JP4646968B2 - 回路転写用キャリア部材の製造方法 - Google Patents
回路転写用キャリア部材の製造方法 Download PDFInfo
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- JP4646968B2 JP4646968B2 JP2007337587A JP2007337587A JP4646968B2 JP 4646968 B2 JP4646968 B2 JP 4646968B2 JP 2007337587 A JP2007337587 A JP 2007337587A JP 2007337587 A JP2007337587 A JP 2007337587A JP 4646968 B2 JP4646968 B2 JP 4646968B2
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- Prior art keywords
- circuit
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4658—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern characterized by laminating a prefabricated metal foil pattern, e.g. by transfer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1536—Temporarily stacked PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
101、201、211 樹脂絶縁層
102、104、202、212 回路パターン
103、105、203、213 ランド
106、206、216 ビアホール
300 キャリア原板
301 接着体
302 キャリア層
303 バリア層
304 鍍金レジスト
305、306、307、308 回路形成部位
309、311 回路パターン
310、312 ランド
313 凹凸
C1、C2 回路転写用キャリア部材
400a、400b 回路転写用キャリア部材
401a、401b キャリア層
402a、402b バリア層
403a、403b 回路パターン
404a、404b ランド
405 樹脂絶縁層
406 ブラインドビアホール
407a、407b 銅シード層
408 充電鍍金層
Claims (5)
- (a)熱処理の際に非接着性を表す熱接着剤の両面に、キャリア層と、銅以外の金属シード層でなるバリア層とから構成されたキャリア原板が付着された両面キャリア構造物を準備するステップと、
(b)前記両面キャリア構造物のバリア層上において、ランドを含むか又は含まない回路形成部位を除いた部分に鍍金レジストを塗布するステップと、
(c)前記鍍金レジストを通じて開放された回路形成部位に電解銅鍍金を施して回路パターンを形成するステップと、
(d)前記回路パターンの露出した表面を粗面化処理して凹凸を形成するステップと、
(e)前記鍍金レジストを除去し、前記両面キャリア構造物を熱処理することで、熱接着剤から一対の回路転写用キャリア部材を分離して得るステップと
を含むことを特徴とする、回路転写用キャリア部材の製造方法。 - 前記キャリア層は金属又は重合体でなることを特徴とする、請求項1に記載の回路転写用キャリア部材の製造方法。
- 前記両面キャリア構造物の熱処理は、100〜150℃の温度で行われることを特徴とする、請求項1に記載の回路転写用キャリア部材の製造方法。
- 前記回路パターン幅の偏差は±10%以内であることを特徴とする、請求項1に記載の回路転写用キャリア部材の製造方法。
- 前記回路形成部位は、前記一対の回路転写用キャリア部材のうち、第1回路転写用キャリア部材に形成された第1層ランドがビアホール加工部位を介在して離隔して形成され、第2回路転写用キャリア部材に形成された第2層ランドが離隔部分なしに一体的に前記第1層ランドに対向して形成されるように選択されることを特徴とする、請求項1に記載の回路転写用キャリア部材の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070042002A KR100905566B1 (ko) | 2007-04-30 | 2007-04-30 | 회로 전사용 캐리어 부재, 이를 이용한 코어리스인쇄회로기판, 및 이들의 제조방법 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010163108A Division JP2010263237A (ja) | 2007-04-30 | 2010-07-20 | 回路転写用キャリア部材、これを用いたコアレスプリント基板、及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008277737A JP2008277737A (ja) | 2008-11-13 |
JP4646968B2 true JP4646968B2 (ja) | 2011-03-09 |
Family
ID=39885649
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007337587A Expired - Fee Related JP4646968B2 (ja) | 2007-04-30 | 2007-12-27 | 回路転写用キャリア部材の製造方法 |
JP2010163108A Pending JP2010263237A (ja) | 2007-04-30 | 2010-07-20 | 回路転写用キャリア部材、これを用いたコアレスプリント基板、及びその製造方法 |
JP2013000173A Pending JP2013062546A (ja) | 2007-04-30 | 2013-01-04 | 回路転写用キャリア部材、これを用いたコアレスプリント基板、及びその製造方法 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010163108A Pending JP2010263237A (ja) | 2007-04-30 | 2010-07-20 | 回路転写用キャリア部材、これを用いたコアレスプリント基板、及びその製造方法 |
JP2013000173A Pending JP2013062546A (ja) | 2007-04-30 | 2013-01-04 | 回路転写用キャリア部材、これを用いたコアレスプリント基板、及びその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (2) | US20080264684A1 (ja) |
JP (3) | JP4646968B2 (ja) |
KR (1) | KR100905566B1 (ja) |
TW (1) | TWI352562B (ja) |
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JP4079927B2 (ja) * | 2004-09-16 | 2008-04-23 | Tdk株式会社 | 多層基板及びその製造方法 |
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2007
- 2007-04-30 KR KR1020070042002A patent/KR100905566B1/ko active IP Right Grant
- 2007-12-27 JP JP2007337587A patent/JP4646968B2/ja not_active Expired - Fee Related
- 2007-12-28 US US12/003,669 patent/US20080264684A1/en not_active Abandoned
- 2007-12-28 TW TW096150792A patent/TWI352562B/zh not_active IP Right Cessation
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2010
- 2010-07-20 JP JP2010163108A patent/JP2010263237A/ja active Pending
-
2011
- 2011-12-05 US US13/311,058 patent/US20120073865A1/en not_active Abandoned
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2013
- 2013-01-04 JP JP2013000173A patent/JP2013062546A/ja active Pending
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Also Published As
Publication number | Publication date |
---|---|
KR20080096985A (ko) | 2008-11-04 |
JP2010263237A (ja) | 2010-11-18 |
US20080264684A1 (en) | 2008-10-30 |
TWI352562B (en) | 2011-11-11 |
TW200843578A (en) | 2008-11-01 |
JP2013062546A (ja) | 2013-04-04 |
JP2008277737A (ja) | 2008-11-13 |
KR100905566B1 (ko) | 2009-07-02 |
US20120073865A1 (en) | 2012-03-29 |
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