JPH034612B2 - - Google Patents
Info
- Publication number
- JPH034612B2 JPH034612B2 JP22015186A JP22015186A JPH034612B2 JP H034612 B2 JPH034612 B2 JP H034612B2 JP 22015186 A JP22015186 A JP 22015186A JP 22015186 A JP22015186 A JP 22015186A JP H034612 B2 JPH034612 B2 JP H034612B2
- Authority
- JP
- Japan
- Prior art keywords
- less
- strength
- alloy
- electronic devices
- rate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910045601 alloy Inorganic materials 0.000 claims description 14
- 239000000956 alloy Substances 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000012535 impurity Substances 0.000 claims description 7
- 238000005482 strain hardening Methods 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 229910052796 boron Inorganic materials 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 229910052749 magnesium Inorganic materials 0.000 claims description 5
- 229910052748 manganese Inorganic materials 0.000 claims description 5
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 3
- 238000001953 recrystallisation Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000002244 precipitate Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- 238000005452 bending Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 238000001556 precipitation Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910052768 actinide Inorganic materials 0.000 description 1
- 150000001255 actinides Chemical class 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006477 desulfuration reaction Methods 0.000 description 1
- 230000023556 desulfurization Effects 0.000 description 1
- 230000003009 desulfurizing effect Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22015186A JPS6376839A (ja) | 1986-09-18 | 1986-09-18 | 電子機器用銅合金とその製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22015186A JPS6376839A (ja) | 1986-09-18 | 1986-09-18 | 電子機器用銅合金とその製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6376839A JPS6376839A (ja) | 1988-04-07 |
| JPH034612B2 true JPH034612B2 (ko) | 1991-01-23 |
Family
ID=16746692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22015186A Granted JPS6376839A (ja) | 1986-09-18 | 1986-09-18 | 電子機器用銅合金とその製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6376839A (ko) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2514234B2 (ja) * | 1988-08-05 | 1996-07-10 | 株式会社神戸製鋼所 | 強度と導電性に優れる端子・コネクタ―用銅合金 |
| JPH0266130A (ja) * | 1988-08-29 | 1990-03-06 | Mitsubishi Shindoh Co Ltd | 打抜金型摩耗の少ない端子・コネクタ用Ｃｕ合金 |
| WO2006093140A1 (ja) * | 2005-02-28 | 2006-09-08 | The Furukawa Electric Co., Ltd. | 銅合金 |
| JP2006265731A (ja) * | 2005-02-28 | 2006-10-05 | Furukawa Electric Co Ltd:The | 銅合金 |
| JP4655834B2 (ja) * | 2005-09-02 | 2011-03-23 | 日立電線株式会社 | 電気部品用銅合金材とその製造方法 |
| JP5002768B2 (ja) * | 2006-03-30 | 2012-08-15 | Ｄｏｗａメタルテック株式会社 | 曲げ加工性に優れた高導電性銅基合金およびその製造法 |
-
1986
- 1986-09-18 JP JP22015186A patent/JPS6376839A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6376839A (ja) | 1988-04-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |