KR101013992B1 - 인쇄회로기판 제조방법 - Google Patents
인쇄회로기판 제조방법 Download PDFInfo
- Publication number
- KR101013992B1 KR101013992B1 KR1020080120966A KR20080120966A KR101013992B1 KR 101013992 B1 KR101013992 B1 KR 101013992B1 KR 1020080120966 A KR1020080120966 A KR 1020080120966A KR 20080120966 A KR20080120966 A KR 20080120966A KR 101013992 B1 KR101013992 B1 KR 101013992B1
- Authority
- KR
- South Korea
- Prior art keywords
- carrier
- barrier layer
- forming
- circuit pattern
- hole
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000004020 conductor Substances 0.000 claims abstract description 22
- 239000012212 insulator Substances 0.000 claims abstract description 21
- 238000012545 processing Methods 0.000 claims abstract description 8
- 239000011229 interlayer Substances 0.000 claims abstract description 6
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 67
- 230000004888 barrier function Effects 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 30
- 238000009713 electroplating Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 238000007747 plating Methods 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 9
- 238000005530 etching Methods 0.000 description 9
- 239000011651 chromium Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 206010017577 Gait disturbance Diseases 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D73/00—Packages comprising articles attached to cards, sheets or webs
- B65D73/02—Articles, e.g. small electrical components, attached to webs
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0384—Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4658—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern characterized by laminating a prefabricated metal foil pattern, e.g. by transfer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (6)
- 층간 접속을 위한 비아를 포함하는 인쇄회로기판을 제조하는 방법으로서,캐리어의 일면에 회로패턴을 형성하는 단계;상기 캐리어의 일면을 절연체의 일면에 압착하는 단계;상기 캐리어를 제거하는 단계;비아랜드가 형성되어 있지 않은 상기 회로패턴의 일단을 가공하여 상기 절연체를 관통하는 홀을 형성하는 단계;상기 홀의 내부에 도전성 물질을 형성하여 랜드리스(landless) 구조의 비아를 형성하는 단계를 포함하는 인쇄회로기판 제조방법.
- 삭제
- 제1항에 있어서,상기 캐리어는 금속 재질이며,상기 회로패턴을 형성하는 단계는,상기 캐리어의 일면에, 상기 캐리어와 상이한 재질의 장벽층(barrier)을 형성하는 단계;상기 장벽층 상에 상기 회로패턴을 형성하는 단계를 포함하는 것을 특징으로 하는 인쇄회로기판 제조방법.
- 제3항에 있어서,상기 장벽층 상에 상기 장벽층과 상이한 재질의 제1 시드층을 형성하는 단계를 더 포함하며,상기 회로패턴은 전해도금을 통해 상기 제1 시드층 상에 형성되는 것을 특징으로 하는 인쇄회로기판 제조방법.
- 제3항에 있어서,상기 홀의 내부에 도전성 물질을 형성하는 단계는,상기 홀의 내벽 및 상기 장벽층의 표면에 제2 시드층을 형성하는 단계;전해도금을 통하여, 상기 홀의 내부 및 상기 장벽층 상에 도전성 물질을 형성하는 단계;상기 장벽층 상에 형성된 도전성 물질을 제거하는 단계; 및상기 장벽층을 제거하는 단계를 포함하는 것을 특징으로 하는 인쇄회로기판 제조방법.
- 제1항에 있어서,상기 도전성 물질을 형성하는 단계는, 상기 홀 내부가 충전(充塡) 되도록 수행되는 것을 특징으로 하는 인쇄회로기판 제조방법.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080120966A KR101013992B1 (ko) | 2008-12-02 | 2008-12-02 | 인쇄회로기판 제조방법 |
US12/508,224 US8197702B2 (en) | 2008-12-02 | 2009-07-23 | Manufacturing method of printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080120966A KR101013992B1 (ko) | 2008-12-02 | 2008-12-02 | 인쇄회로기판 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100062361A KR20100062361A (ko) | 2010-06-10 |
KR101013992B1 true KR101013992B1 (ko) | 2011-02-14 |
Family
ID=42221718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080120966A KR101013992B1 (ko) | 2008-12-02 | 2008-12-02 | 인쇄회로기판 제조방법 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8197702B2 (ko) |
KR (1) | KR101013992B1 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5600427B2 (ja) * | 2009-12-25 | 2014-10-01 | 株式会社フジクラ | 貫通配線基板の材料基板 |
US9368340B2 (en) | 2014-06-02 | 2016-06-14 | Lam Research Corporation | Metallization of the wafer edge for optimized electroplating performance on resistive substrates |
CN107447243B (zh) * | 2017-06-19 | 2023-07-14 | 中南大学 | 一种用于金属微弧氧化单向表面改性的装置 |
CN111312680B (zh) * | 2018-12-12 | 2022-10-28 | 深南电路股份有限公司 | 一种无芯封装基板的承载板及制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005039233A (ja) | 2003-06-27 | 2005-02-10 | Tdk Corp | ビアホールを有する基板およびその製造方法 |
KR100776248B1 (ko) | 2006-11-21 | 2007-11-16 | 삼성전기주식회사 | 인쇄회로기판 제조방법 |
KR20080037307A (ko) * | 2006-10-25 | 2008-04-30 | 삼성전기주식회사 | 회로기판 및 그 제조방법 |
KR20080096985A (ko) * | 2007-04-30 | 2008-11-04 | 삼성전기주식회사 | 회로 전사용 캐리어 부재, 이를 이용한 코어리스인쇄회로기판, 및 이들의 제조방법 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6958535B2 (en) * | 2000-09-22 | 2005-10-25 | Matsushita Electric Industrial Co., Ltd. | Thermal conductive substrate and semiconductor module using the same |
US7537668B2 (en) * | 2004-07-21 | 2009-05-26 | Samsung Electro-Mechanics Co., Ltd. | Method of fabricating high density printed circuit board |
KR100857165B1 (ko) * | 2007-04-13 | 2008-09-05 | 삼성전기주식회사 | 회로기판 제조방법 |
KR100841987B1 (ko) * | 2007-07-10 | 2008-06-27 | 삼성전기주식회사 | 다층 인쇄회로기판 제조방법 |
KR100894178B1 (ko) * | 2007-09-28 | 2009-04-22 | 삼성전기주식회사 | 인쇄회로기판 제조방법 |
KR20110028951A (ko) * | 2009-09-14 | 2011-03-22 | 삼성전기주식회사 | 인쇄회로기판 및 그의 제조방법 |
KR101012403B1 (ko) * | 2009-10-19 | 2011-02-09 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
US8334463B2 (en) * | 2009-10-30 | 2012-12-18 | Ibiden Co., Ltd. | Wiring board and method for manufacturing the same |
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2008
- 2008-12-02 KR KR1020080120966A patent/KR101013992B1/ko active IP Right Grant
-
2009
- 2009-07-23 US US12/508,224 patent/US8197702B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005039233A (ja) | 2003-06-27 | 2005-02-10 | Tdk Corp | ビアホールを有する基板およびその製造方法 |
KR20080037307A (ko) * | 2006-10-25 | 2008-04-30 | 삼성전기주식회사 | 회로기판 및 그 제조방법 |
KR100776248B1 (ko) | 2006-11-21 | 2007-11-16 | 삼성전기주식회사 | 인쇄회로기판 제조방법 |
KR20080096985A (ko) * | 2007-04-30 | 2008-11-04 | 삼성전기주식회사 | 회로 전사용 캐리어 부재, 이를 이용한 코어리스인쇄회로기판, 및 이들의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
KR20100062361A (ko) | 2010-06-10 |
US20100132876A1 (en) | 2010-06-03 |
US8197702B2 (en) | 2012-06-12 |
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