JP7423640B2 - 高度なパッケージング用途のための微細な再配線形成の方法 - Google Patents
高度なパッケージング用途のための微細な再配線形成の方法 Download PDFInfo
- Publication number
- JP7423640B2 JP7423640B2 JP2021542108A JP2021542108A JP7423640B2 JP 7423640 B2 JP7423640 B2 JP 7423640B2 JP 2021542108 A JP2021542108 A JP 2021542108A JP 2021542108 A JP2021542108 A JP 2021542108A JP 7423640 B2 JP7423640 B2 JP 7423640B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- photoresist
- etching
- molybdenum
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 89
- 238000004806 packaging method and process Methods 0.000 title claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 121
- 239000010949 copper Substances 0.000 claims description 119
- 229910052802 copper Inorganic materials 0.000 claims description 118
- 239000010410 layer Substances 0.000 claims description 94
- 229920002120 photoresistant polymer Polymers 0.000 claims description 49
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 38
- 229910052750 molybdenum Inorganic materials 0.000 claims description 38
- 239000011733 molybdenum Substances 0.000 claims description 38
- 239000011248 coating agent Substances 0.000 claims description 33
- 238000000576 coating method Methods 0.000 claims description 33
- 239000012790 adhesive layer Substances 0.000 claims description 32
- 230000008569 process Effects 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 28
- 238000005530 etching Methods 0.000 claims description 26
- 238000007747 plating Methods 0.000 claims description 18
- 239000004593 Epoxy Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 238000004544 sputter deposition Methods 0.000 claims description 9
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical group S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 claims description 6
- 229910052982 molybdenum disulfide Inorganic materials 0.000 claims description 6
- 238000001039 wet etching Methods 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 description 21
- 239000004642 Polyimide Substances 0.000 description 14
- 229920001721 polyimide Polymers 0.000 description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 11
- 239000010936 titanium Substances 0.000 description 11
- 229910052719 titanium Inorganic materials 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 7
- 230000008901 benefit Effects 0.000 description 6
- MPTQRFCYZCXJFQ-UHFFFAOYSA-L copper(II) chloride dihydrate Chemical compound O.O.[Cl-].[Cl-].[Cu+2] MPTQRFCYZCXJFQ-UHFFFAOYSA-L 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 229920001646 UPILEX Polymers 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000000708 deep reactive-ion etching Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 101710179734 6,7-dimethyl-8-ribityllumazine synthase 2 Proteins 0.000 description 1
- 238000009623 Bosch process Methods 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 101710186609 Lipoyl synthase 2 Proteins 0.000 description 1
- 101710122908 Lipoyl synthase 2, chloroplastic Proteins 0.000 description 1
- 101710101072 Lipoyl synthase 2, mitochondrial Proteins 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000035899 viability Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4827—Materials
- H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geometry (AREA)
- Materials Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
Claims (16)
- 電気部品を製造するための方法であって、
エポキシ基板を配置することと、
モリブデンを含む接着層で前記エポキシ基板の少なくとも1つの面をコーティングすることであって、モリブデンを含む前記接着層が前記エポキシ基板と直接接触するように、コーティングすることと、
前記接着層を銅シード層でコーティングすることであって、前記銅シード層が、モリブデンを含む前記接着層と直接接触するように、コーティングすることと、
前記銅シード層の少なくとも一部をフォトレジストのコーティングで覆うことと、
前記フォトレジストの前記コーティングの一部を除去して、表面フィーチャを生成することと、
前記表面フィーチャが銅で充填されるように、銅めっきプロセスを実行することと、
前記フォトレジストを除去して、前記フォトレジストでコーティングされた前記銅シード層の少なくとも一部及び前記銅めっきプロセスにおいて形成された銅を含む、銅表面を生成することと、
前記フォトレジストを除去した後に、前記フォトレジストでコーティングされた前記銅シード層の前記少なくとも一部を除去し、前記銅めっきプロセスにおいて形成された前記銅の少なくとも一部を残すように、前記銅表面をエッチングすることであって、前記銅表面のエッチングがウェット銅エッチングである、エッチングすることと、
前記銅表面をエッチングした後に露出した前記接着層をエッチングすることであって、前記接着層が、隣接する前記表面フィーチャの幅に実質的に等しい幅を有するようにエッチングされ、さらに前記接着層のエッチングがウェットエッチングである、エッチングすることと、
を含む方法。 - 5/5μm未満のラインスペースパッケージング比で複数の表面フィーチャを生成することをさらに含む、請求項1に記載の方法。
- 前記フォトレジストの前記コーティングの前記一部を除去することが、フォトレジスト現像剤を用いて実行される、請求項1に記載の方法。
- 前記エポキシ基板がエポキシ膜である、請求項1に記載の方法。
- モリブデンを含む接着層で前記エポキシ基板の少なくとも1つの面をコーティングすることが、スパッタリングプロセスによって実行される、請求項1に記載の方法。
- 前記スパッタリングプロセスが、マグネトロンによって生成される、請求項5に記載の方法。
- 前記モリブデンが、二硫化モリブデンである、請求項1に記載の方法。
- 電気部品を製造するための方法であって、
エポキシ基板であって、前記エポキシ基板上に直接配置されたモリブデンを含む接着層および前記接着層上に直接配置された銅シード層を有するエポキシ基板を配置することと、
前記銅シード層の少なくとも一部をフォトレジストのコーティングで覆うことと、
前記フォトレジストの前記コーティングを、マスクを通して放射線源に曝露することと、
前記フォトレジストの前記コーティングの一部を除去して、前記マスクから転写された表面フィーチャを生成することと、
前記表面フィーチャが銅で充填されるように、銅めっきプロセスを実行することと、
前記フォトレジストを除去して、前記フォトレジストでコーティングされた前記銅シード層の少なくとも一部及び前記銅めっきプロセスにおいて形成された銅を含む、銅表面を生成することと、
前記フォトレジストを除去した後に、前記フォトレジストでコーティングされた前記銅シード層の前記少なくとも一部を除去し、前記銅めっきプロセスにおいて形成された前記銅の少なくとも一部を残すように、前記銅表面をエッチングすることであって、前記銅表面のエッチングがウェット銅エッチングである、エッチングすることと、
前記銅表面をエッチングした後に露出した前記接着層をエッチングすることであって、前記接着層が、隣接する前記表面フィーチャの幅に実質的に等しい幅を有するようにエッチングされ、さらに前記接着層のエッチングがウェットエッチングである、エッチングすることと、
を含む方法。 - 前記フォトレジストの前記コーティングの前記一部を除去することが、フォトレジスト現像剤を用いて実行される、請求項8に記載の方法。
- 前記エポキシ基板がエポキシ膜である、請求項8に記載の方法。
- モリブデンを含む接着層で前記エポキシ基板の少なくとも1つの面をコーティングすることが、スパッタリングプロセスによって実行される、請求項8に記載の方法。
- 前記スパッタリングプロセスが、マグネトロンによって生成される、請求項11に記載の方法。
- 前記モリブデンが、二硫化モリブデンである、請求項8に記載の方法。
- 電気部品を製造するための方法であって、
モリブデンを含む接着層でエポキシ基板の第1の表面をコーティングすることであって、モリブデンを含む前記接着層が前記エポキシ基板の前記第1の表面と直接接触するように、コーティングすることと、
前記接着層を銅シード層でコーティングすることであって、前記銅シード層が、モリブデンを含む前記接着層と直接接触するように、コーティングすることと、
前記銅シード層の少なくとも一部をフォトレジストのコーティングで覆うことと、
前記フォトレジストの前記コーティングの一部を除去して、表面フィーチャを生成することと、
前記表面フィーチャが銅で充填されるように、銅めっきプロセスを実行することと、
前記フォトレジストを除去して、前記フォトレジストでコーティングされた前記銅シード層の少なくとも一部及び前記銅めっきプロセスにおいて形成された銅を含む、銅表面を生成することと、
前記フォトレジストを除去した後に、前記フォトレジストでコーティングされた前記銅シード層の前記少なくとも一部を除去し、前記銅めっきプロセスにおいて形成された前記銅の少なくとも一部を残すように、前記銅表面をエッチングすることであって、前記銅表面のエッチングがウェット銅エッチングプロセスを含む、エッチングすることと、
前記エポキシ基板の前記第1の表面を露出させるように、前記銅表面をエッチングした後に露出した前記接着層の表面をエッチングすることであって、前記接着層が、隣接する前記表面フィーチャの幅に実質的に等しい幅を有するようにエッチングされ、さらに露出した前記接着層の表面のエッチングがウェットエッチングである、エッチングすることと、
を含む方法。 - 前記モリブデンが、二硫化モリブデンである、請求項14に記載の方法。
- モリブデンを含む接着層で前記エポキシ基板の前記第1の表面をコーティングすることが、マグネトロンによって生成されたスパッタリングプロセスによって実行される、請求項15に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/256,809 US11342256B2 (en) | 2019-01-24 | 2019-01-24 | Method of fine redistribution interconnect formation for advanced packaging applications |
US16/256,809 | 2019-01-24 | ||
PCT/US2019/064280 WO2020154041A1 (en) | 2019-01-24 | 2019-12-03 | Method of fine redistribution interconnect formation for advanced packaging applications |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022523016A JP2022523016A (ja) | 2022-04-21 |
JP7423640B2 true JP7423640B2 (ja) | 2024-01-29 |
Family
ID=71733777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021542108A Active JP7423640B2 (ja) | 2019-01-24 | 2019-12-03 | 高度なパッケージング用途のための微細な再配線形成の方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US11342256B2 (ja) |
EP (1) | EP3915144A4 (ja) |
JP (1) | JP7423640B2 (ja) |
KR (1) | KR102554293B1 (ja) |
CN (1) | CN113330562A (ja) |
SG (1) | SG11202107219RA (ja) |
TW (1) | TWI729660B (ja) |
WO (1) | WO2020154041A1 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000114678A (ja) | 1998-09-29 | 2000-04-21 | Ibiden Co Ltd | プリント配線板 |
JP2006093199A (ja) | 2004-09-21 | 2006-04-06 | Hitachi Chem Co Ltd | 配線基板、半導体チップ搭載基板及び半導体パッケージ、並びにそれらの製造方法 |
US20070111401A1 (en) | 2003-12-05 | 2007-05-17 | Mitsui Mining & Smelting Co., Ltd | Printed wiring board, its manufacturing method, and circuit device |
CN1994033A (zh) | 2004-07-29 | 2007-07-04 | 三井金属矿业株式会社 | 印刷电路板、其制造方法及半导体装置 |
JP2009010398A (ja) | 2003-12-05 | 2009-01-15 | Mitsui Mining & Smelting Co Ltd | プリント配線基板の製造方法 |
JP2015104896A (ja) | 2013-12-02 | 2015-06-08 | 東レフィルム加工株式会社 | 銅ポリイミド積層フィルム |
WO2016075791A1 (ja) | 2014-11-13 | 2016-05-19 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
Family Cites Families (273)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4073610A (en) | 1976-02-05 | 1978-02-14 | Cox Bernard K | Apparatus for producing a foldable plastic strip |
US4751349A (en) | 1986-10-16 | 1988-06-14 | International Business Machines Corporation | Zirconium as an adhesion material in a multi-layer metallic structure |
JPH0494592A (ja) | 1990-08-10 | 1992-03-26 | Cmk Corp | プリント配線板におけるスルーホールに対する充填材の充填方法 |
US5126016A (en) * | 1991-02-01 | 1992-06-30 | International Business Machines Corporation | Circuitization of polymeric circuit boards with galvanic removal of chromium adhesion layers |
US5519332A (en) | 1991-06-04 | 1996-05-21 | Micron Technology, Inc. | Carrier for testing an unpackaged semiconductor die |
US5231751A (en) * | 1991-10-29 | 1993-08-03 | International Business Machines Corporation | Process for thin film interconnect |
US5474834A (en) | 1992-03-09 | 1995-12-12 | Kyocera Corporation | Superconducting circuit sub-assembly having an oxygen shielding barrier layer |
JP2819523B2 (ja) | 1992-10-09 | 1998-10-30 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 印刷配線板及びその製造方法 |
US5353195A (en) | 1993-07-09 | 1994-10-04 | General Electric Company | Integral power and ground structure for multi-chip modules |
US5688716A (en) | 1994-07-07 | 1997-11-18 | Tessera, Inc. | Fan-out semiconductor chip assembly |
US5783870A (en) | 1995-03-16 | 1998-07-21 | National Semiconductor Corporation | Method for connecting packages of a stacked ball grid array structure |
US5670262A (en) * | 1995-05-09 | 1997-09-23 | The Dow Chemical Company | Printing wiring board(s) having polyimidebenzoxazole dielectric layer(s) and the manufacture thereof |
JPH08330695A (ja) * | 1995-06-05 | 1996-12-13 | Mitsui Toatsu Chem Inc | 高密着性フレキシブル回路基板 |
US5767480A (en) | 1995-07-28 | 1998-06-16 | National Semiconductor Corporation | Hole generation and lead forming for integrated circuit lead frames using laser machining |
US6631558B2 (en) | 1996-06-05 | 2003-10-14 | Laservia Corporation | Blind via laser drilling system |
AU3301197A (en) | 1996-06-05 | 1998-01-05 | Larry W. Burgess | Blind via laser drilling system |
US7062845B2 (en) | 1996-06-05 | 2006-06-20 | Laservia Corporation | Conveyorized blind microvia laser drilling system |
US5841102A (en) | 1996-11-08 | 1998-11-24 | W. L. Gore & Associates, Inc. | Multiple pulse space processing to enhance via entrance formation at 355 nm |
JP3920399B2 (ja) | 1997-04-25 | 2007-05-30 | 株式会社東芝 | マルチチップ半導体装置用チップの位置合わせ方法、およびマルチチップ半導体装置の製造方法・製造装置 |
US6184121B1 (en) * | 1997-07-10 | 2001-02-06 | International Business Machines Corporation | Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same |
US6388202B1 (en) | 1997-10-06 | 2002-05-14 | Motorola, Inc. | Multi layer printed circuit board |
US6038133A (en) | 1997-11-25 | 2000-03-14 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module and method for producing the same |
GB9811328D0 (en) | 1998-05-27 | 1998-07-22 | Exitech Ltd | The use of mid-infrared lasers for drilling microvia holes in printed circuit (wiring) boards and other electrical circuit interconnection packages |
MY144573A (en) | 1998-09-14 | 2011-10-14 | Ibiden Co Ltd | Printed circuit board and method for its production |
SE513341C2 (sv) | 1998-10-06 | 2000-08-28 | Ericsson Telefon Ab L M | Arrangemang med tryckta kretskort samt metod för tillverkning därav |
US6039889A (en) * | 1999-01-12 | 2000-03-21 | Fujitsu Limited | Process flows for formation of fine structure layer pairs on flexible films |
US6117704A (en) | 1999-03-31 | 2000-09-12 | Irvine Sensors Corporation | Stackable layers containing encapsulated chips |
US6599836B1 (en) | 1999-04-09 | 2003-07-29 | Micron Technology, Inc. | Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
US6212769B1 (en) * | 1999-06-29 | 2001-04-10 | International Business Machines Corporation | Process for manufacturing a printed wiring board |
AU6178200A (en) | 1999-08-03 | 2001-02-19 | Xsil Technology Limited | A circuit singulation system and method |
EP1139705B1 (en) | 1999-09-02 | 2006-11-22 | Ibiden Co., Ltd. | Printed wiring board and method of producing the same |
ATE233985T1 (de) | 1999-09-30 | 2003-03-15 | Siemens Ag | Verfahren und einrichtung zum laserbohren von laminaten |
US6538210B2 (en) | 1999-12-20 | 2003-03-25 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module, radio device having the same, and method for producing the same |
US6887804B2 (en) | 2000-01-10 | 2005-05-03 | Electro Scientific Industries, Inc. | Passivation processing over a memory link |
US6661084B1 (en) | 2000-05-16 | 2003-12-09 | Sandia Corporation | Single level microelectronic device package with an integral window |
US6384473B1 (en) | 2000-05-16 | 2002-05-07 | Sandia Corporation | Microelectronic device package with an integral window |
US6593240B1 (en) | 2000-06-28 | 2003-07-15 | Infineon Technologies, North America Corp | Two step chemical mechanical polishing process |
US20020048715A1 (en) | 2000-08-09 | 2002-04-25 | Bret Walczynski | Photoresist adhesive and method |
US20020020898A1 (en) | 2000-08-16 | 2002-02-21 | Vu Quat T. | Microelectronic substrates with integrated devices |
US6459046B1 (en) | 2000-08-28 | 2002-10-01 | Matsushita Electric Industrial Co., Ltd. | Printed circuit board and method for producing the same |
CN1278413C (zh) | 2000-09-25 | 2006-10-04 | 揖斐电株式会社 | 半导体元件及其制造方法、多层印刷布线板及其制造方法 |
US20020070443A1 (en) | 2000-12-08 | 2002-06-13 | Xiao-Chun Mu | Microelectronic package having an integrated heat sink and build-up layers |
US6555906B2 (en) | 2000-12-15 | 2003-04-29 | Intel Corporation | Microelectronic package having a bumpless laminated interconnection layer |
JP4108285B2 (ja) | 2000-12-15 | 2008-06-25 | イビデン株式会社 | 多層プリント配線板の製造方法 |
US6388207B1 (en) | 2000-12-29 | 2002-05-14 | Intel Corporation | Electronic assembly with trench structures and methods of manufacture |
JP5004378B2 (ja) | 2001-01-10 | 2012-08-22 | イビデン株式会社 | 多層プリント配線板 |
TW511415B (en) | 2001-01-19 | 2002-11-21 | Matsushita Electric Ind Co Ltd | Component built-in module and its manufacturing method |
JP2001244591A (ja) | 2001-02-06 | 2001-09-07 | Ngk Spark Plug Co Ltd | 配線基板及びその製造方法 |
US6512182B2 (en) | 2001-03-12 | 2003-01-28 | Ngk Spark Plug Co., Ltd. | Wiring circuit board and method for producing same |
US7160432B2 (en) | 2001-03-14 | 2007-01-09 | Applied Materials, Inc. | Method and composition for polishing a substrate |
DE60210770T2 (de) | 2001-03-22 | 2006-08-31 | Xsil Technology Ltd. | Ein laserbearbeitungssystem und -verfahren |
US6465084B1 (en) | 2001-04-12 | 2002-10-15 | International Business Machines Corporation | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements |
US6894399B2 (en) | 2001-04-30 | 2005-05-17 | Intel Corporation | Microelectronic device having signal distribution functionality on an interfacial layer thereof |
JP2003023224A (ja) | 2001-07-05 | 2003-01-24 | Sumitomo Electric Ind Ltd | 回路基板とその製造方法及び高出力モジュール |
JP2003023239A (ja) * | 2001-07-05 | 2003-01-24 | Sumitomo Electric Ind Ltd | 回路基板とその製造方法及び高出力モジュール |
US20030059976A1 (en) | 2001-09-24 | 2003-03-27 | Nathan Richard J. | Integrated package and methods for making same |
JP2003188340A (ja) | 2001-12-19 | 2003-07-04 | Matsushita Electric Ind Co Ltd | 部品内蔵モジュールとその製造方法 |
JP3998984B2 (ja) | 2002-01-18 | 2007-10-31 | 富士通株式会社 | 回路基板及びその製造方法 |
JP2003289073A (ja) * | 2002-01-22 | 2003-10-10 | Canon Inc | 半導体装置および半導体装置の製造方法 |
US6506632B1 (en) | 2002-02-15 | 2003-01-14 | Unimicron Technology Corp. | Method of forming IC package having downward-facing chip cavity |
US7358157B2 (en) | 2002-03-27 | 2008-04-15 | Gsi Group Corporation | Method and system for high-speed precise laser trimming, scan lens system for use therein and electrical device produced thereby |
US7028400B1 (en) | 2002-05-01 | 2006-04-18 | Amkor Technology, Inc. | Integrated circuit substrate having laser-exposed terminals |
JP3871609B2 (ja) * | 2002-05-27 | 2007-01-24 | 松下電器産業株式会社 | 半導体装置及びその製造方法 |
JP2003347741A (ja) | 2002-05-30 | 2003-12-05 | Taiyo Yuden Co Ltd | 複合多層基板およびそれを用いたモジュール |
JP3908146B2 (ja) | 2002-10-28 | 2007-04-25 | シャープ株式会社 | 半導体装置及び積層型半導体装置 |
US6905914B1 (en) | 2002-11-08 | 2005-06-14 | Amkor Technology, Inc. | Wafer level package and fabrication method |
US7091589B2 (en) | 2002-12-11 | 2006-08-15 | Dai Nippon Printing Co., Ltd. | Multilayer wiring board and manufacture method thereof |
US7105931B2 (en) | 2003-01-07 | 2006-09-12 | Abbas Ismail Attarwala | Electronic package and method |
US8704359B2 (en) | 2003-04-01 | 2014-04-22 | Ge Embedded Electronics Oy | Method for manufacturing an electronic module and an electronic module |
JP2004311788A (ja) | 2003-04-08 | 2004-11-04 | Matsushita Electric Ind Co Ltd | シート状モジュールとその製造方法 |
JP2004335641A (ja) | 2003-05-06 | 2004-11-25 | Canon Inc | 半導体素子内蔵基板の製造方法 |
EP1478021B1 (en) | 2003-05-15 | 2008-07-16 | Sanyo Electric Co., Ltd. | Semiconductor device and manufacturing method thereof |
US20060283716A1 (en) | 2003-07-08 | 2006-12-21 | Hooman Hafezi | Method of direct plating of copper on a ruthenium alloy |
CN1577819A (zh) | 2003-07-09 | 2005-02-09 | 松下电器产业株式会社 | 带内置电子部件的电路板及其制造方法 |
US7271012B2 (en) | 2003-07-15 | 2007-09-18 | Control Systemation, Inc. | Failure analysis methods and systems |
EP2937897A3 (en) | 2003-09-15 | 2016-03-23 | Nuvotronics LLC | Device package and methods for the fabrication and testing thereof |
US7064069B2 (en) | 2003-10-21 | 2006-06-20 | Micron Technology, Inc. | Substrate thinning including planarization |
JP4271590B2 (ja) | 2004-01-20 | 2009-06-03 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
US20050224977A1 (en) * | 2004-01-29 | 2005-10-13 | Yusuke Yoshimura | Wiring substrate and method using the same |
US7309515B2 (en) | 2004-02-04 | 2007-12-18 | Industrial Technology Research Institute | Method for fabricating an imprint mold structure |
TWI256095B (en) | 2004-03-11 | 2006-06-01 | Siliconware Precision Industries Co Ltd | Wafer level semiconductor package with build-up layer and process for fabricating the same |
JP2006024902A (ja) | 2004-06-07 | 2006-01-26 | Shinko Electric Ind Co Ltd | 極細線パターンを有する配線基板の製造方法および配線基板 |
US20060000814A1 (en) | 2004-06-30 | 2006-01-05 | Bo Gu | Laser-based method and system for processing targeted surface material and article produced thereby |
US8571541B2 (en) | 2004-07-15 | 2013-10-29 | Avaya Inc. | Proximity-based authorization |
DE102004038852B4 (de) | 2004-08-10 | 2006-06-29 | Webasto Ag | Spritzgießmaschine |
KR100858309B1 (ko) * | 2004-09-01 | 2008-09-11 | 스미토모 긴조쿠 고잔 가부시키가이샤 | 2층 플렉시블 기판 및 그 제조 방법 |
TWI241007B (en) | 2004-09-09 | 2005-10-01 | Phoenix Prec Technology Corp | Semiconductor device embedded structure and method for fabricating the same |
TW200618705A (en) | 2004-09-16 | 2006-06-01 | Tdk Corp | Multilayer substrate and manufacturing method thereof |
US20060073234A1 (en) | 2004-10-06 | 2006-04-06 | Williams Michael E | Concrete stamp and method of manufacture |
JP4564342B2 (ja) | 2004-11-24 | 2010-10-20 | 大日本印刷株式会社 | 多層配線基板およびその製造方法 |
TWI301660B (en) | 2004-11-26 | 2008-10-01 | Phoenix Prec Technology Corp | Structure of embedding chip in substrate and method for fabricating the same |
TWI245384B (en) | 2004-12-10 | 2005-12-11 | Phoenix Prec Technology Corp | Package structure with embedded chip and method for fabricating the same |
TWI245388B (en) | 2005-01-06 | 2005-12-11 | Phoenix Prec Technology Corp | Three dimensional package structure of semiconductor chip embedded in substrate and method for fabricating the same |
US7579224B2 (en) | 2005-01-21 | 2009-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a thin film semiconductor device |
TWI260056B (en) | 2005-02-01 | 2006-08-11 | Phoenix Prec Technology Corp | Module structure having an embedded chip |
JP2006216714A (ja) | 2005-02-02 | 2006-08-17 | Ibiden Co Ltd | 多層プリント配線板 |
JP2006216713A (ja) | 2005-02-02 | 2006-08-17 | Ibiden Co Ltd | 多層プリント配線板 |
TWI283553B (en) | 2005-04-21 | 2007-07-01 | Ind Tech Res Inst | Thermal enhanced low profile package structure and method for fabricating the same |
US7919844B2 (en) | 2005-05-26 | 2011-04-05 | Aprolase Development Co., Llc | Tier structure with tier frame having a feedthrough structure |
US7215032B2 (en) | 2005-06-14 | 2007-05-08 | Cubic Wafer, Inc. | Triaxial through-chip connection |
KR100714196B1 (ko) | 2005-07-11 | 2007-05-02 | 삼성전기주식회사 | 전기소자를 내장한 인쇄회로기판 및 그 제조방법 |
TWI263313B (en) | 2005-08-15 | 2006-10-01 | Phoenix Prec Technology Corp | Stack structure of semiconductor component embedded in supporting board |
US20070077865A1 (en) | 2005-10-04 | 2007-04-05 | Cabot Microelectronics Corporation | Method for controlling polysilicon removal |
KR100772639B1 (ko) | 2005-10-18 | 2007-11-02 | 한국기계연구원 | 다이아몬드상 카본 박막을 이용한 미세 임프린트리소그래피용 스탬프 및 그 제조방법 |
CN100463128C (zh) | 2005-11-25 | 2009-02-18 | 全懋精密科技股份有限公司 | 半导体芯片埋入基板的三维构装结构及其制作方法 |
CN100524717C (zh) | 2005-11-25 | 2009-08-05 | 全懋精密科技股份有限公司 | 芯片内埋的模块化结构 |
KR100688701B1 (ko) * | 2005-12-14 | 2007-03-02 | 삼성전기주식회사 | 랜드리스 비아홀을 구비한 인쇄회로기판의 제조방법 |
KR101329931B1 (ko) | 2006-04-25 | 2013-11-28 | 니혼도꾸슈도교 가부시키가이샤 | 배선기판 |
KR101037229B1 (ko) | 2006-04-27 | 2011-05-25 | 스미토모 베이클리트 컴퍼니 리미티드 | 반도체 장치 및 반도체 장치의 제조 방법 |
US8022552B2 (en) | 2006-06-27 | 2011-09-20 | Megica Corporation | Integrated circuit and method for fabricating the same |
KR100731112B1 (ko) | 2006-07-24 | 2007-06-22 | 동부일렉트로닉스 주식회사 | 포토 레지스트를 제거하기 위한 cmp 슬러리 |
JP5252792B2 (ja) | 2006-08-25 | 2013-07-31 | 日本ミクロコーティング株式会社 | 酸化物超伝導体用テープ基材の研磨方法並びに酸化物超伝導体及び酸化物超伝導体用基材 |
KR20080037296A (ko) | 2006-10-25 | 2008-04-30 | 삼성전자주식회사 | 박막 트랜지스터 기판 및 그 제조방법 |
US20080136002A1 (en) | 2006-12-07 | 2008-06-12 | Advanced Chip Engineering Technology Inc. | Multi-chips package and method of forming the same |
US7915737B2 (en) | 2006-12-15 | 2011-03-29 | Sanyo Electric Co., Ltd. | Packing board for electronic device, packing board manufacturing method, semiconductor module, semiconductor module manufacturing method, and mobile device |
TWI330401B (en) | 2006-12-25 | 2010-09-11 | Unimicron Technology Corp | Circuit board structure having embedded semiconductor component and fabrication method thereof |
KR101030769B1 (ko) | 2007-01-23 | 2011-04-27 | 삼성전자주식회사 | 스택 패키지 및 스택 패키징 방법 |
US20080173792A1 (en) | 2007-01-23 | 2008-07-24 | Advanced Chip Engineering Technology Inc. | Image sensor module and the method of the same |
CN100561696C (zh) | 2007-03-01 | 2009-11-18 | 全懋精密科技股份有限公司 | 嵌埋半导体芯片的结构及其制法 |
US7757196B2 (en) | 2007-04-04 | 2010-07-13 | Cisco Technology, Inc. | Optimizing application specific integrated circuit pinouts for high density interconnect printed circuit boards |
JP2008277339A (ja) | 2007-04-25 | 2008-11-13 | Tdk Corp | 電子部品およびその製造方法 |
US8710402B2 (en) | 2007-06-01 | 2014-04-29 | Electro Scientific Industries, Inc. | Method of and apparatus for laser drilling holes with improved taper |
US8143719B2 (en) | 2007-06-07 | 2012-03-27 | United Test And Assembly Center Ltd. | Vented die and package |
US8314343B2 (en) | 2007-09-05 | 2012-11-20 | Taiyo Yuden Co., Ltd. | Multi-layer board incorporating electronic component and method for producing the same |
US8476769B2 (en) | 2007-10-17 | 2013-07-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Through-silicon vias and methods for forming the same |
US7843064B2 (en) | 2007-12-21 | 2010-11-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure and process for the formation of TSVs |
JP5280079B2 (ja) | 2008-03-25 | 2013-09-04 | 新光電気工業株式会社 | 配線基板の製造方法 |
US8017451B2 (en) | 2008-04-04 | 2011-09-13 | The Charles Stark Draper Laboratory, Inc. | Electronic modules and methods for forming the same |
KR20090116168A (ko) * | 2008-05-06 | 2009-11-11 | 삼성전자주식회사 | 금속 배선 기판, 박막 트랜지스터 기판, 및 금속 배선의형성 방법 |
US7842542B2 (en) | 2008-07-14 | 2010-11-30 | Stats Chippac, Ltd. | Embedded semiconductor die package and method of making the same using metal frame carrier |
TWI573201B (zh) | 2008-07-18 | 2017-03-01 | 聯測總部私人有限公司 | 封裝結構性元件 |
CN102149784B (zh) | 2008-07-22 | 2014-03-05 | 圣戈班磨料磨具有限公司 | 包含聚集体的涂覆的磨料产品 |
US20100062287A1 (en) | 2008-09-10 | 2010-03-11 | Seagate Technology Llc | Method of polishing amorphous/crystalline glass to achieve a low rq & wq |
US8633420B2 (en) | 2008-10-10 | 2014-01-21 | Ipg Microsystems Llc | Laser machining systems and methods with debris extraction |
JP5246103B2 (ja) | 2008-10-16 | 2013-07-24 | 大日本印刷株式会社 | 貫通電極基板の製造方法 |
US7982305B1 (en) | 2008-10-20 | 2011-07-19 | Maxim Integrated Products, Inc. | Integrated circuit package including a three-dimensional fan-out / fan-in signal routing |
JP5111342B2 (ja) | 2008-12-01 | 2013-01-09 | 日本特殊陶業株式会社 | 配線基板 |
US8354304B2 (en) | 2008-12-05 | 2013-01-15 | Stats Chippac, Ltd. | Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant |
KR20100067966A (ko) * | 2008-12-12 | 2010-06-22 | 주식회사 동부하이텍 | 반도체 소자 및 그 제조 방법 |
US9064936B2 (en) | 2008-12-12 | 2015-06-23 | Stats Chippac, Ltd. | Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP |
US8592992B2 (en) | 2011-12-14 | 2013-11-26 | Stats Chippac, Ltd. | Semiconductor device and method of forming vertical interconnect structure with conductive micro via array for 3-D Fo-WLCSP |
US7932608B2 (en) | 2009-02-24 | 2011-04-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Through-silicon via formed with a post passivation interconnect structure |
KR101065744B1 (ko) | 2009-02-27 | 2011-09-19 | 주식회사 티지솔라 | 요철구조가 형성된 기판을 이용한 태양전지의 제조방법 |
US7955942B2 (en) | 2009-05-18 | 2011-06-07 | Stats Chippac, Ltd. | Semiconductor device and method of forming a 3D inductor from prefabricated pillar frame |
CN101898405A (zh) | 2009-05-27 | 2010-12-01 | 鸿富锦精密工业(深圳)有限公司 | 模具流道组合 |
TWI523720B (zh) | 2009-05-28 | 2016-03-01 | 伊雷克托科學工業股份有限公司 | 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法 |
US20100307798A1 (en) | 2009-06-03 | 2010-12-09 | Izadian Jamal S | Unified scalable high speed interconnects technologies |
TWI418272B (zh) | 2009-08-25 | 2013-12-01 | Samsung Electro Mech | 處理核心基板之空腔的方法 |
TW201110285A (en) | 2009-09-08 | 2011-03-16 | Unimicron Technology Corp | Package structure having embedded semiconductor element and method of forming the same |
US8772087B2 (en) | 2009-10-22 | 2014-07-08 | Infineon Technologies Ag | Method and apparatus for semiconductor device fabrication using a reconstituted wafer |
CN102473622B (zh) | 2009-10-22 | 2013-10-16 | 日立化成株式会社 | 研磨剂、浓缩一液式研磨剂、二液式研磨剂以及基板研磨方法 |
CN102230991B (zh) | 2009-10-23 | 2013-01-09 | 鸿富锦精密工业(深圳)有限公司 | 光纤耦合连接器 |
JP5700241B2 (ja) | 2009-11-09 | 2015-04-15 | 日立化成株式会社 | 多層配線基板及びその製造方法 |
EP2499686A2 (en) | 2009-11-11 | 2012-09-19 | Amprius, Inc. | Intermediate layers for electrode fabrication |
EP2339627A1 (en) | 2009-12-24 | 2011-06-29 | Imec | Window interposed die packaging |
US9196509B2 (en) | 2010-02-16 | 2015-11-24 | Deca Technologies Inc | Semiconductor device and method of adaptive patterning for panelized packaging |
US8822281B2 (en) | 2010-02-23 | 2014-09-02 | Stats Chippac, Ltd. | Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier |
JP5904556B2 (ja) | 2010-03-03 | 2016-04-13 | ジョージア テック リサーチ コーポレイション | 無機インターポーザ上のパッケージ貫通ビア(tpv)構造およびその製造方法 |
JP5871904B2 (ja) | 2010-04-12 | 2016-03-01 | イコニクス コーポレーションIkonics Corporation | アブレシブエッチングおよびカッティングのためのフォトレジスト膜および方法 |
US8426961B2 (en) | 2010-06-25 | 2013-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Embedded 3D interposer structure |
KR102055459B1 (ko) * | 2010-08-02 | 2019-12-12 | 아토테크더치랜드게엠베하 | 기판 상에 솔더 성막 및 비용융 범프 구조들을 형성하는 방법 |
US9049808B2 (en) | 2010-08-21 | 2015-06-02 | Ibiden Co., Ltd. | Printed wiring board and a method of manufacturing a printed wiring board |
JP2012054382A (ja) * | 2010-09-01 | 2012-03-15 | Sumitomo Bakelite Co Ltd | 回路基板、回路基板の製造方法および半導体装置 |
US8518746B2 (en) | 2010-09-02 | 2013-08-27 | Stats Chippac, Ltd. | Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die |
TWI434387B (zh) | 2010-10-11 | 2014-04-11 | Advanced Semiconductor Eng | 具有穿導孔之半導體裝置及具有穿導孔之半導體裝置之封裝結構及其製造方法 |
TWI418269B (zh) | 2010-12-14 | 2013-12-01 | Unimicron Technology Corp | 嵌埋穿孔中介層之封裝基板及其製法 |
US8617990B2 (en) | 2010-12-20 | 2013-12-31 | Intel Corporation | Reduced PTH pad for enabling core routing and substrate layer count reduction |
US8329575B2 (en) | 2010-12-22 | 2012-12-11 | Applied Materials, Inc. | Fabrication of through-silicon vias on silicon wafers |
JP5693977B2 (ja) | 2011-01-11 | 2015-04-01 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
WO2012122388A2 (en) | 2011-03-08 | 2012-09-13 | Georgia Tech Research Corporation | Chip-last embedded interconnect structures and methods of making the same |
JP2012195514A (ja) | 2011-03-17 | 2012-10-11 | Seiko Epson Corp | 素子付き基板、赤外線センサー、および貫通電極形成方法 |
US20120261805A1 (en) | 2011-04-14 | 2012-10-18 | Georgia Tech Research Corporation | Through package via structures in panel-based silicon substrates and methods of making the same |
WO2013008415A1 (ja) | 2011-07-08 | 2013-01-17 | パナソニック株式会社 | 配線基板および立体配線基板の製造方法 |
US9708706B2 (en) * | 2011-11-30 | 2017-07-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | PVD apparatus and method with deposition chamber having multiple targets and magnets |
US9224674B2 (en) | 2011-12-15 | 2015-12-29 | Intel Corporation | Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages |
EP2817819A4 (en) | 2012-02-26 | 2015-09-02 | Solexel Inc | SYSTEMS AND METHOD FOR LASER DISTRIBUTION AND DEVICE LAYER TRANSMISSION |
US8698293B2 (en) | 2012-05-25 | 2014-04-15 | Infineon Technologies Ag | Multi-chip package and method of manufacturing thereof |
JP5981232B2 (ja) | 2012-06-06 | 2016-08-31 | 新光電気工業株式会社 | 半導体パッケージ、半導体装置及び半導体パッケージの製造方法 |
JP6029342B2 (ja) | 2012-06-15 | 2016-11-24 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
CN103635017B (zh) * | 2012-08-24 | 2016-12-28 | 碁鼎科技秦皇岛有限公司 | 电路板及其制作方法 |
US8890628B2 (en) | 2012-08-31 | 2014-11-18 | Intel Corporation | Ultra slim RF package for ultrabooks and smart phones |
US9385102B2 (en) | 2012-09-28 | 2016-07-05 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package |
CN102890591B (zh) * | 2012-09-28 | 2016-03-09 | 北京京东方光电科技有限公司 | 一种触摸屏、触控显示装置及触摸屏的制造方法 |
KR20150056633A (ko) | 2012-09-28 | 2015-05-26 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | 개량된 미세연마 방법 |
US20140103499A1 (en) | 2012-10-11 | 2014-04-17 | International Business Machines Corporation | Advanced handler wafer bonding and debonding |
KR101301507B1 (ko) | 2012-11-26 | 2013-09-04 | (주)씨엠코리아 | 반도체 제조장치용 히터 제조방법 및 그에 따라 제조된 히터 |
KR102072846B1 (ko) | 2012-12-18 | 2020-02-03 | 에스케이하이닉스 주식회사 | 임베디드 패키지 및 제조 방법 |
KR20140083657A (ko) | 2012-12-26 | 2014-07-04 | 하나 마이크론(주) | 인터포저가 임베디드 되는 전자 모듈 및 그 제조방법 |
KR101441632B1 (ko) | 2012-12-28 | 2014-09-23 | (재)한국나노기술원 | 글라스 기반 프로브 카드용 스페이스 트랜스포머의 제조방법 및 이에 의해 제조된 글라스 기반 프로브 카드용 스페이스 트랜스포머 |
US20150351241A1 (en) | 2013-01-07 | 2015-12-03 | A.L.M.T. Corp. | Ceramic Wiring Substrate, Semiconductor Device, And Method For Manufacturing Ceramic Wiring Substrate |
US9378982B2 (en) | 2013-01-31 | 2016-06-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package |
US9704809B2 (en) | 2013-03-05 | 2017-07-11 | Maxim Integrated Products, Inc. | Fan-out and heterogeneous packaging of electronic components |
US8877554B2 (en) | 2013-03-15 | 2014-11-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices |
KR101494413B1 (ko) | 2013-05-29 | 2015-02-17 | 주식회사 네패스 | 지지프레임 및 이를 이용한 반도체패키지 제조방법 |
US9685414B2 (en) | 2013-06-26 | 2017-06-20 | Intel Corporation | Package assembly for embedded die and associated techniques and configurations |
US8980691B2 (en) | 2013-06-28 | 2015-03-17 | Stats Chippac, Ltd. | Semiconductor device and method of forming low profile 3D fan-out package |
KR102101377B1 (ko) | 2013-06-29 | 2020-04-16 | 인텔 코포레이션 | 비아들과 조합되는 미세 피치 후면측 금속 재분포 라인들을 포함하는 상호접속 구조 |
US8952544B2 (en) | 2013-07-03 | 2015-02-10 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device and manufacturing method thereof |
US10446335B2 (en) | 2013-08-08 | 2019-10-15 | Zhuhai Access Semiconductor Co., Ltd. | Polymer frame for a chip, such that the frame comprises at least one via in series with a capacitor |
US9209151B2 (en) | 2013-09-26 | 2015-12-08 | General Electric Company | Embedded semiconductor device package and method of manufacturing thereof |
US9530752B2 (en) | 2013-11-11 | 2016-12-27 | Infineon Technologies Ag | Method for forming electronic components |
US20160270242A1 (en) * | 2013-11-14 | 2016-09-15 | Amogreentech Co., Ltd. | Flexible printed circuit board and method for manufacturing same |
US9159678B2 (en) | 2013-11-18 | 2015-10-13 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device and manufacturing method thereof |
US10014292B2 (en) | 2015-03-09 | 2018-07-03 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10297586B2 (en) | 2015-03-09 | 2019-05-21 | Monolithic 3D Inc. | Methods for processing a 3D semiconductor device |
US9355881B2 (en) | 2014-02-18 | 2016-05-31 | Infineon Technologies Ag | Semiconductor device including a dielectric material |
WO2015126438A1 (en) | 2014-02-20 | 2015-08-27 | Applied Materials, Inc. | Laser ablation platform for solar cells |
EP3117456B1 (en) | 2014-03-12 | 2022-05-11 | Intel Corporation | Microelectronic package having a passive microelectronic device disposed within a package body and its manufacturing method |
US9735134B2 (en) | 2014-03-12 | 2017-08-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Packages with through-vias having tapered ends |
US9499397B2 (en) | 2014-03-31 | 2016-11-22 | Freescale Semiconductor, Inc. | Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof |
US9326373B2 (en) * | 2014-04-09 | 2016-04-26 | Finisar Corporation | Aluminum nitride substrate |
US10074631B2 (en) | 2014-04-14 | 2018-09-11 | Taiwan Semiconductor Manufacturing Company | Packages and packaging methods for semiconductor devices, and packaged semiconductor devices |
US9589786B2 (en) | 2014-04-28 | 2017-03-07 | National Center For Advanced Packaging Co., Ltd | Method for polishing a polymer surface |
WO2015171118A1 (en) | 2014-05-06 | 2015-11-12 | Intel Corporation | Multi-layer package with integrated antenna |
US10256180B2 (en) | 2014-06-24 | 2019-04-09 | Ibis Innotech Inc. | Package structure and manufacturing method of package structure |
US9396999B2 (en) | 2014-07-01 | 2016-07-19 | Freescale Semiconductor, Inc. | Wafer level packaging method |
JP6394136B2 (ja) | 2014-07-14 | 2018-09-26 | 凸版印刷株式会社 | パッケージ基板およびその製造方法 |
JP6324876B2 (ja) | 2014-07-16 | 2018-05-16 | 新光電気工業株式会社 | 配線基板、半導体装置及び配線基板の製造方法 |
KR20160013706A (ko) | 2014-07-28 | 2016-02-05 | 삼성전기주식회사 | 인쇄회로기판 및 인쇄회로기판의 제조 방법 |
CN105436718A (zh) | 2014-08-26 | 2016-03-30 | 安捷利电子科技(苏州)有限公司 | 一种uv激光钻孔制备具有可控锥度盲孔的方法 |
KR102268386B1 (ko) | 2014-09-30 | 2021-06-23 | 삼성전기주식회사 | 회로기판 |
US9554469B2 (en) | 2014-12-05 | 2017-01-24 | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | Method of fabricating a polymer frame with a rectangular array of cavities |
US20160329272A1 (en) | 2014-12-19 | 2016-11-10 | Intel IP Corporation | Stacked semiconductor device package with improved interconnect bandwidth |
US9754849B2 (en) | 2014-12-23 | 2017-09-05 | Intel Corporation | Organic-inorganic hybrid structure for integrated circuit packages |
US9842789B2 (en) | 2015-05-11 | 2017-12-12 | Samsung Electro-Mechanics Co., Ltd. | Electronic component package and method of manufacturing the same |
US10109588B2 (en) | 2015-05-15 | 2018-10-23 | Samsung Electro-Mechanics Co., Ltd. | Electronic component package and package-on-package structure including the same |
US9978720B2 (en) | 2015-07-06 | 2018-05-22 | Infineon Technologies Ag | Insulated die |
US20190189561A1 (en) | 2015-07-15 | 2019-06-20 | Chip Solutions, LLC | Semiconductor device and method with multiple redistribution layer and fine line capability |
CN105023900A (zh) | 2015-08-11 | 2015-11-04 | 华天科技(昆山)电子有限公司 | 埋入硅基板扇出型封装结构及其制造方法 |
JP6542616B2 (ja) | 2015-08-27 | 2019-07-10 | 古河電気工業株式会社 | 部品内蔵配線基板の製造方法、部品内蔵配線基板および電子部品固定用テープ |
US9761571B2 (en) | 2015-09-17 | 2017-09-12 | Deca Technologies Inc. | Thermally enhanced fully molded fan-out module |
WO2017052633A1 (en) | 2015-09-25 | 2017-03-30 | Vivek Raghunathan | Thin electronic package elements using laser spallation |
US9837352B2 (en) | 2015-10-07 | 2017-12-05 | Advanced Semiconductor Engineering, Inc. | Semiconductor device and method for manufacturing the same |
WO2017074390A1 (en) | 2015-10-29 | 2017-05-04 | Intel Corporation | Alternative surfaces for conductive pad layers of silicon bridges for semiconductor packages |
US10570257B2 (en) | 2015-11-16 | 2020-02-25 | Applied Materials, Inc. | Copolymerized high temperature bonding component |
JP6626697B2 (ja) | 2015-11-24 | 2019-12-25 | 京セラ株式会社 | 配線基板およびその製造方法 |
US9660037B1 (en) | 2015-12-15 | 2017-05-23 | Infineon Technologies Austria Ag | Semiconductor wafer and method |
DE112015007213B4 (de) | 2015-12-22 | 2021-08-19 | Intel Corporation | Halbleiter-package mit durchgangsbrücken-die-verbindungen und verfahren zum herstellen eines halbleiter-package |
US9875970B2 (en) | 2016-04-25 | 2018-01-23 | Samsung Electro-Mechanics Co., Ltd. | Fan-out semiconductor package |
US10553515B2 (en) | 2016-04-28 | 2020-02-04 | Intel Corporation | Integrated circuit structures with extended conductive pathways |
US9859258B2 (en) | 2016-05-17 | 2018-01-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method of manufacture |
US10615191B2 (en) * | 2016-05-20 | 2020-04-07 | Ares Materials Inc. | Polymer substrate for flexible electronics microfabrication and methods of use |
US11156788B2 (en) | 2016-07-14 | 2021-10-26 | Intel Corporation | Semiconductor package with embedded optical die |
US9748167B1 (en) | 2016-07-25 | 2017-08-29 | United Microelectronics Corp. | Silicon interposer, semiconductor package using the same, and fabrication method thereof |
US10037975B2 (en) | 2016-08-31 | 2018-07-31 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and a method of manufacturing the same |
KR102566996B1 (ko) | 2016-09-09 | 2023-08-14 | 삼성전자주식회사 | FOWLP 형태의 반도체 패키지 및 이를 가지는 PoP 형태의 반도체 패키지 |
US9887167B1 (en) | 2016-09-19 | 2018-02-06 | Advanced Semiconductor Engineering, Inc. | Embedded component package structure and method of manufacturing the same |
KR102012443B1 (ko) | 2016-09-21 | 2019-08-20 | 삼성전자주식회사 | 팬-아웃 반도체 패키지 |
JP2018073890A (ja) | 2016-10-25 | 2018-05-10 | イビデン株式会社 | プリント配線板およびプリント配線板の製造方法 |
CN106531647B (zh) | 2016-12-29 | 2019-08-09 | 华进半导体封装先导技术研发中心有限公司 | 一种扇出型芯片的封装结构及其封装方法 |
WO2018125184A1 (en) | 2016-12-30 | 2018-07-05 | Intel Corporation | Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling |
KR102019353B1 (ko) | 2017-04-07 | 2019-09-09 | 삼성전자주식회사 | 팬-아웃 센서 패키지 및 이를 포함하는 광학방식 지문센서 모듈 |
JP6827663B2 (ja) | 2017-04-24 | 2021-02-10 | 株式会社荏原製作所 | 基板の研磨装置 |
TWI645519B (zh) | 2017-06-02 | 2018-12-21 | 旭德科技股份有限公司 | 元件內埋式封裝載板及其製作方法 |
US10304765B2 (en) | 2017-06-08 | 2019-05-28 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package |
US10163803B1 (en) | 2017-06-20 | 2018-12-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated fan-out packages and methods of forming the same |
US10211072B2 (en) | 2017-06-23 | 2019-02-19 | Applied Materials, Inc. | Method of reconstituted substrate formation for advanced packaging applications |
JP6885800B2 (ja) | 2017-06-26 | 2021-06-16 | 京セラ株式会社 | 配線基板およびその製造方法 |
TW201909245A (zh) | 2017-07-24 | 2019-03-01 | 美商康寧公司 | 精密結構玻璃物件、積體電路封裝、光學元件、微流體元件及其製造方法 |
US10410971B2 (en) | 2017-08-29 | 2019-09-10 | Qualcomm Incorporated | Thermal and electromagnetic interference shielding for die embedded in package substrate |
US10515912B2 (en) | 2017-09-24 | 2019-12-24 | Intel Corporation | Integrated circuit packages |
US10269773B1 (en) | 2017-09-29 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor packages and methods of forming the same |
WO2019066988A1 (en) | 2017-09-30 | 2019-04-04 | Intel Corporation | INTEGRATED PCB / HOUSING STACK FOR DOUBLE-SIDED INTERCONNECTION |
KR101892869B1 (ko) | 2017-10-20 | 2018-08-28 | 삼성전기주식회사 | 팬-아웃 반도체 패키지 |
KR101922884B1 (ko) | 2017-10-26 | 2018-11-28 | 삼성전기 주식회사 | 팬-아웃 반도체 패키지 |
KR101963292B1 (ko) | 2017-10-31 | 2019-03-28 | 삼성전기주식회사 | 팬-아웃 반도체 패키지 |
US10388631B1 (en) | 2018-01-29 | 2019-08-20 | Globalfoundries Inc. | 3D IC package with RDL interposer and related method |
CN111868920A (zh) | 2018-03-15 | 2020-10-30 | 应用材料公司 | 用于半导体器件封装制造工艺的平坦化 |
US10948818B2 (en) | 2018-03-19 | 2021-03-16 | Applied Materials, Inc. | Methods and apparatus for creating a large area imprint without a seam |
US11063007B2 (en) | 2018-05-21 | 2021-07-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method of manufacture |
US10955606B2 (en) | 2018-05-30 | 2021-03-23 | Applied Materials, Inc. | Method of imprinting tilt angle light gratings |
JP7183582B2 (ja) * | 2018-06-19 | 2022-12-06 | 凸版印刷株式会社 | ガラス配線基板 |
US10705268B2 (en) | 2018-06-29 | 2020-07-07 | Applied Materials, Inc. | Gap fill of imprinted structure with spin coated high refractive index material for optical components |
-
2019
- 2019-01-24 US US16/256,809 patent/US11342256B2/en active Active
- 2019-12-03 KR KR1020217026592A patent/KR102554293B1/ko active IP Right Grant
- 2019-12-03 EP EP19911757.3A patent/EP3915144A4/en active Pending
- 2019-12-03 WO PCT/US2019/064280 patent/WO2020154041A1/en unknown
- 2019-12-03 JP JP2021542108A patent/JP7423640B2/ja active Active
- 2019-12-03 CN CN201980089669.3A patent/CN113330562A/zh active Pending
- 2019-12-03 SG SG11202107219RA patent/SG11202107219RA/en unknown
- 2019-12-31 TW TW108148588A patent/TWI729660B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000114678A (ja) | 1998-09-29 | 2000-04-21 | Ibiden Co Ltd | プリント配線板 |
US20070111401A1 (en) | 2003-12-05 | 2007-05-17 | Mitsui Mining & Smelting Co., Ltd | Printed wiring board, its manufacturing method, and circuit device |
JP2009010398A (ja) | 2003-12-05 | 2009-01-15 | Mitsui Mining & Smelting Co Ltd | プリント配線基板の製造方法 |
CN1994033A (zh) | 2004-07-29 | 2007-07-04 | 三井金属矿业株式会社 | 印刷电路板、其制造方法及半导体装置 |
JP2006093199A (ja) | 2004-09-21 | 2006-04-06 | Hitachi Chem Co Ltd | 配線基板、半導体チップ搭載基板及び半導体パッケージ、並びにそれらの製造方法 |
JP2015104896A (ja) | 2013-12-02 | 2015-06-08 | 東レフィルム加工株式会社 | 銅ポリイミド積層フィルム |
WO2016075791A1 (ja) | 2014-11-13 | 2016-05-19 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2022523016A (ja) | 2022-04-21 |
US11342256B2 (en) | 2022-05-24 |
EP3915144A1 (en) | 2021-12-01 |
KR20210107899A (ko) | 2021-09-01 |
SG11202107219RA (en) | 2021-08-30 |
KR102554293B1 (ko) | 2023-07-10 |
EP3915144A4 (en) | 2022-11-16 |
TWI729660B (zh) | 2021-06-01 |
CN113330562A (zh) | 2021-08-31 |
WO2020154041A1 (en) | 2020-07-30 |
US20200243432A1 (en) | 2020-07-30 |
TW202029314A (zh) | 2020-08-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6832057B2 (ja) | 垂直nandホールエッチングのためのめっき金属ハードマスク | |
JP5722223B2 (ja) | 選択的な基板領域メッキを可能とする方法 | |
US10714436B2 (en) | Systems and methods for achieving uniformity across a redistribution layer | |
US20070148972A1 (en) | Method of repairing seed layer for damascene interconnects | |
CN101378033A (zh) | 形成薄膜金属导线的方法 | |
TWI737215B (zh) | 重佈線路結構的製備方法 | |
US10154584B2 (en) | Method of producing a fine line 3D non-planar conforming circuit | |
US10332850B2 (en) | Method for producing contact areas on a semiconductor substrate | |
CN107452632B (zh) | 跨再分配层实现均匀性的系统和方法 | |
JP7423640B2 (ja) | 高度なパッケージング用途のための微細な再配線形成の方法 | |
US20160268206A1 (en) | Interconnection structure and manufacturing method thereof | |
KR102060360B1 (ko) | Tsv 기판 상의 범프 형성 방법 | |
TW202245300A (zh) | 超導基板貫孔 | |
KR101976727B1 (ko) | 상호 연결 구조체 형성 방법 | |
US20060226014A1 (en) | Method and process for improved uniformity of electrochemical plating films produced in semiconductor device processing | |
JP2007234889A (ja) | 配線の形成方法 | |
JP2018012885A5 (ja) | ||
US10777503B2 (en) | Method for contacting a metallic contact pad in a printed circuit board and printed circuit board | |
CN112259465A (zh) | 一种重新布线层及其制备方法 | |
US11710690B2 (en) | Package structure and manufacturing method thereof | |
US20230307320A1 (en) | Single side via fill process for through-vias | |
KR100568418B1 (ko) | 반도체 소자의 인덕터 형성방법 | |
TW202236517A (zh) | 電鍍方法 | |
Darrow et al. | Low-cost patterned metallization technique for high density multilayer interconnect applications | |
CN115802645A (zh) | 用于电子线路封装的电镀铜通孔填平方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20211008 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20211008 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20221019 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20221122 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230222 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20230613 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231013 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20231023 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20231219 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20240117 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7423640 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |