JP5441340B2 - 窒化タンタル膜のプラズマald - Google Patents
窒化タンタル膜のプラズマald Download PDFInfo
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- JP5441340B2 JP5441340B2 JP2008010072A JP2008010072A JP5441340B2 JP 5441340 B2 JP5441340 B2 JP 5441340B2 JP 2008010072 A JP2008010072 A JP 2008010072A JP 2008010072 A JP2008010072 A JP 2008010072A JP 5441340 B2 JP5441340 B2 JP 5441340B2
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- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 title claims description 59
- 239000010408 film Substances 0.000 claims description 111
- 238000006243 chemical reaction Methods 0.000 claims description 108
- 239000000376 reactant Substances 0.000 claims description 86
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 81
- 238000000034 method Methods 0.000 claims description 71
- 239000000758 substrate Substances 0.000 claims description 68
- 239000001257 hydrogen Substances 0.000 claims description 55
- 229910052739 hydrogen Inorganic materials 0.000 claims description 55
- 150000004767 nitrides Chemical class 0.000 claims description 51
- 239000000126 substance Substances 0.000 claims description 48
- 238000000231 atomic layer deposition Methods 0.000 claims description 45
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 42
- 229910052757 nitrogen Inorganic materials 0.000 claims description 41
- 239000007789 gas Substances 0.000 claims description 37
- 239000010409 thin film Substances 0.000 claims description 32
- 229910052715 tantalum Inorganic materials 0.000 claims description 31
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 28
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 25
- 238000010926 purge Methods 0.000 claims description 25
- 239000012071 phase Substances 0.000 claims description 24
- 229910021529 ammonia Inorganic materials 0.000 claims description 14
- 239000012159 carrier gas Substances 0.000 claims description 11
- 238000009792 diffusion process Methods 0.000 claims description 10
- -1 tantalum halides Chemical class 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 9
- 230000004888 barrier function Effects 0.000 claims description 8
- 150000002431 hydrogen Chemical class 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- WTDHULULXKLSOZ-UHFFFAOYSA-N Hydroxylamine hydrochloride Chemical compound Cl.ON WTDHULULXKLSOZ-UHFFFAOYSA-N 0.000 claims description 4
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- CJANULXXNBPNRH-UHFFFAOYSA-N CNNC.Cl.NN Chemical compound CNNC.Cl.NN CJANULXXNBPNRH-UHFFFAOYSA-N 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- ZNRKKSGNBIJSRT-UHFFFAOYSA-L dibromotantalum Chemical compound Br[Ta]Br ZNRKKSGNBIJSRT-UHFFFAOYSA-L 0.000 claims description 2
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims description 2
- 239000003574 free electron Substances 0.000 claims description 2
- 150000002429 hydrazines Chemical class 0.000 claims description 2
- JUINSXZKUKVTMD-UHFFFAOYSA-N hydrogen azide Chemical compound N=[N+]=[N-] JUINSXZKUKVTMD-UHFFFAOYSA-N 0.000 claims description 2
- 150000002831 nitrogen free-radicals Chemical class 0.000 claims description 2
- GVGCUCJTUSOZKP-UHFFFAOYSA-N nitrogen trifluoride Chemical compound FN(F)F GVGCUCJTUSOZKP-UHFFFAOYSA-N 0.000 claims description 2
- 150000002894 organic compounds Chemical class 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- YRGLXIVYESZPLQ-UHFFFAOYSA-I tantalum pentafluoride Chemical compound F[Ta](F)(F)(F)F YRGLXIVYESZPLQ-UHFFFAOYSA-I 0.000 claims description 2
- MISXNQITXACHNJ-UHFFFAOYSA-I tantalum(5+);pentaiodide Chemical compound [I-].[I-].[I-].[I-].[I-].[Ta+5] MISXNQITXACHNJ-UHFFFAOYSA-I 0.000 claims description 2
- OEIMLTQPLAGXMX-UHFFFAOYSA-I tantalum(v) chloride Chemical compound Cl[Ta](Cl)(Cl)(Cl)Cl OEIMLTQPLAGXMX-UHFFFAOYSA-I 0.000 claims description 2
- 230000005281 excited state Effects 0.000 claims 1
- 239000012808 vapor phase Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 100
- 239000002184 metal Substances 0.000 description 100
- 210000002381 plasma Anatomy 0.000 description 83
- 239000006227 byproduct Substances 0.000 description 24
- 230000015572 biosynthetic process Effects 0.000 description 17
- 230000008569 process Effects 0.000 description 17
- 239000002356 single layer Substances 0.000 description 17
- 229910052723 transition metal Inorganic materials 0.000 description 13
- 150000003624 transition metals Chemical class 0.000 description 13
- 239000010410 layer Substances 0.000 description 12
- 238000000151 deposition Methods 0.000 description 11
- 230000008021 deposition Effects 0.000 description 11
- 239000002243 precursor Substances 0.000 description 11
- 150000004820 halides Chemical class 0.000 description 10
- 239000003638 chemical reducing agent Substances 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 229910052786 argon Inorganic materials 0.000 description 5
- 238000001465 metallisation Methods 0.000 description 5
- 238000006557 surface reaction Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 4
- 238000003877 atomic layer epitaxy Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 238000011065 in-situ storage Methods 0.000 description 4
- 239000003446 ligand Substances 0.000 description 4
- 239000002052 molecular layer Substances 0.000 description 4
- 238000001208 nuclear magnetic resonance pulse sequence Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 229910004529 TaF 5 Inorganic materials 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 229910052735 hafnium Inorganic materials 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 229910052758 niobium Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- 229910052720 vanadium Inorganic materials 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
- 238000000560 X-ray reflectometry Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000000407 epitaxy Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 238000010574 gas phase reaction Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011066 ex-situ storage Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910001509 metal bromide Inorganic materials 0.000 description 1
- 229910001510 metal chloride Inorganic materials 0.000 description 1
- 229910001512 metal fluoride Inorganic materials 0.000 description 1
- 229910001511 metal iodide Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004375 physisorption Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/34—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
- C23C16/45536—Use of plasma, radiation or electromagnetic fields
- C23C16/4554—Plasma being used non-continuously in between ALD reactions
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- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Electromagnetism (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Description
本出願は、Elersらの、2002年4月11日に出願した番号10/110,730のアメリカ合衆国特許出願、現在、番号6,863,727のアメリカ合衆国特許に関連し、且つ参照によりその出願を完全に本明細書の一部として取り入れている。
本発明の文脈において、「ALDプロセス」は、自己飽和化学反応を使用して一分子層ずつ基板上に薄膜を形成するプロセスを基本的に指す。ALDの一般的な原則が、例えば、番号4,058,430及び5,711,811のアメリカ合衆国特許に開示されており、それらの開示全体は参照により本明細書の一部として取り入れられている。典型的なALDプロセスでは、ガスの反応物がALDタイプ反応器の反応室(あるいは反応空間)に導入され、反応室内に配置されている基板とコンタクトし、表面反応を提供する。反応室の圧力及び温度は前駆体の物理吸着(つまり、ガスの凝結)及び熱分解が回避される範囲に調節される。さらに、反応物はそれら自身では反応しないように選択されている。その結果、各パルスサイクルの期間中に、物質の最大でも1単分子層(つまり、1原子の層あるいは分子層)だけが堆積する。典型的にはÅ/パルスサイクルとして表される薄膜の実際の成長率が、例えば、表面上の利用可能な反応点の数及び反応物分子のかさ高さ(Bulkiness)に依存する。すなわち、一旦利用可能な結合部位がすべて埋め込まれれば、さらなる表面反応は可能ではない。前駆体間の気相反応及び副産物間のいかなる望まれない反応も抑制される。それは、反応物パルスが時間的に互いから分離され、且つ、余分の(あるいは超過の)ガス反応物及び反応副産物を、もしあれば除去するために、反応室が、反応物パルス間で、不活性ガス(例えば、窒素、アルゴン、H2、またはHe)でパージされ、及び/又は、例えば、真空ポンプを使用して排気されるためである。
ここに示された方法は、基板表面上でのコンフォーマルな導電窒化金属(例えばタンタル)薄膜の制御された形成を可能にする。反応器または反応空間内のシャワーヘッドのような別の表面上での導電膜の形成は、好ましく低減しあるいは防止される。好ましい実施の形態では、窒化タンタル薄膜がハロゲン含有のケミカルから形成される。さらに、高いアスペクト比のトレンチ中の成膜のような幾何学的に難しいアプリケーションも、表面反応の自己制限性質により可能である。
1.遷移金属ハロゲン化物を反応空間に供給するステップ
2.超過遷移金属ハロゲン化物及び反応副産物をパージ及び/又は排出するステップ
3.窒素ソース物質を反応空間に供給するステップ
4.超過窒素ソース物質及び反応副産物をパージ及び/又は排出するステップ
5.水素プラズマを反応空間に供給するステップ、及び
6.超過水素プラズマ及び反応副産物をパージ及び/又は排出するステップ
ASM Genitech社のPEALD反応器中で300mmのシリコンウェーハ上に導電窒化タンタル膜を形成した。成膜は約300〜350℃の基板温度及び約93℃のTaF5ソースガス温度で行われた。水素(H2)プラズマ及びアンモニア(NH3)は、還元剤及び窒素ソース物質としてそれぞれ使用された。H2プラズマは、プラズマパワーを約400Wに保持しながら、H2を反応器にパルス的に供給すると同時に、プラズマ発生器へパワー(1キロワット、13.56MHz)を供給することによって生成された。ガスパルスのシーケンス及びパルス時間(ミリセカンド、「ms」)は、以下のとおりである。
(2)Arパージ(3000ms)
(3)H2プラズマパルス(2000〜4000ms)
(4)Arパージ(2000ms)
(5)NH3パルス(1000〜4000ms)
(6)Arパージ(6000ms)
ステップ(1)〜(6)は、約40nm〜70nm間の厚さの導電窒化タンタル膜が基板上で形成されるまで繰り返された。パルスシーケンスの期間中に、絞り弁は反応器圧力を約3Torrに維持するために使用され、また、アルゴン(Ar)は約650sccmの流量でウェーハ上に連続的に供給された。
ALD(熱/プラズマ)は、主に約300℃の基板温度で行った。また、結果は、約300℃〜350℃間の温度で得た。アンモニアパルスの期間を長くし、化学量論的窒化タンタル(つまり、TaN)の約1.0及び誘電体窒化タンタル(例えばTa3N5)の約1.67の間に変化するN対Taの比率(N/Ta)を算定した結果は、窒化タンタル膜が化学量論的な相で成長したことを示した。TaF5及びH2プラズマのパルスの長さまたは期間は、アンモニア(NH3)パルスに先立って基板上に飽和した、且つ完全に還元されたタンタル層を提供するのに十分であるように選択された。さらに、パージガスは前駆体と反応副産物の除去を支援するために供給された。約0.5秒(s)、1s、2s、及び4sのアンモニアパルス期間のそれぞれにおいて、約800〜1000のサイクルを使用した結果、それぞれ連続的な帯黄色の金属の膜が基板上に形成された。
Claims (25)
- 反応空間内の基板上に窒化タンタル膜を成長させる原子層成長(ALD)方法であって、
a)タンタルソースケミカルの気相パルスを前記反応空間に供給するステップ、
b)超過の前記タンタルソースケミカル及び反応副産物を前記反応空間から除去するステップ、
c)窒素ソースケミカルの気相パルスを前記反応空間に供給し、基板表面上に残された前記タンタルソースケミカルと反応させるステップ、
d)超過の前記窒素ソースケミカル及び反応副産物を前記反応空間から除去するステップ、
e)水素(H2)のプラズマ励起種の気相パルスを前記反応空間に供給するステップ、及び、
f)超過の前記水素のプラズマ励起種及び反応副産物を前記反応空間から除去するステップ、
の逐次的なステップを含む方法。 - 前記ステップa)〜ステップf)が、所定の厚さの窒化タンタル膜が基板表面上に形成されるまで繰り返されるステップをさらに含む請求項1の方法。
- 前記ステップa)〜ステップd)が、前記ステップe)〜ステップf)の前に所定の回数繰り返される請求項1の方法。
- 前記供給ステップが、キャリヤーガスでパルス的に供給するステップを含む請求項1から請求項3のいずれか1項の方法。
- 前記除去ステップが、不活性ガスを用いてパージするステップを含む請求項1から請求項4のいずれか1項の方法。
- 前記除去ステップが、排気システムを用いて排出するステップを含む請求項1から請求項5のいずれか1項の方法。
- 前記タンタルソースケミカルが、タンタルハロゲン化物及びタンタルの有機化合物から成るグループから選択される請求項1から請求項6のいずれか1項の方法。
- 前記タンタルソースケミカルが、タンタルのペンタキス(ジアルキルアミド)化合物を含む請求項7の方法。
- 前記タンタルソースケミカルが、タンタル臭化物、塩化タンタル、タンタルフッ化物、およびタンタルヨウ化物から成るグループから選択される請求項7の方法。
- 前記窒素ソースケミカルが、アンモニア(NH3)及びその塩類、アジ化水素(HN3)及びそのアルキル誘導体、ヒドラジン(N2H4)及びヒドラジンの塩類、ヒドラジンのアルキル誘導体、弗化窒素NF3、第1、第2及び第3のアミン類、窒素ラジカル、並びに励起状態窒素(N2 *)から成るグループから選択される(ここで、*は結合可能な自由電子である)請求項1から請求項9のいずれか1項の方法。
- 前記窒素ソースケミカルが、t−ブチルアミド、CH3N3、ヒドラジン塩酸塩ジメチルヒドラジン、ヒドロキシルアミン塩酸塩、メチルアミン、ジエチルアミン、及びトリエチルアミンからなるグループから選択される請求項10の方法。
- 前記水素のプラズマ励起種が、反応空間内で生成される請求項1から請求項11のいずれか1項の方法。
- 前記水素のプラズマ励起種が、シャワーヘッドを備える反応器内で生成される請求項12の方法。
- 前記水素のプラズマ励起種が、遠隔で生成される請求項1から請求項12のいずれか1項の方法。
- 前記基板が、少なくとも1つの前記パルスの期間中に加熱される請求項1から請求項14のいずれか1項の方法。
- 前記基板が、シリコン、シリカ、コーティングされたシリコン、金属銅、及び窒化物から成るグループから選択された1つ以上の物質を含む請求項1から請求項15のいずれか1項の方法。
- 前記反応空間が、プラズマ原子層成長法(PEALD)のために構成された反応器である請求項1から請求項16のいずれか1項の方法。
- 前記反応空間が、枚葉式PEALD反応器である請求項17の方法。
- プラズマパラメータが、導電窒化タンタル膜が前記基板上にのみ形成され、誘電体窒化タンタル膜が前記反応空間の別の場所の上に形成されるように、水素プラズマが基板表面に向けられるように選択される請求項17の方法。
- 前記プラズマパラメータが、RFパワーのオン時間、RFパワーの振幅、RFパワーの周波数、反応物の濃度、反応物の流量、反応空間の圧力、ガス全体の流量、反応物パルスの持続時間及び間隔、並びにRF電極間隔からなるグループから選択される請求項19の方法。
- 前記窒化タンタル膜が、導電性である請求項1から請求項18のいずれか1項の方法。
- 前記窒化タンタル膜内の窒素に対するタンタルの比率が、1以上である請求項21の方法。
- 前記窒化タンタル薄膜が、2000μΩcm未満のバルク抵抗率を有する請求項21の方法。
- 前記窒化タンタル薄膜が、1000μΩcm未満のバルク抵抗率を有する請求項23の方法。
- 前記窒化タンタル膜が、集積回路中の拡散障壁を画定する請求項1から請求項18のいずれか1項の方法。
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-
2007
- 2007-01-26 US US11/627,749 patent/US7598170B2/en active Active
-
2008
- 2008-01-15 TW TW097101458A patent/TWI433956B/zh active
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US7598170B2 (en) | 2009-10-06 |
TWI433956B (zh) | 2014-04-11 |
JP2008184688A (ja) | 2008-08-14 |
TW200839029A (en) | 2008-10-01 |
US20080182411A1 (en) | 2008-07-31 |
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