JP5952523B2 - 半導体素子およびフリップチップ相互接続構造を形成する方法 - Google Patents

半導体素子およびフリップチップ相互接続構造を形成する方法 Download PDF

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JP5952523B2
JP5952523B2 JP2011009327A JP2011009327A JP5952523B2 JP 5952523 B2 JP5952523 B2 JP 5952523B2 JP 2011009327 A JP2011009327 A JP 2011009327A JP 2011009327 A JP2011009327 A JP 2011009327A JP 5952523 B2 JP5952523 B2 JP 5952523B2
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interconnect
bump
substrate
semiconductor die
conductive
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JP2012109507A5 (enExample
JP2012109507A (ja
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ディー． ペンズ ラジェンドラ
ディー． ペンズ ラジェンドラ
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Stats Chippac Pte Ltd
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    • H10W74/016—
    • H10P95/00—
    • H10P72/00—
    • H10W72/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H10W72/01225—
    • H10W72/01308—
    • H10W72/072—
    • H10W72/07227—
    • H10W72/07236—
    • H10W72/07252—
    • H10W72/07253—
    • H10W72/073—
    • H10W72/07331—
    • H10W72/221—
    • H10W72/234—
    • H10W72/241—
    • H10W72/251—
    • H10W72/252—
    • H10W72/352—
    • H10W72/354—
    • H10W72/884—
    • H10W72/952—
    • H10W74/00—
    • H10W74/012—
    • H10W74/114—
    • H10W74/15—
    • H10W90/724—
    • H10W90/732—
    • H10W90/734—
    • H10W90/754—
    • H10W90/756—

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  • Wire Bonding (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
JP2011009327A 2010-11-16 2011-01-19 半導体素子およびフリップチップ相互接続構造を形成する方法 Active JP5952523B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/947,414 US10388626B2 (en) 2000-03-10 2010-11-16 Semiconductor device and method of forming flipchip interconnect structure
US12/947,414 2010-11-16

Publications (3)

Publication Number Publication Date
JP2012109507A JP2012109507A (ja) 2012-06-07
JP2012109507A5 JP2012109507A5 (enExample) 2014-01-09
JP5952523B2 true JP5952523B2 (ja) 2016-07-13

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JP2011009327A Active JP5952523B2 (ja) 2010-11-16 2011-01-19 半導体素子およびフリップチップ相互接続構造を形成する方法

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US (1) US10388626B2 (enExample)
JP (1) JP5952523B2 (enExample)
KR (1) KR101785729B1 (enExample)
CN (1) CN102468197B (enExample)
SG (3) SG10201402214VA (enExample)
TW (1) TWI541916B (enExample)

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TW202042359A (zh) * 2019-05-02 2020-11-16 南茂科技股份有限公司 薄膜覆晶封裝結構
CN112687629B (zh) * 2020-12-25 2024-02-23 上海易卜半导体有限公司 半导体封装方法、半导体组件以及包含其的电子设备
US12218090B2 (en) 2020-12-25 2025-02-04 Yibu Semiconductor Co., Ltd. Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly
CN114679143A (zh) * 2020-12-25 2022-06-28 苏州固锝电子股份有限公司 适用于声表面滤波器的低成本封装工艺
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SG10201402214VA (en) 2014-09-26
CN102468197A (zh) 2012-05-23
US10388626B2 (en) 2019-08-20
SG10201809052TA (en) 2018-11-29
US20110074022A1 (en) 2011-03-31
US20120241945A9 (en) 2012-09-27
KR101785729B1 (ko) 2017-11-06
KR20120052844A (ko) 2012-05-24
TWI541916B (zh) 2016-07-11
TW201225193A (en) 2012-06-16
CN102468197B (zh) 2017-04-26
JP2012109507A (ja) 2012-06-07

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