JP2005520317A - 半導体ウェハの表面平坦化方法及びその装置 - Google Patents
半導体ウェハの表面平坦化方法及びその装置 Download PDFInfo
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
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- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/03—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent according to the final size of the previously ground workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
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- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
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Abstract
Description
Claims (32)
- 研磨操作における一様なウェハ厚さのプロファイル生成方法を有する半導体ウェハの表面平坦化方法であって、前記プロファイル生成方法が、
(a)複数の領域をウェハ上に形成し、かつ研磨工程における個々の領域のウェハ材料の除去速度を識別するウェハ研磨モデルを提供するステップと、
(b)個々の領域に対する目標厚さプロファイルを生成する研磨製法を使用してウェハを研磨するステップと
を備えたことを特徴とする半導体ウェハの表面平坦化方法。 - 研磨操作におけるウェハ表面の非一様性制御方法を有する半導体ウェハの表面平坦化方法であって、前記非一様性制御方法が、
(a)複数の領域をウェハ上に形成し、かつ研磨プロセスの研磨工程における個々の領域のウェハ材料除去速度を識別するウェハ研磨モデルを提供するステップであって、前記研磨プロセスが複数の研磨工程を有するステップと、
(b)入りウェハ厚さプロファイルに基づく第1の研磨製法を使用してウェハを研磨するステップと、
(c)前記ステップ(b)の研磨後におけるウェハのウェハ厚さプロファイルを決定するステップと、
(d)目標ウェハ厚さプロファイルを維持するべく、前記ステップ(c)の前記ウェハ厚さプロファイル及び前記ステップ(a)の前記モデルに基づく更新研磨製法を計算するステップと
を備えたことを特徴とする半導体ウェハの表面平坦化方法。 - 前記第1の研磨製法は、前記目標ウェハ厚さプロファイルを得るべく前記ステップ(a)の前記モデルに基づいていることを特徴とする請求項2に記載の半導体ウェハの表面平坦化方法。
- 前記第1の研磨製法は、実験によって決定されることを特徴とする請求項2に記載の半導体ウェハの表面平坦化方法。
- 前記ステップ(a)のモデルの前記複数の領域は、前記ウェハの中心点から半径方向を外側に向かって延びた領域を備えることを特徴とする請求項1又は2に記載の半導体ウェハの表面平坦化方法。
- 前記モデルは、4つ以上の領域を備えることを特徴とする請求項5に記載の半導体ウェハの表面平坦化方法。
- 前記ステップ(b)の研磨は、複数の研磨ステーションで前記ウェハを研磨するステップを含むことを特徴とする請求項1に記載の半導体ウェハの表面平坦化方法。
- 前記研磨ステップは、3つの研磨ステーションで実施されることを特徴とする請求項7に記載の半導体ウェハの表面平坦化方法。
- 少なくとも2つの研磨ステーションの前記研磨製法が同じであることを特徴とする請求項7に記載の半導体ウェハの表面平坦化方法。
- 少なくとも2つの研磨ステーションの前記研磨製法が異なることを特徴とする請求項7に記載の半導体ウェハの表面平坦化方法。
- 前記ステップ(d)の更新研磨製法の計算は、前記複数の研磨ステーションの各々に対する更新研磨製法を計算するステップを含むことを特徴とする請求項1に記載の半導体ウェハの表面平坦化方法。
- 前記複数の研磨ステーションの各々に対する前記更新研磨製法は、個々の研磨ステーションのツール状態を補償することを特徴とする請求項11に記載の半導体ウェハの表面平坦化方法。
- 前記ステップ(b)の研磨は、複数の研磨ステーションで実行され、連続する研磨ステーションの各々に対する前記ウェハ厚さプロファイルは、先行するステーションからの予測によって提供されることを特徴とする請求項9又は10に記載の半導体ウェハの表面平坦化方法。
- ウェハ磨済モデルを提供する前記ステップは、
(e)1つ又は複数のウェハ上に形成されている複数の領域の各々の予備研磨済みウェハ厚さを測定するステップと、
(f)前記1つ又は複数のウェハを複数の研磨工程で研磨するステップと、
(g)前記ステップ(f)における個々の研磨工程の後、前記複数の領域の各々における前記1つ又は複数のウェハに対する前記ウェハ材料除去速度を測定するステップと、
(h)研磨有効性に対するツール状態の影響を明確にするモデルを提供するステップと、
(i)前記個々の領域に対する前記予備研磨済み及び研磨後のウェハ厚さを記録媒体に記録するステップと
を備えたことを特徴とする請求項1又は2に記載の半導体ウェハの表面平坦化方法。 - 前記ウェハの1つの領域の前記材料の除去速度と重要な研磨パラメータの間の関係を確立する線形又は非線形曲線にデータを当てはめるステップを備えたことを特徴とする請求項14に記載の半導体ウェハの表面平坦化方法。
- 前記研磨パラメータは、研磨時間からなることを特徴とする請求項14に記載の半導体ウェハの表面平坦化方法。
- 前記研磨パラメータは、研磨時間、研磨パッドダウンフォース及び速度、泥状物流量及び組成、調整時間、調整ディスクダウンフォース及び速度、調整ディスク及びウェハキャリアの両方の発振速度からなるグループから選択されるパラメータからなることを特徴とする請求項16に記載の半導体ウェハの表面平坦化方法。
- 前記ステップ(a)のモデルにおける領域j(AR’j)に対する前記ウェハ除去は、x1、x2、x3、x4及びx5が、それぞれ研磨工程1、2、3、4及び5の追加パラメータ値であり、t1、t2、t3、t4及びt5が、それぞれ研磨工程1、2、3、4及び5の研磨時間であり、また、ca1jが領域jの研磨工程aにおける変数xのウェハ除去に対する寄与を表し、ca2jが、研磨工程aにおける研磨時間のウェハ除去に対する寄与を表す方程式、
AR’j=(c11j≒x1+c12j)≒t1+(c21j≒x2+c22j)≒t2+(c31j≒x3+c32j)≒t3+(c41j≒x4+c42j)≒t4+(c51j≒x5+c52j)≒t5
に従って決定されることを特徴とする請求項1又は2に記載の半導体ウェハの表面平坦化方法。 - 前記ウェハ材料除去速度プロファイルは、項tp及びtdがそれぞれ時間を単位としたパッド及びディスクの寿命を表し、項kp、kd及びkpdが実験的に決定される、パッド及びディスクの寿命を除去速度に関連付ける係数であるスケーリング因子、
(1+kp・tp+kd・td+kpd・tp・td)
を使用してプロファイルをスケーリングすることによってツール状態を補償することを特徴とする請求項18に記載の半導体ウェハの表面平坦化方法。 - ウェハ厚さプロファイルのモデル決定方法を有する半導体ウェハの表面平坦化方法であって、前記モデル決定方法が、
(a)1つ又は複数のウェハ上に形成された複数の領域の各々の予備研磨済みウェハ厚さを測定するステップと、
(b)前記1つ又は複数のウェハを複数の研磨工程で研磨するステップと、
(c)前記ステップ(b)における個々の研磨工程の後、前記複数の領域の各々における前記1つ又は複数のウェハに対するウェハ材料除去速度を測定するステップと、
(d)研磨有効性に対するツール状態の影響を明確にするモデルを提供するステップと、
(e)前記個々の領域に対する前記予備研磨済み及び研磨後のウェハ厚さを記録媒体に記録するステップと
を備えたことを特徴とする半導体ウェハの表面平坦化方法。 - 前記ウェハの1つの領域の前記材料除去速度と重要な研磨パラメータの間の関係を確立する線形又は非線形曲線にデータを当てはめるステップを備えたことを特徴とする請求項21に記載の半導体ウェハの表面平坦化方法。
- 前記研磨パラメータは、研磨時間からなることを特徴とする請求項22に記載の半導体ウェハの表面平坦化方法。
- 前記研磨パラメータは、研磨時間、研磨パッドダウンフォース及び速度、泥状物流量及び組成、調整時間、調整ディスクダウンフォース及び速度、調整ディスク及びウェハキャリアの両方の発振速度からなるグループから選択されるパラメータからなることを特徴とする請求項23に記載の半導体ウェハの表面平坦化方法。
- 前記ステップ(a)の前記モデルにおける領域j(AR’j)に対する前記ウェハ材料除去は、x1、x2、x3、x4およびx5が、それぞれ研磨工程1、2、3、4及び5の追加パラメータ値であり、t1、t2、t3、t4及びt5が、それぞれ研磨工程1、2、3、4及び5の研磨時間であり、また、ca1jが領域jの研磨工程aにおける変数xのウェハ除去に対する寄与を表し、ca2jが、研磨工程aにおける研磨時間のウェハ除去に対する寄与を表す方程式、
AR’j=(c11j≒x1+c12j)≒t1+(c21j≒x2+c22j)≒t2+(c31j≒x3+c32j)≒t3+(c41j≒x4+c42j)≒t4+(c51j≒x5+c52j)≒t5
に従って決定されることを特徴とする請求項21に記載の半導体ウェハの表面平坦化方法。 - 前記ウェハ材料除去速度プロファイルは、項tp及びtdがそれぞれ時間を単位としたパッド及びディスクの寿命を表し、項kp、kd及びkpdが実験的に決定される、パッド及びディスクの寿命を除去速度に関連付ける係数であるスケーリング因子、
(1+kp・tp+kd・td+kpd・tp・td)
を使用してプロファイルをスケーリングすることによってツール状態を補償することを特徴とする請求項21に記載の半導体ウェハの表面平坦化方法。 - 前記モデルが、最大9枚のウェハを使用して決定されることを特徴とする請求項22に記載の半導体ウェハの表面平坦化方法。
- 基板の平坦化に使用される研磨パッドの調整装置を有する半導体ウェハの表面平坦化装置であって、前記調整装置が、
複数の研磨パッドの複数の平坦化表面に対して位置決め可能な、ウェハを保持するための複数のアームを有するキャリアアセンブリと、
研磨プロセスの動作パラメータを制御することができる制御手段と、
該制御手段に動作結合された、前記研磨プロセスの前記動作パラメータをウェハ厚さプロファイルのモデルの関数として調整するべく前記制御手段を動作させるコントローラとを備え、前記モデルは、
複数の領域をウェハ上に形成し、かつ研磨プロセスの研磨工程における個々の前記領域のウェハ材料除去速度を識別する研磨モデルを形成するステップであって、前記研磨プロセスが複数の研磨工程を含むステップを備えたことを特徴とする半導体ウェハの表面平坦化装置。 - 前記ウェハ材料の除去速度モデルにおける領域j(AR’j)に対するウェハ除去を形成する前記モデルは、x1、x2、x3、x4及びx5が、それぞれ研磨工程1、2、3、4及び5の追加パラメータ値であり、t1、t2、t3、t4及びt5が、それぞれ研磨工程1、2、3、4及び5の研磨時間であり、また、ca1jが領域jの研磨工程aにおける変数xのウェハ除去に対する寄与を表し、ca2jが研磨工程aにおける研磨時間のウェハ除去に対する寄与を表す方程式、
AR’j=(c11j≒x1+c12j)≒t1+(c21j≒x2+c22j)≒t2+(c31j≒x3+c32j)≒t3+(c41j≒x4+c42j)≒t4+(c51j≒x5+c52j)≒t5
に従って決定されることを特徴とする請求項28に記載の半導体ウェハの表面平坦化装置。 - コンピュータによって実行される命令機能をプログラムしたコンピュータ読み取り可能な記録媒体であって、前記命令機能には、化学機械研磨プロセスのためのコンピュータ実施ソフトウェアアプリケーションが含まれ、また、前記プロセスを実施するための前記命令機能には、
(a)化学機械研磨プロセスで処理する少なくとも1つのウェハのウェハ除去速度に関連するデータを化学機械研磨ツールから受け取るステップと、
(b)前記ステップ(a)で受け取ったデータから更新研磨製法を計算するステップであって、ウェハ材料の除去速度モデルの出力とステップ(a)で受け取った前記データの差を決定することによって前記更新研磨製法を計算するステップとを含まれていることを特徴とするコンピュータ読み取り可能な記録媒体。 - 前記ウェハ材料除去速度のモデルは、複数の領域をウェハ上に形成し、かつ研磨プロセスの研磨工程における前記個々の領域に対する前記ウェハ材料の除去速度を識別し、前記研磨プロセスは複数の研磨ステップを含むことを特徴とする請求項30に記載のコンピュータ読み取り可能な記録媒体。
- 前記ウェハ材料除去速度のモデルにおける領域j(AR’j)に対する前記ウェハ除去は、x1、x2、x3、x4及びx5が、それぞれ研磨工程1、2、3、4及び5の追加パラメータ値であり、t1、t2、t3、t4及びt5が、それぞれ研磨工程1、2、3、4及び5の研磨時間であり、また、ca1jが領域jの研磨工程aにおける変数xのウェハ除去に対する寄与を表し、ca2jが、研磨工程aにおける研磨時間のウェハ除去に対する寄与を表す方程式、
AR’j=(c11j≒x1+c12j)≒t1+(c21j≒x2+c22j)≒t2+(c31j≒x3+c32j)≒t3+(c41j≒x4+c42j)≒t4+(c51j≒x5+c52j)≒t5
に従って決定されることを特徴とする請求項30に記載のコンピュータ読み取り可能な記録媒体。
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- 2002-06-17 EP EP02742127A patent/EP1399962A1/en not_active Withdrawn
- 2002-06-17 KR KR1020037016660A patent/KR100906133B1/ko not_active IP Right Cessation
- 2002-06-17 JP JP2003505993A patent/JP4799817B2/ja not_active Expired - Fee Related
- 2002-06-17 CN CNB028154517A patent/CN1292464C/zh not_active Expired - Fee Related
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2006
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KR20130139778A (ko) | 2012-06-13 | 2013-12-23 | 가부시키가이샤 에바라 세이사꾸쇼 | 연마 방법 및 연마 장치 |
JP2014014922A (ja) * | 2012-06-13 | 2014-01-30 | Ebara Corp | 研磨方法及び研磨装置 |
JP2015168015A (ja) * | 2014-03-05 | 2015-09-28 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
KR20190049461A (ko) * | 2017-10-31 | 2019-05-09 | 가부시키가이샤 에바라 세이사꾸쇼 | 연마 장치 및 연마 방법 |
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KR100906133B1 (ko) | 2009-07-07 |
KR20040010755A (ko) | 2004-01-31 |
US8070909B2 (en) | 2011-12-06 |
CN1292464C (zh) | 2006-12-27 |
JP4799817B2 (ja) | 2011-10-26 |
US8694145B2 (en) | 2014-04-08 |
CN1554118A (zh) | 2004-12-08 |
WO2002103777A1 (en) | 2002-12-27 |
US20020197745A1 (en) | 2002-12-26 |
US20070102116A1 (en) | 2007-05-10 |
US7160739B2 (en) | 2007-01-09 |
US20120053721A1 (en) | 2012-03-01 |
EP1399962A1 (en) | 2004-03-24 |
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