JP2010073951A5 - - Google Patents
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- Publication number
- JP2010073951A5 JP2010073951A5 JP2008240825A JP2008240825A JP2010073951A5 JP 2010073951 A5 JP2010073951 A5 JP 2010073951A5 JP 2008240825 A JP2008240825 A JP 2008240825A JP 2008240825 A JP2008240825 A JP 2008240825A JP 2010073951 A5 JP2010073951 A5 JP 2010073951A5
- Authority
- JP
- Japan
- Prior art keywords
- pad
- power supply
- internal power
- semiconductor chip
- supply voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 79
- 239000002184 metal Substances 0.000 claims 21
- 238000007789 sealing Methods 0.000 claims 6
- 238000013459 approach Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
Priority Applications (13)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008240825A JP5405785B2 (ja) | 2008-09-19 | 2008-09-19 | 半導体装置 |
| CN201310353788.XA CN103794591B (zh) | 2008-09-19 | 2009-06-12 | 半导体器件 |
| CN201310353825.7A CN103400818B (zh) | 2008-09-19 | 2009-06-12 | 半导体器件 |
| CN2009101461061A CN101677096B (zh) | 2008-09-19 | 2009-06-12 | 半导体器件 |
| US12/489,714 US8134228B2 (en) | 2008-09-19 | 2009-06-23 | Semiconductor device for battery power voltage control |
| TW104130159A TWI581393B (zh) | 2008-09-19 | 2009-08-21 | Semiconductor device |
| TW98128295A TWI462260B (zh) | 2008-09-19 | 2009-08-21 | Semiconductor device |
| TW103136344A TWI505426B (zh) | 2008-09-19 | 2009-08-21 | Semiconductor device |
| US13/403,038 US9000574B2 (en) | 2008-09-19 | 2012-02-23 | Semiconductor device for battery power voltage control |
| JP2013226582A JP2014060417A (ja) | 2008-09-19 | 2013-10-31 | 半導体装置 |
| HK14108805.2A HK1195667B (en) | 2008-09-19 | 2014-08-29 | Semiconductor device |
| US14/518,003 US9209113B2 (en) | 2008-09-19 | 2014-10-20 | Semiconductor device for battery power voltage control |
| US14/881,481 US20160035706A1 (en) | 2008-09-19 | 2015-10-13 | Semiconductor device for battery power voltage control |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008240825A JP5405785B2 (ja) | 2008-09-19 | 2008-09-19 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013226582A Division JP2014060417A (ja) | 2008-09-19 | 2013-10-31 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010073951A JP2010073951A (ja) | 2010-04-02 |
| JP2010073951A5 true JP2010073951A5 (enExample) | 2011-10-27 |
| JP5405785B2 JP5405785B2 (ja) | 2014-02-05 |
Family
ID=42029591
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008240825A Active JP5405785B2 (ja) | 2008-09-19 | 2008-09-19 | 半導体装置 |
| JP2013226582A Pending JP2014060417A (ja) | 2008-09-19 | 2013-10-31 | 半導体装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013226582A Pending JP2014060417A (ja) | 2008-09-19 | 2013-10-31 | 半導体装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (4) | US8134228B2 (enExample) |
| JP (2) | JP5405785B2 (enExample) |
| CN (3) | CN103400818B (enExample) |
| TW (3) | TWI505426B (enExample) |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5405785B2 (ja) * | 2008-09-19 | 2014-02-05 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP5448727B2 (ja) * | 2009-11-05 | 2014-03-19 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
| US9048112B2 (en) * | 2010-06-29 | 2015-06-02 | Qualcomm Incorporated | Integrated voltage regulator with embedded passive device(s) for a stacked IC |
| KR101695770B1 (ko) * | 2010-07-02 | 2017-01-13 | 삼성전자주식회사 | 회전 적층 구조를 갖는 반도체 패키지 |
| FR2966982B1 (fr) * | 2010-10-27 | 2012-12-07 | St Microelectronics Sa | Ligne de transmission pour circuits electroniques |
| US8686537B2 (en) | 2011-03-03 | 2014-04-01 | Skyworks Solutions, Inc. | Apparatus and methods for reducing impact of high RF loss plating |
| US8889995B2 (en) | 2011-03-03 | 2014-11-18 | Skyworks Solutions, Inc. | Wire bond pad system and method |
| US9402319B2 (en) * | 2011-05-11 | 2016-07-26 | Vlt, Inc. | Panel-molded electronic assemblies |
| EP2741426B1 (en) * | 2011-08-01 | 2017-12-20 | Murata Manufacturing Co., Ltd. | High-frequency module |
| US9679869B2 (en) | 2011-09-02 | 2017-06-13 | Skyworks Solutions, Inc. | Transmission line for high performance radio frequency applications |
| JP5743922B2 (ja) * | 2012-02-21 | 2015-07-01 | 日立オートモティブシステムズ株式会社 | 熱式空気流量測定装置 |
| JP6051542B2 (ja) * | 2012-03-07 | 2016-12-27 | ミツミ電機株式会社 | 電池電圧監視回路 |
| KR101921686B1 (ko) | 2012-06-14 | 2018-11-26 | 스카이워크스 솔루션즈, 인코포레이티드 | 와이어 본드 패드 및 관련된 시스템, 장치, 및 방법을 포함하는 전력 증폭기 모듈 |
| JP5968713B2 (ja) * | 2012-07-30 | 2016-08-10 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| KR20150054789A (ko) * | 2012-09-10 | 2015-05-20 | 르네사스 일렉트로닉스 가부시키가이샤 | 반도체 장치 및 전지 전압 감시 장치 |
| JP6063713B2 (ja) * | 2012-11-08 | 2017-01-18 | ルネサスエレクトロニクス株式会社 | 電池保護システム |
| KR101350388B1 (ko) | 2012-11-22 | 2014-01-15 | 숭실대학교산학협력단 | 적층 구조를 가지는 집적회로 |
| CN103750834A (zh) * | 2014-02-13 | 2014-04-30 | 重庆海睿科技有限公司 | 一种心电信号采集线 |
| US9557755B2 (en) * | 2014-06-13 | 2017-01-31 | Gn Resound A/S | Interface circuit for a hearing aid and method |
| US9875963B2 (en) * | 2014-12-19 | 2018-01-23 | Toshiba Memory Corporation | Semiconductor device |
| US9967984B1 (en) | 2015-01-14 | 2018-05-08 | Vlt, Inc. | Power adapter packaging |
| US9666509B2 (en) * | 2015-01-16 | 2017-05-30 | New Japan Radio Co., Ltd. | Semiconductor device |
| CN107836037B (zh) * | 2015-01-22 | 2020-07-17 | 瑞萨电子株式会社 | 半导体器件及其制造方法 |
| US9589946B2 (en) * | 2015-04-28 | 2017-03-07 | Kabushiki Kaisha Toshiba | Chip with a bump connected to a plurality of wirings |
| US10264664B1 (en) | 2015-06-04 | 2019-04-16 | Vlt, Inc. | Method of electrically interconnecting circuit assemblies |
| JP6515724B2 (ja) * | 2015-07-31 | 2019-05-22 | 富士通株式会社 | 半導体装置 |
| JP6771870B2 (ja) * | 2015-08-31 | 2020-10-21 | 三菱電機株式会社 | 点灯装置および照明装置 |
| JP6753042B2 (ja) * | 2015-08-31 | 2020-09-09 | 三菱電機株式会社 | 点灯装置、点灯制御icおよび照明装置 |
| US10158357B1 (en) | 2016-04-05 | 2018-12-18 | Vlt, Inc. | Method and apparatus for delivering power to semiconductors |
| US11336167B1 (en) | 2016-04-05 | 2022-05-17 | Vicor Corporation | Delivering power to semiconductor loads |
| US10903734B1 (en) | 2016-04-05 | 2021-01-26 | Vicor Corporation | Delivering power to semiconductor loads |
| TWI652790B (zh) | 2016-10-19 | 2019-03-01 | Upi Semiconductor Corp. | 瞬間電壓抑制器裝置 |
| TWI637476B (zh) * | 2017-02-14 | 2018-10-01 | Lyontek Inc. | 雙晶片封裝結構 |
| CN108511427A (zh) * | 2017-02-24 | 2018-09-07 | 来扬科技股份有限公司 | 双芯片封装结构 |
| TWI631681B (zh) * | 2017-12-15 | 2018-08-01 | Lyontek Inc. | 雙晶片封裝結構 |
| JP6606236B2 (ja) * | 2018-08-02 | 2019-11-13 | ラピスセミコンダクタ株式会社 | 半導体チップ |
| WO2021059881A1 (ja) | 2019-09-25 | 2021-04-01 | 富士電機株式会社 | 半導体装置 |
| CN112309995B (zh) * | 2019-10-30 | 2023-05-30 | 成都华微电子科技股份有限公司 | 电压调整器陶瓷管壳、封装结构及其制造方法 |
| KR102817225B1 (ko) * | 2020-02-13 | 2025-06-05 | 에스케이하이닉스 주식회사 | 점대칭 구조의 칩 패드를 구비하는 반도체 칩을 포함하는 반도체 패키지 |
| JP7413102B2 (ja) * | 2020-03-17 | 2024-01-15 | キオクシア株式会社 | 半導体装置 |
| TWI749580B (zh) * | 2020-06-08 | 2021-12-11 | 星河半導體股份有限公司 | 多通道天線晶片測試系統及方法 |
| US11289437B1 (en) * | 2020-10-28 | 2022-03-29 | Renesas Electronics Corporation | Semiconductor device |
| JP7562234B2 (ja) | 2021-01-26 | 2024-10-07 | エイブリック株式会社 | 半導体装置 |
| CN116974322A (zh) * | 2022-04-22 | 2023-10-31 | 创意电子股份有限公司 | 捕获电阻电压降的分析器以及其分析方法 |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6159762A (ja) * | 1984-08-30 | 1986-03-27 | Fujitsu Ltd | 半導体装置 |
| JPH0741607U (ja) * | 1993-11-17 | 1995-07-21 | 富士通テン株式会社 | 電源回路 |
| US5408127A (en) * | 1994-03-21 | 1995-04-18 | National Semiconductor Corporation | Method of and arrangement for preventing bonding wire shorts with certain integrated circuit components |
| KR100192179B1 (ko) * | 1996-03-06 | 1999-06-15 | 김영환 | 반도체 패키지 |
| JP3732884B2 (ja) | 1996-04-22 | 2006-01-11 | 株式会社ルネサステクノロジ | 内部電源電圧発生回路、内部電圧発生回路および半導体装置 |
| KR0179920B1 (ko) * | 1996-05-17 | 1999-03-20 | 문정환 | 칩 사이즈 패키지의 제조방법 |
| JP3311935B2 (ja) | 1996-08-12 | 2002-08-05 | 株式会社東芝 | 半導体装置およびその計測方法 |
| JP2001110184A (ja) * | 1999-10-14 | 2001-04-20 | Hitachi Ltd | 半導体装置 |
| JP2002026173A (ja) * | 2000-07-10 | 2002-01-25 | Fuji Photo Film Co Ltd | Ic装置、基板、およびic組付基板 |
| JP2002043504A (ja) | 2000-07-27 | 2002-02-08 | Sharp Corp | 複合デバイス |
| JP2002124626A (ja) | 2000-10-16 | 2002-04-26 | Hitachi Ltd | 半導体装置 |
| WO2003065453A1 (de) * | 2002-01-31 | 2003-08-07 | Micronas Gmbh | Aufnahmevorrichtung für eine programmierbare, elektronische verarbeitungseinrichtung |
| JP2003243435A (ja) * | 2002-02-14 | 2003-08-29 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
| KR100594872B1 (ko) * | 2002-10-04 | 2006-06-30 | 롬 씨오.엘티디 | 전압귀환회로를 갖는 반도체 장치 및 이를 이용한 전자장치 |
| JP2004128329A (ja) | 2002-10-04 | 2004-04-22 | Rohm Co Ltd | 電圧帰還回路を有する半導体装置及びそれを用いた電子装置 |
| JP4236448B2 (ja) | 2002-11-15 | 2009-03-11 | 三洋電機株式会社 | 半導体集積回路 |
| JP2007066922A (ja) * | 2003-11-28 | 2007-03-15 | Renesas Technology Corp | 半導体集積回路装置 |
| EP1544917A1 (en) * | 2003-12-15 | 2005-06-22 | Dialog Semiconductor GmbH | Integrated battery pack with lead frame connection |
| JP2005183611A (ja) * | 2003-12-18 | 2005-07-07 | Matsushita Electric Ind Co Ltd | マルチチップ型半導体装置 |
| US7154186B2 (en) * | 2004-03-18 | 2006-12-26 | Fairchild Semiconductor Corporation | Multi-flip chip on lead frame on over molded IC package and method of assembly |
| JP2006073625A (ja) * | 2004-08-31 | 2006-03-16 | Sharp Corp | 電子部品 |
| US20060065962A1 (en) * | 2004-09-29 | 2006-03-30 | Intel Corporation | Control circuitry in stacked silicon |
| JP4808979B2 (ja) * | 2005-03-18 | 2011-11-02 | 株式会社リコー | マルチチップ型半導体装置及びその製造方法 |
| JP2006309312A (ja) * | 2005-04-26 | 2006-11-09 | Sharp Corp | レギュレータ |
| US7368960B2 (en) * | 2005-06-15 | 2008-05-06 | Cypress Semiconductor Corp. | Circuit and method for monitoring the integrity of a power supply |
| US8258607B2 (en) * | 2005-10-19 | 2012-09-04 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Apparatus and method for providing bypass capacitance and power routing in QFP package |
| JP2008004639A (ja) * | 2006-06-20 | 2008-01-10 | Toshiba Corp | 半導体装置 |
| JP2008060444A (ja) | 2006-09-01 | 2008-03-13 | Seiko Epson Corp | 集積回路装置 |
| TW200814275A (en) * | 2006-09-06 | 2008-03-16 | Advanced Semiconductor Eng | Chip carrier with a signal collection tape and manufacturing method thereof |
| US8148816B2 (en) | 2007-01-11 | 2012-04-03 | Nec Corporation | Semiconductor device |
| JP4940064B2 (ja) * | 2007-08-28 | 2012-05-30 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US7676912B2 (en) * | 2007-09-05 | 2010-03-16 | Headway Technologies, Inc. | Method of manufacturing electronic component package |
| JP5405785B2 (ja) * | 2008-09-19 | 2014-02-05 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP5407667B2 (ja) * | 2008-11-05 | 2014-02-05 | 株式会社村田製作所 | 半導体装置 |
| JP5335931B2 (ja) * | 2008-12-26 | 2013-11-06 | メギカ・コーポレイション | 電力管理集積回路を有するチップ・パッケージおよび関連技術 |
| JP5481161B2 (ja) * | 2009-10-30 | 2014-04-23 | ルネサスエレクトロニクス株式会社 | 半導体装置および電源装置 |
-
2008
- 2008-09-19 JP JP2008240825A patent/JP5405785B2/ja active Active
-
2009
- 2009-06-12 CN CN201310353825.7A patent/CN103400818B/zh active Active
- 2009-06-12 CN CN2009101461061A patent/CN101677096B/zh active Active
- 2009-06-12 CN CN201310353788.XA patent/CN103794591B/zh active Active
- 2009-06-23 US US12/489,714 patent/US8134228B2/en active Active
- 2009-08-21 TW TW103136344A patent/TWI505426B/zh active
- 2009-08-21 TW TW104130159A patent/TWI581393B/zh active
- 2009-08-21 TW TW98128295A patent/TWI462260B/zh active
-
2012
- 2012-02-23 US US13/403,038 patent/US9000574B2/en active Active
-
2013
- 2013-10-31 JP JP2013226582A patent/JP2014060417A/ja active Pending
-
2014
- 2014-10-20 US US14/518,003 patent/US9209113B2/en active Active
-
2015
- 2015-10-13 US US14/881,481 patent/US20160035706A1/en not_active Abandoned
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