WO2009060958A1 - 環状ポリオルガノシロキサンの製造方法、硬化剤、硬化性組成物およびその硬化物 - Google Patents

環状ポリオルガノシロキサンの製造方法、硬化剤、硬化性組成物およびその硬化物 Download PDF

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Publication number
WO2009060958A1
WO2009060958A1 PCT/JP2008/070350 JP2008070350W WO2009060958A1 WO 2009060958 A1 WO2009060958 A1 WO 2009060958A1 JP 2008070350 W JP2008070350 W JP 2008070350W WO 2009060958 A1 WO2009060958 A1 WO 2009060958A1
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WIPO (PCT)
Prior art keywords
curable composition
molecule
curing agent
cured product
compound
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PCT/JP2008/070350
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English (en)
French (fr)
Inventor
Yoshikatsu Ichiryu
Masayuki Fujita
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Kaneka Corporation
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Publication date
Application filed by Kaneka Corporation filed Critical Kaneka Corporation
Priority to US12/741,697 priority Critical patent/US8273842B2/en
Priority to KR1020107012221A priority patent/KR101796065B1/ko
Priority to EP08848171.8A priority patent/EP2216336B1/en
Priority to JP2009540104A priority patent/JP5519290B2/ja
Priority to CN2008801147947A priority patent/CN101848914B/zh
Publication of WO2009060958A1 publication Critical patent/WO2009060958A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/21—Cyclic compounds having at least one ring containing silicon, but no carbon in the ring
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0834—Compounds having one or more O-Si linkage
    • C07F7/0838—Compounds with one or more Si-O-Si sequences
    • C07F7/0872—Preparation and treatment thereof
    • C07F7/0874—Reactions involving a bond of the Si-O-Si linkage
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/54—Nitrogen-containing linkages

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

　本発明の課題は、光学材料用途にも適用可能な耐熱耐光透明性、耐クラック性に優れる硬化物を与え得る硬化剤、硬化性組成物、それを硬化させて得られる硬化物を提供することである。また、上記硬化剤の成分である特定構造の環状ポリオルガノシロキサンを選択的にかつ高収率で得られる製造方法を提供することである。その為に、（Ａ）ＳｉＨ基と反応性を有する炭素－炭素二重結合を１分子中に少なくとも２個有する有機系化合物、（Ｂ）ＳｉＨ基を１分子中に少なくとも２個有する化合物、（Ｃ）ヒドロシリル化触媒を必須成分として含有する硬化性組成物において、（Ｂ）ＳｉＨ基を１分子中に少なくとも２個有する化合物として、特定の環状ポリオルガノシロキサンの反応物である、ＳｉＨ基を１分子中に少なくとも２個有する変性ポリオルガノシロキサン化合物（Ｂ）を使用する。                                                                                 
PCT/JP2008/070350 2007-11-09 2008-11-07 環状ポリオルガノシロキサンの製造方法、硬化剤、硬化性組成物およびその硬化物 WO2009060958A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US12/741,697 US8273842B2 (en) 2007-11-09 2008-11-07 Process for production of cyclic polyorganosiloxane, curing agent, curable composition, and cured product of the curable composition
KR1020107012221A KR101796065B1 (ko) 2007-11-09 2008-11-07 변성 폴리오르가노실록산 조성물, 변성 폴리오르가노실록산 화합물, 및 경화성 조성물
EP08848171.8A EP2216336B1 (en) 2007-11-09 2008-11-07 Process for production of cyclic polyorganosiloxane, curing agent, curable composition, and cured product of the curable composition
JP2009540104A JP5519290B2 (ja) 2007-11-09 2008-11-07 環状ポリオルガノシロキサンの製造方法、硬化剤、硬化性組成物およびその硬化物
CN2008801147947A CN101848914B (zh) 2007-11-09 2008-11-07 环状聚有机硅氧烷的制备方法、固化剂、固化性组合物及其固化物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007292451 2007-11-09
JP2007-292451 2007-11-09

Publications (1)

Publication Number Publication Date
WO2009060958A1 true WO2009060958A1 (ja) 2009-05-14

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PCT/JP2008/070350 WO2009060958A1 (ja) 2007-11-09 2008-11-07 環状ポリオルガノシロキサンの製造方法、硬化剤、硬化性組成物およびその硬化物

Country Status (6)

Country Link
US (1) US8273842B2 (ja)
EP (1) EP2216336B1 (ja)
JP (1) JP5519290B2 (ja)
KR (1) KR101796065B1 (ja)
CN (2) CN101848914B (ja)
WO (1) WO2009060958A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
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JP2010285517A (ja) * 2009-06-10 2010-12-24 Kaneka Corp 光硬化性組成物およびそれを用いた絶縁性薄膜および薄膜トランジスタ
JP2010285519A (ja) * 2009-06-10 2010-12-24 Kaneka Corp 光硬化性組成物およびそれを用いた絶縁性薄膜および薄膜トランジスタ
JP2015028179A (ja) * 2014-09-25 2015-02-12 株式会社カネカ 光硬化性組成物およびそれを用いた絶縁性薄膜および薄膜トランジスタ
JP2015038211A (ja) * 2014-09-25 2015-02-26 株式会社カネカ 光硬化性組成物およびそれを用いた絶縁性薄膜および薄膜トランジスタ
JP2015523917A (ja) * 2012-04-30 2015-08-20 ザ・ボーイング・カンパニーＴｈｅＢｏｅｉｎｇ Ｃｏｍｐａｎｙ シリコンオキシカーバイド層を含む複合材料、及び複合材料を形成する方法
JP2017132048A (ja) * 2016-01-25 2017-08-03 セイコーエプソン株式会社 前処理液、油性インクジェット記録用インクセット及び油性インクジェット記録方法

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KR101905238B1 (ko) * 2012-03-28 2018-10-05 주식회사 다이셀 경화성 에폭시 수지 조성물
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US9226541B2 (en) * 2013-04-28 2016-01-05 Hongguang YANG Silicon rubber healthcare footwear article with silicon rubber insole and its manufacturing method
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KR102331247B1 (ko) * 2015-03-31 2021-11-25 코오롱인더스트리 주식회사 저유전 특성을 갖는 실록산 수지, 이의 제조방법 및 이를 포함하는 경화 조성물
CN105679754A (zh) * 2016-01-27 2016-06-15 长兴科迪光电股份有限公司 一种大功率led封装的方法
KR101881696B1 (ko) * 2017-05-19 2018-07-24 주식회사 케이씨씨 접착제 조성물 및 이를 이용하여 제조된 반도체 소자
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KR102075461B1 (ko) * 2018-07-12 2020-02-10 주식회사 에이치알에스 고방열 액상 실리콘 조성물
CN110819141B (zh) * 2018-08-10 2022-07-12 Jsr株式会社 硬化性组合物及化合物
KR102173016B1 (ko) * 2018-10-15 2020-11-02 금호석유화학 주식회사 첨가제 조성물 및 그 제조방법

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US8273842B2 (en) 2012-09-25
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CN101848914A (zh) 2010-09-29
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