CN101456150B - 化学机械抛光方法 - Google Patents
化学机械抛光方法 Download PDFInfo
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- CN101456150B CN101456150B CN2007100944291A CN200710094429A CN101456150B CN 101456150 B CN101456150 B CN 101456150B CN 2007100944291 A CN2007100944291 A CN 2007100944291A CN 200710094429 A CN200710094429 A CN 200710094429A CN 101456150 B CN101456150 B CN 101456150B
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CN2007100944291A CN101456150B (zh) | 2007-12-11 | 2007-12-11 | 化学机械抛光方法 |
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CN2007100944291A CN101456150B (zh) | 2007-12-11 | 2007-12-11 | 化学机械抛光方法 |
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CN101456150A CN101456150A (zh) | 2009-06-17 |
CN101456150B true CN101456150B (zh) | 2011-09-28 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102528637A (zh) * | 2010-12-30 | 2012-07-04 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨设备及其研磨单元 |
CN102528643A (zh) * | 2010-12-30 | 2012-07-04 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨设备及其研磨单元 |
CN103009222A (zh) * | 2012-12-03 | 2013-04-03 | 天津中环领先材料技术有限公司 | 一种高局部平整度重掺硅晶圆抛光片的无蜡抛光工艺 |
JP6418174B2 (ja) * | 2016-02-03 | 2018-11-07 | 株式会社Sumco | シリコンウェーハの片面研磨方法 |
CN108406575B (zh) * | 2018-02-05 | 2020-04-14 | 上海华虹宏力半导体制造有限公司 | Cmp研磨方法 |
CN113223932B (zh) * | 2021-04-27 | 2022-08-16 | 华虹半导体(无锡)有限公司 | 晶圆干燥方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6648731B2 (en) * | 2000-05-09 | 2003-11-18 | Samsung Electronics Co., Ltd. | Polishing pad conditioning apparatus in chemical mechanical polishing apparatus |
CN1292464C (zh) * | 2001-06-19 | 2006-12-27 | 应用材料有限公司 | 提供去除速率曲线处理的化学机械抛光设备的反馈控制 |
CN1981990A (zh) * | 2005-12-13 | 2007-06-20 | 上海华虹Nec电子有限公司 | 化学机械抛光研磨垫 |
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- 2007-12-11 CN CN2007100944291A patent/CN101456150B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6648731B2 (en) * | 2000-05-09 | 2003-11-18 | Samsung Electronics Co., Ltd. | Polishing pad conditioning apparatus in chemical mechanical polishing apparatus |
CN1292464C (zh) * | 2001-06-19 | 2006-12-27 | 应用材料有限公司 | 提供去除速率曲线处理的化学机械抛光设备的反馈控制 |
CN1981990A (zh) * | 2005-12-13 | 2007-06-20 | 上海华虹Nec电子有限公司 | 化学机械抛光研磨垫 |
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Publication number | Publication date |
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CN101456150A (zh) | 2009-06-17 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20131216 |
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Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
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Effective date of registration: 20131216 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Patentee before: Shanghai Huahong NEC Electronics Co., Ltd. |