JP6108833B2 - 包装システム、及び包装方法 - Google Patents

包装システム、及び包装方法 Download PDF

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Publication number
JP6108833B2
JP6108833B2 JP2012512018A JP2012512018A JP6108833B2 JP 6108833 B2 JP6108833 B2 JP 6108833B2 JP 2012512018 A JP2012512018 A JP 2012512018A JP 2012512018 A JP2012512018 A JP 2012512018A JP 6108833 B2 JP6108833 B2 JP 6108833B2
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product
contact
surface area
tape
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Expired - Fee Related
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Japanese (ja)
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JP2012527384A (ja
JP2012527384A5 (enExample
Inventor
ジューラム、ラデシュ
マッキントシュ、ウィリアム、イー．
Original Assignee
ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング
ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング
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Publication of JP2012527384A publication Critical patent/JP2012527384A/ja
Publication of JP2012527384A5 publication Critical patent/JP2012527384A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
JP2012512018A 2009-05-20 2010-05-20 包装システム、及び包装方法 Expired - Fee Related JP6108833B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/469,053 US8205766B2 (en) 2009-05-20 2009-05-20 Method for packaging thermal interface materials
US12/469,053 2009-05-20
PCT/US2010/035524 WO2010135497A1 (en) 2009-05-20 2010-05-20 Method for mounting thermal interface materials

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014037111A Division JP2014141305A (ja) 2009-05-20 2014-02-27 熱界面材料の包装方法

Publications (3)

Publication Number Publication Date
JP2012527384A JP2012527384A (ja) 2012-11-08
JP2012527384A5 JP2012527384A5 (enExample) 2013-07-04
JP6108833B2 true JP6108833B2 (ja) 2017-04-05

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ID=43123900

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2012512018A Expired - Fee Related JP6108833B2 (ja) 2009-05-20 2010-05-20 包装システム、及び包装方法
JP2014037111A Ceased JP2014141305A (ja) 2009-05-20 2014-02-27 熱界面材料の包装方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014037111A Ceased JP2014141305A (ja) 2009-05-20 2014-02-27 熱界面材料の包装方法

Country Status (4)

Country Link
US (1) US8205766B2 (enExample)
EP (1) EP2432709A4 (enExample)
JP (2) JP6108833B2 (enExample)
WO (1) WO2010135497A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8430264B2 (en) * 2009-05-20 2013-04-30 The Bergquist Company Method for packaging thermal interface materials
JP6087518B2 (ja) 2012-05-14 2017-03-01 信越化学工業株式会社 熱伝導性シート供給体及び熱伝導性シートの供給方法
US20150083641A1 (en) * 2013-09-25 2015-03-26 Texas Instruments Incorporated Selective heat seal wafer cover tape (has tape)
DE102015111569A1 (de) * 2015-07-16 2017-01-19 Buck Service Gmbh Produktverpackung für Reinigungsmittel
CN108357784B (zh) * 2017-01-26 2020-03-03 华邦电子股份有限公司 卷带式包装材

Family Cites Families (136)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3858721A (en) 1971-10-01 1975-01-07 Western Electric Co Loading of compliant tape
US4188438A (en) 1975-06-02 1980-02-12 National Semiconductor Corporation Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices
US4575995A (en) 1980-04-03 1986-03-18 Murata Manufacturing Co., Ltd. Automatic producing apparatus of chip-form electronic parts aggregate
NL8005052A (nl) 1980-09-08 1982-04-01 Philips Nv Verpakking voor elektrische en/of elektronische componenten.
NL8103573A (nl) 1981-07-29 1983-02-16 Philips Nv Inrichting voor het tegelijkertijd toevoeren van meerdere in banden verpakte electrische en/of electronische onderdelen aan een bepaalde positie.
US4716124A (en) 1984-06-04 1987-12-29 General Electric Company Tape automated manufacture of power semiconductor devices
JPS6151896A (ja) 1984-08-21 1986-03-14 株式会社村田製作所 電子部品連
US4753061A (en) 1986-06-20 1988-06-28 Electro Scientific Industries, Inc. Method of and apparatus for packaging chip components
JPH01122493U (enExample) * 1988-02-09 1989-08-21
JPH01294463A (ja) * 1988-05-14 1989-11-28 Murata Mfg Co Ltd 電子部品連
JPH0219271A (ja) 1988-07-06 1990-01-23 Toshiba Corp 半導体装置用テーピング部品
JPH0252765U (enExample) * 1988-10-11 1990-04-16
GB8825154D0 (en) * 1988-10-27 1988-11-30 Reel Service Ltd Tape for storage of electronic components
US4966282A (en) 1989-01-13 1990-10-30 Nitto Denko Corporation Electronic component carrier
JPH0325947A (ja) 1989-06-23 1991-02-04 Nec Corp 半導体装置の製法
JPH0378771U (enExample) * 1989-11-30 1991-08-09
US5191693A (en) 1989-12-29 1993-03-09 Canon Kabushiki Kaisha Tape type work conveying method and conveying apparatus
US5101975A (en) 1990-10-31 1992-04-07 Novapak, Inc. Electronic component carrier
US5234105A (en) 1990-02-22 1993-08-10 Matsushita Electric Industrial Co., Ltd. Packages for circuit boards for preventing oxidation thereof
JPH0416468A (ja) 1990-05-11 1992-01-21 Mitsubishi Electric Corp 半導体素子梱包用リール
JPH0431260A (ja) 1990-05-25 1992-02-03 Toshiba Corp 半導体包装材料の封止構造
JP2816244B2 (ja) 1990-07-11 1998-10-27 株式会社日立製作所 積層型マルチチップ半導体装置およびこれに用いる半導体装置
US5234104A (en) * 1991-02-04 1993-08-10 Illinois Tool Works Inc. Carrier tape system
US5361901A (en) * 1991-02-12 1994-11-08 Minnesota Mining And Manufacturing Company Carrier tape
US5132160A (en) 1991-02-21 1992-07-21 Minnesota Mining And Manufacturing Company Component carrier tape
JPH04294758A (ja) * 1991-03-15 1992-10-19 Fujitsu Ltd 電子デバイスの梱包テープ
JP2768049B2 (ja) 1991-04-30 1998-06-25 株式会社村田製作所 電子部品の自動テーピング装置
US5152393A (en) * 1991-07-08 1992-10-06 Advantek, Inc. Microchip storage tape
JPH0521989A (ja) * 1991-07-17 1993-01-29 Matsushita Electric Ind Co Ltd チツプ型電子部品のテープ包装体およびチツプ型電子部品供給装置
US5226226A (en) * 1991-07-29 1993-07-13 Fierkens Richard H J Tube-shaped package for a semiconductor device and method therefor
US5259500A (en) 1991-12-23 1993-11-09 Joseph Alvite Tape packaging system with removeable covers
US5203143A (en) 1992-03-28 1993-04-20 Tempo G Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system
JPH07122682A (ja) 1992-03-30 1995-05-12 Sharp Corp 半導体素子封止装置
US5325654A (en) 1992-06-19 1994-07-05 Minnesota Mining And Manufacturing Company Carrier tape with cover strip
JPH06163617A (ja) 1992-11-21 1994-06-10 Nitto Denko Corp 半導体装置の封止方法
JP2882972B2 (ja) * 1993-06-15 1999-04-19 電気化学工業株式会社 放熱シート
JPH07101461A (ja) * 1993-09-30 1995-04-18 Yayoi Kk エンボスキャリアテープ
JPH07149365A (ja) * 1993-11-26 1995-06-13 Denki Kagaku Kogyo Kk 絶縁放熱シート包装体、及び基板又は放熱フィン
US5472085A (en) 1994-05-16 1995-12-05 Gpax International, Inc. Gated-pocket tape-form packaging system
US5524765A (en) 1994-11-15 1996-06-11 Tempo G Carrier tape packaging system utilizing a layer of gel for retaining small components
US5526935A (en) * 1995-02-15 1996-06-18 Minnesota Mining And Manufacturing Company Component carrier tape
US5800772A (en) 1995-03-22 1998-09-01 Yayoi Corporation Method for producing embossed carrier tape system
US5673795A (en) * 1995-06-26 1997-10-07 Minnesota Mining And Manufacturing Company Discrete packaging system for electronic device
US5648136A (en) 1995-07-11 1997-07-15 Minnesota Mining And Manufacturing Co. Component carrier tape
JPH0936135A (ja) 1995-07-19 1997-02-07 Disco Abrasive Syst Ltd 樹脂封止装置におけるテープ搬送機構
US5846621A (en) * 1995-09-15 1998-12-08 Minnesota Mining And Manufacturing Company Component carrier tape having static dissipative properties
JP3752712B2 (ja) * 1995-10-31 2006-03-08 エヌエスケイ．ヤヨイ株式会社 電子部品搬送体
US5765692A (en) * 1995-11-13 1998-06-16 Minnesota Mining And Manufacturing Company Carrier tape with adhesive and protective walls
JPH09216659A (ja) * 1996-02-09 1997-08-19 Hiroyuki Kawashima 帯電防止用キャリアテープ、および帯電防止用キャリアテープの製造方法
JP3519534B2 (ja) 1996-02-19 2004-04-19 株式会社東芝 ベアチッププローバ装置及びベアチップハンドリング方法
JP3025947B2 (ja) 1996-04-18 2000-03-27 富士紡績株式会社 乾燥固定化リパーゼ担体の製造方法
US5964353A (en) * 1996-05-20 1999-10-12 Ilinois Tool Works Inc. Energy absorbing carrier tape
US6030692A (en) 1996-09-13 2000-02-29 Netpco Incorporated Cover tape for formed tape packing system and process for making same
JP3611861B2 (ja) 1996-09-17 2005-01-19 松下電器産業株式会社 Ｉｃチップの実装方法及び実装装置
JPH10116842A (ja) 1996-10-14 1998-05-06 Fujitsu Ltd 半導体収容装置及び半導体デバイスの挿入及び取り出し方法
JP3566003B2 (ja) * 1996-10-18 2004-09-15 新日本無線株式会社 半導体素子の検査装置及びエンボスキャリアテープ
JPH10144735A (ja) 1996-11-06 1998-05-29 Sumitomo Metal Mining Co Ltd 補強板付きテープキャリアおよびその製造方法
JP4069963B2 (ja) 1996-11-14 2008-04-02 富士通株式会社 Ｍｏｓトランジスタ敷居値補償回路及びこれを備えたフリップフロップ型センスアンプ
KR100214555B1 (ko) 1997-02-14 1999-08-02 구본준 반도체 패키지의 제조방법
JP3039424B2 (ja) 1997-02-17 2000-05-08 信越ポリマー株式会社 エンボスキャリアテープ
JP3942685B2 (ja) 1997-03-14 2007-07-11 ユー・エム・シー・ジャパン株式会社 半導体包装装置
US5875897A (en) 1997-03-31 1999-03-02 Motorola, Inc. Packaging apparatus and method
TW379182B (en) 1997-07-23 2000-01-11 Matsushita Electric Industrial Co Ltd Packing materials for small parts, packing method and packing apparatus as well as the packing method for electronic parts
US5908114A (en) 1997-09-09 1999-06-01 Gelpak, Llc Tape carrier for electronic and electrical parts
IL129606A (en) 1997-09-10 2003-05-29 Yayoi Corp Tape-shaped parts package, parts storing tape, tape-shaped cover and parts packaging apparatus
JPH11105923A (ja) * 1997-10-03 1999-04-20 Yayoi Kk テープ状部品包装体、テープ状蓋体及び部品包装装置
JPH11147507A (ja) 1997-11-14 1999-06-02 Nec Eng Ltd 半導体装置のテーピング装置
US6003676A (en) 1997-12-05 1999-12-21 Tek Pak, Inc. Product carrier and method of making same
JP4016468B2 (ja) 1997-12-15 2007-12-05 リコープリンティングシステムズ株式会社 電位分割現像を用いた電子写真装置
US6173750B1 (en) 1998-02-18 2001-01-16 Hover-Davis, Inc. Method and apparatus for removing die from a wafer and conveying die to a pickup location
US6076681A (en) * 1998-03-02 2000-06-20 Advantek, Inc. Microchip carrier tape
JP4257534B2 (ja) 1998-07-28 2009-04-22 セイコーエプソン株式会社 半導体装置の製造方法
JP3536728B2 (ja) 1998-07-31 2004-06-14 セイコーエプソン株式会社 半導体装置及びテープキャリア並びにそれらの製造方法、回路基板、電子機器並びにテープキャリア製造装置
US5960961A (en) 1998-08-03 1999-10-05 Tempo G Tab means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes
US6206198B1 (en) 1998-08-11 2001-03-27 Texas Instruments Incorporated Lightweight, high temperature packing reel for integrated circuits
JP4179680B2 (ja) 1998-10-12 2008-11-12 富士通コンポーネント株式会社 電子部品用キャリア、電子部品梱包体及び電子部品運搬方法
JP3512655B2 (ja) 1998-12-01 2004-03-31 シャープ株式会社 半導体装置およびその製造方法並びに該半導体装置の製造に使用される補強用テープ
US7169643B1 (en) 1998-12-28 2007-01-30 Seiko Epson Corporation Semiconductor device, method of fabricating the same, circuit board, and electronic apparatus
JP2000203630A (ja) 1999-01-13 2000-07-25 Miyagi Oki Denki Kk エンボスキャリアテ―プおよびエンボスキャリアテ―ピング方法
JP3504543B2 (ja) 1999-03-03 2004-03-08 株式会社日立製作所 半導体素子の分離方法およびその装置並びに半導体素子の搭載方法
EP1073325A3 (en) 1999-07-27 2002-04-03 Lucent Technologies Inc. Testing and transporting semiconductor chips
US6568535B1 (en) 2000-01-14 2003-05-27 Peak International Ltd. Apparatus and methods for improving uniform cover tape adhesion on a carrier tape
JP4425413B2 (ja) 2000-03-07 2010-03-03 信越ポリマー株式会社 キャリアテープの製造方法および製造装置
DE10017742C2 (de) 2000-04-10 2002-05-29 Infineon Technologies Ag Vorrichtung zum Handling von Bauelementen
US6469372B2 (en) 2000-05-16 2002-10-22 Texas Instruments Incorporated Matched thermal expansion carrier tape assemblage for semiconductor devices
US6938783B2 (en) 2000-07-26 2005-09-06 Amerasia International Technology, Inc. Carrier tape
DE10038163A1 (de) 2000-08-04 2002-02-14 Infineon Technologies Ag Vorrichtung und Verfahren zur Bestückung von Transportgurten
US7389877B2 (en) 2000-08-28 2008-06-24 Sud-Chemie Inc. Apparatus for packaging electronic components including a reel entrained with desiccating material
US6559537B1 (en) * 2000-08-31 2003-05-06 Micron Technology, Inc. Ball grid array packages with thermally conductive containers
AU2001282581A1 (en) 2000-09-01 2002-03-13 Showa Denko K K Apparatus for producing capacitor element member
JP2002096974A (ja) 2000-09-22 2002-04-02 Oki Electric Ind Co Ltd 搬送用リールとそれを用いた搬送方法、及び電子装置の製造方法
JP2002211637A (ja) * 2001-01-24 2002-07-31 Rohm Co Ltd 部品梱包用テープ
JP2002362677A (ja) * 2001-06-06 2002-12-18 Nitto Denko Corp チップ状電子部品のキャリアテープ及びその使用方法
JP2003002360A (ja) * 2001-06-25 2003-01-08 Toyo Chem Co Ltd キャリアテープ
JP2003012028A (ja) * 2001-06-26 2003-01-15 Kyushu Nitto Denko Kk 包装粘性魂状物
US7154166B2 (en) 2001-08-15 2006-12-26 Texas Instruments Incorporated Low profile ball-grid array package for high power
US6820401B2 (en) 2001-10-31 2004-11-23 International Product Technology, Inc. Method and apparatus for tensioning cover tape
JP3927796B2 (ja) * 2001-11-29 2007-06-13 株式会社ルネサステクノロジ 半導体装置の製造方法
JP2003197715A (ja) 2001-12-28 2003-07-11 M Tec Kk リールテープへの半導体チップの貼付け装置
US6984427B2 (en) 2002-01-10 2006-01-10 3M Innovative Properties Company Microstructed release liner
JP2003218165A (ja) 2002-01-24 2003-07-31 Hitachi Ltd 半導体装置の製造方法
JP4031260B2 (ja) 2002-02-22 2008-01-09 大日本印刷株式会社 固形物の殺菌方法及び殺菌装置
DE10211993B4 (de) 2002-03-18 2004-02-05 Infineon Technologies Ag Verfahren und Vorrichtung zum Verpacken und zum Transport von elektronischen Bauteilen
JP2003303919A (ja) 2002-04-10 2003-10-24 Hitachi Ltd 半導体装置及びその製造方法
JP2003338526A (ja) 2002-05-21 2003-11-28 Hitachi Cable Ltd 半導体装置用キャリアテープの送出方法及び送出装置
JP2003341782A (ja) 2002-05-27 2003-12-03 Oki Electric Ind Co Ltd 電子デバイス収容体、電子デバイスの搬送方法、電子デバイスの実装方法、電子デバイスの収容方法
EP1376462A1 (en) 2002-06-19 2004-01-02 SCHLUMBERGER Systèmes Method for manufacturing a tape
KR100469169B1 (ko) 2002-08-14 2005-02-02 삼성전자주식회사 절연 접착 테이프를 이용한 적층 칩 접착 장치
US6657297B1 (en) 2002-08-15 2003-12-02 The Bergquist Company Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads
JP3741683B2 (ja) 2002-12-13 2006-02-01 三井金属鉱業株式会社 電子部品実装用フィルムキャリアテープの製造方法およびこの方法に使用できる鍍金装置
US7416922B2 (en) 2003-03-31 2008-08-26 Intel Corporation Heat sink with preattached thermal interface material and method of making same
JP2004327550A (ja) 2003-04-22 2004-11-18 Renesas Technology Corp 半導体装置の製造方法および半導体装置の出荷方法
JP2005035636A (ja) * 2003-07-17 2005-02-10 Matsushita Electric Ind Co Ltd 電子部品用包装体
TWI228809B (en) 2003-08-07 2005-03-01 Advanced Semiconductor Eng Flip chip package structure and substrate structure thereof
JP2005093958A (ja) 2003-09-19 2005-04-07 Hitachi Cable Ltd 半導体装置用テープキャリアの巻取り装置
US7061108B2 (en) 2003-10-02 2006-06-13 Texas Instruments Incorporated Semiconductor device and a method for securing the device in a carrier tape
US20050151555A1 (en) 2004-01-13 2005-07-14 Cookson Electronics, Inc. Cooling devices and methods of using them
WO2005082737A1 (en) 2004-01-29 2005-09-09 Infineon Technologies Ag Carrier tape for electronic components
JP2005311160A (ja) * 2004-04-23 2005-11-04 Mitsuboshi Belting Ltd 熱伝導材料
JP4517856B2 (ja) * 2004-12-27 2010-08-04 Ｔｄｋ株式会社 電子部品連
JP2006199300A (ja) * 2005-01-18 2006-08-03 Matsushita Electric Ind Co Ltd 電子部品包装帯及びその製造方法
US20060157381A1 (en) 2005-01-20 2006-07-20 Adams James T Component carrier and method for making
JP2006213374A (ja) * 2005-02-04 2006-08-17 Matsushita Electric Ind Co Ltd キャリアテープ
US20060228542A1 (en) 2005-04-08 2006-10-12 Saint-Gobain Performance Plastics Corporation Thermal interface material having spheroidal particulate filler
JP2006306403A (ja) 2005-04-26 2006-11-09 Renesas Technology Corp 半導体装置の製造方法
US7288438B2 (en) 2005-04-28 2007-10-30 Intel Corporation Solder deposition on wafer backside for thin-die thermal interface material
US7097040B1 (en) 2005-08-05 2006-08-29 Charles Gutentag Adhesive backed carrier tape with calibrated levels of low tack adhesion for retention of small components
US7623360B2 (en) * 2006-03-09 2009-11-24 Laird Technologies, Inc. EMI shielding and thermal management assemblies including frames and covers with multi-position latching
JP4777104B2 (ja) 2006-03-16 2011-09-21 富士通セミコンダクター株式会社 半導体装置包装用カバーテープ及び半導体装置用包装体
JP4523923B2 (ja) 2006-03-22 2010-08-11 芝浦メカトロニクス株式会社 テープ部材の搬送装置
US7651938B2 (en) 2006-06-07 2010-01-26 Advanced Micro Devices, Inc. Void reduction in indium thermal interface material
US7513035B2 (en) 2006-06-07 2009-04-07 Advanced Micro Devices, Inc. Method of integrated circuit packaging
US20080006922A1 (en) 2006-07-08 2008-01-10 Charles Gutentag Thermal release adhesive-backed carrier tapes
US20080124840A1 (en) 2006-07-31 2008-05-29 Su Michael Z Electrical Insulating Layer for Metallic Thermal Interface Material
JP5265885B2 (ja) * 2006-10-13 2013-08-14 出光興産株式会社 低硬度熱伝導性樹脂組成物及びそれを用いたシート状放熱部材
JP2008100482A (ja) 2006-10-20 2008-05-01 Nec Lcd Technologies Ltd Ｔｃｐ実装装置におけるキャリアテープの接続方法、それを用いるｔｃｐ実装装置及び表示装置の製造方法

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JP2012527384A (ja) 2012-11-08
EP2432709A4 (en) 2017-06-07
US20100294780A1 (en) 2010-11-25
US8205766B2 (en) 2012-06-26
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WO2010135497A1 (en) 2010-11-25

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