JP6474489B2 - 活性化可能なゲッター材料を含む接着剤 - Google Patents
活性化可能なゲッター材料を含む接着剤 Download PDFInfo
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- JP6474489B2 JP6474489B2 JP2017523283A JP2017523283A JP6474489B2 JP 6474489 B2 JP6474489 B2 JP 6474489B2 JP 2017523283 A JP2017523283 A JP 2017523283A JP 2017523283 A JP2017523283 A JP 2017523283A JP 6474489 B2 JP6474489 B2 JP 6474489B2
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- 230000000149 penetrating effect Effects 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- FAQJJMHZNSSFSM-UHFFFAOYSA-N phenylglyoxylic acid Chemical class OC(=O)C(=O)C1=CC=CC=C1 FAQJJMHZNSSFSM-UHFFFAOYSA-N 0.000 description 1
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- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
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- RWPGFSMJFRPDDP-UHFFFAOYSA-L potassium metabisulfite Chemical compound [K+].[K+].[O-]S(=O)S([O-])(=O)=O RWPGFSMJFRPDDP-UHFFFAOYSA-L 0.000 description 1
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 1
- 229910001950 potassium oxide Inorganic materials 0.000 description 1
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- 238000000197 pyrolysis Methods 0.000 description 1
- GRWFGVWFFZKLTI-UHFFFAOYSA-N rac-alpha-Pinene Natural products CC1=CCC2C(C)(C)C1C2 GRWFGVWFFZKLTI-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
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- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- JVBXVOWTABLYPX-UHFFFAOYSA-L sodium dithionite Chemical compound [Na+].[Na+].[O-]S(=O)S([O-])=O JVBXVOWTABLYPX-UHFFFAOYSA-L 0.000 description 1
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- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
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- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229910000348 titanium sulfate Inorganic materials 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- KAKQVSNHTBLJCH-UHFFFAOYSA-N trifluoromethanesulfonimidic acid Chemical compound NS(=O)(=O)C(F)(F)F KAKQVSNHTBLJCH-UHFFFAOYSA-N 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
- DCDZBASUOMHACN-UHFFFAOYSA-N tris(2-dodecylphenyl)sulfanium Chemical compound CCCCCCCCCCCCC1=CC=CC=C1[S+](C=1C(=CC=CC=1)CCCCCCCCCCCC)C1=CC=CC=C1CCCCCCCCCCCC DCDZBASUOMHACN-UHFFFAOYSA-N 0.000 description 1
- ULNJZOIDTANZKR-UHFFFAOYSA-N tris[4-(4-acetylphenyl)sulfanylphenyl]sulfanium Chemical compound C1=CC(C(=O)C)=CC=C1SC1=CC=C([S+](C=2C=CC(SC=3C=CC(=CC=3)C(C)=O)=CC=2)C=2C=CC(SC=3C=CC(=CC=3)C(C)=O)=CC=2)C=C1 ULNJZOIDTANZKR-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 235000021081 unsaturated fats Nutrition 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229940102001 zinc bromide Drugs 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J7/00—Adhesives in the form of films or foils
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/008—Additives improving gas barrier properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/33—Applications of adhesives in processes or use of adhesives in the form of films or foils for batteries or fuel cells
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2453/00—Presence of block copolymer
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Description
溶解度項Sは、主として、浸透物に対するバリア接着剤の親和力を表している。水蒸気の場合は、例えば疎水性材料によって低いS値が達成される。拡散項Dは、バリア材料中での浸透物の可動性に関する尺度であり、分子の可動性または自由体積のような特性に直接的に左右される。強架橋された材料または高結晶質の材料ではしばしば比較的低いD値が達成される。しかしながら高結晶質の材料は一般的にあまり透明ではなく、比較的強い架橋は柔軟性を相対的に低くする。浸透性Pは、通常は分子の可動性が増すとともに上昇し、例えば温度が上昇する場合またはガラス転移点を超える場合にも上昇する。
・スルホニウム塩(例えばUS4,231,951A(特許文献9)、US4,256,828A(特許文献10)、US4,058,401A(特許文献11)、US4,138,255A(特許文献12)、およびUS2010/063221A1(特許文献13)を参照)、
例えばトリフェニルスルホニウムヘキサフルオロアルセネート、トリフェニルスルホニウムヘキサフルオロボレート、トリフェニルスルホニウムテトラフルオロボレート、トリフェニルスルホニウムテトラキス(ペンタフルオロベンジル)ボレート、メチルジフェニルスルホニウムテトラフルオロボレート、メチルジフェニルスルホニウムテトラキス(ペンタフルオロベンジル)ボレート、ジメチルフェニルスルホニウムヘキサフルオロホスフェート、トリフェニルスルホニウムヘキサフルオロホスフェート、トリフェニルスルホニウムヘキサフルオロアンチモネート、ジフェニルナフチルスルホニウムヘキサフルオロアルセネート、トリトリルスルホニウムヘキサフルオロホスフェート、アニシルジフェニルスルホニウムヘキサフルオロアンチモネート、4−ブトキシフェニルジフェニルスルホニウムテトラフルオロボレート、4−クロロフェニルジフェニルスルホニウムヘキサフルオロアンチモネート、トリス(4−フェノキシフェニル)スルホニウムヘキサフルオロホスフェート、ジ(4−エトキシフェニル)メチルスルホニウムヘキサフルオロアルセネート、4−アセチルフェニルジフェニルスルホニウムテトラフルオロボレート、4−アセチルフェニルジフェニルスルホニウムテトラキス(ペンタフルオロベンジル)ボレート、トリス(4−チオメトキシフェニル)スルホニウムヘキサフルオロホスフェート、ジ(メトキシスルホニルフェニル)メチルスルホニウムヘキサフルオロアンチモネート、ジ(メトキシナフチル)メチルスルホニウムテトラフルオロボレート、ジ(メトキシナフチル)メチルスルホニウムテトラキス(ペンタフルオロベンジル)ボレート、ジ(カルボメトキシフェニル)メチルスルホニウムヘキサフルオロホスフェート、(4−オクチルオキシフェニル)ジフェニルスルホニウムテトラキス(3,5−ビス−トリフルオロメチルフェニル)ボレート、トリス[4−(4−アセチルフェニル)チオフェニル]スルホニウムテトラキス(ペンタフルオロフェニル)ボレート、トリス(ドデシルフェニル)スルホニウムテトラキス(3,5−ビス−トリフルオロメチルフェニル)ボレート、4−アセトアミドフェニルジフェニルスルホニウムテトラフルオロボレート、4−アセトアミドフェニルジフェニルスルホニウムテトラキス(ペンタフルオロベンジル)ボレート、ジメチルナフチルスルホニウムヘキサフルオロホスフェート、トリフルオロメチルジフェニルスルホニウムテトラフルオロボレート、トリフルオロメチルジフェニルスルホニウムテトラキス(ペンタフルオロベンジル)ボレート、フェニルメチルベンジルスルホニウムヘキサフルオロホスフェート、5−メチルチアントレニウムヘキサフルオロホスフェート、10−フェニル−9,9−ジメチルチオキサンテニウムヘキサフルオロホスフェート、10−フェニル−9−オキソチオキサンテニウムテトラフルオロボレート、10−フェニル−9−オキソチオキサンテニウムテトラキス(ペンタフルオロベンジル)ボレート、5−メチル−10−オキソチアントレニウムテトラフルオロボレート、5−メチル−10−オキソチアントレニウムテトラキス(ペンタフルオロベンジル)ボレート、および5−メチル−10,10−ジオキソチアントレニウムヘキサフルオロホスフェートであり、
・ヨードニウム塩(例えば、US3,729,313A(特許文献14)、US3,741,769A(特許文献15)、US4,250,053A(特許文献16)、US4,394,403A(特許文献17)およびUS2010/063221A1(特許文献13))、例えば
ジフェニルヨードニウムテトラフルオロボレート、
ジ−(4−メチルフェニル)−ヨードニウムテトラフルオロボレート、
フェニル−4−メチルフェニルヨードニウムテトラフルオロボレート、
ジ−(4−クロロフェニル)−ヨードニウムヘキサフルオロホスフェート、ジナフチルヨードニウムテトラフルオロボレート、
ジ−(4−トリフルオロメチルフェニル)−ヨードニウムテトラフルオロボレート、ジフェニルヨードニウムヘキサフルオロホスフェート、
ジ−(4−メチルフェニル)−ヨードニウムヘキサフルオロホスフェート、ジフェニルヨードニウムヘキサフルオロアルセネート、
ジ−(4−フェノキシフェニル)−ヨードニウムテトラフルオロボレート、
フェニル−3−チエニルヨードニウムヘキサフルオロホスフェート、
3,5−ジメチルピラゾリル−4−フェニルヨードニウムヘキサフルオロホスフェート、ジフェニルヨードニウムヘキサフルオロアンチモネート、
2,2’−ジフェニルヨードニウムテトラフルオロボレート、
ジ−(2,4−ジクロロフェニル)−ヨードニウムヘキサフルオロホスフェート、
ジ−(4−ブロモフェニル)−ヨードニウムヘキサフルオロホスフェート、
ジ−(4−メトキシフェニル)−ヨードニウムヘキサフルオロホスフェート、
ジ−(3−カルボキシフェニル)−ヨードニウムヘキサフルオロホスフェート、
ジ−(3−メトキシカルボニルフェニル)−ヨードニウムヘキサフルオロホスフェート、
ジ−(3−メトキシスルホニルフェニル)−ヨードニウムヘキサフルオロホスフェート、
ジ−(4−アセトアミドフェニル)−ヨードニウムヘキサフルオロホスフェート、
ジ−(2−ベンゾチエニル)−ヨードニウムヘキサフルオロホスフェート、
ジアリールヨードニウムトリストリフルオロメチルスルホニルメチド、例えば
ジフェニルヨードニウムヘキサフルオロアンチモネート、
ジアリールヨードニウムテトラキス−(ペンタフルオロフェニル)−ボレート、例えば
ジフェニルヨードニウムテトラキス(ペンタフルオロフェニル)ボレート、
(4−n−デシロキシフェニル)−フェニルヨードニウムヘキサフルオロアンチモネート、
[4−(2−ヒドロキシ−n−テトラデシロキシ)−フェニル]−フェニルヨードニウムヘキサフルオロアンチモネート、
[4−(2−ヒドロキシ−n−テトラデシロキシ)−フェニル]−フェニルヨードニウムトリフルオロスルホネート、
[4−(2−ヒドロキシ−n−テトラデシロキシ)−フェニル]−フェニルヨードニウムヘキサフルオロホスフェート、
[4−(2−ヒドロキシ−n−テトラデシロキシ)−フェニル]−フェニルヨードニウムテトラキス−(ペンタフロロフェニル)−ボレート、
ビス−(4−tert−ブチルフェニル)−ヨードニウムヘキサフルオロアンチモネート、
ビス−(4−tert−ブチルフェニル)−ヨードニウムヘキサフルオロホスフェート、
ビス−(4−tert−ブチルフェニル)−ヨードニウムトリフルオロスルホネート、
ビス−(4−tert−ブチルフェニル)−ヨードニウムトリフルオロボレート、
ビス−(ドデシルフェニル)−ヨードニウムヘキサフルオロアンチモネート、
ビス−(ドデシルフェニル)−ヨードニウムテトラフルオロボレート、
ビス−(ドデシルフェニル)−ヨードニウムヘキサフルオロホスフェート、
ビス−(ドデシルフェニル)−ヨードニウムトリフルオロメチルスルホネート、
ジ−(ドデシルフェニル)−ヨードニウムヘキサフルオロアンチモネート、
ジ−(ドデシルフェニル)−ヨードニウムトリフレート、
ジフェニルヨードニウムビスルフェート、
4,4’−ジクロロジフェニルヨードニウムジスルフェート、4,4’−ジブロモジフェニルヨードニウムビスルフェート、
3,3’−ジニトロジフェニルヨードニウムビスルフェート、4,4’−ジメチルジフェニルヨードニウムビスルフェート、
4,4’−ビス−スクシンイミドジフェニルヨードニウムビスルフェート、3−ニトロジフェニルヨードニウムビスルフェート、4,4’−ジメトキシジフェニルヨードニウムビスルフェート、
ビス−(ドデシルフェニル)−ヨードニウムテトラキス−(ペンタフルオロフェニル)−ボレート、
(4−オクチルオキシフェニル)−フェニルヨードニウムテトラキス−(3,5−ビス−トリフルオロメチルフェニル)−ボレート、および(トリルクミル)−ヨードニウムテトラキス−(ペンタフルオロフェニル)−ボレート、
および
・フェロセニウム塩(例えばEP0542716B1(特許文献18)参照)、例えば
η5−(2,4−シクロペンタジエン−1−イル)−[(1,2,3,4,5,6,9)−(1−メチルエチル)−ベンゼン]鉄。
−接着すべき物品上に、接着剤または接着テープを施与するステップ、および
−外部刺激を用いてゲッター材料を活性化するステップ、
を含む方法に関する。
ポリエチレン、ポリプロピレン、特に1軸延伸もしくは2軸延伸により生成された配向ポリプロピレン(OPP)、環状オレフィンコポリマー(COC)、ポリ塩化ビニル(PVC)、ポリエステル、特にポリエチレンテレフタレート(PET)およびポリエチレンナフタレート(PEN)、エチレンビニルアルコール(EVOH)、ポリ塩化ビニリデン(PVDC)、ポリフッ化ビニリデン(PVDF)、エチレンテトラフルオロエチレン(ETFE)、ポリアクリロニトリル(PAN)、ポリカーボネート(PC)、ポリアミド(PA)、ポリエーテルスルホン(PES)、またはポリイミド(PI)である。
破過時間の決定(耐用期間試験)
電子構成物の耐用期間を決定するための尺度としてカルシウム試験を採用した。カルシウム試験を図1に示している。これについては真空中で、10×10mm2の大きさの薄いカルシウム層23をガラスプレート21上に堆積させ、その後、窒素雰囲気下で貯蔵する。カルシウム層23の厚さは約100nmである。カルシウム層23をカプセル化するために、試験すべき接着剤22および支持体材料としての薄いガラス板24(35μm、Schott社)を備えた接着テープ(23×23mm2)を使用する。薄いガラス板は安定化のため、光学的に高透明性のアクリレート感圧接着剤の50μm厚の転写式接着テープ25により、100μm厚のPETフィルム26をラミネートしていた。接着剤22がすべての側ではみ出した6.5mmの縁(A−A)を設けてカルシウム面23を覆うように、接着剤22をガラスプレート21上に適用する。非透過性のガラス支持体24により、感圧接着剤を通るかまたは界面に沿った浸透だけが確定される。
水蒸気の浸透性(WVTR)の決定はASTM F−1249に従い行う。このために、感圧接着剤を、それ自体は浸透バリアに寄与しない高浸透性ポリスルホン膜(Sartorius社から入手可能)上に層厚50μmで施与する。水蒸気透過性は37.5℃および相対湿度90%で、測定装置としてMocon OX−Tran2/21を用いて決定する。
数平均分子量Mnおよび重量平均分子量Mwの分子量決定は、ゲル浸透クロマトグラフィ(GPC)を用いて行った。溶離液としては、トリフルオロ酢酸を0.1体積%含むTHF(テトラヒドロフラン)を用いた。測定は25℃で行った。プレカラムとして、PSS−SDV、5μ、103Å、ID8.0mm×50mmを使用した。分離にはカラムPSS−SDV、5μ、103Å並びに105Åおよび106、それぞれID8.0mm×300mmを用いた。試料濃度は4g/lであり、貫流量は1分当たり1.0mlであった。ポリスチレン標準に対して測定した。
MMAPは、変更を加えたASTM C611方法を使用して決定される混合メチルシクロヘキサンアニリン曇り点である。標準的な試験方法で使用されるヘプタンの代わりにメチルシクロヘキサンを用いる。この方法は、樹脂/アニリン/メチルシクロヘキサンを1/2/1(5g/10ml/5ml)の比で使用し、加熱されて透明なこの3種の成分の混合物を、ちょうど完全に曇るまで冷却することによって曇り点を決定する。
接着樹脂軟化温度は、環球法として知られておりASTM E28に基づいて標準化されている該当する方法論に基づいて実施される。
接着剤層を製造するため、様々な接着剤を溶液状態で、従来のライナー(シリコーン被覆されたポリエステルフィルム)上に、実験用塗布器によって施し、乾燥した。乾燥後の接着剤層厚は50±5μmである。乾燥は、それぞれの場合に、先ず室温下に10分間、そして実験室用乾燥庫内で120℃で10分間行った。それぞれの場合に、乾燥した接着剤層を、乾燥後直ぐに、第二のライナー(剥離力がより弱いシリコーン被覆したポリエステルフィルム)を用いてその開放面側にラミネートした。
本願は特許請求の範囲に記載の発明に係るものであるが、本願の開示は以下も包含する:
1.
ゲッター材料並びに任意選択に溶剤を含む接着剤であって、外部刺激によって活性化可能な、ゲッター材料と浸透物との反応のための触媒を含むことを特徴とする、接着剤。
2.
浸透物が水であることを特徴とする、上記1に記載の接着剤。
3.
ゲッターが、少なくとも2重量%、好ましくは少なくとも3重量%、特に少なくとも5重量%の量で含まれることを特徴とする、上記1または2に記載の接着剤。
4.
触媒の量が、5重量%未満、好ましくは2重量%未満、特に1重量%未満であることを特徴とする、上記1〜3のいずれか一つに記載の接着剤。
5.
外部刺激が、UV放射線、温度変化、マイクロ波放射線または可視光であることを特徴とする、上記1〜4のいずれか一つに記載の接着剤。
6.
外部刺激によって活性化可能な触媒が潜在性酸または潜在性塩基であることを特徴とする、上記1〜5のいずれか一つに記載の接着剤。
7.
−少なくとも1種のポリマー、とりわけエラストマー、および
−少なくとも一種の粘着樹脂、
でできた接着材料ベースを含むことを特徴とする、上記1〜6のいずれか一つに記載の接着剤。
8.
接着材料ベースが、少なくとも一つの硬化可能な基を有する少なくとも一種の反応性樹脂を更に含むことを特徴とする、上記1〜7のいずれか一つに記載の接着剤。
9.
接着剤がバリア接着剤であること、および接着材料ベースが、(反応性樹脂が存在する場合には硬化の後に)100g/m 2 d未満、好ましくは50g/m 2 d未満、特に15g/m 2 d未満の水蒸気浸透速度を有することを特徴とする、上記7または8に記載の接着剤。
10.
ゲッター材料が、エトキシシランを含む群から選択される少なくとも一種の化合物であることを特徴とする、上記1〜9のいずれか一つに記載の接着剤。
11.
エトキシシランが少なくとも一種の重合可能な基を追加的に含むことを特徴とする、上記10に記載の接着剤。
12.
触媒が潜在性酸または潜在性塩基であることを特徴とする、上記1〜11のいずれか一つに記載の接着剤。
13.
重合可能な基が、任意選択の反応性樹脂の基と重合可能であることを特徴とする、特に重合可能な基が反応性樹脂の基と同一のものであることを特徴とする、上記1〜12のいずれか一つに記載の接着剤。
14.
ゲッター材料が、非芳香族系カルボジイミドを含む群から選択される少なくとも一種の化合物であることを特徴とする、上記1〜13のいずれか一つに記載の接着剤。
15.
ゲッター材料が、酸性および/または塩基性の加水分解可能なエステルを含む群から選択される少なくとも一種の化合物であることを特徴とする、上記1〜14のいずれか一つに記載の接着剤。
16.
ゲッター材料が、オキサゾリジン類の群から選択される少なくとも一種の化合物であることを特徴とする、上記1〜15のいずれか一つに記載の接着剤。
17.
触媒が潜在性塩基であることを特徴とする、上記16に記載の接着剤。
18.
ゲッター材料が、イソシアネート類の群から選択される少なくとも一種の化合物であることを特徴とする、上記1〜17のいずれか一つに記載の接着剤。
19.
触媒が潜在性塩基であることを特徴とする、上記18に記載の接着剤。
20.
ゲッター材料が、酸無水物の群から選択される少なくとも一種の化合物であることを特徴とする、上記1〜19のいずれか一つに記載の接着剤。
21.
触媒が潜在性酸、好ましくは潜在性塩基であることを特徴とする、上記20に記載の接着剤。
22.
少なくとも一つの硬化可能な基が、環状エーテル、ビニル、アクリレート、メタクリレート、ヒドロキシル、アミノおよびイソシアネートから選択される少なくとも一つの基であることを特徴とする、上記1〜21のいずれか一つに記載の接着剤。
23.
接着剤が感圧接着性であることを特徴とする、上記1〜22のいずれか一つに記載の接着剤。
24.
上記1〜23のいずれか一つに記載の接着剤を含む接着テープ。
25.
有機電子機器内の構成物をカプセル化するための、上記1〜23のいずれか一つに記載の接着剤または上記24に記載の接着テープの使用。
26.
接着剤、特に上記1〜23のいずれか一つに記載の接着剤、または上記24に記載の接着テープの施与方法であって、次のステップ
−接着すべき物品上に、接着剤または接着テープを施与するステップ、および
−外部刺激を用いてゲッター材料を活性化するステップ、
を含む前記方法。
27.
接着剤が反応性樹脂を含み、および外部刺激によって、ゲッター材料の活性化の他に、接着剤または接着テープの硬化も誘発されることを特徴とする、上記26に記載の方法。
28.
土台上に配置された有機電気的装置を保護するための方法であって、
電子的装置が少なくとも部分的にカバーによって覆われるように、電子的装置上にカバーを施し、
さらにカバーを土台および/または電子的装置の少なくとも一部の面に貼付し、
貼付が、上記1〜23のいずれか一つに記載の接着剤の少なくとも1つの層によってもたらされる方法。
29.
接着剤が、接着テープの層として存在することを特徴とする上記28に記載の方法。
30.
最初に接着剤層が、場合によっては、さらなる層を含む両面で接着性の接着テープの構成要素としての接着剤層が、そしてその後のステップでカバーが、土台および/または電子的装置上に施されることを特徴とする上記26〜29のいずれか一つに記載の方法。
31.
接着剤層とカバーが一緒に土台および/または電子的装置上に施されることを特徴とする上記26〜30のいずれか一つに記載の方法。
32.
カバーが電子的装置を完全に覆うことを特徴とする、上記26〜31のいずれか一つに記載の方法。
33.
電子的装置の周囲の土台の領域も、カバーにより完全にまたは部分的に覆われることを特徴とする、上記26〜32のいずれか一つに記載の方法。
Claims (41)
- ゲッター材料並びに任意選択に溶剤を含む接着剤であって、外部刺激によって活性化可能な、ゲッター材料と浸透物との反応のための触媒を含み、かつ
前記ゲッター材料が、一般式R a −Si−X 4−a の少なくとも一種の化合物またはそれの部分縮合生成物であり、ここで
aは0〜3の整数を表し、
Xは、ハロゲン原子、エトキシ基、n−プロポキシ基、iso−プロポキシ基、n−ブトキシ基、sec−ブトキシ基もしくはtert−ブトキシ基、またはアセトキシ基を表し、
Rは、場合により置換された炭化水素残基を表し、該炭化水素残基は、加えて、環状および/または芳香族部分を含むことができ、及び該炭化水素残基は、一つ以上のヘテロ原子含有置換基を含むことができ、及び
接着剤がバリア接着剤であり、かつそれの接着材料ベースが、(反応性樹脂が存在する場合にはその硬化の後に)100g/m 2 d未満の水蒸気浸透速度を有する、
ことを特徴とする、接着剤。 - 浸透物が水であることを特徴とする、請求項1に記載の接着剤。
- ゲッターが、少なくとも2重量%の量で含まれることを特徴とする、請求項1または2に記載の接着剤。
- ゲッターが、少なくとも3重量%の量で含まれることを特徴とする、請求項1または2に記載の接着剤。
- ゲッターが、少なくとも5重量%の量で含まれることを特徴とする、請求項1または2に記載の接着剤。
- 触媒の量が、5重量%未満であることを特徴とする、請求項1〜5のいずれか一つに記載の接着剤。
- 触媒の量が、2重量%未満であることを特徴とする、請求項1〜5のいずれか一つに記載の接着剤。
- 触媒の量が、1重量%未満であることを特徴とする、請求項1〜5のいずれか一つに記載の接着剤。
- 外部刺激が、UV放射線、温度変化、マイクロ波放射線または可視光であることを特徴とする、請求項1〜8のいずれか一つに記載の接着剤。
- 外部刺激によって活性化可能な触媒が潜在性酸または潜在性塩基であることを特徴とする、請求項1〜9のいずれか一つに記載の接着剤。
- −少なくとも1種のポリマー、および
−少なくとも一種の粘着樹脂、
でできた接着材料ベースを含むことを特徴とする、請求項1〜10のいずれか一つに記載の接着剤。 - 前記ポリマーがエラストマーであることを特徴とする、請求項11に記載の接着剤。
- 接着材料ベースが、少なくとも一つの硬化可能な基を有する少なくとも一種の反応性樹脂を更に含むことを特徴とする、請求項1〜12のいずれか一つに記載の接着剤。
- 接着剤がバリア接着剤であること、および接着材料ベースが、(反応性樹脂が存在する場合にはその硬化の後に)50g/m 2 d未満の水蒸気浸透速度を有することを特徴とする、請求項11〜13のいずれか一つに記載の接着剤。
- 接着剤がバリア接着剤であること、および接着材料ベースが、(反応性樹脂が存在する場合にはその硬化の後に)15g/m 2 d未満の水蒸気浸透速度を有することを特徴とする、請求項11〜13のいずれか一つに記載の接着剤。
- ゲッター材料が、エトキシシランを含む群から選択される少なくとも一種の化合物であることを特徴とする、請求項1〜15のいずれか一つに記載の接着剤。
- エトキシシランが少なくとも一種の重合可能な基を追加的に含むことを特徴とする、請求項16に記載の接着剤。
- 触媒が潜在性酸または潜在性塩基であることを特徴とする、請求項1〜17のいずれか一つに記載の接着剤。
- 重合可能な基が、任意選択の反応性樹脂の基と重合可能であることを特徴とする、請求項1〜18のいずれか一つに記載の接着剤。
- 重合可能な基が反応性樹脂の基と同一のものであることを特徴とする、請求項19に記載の接着剤。
- ゲッター材料が、非芳香族系カルボジイミドを含む群から選択される少なくとも一種の化合物であることを特徴とする、請求項1〜20のいずれか一つに記載の接着剤。
- ゲッター材料が、酸性および/または塩基性の加水分解可能なエステルを含む群から選択される少なくとも一種の化合物であることを特徴とする、請求項1〜21のいずれか一つに記載の接着剤。
- ゲッター材料が、オキサゾリジン類の群から選択される少なくとも一種の化合物であることを特徴とする、請求項1〜22のいずれか一つに記載の接着剤。
- 触媒が潜在性塩基であることを特徴とする、請求項23に記載の接着剤。
- ゲッター材料が、イソシアネート類の群から選択される少なくとも一種の化合物であることを特徴とする、請求項1〜24のいずれか一つに記載の接着剤。
- 触媒が潜在性塩基であることを特徴とする、請求項25に記載の接着剤。
- ゲッター材料が、酸無水物の群から選択される少なくとも一種の化合物であることを特徴とする、請求項1〜26のいずれか一つに記載の接着剤。
- 触媒が潜在性酸であることを特徴とする、請求項27に記載の接着剤。
- 触媒が潜在性塩基であることを特徴とする、請求項27に記載の接着剤。
- 少なくとも一つの硬化可能な基が、環状エーテル、ビニル、アクリレート、メタクリレート、ヒドロキシル、アミノおよびイソシアネートから選択される少なくとも一つの基であることを特徴とする、請求項1〜29のいずれか一つに記載の接着剤。
- 接着剤が感圧接着性であることを特徴とする、請求項1〜30のいずれか一つに記載の接着剤。
- 請求項1〜31のいずれか一つに記載の接着剤を含む接着テープ。
- 有機電子機器内の構成物をカプセル化するための、請求項1〜31のいずれか一つに記載の接着剤または請求項32に記載の接着テープの使用。
- 請求項1〜31のいずれか一つに記載の接着剤、または請求項32に記載の接着テープの施与方法であって、次のステップ
−接着すべき物品上に、接着剤または接着テープを施与するステップ、および
−外部刺激を用いてゲッター材料を活性化するステップ、
を含む前記方法。 - 接着剤が反応性樹脂を含み、および外部刺激によって、ゲッター材料の活性化の他に、接着剤または接着テープの硬化も誘発されることを特徴とする、請求項34に記載の方法。
- 土台上に配置された有機電気的装置を保護するための方法であって、
電子的装置が少なくとも部分的にカバーによって覆われるように、電子的装置上にカバーを施し、
さらにカバーを土台および/または電子的装置の少なくとも一部の面に貼付し、
貼付が、請求項1〜31のいずれか一つに記載の接着剤の少なくとも1つの層によってもたらされる方法。 - 接着剤が、接着テープの層として存在することを特徴とする請求項36に記載の方法。
- 最初に接着剤層が、場合によっては、さらなる層を含む両面で接着性の接着テープの構成要素としての接着剤層が、そしてその後のステップでカバーが、土台および/または電子的装置上に施されることを特徴とする請求項34〜37のいずれか一つに記載の方法。
- 接着剤層とカバーが一緒に土台および/または電子的装置上に施されることを特徴とする請求項34〜38のいずれか一つに記載の方法。
- カバーが電子的装置を完全に覆うことを特徴とする、請求項34〜39のいずれか一つに記載の方法。
- 電子的装置の周囲の土台の領域も、カバーにより完全にまたは部分的に覆われることを特徴とする、請求項34〜40のいずれか一つに記載の方法。
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DE102011089565A1 (de) * | 2011-12-22 | 2013-06-27 | Tesa Se | Liner zum Schutz von Klebemassen |
DE102011089566A1 (de) * | 2011-12-22 | 2013-06-27 | Tesa Se | Liner zum Schutz von Klebemassen |
DE102012203623A1 (de) * | 2012-03-07 | 2013-09-12 | Tesa Se | Verbundsystem zur Verkapselung elektronischer Anordnungen |
DE102012206273A1 (de) * | 2012-04-17 | 2013-10-17 | Tesa Se | Vernetzbare Klebmasse mit Hart- und Weichblöcken als Permeantenbarriere |
DE102012211335A1 (de) | 2012-06-29 | 2014-01-02 | Tesa Se | Klebeband für die Kapselung einer organischen elektronischen Anordnung |
DE102012219877A1 (de) * | 2012-08-24 | 2014-02-27 | Tesa Se | Haftklebemasse insbesondere zur Kapselung einer elektronischen Anordnung |
TW201436855A (zh) * | 2012-12-21 | 2014-10-01 | Tesa Se | 從平面結構物移除滲透物的方法 |
DE102012224310A1 (de) * | 2012-12-21 | 2014-06-26 | Tesa Se | Gettermaterial enthaltendes Klebeband |
DE102014207074A1 (de) * | 2014-04-11 | 2015-10-15 | Tesa Se | Klebeband für die Kapselung einer organischen elektronischen Anordnung |
WO2016066434A1 (de) * | 2014-10-29 | 2016-05-06 | Tesa Se | Oled kompatible klebemassen mit silanwasserfängern |
US10696016B2 (en) * | 2015-07-31 | 2020-06-30 | Samsung Sdi Co., Ltd. | Window film and flexible display including the same |
-
2015
- 2015-10-15 JP JP2017523283A patent/JP6474489B2/ja not_active Expired - Fee Related
- 2015-10-15 KR KR1020177013521A patent/KR101994466B1/ko active IP Right Grant
- 2015-10-15 WO PCT/EP2015/073898 patent/WO2016066435A1/de active Application Filing
- 2015-10-15 EP EP15786881.1A patent/EP3212727A1/de active Pending
- 2015-10-15 US US15/520,003 patent/US20170327717A1/en not_active Abandoned
- 2015-10-15 CN CN201580058849.7A patent/CN107148458A/zh active Pending
- 2015-10-26 TW TW104135079A patent/TWI681034B/zh active
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2019
- 2019-06-03 US US16/429,831 patent/US11390783B2/en active Active
Also Published As
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US11390783B2 (en) | 2022-07-19 |
TWI681034B (zh) | 2020-01-01 |
KR101994466B1 (ko) | 2019-06-28 |
WO2016066435A1 (de) | 2016-05-06 |
TW201634634A (zh) | 2016-10-01 |
EP3212727A1 (de) | 2017-09-06 |
JP2017537998A (ja) | 2017-12-21 |
KR20170070223A (ko) | 2017-06-21 |
US20190284450A1 (en) | 2019-09-19 |
US20170327717A1 (en) | 2017-11-16 |
CN107148458A (zh) | 2017-09-08 |
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