AU2001249724A1 - System and method for predicting software models using material-centric process instrumentation - Google Patents
System and method for predicting software models using material-centric process instrumentationInfo
- Publication number
- AU2001249724A1 AU2001249724A1 AU2001249724A AU4972401A AU2001249724A1 AU 2001249724 A1 AU2001249724 A1 AU 2001249724A1 AU 2001249724 A AU2001249724 A AU 2001249724A AU 4972401 A AU4972401 A AU 4972401A AU 2001249724 A1 AU2001249724 A1 AU 2001249724A1
- Authority
- AU
- Australia
- Prior art keywords
- software models
- process instrumentation
- centric process
- predicting software
- predicting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
- G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
- G05B13/0205—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric not using a model or a simulator of the controlled system
- G05B13/026—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric not using a model or a simulator of the controlled system using a predictor
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
- G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
- G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
- G05B13/048—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators using a predictor
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B17/00—Systems involving the use of models or simulators of said systems
- G05B17/02—Systems involving the use of models or simulators of said systems electric
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
- G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45232—CMP chemical mechanical polishing of wafer
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US19423700P | 2000-04-03 | 2000-04-03 | |
US60194237 | 2000-04-03 | ||
PCT/US2001/010477 WO2001075534A2 (en) | 2000-04-03 | 2001-03-30 | System and method for predicting software models using material-centric process instrumentation |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001249724A1 true AU2001249724A1 (en) | 2001-10-15 |
Family
ID=22716826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001249724A Abandoned AU2001249724A1 (en) | 2000-04-03 | 2001-03-30 | System and method for predicting software models using material-centric process instrumentation |
Country Status (3)
Country | Link |
---|---|
US (1) | US20010039462A1 (en) |
AU (1) | AU2001249724A1 (en) |
WO (1) | WO2001075534A2 (en) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7008300B1 (en) * | 2000-10-10 | 2006-03-07 | Beaver Creek Concepts Inc | Advanced wafer refining |
US6640151B1 (en) | 1999-12-22 | 2003-10-28 | Applied Materials, Inc. | Multi-tool control system, method and medium |
US6708074B1 (en) | 2000-08-11 | 2004-03-16 | Applied Materials, Inc. | Generic interface builder |
US7188142B2 (en) | 2000-11-30 | 2007-03-06 | Applied Materials, Inc. | Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility |
US6782343B2 (en) * | 2001-02-28 | 2004-08-24 | Asm International N.V. | Resource consumption calculator |
US7103439B1 (en) * | 2001-04-02 | 2006-09-05 | Advanced Micro Devices, Inc. | Method and apparatus for initializing tool controllers based on tool event data |
JP4348412B2 (en) * | 2001-04-26 | 2009-10-21 | 東京エレクトロン株式会社 | Measurement system cluster |
US7089075B2 (en) * | 2001-05-04 | 2006-08-08 | Tokyo Electron Limited | Systems and methods for metrology recipe and model generation |
US7160739B2 (en) | 2001-06-19 | 2007-01-09 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
US7698012B2 (en) | 2001-06-19 | 2010-04-13 | Applied Materials, Inc. | Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
JP4876345B2 (en) * | 2001-08-22 | 2012-02-15 | 株式会社ニコン | Simulation method and apparatus, and polishing method and apparatus using the same |
US20030220708A1 (en) * | 2001-11-28 | 2003-11-27 | Applied Materials, Inc. | Integrated equipment set for forming shallow trench isolation regions |
US20030199112A1 (en) | 2002-03-22 | 2003-10-23 | Applied Materials, Inc. | Copper wiring module control |
US6799311B1 (en) * | 2002-06-27 | 2004-09-28 | Advanced Micro Devices, Inc. | Batch/lot organization based on quality characteristics |
US7668702B2 (en) * | 2002-07-19 | 2010-02-23 | Applied Materials, Inc. | Method, system and medium for controlling manufacturing process using adaptive models based on empirical data |
DE10348563B4 (en) | 2002-10-22 | 2014-01-09 | Fisher-Rosemount Systems, Inc. | Integration of graphic display elements, process modules and control modules in process plants |
US9983559B2 (en) | 2002-10-22 | 2018-05-29 | Fisher-Rosemount Systems, Inc. | Updating and utilizing dynamic process simulation in an operating process environment |
US7272459B2 (en) | 2002-11-15 | 2007-09-18 | Applied Materials, Inc. | Method, system and medium for controlling manufacture process having multivariate input parameters |
US7254453B2 (en) * | 2002-11-21 | 2007-08-07 | Advanced Micro Devices, Inc. | Secondary process controller for supplementing a primary process controller |
US20050033464A1 (en) * | 2003-08-06 | 2005-02-10 | Siemens Dematic Electronics Assembly Systems, Inc. | Real time closed-loop process control system for defect prevention |
US20060107898A1 (en) * | 2004-11-19 | 2006-05-25 | Blomberg Tom E | Method and apparatus for measuring consumption of reactants |
DE102005009022A1 (en) * | 2005-02-28 | 2006-09-07 | Advanced Micro Devices, Inc., Sunnyvale | Automatic throughput control system and method of operating the same |
WO2006093604A2 (en) * | 2005-02-28 | 2006-09-08 | Advanced Micro Devices Inc | Automated throughput control system and method of operating the same |
JP4884801B2 (en) * | 2005-10-06 | 2012-02-29 | 東京エレクトロン株式会社 | Processing system |
US8055370B1 (en) * | 2006-06-23 | 2011-11-08 | Novellus Systems, Inc. | Apparatus and methods for monitoring health of semiconductor process systems |
US8151814B2 (en) * | 2009-01-13 | 2012-04-10 | Asm Japan K.K. | Method for controlling flow and concentration of liquid precursor |
JP5334787B2 (en) * | 2009-10-09 | 2013-11-06 | 株式会社日立ハイテクノロジーズ | Plasma processing equipment |
CN104155914A (en) * | 2014-09-01 | 2014-11-19 | 湘潭大学 | CMP process intelligent decision making system for polishing carbide blade |
US10878140B2 (en) | 2016-07-27 | 2020-12-29 | Emerson Process Management Power & Water Solutions, Inc. | Plant builder system with integrated simulation and control system configuration |
CN108490787B (en) * | 2018-04-29 | 2021-04-27 | 天津大学 | Saturated system composite nonlinear feedback controller design method based on event triggering |
US11418969B2 (en) | 2021-01-15 | 2022-08-16 | Fisher-Rosemount Systems, Inc. | Suggestive device connectivity planning |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5740033A (en) * | 1992-10-13 | 1998-04-14 | The Dow Chemical Company | Model predictive controller |
US5526293A (en) * | 1993-12-17 | 1996-06-11 | Texas Instruments Inc. | System and method for controlling semiconductor wafer processing |
US5599423A (en) * | 1995-06-30 | 1997-02-04 | Applied Materials, Inc. | Apparatus and method for simulating and optimizing a chemical mechanical polishing system |
CA2255915A1 (en) * | 1997-03-15 | 1998-09-24 | Makino Milling Machine Co., Ltd. | Machining processor |
US5926690A (en) * | 1997-05-28 | 1999-07-20 | Advanced Micro Devices, Inc. | Run-to-run control process for controlling critical dimensions |
DE19882821T1 (en) * | 1997-11-18 | 2001-05-10 | Speedfam Ipec Corp N D Ges D S | Method and device for modeling a chemical mechanical polishing process |
US6148239A (en) * | 1997-12-12 | 2000-11-14 | Advanced Micro Devices, Inc. | Process control system using feed forward control threads based on material groups |
US6230069B1 (en) * | 1998-06-26 | 2001-05-08 | Advanced Micro Devices, Inc. | System and method for controlling the manufacture of discrete parts in semiconductor fabrication using model predictive control |
US6405144B1 (en) * | 2000-01-18 | 2002-06-11 | Advanced Micro Devices, Inc. | Method and apparatus for programmed latency for improving wafer-to-wafer uniformity |
-
2001
- 2001-03-30 AU AU2001249724A patent/AU2001249724A1/en not_active Abandoned
- 2001-03-30 WO PCT/US2001/010477 patent/WO2001075534A2/en active Application Filing
- 2001-04-02 US US09/824,110 patent/US20010039462A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2001075534A2 (en) | 2001-10-11 |
US20010039462A1 (en) | 2001-11-08 |
WO2001075534A3 (en) | 2002-05-23 |
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