US20100165585A1 - Chip packages with power management integrated circuits and related techniques - Google Patents

Chip packages with power management integrated circuits and related techniques Download PDF

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US20100165585A1
US20100165585A1 US12/645,361 US64536109A US2010165585A1 US 20100165585 A1 US20100165585 A1 US 20100165585A1 US 64536109 A US64536109 A US 64536109A US 2010165585 A1 US2010165585 A1 US 2010165585A1
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layer
chip
over
metal
substrate
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Mou-Shiung Lin
Jin-Yuan Lee
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Qualcomm Inc
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Megica Corp
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Priority to US12/645,361 priority patent/US20100165585A1/en
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Publication of US20100165585A1 publication Critical patent/US20100165585A1/en
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Assigned to QUALCOMM INCORPORATED reassignment QUALCOMM INCORPORATED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MEGIT ACQUISITION CORP.
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