JP2011091381A - 半導体素子、半導体素子の作製方法 - Google Patents
半導体素子、半導体素子の作製方法 Download PDFInfo
- Publication number
- JP2011091381A JP2011091381A JP2010209431A JP2010209431A JP2011091381A JP 2011091381 A JP2011091381 A JP 2011091381A JP 2010209431 A JP2010209431 A JP 2010209431A JP 2010209431 A JP2010209431 A JP 2010209431A JP 2011091381 A JP2011091381 A JP 2011091381A
- Authority
- JP
- Japan
- Prior art keywords
- oxide semiconductor
- semiconductor layer
- oxide
- substrate
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
- H10D30/6739—Conductor-insulator-semiconductor electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3434—Deposited materials, e.g. layers characterised by the chemical composition being oxide semiconductor materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6329—Deposition from the gas or vapour phase using physical ablation of a target, e.g. physical vapour deposition or pulsed laser deposition
Landscapes
- Thin Film Transistor (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Liquid Crystal (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010209431A JP2011091381A (ja) | 2009-09-24 | 2010-09-17 | 半導体素子、半導体素子の作製方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009219558 | 2009-09-24 | ||
| JP2010209431A JP2011091381A (ja) | 2009-09-24 | 2010-09-17 | 半導体素子、半導体素子の作製方法 |
Related Child Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012169477A Division JP5116898B2 (ja) | 2009-09-24 | 2012-07-31 | 半導体素子の作製方法 |
| JP2013000557A Division JP5216946B2 (ja) | 2009-09-24 | 2013-01-07 | 半導体素子の作製方法 |
| JP2013183616A Division JP2014033208A (ja) | 2009-09-24 | 2013-09-05 | 半導体素子の作製方法 |
| JP2015041958A Division JP6114769B2 (ja) | 2009-09-24 | 2015-03-04 | 半導体素子の作製方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011091381A true JP2011091381A (ja) | 2011-05-06 |
| JP2011091381A5 JP2011091381A5 (https=) | 2013-10-17 |
Family
ID=43755841
Family Applications (17)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010209431A Withdrawn JP2011091381A (ja) | 2009-09-24 | 2010-09-17 | 半導体素子、半導体素子の作製方法 |
| JP2012169477A Active JP5116898B2 (ja) | 2009-09-24 | 2012-07-31 | 半導体素子の作製方法 |
| JP2013000557A Active JP5216946B2 (ja) | 2009-09-24 | 2013-01-07 | 半導体素子の作製方法 |
| JP2013183616A Withdrawn JP2014033208A (ja) | 2009-09-24 | 2013-09-05 | 半導体素子の作製方法 |
| JP2015041958A Active JP6114769B2 (ja) | 2009-09-24 | 2015-03-04 | 半導体素子の作製方法 |
| JP2017052114A Active JP6385491B2 (ja) | 2009-09-24 | 2017-03-17 | 半導体素子の作製方法 |
| JP2018148183A Active JP6568273B2 (ja) | 2009-09-24 | 2018-08-07 | 半導体素子の作製方法 |
| JP2019142123A Active JP6595144B1 (ja) | 2009-09-24 | 2019-08-01 | 半導体装置の作製方法 |
| JP2019173779A Active JP6620263B1 (ja) | 2009-09-24 | 2019-09-25 | 半導体装置 |
| JP2019207687A Withdrawn JP2020074398A (ja) | 2009-09-24 | 2019-11-18 | 半導体装置 |
| JP2019213967A Active JP6722812B2 (ja) | 2009-09-24 | 2019-11-27 | 半導体装置 |
| JP2020203863A Active JP6990289B2 (ja) | 2009-09-24 | 2020-12-09 | 表示装置 |
| JP2021143035A Withdrawn JP2021192451A (ja) | 2009-09-24 | 2021-09-02 | 半導体装置 |
| JP2021196736A Withdrawn JP2022033140A (ja) | 2009-09-24 | 2021-12-03 | 液晶ディスプレイ、及び、エレクトロルミネセンスディスプレイ |
| JP2023081399A Active JP7507285B2 (ja) | 2009-09-24 | 2023-05-17 | 液晶ディスプレイ及びエレクトロルミネセンスディスプレイ |
| JP2024097536A Active JP7645421B2 (ja) | 2009-09-24 | 2024-06-17 | 液晶ディスプレイ及びエレクトロルミネセンスディスプレイ |
| JP2025032632A Withdrawn JP2025074221A (ja) | 2009-09-24 | 2025-03-03 | 液晶ディスプレイ及びエレクトロルミネセンスディスプレイ |
Family Applications After (16)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012169477A Active JP5116898B2 (ja) | 2009-09-24 | 2012-07-31 | 半導体素子の作製方法 |
| JP2013000557A Active JP5216946B2 (ja) | 2009-09-24 | 2013-01-07 | 半導体素子の作製方法 |
| JP2013183616A Withdrawn JP2014033208A (ja) | 2009-09-24 | 2013-09-05 | 半導体素子の作製方法 |
| JP2015041958A Active JP6114769B2 (ja) | 2009-09-24 | 2015-03-04 | 半導体素子の作製方法 |
| JP2017052114A Active JP6385491B2 (ja) | 2009-09-24 | 2017-03-17 | 半導体素子の作製方法 |
| JP2018148183A Active JP6568273B2 (ja) | 2009-09-24 | 2018-08-07 | 半導体素子の作製方法 |
| JP2019142123A Active JP6595144B1 (ja) | 2009-09-24 | 2019-08-01 | 半導体装置の作製方法 |
| JP2019173779A Active JP6620263B1 (ja) | 2009-09-24 | 2019-09-25 | 半導体装置 |
| JP2019207687A Withdrawn JP2020074398A (ja) | 2009-09-24 | 2019-11-18 | 半導体装置 |
| JP2019213967A Active JP6722812B2 (ja) | 2009-09-24 | 2019-11-27 | 半導体装置 |
| JP2020203863A Active JP6990289B2 (ja) | 2009-09-24 | 2020-12-09 | 表示装置 |
| JP2021143035A Withdrawn JP2021192451A (ja) | 2009-09-24 | 2021-09-02 | 半導体装置 |
| JP2021196736A Withdrawn JP2022033140A (ja) | 2009-09-24 | 2021-12-03 | 液晶ディスプレイ、及び、エレクトロルミネセンスディスプレイ |
| JP2023081399A Active JP7507285B2 (ja) | 2009-09-24 | 2023-05-17 | 液晶ディスプレイ及びエレクトロルミネセンスディスプレイ |
| JP2024097536A Active JP7645421B2 (ja) | 2009-09-24 | 2024-06-17 | 液晶ディスプレイ及びエレクトロルミネセンスディスプレイ |
| JP2025032632A Withdrawn JP2025074221A (ja) | 2009-09-24 | 2025-03-03 | 液晶ディスプレイ及びエレクトロルミネセンスディスプレイ |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9171938B2 (https=) |
| JP (17) | JP2011091381A (https=) |
| KR (3) | KR101809759B1 (https=) |
| CN (2) | CN104934483B (https=) |
| TW (2) | TWI636508B (https=) |
| WO (1) | WO2011037010A1 (https=) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012253331A (ja) * | 2011-05-11 | 2012-12-20 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| JP2014057051A (ja) * | 2012-08-10 | 2014-03-27 | Semiconductor Energy Lab Co Ltd | 半導体装置及び半導体装置の作製方法 |
| JP2014057049A (ja) * | 2012-08-10 | 2014-03-27 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
| KR20140066222A (ko) * | 2011-09-29 | 2014-05-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| WO2014192210A1 (ja) * | 2013-05-29 | 2014-12-04 | パナソニック株式会社 | 薄膜トランジスタ装置とその製造方法、および表示装置 |
| WO2014208520A1 (ja) * | 2013-06-28 | 2014-12-31 | 株式会社神戸製鋼所 | 薄膜トランジスタおよびその製造方法 |
| JP2016154365A (ja) * | 2011-05-19 | 2016-08-25 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2016158269A (ja) * | 2011-05-20 | 2016-09-01 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2017028324A (ja) * | 2012-05-01 | 2017-02-02 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US9570622B2 (en) | 2013-09-05 | 2017-02-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP2020038990A (ja) * | 2011-09-29 | 2020-03-12 | 株式会社半導体エネルギー研究所 | トランジスタ |
| JP2021044587A (ja) * | 2011-10-14 | 2021-03-18 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2022024159A (ja) * | 2012-05-10 | 2022-02-08 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2025017415A1 (ja) * | 2023-07-14 | 2025-01-23 | 株式会社半導体エネルギー研究所 | 製造装置、及び酸化物半導体層の作製方法 |
| WO2025258263A1 (ja) * | 2024-06-10 | 2025-12-18 | 株式会社ジャパンディスプレイ | 酸化物半導体膜、積層構造体、薄膜トランジスタ、および電子機器 |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011037008A1 (en) | 2009-09-24 | 2011-03-31 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing oxide semiconductor film and method for manufacturing semiconductor device |
| WO2011043163A1 (en) * | 2009-10-05 | 2011-04-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| WO2011043206A1 (en) * | 2009-10-09 | 2011-04-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR102142450B1 (ko) | 2009-10-30 | 2020-08-10 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작방법 |
| WO2011145484A1 (en) | 2010-05-21 | 2011-11-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8895375B2 (en) | 2010-06-01 | 2014-11-25 | Semiconductor Energy Laboratory Co., Ltd. | Field effect transistor and method for manufacturing the same |
| US8441010B2 (en) | 2010-07-01 | 2013-05-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8519387B2 (en) | 2010-07-26 | 2013-08-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing |
| KR102143469B1 (ko) | 2010-07-27 | 2020-08-11 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| US20120298998A1 (en) | 2011-05-25 | 2012-11-29 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming oxide semiconductor film, semiconductor device, and method for manufacturing semiconductor device |
| US20130037793A1 (en) * | 2011-08-11 | 2013-02-14 | Qualcomm Mems Technologies, Inc. | Amorphous oxide semiconductor thin film transistor fabrication method |
| TWI567985B (zh) | 2011-10-21 | 2017-01-21 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| TWI584383B (zh) * | 2011-12-27 | 2017-05-21 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| US9735280B2 (en) | 2012-03-02 | 2017-08-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, method for manufacturing semiconductor device, and method for forming oxide film |
| WO2013179837A1 (ja) * | 2012-05-28 | 2013-12-05 | シャープ株式会社 | 半導体装置およびその製造方法 |
| KR102141977B1 (ko) | 2012-07-20 | 2020-08-06 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제조 방법 |
| KR102241249B1 (ko) * | 2012-12-25 | 2021-04-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 저항 소자, 표시 장치, 및 전자기기 |
| US9577107B2 (en) | 2013-03-19 | 2017-02-21 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor film and method for forming oxide semiconductor film |
| KR102263827B1 (ko) * | 2014-03-21 | 2021-06-14 | 삼성디스플레이 주식회사 | 산화물 반도체 증착장치 및 이를 이용한 산화물 반도체의 제조 방법 |
| US9633839B2 (en) * | 2015-06-19 | 2017-04-25 | Applied Materials, Inc. | Methods for depositing dielectric films via physical vapor deposition processes |
| US10205008B2 (en) | 2016-08-03 | 2019-02-12 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
| JP7030285B2 (ja) * | 2016-09-14 | 2022-03-07 | 天馬微電子有限公司 | 半導体装置、表示装置、半導体装置の製造方法及び表示装置の製造方法 |
| JP7055285B2 (ja) * | 2016-09-14 | 2022-04-18 | 天馬微電子有限公司 | 半導体装置、表示装置、半導体装置の製造方法及び表示装置の製造方法 |
| US10692994B2 (en) | 2016-12-23 | 2020-06-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP6640759B2 (ja) * | 2017-01-11 | 2020-02-05 | 株式会社アルバック | 真空処理装置 |
| JP2018187189A (ja) * | 2017-05-10 | 2018-11-29 | 株式会社三洋物産 | 遊技機 |
| JP2018187191A (ja) * | 2017-05-10 | 2018-11-29 | 株式会社三洋物産 | 遊技機 |
| CN110616406A (zh) * | 2018-11-29 | 2019-12-27 | 爱发科豪威光电薄膜科技(深圳)有限公司 | 磁控溅射镀膜机 |
| US20210066321A1 (en) * | 2019-09-03 | 2021-03-04 | Electronics And Telecommunications Research Institute | Memory device |
| KR102599124B1 (ko) * | 2019-09-03 | 2023-11-07 | 한국전자통신연구원 | 메모리 소자 |
| CN112981346B (zh) * | 2021-02-08 | 2021-10-19 | 肇庆市科润真空设备有限公司 | 一种多室磁控多层光学镀膜设备及镀膜方法 |
| WO2024065110A1 (zh) * | 2022-09-26 | 2024-04-04 | 京东方科技集团股份有限公司 | 薄膜晶体管及制备方法、显示面板 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004288864A (ja) * | 2003-03-20 | 2004-10-14 | Seiko Epson Corp | 薄膜半導体、薄膜トランジスタの製造方法、電気光学装置及び電子機器 |
| JP2007103918A (ja) * | 2005-09-06 | 2007-04-19 | Canon Inc | アモルファス酸化物膜をチャネル層に用いた電界効果型トランジスタ、アモルファス酸化物膜をチャネル層に用いた電界効果型トランジスタの製造方法及びアモルファス酸化物膜の製造方法 |
| JP2007173489A (ja) * | 2005-12-21 | 2007-07-05 | Idemitsu Kosan Co Ltd | Tft基板及びtft基板の製造方法 |
| JP2008141119A (ja) * | 2006-12-05 | 2008-06-19 | Canon Inc | 酸化物半導体を用いた表示装置及びその製造方法 |
| JP2008281988A (ja) * | 2007-04-09 | 2008-11-20 | Canon Inc | 発光装置とその作製方法 |
| JP2009135436A (ja) * | 2007-11-01 | 2009-06-18 | Semiconductor Energy Lab Co Ltd | 薄膜トランジスタ、及び薄膜トランジスタを有する表示装置 |
| WO2009084537A1 (ja) * | 2007-12-27 | 2009-07-09 | Nippon Mining & Metals Co., Ltd. | a-IGZO酸化物薄膜の製造方法 |
Family Cites Families (144)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60198861A (ja) | 1984-03-23 | 1985-10-08 | Fujitsu Ltd | 薄膜トランジスタ |
| JPH0244256B2 (ja) | 1987-01-28 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn2o5deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPS63210023A (ja) | 1987-02-24 | 1988-08-31 | Natl Inst For Res In Inorg Mater | InGaZn↓4O↓7で示される六方晶系の層状構造を有する化合物およびその製造法 |
| JPH0244258B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn3o6deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244260B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn5o8deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244262B2 (ja) | 1987-02-27 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn6o9deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244263B2 (ja) | 1987-04-22 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn7o10deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| US5210050A (en) * | 1990-10-15 | 1993-05-11 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a semiconductor device comprising a semiconductor film |
| JPH05251705A (ja) | 1992-03-04 | 1993-09-28 | Fuji Xerox Co Ltd | 薄膜トランジスタ |
| JP3479375B2 (ja) | 1995-03-27 | 2003-12-15 | 科学技術振興事業団 | 亜酸化銅等の金属酸化物半導体による薄膜トランジスタとpn接合を形成した金属酸化物半導体装置およびそれらの製造方法 |
| WO1997006554A2 (en) | 1995-08-03 | 1997-02-20 | Philips Electronics N.V. | Semiconductor device provided with transparent switching element |
| JP3625598B2 (ja) | 1995-12-30 | 2005-03-02 | 三星電子株式会社 | 液晶表示装置の製造方法 |
| JP4170454B2 (ja) | 1998-07-24 | 2008-10-22 | Hoya株式会社 | 透明導電性酸化物薄膜を有する物品及びその製造方法 |
| JP2000150861A (ja) | 1998-11-16 | 2000-05-30 | Tdk Corp | 酸化物薄膜 |
| JP3276930B2 (ja) | 1998-11-17 | 2002-04-22 | 科学技術振興事業団 | トランジスタ及び半導体装置 |
| JP2000206508A (ja) * | 1999-01-12 | 2000-07-28 | Advanced Display Inc | 液晶表示装置およびその製造方法 |
| TW460731B (en) | 1999-09-03 | 2001-10-21 | Ind Tech Res Inst | Electrode structure and production method of wide viewing angle LCD |
| JP4089858B2 (ja) | 2000-09-01 | 2008-05-28 | 国立大学法人東北大学 | 半導体デバイス |
| KR20020038482A (ko) | 2000-11-15 | 2002-05-23 | 모리시타 요이찌 | 박막 트랜지스터 어레이, 그 제조방법 및 그것을 이용한표시패널 |
| JP3997731B2 (ja) | 2001-03-19 | 2007-10-24 | 富士ゼロックス株式会社 | 基材上に結晶性半導体薄膜を形成する方法 |
| JP2002289859A (ja) | 2001-03-23 | 2002-10-04 | Minolta Co Ltd | 薄膜トランジスタ |
| JP4090716B2 (ja) | 2001-09-10 | 2008-05-28 | 雅司 川崎 | 薄膜トランジスタおよびマトリクス表示装置 |
| JP3925839B2 (ja) | 2001-09-10 | 2007-06-06 | シャープ株式会社 | 半導体記憶装置およびその試験方法 |
| US7061014B2 (en) | 2001-11-05 | 2006-06-13 | Japan Science And Technology Agency | Natural-superlattice homologous single crystal thin film, method for preparation thereof, and device using said single crystal thin film |
| JP4164562B2 (ja) | 2002-09-11 | 2008-10-15 | 独立行政法人科学技術振興機構 | ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ |
| JP4083486B2 (ja) | 2002-02-21 | 2008-04-30 | 独立行政法人科学技術振興機構 | LnCuO(S,Se,Te)単結晶薄膜の製造方法 |
| US7049190B2 (en) | 2002-03-15 | 2006-05-23 | Sanyo Electric Co., Ltd. | Method for forming ZnO film, method for forming ZnO semiconductor layer, method for fabricating semiconductor device, and semiconductor device |
| JP3933591B2 (ja) | 2002-03-26 | 2007-06-20 | 淳二 城戸 | 有機エレクトロルミネッセント素子 |
| US7339187B2 (en) | 2002-05-21 | 2008-03-04 | State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University | Transistor structures |
| JP2004022625A (ja) | 2002-06-13 | 2004-01-22 | Murata Mfg Co Ltd | 半導体デバイス及び該半導体デバイスの製造方法 |
| US7105868B2 (en) | 2002-06-24 | 2006-09-12 | Cermet, Inc. | High-electron mobility transistor with zinc oxide |
| US7067843B2 (en) | 2002-10-11 | 2006-06-27 | E. I. Du Pont De Nemours And Company | Transparent oxide semiconductor thin film transistors |
| JP4373085B2 (ja) * | 2002-12-27 | 2009-11-25 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法、剥離方法及び転写方法 |
| JP4166105B2 (ja) | 2003-03-06 | 2008-10-15 | シャープ株式会社 | 半導体装置およびその製造方法 |
| JP2004273732A (ja) | 2003-03-07 | 2004-09-30 | Sharp Corp | アクティブマトリクス基板およびその製造方法 |
| JP4108633B2 (ja) | 2003-06-20 | 2008-06-25 | シャープ株式会社 | 薄膜トランジスタおよびその製造方法ならびに電子デバイス |
| US7262463B2 (en) | 2003-07-25 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | Transistor including a deposited channel region having a doped portion |
| US7297977B2 (en) | 2004-03-12 | 2007-11-20 | Hewlett-Packard Development Company, L.P. | Semiconductor device |
| KR20070116888A (ko) | 2004-03-12 | 2007-12-11 | 도꾸리쯔교세이호징 가가꾸 기쥬쯔 신꼬 기꼬 | 아몰퍼스 산화물 및 박막 트랜지스터 |
| US7145174B2 (en) | 2004-03-12 | 2006-12-05 | Hewlett-Packard Development Company, Lp. | Semiconductor device |
| US7282782B2 (en) | 2004-03-12 | 2007-10-16 | Hewlett-Packard Development Company, L.P. | Combined binary oxide semiconductor device |
| US7211825B2 (en) | 2004-06-14 | 2007-05-01 | Yi-Chi Shih | Indium oxide-based thin film transistors and circuits |
| JP2006100760A (ja) | 2004-09-02 | 2006-04-13 | Casio Comput Co Ltd | 薄膜トランジスタおよびその製造方法 |
| US7285501B2 (en) | 2004-09-17 | 2007-10-23 | Hewlett-Packard Development Company, L.P. | Method of forming a solution processed device |
| US7298084B2 (en) | 2004-11-02 | 2007-11-20 | 3M Innovative Properties Company | Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes |
| US7453065B2 (en) | 2004-11-10 | 2008-11-18 | Canon Kabushiki Kaisha | Sensor and image pickup device |
| US7863611B2 (en) | 2004-11-10 | 2011-01-04 | Canon Kabushiki Kaisha | Integrated circuits utilizing amorphous oxides |
| US7829444B2 (en) | 2004-11-10 | 2010-11-09 | Canon Kabushiki Kaisha | Field effect transistor manufacturing method |
| EP2453481B1 (en) | 2004-11-10 | 2017-01-11 | Canon Kabushiki Kaisha | Field effect transistor with amorphous oxide |
| CA2585063C (en) | 2004-11-10 | 2013-01-15 | Canon Kabushiki Kaisha | Light-emitting device |
| BRPI0517560B8 (pt) | 2004-11-10 | 2018-12-11 | Canon Kk | transistor de efeito de campo |
| US7791072B2 (en) | 2004-11-10 | 2010-09-07 | Canon Kabushiki Kaisha | Display |
| US7579224B2 (en) | 2005-01-21 | 2009-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a thin film semiconductor device |
| TWI505473B (zh) | 2005-01-28 | 2015-10-21 | 半導體能源研究所股份有限公司 | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
| US7608531B2 (en) | 2005-01-28 | 2009-10-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, electronic device, and method of manufacturing semiconductor device |
| US7858451B2 (en) | 2005-02-03 | 2010-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device, semiconductor device and manufacturing method thereof |
| US7948171B2 (en) | 2005-02-18 | 2011-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
| US20060197092A1 (en) | 2005-03-03 | 2006-09-07 | Randy Hoffman | System and method for forming conductive material on a substrate |
| US8681077B2 (en) | 2005-03-18 | 2014-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, and display device, driving method and electronic apparatus thereof |
| WO2006105077A2 (en) | 2005-03-28 | 2006-10-05 | Massachusetts Institute Of Technology | Low voltage thin film transistor with high-k dielectric material |
| US7645478B2 (en) | 2005-03-31 | 2010-01-12 | 3M Innovative Properties Company | Methods of making displays |
| US8300031B2 (en) | 2005-04-20 | 2012-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising transistor having gate and drain connected through a current-voltage conversion element |
| JP2006344849A (ja) | 2005-06-10 | 2006-12-21 | Casio Comput Co Ltd | 薄膜トランジスタ |
| US7691666B2 (en) | 2005-06-16 | 2010-04-06 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
| US7402506B2 (en) | 2005-06-16 | 2008-07-22 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
| US7507618B2 (en) | 2005-06-27 | 2009-03-24 | 3M Innovative Properties Company | Method for making electronic devices using metal oxide nanoparticles |
| KR100711890B1 (ko) | 2005-07-28 | 2007-04-25 | 삼성에스디아이 주식회사 | 유기 발광표시장치 및 그의 제조방법 |
| JP2007059128A (ja) | 2005-08-23 | 2007-03-08 | Canon Inc | 有機el表示装置およびその製造方法 |
| JP4958253B2 (ja) | 2005-09-02 | 2012-06-20 | 財団法人高知県産業振興センター | 薄膜トランジスタ |
| JP2007073705A (ja) | 2005-09-06 | 2007-03-22 | Canon Inc | 酸化物半導体チャネル薄膜トランジスタおよびその製造方法 |
| JP5116225B2 (ja) | 2005-09-06 | 2013-01-09 | キヤノン株式会社 | 酸化物半導体デバイスの製造方法 |
| JP4850457B2 (ja) | 2005-09-06 | 2012-01-11 | キヤノン株式会社 | 薄膜トランジスタ及び薄膜ダイオード |
| JP2007073698A (ja) * | 2005-09-06 | 2007-03-22 | Canon Inc | トランジスタ |
| JP4280736B2 (ja) | 2005-09-06 | 2009-06-17 | キヤノン株式会社 | 半導体素子 |
| CN101258607B (zh) * | 2005-09-06 | 2011-01-05 | 佳能株式会社 | 使用非晶氧化物膜作为沟道层的场效应晶体管、使用非晶氧化物膜作为沟道层的场效应晶体管的制造方法、以及非晶氧化物膜的制造方法 |
| JP5078246B2 (ja) | 2005-09-29 | 2012-11-21 | 株式会社半導体エネルギー研究所 | 半導体装置、及び半導体装置の作製方法 |
| EP3614442A3 (en) | 2005-09-29 | 2020-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having oxide semiconductor layer and manufactoring method thereof |
| JP5064747B2 (ja) | 2005-09-29 | 2012-10-31 | 株式会社半導体エネルギー研究所 | 半導体装置、電気泳動表示装置、表示モジュール、電子機器、及び半導体装置の作製方法 |
| EP1933293A4 (en) | 2005-10-05 | 2009-12-23 | Idemitsu Kosan Co | TFT SUBSTRATE AND METHOD FOR MANUFACTURING A TFT SUBSTRATE |
| JP5037808B2 (ja) | 2005-10-20 | 2012-10-03 | キヤノン株式会社 | アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置 |
| JP5224676B2 (ja) | 2005-11-08 | 2013-07-03 | キヤノン株式会社 | 表示装置の製造方法 |
| KR20090115222A (ko) | 2005-11-15 | 2009-11-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 제조방법 |
| JP5089139B2 (ja) * | 2005-11-15 | 2012-12-05 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP5099740B2 (ja) * | 2005-12-19 | 2012-12-19 | 財団法人高知県産業振興センター | 薄膜トランジスタ |
| TWI292281B (en) | 2005-12-29 | 2008-01-01 | Ind Tech Res Inst | Pixel structure of active organic light emitting diode and method of fabricating the same |
| US7867636B2 (en) | 2006-01-11 | 2011-01-11 | Murata Manufacturing Co., Ltd. | Transparent conductive film and method for manufacturing the same |
| JP4977478B2 (ja) | 2006-01-21 | 2012-07-18 | 三星電子株式会社 | ZnOフィルム及びこれを用いたTFTの製造方法 |
| US7576394B2 (en) | 2006-02-02 | 2009-08-18 | Kochi Industrial Promotion Center | Thin film transistor including low resistance conductive thin films and manufacturing method thereof |
| JP2007212699A (ja) | 2006-02-09 | 2007-08-23 | Idemitsu Kosan Co Ltd | 反射型tft基板及び反射型tft基板の製造方法 |
| US7977169B2 (en) | 2006-02-15 | 2011-07-12 | Kochi Industrial Promotion Center | Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof |
| JP5110803B2 (ja) * | 2006-03-17 | 2012-12-26 | キヤノン株式会社 | 酸化物膜をチャネルに用いた電界効果型トランジスタ及びその製造方法 |
| JP5196813B2 (ja) * | 2006-03-20 | 2013-05-15 | キヤノン株式会社 | アモルファス酸化物膜をゲート絶縁層に用いた電界効果型トランジスタ |
| KR20070101595A (ko) | 2006-04-11 | 2007-10-17 | 삼성전자주식회사 | ZnO TFT |
| US20070252928A1 (en) | 2006-04-28 | 2007-11-01 | Toppan Printing Co., Ltd. | Structure, transmission type liquid crystal display, reflection type display and manufacturing method thereof |
| JP5028033B2 (ja) | 2006-06-13 | 2012-09-19 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
| JP4609797B2 (ja) | 2006-08-09 | 2011-01-12 | Nec液晶テクノロジー株式会社 | 薄膜デバイス及びその製造方法 |
| JP4999400B2 (ja) | 2006-08-09 | 2012-08-15 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
| JP5127183B2 (ja) * | 2006-08-23 | 2013-01-23 | キヤノン株式会社 | アモルファス酸化物半導体膜を用いた薄膜トランジスタの製造方法 |
| JP4332545B2 (ja) * | 2006-09-15 | 2009-09-16 | キヤノン株式会社 | 電界効果型トランジスタ及びその製造方法 |
| JP5164357B2 (ja) | 2006-09-27 | 2013-03-21 | キヤノン株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP4274219B2 (ja) | 2006-09-27 | 2009-06-03 | セイコーエプソン株式会社 | 電子デバイス、有機エレクトロルミネッセンス装置、有機薄膜半導体装置 |
| US7622371B2 (en) | 2006-10-10 | 2009-11-24 | Hewlett-Packard Development Company, L.P. | Fused nanocrystal thin film semiconductor and method |
| US7772021B2 (en) | 2006-11-29 | 2010-08-10 | Samsung Electronics Co., Ltd. | Flat panel displays comprising a thin-film transistor having a semiconductive oxide in its channel and methods of fabricating the same for use in flat panel displays |
| JP2008140684A (ja) | 2006-12-04 | 2008-06-19 | Toppan Printing Co Ltd | カラーelディスプレイおよびその製造方法 |
| KR101303578B1 (ko) | 2007-01-05 | 2013-09-09 | 삼성전자주식회사 | 박막 식각 방법 |
| US8207063B2 (en) | 2007-01-26 | 2012-06-26 | Eastman Kodak Company | Process for atomic layer deposition |
| US8129714B2 (en) * | 2007-02-16 | 2012-03-06 | Idemitsu Kosan Co., Ltd. | Semiconductor, semiconductor device, complementary transistor circuit device |
| KR100851215B1 (ko) | 2007-03-14 | 2008-08-07 | 삼성에스디아이 주식회사 | 박막 트랜지스터 및 이를 이용한 유기 전계 발광표시장치 |
| WO2008126879A1 (en) * | 2007-04-09 | 2008-10-23 | Canon Kabushiki Kaisha | Light-emitting apparatus and production method thereof |
| US7795613B2 (en) | 2007-04-17 | 2010-09-14 | Toppan Printing Co., Ltd. | Structure with transistor |
| KR101325053B1 (ko) | 2007-04-18 | 2013-11-05 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 이의 제조 방법 |
| KR20080094300A (ko) | 2007-04-19 | 2008-10-23 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조 방법과 박막 트랜지스터를포함하는 평판 디스플레이 |
| KR101334181B1 (ko) | 2007-04-20 | 2013-11-28 | 삼성전자주식회사 | 선택적으로 결정화된 채널층을 갖는 박막 트랜지스터 및 그제조 방법 |
| JP2008277326A (ja) * | 2007-04-25 | 2008-11-13 | Canon Inc | アモルファス酸化物半導体、半導体デバイス及び薄膜トランジスタ |
| CN101663762B (zh) | 2007-04-25 | 2011-09-21 | 佳能株式会社 | 氧氮化物半导体 |
| US8748879B2 (en) | 2007-05-08 | 2014-06-10 | Idemitsu Kosan Co., Ltd. | Semiconductor device, thin film transistor and a method for producing the same |
| KR101334182B1 (ko) * | 2007-05-28 | 2013-11-28 | 삼성전자주식회사 | ZnO 계 박막 트랜지스터의 제조방법 |
| KR101345376B1 (ko) | 2007-05-29 | 2013-12-24 | 삼성전자주식회사 | ZnO 계 박막 트랜지스터 및 그 제조방법 |
| EP2153468B1 (en) * | 2007-05-31 | 2010-12-01 | Canon Kabushiki Kaisha | Manufacturing method of thin film transistor using oxide semiconductor |
| JP5242083B2 (ja) | 2007-06-13 | 2013-07-24 | 出光興産株式会社 | 結晶酸化物半導体、及びそれを用いてなる薄膜トランジスタ |
| JP5331407B2 (ja) | 2007-08-17 | 2013-10-30 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP5354999B2 (ja) | 2007-09-26 | 2013-11-27 | キヤノン株式会社 | 電界効果型トランジスタの製造方法 |
| JP4759598B2 (ja) | 2007-09-28 | 2011-08-31 | キヤノン株式会社 | 薄膜トランジスタ、その製造方法及びそれを用いた表示装置 |
| JP5213422B2 (ja) | 2007-12-04 | 2013-06-19 | キヤノン株式会社 | 絶縁層を有する酸化物半導体素子およびそれを用いた表示装置 |
| WO2009081885A1 (ja) | 2007-12-25 | 2009-07-02 | Idemitsu Kosan Co., Ltd. | 酸化物半導体電界効果型トランジスタ及びその製造方法 |
| CN103258857B (zh) | 2007-12-13 | 2016-05-11 | 出光兴产株式会社 | 使用了氧化物半导体的场效应晶体管及其制造方法 |
| JP5215158B2 (ja) | 2007-12-17 | 2013-06-19 | 富士フイルム株式会社 | 無機結晶性配向膜及びその製造方法、半導体デバイス |
| JP5291928B2 (ja) | 2007-12-26 | 2013-09-18 | 株式会社日立製作所 | 酸化物半導体装置およびその製造方法 |
| JP2009164519A (ja) | 2008-01-10 | 2009-07-23 | Shimadzu Corp | 低温ポリシリコン用保護膜の成膜方法、低温ポリシリコン用保護膜の成膜装置および低温ポリシリコンtft |
| JP5467728B2 (ja) * | 2008-03-14 | 2014-04-09 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタおよびその製造方法 |
| TWI500160B (zh) | 2008-08-08 | 2015-09-11 | Semiconductor Energy Lab | 半導體裝置及其製造方法 |
| US8129718B2 (en) | 2008-08-28 | 2012-03-06 | Canon Kabushiki Kaisha | Amorphous oxide semiconductor and thin film transistor using the same |
| JP5627071B2 (ja) | 2008-09-01 | 2014-11-19 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US9082857B2 (en) | 2008-09-01 | 2015-07-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising an oxide semiconductor layer |
| JP5537787B2 (ja) | 2008-09-01 | 2014-07-02 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4623179B2 (ja) | 2008-09-18 | 2011-02-02 | ソニー株式会社 | 薄膜トランジスタおよびその製造方法 |
| JP5451280B2 (ja) | 2008-10-09 | 2014-03-26 | キヤノン株式会社 | ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置 |
| US8445903B2 (en) * | 2008-10-23 | 2013-05-21 | Idemitsu Kosan Co., Ltd. | Thin film transistor having a crystalline semiconductor film including indium oxide which contains a hydrogen element and method for manufacturing same |
| JP5616012B2 (ja) | 2008-10-24 | 2014-10-29 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| KR102068632B1 (ko) * | 2009-03-12 | 2020-01-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제작 방법 |
| WO2011027664A1 (en) * | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and method for manufacturing the same |
| WO2011037008A1 (en) | 2009-09-24 | 2011-03-31 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing oxide semiconductor film and method for manufacturing semiconductor device |
| WO2011037050A1 (en) | 2009-09-24 | 2011-03-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| KR102142450B1 (ko) * | 2009-10-30 | 2020-08-10 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작방법 |
-
2010
- 2010-09-01 KR KR1020127006049A patent/KR101809759B1/ko not_active Expired - Fee Related
- 2010-09-01 WO PCT/JP2010/065363 patent/WO2011037010A1/en not_active Ceased
- 2010-09-01 CN CN201510349006.4A patent/CN104934483B/zh active Active
- 2010-09-01 KR KR1020137013720A patent/KR101342343B1/ko active Active
- 2010-09-01 KR KR1020137012370A patent/KR101342179B1/ko active Active
- 2010-09-01 CN CN201080043261.1A patent/CN102576677B/zh active Active
- 2010-09-17 JP JP2010209431A patent/JP2011091381A/ja not_active Withdrawn
- 2010-09-23 TW TW105115975A patent/TWI636508B/zh active
- 2010-09-23 TW TW099132252A patent/TWI585862B/zh active
- 2010-09-23 US US12/888,835 patent/US9171938B2/en active Active
-
2012
- 2012-07-31 JP JP2012169477A patent/JP5116898B2/ja active Active
-
2013
- 2013-01-07 JP JP2013000557A patent/JP5216946B2/ja active Active
- 2013-09-05 JP JP2013183616A patent/JP2014033208A/ja not_active Withdrawn
-
2014
- 2014-01-02 US US14/146,093 patent/US9530872B2/en active Active
-
2015
- 2015-03-04 JP JP2015041958A patent/JP6114769B2/ja active Active
-
2017
- 2017-03-17 JP JP2017052114A patent/JP6385491B2/ja active Active
-
2018
- 2018-08-07 JP JP2018148183A patent/JP6568273B2/ja active Active
-
2019
- 2019-08-01 JP JP2019142123A patent/JP6595144B1/ja active Active
- 2019-09-25 JP JP2019173779A patent/JP6620263B1/ja active Active
- 2019-11-18 JP JP2019207687A patent/JP2020074398A/ja not_active Withdrawn
- 2019-11-27 JP JP2019213967A patent/JP6722812B2/ja active Active
-
2020
- 2020-12-09 JP JP2020203863A patent/JP6990289B2/ja active Active
-
2021
- 2021-09-02 JP JP2021143035A patent/JP2021192451A/ja not_active Withdrawn
- 2021-12-03 JP JP2021196736A patent/JP2022033140A/ja not_active Withdrawn
-
2023
- 2023-05-17 JP JP2023081399A patent/JP7507285B2/ja active Active
-
2024
- 2024-06-17 JP JP2024097536A patent/JP7645421B2/ja active Active
-
2025
- 2025-03-03 JP JP2025032632A patent/JP2025074221A/ja not_active Withdrawn
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004288864A (ja) * | 2003-03-20 | 2004-10-14 | Seiko Epson Corp | 薄膜半導体、薄膜トランジスタの製造方法、電気光学装置及び電子機器 |
| JP2007103918A (ja) * | 2005-09-06 | 2007-04-19 | Canon Inc | アモルファス酸化物膜をチャネル層に用いた電界効果型トランジスタ、アモルファス酸化物膜をチャネル層に用いた電界効果型トランジスタの製造方法及びアモルファス酸化物膜の製造方法 |
| JP2007173489A (ja) * | 2005-12-21 | 2007-07-05 | Idemitsu Kosan Co Ltd | Tft基板及びtft基板の製造方法 |
| JP2008141119A (ja) * | 2006-12-05 | 2008-06-19 | Canon Inc | 酸化物半導体を用いた表示装置及びその製造方法 |
| JP2008281988A (ja) * | 2007-04-09 | 2008-11-20 | Canon Inc | 発光装置とその作製方法 |
| JP2009135436A (ja) * | 2007-11-01 | 2009-06-18 | Semiconductor Energy Lab Co Ltd | 薄膜トランジスタ、及び薄膜トランジスタを有する表示装置 |
| WO2009084537A1 (ja) * | 2007-12-27 | 2009-07-09 | Nippon Mining & Metals Co., Ltd. | a-IGZO酸化物薄膜の製造方法 |
Cited By (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024023689A (ja) * | 2011-05-11 | 2024-02-21 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP2012253331A (ja) * | 2011-05-11 | 2012-12-20 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| US9893195B2 (en) | 2011-05-11 | 2018-02-13 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
| JP2016154365A (ja) * | 2011-05-19 | 2016-08-25 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US12283954B2 (en) | 2011-05-20 | 2025-04-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US10897258B2 (en) | 2011-05-20 | 2021-01-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US10505547B2 (en) | 2011-05-20 | 2019-12-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US11750194B2 (en) | 2011-05-20 | 2023-09-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2016158269A (ja) * | 2011-05-20 | 2016-09-01 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US11791415B2 (en) | 2011-09-29 | 2023-10-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2020038990A (ja) * | 2011-09-29 | 2020-03-12 | 株式会社半導体エネルギー研究所 | トランジスタ |
| US11217701B2 (en) | 2011-09-29 | 2022-01-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR102304125B1 (ko) * | 2011-09-29 | 2021-09-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP2023162370A (ja) * | 2011-09-29 | 2023-11-08 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP7625044B2 (ja) | 2011-09-29 | 2025-01-31 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US12218251B2 (en) | 2011-09-29 | 2025-02-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US10290744B2 (en) | 2011-09-29 | 2019-05-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US12225739B2 (en) | 2011-09-29 | 2025-02-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2021071730A (ja) * | 2011-09-29 | 2021-05-06 | 株式会社半導体エネルギー研究所 | 液晶表示装置、発光装置 |
| US10622485B2 (en) | 2011-09-29 | 2020-04-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR102128369B1 (ko) * | 2011-09-29 | 2020-06-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR20200077623A (ko) * | 2011-09-29 | 2020-06-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR20140066222A (ko) * | 2011-09-29 | 2014-05-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP2021044587A (ja) * | 2011-10-14 | 2021-03-18 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2024036335A (ja) * | 2011-10-14 | 2024-03-15 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP7412493B2 (ja) | 2011-10-14 | 2024-01-12 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP7707272B2 (ja) | 2011-10-14 | 2025-07-14 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2022171784A (ja) * | 2011-10-14 | 2022-11-11 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2017028324A (ja) * | 2012-05-01 | 2017-02-02 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP7346530B2 (ja) | 2012-05-10 | 2023-09-19 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2022024159A (ja) * | 2012-05-10 | 2022-02-08 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2014057051A (ja) * | 2012-08-10 | 2014-03-27 | Semiconductor Energy Lab Co Ltd | 半導体装置及び半導体装置の作製方法 |
| JP2014057049A (ja) * | 2012-08-10 | 2014-03-27 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
| WO2014192210A1 (ja) * | 2013-05-29 | 2014-12-04 | パナソニック株式会社 | 薄膜トランジスタ装置とその製造方法、および表示装置 |
| US9799772B2 (en) | 2013-05-29 | 2017-10-24 | Joled Inc. | Thin film transistor device, method for manufacturing same and display device |
| JPWO2014192210A1 (ja) * | 2013-05-29 | 2017-02-23 | 株式会社Joled | 薄膜トランジスタ装置とその製造方法、および表示装置 |
| US9660103B2 (en) | 2013-06-28 | 2017-05-23 | Kobe Steel, Ltd. | Thin film transistor and method for manufacturing same |
| JP2015029051A (ja) * | 2013-06-28 | 2015-02-12 | 株式会社神戸製鋼所 | 薄膜トランジスタおよびその製造方法 |
| WO2014208520A1 (ja) * | 2013-06-28 | 2014-12-31 | 株式会社神戸製鋼所 | 薄膜トランジスタおよびその製造方法 |
| US9570622B2 (en) | 2013-09-05 | 2017-02-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US9824898B2 (en) | 2013-09-05 | 2017-11-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| WO2025017415A1 (ja) * | 2023-07-14 | 2025-01-23 | 株式会社半導体エネルギー研究所 | 製造装置、及び酸化物半導体層の作製方法 |
| WO2025258263A1 (ja) * | 2024-06-10 | 2025-12-18 | 株式会社ジャパンディスプレイ | 酸化物半導体膜、積層構造体、薄膜トランジスタ、および電子機器 |
Also Published As
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6620263B1 (ja) | 半導体装置 | |
| JP5537787B2 (ja) | 半導体装置の作製方法 | |
| JP5791934B2 (ja) | 半導体装置の作製方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130903 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130903 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140814 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140819 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140825 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20141216 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20150310 |