HK1195667A1 - 半導體器件 - Google Patents

半導體器件

Info

Publication number
HK1195667A1
HK1195667A1 HK14108805.2A HK14108805A HK1195667A1 HK 1195667 A1 HK1195667 A1 HK 1195667A1 HK 14108805 A HK14108805 A HK 14108805A HK 1195667 A1 HK1195667 A1 HK 1195667A1
Authority
HK
Hong Kong
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
HK14108805.2A
Other languages
English (en)
Inventor
小松干彥
日高隆雄
木村純子
Original Assignee
瑞薩電子株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞薩電子株式會社 filed Critical 瑞薩電子株式會社
Publication of HK1195667A1 publication Critical patent/HK1195667A1/zh

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    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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CN101677096B (zh) 2013-09-11
US9000574B2 (en) 2015-04-07
US20160035706A1 (en) 2016-02-04
TW201013890A (en) 2010-04-01
TW201511207A (zh) 2015-03-16
CN103400818B (zh) 2016-06-22
TW201603222A (zh) 2016-01-16
CN103794591A (zh) 2014-05-14
JP2014060417A (ja) 2014-04-03
JP2010073951A (ja) 2010-04-02
TWI505426B (zh) 2015-10-21
US20120146245A1 (en) 2012-06-14
US20150102501A1 (en) 2015-04-16
CN103400818A (zh) 2013-11-20
US8134228B2 (en) 2012-03-13
TWI581393B (zh) 2017-05-01
JP5405785B2 (ja) 2014-02-05
CN103794591B (zh) 2016-08-10
TWI462260B (zh) 2014-11-21
CN101677096A (zh) 2010-03-24
US20100072604A1 (en) 2010-03-25

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