JP2008184688A5 - - Google Patents

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JP2008184688A5
JP2008184688A5 JP2008010072A JP2008010072A JP2008184688A5 JP 2008184688 A5 JP2008184688 A5 JP 2008184688A5 JP 2008010072 A JP2008010072 A JP 2008010072A JP 2008010072 A JP2008010072 A JP 2008010072A JP 2008184688 A5 JP2008184688 A5 JP 2008184688A5
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tantalum
reaction space
source chemical
nitride film
tantalum nitride
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JP2008010072A
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JP5441340B2 (ja
JP2008184688A (ja
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Claims (25)

  1. 反応空間内の基板上に窒化タンタル膜を成長させる原子層成長(ALD)方法であって、
    a)タンタルソースケミカルの気相パルスを前記反応空間に供給するステップ、
    b)超過の前記タンタルソースケミカル及び任意の反応副産物を前記反応空間から除去するステップ、
    c)窒素ソースケミカルの気相パルスを前記反応空間に供給するステップ、
    d)超過の前記窒素ソースケミカル及び任意の反応副産物を前記反応空間から除去するステップ、
    e)水素(H )のプラズマ励起種の気相パルスを前記反応空間に供給するステップ、及び、
    f)超過の前記水素のプラズマ励起種及び任意の反応副産物を前記反応空間から除去するステップ、を含む方法。
  2. 前記ステップa)〜ステップf)が、所定の厚さの窒化タンタル膜が基板表面上に形成されるまで繰り返されるステップをさらに含む請求項の方法。
  3. 前記ステップa)〜ステップd)が、前記ステップe)〜ステップf)の前に所定の回数繰り返される請求項の方法。
  4. 前記供給ステップが、キャリヤーガスでパルス的に供給するステップを含む請求項1から請求項3のいずれか1項の方法。
  5. 前記除去ステップが、不活性ガスを用いてパージするステップを含む請求項1から請求項4のいずれか1項の方法。
  6. 前記除去ステップが、排気システムを用いて排出するステップを含む請求項1から請求項5のいずれか1項の方法。
  7. 前記タンタルソースケミカルが、タンタルハロゲン化物及びタンタルの有機化合物から成るグループから選択される請求項1から請求項6のいずれか1項の方法。
  8. 前記タンタルソースケミカルが、タンタルのペンタキス(ジアルキルアミド)化合物を含む請求項の方法。
  9. 前記タンタルソースケミカルが、タンタル臭化物、塩化タンタル、タンタルフッ化物、およびタンタルヨウ化物から成るグループから選択される請求項の方法。
  10. 前記窒素ソースケミカルが、アンモニア(NH)及びその塩類、アジ化水素(HN)及びそのアルキル誘導体、ヒドラジン(N)及びヒドラジンの塩類、ヒドラジンのアルキル誘導体、弗化窒素NF、第1、第2及び第3のアミン類、窒素ラジカル、並びに励起状態窒素(N )から成るグループから選択される(ここで、*は結合可能な自由電子である)請求項1から請求項9のいずれか1項の方法。
  11. 前記窒素ソースケミカルが、t−ブチルアミド、C、ヒドラジン塩酸塩ジメチルヒドラジン、ヒドロキシルアミン塩酸塩、メチルアミン、ジエチルアミン、及びトリエチルアミンからなるグループから選択される請求項10の方法。
  12. 前記水素のプラズマ励起種が、反応空間内で生成される請求項1から請求項11のいずれか1項の方法。
  13. 前記水素のプラズマ励起種が、シャワーヘッドを備える反応器内で生成される請求項12の方法。
  14. 前記水素のプラズマ励起種が、遠隔で生成される請求項1から請求項12のいずれか1項の方法。
  15. 前記基板が、少なくとも1つの前記パルスの期間中に加熱される請求項1から請求項14のいずれか1項の方法。
  16. 前記基板が、シリコン、シリカ、コーティングされたシリコン、金属銅、及び窒化物から成るグループから選択された1つ以上の物質を含む請求項1から請求項15のいずれか1項の方法。
  17. 前記反応空間が、プラズマ原子層成長法(PEALD)のために構成された反応器である請求項1から請求項16のいずれか1項の方法。
  18. 前記反応空間が、枚葉式PEALD反応器である請求項17の方法。
  19. ラズマパラメータが、導電窒化タンタル膜が前記基板上にのみ形成され、誘電体窒化タンタル膜が前記反応空間の別の場所の上に形成されるように選択される請求項17の方法。
  20. 前記プラズマパラメータが、RFパワーのオン時間、RFパワーの振幅、RFパワーの周波数、反応物の濃度、反応物の流量、反応空間の圧力、ガス全体の流量、反応物パルスの持続時間及び間隔、並びにRF電極間隔からなるグループから選択される請求項19の方法。
  21. 前記窒化タンタル膜が、導電性である請求項1から請求項18のいずれか1項の方法。
  22. 前記窒化タンタル膜内の窒素に対するタンタルの比率が、1以上である請求項21の方法。
  23. 前記窒化タンタル薄膜が、2000μΩcm未満のバルク抵抗率を有する請求項21の方法。
  24. 前記窒化タンタル薄膜が、1000μΩcm未満のバルク抵抗率を有する請求項23の方法。
  25. 前記窒化タンタル膜が、集積回路中の拡散障壁を画定する請求項1から請求項18のいずれか1項の方法。
JP2008010072A 2007-01-26 2008-01-21 窒化タンタル膜のプラズマald Active JP5441340B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/627,749 2007-01-26
US11/627,749 US7598170B2 (en) 2007-01-26 2007-01-26 Plasma-enhanced ALD of tantalum nitride films

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JP2008184688A JP2008184688A (ja) 2008-08-14
JP2008184688A5 true JP2008184688A5 (ja) 2011-03-03
JP5441340B2 JP5441340B2 (ja) 2014-03-12

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EP (1) EP1956113A1 (ja)
JP (1) JP5441340B2 (ja)
TW (1) TWI433956B (ja)

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