JP2012527384A5 - - Google Patents

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Publication number
JP2012527384A5
JP2012527384A5 JP2012512018A JP2012512018A JP2012527384A5 JP 2012527384 A5 JP2012527384 A5 JP 2012527384A5 JP 2012512018 A JP2012512018 A JP 2012512018A JP 2012512018 A JP2012512018 A JP 2012512018A JP 2012527384 A5 JP2012527384 A5 JP 2012527384A5
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Japan
Prior art keywords
contact
product
surface area
less
tape
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Granted
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JP2012512018A
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English (en)
Japanese (ja)
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JP2012527384A (ja
JP6108833B2 (ja
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Priority claimed from US12/469,053 external-priority patent/US8205766B2/en
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Publication of JP2012527384A publication Critical patent/JP2012527384A/ja
Publication of JP2012527384A5 publication Critical patent/JP2012527384A5/ja
Application granted granted Critical
Publication of JP6108833B2 publication Critical patent/JP6108833B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012512018A 2009-05-20 2010-05-20 包装システム、及び包装方法 Expired - Fee Related JP6108833B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/469,053 US8205766B2 (en) 2009-05-20 2009-05-20 Method for packaging thermal interface materials
US12/469,053 2009-05-20
PCT/US2010/035524 WO2010135497A1 (en) 2009-05-20 2010-05-20 Method for mounting thermal interface materials

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014037111A Division JP2014141305A (ja) 2009-05-20 2014-02-27 熱界面材料の包装方法

Publications (3)

Publication Number Publication Date
JP2012527384A JP2012527384A (ja) 2012-11-08
JP2012527384A5 true JP2012527384A5 (enExample) 2013-07-04
JP6108833B2 JP6108833B2 (ja) 2017-04-05

Family

ID=43123900

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2012512018A Expired - Fee Related JP6108833B2 (ja) 2009-05-20 2010-05-20 包装システム、及び包装方法
JP2014037111A Ceased JP2014141305A (ja) 2009-05-20 2014-02-27 熱界面材料の包装方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014037111A Ceased JP2014141305A (ja) 2009-05-20 2014-02-27 熱界面材料の包装方法

Country Status (4)

Country Link
US (1) US8205766B2 (enExample)
EP (1) EP2432709A4 (enExample)
JP (2) JP6108833B2 (enExample)
WO (1) WO2010135497A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8430264B2 (en) * 2009-05-20 2013-04-30 The Bergquist Company Method for packaging thermal interface materials
JP6087518B2 (ja) 2012-05-14 2017-03-01 信越化学工業株式会社 熱伝導性シート供給体及び熱伝導性シートの供給方法
US20150083641A1 (en) * 2013-09-25 2015-03-26 Texas Instruments Incorporated Selective heat seal wafer cover tape (has tape)
DE102015111569A1 (de) * 2015-07-16 2017-01-19 Buck Service Gmbh Produktverpackung für Reinigungsmittel
CN108357784B (zh) * 2017-01-26 2020-03-03 华邦电子股份有限公司 卷带式包装材

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