KR100221259B1 - 인라인식 성막장치 - Google Patents

인라인식 성막장치 Download PDF

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Publication number
KR100221259B1
KR100221259B1 KR1019960008513A KR19960008513A KR100221259B1 KR 100221259 B1 KR100221259 B1 KR 100221259B1 KR 1019960008513 A KR1019960008513 A KR 1019960008513A KR 19960008513 A KR19960008513 A KR 19960008513A KR 100221259 B1 KR100221259 B1 KR 100221259B1
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KR
South Korea
Prior art keywords
substrate
carrier
vacuum chamber
film forming
forming apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019960008513A
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English (en)
Korean (ko)
Other versions
KR960035782A (ko
Inventor
요시키 아루가
요 가미쿠라
Original Assignee
니시히라 순지
아네르바 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 니시히라 순지, 아네르바 가부시기가이샤 filed Critical 니시히라 순지
Publication of KR960035782A publication Critical patent/KR960035782A/ko
Application granted granted Critical
Publication of KR100221259B1 publication Critical patent/KR100221259B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Tunnel Furnaces (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
KR1019960008513A 1995-03-30 1996-03-27 인라인식 성막장치 Expired - Lifetime KR100221259B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP09964895A JP3732250B2 (ja) 1995-03-30 1995-03-30 インライン式成膜装置
JP95-99648 1995-03-30

Publications (2)

Publication Number Publication Date
KR960035782A KR960035782A (ko) 1996-10-28
KR100221259B1 true KR100221259B1 (ko) 1999-09-15

Family

ID=14252882

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960008513A Expired - Lifetime KR100221259B1 (ko) 1995-03-30 1996-03-27 인라인식 성막장치

Country Status (4)

Country Link
US (2) US5846328A (enExample)
JP (1) JP3732250B2 (enExample)
KR (1) KR100221259B1 (enExample)
TW (1) TW311105B (enExample)

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CN109797373A (zh) * 2019-03-04 2019-05-24 苏州华杨赛斯真空设备有限公司 卫星式真空薄膜沉积系统
CN112458425B (zh) * 2020-10-30 2022-06-28 湘潭宏大真空技术股份有限公司 应用于狭窄空间的三室镀膜机
EP4285403B1 (de) * 2021-01-29 2025-08-06 PINK GmbH Thermosysteme Anlage und verfahren zum verbinden von elektronischen baugruppen

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US6027618A (en) 2000-02-22
US5846328A (en) 1998-12-08
KR960035782A (ko) 1996-10-28

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