JP2009527622A5 - - Google Patents
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- JP2009527622A5 JP2009527622A5 JP2008556343A JP2008556343A JP2009527622A5 JP 2009527622 A5 JP2009527622 A5 JP 2009527622A5 JP 2008556343 A JP2008556343 A JP 2008556343A JP 2008556343 A JP2008556343 A JP 2008556343A JP 2009527622 A5 JP2009527622 A5 JP 2009527622A5
- Authority
- JP
- Japan
- Prior art keywords
- vime
- sio
- mixture
- simepho
- diethenyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000203 mixture Substances 0.000 description 5
- -1 methacryloxypropyl Chemical group 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US77657506P | 2006-02-24 | 2006-02-24 | |
| PCT/US2007/002966 WO2007100445A2 (en) | 2006-02-24 | 2007-02-01 | Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012279902A Division JP5669815B2 (ja) | 2006-02-24 | 2012-12-21 | シリコーンで封入された光放出装置及び前記シリコーンを調製するための硬化性シリコーン組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009527622A JP2009527622A (ja) | 2009-07-30 |
| JP2009527622A5 true JP2009527622A5 (https=) | 2011-03-24 |
Family
ID=38459494
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008556343A Pending JP2009527622A (ja) | 2006-02-24 | 2007-02-01 | シリコーンで封入された光放出装置及び前記シリコーンを調製するための硬化性シリコーン組成物 |
| JP2012279902A Active JP5669815B2 (ja) | 2006-02-24 | 2012-12-21 | シリコーンで封入された光放出装置及び前記シリコーンを調製するための硬化性シリコーン組成物 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012279902A Active JP5669815B2 (ja) | 2006-02-24 | 2012-12-21 | シリコーンで封入された光放出装置及び前記シリコーンを調製するための硬化性シリコーン組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8258502B2 (https=) |
| EP (1) | EP1987084B1 (https=) |
| JP (2) | JP2009527622A (https=) |
| KR (1) | KR20080104279A (https=) |
| CN (1) | CN101389695B (https=) |
| TW (1) | TWI470028B (https=) |
| WO (1) | WO2007100445A2 (https=) |
Families Citing this family (105)
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| CN101336383B (zh) | 2006-02-01 | 2012-05-09 | 陶氏康宁公司 | 抗冲击的光波导管及其制造方法 |
| US8258502B2 (en) | 2006-02-24 | 2012-09-04 | Dow Corning Corporation | Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones |
| JP5000566B2 (ja) * | 2008-03-27 | 2012-08-15 | 信越化学工業株式会社 | 硬化性シリコーンゴム組成物、およびそれを封止材料として用いた光半導体装置 |
| JP5667740B2 (ja) * | 2008-06-18 | 2015-02-12 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物及び半導体装置 |
| JP5972512B2 (ja) * | 2008-06-18 | 2016-08-17 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物及び半導体装置 |
| JP5555989B2 (ja) * | 2008-08-08 | 2014-07-23 | 横浜ゴム株式会社 | シリコーン樹脂組成物、これを用いるシリコーン樹脂および光半導体素子封止体 |
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| US8946353B2 (en) | 2008-10-31 | 2015-02-03 | Dow Corning Toray Co. Ltd. | Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device |
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| JP5526823B2 (ja) | 2009-02-24 | 2014-06-18 | 信越化学工業株式会社 | シリコーン樹脂で封止された光半導体装置 |
| TWI399873B (zh) * | 2009-03-03 | 2013-06-21 | 億光電子工業股份有限公司 | 發光二極體封裝結構及其製作方法 |
| CN102414275A (zh) * | 2009-05-29 | 2012-04-11 | 道康宁公司 | 用于产生透明硅氧烷材料和光学器件的硅氧烷组合物 |
| US8035236B2 (en) * | 2009-10-16 | 2011-10-11 | The Regents Of The University Of California | Semiconductor device comprising high performance encapsulation resins |
| TWI435895B (zh) | 2009-10-28 | 2014-05-01 | Indial Technology Co Ltd | Package material composition |
| US9299896B2 (en) | 2010-01-25 | 2016-03-29 | Lg Chem, Ltd. | Curable composition |
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| EP2530122B1 (en) * | 2010-01-25 | 2015-11-11 | LG Chem, Ltd. | Curable composition |
| EP2554601A4 (en) * | 2010-03-31 | 2013-10-09 | Sekisui Chemical Co Ltd | SEALANT FOR OPTICAL SEMICONDUCTORS AND OPTICAL SEMICONDUCTOR ELEMENT |
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2007
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- 2007-02-01 WO PCT/US2007/002966 patent/WO2007100445A2/en not_active Ceased
- 2007-02-01 JP JP2008556343A patent/JP2009527622A/ja active Pending
- 2007-02-01 KR KR1020087020666A patent/KR20080104279A/ko not_active Ceased
- 2007-02-01 CN CN200780006355XA patent/CN101389695B/zh active Active
- 2007-02-01 EP EP07749880.6A patent/EP1987084B1/en active Active
- 2007-02-15 TW TW96105604A patent/TWI470028B/zh active
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2012
- 2012-12-21 JP JP2012279902A patent/JP5669815B2/ja active Active
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