US3858721A
(en)
*
|
1971-10-01 |
1975-01-07 |
Western Electric Co |
Loading of compliant tape
|
US4188438A
(en)
*
|
1975-06-02 |
1980-02-12 |
National Semiconductor Corporation |
Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices
|
US4575995A
(en)
*
|
1980-04-03 |
1986-03-18 |
Murata Manufacturing Co., Ltd. |
Automatic producing apparatus of chip-form electronic parts aggregate
|
NL8005052A
(nl)
*
|
1980-09-08 |
1982-04-01 |
Philips Nv |
Verpakking voor elektrische en/of elektronische componenten.
|
NL8103573A
(nl)
*
|
1981-07-29 |
1983-02-16 |
Philips Nv |
Inrichting voor het tegelijkertijd toevoeren van meerdere in banden verpakte electrische en/of electronische onderdelen aan een bepaalde positie.
|
US4716124A
(en)
*
|
1984-06-04 |
1987-12-29 |
General Electric Company |
Tape automated manufacture of power semiconductor devices
|
JPS6151896A
(ja)
*
|
1984-08-21 |
1986-03-14 |
株式会社村田製作所 |
電子部品連
|
US4753061A
(en)
*
|
1986-06-20 |
1988-06-28 |
Electro Scientific Industries, Inc. |
Method of and apparatus for packaging chip components
|
JPH01122493U
(ja)
*
|
1988-02-09 |
1989-08-21 |
|
|
JPH01294463A
(ja)
*
|
1988-05-14 |
1989-11-28 |
Murata Mfg Co Ltd |
電子部品連
|
JPH0219271A
(ja)
*
|
1988-07-06 |
1990-01-23 |
Toshiba Corp |
半導体装置用テーピング部品
|
JPH0252765U
(ja)
*
|
1988-10-11 |
1990-04-16 |
|
|
GB8825154D0
(en)
*
|
1988-10-27 |
1988-11-30 |
Reel Service Ltd |
Tape for storage of electronic components
|
US4966282A
(en)
*
|
1989-01-13 |
1990-10-30 |
Nitto Denko Corporation |
Electronic component carrier
|
JPH0325947A
(ja)
|
1989-06-23 |
1991-02-04 |
Nec Corp |
半導体装置の製法
|
JPH0378771U
(ja)
*
|
1989-11-30 |
1991-08-09 |
|
|
US5191693A
(en)
*
|
1989-12-29 |
1993-03-09 |
Canon Kabushiki Kaisha |
Tape type work conveying method and conveying apparatus
|
US5101975A
(en)
*
|
1990-10-31 |
1992-04-07 |
Novapak, Inc. |
Electronic component carrier
|
US5234105A
(en)
*
|
1990-02-22 |
1993-08-10 |
Matsushita Electric Industrial Co., Ltd. |
Packages for circuit boards for preventing oxidation thereof
|
JPH0416468A
(ja)
|
1990-05-11 |
1992-01-21 |
Mitsubishi Electric Corp |
半導体素子梱包用リール
|
JPH0431260A
(ja)
|
1990-05-25 |
1992-02-03 |
Toshiba Corp |
半導体包装材料の封止構造
|
JP2816244B2
(ja)
|
1990-07-11 |
1998-10-27 |
株式会社日立製作所 |
積層型マルチチップ半導体装置およびこれに用いる半導体装置
|
US5234104A
(en)
*
|
1991-02-04 |
1993-08-10 |
Illinois Tool Works Inc. |
Carrier tape system
|
US5361901A
(en)
*
|
1991-02-12 |
1994-11-08 |
Minnesota Mining And Manufacturing Company |
Carrier tape
|
US5132160A
(en)
*
|
1991-02-21 |
1992-07-21 |
Minnesota Mining And Manufacturing Company |
Component carrier tape
|
JPH04294758A
(ja)
*
|
1991-03-15 |
1992-10-19 |
Fujitsu Ltd |
電子デバイスの梱包テープ
|
JP2768049B2
(ja)
*
|
1991-04-30 |
1998-06-25 |
株式会社村田製作所 |
電子部品の自動テーピング装置
|
US5152393A
(en)
*
|
1991-07-08 |
1992-10-06 |
Advantek, Inc. |
Microchip storage tape
|
JPH0521989A
(ja)
*
|
1991-07-17 |
1993-01-29 |
Matsushita Electric Ind Co Ltd |
チツプ型電子部品のテープ包装体およびチツプ型電子部品供給装置
|
US5226226A
(en)
*
|
1991-07-29 |
1993-07-13 |
Fierkens Richard H J |
Tube-shaped package for a semiconductor device and method therefor
|
US5259500A
(en)
*
|
1991-12-23 |
1993-11-09 |
Joseph Alvite |
Tape packaging system with removeable covers
|
US5203143A
(en)
*
|
1992-03-28 |
1993-04-20 |
Tempo G |
Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system
|
JPH07122682A
(ja)
|
1992-03-30 |
1995-05-12 |
Sharp Corp |
半導体素子封止装置
|
US5325654A
(en)
*
|
1992-06-19 |
1994-07-05 |
Minnesota Mining And Manufacturing Company |
Carrier tape with cover strip
|
JPH06163617A
(ja)
|
1992-11-21 |
1994-06-10 |
Nitto Denko Corp |
半導体装置の封止方法
|
JP2882972B2
(ja)
*
|
1993-06-15 |
1999-04-19 |
電気化学工業株式会社 |
放熱シート
|
JPH07101461A
(ja)
*
|
1993-09-30 |
1995-04-18 |
Yayoi Kk |
エンボスキャリアテープ
|
JPH07149365A
(ja)
*
|
1993-11-26 |
1995-06-13 |
Denki Kagaku Kogyo Kk |
絶縁放熱シート包装体、及び基板又は放熱フィン
|
US5472085A
(en)
*
|
1994-05-16 |
1995-12-05 |
Gpax International, Inc. |
Gated-pocket tape-form packaging system
|
US5524765A
(en)
*
|
1994-11-15 |
1996-06-11 |
Tempo G |
Carrier tape packaging system utilizing a layer of gel for retaining small components
|
US5526935A
(en)
*
|
1995-02-15 |
1996-06-18 |
Minnesota Mining And Manufacturing Company |
Component carrier tape
|
US5800772A
(en)
*
|
1995-03-22 |
1998-09-01 |
Yayoi Corporation |
Method for producing embossed carrier tape system
|
US5673795A
(en)
*
|
1995-06-26 |
1997-10-07 |
Minnesota Mining And Manufacturing Company |
Discrete packaging system for electronic device
|
US5648136A
(en)
*
|
1995-07-11 |
1997-07-15 |
Minnesota Mining And Manufacturing Co. |
Component carrier tape
|
JPH0936135A
(ja)
|
1995-07-19 |
1997-02-07 |
Disco Abrasive Syst Ltd |
樹脂封止装置におけるテープ搬送機構
|
US5846621A
(en)
*
|
1995-09-15 |
1998-12-08 |
Minnesota Mining And Manufacturing Company |
Component carrier tape having static dissipative properties
|
JP3752712B2
(ja)
*
|
1995-10-31 |
2006-03-08 |
エヌエスケイ.ヤヨイ株式会社 |
電子部品搬送体
|
US5765692A
(en)
*
|
1995-11-13 |
1998-06-16 |
Minnesota Mining And Manufacturing Company |
Carrier tape with adhesive and protective walls
|
JPH09216659A
(ja)
*
|
1996-02-09 |
1997-08-19 |
Hiroyuki Kawashima |
帯電防止用キャリアテープ、および帯電防止用キャリアテープの製造方法
|
JP3519534B2
(ja)
*
|
1996-02-19 |
2004-04-19 |
株式会社東芝 |
ベアチッププローバ装置及びベアチップハンドリング方法
|
JP3025947B2
(ja)
|
1996-04-18 |
2000-03-27 |
富士紡績株式会社 |
乾燥固定化リパーゼ担体の製造方法
|
US5964353A
(en)
*
|
1996-05-20 |
1999-10-12 |
Ilinois Tool Works Inc. |
Energy absorbing carrier tape
|
US6030692A
(en)
*
|
1996-09-13 |
2000-02-29 |
Netpco Incorporated |
Cover tape for formed tape packing system and process for making same
|
US6332268B1
(en)
*
|
1996-09-17 |
2001-12-25 |
Matsushita Electric Industrial Co., Ltd. |
Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor
|
JPH10116842A
(ja)
*
|
1996-10-14 |
1998-05-06 |
Fujitsu Ltd |
半導体収容装置及び半導体デバイスの挿入及び取り出し方法
|
JP3566003B2
(ja)
*
|
1996-10-18 |
2004-09-15 |
新日本無線株式会社 |
半導体素子の検査装置及びエンボスキャリアテープ
|
JPH10144735A
(ja)
|
1996-11-06 |
1998-05-29 |
Sumitomo Metal Mining Co Ltd |
補強板付きテープキャリアおよびその製造方法
|
JP4069963B2
(ja)
|
1996-11-14 |
2008-04-02 |
富士通株式会社 |
Mosトランジスタ敷居値補償回路及びこれを備えたフリップフロップ型センスアンプ
|
KR100214555B1
(ko)
*
|
1997-02-14 |
1999-08-02 |
구본준 |
반도체 패키지의 제조방법
|
JP3039424B2
(ja)
*
|
1997-02-17 |
2000-05-08 |
信越ポリマー株式会社 |
エンボスキャリアテープ
|
JP3942685B2
(ja)
|
1997-03-14 |
2007-07-11 |
ユー・エム・シー・ジャパン株式会社 |
半導体包装装置
|
US5875897A
(en)
*
|
1997-03-31 |
1999-03-02 |
Motorola, Inc. |
Packaging apparatus and method
|
TW379182B
(en)
*
|
1997-07-23 |
2000-01-11 |
Matsushita Electric Ind Co Ltd |
Packing materials for small parts, packing method and packing apparatus as well as the packing method for electronic parts
|
US5908114A
(en)
*
|
1997-09-09 |
1999-06-01 |
Gelpak, Llc |
Tape carrier for electronic and electrical parts
|
JPH11105923A
(ja)
*
|
1997-10-03 |
1999-04-20 |
Yayoi Kk |
テープ状部品包装体、テープ状蓋体及び部品包装装置
|
WO1999012827A1
(fr)
*
|
1997-09-10 |
1999-03-18 |
Yayoi Corporation |
Emballage de pieces de type bande, bande de logement de pieces, element de recouvrement de type bande et appareil d'emballage de pieces
|
JPH11147507A
(ja)
|
1997-11-14 |
1999-06-02 |
Nec Eng Ltd |
半導体装置のテーピング装置
|
US6003676A
(en)
*
|
1997-12-05 |
1999-12-21 |
Tek Pak, Inc. |
Product carrier and method of making same
|
JP4016468B2
(ja)
|
1997-12-15 |
2007-12-05 |
リコープリンティングシステムズ株式会社 |
電位分割現像を用いた電子写真装置
|
US6173750B1
(en)
*
|
1998-02-18 |
2001-01-16 |
Hover-Davis, Inc. |
Method and apparatus for removing die from a wafer and conveying die to a pickup location
|
US6076681A
(en)
*
|
1998-03-02 |
2000-06-20 |
Advantek, Inc. |
Microchip carrier tape
|
JP4257534B2
(ja)
|
1998-07-28 |
2009-04-22 |
セイコーエプソン株式会社 |
半導体装置の製造方法
|
JP3536728B2
(ja)
*
|
1998-07-31 |
2004-06-14 |
セイコーエプソン株式会社 |
半導体装置及びテープキャリア並びにそれらの製造方法、回路基板、電子機器並びにテープキャリア製造装置
|
US5960961A
(en)
*
|
1998-08-03 |
1999-10-05 |
Tempo G |
Tab means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes
|
US6206198B1
(en)
*
|
1998-08-11 |
2001-03-27 |
Texas Instruments Incorporated |
Lightweight, high temperature packing reel for integrated circuits
|
JP4179680B2
(ja)
*
|
1998-10-12 |
2008-11-12 |
富士通コンポーネント株式会社 |
電子部品用キャリア、電子部品梱包体及び電子部品運搬方法
|
JP3512655B2
(ja)
*
|
1998-12-01 |
2004-03-31 |
シャープ株式会社 |
半導体装置およびその製造方法並びに該半導体装置の製造に使用される補強用テープ
|
US7169643B1
(en)
*
|
1998-12-28 |
2007-01-30 |
Seiko Epson Corporation |
Semiconductor device, method of fabricating the same, circuit board, and electronic apparatus
|
JP2000203630A
(ja)
*
|
1999-01-13 |
2000-07-25 |
Miyagi Oki Denki Kk |
エンボスキャリアテ―プおよびエンボスキャリアテ―ピング方法
|
JP3504543B2
(ja)
*
|
1999-03-03 |
2004-03-08 |
株式会社日立製作所 |
半導体素子の分離方法およびその装置並びに半導体素子の搭載方法
|
EP1073325A3
(en)
|
1999-07-27 |
2002-04-03 |
Lucent Technologies Inc. |
Testing and transporting semiconductor chips
|
US6568535B1
(en)
*
|
2000-01-14 |
2003-05-27 |
Peak International Ltd. |
Apparatus and methods for improving uniform cover tape adhesion on a carrier tape
|
JP4425413B2
(ja)
|
2000-03-07 |
2010-03-03 |
信越ポリマー株式会社 |
キャリアテープの製造方法および製造装置
|
DE10017742C2
(de)
*
|
2000-04-10 |
2002-05-29 |
Infineon Technologies Ag |
Vorrichtung zum Handling von Bauelementen
|
US6469372B2
(en)
*
|
2000-05-16 |
2002-10-22 |
Texas Instruments Incorporated |
Matched thermal expansion carrier tape assemblage for semiconductor devices
|
US6938783B2
(en)
|
2000-07-26 |
2005-09-06 |
Amerasia International Technology, Inc. |
Carrier tape
|
DE10038163A1
(de)
*
|
2000-08-04 |
2002-02-14 |
Infineon Technologies Ag |
Vorrichtung und Verfahren zur Bestückung von Transportgurten
|
US7389877B2
(en)
*
|
2000-08-28 |
2008-06-24 |
Sud-Chemie Inc. |
Apparatus for packaging electronic components including a reel entrained with desiccating material
|
US6559537B1
(en)
*
|
2000-08-31 |
2003-05-06 |
Micron Technology, Inc. |
Ball grid array packages with thermally conductive containers
|
US7398593B2
(en)
|
2000-09-01 |
2008-07-15 |
Showa Denko K.K. |
Apparatus for producing capacitor element member
|
JP2002096974A
(ja)
*
|
2000-09-22 |
2002-04-02 |
Oki Electric Ind Co Ltd |
搬送用リールとそれを用いた搬送方法、及び電子装置の製造方法
|
JP2002211637A
(ja)
*
|
2001-01-24 |
2002-07-31 |
Rohm Co Ltd |
部品梱包用テープ
|
JP2002362677A
(ja)
*
|
2001-06-06 |
2002-12-18 |
Nitto Denko Corp |
チップ状電子部品のキャリアテープ及びその使用方法
|
JP2003002360A
(ja)
*
|
2001-06-25 |
2003-01-08 |
Toyo Chem Co Ltd |
キャリアテープ
|
JP2003012028A
(ja)
*
|
2001-06-26 |
2003-01-15 |
Kyushu Nitto Denko Kk |
包装粘性魂状物
|
US7154166B2
(en)
*
|
2001-08-15 |
2006-12-26 |
Texas Instruments Incorporated |
Low profile ball-grid array package for high power
|
US6820401B2
(en)
*
|
2001-10-31 |
2004-11-23 |
International Product Technology, Inc. |
Method and apparatus for tensioning cover tape
|
JP3927796B2
(ja)
*
|
2001-11-29 |
2007-06-13 |
株式会社ルネサステクノロジ |
半導体装置の製造方法
|
JP2003197715A
(ja)
|
2001-12-28 |
2003-07-11 |
M Tec Kk |
リールテープへの半導体チップの貼付け装置
|
US6984427B2
(en)
*
|
2002-01-10 |
2006-01-10 |
3M Innovative Properties Company |
Microstructed release liner
|
JP2003218165A
(ja)
|
2002-01-24 |
2003-07-31 |
Hitachi Ltd |
半導体装置の製造方法
|
JP4031260B2
(ja)
|
2002-02-22 |
2008-01-09 |
大日本印刷株式会社 |
固形物の殺菌方法及び殺菌装置
|
DE10211993B4
(de)
*
|
2002-03-18 |
2004-02-05 |
Infineon Technologies Ag |
Verfahren und Vorrichtung zum Verpacken und zum Transport von elektronischen Bauteilen
|
JP2003303919A
(ja)
*
|
2002-04-10 |
2003-10-24 |
Hitachi Ltd |
半導体装置及びその製造方法
|
JP2003338526A
(ja)
|
2002-05-21 |
2003-11-28 |
Hitachi Cable Ltd |
半導体装置用キャリアテープの送出方法及び送出装置
|
JP2003341782A
(ja)
*
|
2002-05-27 |
2003-12-03 |
Oki Electric Ind Co Ltd |
電子デバイス収容体、電子デバイスの搬送方法、電子デバイスの実装方法、電子デバイスの収容方法
|
EP1376462A1
(en)
|
2002-06-19 |
2004-01-02 |
SCHLUMBERGER Systèmes |
Method for manufacturing a tape
|
KR100469169B1
(ko)
*
|
2002-08-14 |
2005-02-02 |
삼성전자주식회사 |
절연 접착 테이프를 이용한 적층 칩 접착 장치
|
US6657297B1
(en)
*
|
2002-08-15 |
2003-12-02 |
The Bergquist Company |
Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads
|
JP3741683B2
(ja)
*
|
2002-12-13 |
2006-02-01 |
三井金属鉱業株式会社 |
電子部品実装用フィルムキャリアテープの製造方法およびこの方法に使用できる鍍金装置
|
US7416922B2
(en)
*
|
2003-03-31 |
2008-08-26 |
Intel Corporation |
Heat sink with preattached thermal interface material and method of making same
|
JP2004327550A
(ja)
|
2003-04-22 |
2004-11-18 |
Renesas Technology Corp |
半導体装置の製造方法および半導体装置の出荷方法
|
JP2005035636A
(ja)
*
|
2003-07-17 |
2005-02-10 |
Matsushita Electric Ind Co Ltd |
電子部品用包装体
|
TWI228809B
(en)
*
|
2003-08-07 |
2005-03-01 |
Advanced Semiconductor Eng |
Flip chip package structure and substrate structure thereof
|
JP2005093958A
(ja)
|
2003-09-19 |
2005-04-07 |
Hitachi Cable Ltd |
半導体装置用テープキャリアの巻取り装置
|
US7061108B2
(en)
*
|
2003-10-02 |
2006-06-13 |
Texas Instruments Incorporated |
Semiconductor device and a method for securing the device in a carrier tape
|
US20050151555A1
(en)
*
|
2004-01-13 |
2005-07-14 |
Cookson Electronics, Inc. |
Cooling devices and methods of using them
|
WO2005082737A1
(en)
*
|
2004-01-29 |
2005-09-09 |
Infineon Technologies Ag |
Carrier tape for electronic components
|
JP2005311160A
(ja)
*
|
2004-04-23 |
2005-11-04 |
Mitsuboshi Belting Ltd |
熱伝導材料
|
JP4517856B2
(ja)
*
|
2004-12-27 |
2010-08-04 |
Tdk株式会社 |
電子部品連
|
JP2006199300A
(ja)
*
|
2005-01-18 |
2006-08-03 |
Matsushita Electric Ind Co Ltd |
電子部品包装帯及びその製造方法
|
US20060157381A1
(en)
*
|
2005-01-20 |
2006-07-20 |
Adams James T |
Component carrier and method for making
|
JP2006213374A
(ja)
*
|
2005-02-04 |
2006-08-17 |
Matsushita Electric Ind Co Ltd |
キャリアテープ
|
US20060228542A1
(en)
*
|
2005-04-08 |
2006-10-12 |
Saint-Gobain Performance Plastics Corporation |
Thermal interface material having spheroidal particulate filler
|
JP2006306403A
(ja)
|
2005-04-26 |
2006-11-09 |
Renesas Technology Corp |
半導体装置の製造方法
|
US7288438B2
(en)
*
|
2005-04-28 |
2007-10-30 |
Intel Corporation |
Solder deposition on wafer backside for thin-die thermal interface material
|
US7097040B1
(en)
*
|
2005-08-05 |
2006-08-29 |
Charles Gutentag |
Adhesive backed carrier tape with calibrated levels of low tack adhesion for retention of small components
|
US7623360B2
(en)
*
|
2006-03-09 |
2009-11-24 |
Laird Technologies, Inc. |
EMI shielding and thermal management assemblies including frames and covers with multi-position latching
|
JP4777104B2
(ja)
*
|
2006-03-16 |
2011-09-21 |
富士通セミコンダクター株式会社 |
半導体装置包装用カバーテープ及び半導体装置用包装体
|
JP4523923B2
(ja)
|
2006-03-22 |
2010-08-11 |
芝浦メカトロニクス株式会社 |
テープ部材の搬送装置
|
US7513035B2
(en)
*
|
2006-06-07 |
2009-04-07 |
Advanced Micro Devices, Inc. |
Method of integrated circuit packaging
|
US7651938B2
(en)
*
|
2006-06-07 |
2010-01-26 |
Advanced Micro Devices, Inc. |
Void reduction in indium thermal interface material
|
US20080006922A1
(en)
*
|
2006-07-08 |
2008-01-10 |
Charles Gutentag |
Thermal release adhesive-backed carrier tapes
|
US20080124840A1
(en)
*
|
2006-07-31 |
2008-05-29 |
Su Michael Z |
Electrical Insulating Layer for Metallic Thermal Interface Material
|
JP5265885B2
(ja)
*
|
2006-10-13 |
2013-08-14 |
出光興産株式会社 |
低硬度熱伝導性樹脂組成物及びそれを用いたシート状放熱部材
|
JP2008100482A
(ja)
*
|
2006-10-20 |
2008-05-01 |
Nec Lcd Technologies Ltd |
Tcp実装装置におけるキャリアテープの接続方法、それを用いるtcp実装装置及び表示装置の製造方法
|