JP3732250B2 - インライン式成膜装置 - Google Patents

インライン式成膜装置 Download PDF

Info

Publication number
JP3732250B2
JP3732250B2 JP09964895A JP9964895A JP3732250B2 JP 3732250 B2 JP3732250 B2 JP 3732250B2 JP 09964895 A JP09964895 A JP 09964895A JP 9964895 A JP9964895 A JP 9964895A JP 3732250 B2 JP3732250 B2 JP 3732250B2
Authority
JP
Japan
Prior art keywords
chamber
substrate
carrier
vacuum
film forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP09964895A
Other languages
English (en)
Japanese (ja)
Other versions
JPH08274142A (ja
Inventor
洋 神倉
芳樹 有賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Canon Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Anelva Corp filed Critical Canon Anelva Corp
Priority to JP09964895A priority Critical patent/JP3732250B2/ja
Priority to TW084113505A priority patent/TW311105B/zh
Priority to US08/606,038 priority patent/US5846328A/en
Priority to KR1019960008513A priority patent/KR100221259B1/ko
Publication of JPH08274142A publication Critical patent/JPH08274142A/ja
Priority to US08/957,767 priority patent/US6027618A/en
Application granted granted Critical
Publication of JP3732250B2 publication Critical patent/JP3732250B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568Transferring the substrates through a series of coating stations
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/137Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/139Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Tunnel Furnaces (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP09964895A 1995-03-30 1995-03-30 インライン式成膜装置 Expired - Lifetime JP3732250B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP09964895A JP3732250B2 (ja) 1995-03-30 1995-03-30 インライン式成膜装置
TW084113505A TW311105B (enExample) 1995-03-30 1995-12-18
US08/606,038 US5846328A (en) 1995-03-30 1996-02-22 In-line film deposition system
KR1019960008513A KR100221259B1 (ko) 1995-03-30 1996-03-27 인라인식 성막장치
US08/957,767 US6027618A (en) 1995-03-30 1997-10-24 Compact in-line film deposition system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP09964895A JP3732250B2 (ja) 1995-03-30 1995-03-30 インライン式成膜装置

Publications (2)

Publication Number Publication Date
JPH08274142A JPH08274142A (ja) 1996-10-18
JP3732250B2 true JP3732250B2 (ja) 2006-01-05

Family

ID=14252882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP09964895A Expired - Lifetime JP3732250B2 (ja) 1995-03-30 1995-03-30 インライン式成膜装置

Country Status (4)

Country Link
US (2) US5846328A (enExample)
JP (1) JP3732250B2 (enExample)
KR (1) KR100221259B1 (enExample)
TW (1) TW311105B (enExample)

Families Citing this family (122)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5779799A (en) * 1996-06-21 1998-07-14 Micron Technology, Inc. Substrate coating apparatus
US6280134B1 (en) 1997-06-17 2001-08-28 Applied Materials, Inc. Apparatus and method for automated cassette handling
US6053687A (en) 1997-09-05 2000-04-25 Applied Materials, Inc. Cost effective modular-linear wafer processing
JP4059549B2 (ja) * 1997-09-20 2008-03-12 キヤノンアネルバ株式会社 基板支持装置
US6235634B1 (en) 1997-10-08 2001-05-22 Applied Komatsu Technology, Inc. Modular substrate processing system
DE19753656C1 (de) * 1997-12-03 1998-12-03 Fraunhofer Ges Forschung Einrichtung zur Vakuumbeschichtung von Gleitlagern
US6095160A (en) * 1998-04-06 2000-08-01 Chu; Xi In-situ magnetron assisted DC plasma etching apparatus and method for cleaning magnetic recording disks
US6215897B1 (en) 1998-05-20 2001-04-10 Applied Komatsu Technology, Inc. Automated substrate processing system
US6213704B1 (en) 1998-05-20 2001-04-10 Applied Komatsu Technology, Inc. Method and apparatus for substrate transfer and processing
US6517303B1 (en) 1998-05-20 2003-02-11 Applied Komatsu Technology, Inc. Substrate transfer shuttle
US6206176B1 (en) * 1998-05-20 2001-03-27 Applied Komatsu Technology, Inc. Substrate transfer shuttle having a magnetic drive
US6203619B1 (en) * 1998-10-26 2001-03-20 Symetrix Corporation Multiple station apparatus for liquid source fabrication of thin films
TW442891B (en) * 1998-11-17 2001-06-23 Tokyo Electron Ltd Vacuum processing system
TW552306B (en) * 1999-03-26 2003-09-11 Anelva Corp Method of removing accumulated films from the surfaces of substrate holders in film deposition apparatus, and film deposition apparatus
JP4550959B2 (ja) * 1999-11-24 2010-09-22 キヤノンアネルバ株式会社 薄膜作成装置
WO2001004379A1 (de) * 1999-07-13 2001-01-18 Unaxis Balzers Aktiengesellschaft Anlage und verfahren zur vakuumbehandlung bzw. zur pulverherstellung
JP2001043530A (ja) 1999-07-28 2001-02-16 Anelva Corp 情報記録ディスク用保護膜作成方法及び情報記録ディスク用薄膜作成装置
US6298685B1 (en) 1999-11-03 2001-10-09 Applied Materials, Inc. Consecutive deposition system
JP4526151B2 (ja) * 2000-01-28 2010-08-18 キヤノンアネルバ株式会社 基板処理装置の基板移載装置
JP4268303B2 (ja) * 2000-02-01 2009-05-27 キヤノンアネルバ株式会社 インライン型基板処理装置
US6919001B2 (en) 2000-05-01 2005-07-19 Intevac, Inc. Disk coating system
JP4516199B2 (ja) 2000-09-13 2010-08-04 キヤノンアネルバ株式会社 スパッタ装置及び電子デバイス製造方法
DE10054045B4 (de) * 2000-10-31 2004-12-30 Asys Gmbh & Co. Kg Arbeitstisch mit einer Tischplatte
JP4614529B2 (ja) * 2000-12-07 2011-01-19 キヤノンアネルバ株式会社 インライン式基板処理装置
JP2002203885A (ja) * 2000-12-27 2002-07-19 Anelva Corp インターバック型基板処理装置
JP4856308B2 (ja) * 2000-12-27 2012-01-18 キヤノンアネルバ株式会社 基板処理装置及び経由チャンバー
DE10103111A1 (de) * 2001-01-24 2002-08-01 Mattson Wet Products Gmbh Vorrichtung zum Behandeln von Substraten
JP2002260218A (ja) * 2001-03-05 2002-09-13 Anelva Corp 磁気記録ディスク、磁気記録ディスク製造方法及び磁気記録ディスク製造装置
JP2002309372A (ja) * 2001-04-13 2002-10-23 Canon Inc インライン式成膜装置、成膜方法及び液晶素子
US6626997B2 (en) 2001-05-17 2003-09-30 Nathan P. Shapiro Continuous processing chamber
US6808741B1 (en) * 2001-10-26 2004-10-26 Seagate Technology Llc In-line, pass-by method for vapor lubrication
JP2003141719A (ja) 2001-10-30 2003-05-16 Anelva Corp スパッタリング装置及び薄膜形成方法
DE10205168A1 (de) * 2002-02-07 2003-08-21 Ardenne Anlagentech Gmbh Verfahren zur Zwischenbehandlung von Substraten in einer In-Line-Vakuumbeschichtungsanlage
DE10205167C5 (de) * 2002-02-07 2007-01-18 Von Ardenne Anlagentechnik Gmbh In-Line-Vakuumbeschichtungsanlage zur Zwischenbehandlung von Substraten
US6838678B1 (en) 2002-04-10 2005-01-04 Seagate Technology Llc Apparatus for inline continuous and uniform ultraviolet irradiation of recording media
AU2003234484A1 (en) * 2002-05-06 2003-11-11 Guardian Industries Corp. Sputter coating apparatus including ion beam source(s), and corresponding method
WO2004010476A2 (en) * 2002-07-22 2004-01-29 Brooks Automation, Inc. Substrate processing apparatus
US7959395B2 (en) * 2002-07-22 2011-06-14 Brooks Automation, Inc. Substrate processing apparatus
US7988398B2 (en) 2002-07-22 2011-08-02 Brooks Automation, Inc. Linear substrate transport apparatus
US8960099B2 (en) * 2002-07-22 2015-02-24 Brooks Automation, Inc Substrate processing apparatus
JP4447279B2 (ja) 2003-10-15 2010-04-07 キヤノンアネルバ株式会社 成膜装置
WO2005055314A1 (ja) * 2003-12-01 2005-06-16 Hitachi Kokusai Electric Inc. 基板処理装置
US8007477B2 (en) * 2004-03-22 2011-08-30 Applied Medical Resources Corporation Surgical access port and method of using same
JP2008512810A (ja) * 2004-09-10 2008-04-24 オー・ツェー・エリコン・バルザース・アクチェンゲゼルシャフト 基板プロセスシステム
JP2006147130A (ja) * 2004-10-21 2006-06-08 Showa Denko Kk 垂直磁気記録媒体の製造方法及び垂直磁気記録媒体
TWI257959B (en) * 2005-01-20 2006-07-11 Uvat Technology Co Ltd Continuous vacuum film deposition machine with built-in electrostatic dust removal mechanism
EP1698715A1 (de) * 2005-03-03 2006-09-06 Applied Films GmbH & Co. KG Anlage zum Beschichten eines Substrats und Einschubelement
JP2006241567A (ja) * 2005-03-07 2006-09-14 Showa Shinku:Kk 基板搬送機構を備える連続式成膜装置および方法
US8591710B2 (en) * 2005-06-02 2013-11-26 Seagate Tchnology LLC Method and apparatus for formation of oriented magnetic films for magnetic recording media
JP4580860B2 (ja) * 2005-11-02 2010-11-17 大日本印刷株式会社 成膜装置
KR101213849B1 (ko) * 2005-12-16 2012-12-18 엘지디스플레이 주식회사 스퍼터링 장치
SE0601150L (sv) * 2006-05-24 2007-07-03 Goeran Fajerson Metod för tillverkning av fotovoltaiska celler och moduler från kiselskivor
US20080213071A1 (en) * 2007-02-09 2008-09-04 Applied Materials, Inc. Transport device in an installation for the treatment of substrates
ATE555496T1 (de) * 2007-03-13 2012-05-15 Applied Materials Inc Vorrichtung zum bewegen eines carriers in einer vakuumkammer
US8740205B2 (en) 2007-04-16 2014-06-03 Ulvac, Inc. Conveyor and deposition apparatus, and maintenance method thereof
KR100887161B1 (ko) * 2007-08-03 2009-03-09 주식회사 에이디피엔지니어링 플라즈마 처리장치
TWI421360B (zh) * 2007-12-06 2014-01-01 Intevac Inc 雙面濺射蝕刻基板之系統與方法(一)
US20090165714A1 (en) * 2008-01-01 2009-07-02 Dongguan Anwell Digital Machinery Ltd. Method and system for processing substrates in chambers
WO2009107740A1 (ja) * 2008-02-27 2009-09-03 昭和電工株式会社 磁気記録媒体の製造装置および製造方法
US8208238B1 (en) 2008-03-21 2012-06-26 Seagate Technology, Llc Apparatus for orienting soft-underlayer deposition
JP2009277275A (ja) * 2008-05-13 2009-11-26 Showa Denko Kk 磁気記録媒体の製造方法および製造装置
US20090304907A1 (en) * 2008-06-09 2009-12-10 Applied Materials, Inc. Coating system and method for coating a substrate
US8795466B2 (en) * 2008-06-14 2014-08-05 Intevac, Inc. System and method for processing substrates with detachable mask
JP5150387B2 (ja) * 2008-06-27 2013-02-20 昭和電工株式会社 インライン式成膜装置及び磁気記録媒体の製造方法
US20090324368A1 (en) * 2008-06-27 2009-12-31 Applied Materials, Inc. Processing system and method of operating a processing system
EP2141739A3 (en) * 2008-06-30 2011-01-12 Intevac, Inc. System and method for substrate transport
JP2010020841A (ja) * 2008-07-10 2010-01-28 Showa Denko Kk インライン式成膜装置及び磁気記録媒体の製造方法
US9157145B2 (en) * 2008-07-29 2015-10-13 Intevac, Inc. Processing tool with combined sputter and evaporation deposition sources
WO2010013765A1 (ja) * 2008-07-31 2010-02-04 キヤノンアネルバ株式会社 磁気記録媒体の製造方法及び磁気記録媒体
JP5262406B2 (ja) * 2008-08-05 2013-08-14 凸版印刷株式会社 スパッタリング装置及びそのメンテナンス方法
JP2010077508A (ja) * 2008-09-26 2010-04-08 Tokyo Electron Ltd 成膜装置及び基板処理装置
JP2010113771A (ja) * 2008-11-07 2010-05-20 Showa Denko Kk 磁気記録媒体の製造方法及び製造装置
DE102008064183B4 (de) * 2008-12-22 2013-09-05 Fhr Anlagenbau Gmbh In-Line-Vakuumbeschichtungsanlage
JP2010192056A (ja) * 2009-02-19 2010-09-02 Showa Denko Kk インライン式成膜装置及び磁気記録媒体の製造方法
JP2010270367A (ja) * 2009-05-21 2010-12-02 Showa Denko Kk インライン式成膜装置及び磁気記録媒体の製造方法
US8101054B2 (en) * 2009-05-28 2012-01-24 Wd Media, Inc. Magnetic particle trapper for a disk sputtering system
JP5364455B2 (ja) * 2009-06-08 2013-12-11 昭和電工株式会社 マグネトロンスパッタ装置及びインライン式成膜装置
JP5042277B2 (ja) * 2009-06-16 2012-10-03 キヤノンアネルバ株式会社 基板処理装置及び搬送方法、並びに真空処理方法
JP2011047515A (ja) * 2009-07-28 2011-03-10 Canon Anelva Corp 駆動装置及び真空処理装置
US8602706B2 (en) * 2009-08-17 2013-12-10 Brooks Automation, Inc. Substrate processing apparatus
CN102598130A (zh) * 2009-08-26 2012-07-18 威科仪器股份有限公司 用于在磁记录介质上制作图案的系统
JP5657948B2 (ja) * 2009-09-02 2015-01-21 キヤノンアネルバ株式会社 真空処理装置及び基板移載方法
JP5566669B2 (ja) 2009-11-19 2014-08-06 昭和電工株式会社 インライン式成膜装置及び磁気記録媒体の製造方法
JP5539019B2 (ja) 2010-05-19 2014-07-02 キヤノンアネルバ株式会社 基板支持装置及び真空処理装置
CN103155133A (zh) * 2010-08-06 2013-06-12 东京毅力科创株式会社 基板处理系统、搬送模块、基板处理方法和半导体元件的制造方法
DE102011114852A1 (de) 2010-10-06 2012-05-03 Von Ardenne Anlagentechnik Gmbh Einschleusvorrichtung für eine Vakuumanlage
KR101806916B1 (ko) * 2011-03-17 2017-12-12 한화테크윈 주식회사 그래핀 필름 제조 장치 및 그래핀 필름 제조 방법
JP5247847B2 (ja) * 2011-03-29 2013-07-24 キヤノンアネルバ株式会社 成膜装置及び成膜装置用ストックチャンバー
JP5832372B2 (ja) * 2011-05-16 2015-12-16 キヤノンアネルバ株式会社 真空処理装置
JP5450562B2 (ja) * 2011-10-20 2014-03-26 株式会社日本製鋼所 薄膜を有する成形品の製造方法および製造装置
WO2013101851A1 (en) * 2011-12-27 2013-07-04 Intevac, Inc. System architecture for combined static and pass-by processing
EP2650135A1 (en) 2012-04-12 2013-10-16 KBA-NotaSys SA Intaglio printing plate coating apparatus
EP2839052A4 (en) 2012-04-19 2015-06-10 Intevac Inc Dual-mask arrangement for solar cell fabrication
EP2852469B1 (en) * 2012-04-26 2019-04-24 Intevac, Inc. System architecture for vacuum processing
US10062600B2 (en) 2012-04-26 2018-08-28 Intevac, Inc. System and method for bi-facial processing of substrates
WO2014054587A1 (ja) * 2012-10-01 2014-04-10 日産自動車株式会社 インライン式コーティング装置、インライン式コーティング方法、およびセパレータ
JP2014075166A (ja) 2012-10-04 2014-04-24 Showa Denko Kk 磁気記録媒体の製造方法及び装置
JP6118114B2 (ja) * 2013-01-15 2017-04-19 昭和電工株式会社 磁気記録媒体の製造方法及び装置
JP2014146401A (ja) 2013-01-29 2014-08-14 Showa Denko Kk 磁気記録媒体の製造方法及び装置
JP2014146400A (ja) 2013-01-29 2014-08-14 Showa Denko Kk 磁気記録媒体の製造方法
JP6118130B2 (ja) 2013-02-25 2017-04-19 昭和電工株式会社 磁気記録媒体の製造方法及び装置
JP6161149B2 (ja) * 2013-03-12 2017-07-12 スタンレー電気株式会社 金属被覆部材の製造方法およびその真空製造装置
JP6175265B2 (ja) 2013-04-02 2017-08-02 昭和電工株式会社 磁気記録媒体の製造方法
JP6056079B2 (ja) * 2013-05-01 2017-01-11 アキム株式会社 熱処理装置
DE102013105116A1 (de) * 2013-05-17 2014-12-04 Von Ardenne Gmbh Vakuumbeschichtungsanlage und Verfahren zum Betreiben einer Vakuumbeschichtungsanlage
JP6303167B2 (ja) 2013-11-07 2018-04-04 昭和電工株式会社 インライン式成膜装置及びそれを用いた磁気記録媒体の製造方法
MY181905A (en) * 2014-02-20 2021-01-13 Intevac Inc System and method for bi-facial processing of substrates
JP6055575B2 (ja) 2014-03-04 2016-12-27 キヤノンアネルバ株式会社 真空処理装置及び真空処理方法
JP6126302B2 (ja) 2014-03-18 2017-05-10 キヤノンアネルバ株式会社 成膜装置
JP6607923B2 (ja) 2014-08-05 2019-11-20 インテヴァック インコーポレイテッド 注入マスク及びアライメント
KR102156989B1 (ko) 2015-06-24 2020-09-16 캐논 아네르바 가부시키가이샤 진공 아크 성막 장치 및 성막 방법
US20190116294A1 (en) * 2016-10-18 2019-04-18 Interdigital Vc Holdings, Inc. Method for detection of saturated pixels in an image
KR20180118593A (ko) * 2017-03-17 2018-10-31 어플라이드 머티어리얼스, 인코포레이티드 프로세싱 시스템에서 캐리어를 라우팅하기 위한 장치, 캐리어 상의 기판을 프로세싱하기 위한 시스템, 및 진공 챔버에서 캐리어를 라우팅하는 방법
US11339464B2 (en) 2017-03-31 2022-05-24 Agm Container Controls, Inc. Plasma nitriding with PECVD coatings using hollow cathode ion immersion technology
CN110612363B (zh) 2017-03-31 2021-12-21 Agm集装箱控制公司 用于涂覆表面的系统及方法
WO2018210408A1 (en) * 2017-05-16 2018-11-22 Applied Materials, Inc. Apparatus for processing a substrate, processing system and method therefor
JP6379318B1 (ja) * 2017-06-14 2018-08-22 株式会社アルバック 成膜装置及び成膜方法並びに太陽電池の製造方法
KR101870579B1 (ko) * 2017-07-27 2018-06-22 캐논 톡키 가부시키가이샤 디스플레이 제조장치 및 이를 사용한 디스플레이 제조방법
KR102444086B1 (ko) * 2018-06-28 2022-09-16 어플라이드 머티어리얼스, 인코포레이티드 스윙 장치, 기판을 프로세싱하기 위한 방법, 이송 챔버로부터 기판을 수용하기 위한 스윙 모듈, 및 진공 프로세싱 시스템
CN109797373A (zh) * 2019-03-04 2019-05-24 苏州华杨赛斯真空设备有限公司 卫星式真空薄膜沉积系统
CN112458425B (zh) * 2020-10-30 2022-06-28 湘潭宏大真空技术股份有限公司 应用于狭窄空间的三室镀膜机
EP4285403B1 (de) * 2021-01-29 2025-08-06 PINK GmbH Thermosysteme Anlage und verfahren zum verbinden von elektronischen baugruppen

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2730987A (en) * 1954-03-25 1956-01-17 James L Entwistle Company Apparatus for automatically vacuum coating of interior of glass tubes with metal
DE2844491C2 (de) * 1978-10-12 1983-04-14 Leybold-Heraeus GmbH, 5000 Köln Vakuum-Beschichtungsanlage mit einer Einrichtung zum kontinuierlichen Substrattransport
DE2900724C2 (de) * 1979-01-10 1986-05-28 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zur Beschichtung von Substraten im Vakuum
JPH067547B2 (ja) * 1983-06-09 1994-01-26 富士通株式会社 気相成長装置
US4500407A (en) * 1983-07-19 1985-02-19 Varian Associates, Inc. Disk or wafer handling and coating system
JPS61105853A (ja) * 1984-10-30 1986-05-23 Anelva Corp オ−トロ−ダ−
JPS61106768A (ja) * 1984-10-31 1986-05-24 Anelva Corp 基体処理装置
JPS61170568A (ja) * 1985-01-24 1986-08-01 Mitsubishi Heavy Ind Ltd 連続真空処理装置
JPS6220347A (ja) * 1985-07-19 1987-01-28 Hitachi Ltd 処理装置
JPS62230977A (ja) * 1986-04-01 1987-10-09 Seiko Epson Corp 薄膜製造装置
US4722298A (en) * 1986-05-19 1988-02-02 Machine Technology, Inc. Modular processing apparatus for processing semiconductor wafers
JPS63157870A (ja) * 1986-12-19 1988-06-30 Anelva Corp 基板処理装置
JPS63161636A (ja) * 1986-12-25 1988-07-05 Toshiba Corp プラズマ気相成長システム
US4795299A (en) * 1987-04-15 1989-01-03 Genus, Inc. Dial deposition and processing apparatus
JPS63303062A (ja) * 1987-06-02 1988-12-09 Nec Corp 半導体集積回路の製造装置
JPH01230250A (ja) * 1988-03-09 1989-09-13 Mitsubishi Electric Corp Cvd装置
US5024570A (en) * 1988-09-14 1991-06-18 Fujitsu Limited Continuous semiconductor substrate processing system
JP2627651B2 (ja) * 1988-10-17 1997-07-09 アネルバ株式会社 マグネトロンスパッタリング装置
US5076205A (en) * 1989-01-06 1991-12-31 General Signal Corporation Modular vapor processor system
JPH0382121A (ja) * 1989-08-25 1991-04-08 Nec Corp ドライエッチングの後処理方法
JP2948842B2 (ja) * 1989-11-24 1999-09-13 日本真空技術株式会社 インライン型cvd装置
US4981408A (en) * 1989-12-18 1991-01-01 Varian Associates, Inc. Dual track handling and processing system
US5379212A (en) * 1990-01-29 1995-01-03 United States Voting Machines, Inc. Locking memory device
JPH03274746A (ja) * 1990-03-24 1991-12-05 Sony Corp マルチチャンバ装置
JPH04115513A (ja) * 1990-09-05 1992-04-16 Hitachi Ltd 半導体製造ラインの構成方法
JPH04275449A (ja) * 1991-03-04 1992-10-01 Mitsubishi Heavy Ind Ltd 磁気搬送装置
JPH04271139A (ja) * 1991-02-27 1992-09-28 Fuji Electric Co Ltd 半導体製造装置
DE4123274C2 (de) * 1991-07-13 1996-12-19 Leybold Ag Vorrichtung zum Beschichten von Bauteilen bzw. Formteilen durch Kathodenzerstäubung
US5376212A (en) * 1992-02-18 1994-12-27 Tokyo Electron Yamanashi Limited Reduced-pressure processing apparatus
US5482607A (en) * 1992-09-21 1996-01-09 Nissin Electric Co., Ltd. Film forming apparatus
US5377816A (en) * 1993-07-15 1995-01-03 Materials Research Corp. Spiral magnetic linear translating mechanism
TW295677B (enExample) * 1994-08-19 1997-01-11 Tokyo Electron Co Ltd
US5651868A (en) * 1994-10-26 1997-07-29 International Business Machines Corporation Method and apparatus for coating thin film data storage disks

Also Published As

Publication number Publication date
KR100221259B1 (ko) 1999-09-15
JPH08274142A (ja) 1996-10-18
TW311105B (enExample) 1997-07-21
US6027618A (en) 2000-02-22
US5846328A (en) 1998-12-08
KR960035782A (ko) 1996-10-28

Similar Documents

Publication Publication Date Title
JP3732250B2 (ja) インライン式成膜装置
US5738767A (en) Substrate handling and processing system for flat panel displays
US6139695A (en) Modular deposition system having batch processing and serial thin film deposition
US4356073A (en) Magnetron cathode sputtering apparatus
US6231732B1 (en) Cylindrical carriage sputtering system
TW495827B (en) A cylindrical carriage sputtering system
KR100367340B1 (ko) 성막장치에 있어서의 기판유지구의 표면의 퇴적막의제거방법 및 성막장치 그리고 박막작성장치
KR102659918B1 (ko) 성막 장치 및 전자 디바이스의 제조 방법
JPH10238U (ja) ウエハ処理工程ラインのための輸送装置
CN101027423B (zh) 成膜装置
JP4614529B2 (ja) インライン式基板処理装置
JP4005172B2 (ja) 両面同時成膜方法および装置
JPH11302841A (ja) スパッタ装置
TWI454587B (zh) 濺鍍裝置
KR101780945B1 (ko) 인라인 스퍼터링 시스템
TWI766741B (zh) 開合式遮蔽構件及具有開合式遮蔽構件的薄膜沉積機台
JP3753896B2 (ja) マグネトロンスパッタ装置
CN216237258U (zh) 开合式遮蔽构件及具有开合式遮蔽构件的薄膜沉积装置
JP2010163639A (ja) スパッタリング装置及びそれを用いた磁気記録媒体の製造方法
JP2003183825A (ja) 多層膜作成装置、垂直磁気記録媒体製造方法及び垂直磁気記録媒体製造装置
KR19990045208A (ko) 기판 캐리어에서 자성체 지지물을 사용하는 기판지지 장치 및방법
KR102661883B1 (ko) 성막 장치 및 전자 디바이스의 제조 방법
JPH0826455B2 (ja) スパツタリング装置
JPH05331642A (ja) マルチチャンバ式スパッタリング装置
TWI771083B (zh) 具有對開式遮蔽構件的薄膜沉積設備

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 19950920

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20010925

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20030918

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20040210

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040412

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20050111

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050314

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050314

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20051004

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20051012

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081021

Year of fee payment: 3

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081021

Year of fee payment: 3

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091021

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101021

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111021

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121021

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131021

Year of fee payment: 8

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term