基础物在活化后具有小于100g/m2d、优选地小于50g/m2d、特别地小于15g/m2d的水蒸气渗透速率;透明的分子分散的吸气剂材料;和任选地溶剂。本发明进一步涉及包括该胶粘剂的胶带和这样的胶粘剂的用途。
(光)电子器件愈发频繁地用于商业产品中。这类器件包括无机或有机电子结构体,例如有机、有机金属或聚合物半导体或其组合。这些器件和产品根据所期望的用途被设计为刚性或柔性的,其中对于柔性器件存在不断增长的需求。这类器件例如通过如下制造:印刷方法例如凸版印刷、凹版印刷、丝网印刷、平面印刷、或如所谓的“无压印刷(非或式印刷)”例如热转移印刷、喷墨印刷、或数字印刷。然而,大多数情况下也使用真空方法,例如化学气相沉积(CVD)、物理气相沉积(PVD)、等离子体增强的化学或物理沉积(PECVD)方法、溅射、(等离子体)蚀刻或蒸发,在该情况下结构化通常借助于掩模实现。
已经商业化或在其市场潜力方面令人感兴趣的(光)电子应用的实例在此包括电泳或电致变色组件或显示器、在读取和显示器件中或作为照明的有机或聚合物发光二极管(OLED或PLED)、电致发光灯、发光电化学单元(LEEC)、有机太阳能电池(优选染料或聚合物太阳能电池)、无机太阳能电池(优选薄层太阳能电池(薄膜太阳能电池)、特别地基于硅、锗、铜、铟和硒)、钙钛矿太阳能电池、有机场效应晶体管、有机开关元件、有机光学放大器、有机激光二极管、有机或无机传感器、或基于有机或无机的RFID应答器。
封装胶带的另外的应用在以下中是已知的:电池技术的领域、特别地柔性的微电池和薄膜电池的领域,非常特别地包括含锂的阴极、阳极或电解质的那些。
因此,在本文献中,有机(光)电子器件理解意为如下的电子器件:其包括至少一种电子功能的、至少部分地有机成分(例如有机金属化合物),或其中电子功能的结构体具有小于20μm的厚度。
在无机和/或有机(光)电子设备的领域中、而且非常特别地在有机(光)电子设备的领域中,作为实现(光)电子器件的足够的寿命和功能的技术挑战的是保护其中所包含的组件(组分)免受渗透物影响。渗透物可为许多低分子量的有机或无机化合物、特别地水蒸气和氧气。
在无机和/或有机(光)电子设备的领域中的许多(光)电子器件,非常特别地在使用有机原材料的情况下,对于水蒸气和氧气两者为敏感的,其中水或水蒸气的透入被归类为对于许多器件的主要问题。因此,在电子器件的寿命期间需要通过封装进行保护,因为否则性能在使用期间下降。例如,成分的氧化可导致例如:在发光器件例如电致发光灯(EL灯)或有机发光二极管(OLED)的情况下,与在电泳显示器(EP显示器)的情况下对比,亮度严重下降,或在太阳能电池的情况下,效率在非常短的时间内严重下降。
为了实现非常良好的密封,使用特定的阻隔胶粘剂(也称作具有水蒸气阻隔性质的胶粘剂)。用于密封(光)电子器件的良好胶粘剂具有低的对氧气和特别地对水蒸气的渗透性,具有足够的对器件的粘附性,并且可良好地与其适应。
阻隔作用典型地通过报告氧气传输(透过)速率(OTR)和水蒸气传输速率(WVTR)进行表征。相应的速率在此表示在特定的温度和分压条件下和可能地进一步的测量条件例如相对空气湿度下的氧气或水蒸气通过膜的基于面积和时间的流量(流动)。这些值越小,用于封装的相应的材料的适合性越佳。所报告的渗透性在此并非单独地基于WVTR或OTR的值,而总是包括渗透的平均路径长度的数值、例如材料的厚度、或标准化为具体的路径长度。
渗透性P为气体和/或液体渗透通过物体的能力的量度。低的P值表示良好的阻隔作用。渗透性P为以具体的渗透路径长度、分压和温度在稳状态条件下的对于所限定的材料和所限定的渗透性的特定值。渗透性P为扩散项D和溶解度项S的乘积:P=D*S。
溶解度项S主要描述阻隔胶粘剂对渗透物的亲和性。例如,在水蒸气的情况下,由疏水性材料实现低的S值。扩散项D为渗透物在阻隔材料中的移动性(迁移率)的量度并且直接取决于例如分子移动性的性质或自由体积。通常,在高度交联或高度结晶的材料中对于D实现相对低的值。然而,高度结晶的材料通常是不太透明的,并且较强的交联导致较低的柔性。渗透性P典型地随分子迁移性增加而上升,例如当温度上升或超过玻璃化转变点时。
增加胶粘剂的阻隔作用的途径必须考虑参数D和S两者、特别地在对水蒸气和氧气的渗透性的影响方面。除这些化学性质之外,也必须考虑物理影响对渗透性的效果、特别地平均渗透路径长度和界面性质(胶粘剂的适应特性,粘附性)。理想的阻隔胶粘剂具有低的D值和S值,兼具对基底的非常好的粘附性。
低的溶解度项S单独地通常不足以实现良好的阻隔性质。其特定的典型实例为硅氧烷弹性体。所述材料是极度疏水性的(小的溶解度项),但是凭借其可自由转动的Si-O键(大的扩散项)而对水蒸气和氧气具有相当小的阻隔作用。对于良好的阻隔作用,因此需要溶解度项S和扩散项D之间的良好平衡。
已有基于苯乙烯嵌段共聚物和具有最大氢化水平的树脂的阻隔胶粘剂(参见DE10 2008 047 964 A1)。
在此还报告了常用胶粘剂体系的渗透值(WVTR)(在37.5℃和90%相对湿度下测量)。典型的基于丙烯酸酯的压敏胶粘剂在100g/m2d和1000g/m2d之间的范围内。由于链的高的移动性,硅酮压敏胶粘剂对水具有大于1000g/m2d的甚至更高的渗透值。如果使用苯乙烯嵌段共聚物作为弹性体组分,则对于未氢化或不完全氢化的体系实现在50-100g/m2d范围内的WVTR值,和对于氢化的体系(例如SEBS)实现小于50g/m2d的值。用纯的聚(异丁烯)弹性体或苯乙烯和异丁烯的嵌段共聚物两者均实现小于15g/m2d的特别低的WVTR值。
同样改善阻隔作用的方式为使用与水或氧气反应的物质。透入(光)电子器件中的氧气或水蒸气然后与这些物质化学地或物理地(优选化学地)结合,并因此增加突破(穿透)时间(“迟延时间”)。所述物质在文献中称作“吸气剂”、“清除剂”、“干燥剂”或“吸收剂”。在下文中仅使用术语“吸气剂”。结合透入水的方式为经由吸附于典型地二氧化硅、分子筛、沸石或硫酸钠的物理方法。水经由烷氧基硅烷、唑烷、异氰酸酯、氧化钡、五氧化二磷、碱金属和碱土金属氧化物(例如氧化钙)、金属钙或金属氢氧化物化学地结合(WO 2004/009720A2)。然而,一些填料不适于例如显示器的透明粘结,因为胶粘剂的透明度下降。
在胶粘剂中已经描述的这样的吸气剂主要为无机填料,例如氯化钙或各种氧化物(参见US 5,304,419 A、EP 2 380 930 A1或US 6,936,131 A)。这种胶粘剂在边缘封装的情况下(即在其中仅有边缘要粘结的情况下)是主要的。然而,包括这样的吸气剂的胶粘剂不适于整个区域地封装,因为如上所述,它们降低透明度。
有机吸气剂也已经描述于胶粘剂中。例如在EP 2 597 697 A1中,其中使用了聚合的烷氧基硅烷作为吸气剂。WO 2014/001005 A1中提及了许多不同的硅烷作为胶粘剂中的吸气剂。根据该文献,待使用的吸气剂的最大使用量为2重量%,因为待封装的敏感性电子组件在使用较高的量的吸气剂的情况下会受损伤。问题在于,所使用的有机吸气剂材料通常是极具反应性的,并且在整个区域的封装中接触敏感性有机电子设备时导致损伤(称作“暗点”)。因此,包括这样的吸气剂的胶粘剂仅适用于边缘封装,其中透明度的损失是不重要的。
总之,吸气剂材料为例如盐,例如氯化钴、氯化钙、溴化钙、氯化锂、溴化锂、氯化镁、高氯酸钡、高氯酸镁、氯化锌、溴化锌、硅石(例如硅胶)、硫酸铝、硫酸钙、硫酸铜、硫酸钡、硫酸镁、硫酸锂、硫酸钠、硫酸钴、硫酸钛、连二亚硫酸钠、碳酸钠、硫酸钠、二亚硫酸钾、碳酸钾、碳酸镁,二氧化钛,硅藻土,沸石,片状硅酸盐例如蒙脱石和膨润土;金属氧化物,例如氧化钡、氧化钙、氧化铁、氧化镁、氧化钠、氧化钾、氧化锶、氧化铝(活化的氧化铝);以及碳纳米管、活性炭、五氧化二磷和硅烷;易氧化的金属,例如铁、钙、钠和镁;金属氢化物,例如氢化钙、氢化钡、氢化锶、氢化钠和氢化锂铝;氢氧化物,例如氢氧化钾和氢氧化钠;金属络合物,例如乙酰丙酮铝;和另外的有机吸收剂,例如聚烯烃共聚物、聚酰胺共聚物、PET共聚酯、单-和多羧酸的酐(例如乙酸酐、丙酸酐、丁酸酐或甲基四氢苯二甲酸酐)、异氰酸酯或另外的基于混杂聚合物的吸收剂,其通常与催化剂例如钴组合使用;另外的有机吸收剂,例如弱交联的聚丙烯酸、聚乙烯醇、抗坏血酸盐(酯)、葡萄糖、五倍子酸或不饱和的脂肪和油。
根据它们的功能,吸气剂材料优选地作为基本上不含渗透物的材料、例如以不含水的形式使用。这使吸气剂材料与用作填料的类似材料区别开。例如,硅石经常以热解硅石的形式用作填料。然而,如果将该填料照常在环境条件下储存,则其甚至从环境吸收水并且不再能够作为在工业上可使用的程度的吸气剂材料发挥作用。仅有已经被干燥或保持干燥的硅石可用作吸气剂材料。然而,也可使用已部分地与渗透物络合的材料,例如CaSO4*1/2H2O(硫酸钙半水合物),或部分水合的硅石,其按照定义作为通式(SiO2)m*nH2O的化合物存在。
如上所述,硅石理解为意指通式(SiO2)m*nH2O的化合物。这是由湿化学法、热法或热解法制造的二氧化硅。更特别地,硅石中的合适的吸气剂材料为硅胶,例如用钴化合物作为水分指示剂浸渍的硅胶(蓝胶),和热解硅石。
因此,在整个区域的封装的情况下,存在相反的要求,一方面为了确保最大的水蒸气渗透防护,吸气剂应是高反应性的,另一方面为了不损伤敏感性有机电子设备,吸气剂应是低反应性的。
因此,本发明的目的在于提供如下的胶粘剂,其具有长的穿透时间(>1100小时(在60℃/90%相对湿度下储存)和>220小时(在85℃/85%相对湿度下储存)),并且其可用于有机电子设备的组件的区域性封装,而不损伤敏感性的有机电子设备。
令人惊奇地,已经发现,当在开头指定的阻隔胶粘剂中使用具有至少一个烷氧基基团和至少一个可活化基团的至少一种硅烷的吸气剂材料时,可实现长的穿透时间而不明显损伤有机电子设备,并且同时可维持高的透明度。
令人惊奇地,已经发现,相比于本领域技术人员已知的有机水清除剂例如唑烷、α-硅烷或碳化二亚胺,反应性较低的烷氧基硅烷明显地降低水分渗透通过胶粘剂,并且可粘结在有机电子设备(例如OLED)的组件的整个区域上而不使其损坏。
非常特别合适的胶粘剂为其中反应性树脂和烷氧基硅烷具有至少一种相同类型的基团、特别地至少一种相同的可活化基团的那些胶粘剂。在该情况下,反应性树脂和烷氧基硅烷可以特别良好的方式相互聚合和交联。“相同类型的多官能的可聚合的基团”应理解意为在化学上相互非常类似的那些基团,例如具有不同环尺寸的环醚、脂族环氧化物和脂环族环氧化物或丙烯酸酯和甲基丙烯酸酯。
当烷氧基为乙氧基时,实现了特别良好的活性。已经发现,令人惊奇地,相比于甲氧基硅烷,不具反应性的乙氧基硅烷可显著更好地降低水分的渗透,特别地在高温下。这是预料不到的,因为甲氧基硅烷通常具有比相应的乙氧基硅烷更高的反应性(参见Wackerproduct description 6085e/09.13第11页,2013年9月(09.13))。
合适的可活化基团为环醚、丙烯酸酯或甲基丙烯酸酯。特别合适的环醚基团为环氧基团或环氧丙基,其中硅烷优选2-(3,4-环氧环己基)乙基甲基二甲氧基硅烷、2-(3,4-环氧环己基)乙基甲基二乙氧基硅烷、γ-(缩水甘油氧基丙基)三甲氧基硅烷、γ-(缩水甘油氧基丙基)三乙氧基硅烷并且特别地2-(3,4-环氧环己基)乙基三甲氧基硅烷和/或2-(3,4-环氧环己基)乙基三乙氧基硅烷。
当吸气剂材料的量为至少2重量%、优选地至少3重量%、特别地至少4重量%和最优选地至少5重量%时,胶粘剂具有特别良好的性质。此外,当吸气剂材料的量同时或替代地不超过15重量%时是有利的。非常特别优选的范围为3重量%至15重量%、优选地4重量%至10重量%并且特别地4.5重量%至7重量%。相对大量的吸气剂材料增加穿透时间,并因此是期望的。另一方面,当引入相对大量的吸气剂时,网络密度降低,由于提高的渗透性这抵销了吸气剂效果,使得吸气剂材料的量也存在上限。
本发明的胶粘剂是部分可交联的,因为除了至少一种反应性树脂组分,其还包含至少一种聚合物,特别地弹性体和任选地增粘树脂。胶粘剂的凝胶含量,即在将所述胶粘剂溶解于合适的溶剂时,使该胶粘剂不能溶解的胶粘剂的比例合适地为小于90重量%、特别地小于80重量%、优选地小于70重量%、更优选地小于50重量%和最优选地小于30重量%。
在有利的实施方案中,胶粘剂中反应性树脂的比例为15重量%至80重量%、特别地20重量%至70重量%和更优选地25重量%至65重量%。为了在固化之后实现良好的易于使用性和弹性的胶粘剂,优选的反应性树脂含量为15重量%至35重量%、特别地20重量%至30重量%。为了更高交联的胶粘剂粘结,65重量%至80重量%的反应性树脂含量是优选的。特别地,产生良好的有关弹性和交联度的平衡的反应性树脂含量为35重量%至65重量%。
在优选的实施中,所述反应性树脂包括环氧基团、特别地脂族的和非常特别优选地脂环族的环氧基团。包含缩水甘油基和/或环氧环己基作为可活化基团的反应性树脂具有非常良好的适合性。
优选地,烷氧基硅烷为以下通式的化合物
其中
●R为烷基或芳基基团,其中特别优选的是乙基;
●X为具有缩水甘油基或环氧环己基基团、丙烯酸酯或甲基丙烯酸酯的基团(原子团)和
●Z为烷基或芳基基团或烷氧基基团,
其中基团Z可为相同或不同。
所述基团Z可为任何烷基或芳基基团或烷氧基基团,其中特别优选的是烷氧基基团。当Z也为乙氧基基团时,可实现非常特别良好的结果。基团Z也可不同。例如,烷氧基硅烷也可包含乙氧基和甲氧基基团两者作为基团Z。
在特别优选的实施中,吸气剂的基团X为2-(3,4-环氧环己基)。
根据本发明,也可使用两种或更多种吸气剂材料的混合物。
在优选的实施中,胶粘剂以阳离子的方式、热或辐射诱导的方式固化。另外优选的是,胶粘剂包含至少一种类型的用于可交联的组分的阳离子固化的引发剂,特别地光引发剂。
优选地,至少一种弹性体由至少一种烯烃类单体和/或由至少一种聚氨酯形成。更优选地,弹性体为至少一种乙烯基芳族嵌段共聚物。
所述聚合物可为一种聚合物、或两种或更多种不同聚合物的混合物。在该情况下,至少一种聚合物可特别地为弹性体或热塑性材料。
所使用的弹性体原则上可为压敏胶粘剂领域中所惯用的任何弹性体,例如在Donatas Satas的“Handbook of Pressure Sensitive Adhesive Technology”(Satas&Associates,Warwick 1999)中所述的。
在本申请的范围中,优选地,使用的弹性体在化学意义上由至少一种烯烃(烯属)单体或由聚氨酯形成,且为例如基于以下的弹性体:聚氨酯、天然橡胶、合成橡胶(例如丁基、(异)丁基、腈或丁二烯橡胶)、具有由不饱和或部分或完全氢化的聚二烯嵌段形成的弹性体嵌段(聚丁二烯、聚异戊二烯、聚(异)丁烯、这些的共聚物和本领域技术人员熟悉的另外的弹性体嵌段)的苯乙烯嵌段共聚物、聚烯烃、含氟聚合物和/或硅酮(有机硅)。
如果使用橡胶或合成橡胶或由其产生的共混物作为压敏胶粘剂的基础材料,则天然橡胶可原则上根据所需的纯度和粘度水平选自所有可得的品质,例如绉、RSS、ADS、TSR或CV型,且合成橡胶选自无规共聚的苯乙烯-丁二烯橡胶(SBR)、丁二烯橡胶(BR)、合成聚异戊二烯(IR)、丁基橡胶(IIR)、卤化的丁基橡胶(XIIR)、丙烯酸酯橡胶(ACM)、乙烯-乙酸乙烯酯共聚物(EVA)或聚氨酯和/或其共混物。
所使用的至少一种聚合物也可为本领域技术人员已知的任何种类的热塑性材料,例如在J.M.G.Cowie的教科书“Chemie und Physik der synthetischen Polymere”[Chemistry and Physics of Synthetic Polymers](Vieweg,Braunschweig)和B.Tieke的“Makromolekulare Chemie”[Macromolecular Chemistry](VCH Weinheim,1997)中说明的。这些为例如聚(乙烯)、聚(丙烯)、聚(氯乙烯)、聚(苯乙烯)、聚(甲醛)、聚(环氧乙烷)、聚(对苯二甲酸乙二醇酯)、聚(碳酸酯)、聚(苯醚)、聚(氨基甲酸酯)、聚(脲)、苯氧基树脂、丙烯腈-丁二烯-苯乙烯(ABS)、聚(酰胺)(PA)、聚(乳酸酯)(PLA)、聚(醚醚酮)(PEEK)、聚(砜)(PSU)、聚(醚砜)(PES)。聚(丙烯酸酯)、聚(甲基丙烯酸酯)和聚(甲基丙烯酸甲酯)(PMMA)作为聚合物也是可能的,但是在本发明的范围中不是优选的。
所使用的反应性树脂,也称作可交联的组分,原则上可为压敏胶粘剂或反应性胶粘剂的领域的技术人员已知的在合成反应(分子量增加反应)中形成交联的大分子的所有反应性组分,如描述于例如Gerd Habenicht:Kleben-Grundlagen,Technologien,Anwendungen[Adhesive Bonding Principles,Technologies,Applications],6thedition,Springer,2009中。这些为例如形成环氧化物、聚酯、聚醚、聚氨酯,酚树脂、甲酚或酚醛树脂基的聚合物、多硫化物或丙烯酸类聚合物(丙烯酸类、甲基丙烯酸类)的组分。
所述可交联的组分的结构和化学性质不是关键性的,条件是它们可与弹性体少部分地混溶,并且分子量增加反应可在不导致弹性体相的任何明显损害和/或分解的条件(特别地在所使用的温度、所使用的催化剂的类型等的方面)下进行。
所述反应性树脂优选地由环醚组成,并且适于辐射化学和任选地热交联,具有小于40℃、优选地小于20℃的软化温度。
基于环醚的反应性树脂特别地为环氧化物,即具有至少一个环氧乙烷基团的化合物、或环氧丙烷。它们在性质上可为芳族的或特别地是脂族或脂环族的。可使用的反应性树脂可为单官能性、二官能性、三官能性、四官能性,或最高达多官能性的更高的官能度,其中所述官能度与环醚基团相关。
不希望设置限制,实例为3,4-环氧环己基甲基-3’,4’-环氧基环己烷羧酸酯(EEC)和衍生物、二氧化二环戊二烯和衍生物、3-乙基-3-环氧丙烷甲醇和衍生物、四氢苯二甲酸二缩水甘油酯和衍生物、六氢苯二甲酸二缩水甘油酯和衍生物、乙烷1,2-二缩水甘油醚和衍生物、丙烷1,3-二缩水甘油醚和衍生物、丁烷-1,4-二醇二缩水甘油醚和衍生物、更高级的烷烃1,n-二缩水甘油醚和衍生物、双[(3,4-环氧环己基)甲基]己二酸酯和衍生物、乙烯基环己基二氧化物和衍生物、环己烷-1,4-二甲醇双(3,4-环氧环己烷羧酸酯)及衍生物、4,5-环氧基四氢苯二甲酸二缩水甘油酯和衍生物、双[1-乙基(3-环氧丙基)甲基]醚和衍生物、季戊四醇四缩水甘油醚和衍生物、双酚A二缩水甘油醚(DGEBA)、氢化的双酚A二缩水甘油醚、双酚F二缩水甘油醚、氢化的双酚F二缩水甘油醚、环氧苯酚酚醛清漆、氢化的环氧苯酚酚醛清漆、环氧甲酚酚醛清漆、氢化的环氧甲酚酚醛清漆、2-(7-氧杂双环;螺[1,3-二烷-5,3'-[7]氧杂双环[4.1.0]庚烷],1,4-双((2,3-环氧丙氧基)甲基)环己烷。
特别适于阳离子固化的为基于环己基环氧化物例如3,4-环氧环己基甲基3’,4’-环氧环己烷羧酸酯(EEC)和衍生物以及双[(3,4-环氧环己基)甲基]己二酸酯和衍生物的反应性树脂。
反应性树脂可以其单体或二聚、三聚形式等、直至且包括其低聚形式使用。
反应性树脂彼此、或与其它共反应性化合物例如醇(单官能或多官能性)或乙烯基醚(单官能或多官能性)的混合物也是可能的。
在用于阳离子UV固化的引发剂中,特别地可使用基于锍碘和茂金属的体系。对于基于锍的阳离子的实例,可参考US 6,908,722 B1(特别地是第10至21栏)中所示的细节。
用作以上提及的阳离子的抗衡离子的阴离子的实例包括四氟硼酸根、四苯基硼酸根、六氟磷酸根、高氯酸根、四氯铁酸根、六氟砷酸根、六氟锑酸根、五氟羟基锑酸根、六氯锑酸根、四(五氟苯基)硼酸根、四(五氟甲基苯基)硼酸根、双(三氟甲磺酰基)酰胺和三(三氟甲磺酰基)甲基根。特别地对于基于碘的引发剂,其它可想到的阴离子为氯根、溴根或碘根,但是优选基本上不含氯和溴的引发剂。
更具体地,可使用的体系包括:
·锍盐(参见例如,US 4,231,951 A、US 4,256,828 A、US 4,058,401 A、US 4,138,255 A和US 2010/063221 A1),例如三苯基锍六氟砷酸盐、三苯基锍六氟硼酸盐、三苯基锍四氟硼酸盐、三苯基锍四(五氟苄基)硼酸盐、甲基二苯基锍四氟硼酸盐、甲基二苯基锍四(五氟苄基)硼酸盐、二甲基苯基锍六氟磷酸盐、三苯基锍六氟磷酸盐、三苯基锍六氟锑酸盐、二苯基萘基锍六氟砷酸盐、三甲苯基锍六氟磷酸盐、茴香基二苯基锍六氟锑酸盐、4-丁氧基苯基二苯基锍四氟硼酸盐、4-氯苯基二苯基锍六氟锑酸盐、三(4-苯氧基苯基)锍六氟磷酸盐、二(4-乙氧基苯基)甲基锍六氟砷酸盐、4-乙酰基苯基二苯基锍四氟硼酸盐、4-乙酰基苯基二苯基锍四(五氟苄基)硼酸盐、三(4-硫甲氧基苯基)锍六氟磷酸盐、二(甲氧基磺酰基苯基)甲基锍六氟锑酸盐、二(甲氧基萘基)甲基锍四氟硼酸盐、二(甲氧基萘基)甲基锍四(五氟苄基)硼酸盐、二(甲酯基苯基)甲基锍六氟磷酸盐、(4-辛氧基苯基)二苯基锍四(3,5-双(三氟甲基)苯基)硼酸盐、三[4-(4-乙酰基苯基)硫苯基]锍四(五氟苯基)硼酸盐、三(十二烷基苯基)锍四(3,5-双-三氟甲基苯基)硼酸盐、4-乙酰氨基苯基二苯基锍四氟硼酸盐、4-乙酰氨基苯基二苯基锍四(五氟苄基)硼酸盐、二甲基萘基锍六氟磷酸盐、三氟甲基二苯基锍四氟硼酸盐、三氟甲基二苯基锍四(五氟苄基)硼酸盐、苯基甲基苄基锍六氟磷酸盐、5-甲基噻蒽六氟磷酸盐、10-苯基-9,9-二甲基噻吨六氟磷酸盐、10-苯基-9-氧代噻吨四氟硼酸盐、10-苯基-9-氧代噻吨四(五氟苄基)硼酸盐、5-甲基-10-氧代噻蒽四氟硼酸盐、5-甲基-10-氧代噻蒽四(五氟苄基)硼酸盐和5-甲基-10,10-二氧代噻蒽六氟磷酸盐,
·碘盐(参见例如,US 3,729,313 A、US 3,741,769 A、US 4,250,053 A、US 4,394,403 A和US 2010/063221 A1),例如二苯基碘四氟硼酸盐、二(4-甲基苯基)碘四氟硼酸盐、苯基-4-甲基苯基碘四氟硼酸盐、二(4-氯苯基)碘六氟磷酸盐、二萘基碘四氟硼酸盐、二(4-三氟甲基苯基)碘四氟硼酸盐、二苯基碘六氟磷酸盐、二(4-甲基苯基)碘六氟磷酸盐、二苯基碘六氟砷酸盐、二(4-苯氧基苯基)碘四氟硼酸盐、苯基-2-噻吩基碘六氟磷酸盐、3,5-二甲基吡唑基-4-苯基碘六氟磷酸盐、二苯基碘六氟锑酸盐、2,2'-二苯基碘四氟硼酸盐、二(2,4-二氯苯基)碘六氟磷酸盐、二(4-溴苯基)碘六氟磷酸盐、二(4-甲氧基苯基)碘六氟磷酸盐、二(3-羧基苯基)碘六氟磷酸盐、二(3-甲氧基羰基苯基)碘六氟磷酸盐、二(3-甲氧基磺酰基苯基)碘六氟磷酸盐、二(4-乙酰氨基苯基)碘六氟磷酸盐、二(2-苯并噻吩基)碘六氟磷酸盐,
二芳基碘三(三氟甲磺酰基)甲基化物,例如
二苯基碘六氟锑酸盐,
二芳基碘四(五氟苯基)硼酸盐,例如
二苯基碘四(五氟苯基)硼酸盐、
(4-n-去硅烷氧基苯基)苯基碘六氟锑酸盐、[4-(2-羟基-n-四去硅烷氧基)苯基]苯基碘六氟锑酸盐、[4-(2-羟基-n-四去硅烷氧基)苯基]苯基碘三氟磺酸盐、[4-(2-羟基-n-四去硅烷氧基)苯基]苯基碘六氟磷酸盐、[4-(2-羟基-n-四去硅烷氧基)苯基]苯基碘四(五氟苯基)硼酸盐、双(4-叔丁基苯基)碘六氟锑酸盐、双(4-叔丁基苯基)碘六氟磷酸盐、双(4-叔丁基苯基)碘三氟磺酸盐、双(4-叔丁基苯基)碘四氟硼酸盐、双(十二烷基苯基)碘六氟锑酸盐、双(十二烷基苯基)碘四氟硼酸盐、双(十二烷基苯基)碘六氟磷酸盐、双(十二烷基苯基)碘三氟甲磺酸盐、二(十二烷基苯基)碘六氟锑酸盐、二(十二烷基苯基)碘三氟甲磺酸盐、二苯基碘硫酸氢盐、4,4'-二氯二苯基碘硫酸氢盐、4,4'-二溴二苯基碘硫酸氢盐、3,3'-二硝基二苯基碘硫酸氢盐、4,4'-二甲基二苯基碘硫酸氢盐、4,4'-双(琥珀酰亚氨基二苯基)碘硫酸氢盐、3-硝基二苯基碘硫酸氢盐、4,4'-二甲氧基二苯基碘硫酸氢盐、双(十二烷基苯基)碘四(五氟苯基)硼酸盐、(4-辛氧基苯基)苯基碘四(3,5-双-三氟甲基苯基)硼酸盐和(甲苯基异丙苯基)碘四(五氟苯基)硼酸盐,
和
·二茂铁盐(参见例如,EP 0542716B1)例如η5-(2,4-环戊二烯-1-基)-[(1,2,3,4,5,6,9)-(1-甲基乙基)苯]铁。
商业化的光引发剂的实例为得自Union Carbide的Cyracure UVI-6990、CyracureUVI-6992、Cyracure UVI-6974和Cyracure UVI-6976;得自Adeka的Optomer SP-55、Optomer SP-150、Optomer SP-151、Optomer SP-170和Optomer SP-172;得自SanshinChemical的San-Aid SI-45L、San-Aid SI-60L、San-Aid SI-80L、San-Aid SI-100L、San-Aid SI-110L、San-Aid SI-150L和San-Aid SI-180L;得自Sartomer的SarCat CD-1010、SarCat CD-1011和SarCat CD-1012;得自Degussa的Degacure K185;得自Rhodia的Rhodorsil光引发剂2074;得自Nippon Soda的CI-2481、CI-2624、CI-2639、CI-2064、CI-2734、CI-2855、CI-2823和CI-2758;得自IGM Resins的Omnicat 320、Omnicat 430、Omnicat432、Omnicat 440、Omnicat 445、Omnicat 550、Omnicat 550BL和Omnicat 650;得自Daicel的Daicat II;得自Daicel-Cytec的UVAC 1591;得自3M的FFC 509;得自Midori Kagaku的BBI-102,BBI-103、BBI-105、BBI-106、BBI-109、BBI-110、BBI-201、BBI-301、BI-105、DPI-105、DPI-106、DPI-109、DPI-201、DTS-102、DTS-103、DTS-105、NDS-103、NDS-105、NDS-155、NDS-159、NDS-165、TPS-102、TPS-103、TPS-105、TPS-106、TPS-109、TPS-1000、MDS-103、MDS-105、MDS-109、MDS-205、MPI-103、MPI-105、MPI-106、MPI-109、DS-100、DS-101、MBZ-101、MBZ-201、MBZ-301、NAI-100、NAI-101、NAI-105、NAI-106、NAI-109、NAI-1002、NAI-1003、NAI-1004、NB-101、NB-201、NDI-101、NDI-105、NDI-106、NDI-109、PAI-01、PAI-101、PAI-106、PAI-1001、PI-105、PI-106、PI-109、PYR-100、SI-101、SI-105、SI-106和SI-109;得自Nippon Kayaku的Kayacure PCI-204、Kayacure PCI-205、Kayacure PCI-615、KayacurePCI-625、Kayarad220和Kayarad 620、PCI-061T、PCI-062T、PCI-020T、PCI-022T;得自SanwaChemical的TS-01和TS-91;得自Deuteron的Deuteron UV 1240;得自Evonik的TegoPhotocompound 1465N;得自GE Bayer Silicones的UV 9380C-D1;得自Cytec的FX 512;得自Bluestar Silicones的Silicolease UV Cata 211;以及得自BASF的Irgacure 250、Irgacure 261、Irgacure 270、Irgacure PAG 103、Irgacure PAG 121、Irgacure PAG 203、Irgacure PAG 290、Irgacure CGI 725、Irgacure CGI 1380、Irgacure CGI 1907和Irgacure GSID 26-1。
本领域技术人员应意识到,根据本发明同样地可使用另外的体系。光引发剂以未组合的形式、或以两种或更多种光引发剂的组合使用。
任选地存在的合适的增粘树脂为本领域技术人员已知的增粘树脂,例如得自Satas。
特别有利地,压敏胶粘剂包含至少一种类型的优选至少部分氢化的增粘树脂,有利地与弹性体组分相容的增粘树脂,或如果使用由硬嵌段和软嵌段形成的共聚物,则主要与软嵌段相容的树脂(增塑剂树脂)。
当相应的增粘树脂具有通过环球法测量的大于25℃的软化温度时是有利的。当另外使用至少一种类型的具有小于20℃的软化温度的增粘树脂时是额外有利的。如果需要,通过该方式可一方面微调胶粘剂特性、而且另一方面微调对粘结基底的适应特性。
对于较为非极性的弹性体,在压敏胶粘剂中使用的树脂可有利地为基于松香和松香衍生物的部分或完全氢化的树脂、二环戊二烯的氢化的聚合物、基于C5、C5/C9或C9单体流的部分、选择性或完全氢化的烃树脂、基于α-蒎烯和/或β-蒎烯和/或δ-柠檬烯和/或Δ3-蒈烯的聚萜烯树脂、优选地纯的C8和C9芳族的氢化的聚合物。以上提及的增粘树脂可单独地或以混合物使用。
可使用在室温下固态或液态的树脂。为了确保高的老化和UV稳定性,优选具有至少90%,优选地至少95%的氢化度的氢化树脂。
可添加惯用的添加剂至所述胶粘剂,例如老化稳定剂(抗臭氧剂、抗氧化剂、光稳定剂等)。
典型地可使用的另外的添加剂如下:
●增塑剂,例如增塑剂油或低分子量的液体聚合物,例如低分子量的聚丁烯
●主抗氧化剂,例如位阻酚
●辅抗氧化剂,例如亚磷酸酯或硫代醚
●加工稳定剂,例如碳自由基清除剂
●光稳定剂,例如UV吸收剂或位阻胺
●加工助剂和
●末端嵌段增强剂树脂。
进一步优选的的是使用如下的胶粘剂,其在特定的实施方式中在可见光光谱(波长范围为约400nm至800nm)中是透明的。“透明度”意为胶粘剂在可见光范围内的平均透射率为至少75%、优选地高于90%,其中该考虑涉及未经修正的透射率,即没有计算排除界面间反射损失。
优选地,胶粘剂具有小于5.0%、优选地小于2.5%的雾度。
更优选地,本发明的胶粘剂为压敏胶粘剂。这使得易于使用性可为特别良好的,因为所述胶粘剂在交联之前已经粘结在待粘结的位置处。
压敏胶粘剂指这样的胶粘剂:其即使在相对温和的接触压力下,也容许于基底持续粘结,并且在使用之后可再次基本上无残留地从基底分离。压敏胶粘剂在室温下是永久压敏胶粘性的,并且因此具有足够低的粘度和高的接触粘性,使得它们即使在低的接触压力下,也润湿相应的基底的表面。相应胶粘剂的粘结能力基于其胶粘性质,和可再分离性基于其内聚性质。用于压敏胶粘剂的基础物包括多种材料。
本发明另外涉及在一侧或两侧上涂覆有本发明的胶粘剂的胶带。在此,该胶带也可为转移胶带。胶带实现特别简单且精确的粘结,以及因此是特别合适的。
最后,本发明涉及本发明的胶粘剂或本发明的胶带作为密封剂(封口膏)的用途、特别地用于有机电子设备中的组件的封装。如上所详述,必须保护组件免受水(蒸气)影响在有机电子设备中是极为重要的。由于它们的非常良好的阻隔性质,本发明的胶粘剂或胶带能够产生相应的保护。由于高透明度和对待封装的电子设备的低损害,本发明的胶粘剂和本发明的胶带除边缘封装外特别地还适于有机电子设备的整个区域封装。一般表述“胶带”包括在一侧或两侧设置有(压敏)胶粘剂的载体材料。所述载体材料包括任何平坦结构体,例如在二维上延伸的膜或膜片段、具有伸长的长度和受限的宽度的带、带片段、模切件(例如(光)电子器件的边缘或边界的形式)、多层器件等。对于各种应用,可将广泛多样的不同载体例如膜、纺织物、非织造布和纸与胶粘剂组合。此外,术语“胶带”也包括所谓的“转移胶带”,即没有载体的胶带。在转移胶带的情况下,胶粘剂替代地在施用前施加在设有剥离层和/或具有抗胶粘性质的柔性衬垫之间。对于施用,常规地是这样的情况:首先将一个衬垫除去,施用胶粘剂,然后将第二衬垫除去。由此可将胶粘剂直接用于粘结(光)电子器件中的两个表面。
其中没有两个衬垫而是替代地具有单一的双面分离衬垫的胶带也是可能的。在那种情况下,胶带幅面在其顶侧上被双面分离衬垫的一侧覆盖且在其底侧上被双面分离衬垫的相反侧覆盖,特别地以捆或卷的相邻卷绕。
用于胶带的载体材料优选地包括聚合物膜、膜复合体、或设置有有机和/或无机层的膜或膜复合体,其中优选的是膜,尤其尺寸稳定的聚合物膜或金属箔。这种膜/膜复合体可由任何惯常用于制造膜的塑料组成,例如但不限于:
聚乙烯、聚丙烯特别地通过单或双轴拉伸制造的取向的聚丙烯(OPP)、环状烯烃共聚物(COC)、聚氯乙烯(PVC)、聚酯特别地聚对苯二甲酸乙二醇酯(PET)和聚萘二甲酸乙二醇酯(PEN)、乙烯-乙烯醇(EVOH)、聚偏氯乙烯(PVDC)、聚偏氟乙烯(PVDF)、聚丙烯腈(PAN)、聚碳酸酯(PC)、聚酰胺(PA)、聚醚砜(PES)或聚亚酰胺(PI)。
聚酯膜具有确保热稳定性和引入提高的机械稳定性的优点。因此,最优选地,本发明的衬垫中的载体层由聚酯膜组成,例如双轴拉伸的聚对苯二甲酸乙二醇酯。
在优选的实施方案中,载体材料还包括对一种或多种特定的渗透物(特别地对水蒸气和氧气)的阻隔功能(功能物)。这样的阻隔功能可由有机或无机材料组成。具有阻隔功能的载体材料描述于EP 2 078 608 A1中。
更优选地,载体材料包括至少一个无机阻隔层。特别良好适合性的无机阻隔层为在减压下(例如通过蒸发、CVD、PVD、PECVD)或在大气压下(例如通过大气等离子体、反应性电晕放电或火焰热解)沉积的金属,例如铝、银、金、镍,或特别地金属化合物例如金属氧化物、金属氮化物、或金属氢氮化物,例如硅、硼、铝、锆、铪或碲的氧化物或氮化物,或氧化铟锡(ITO)。同样合适的为已掺杂有另外的元素的上述变体的层。
在双面(自粘-)胶带的情况下,所使用的上层和下层可为相同或不同种类的和/或相同或不同层厚度的本发明的胶粘剂。载体在一侧或两侧上可根据现有技术进行预处理,使得例如实现在胶粘剂锚固的改善。一侧或两侧设置有功能层(其例如可起到阻隔层的作用)也是可能的。压敏胶粘剂层可任选地被剥离纸或剥离膜覆盖。替代地,仅使一个胶粘剂层被双面的分离衬垫覆盖也是可能的。在一个变型中,在双面(自粘-)胶带中设置本发明的胶粘剂,以及另外的胶粘剂例如任何具有对覆盖基底的特别良好的粘附性或显示出特别良好的再定位性(可再配置性)的那些。
以转移胶带的形式存在或涂覆在平坦结构上的压敏胶粘剂的厚度优选地在1μm和2000μm之间、进一步优选地在5μm和500μm之间、和更优选地在约12μm和250μm之间。
当要实现改善的对基底的粘附性和/或阻尼效果时,使用在50μm和150μm之间的层厚度。
在1μm和50μm之间的层厚度减少材料用量。然而,在对基底的粘附性方面存在降低。
对于双面的胶带,对胶粘剂是同样的情况:单独的压敏胶粘剂层的厚度优选地在1μm和2000μm之间、进一步优选地在5μm和500μm之间、且更优选地在约12μm和250μm之间。如果在双面胶带中除了本发明的胶粘剂外还使用另外的胶粘剂,则若其厚度大于150μm,也可为有利的。
在一侧或两侧上涂覆有胶粘剂的胶带通常在制造过程结束时卷绕以得到阿基米德螺旋形式的卷。在双面胶带的情况下,为了防止胶粘剂相互接触,或在单面胶带的情况下,为了防止胶粘剂粘结至载体,在卷绕前将胶带用覆盖材料(也称作分离材料)覆盖,其与胶带一起卷绕。本领域技术人员以衬垫或剥离衬垫的名称知晓这样的覆盖材料。不但覆盖单-或双面胶带,衬垫还用于覆盖纯的胶粘剂(转移胶带)和胶带片段(例如标签)。
另外的独立权利要求涉及用于保护设置在基底上的有机电子器件的方法,其中以如下方式将覆盖物施用至电子器件,使得电子器件至少部分地被覆盖物覆盖,其中将所述覆盖物另外地粘结在基底和/或电子器件的至少部分区域上,其中所述粘结通过至少一个胶粘剂的层产生。胶粘剂层特别地作为胶带的层存在(采取胶带的层的形式)。
本发明的方法可有利地以如下方式进行:首先施用(压敏)胶粘剂层,其任选地作为包括另外的层的双面胶带的组成部分,且在随后的步骤中将覆盖物施用至基底和/或电子器件。在另外的有利程序中,(压敏)胶粘剂层(其任选地作为包括另外的层的双面胶带的组成部分)和覆盖物一起施用至基底和/或电子器件。
在本发明的方法中,因此可首先将转移胶带粘结至基底或电子器件,或首先粘结至覆盖物。然而,优选的是首先将转移胶带粘结至覆盖物,因为由此可独立于电子器件预制电子功能单元的一个组成部分且通过层压作为整体将其附上(贴上)。
有利地,本发明的方法可以如下方式进行:覆盖物和/或(压敏)胶粘剂层(其特别地作为转移胶带)完全覆盖电子器件,因为光散射作用于是影响电子器件的整个面积(区域)。
转移胶带层压在电子器件的整个区域上另外地消除可能被封入仅边缘封装的器件的气体空间中的有害渗透物的任何影响,因为不存在气体空间。
本发明的方法优选地以如下方式进行:将围绕电子器件的基底的区域也通过覆盖物完全或部分地覆盖,在该情况下,用于粘结的胶带可覆盖电子器件的整个区域并且优选地同样覆盖围绕电子器件的基底的区域,优选地与覆盖物相同的区域,或可施用在所述区域的部分上,例如以围绕电子器件的框的形式,优选地在也被覆盖物覆盖的区域中和任选地另外在电子器件上的边缘区域中。
本发明进一步提供包括至少一个(光)电子结构体和本发明胶粘剂的层的(光)电子器件,其中胶粘剂层完全覆盖(光)电子结构体。
本发明的进一步细节、特征和优点在以下通过优选的实施例被详细地说明。附图显示:
图5为示意图形式的根据现有技术的(光)电子器件,
图6为示意图形式的本发明的第一(光)电子器件,
图7为示意图形式的本发明的第二(光)电子器件。
图5显示根据现有技术的有机电子器件1的第一构造。该器件1具有其上设置有电子结构体3的基底2。基底2本身采取针对渗透物的阻隔物的形式,并因此形成电子结构体3的封装的部分。在电子结构体3上方,在本情况下也与其在空间上分离,设置另外的覆盖物4,其采取阻隔物的形式。
为了还在侧面封装电子结构体3且同时另外将覆盖物4粘结至电子器件1,在基底2上的电子结构体3旁的周边周围提供胶粘剂5。胶粘剂是首先粘结至基底2还是首先粘结至覆盖物4在此是不重要的。胶粘剂5将覆盖物4粘结至基底2。通过适当厚的构造,胶粘剂5另外能够使覆盖物4与电子结构体3分开。
胶粘剂5是根据现有技术的胶粘剂,即具有高的渗透阻隔的胶粘剂,其可另外地用吸气剂材料填充至高的含量。胶粘剂的透明度在该组件中是不相关的。
在本情况中,转移胶带将以模切件的形式提供,其由于精密的几何结构而比基本上在整个区域上施用的转移胶带更难以处理。
图6显示本发明的(光)电子器件1的构造。再次示出的是设置在基底2上且被基底2从下面封装的电子结构体3。在所述电子结构体的上方和侧面,现在将本发明的胶粘剂例如以转移胶带6的形式设置在整个区域上。电子结构体3因此被转移胶带6从上方完全封装。然后将覆盖物4施用至转移胶带6。转移胶带6为基于以一般形式如上所述的和下文中在实施例中详述的本发明的转移胶带的。在示出的型式中,转移胶带仅由本发明的胶粘剂的一个层组成。
与以上构造相比,覆盖物4不需要必须满足高的阻隔要求,因为当电子器件被转移胶带完全覆盖时,已经由胶粘剂提供了阻隔。覆盖物4可例如仅呈现机械保护功能,但其也可另外提供作为渗透阻隔物。
图7显示(光)电子器件1的替代的构造。与以上构造相比,现提供两个转移胶带6a、b,其在本情况中是相同的,但是也可不同。第一转移胶带6a设置在基底2的整个区域上。电子结构体3提供在转移胶带6a上且通过转移胶带6a固定。然后,用另外的转移胶带6b完全覆盖由转移胶带6a和电子结构体3组成的复合体,使得电子结构体3从所有侧面被转移胶带6a、b封装。又在转移胶带6b上方提供覆盖物4。
因此,在该构造中,基底2和覆盖物4均不需要必须具有阻隔性质。但是,它们也可被提供以进一步限制渗透物渗透至电子结构体3。
特别地关于图6和7,指出这些是示意图。更特别地,从所述图示不清晰的是,在此处且优选在各情况下的转移胶带具有均匀的层厚度。因此,没有至电子结构体的过渡处形成的陡沿(尖缘),如图中出现的情况;替代地,过渡是流体的(流利的,flieβend)并且事实上可保留小的未填充的或气体填充的区域。然而,如果必要,也可进行与基底匹配、特别地是当在减压下进行施用时。此外,胶粘剂经受不同程度的局部压缩,使得流动过程可导致对在边缘结构处的高度差的一定程度的补偿。显示的尺寸不是按比例的,而是替代地仅用于更好的说明。特别地,电子结构体本身通常是相对平的(经常小于1μm厚)。
胶粘剂与电子组件的直接接触也不是强制性的。也可在其间设置另外的层,例如电子组件的薄层封装或阻隔膜。
转移胶带的厚度可包括所有惯常的厚度,例如1μm直至3000μm。优选在25和100μm之间的厚度,因为粘结力和处理性质在该范围内是特别有益的。另外优选的范围为3至25μm的厚度,因为在该范围内渗透通过粘结线(胶层)的物质的量可在封装应用中仅穿过小的粘结线的横截面积而保持在低水平。
为了制造根据本发明的转移胶带,将胶带的载体或衬垫在一侧上用本发明的胶粘剂从溶液或分散体或以纯的形式(例如熔体)涂覆或印刷,或胶带通过(共)挤出制造。替代地,可将本发明的胶粘剂层通过层压转移至载体材料或衬垫进行制造。胶粘剂层可通过热或高能射线交联。
优选地,该制造方法在其中特定的渗透物仅以低的浓度存在或几乎不存在的环境中进行。一个实例为小于30%、优选地小于15%的相对空气湿度。
实施例
测试方法
除非另有说明,测量在23±1℃和50±5%相对空气湿度的测试条件下进行。
穿透时间的测定(寿命测试)
用于测定电子组件的寿命的方式为钙测试。这示于图1中。为此,将大小为10×10mm2的薄钙层23在减压下沉积在玻璃载片(载玻片)21上,然后在氮气气氛下储存。钙层23的厚度为约100nm。对于封装钙层23,使用具有待测试的胶粘剂22的胶带(23×23mm2)和作为载体材料的薄玻璃载片24(35μm,得自Schott)。为了稳定化,通过50μm厚的转移胶带25将薄玻璃载片与100μm厚的PET膜26层压以得到视觉上高透明度的丙烯酸酯压敏胶粘剂。以如下方式将胶粘剂22施用至玻璃载片21:胶粘剂22在所有侧上以6.5mm的过量余量(A-A)覆盖钙镜23。由于不透的玻璃载体24,仅通过压敏胶粘剂或沿着界面的渗透被测定。
所述测试基于钙与水蒸气和氧气的反应,例如A.G。Erlat等在“47th AnnualTechnical Conference Proceedings-Society of Vacuum Coaters”,2004,第654至659页中和M.E.Gross等在“46th Annual Technical Conference Proceedings-Society ofVacuum Coaters”,2003,第89至92页中所述的。这涉及监测钙层的光透射,其由于转化成氢氧化钙和氧化钙而增加。在所述的测试装置中,这从边缘进行,使得钙镜的可视区域减小。直到钙镜的光吸收减半的时间称作寿命。所述方法涵盖从边缘的钙镜的区域的减少和经由所述区域中的点劣化以及由在整个区域上劣化造成的钙镜的层厚度的均匀减小。
所选择的测量条件为60℃和90%相对空气湿度。将试样在整个区域上且没有气泡的情况下与层厚度50μm的压敏胶粘剂粘结。钙镜的劣化经由透射测量来监测。穿透时间被定义为水分覆盖至钙的距离所花费的时间(参见图2)。在达到该时间之前,在60℃/90%的相对湿度下在钙镜的透射方面仅略有变化,然后显著上升。
对水蒸气的渗透性
根据ASTM F-1249进行水蒸气的渗透性(WVTR)的测定。为此,将压敏胶粘剂以50μm的层厚度施用至高度渗透的聚砜膜(可得自Sartorius),其本身对渗透阻隔没有做出任何贡献。水蒸气渗透性用OX-Tran 2/21测量仪器在37.5℃和90%的相对湿度下测定。
分子量
通过凝胶渗透色谱法(GPC)进行数均分子量Mn和重均分子量Mw的分子量测定。使用的洗脱剂为具有0.1体积%的三氟乙酸的THF(四氢呋喃)。测量在25℃进行。使用的预备柱为PSS-SDV,5μ,ID 8.0mm×50mm。为了分离,使用的柱为PSS-SDV,5μ,103和105和106,各自具有ID 8.0mm×300mm。样品浓度为4g/l;流速为1.0ml/分钟。针对聚苯乙烯标准物进行测量。
MMAP和DACP
MMAP为混合的甲基环己烷/苯胺浊点,其使用改进的ASTM C 611方法测定。使用甲基环己烷代替在标准测试方法中所使用的庚烷。所述方法以1/2/1的比例(5g/10ml/5ml)使用树脂/苯胺/甲基环己烷,并且浊点通过如下测定:将三种成分的加热的透明混合物冷却直至刚出现完全的混浊。
DACP为二丙酮浊点,并且通过如下测定:将5g树脂、5g二甲苯和5g二丙酮醇的加热的溶液冷却至溶液变成混浊时的点。
环球法软化温度
增粘树脂软化温度通过标准方法测定,其已知为环球法且根据ASTM E28标准化。
树脂的增粘树脂软化温度使用Herzog HRB 754环球法测试仪测定。首先用研钵和研杵将树脂试样细粉碎。将所得的粉末填入具有底部开口的黄铜圆筒中(在圆筒上部处的内径为20mm,圆筒的底部开口的直径为16mm,圆筒的高度为6mm),并且在热台上熔化。选择填充体积使得熔化后的树脂没有过量地完全填充圆筒。
将所得的试样与圆筒一起置于HRB 754的样品架中。如果增粘树脂软化温度在50℃和150℃之间,则调温浴用甘油填充。在较低的增粘树脂软化温度下,也可使用水浴进行工作。测试球具有9.5mm的直径并且重3.5g。根据HRB 754程序,将球布置在调温浴中的测试试样上面并且放置在测试试样上。收集板位于圆筒底部下方25mm处,并且在该收集板上方2mm为遮光器。在测量过程期间,以5℃/分钟提高温度。在增粘树脂软化温度的温度范围内,球开始移动通过圆筒的底部开口,直至其最终在收集板上静止。在该位置处,其被遮光器检测并且记录此时的调温浴的温度。进行双重测定。增粘树脂软化温度为两次单独测定的平均值。
雾度和透射率的测量
雾度值说明被照射的样品以广角向前散射的透射光的比例。因此,雾度值量化了破坏透明度的层的不透明性质。
类似于ASTM D1003-11(程序A(Byk Haze-gard双重雾度计),D65标准光源)在室温下在50μm厚的胶粘剂的层上测定胶粘剂的透射率和雾度。没有进行界面反射损失的修正。
在薄的转移胶带的情况下,为了不使测量结果失真,正确应用测量仪器是重要的,因而使用了辅助载体。使用的载体为得自GE Plastics的PC膜(Lexan 8010膜,厚度125μm)。
该载体满足将胶带试样平坦地安装至测量通道的所有标准(光滑的平坦表面、非常低的雾度值、高透射率、高均匀性)。
胶粘剂层
对于胶粘剂层的制造,通过实验室铺展仪器将各种胶粘剂从溶液施用至常规的衬垫(硅化的聚酯膜)并且干燥。干燥后的胶粘剂层厚度为50±5μm。在各情况下首先在室温下干燥10分钟,并且在实验室干燥箱中在120℃下干燥10分钟。将干燥的胶粘剂层各自在干燥之后立刻用第二衬垫(具有较低的剥离力的硅化的聚酯膜)在开放侧上层压。
使用的原材料:
通过下列方法制备聚丙烯酸酯:
常规类型的2L玻璃反应器中被投入40g的丙烯酸2-羟乙酯、240g的丙烯酸2-乙基己酯、120g的C17丙烯酸酯(三个具有C3-C4链片段的支化的侧链,BASF SE)、133g的69/95特殊沸点汽油和133g的丙酮用于自由基聚合。在伴随着搅拌且反应溶液通氮气45分钟之后,将反应器加热至58℃并且添加0.2g的Vazo 67(得自DuPont)。随后,将外部加热浴加热至75℃并且反应在该外部温度下恒定地进行。在1小时之后,添加50g的甲苯。在2.5小时之后,用100g的丙酮进行稀释。在4小时的反应时间之后,添加另外的0.2g Vazo 67。在7小时的聚合时间之后,用100g的60/95特殊沸点汽油进行稀释,并且在22小时之后用100g的丙酮进行稀释。在24小时的反应时间之后,停止聚合并且将反应容器冷却至室温。分子量Mn为884000g/mol。
所选择的共聚物为得自Kaneka的聚苯乙烯-嵌段-聚异丁烯嵌段共聚物。整体聚合物中的苯乙烯的比例为20重量%。使用Sibstar 62M。摩尔质量Mw为60 000g/mol。聚苯乙烯嵌段的玻璃化转变温度为100℃,并且聚异丁烯嵌段的玻璃化转变温度为-60℃。所使用的增粘树脂为得自Exxon的Escorez 5300(环球法105℃,DACP=71,MMAP=72),完全氢化的烃树脂。所选择的反应性树脂为得自Dow的Uvacure 1500,脂环族二环氧化物。将这些原材料和任选地烷氧烷溶解于甲苯(300g)、丙酮(150g)和60/95特殊沸点汽油(550g)的混合物中,以得到50重量%溶液。
随后,将光引发剂添加至溶液。所述光引发剂采取在碳酸亚丙酯中的50重量%溶液的形式。光引发剂在320nm至360nm的范围内具有最大吸收。
各实施例V1至V7以及K1至K3的精确组成可见于表1中。
表1:
将试样引入手套箱中。将一部分试样在没有气泡的情况下用橡胶辊层压至已经历钙蒸气沉积的玻璃基底上。在其上覆盖有第二PET衬垫,并且层压薄玻璃的层。随后,借助UV光(剂量:80mJ/cm2;灯类型:未经掺杂的汞源)通过覆盖玻璃而固化。将该试样用于寿命测试。
未添加水清除剂的基础胶粘剂(V1/V2/V5)和丙烯酸酯胶粘剂(V7)的水分渗透测量的结果示于表2中。
表2:
V1 | V2 | V5 | V7 | |
WVTR/g m-2d-1 | 7 | 6 | 22 | 673 |
这显示,除了V7之外,这里所述的所有胶粘剂具有非常低的WVTR值(小于100g/m2d、优选地小于50g/m2d、特别地小于15g/m2d)。如果将这些结果与所实现的阻隔性质比较,经发现,仅本发明的胶粘剂具有小于100g/m2d的穿透时间(迟延时间)。
在钙测试中测定的水的穿透时间列于下表3中。
表3:
首先,K1和V8的比较显示,硅烷上的可活化基团是有利的。此外,V3和V4的比较显示,令人惊奇地,不仅可通过聚合并入硅烷的任何基团是有利的,而且与反应性树脂相当的基团也是有利的。这不是本领域技术人员所意料的,因为两种基团(乙烯基(V3)和环己基环氧化物基团(V4)两者)在阳离子聚合中被引入。因此,两个比较例的两种组合物几乎是相同的。与V4相反,V3具有提供乙烯基用于阳离子聚合的硅烷吸气剂。经发现(表3),具有与反应性树脂(在该情况下实施例V4的2,3-环氧环己基)中的那些类型相同的反应性基团的硅烷的迟延时间明显更高。
此外,实施例和对比例显示,令人惊奇地,在60℃/90%相对湿度和特别地在85℃/85%相对湿度下,相比于更具反应性的乙烯基-和环氧环己基三甲氧基硅烷两者,不具反应性的三乙氧基硅烷显著是更有利的。
同样地对于非压敏性液体胶粘剂(K3),具有相应的环氧环己基吸气剂可实现在穿透时间方面的显著改善(K3/V5的比较)。
胶粘剂与OLED和正极材料(钙)的相容性
将已知的透明吸气剂以5重量%的比例引入胶粘剂中。这些水清除剂的反应性太大,使得钙表面甚至在钙测试中就经受侵蚀。如果使用TEE,则钙不受影响。这以照片的方式记录于图3中。
通过将这样的胶粘剂粘结至未封装的聚合的OLED并且在60℃/90%相对湿度下储存150小时,证实了可通过聚合并入的(可共聚的)烷氧基硅烷的OLED相容性。作为相反的实施例,标准有机水清除剂(Incozol,V6)显示明显的损伤(暗点)。结果在图4中再现。
表4再次总结了观察结果。
表4:
*DBAPTS:二甲基亚丁基氨基丙基三乙氧基硅烷
Claims (21)
1.阻隔胶粘剂,其包括
由以下组成的胶粘剂基础物
-具有至少一个可活化基团的至少一种反应性树脂,
-至少一种聚合物,特别地弹性体,
-任选地至少一种增粘树脂,
其中所述胶粘剂基础物在反应性树脂活化之后具有小于100g/m2d、优选地小于50g/m2d、特别地小于15g/m2d的水蒸气渗透速率,
透明的分子分散的吸气剂材料和
任选地溶剂,
其特征在于
所述吸气剂材料为具有至少一个烷氧基基团和至少一个可活化基团的至少一种硅烷。
2.根据权利要求1所述的阻隔胶粘剂,其特征在于,所述反应性树脂和硅烷具有相同类型的,特别地相同的可活化基团。
3.根据权利要求1或2所述的阻隔胶粘剂,其特征在于,所述烷氧基基团为乙氧基基团。
4.根据权利要求1至3至少一项所述的阻隔胶粘剂,其特征在于,吸气剂材料的量为胶粘剂的至少2重量%、优选地至少3重量%、特别地至少5重量%。
5.根据前述权利要求至少一项所述的阻隔胶粘剂,其特征在于,吸气剂材料的量不大于15重量%。
6.根据前述权利要求至少一项所述的阻隔胶粘剂,其特征在于,吸气剂材料的量为3重量%至15重量%、优选地4重量%至10重量%并且特别地4.5重量%至7重量%。
7.根据前述权利要求至少一项所述的阻隔胶粘剂,其特征在于,所述可活化基团为选自包括环醚基团、特别地环氧化物和环氧丙烷、丙烯酸酯和甲基丙烯酸酯的组的至少一种基团。
8.根据前述权利要求至少一项所述的阻隔胶粘剂,其特征在于,至少一种反应性树脂包含选自缩水甘油基和环氧环己基基团的至少一种基团作为可活化基团。
9.根据前述权利要求至少一项所述的阻隔胶粘剂,其特征在于,所述至少一种硅烷为以下通式的化合物
其中R为烷基或芳基基团,其中特别优选的是乙基;
其中X为具有缩水甘油基或环氧环己基基团、丙烯酸酯或甲基丙烯酸酯的基团;
并且Z为烷基或芳基基团或烷氧基基团,
其中基团Z可相同或不同。
10.根据权利要求9所述的阻隔胶粘剂,其特征在于,至少一个基团Z为乙氧基基团。
11.根据前述权利要求至少一项所述的阻隔胶粘剂,其特征在于,所述胶粘剂为压敏胶粘剂。
12.根据前述权利要求至少一项所述的阻隔胶粘剂,其特征在于,其以阳离子的方式、且优选地以热或辐射诱导的方式固化。
13.根据前述权利要求至少一项所述的阻隔胶粘剂,其特征在于,其进一步包括光引发剂。
14.胶带,其包括根据权利要求1至13任一项所述的阻隔胶粘剂。
15.根据权利要求1至13任一项所述的阻隔胶粘剂或根据权利要求14所述的胶带用于有机电子设备中的组件的封装的用途。
16.用于保护设置在基底上的有机电子器件的方法,
其中以如下方式将覆盖物施用至电子器件,使得所述电子器件至少部分地被所述覆盖物覆盖,
其中将所述覆盖物另外地粘结在基底上和/或在电子器件上的至少部分区域上,
其中所述粘结通过至少一个根据前述权利要求任一项中所述的胶粘剂的层产生。
17.根据权利要求16所述的方法,
其特征在于,
所述阻隔胶粘剂作为胶带的层存在。
18.根据前述权利要求至少一项所述的方法,
其特征在于,
首先施用胶粘剂层,其任选地作为包括另外的层的双面胶带的组成部分,和在随后的步骤中将所述覆盖物施用至基底和/或电子器件。
19.根据前述权利要求至少一项所述的方法,
其特征在于,
将所述胶粘剂层和所述覆盖物一起施用至基底和/或电子器件。
20.根据前述权利要求至少一项所述的方法,
其特征在于,
所述覆盖物完全覆盖电子器件。
21.根据前述权利要求至少一项所述的方法,
其特征在于,
在电子器件周围的基底的区域也完全或部分地被所述覆盖物覆盖。
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