KR101006035B1 - 초고순도 구리 및 그 제조 방법 그리고 초고순도 구리로이루어지는 본딩 와이어 - Google Patents
초고순도 구리 및 그 제조 방법 그리고 초고순도 구리로이루어지는 본딩 와이어 Download PDFInfo
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- KR101006035B1 KR101006035B1 KR20077029379A KR20077029379A KR101006035B1 KR 101006035 B1 KR101006035 B1 KR 101006035B1 KR 20077029379 A KR20077029379 A KR 20077029379A KR 20077029379 A KR20077029379 A KR 20077029379A KR 101006035 B1 KR101006035 B1 KR 101006035B1
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Abstract
Description
Claims (7)
- 신선 가공 및 200℃ 이하에서의 소둔 후의 경도가 40Hv 이하이고, 순도가 8N 이상 (단, O, C, N, H, S, P 의 가스 성분을 제외한다) 인 것을 특징으로 하는 초고순도 구리선으로 이루어지는 본딩 와이어.
- 제 1 항에 있어서,가스 성분인 O, S, P 의 각 원소가, 1wtppm 이하인 것을 특징으로 하는 초고순도 구리선으로 이루어지는 본딩 와이어.
- 제 1 항 또는 제 2 항에 있어서,재결정 온도가 200℃ 이하인 것을 특징으로 하는 초고순도 구리선으로 이루어지는 본딩 와이어.
- 삭제
- 질산구리 용액으로 이루어지는 전해액을 사용하여 2 단 전해에 의해 순도가 8N 이상인 초고순도 구리를 제조할 때에, 질산구리 용액으로 이루어지는 전해액 중에 염산을 첨가함과 함께, 전해액을 순환시키고, 이 순환하는 전해액을 일시적으로 10℃ 이하로 하여 필터로 불순물을 제거하면서, 2 단 전해에 의해 전해를 실시하는 것을 특징으로 하는 초고순도 구리의 제조 방법.
- 질산구리 용액으로 이루어지는 전해액을 사용하여 2 단 전해에 의해 초고순도 구리를 제조할 때에, 질산구리 용액으로 이루어지는 전해액 중에 염산을 첨가함과 함께, 전해액을 순환시키고, 이 순환하는 전해액을 일시적으로 10℃ 이하로 하여 필터로 불순물을 제거하면서, 2 단 전해에 의해 전해를 실시하는 것을 특징으로 하는, 제 1 항 또는 제 2 항에 기재된 초고순도 구리선으로 이루어지는 본딩 와이어에 이용되는 초고순도 구리의 제조 방법.
- 질산구리 용액으로 이루어지는 전해액을 사용하여 2 단 전해에 의해 초고순도 구리를 제조할 때에, 질산구리 용액으로 이루어지는 전해액 중에 염산을 첨가함과 함께, 전해액을 순환시키고, 이 순환하는 전해액을 일시적으로 10℃ 이하로 하여 필터로 불순물을 제거하면서, 2 단 전해에 의해 전해를 실시하는 것을 특징으로 하는, 제 3 항에 기재된 초고순도 구리선으로 이루어지는 본딩 와이어에 이용되는 초고순도 구리의 제조 방법.
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JP2005174896 | 2005-06-15 | ||
JPJP-P-2005-00174896 | 2005-06-15 |
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KR1020107015909A Division KR20100087780A (ko) | 2005-06-15 | 2006-04-24 | 초고순도 구리 및 그 제조 방법 그리고 초고순도 구리로 이루어지는 본딩 와이어 |
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KR20080017369A KR20080017369A (ko) | 2008-02-26 |
KR101006035B1 true KR101006035B1 (ko) | 2011-01-06 |
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KR20077029379A KR101006035B1 (ko) | 2005-06-15 | 2006-04-24 | 초고순도 구리 및 그 제조 방법 그리고 초고순도 구리로이루어지는 본딩 와이어 |
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US (1) | US20090272466A1 (ko) |
EP (2) | EP1903119B1 (ko) |
JP (1) | JP4750112B2 (ko) |
KR (2) | KR20100087780A (ko) |
CN (1) | CN100567532C (ko) |
TW (1) | TW200643192A (ko) |
WO (1) | WO2006134724A1 (ko) |
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US8192596B2 (en) * | 2004-01-29 | 2012-06-05 | Jx Nippon Mining & Metals Corporation | Ultrahigh-purity copper and process for producing the same |
JP5109881B2 (ja) * | 2008-09-04 | 2012-12-26 | 住友金属鉱山株式会社 | 銅ボンディングワイヤ |
EP2330224B1 (en) * | 2008-09-30 | 2013-05-29 | JX Nippon Mining & Metals Corporation | High-purity copper and process for electrolytically producing high-purity copper |
CN102165093B (zh) * | 2008-09-30 | 2013-09-25 | Jx日矿日石金属株式会社 | 高纯度铜或高纯度铜合金溅射靶、该溅射靶的制造方法及高纯度铜或高纯度铜合金溅射膜 |
KR20140127362A (ko) * | 2008-10-10 | 2014-11-03 | 스미토모 베이클리트 컴퍼니 리미티드 | 반도체 장치 |
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TWI315349B (ko) | 2009-10-01 |
EP1903119B1 (en) | 2015-09-23 |
TW200643192A (en) | 2006-12-16 |
US20090272466A1 (en) | 2009-11-05 |
EP1903119A1 (en) | 2008-03-26 |
EP2845915A1 (en) | 2015-03-11 |
JPWO2006134724A1 (ja) | 2009-01-08 |
CN101198711A (zh) | 2008-06-11 |
CN100567532C (zh) | 2009-12-09 |
KR20080017369A (ko) | 2008-02-26 |
KR20100087780A (ko) | 2010-08-05 |
EP1903119A4 (en) | 2014-06-18 |
WO2006134724A1 (ja) | 2006-12-21 |
JP4750112B2 (ja) | 2011-08-17 |
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