JP5871387B2 - プログラマブルロジックデバイス - Google Patents
プログラマブルロジックデバイス Download PDFInfo
- Publication number
- JP5871387B2 JP5871387B2 JP2012111152A JP2012111152A JP5871387B2 JP 5871387 B2 JP5871387 B2 JP 5871387B2 JP 2012111152 A JP2012111152 A JP 2012111152A JP 2012111152 A JP2012111152 A JP 2012111152A JP 5871387 B2 JP5871387 B2 JP 5871387B2
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- region
- film
- oxide semiconductor
- oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
- H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/0008—Arrangements for reducing power consumption
- H03K19/0013—Arrangements for reducing power consumption in field effect transistor circuits
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/0008—Arrangements for reducing power consumption
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
- H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form
- H03K19/17736—Structural details of routing resources
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
- H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form
- H03K19/17736—Structural details of routing resources
- H03K19/17744—Structural details of routing resources for input/output signals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
Landscapes
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Logic Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Dram (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012111152A JP5871387B2 (ja) | 2011-05-19 | 2012-05-15 | プログラマブルロジックデバイス |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011112045 | 2011-05-19 | ||
| JP2011112045 | 2011-05-19 | ||
| JP2012111152A JP5871387B2 (ja) | 2011-05-19 | 2012-05-15 | プログラマブルロジックデバイス |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016001479A Division JP6006891B2 (ja) | 2011-05-19 | 2016-01-07 | プログラマブルロジックデバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012257216A JP2012257216A (ja) | 2012-12-27 |
| JP2012257216A5 JP2012257216A5 (enExample) | 2015-04-09 |
| JP5871387B2 true JP5871387B2 (ja) | 2016-03-01 |
Family
ID=47174481
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012111152A Active JP5871387B2 (ja) | 2011-05-19 | 2012-05-15 | プログラマブルロジックデバイス |
| JP2016001479A Expired - Fee Related JP6006891B2 (ja) | 2011-05-19 | 2016-01-07 | プログラマブルロジックデバイス |
| JP2016176761A Expired - Fee Related JP6177978B2 (ja) | 2011-05-19 | 2016-09-09 | プログラマブルロジックデバイス |
| JP2017135929A Withdrawn JP2017212742A (ja) | 2011-05-19 | 2017-07-12 | 半導体装置 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016001479A Expired - Fee Related JP6006891B2 (ja) | 2011-05-19 | 2016-01-07 | プログラマブルロジックデバイス |
| JP2016176761A Expired - Fee Related JP6177978B2 (ja) | 2011-05-19 | 2016-09-09 | プログラマブルロジックデバイス |
| JP2017135929A Withdrawn JP2017212742A (ja) | 2011-05-19 | 2017-07-12 | 半導体装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US8581625B2 (enExample) |
| JP (4) | JP5871387B2 (enExample) |
| KR (2) | KR101900348B1 (enExample) |
| CN (1) | CN103563254A (enExample) |
| DE (1) | DE112012002760T5 (enExample) |
| TW (1) | TWI615972B (enExample) |
| WO (1) | WO2012157593A1 (enExample) |
Families Citing this family (50)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9048142B2 (en) | 2010-12-28 | 2015-06-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR101889383B1 (ko) | 2011-05-16 | 2018-08-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 프로그래머블 로직 디바이스 |
| US8779799B2 (en) | 2011-05-19 | 2014-07-15 | Semiconductor Energy Laboratory Co., Ltd. | Logic circuit |
| JP5892852B2 (ja) | 2011-05-20 | 2016-03-23 | 株式会社半導体エネルギー研究所 | プログラマブルロジックデバイス |
| US8669781B2 (en) | 2011-05-31 | 2014-03-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| WO2013164958A1 (en) | 2012-05-02 | 2013-11-07 | Semiconductor Energy Laboratory Co., Ltd. | Programmable logic device |
| JP6250955B2 (ja) | 2012-05-25 | 2017-12-20 | 株式会社半導体エネルギー研究所 | 半導体装置の駆動方法 |
| CN104321967B (zh) | 2012-05-25 | 2018-01-09 | 株式会社半导体能源研究所 | 可编程逻辑装置及半导体装置 |
| JP6377317B2 (ja) | 2012-05-30 | 2018-08-22 | 株式会社半導体エネルギー研究所 | プログラマブルロジックデバイス |
| US9853053B2 (en) | 2012-09-10 | 2017-12-26 | 3B Technologies, Inc. | Three dimension integrated circuits employing thin film transistors |
| TWI591966B (zh) | 2012-10-17 | 2017-07-11 | 半導體能源研究所股份有限公司 | 可編程邏輯裝置及可編程邏輯裝置的驅動方法 |
| WO2014061567A1 (en) * | 2012-10-17 | 2014-04-24 | Semiconductor Energy Laboratory Co., Ltd. | Programmable logic device |
| JP6254834B2 (ja) | 2012-12-06 | 2017-12-27 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2014125979A1 (en) * | 2013-02-13 | 2014-08-21 | Semiconductor Energy Laboratory Co., Ltd. | Programmable logic device and semiconductor device |
| US8952723B2 (en) * | 2013-02-13 | 2015-02-10 | Semiconductor Energy Laboratory Co., Ltd. | Programmable logic device and semiconductor device |
| JP2014195243A (ja) | 2013-02-28 | 2014-10-09 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| US8947121B2 (en) * | 2013-03-12 | 2015-02-03 | Semiconductor Energy Laboratory Co., Ltd. | Programmable logic device |
| US9612795B2 (en) | 2013-03-14 | 2017-04-04 | Semiconductor Energy Laboratory Co., Ltd. | Data processing device, data processing method, and computer program |
| JP6333028B2 (ja) * | 2013-04-19 | 2018-05-30 | 株式会社半導体エネルギー研究所 | 記憶装置及び半導体装置 |
| US9704886B2 (en) | 2013-05-16 | 2017-07-11 | Semiconductor Energy Laboratory Co., Ltd. | Signal processing device |
| TWI638519B (zh) * | 2013-05-17 | 2018-10-11 | 半導體能源研究所股份有限公司 | 可程式邏輯裝置及半導體裝置 |
| CN103368750B (zh) * | 2013-06-24 | 2016-08-10 | 华为技术有限公司 | 一种电源时序电路及供电方法 |
| JP6478562B2 (ja) | 2013-11-07 | 2019-03-06 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US9385054B2 (en) * | 2013-11-08 | 2016-07-05 | Semiconductor Energy Laboratory Co., Ltd. | Data processing device and manufacturing method thereof |
| JP2016001712A (ja) * | 2013-11-29 | 2016-01-07 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| TWI637484B (zh) * | 2013-12-26 | 2018-10-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| US9349418B2 (en) | 2013-12-27 | 2016-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for driving the same |
| US9379713B2 (en) | 2014-01-17 | 2016-06-28 | Semiconductor Energy Laboratory Co., Ltd. | Data processing device and driving method thereof |
| JP6473626B2 (ja) | 2014-02-06 | 2019-02-20 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| DE102014204110A1 (de) * | 2014-03-06 | 2015-09-10 | Globalfoundries Inc. | Vorrichtung mit einer SRAM-Zelle und Verfahren mit einer Anpassung einer Schwellspannung von Transistoren in einer SRAM-Zelle |
| JP6541376B2 (ja) * | 2014-03-13 | 2019-07-10 | 株式会社半導体エネルギー研究所 | プログラマブルロジックデバイスの動作方法 |
| US10651252B2 (en) * | 2014-03-26 | 2020-05-12 | International Business Machines Corporation | Vertically integrated active matrix backplane |
| TWI643457B (zh) | 2014-04-25 | 2018-12-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| US9401364B2 (en) | 2014-09-19 | 2016-07-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, electronic component, and electronic device |
| JP6689062B2 (ja) | 2014-12-10 | 2020-04-28 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2016099580A2 (en) | 2014-12-23 | 2016-06-23 | Lupino James John | Three dimensional integrated circuits employing thin film transistors |
| TWI662792B (zh) * | 2015-01-29 | 2019-06-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置、電子組件及電子裝置 |
| KR102643895B1 (ko) | 2015-10-30 | 2024-03-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 전자 부품, 및 전자 기기 |
| US9934826B2 (en) | 2016-04-14 | 2018-04-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US10008502B2 (en) | 2016-05-04 | 2018-06-26 | Semiconductor Energy Laboratory Co., Ltd. | Memory device |
| CN109155627B (zh) * | 2016-05-25 | 2023-04-11 | 宜普电源转换公司 | 增强型fet栅极驱动器集成电路 |
| US10504204B2 (en) | 2016-07-13 | 2019-12-10 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device |
| TW201804613A (zh) * | 2016-07-26 | 2018-02-01 | 聯華電子股份有限公司 | 氧化物半導體裝置 |
| CN109565280B (zh) | 2016-08-19 | 2023-02-17 | 株式会社半导体能源研究所 | 半导体装置的电源控制方法 |
| EP3358626B1 (en) * | 2017-02-02 | 2022-07-20 | Nxp B.V. | Method of making a semiconductor switch device |
| US10574239B1 (en) * | 2018-11-07 | 2020-02-25 | Jinghui Zhu | Method and system for providing regional electrical grid for power conservation in a programmable device |
| US11823733B2 (en) | 2019-04-30 | 2023-11-21 | Semiconductor Energy Laboratory Co., Ltd. | Memory device, semiconductor device, and electronic device each including redundant memory cell |
| CN110767745A (zh) * | 2019-09-18 | 2020-02-07 | 华南理工大学 | 复合金属氧化物半导体及薄膜晶体管与应用 |
| CN110797395A (zh) * | 2019-09-18 | 2020-02-14 | 华南理工大学 | 掺杂型金属氧化物半导体及薄膜晶体管与应用 |
| KR102881994B1 (ko) * | 2020-09-10 | 2025-11-07 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
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| JP5883699B2 (ja) | 2011-04-13 | 2016-03-15 | 株式会社半導体エネルギー研究所 | プログラマブルlsi |
| KR101889383B1 (ko) | 2011-05-16 | 2018-08-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 프로그래머블 로직 디바이스 |
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| TW201308601A (zh) | 2013-02-16 |
| KR101900348B1 (ko) | 2018-09-19 |
| CN103563254A (zh) | 2014-02-05 |
| DE112012002760T5 (de) | 2014-04-17 |
| JP6177978B2 (ja) | 2017-08-09 |
| JP2017212742A (ja) | 2017-11-30 |
| US8581625B2 (en) | 2013-11-12 |
| KR20140049096A (ko) | 2014-04-24 |
| US9595964B2 (en) | 2017-03-14 |
| JP2016054561A (ja) | 2016-04-14 |
| US20170179955A1 (en) | 2017-06-22 |
| JP6006891B2 (ja) | 2016-10-12 |
| JP2012257216A (ja) | 2012-12-27 |
| JP2017017743A (ja) | 2017-01-19 |
| KR20140040159A (ko) | 2014-04-02 |
| TWI615972B (zh) | 2018-02-21 |
| US20120293206A1 (en) | 2012-11-22 |
| WO2012157593A1 (en) | 2012-11-22 |
| KR101466885B1 (ko) | 2014-12-03 |
| US20140015566A1 (en) | 2014-01-16 |
| US9900007B2 (en) | 2018-02-20 |
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