TWI505426B - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
TWI505426B
TWI505426B TW103136344A TW103136344A TWI505426B TW I505426 B TWI505426 B TW I505426B TW 103136344 A TW103136344 A TW 103136344A TW 103136344 A TW103136344 A TW 103136344A TW I505426 B TWI505426 B TW I505426B
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Taiwan
Prior art keywords
semiconductor wafer
pad
power supply
connection point
semiconductor device
Prior art date
Application number
TW103136344A
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English (en)
Chinese (zh)
Other versions
TW201511207A (zh
Inventor
小松幹彥
日高隆雄
木村純子
Original Assignee
瑞薩電子股份有限公司
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Publication of TW201511207A publication Critical patent/TW201511207A/zh
Application granted granted Critical
Publication of TWI505426B publication Critical patent/TWI505426B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
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